Processing device for processing a liquid sample and processing system comprising the same

Abstract

The present invention relates to a processing apparatus for processing a liquid sample, the processing apparatus comprising: at least one condenser element for condensing the evaporated liquid of the liquid sample; a housing positioned such that the condenser element is in fluid connection with a container having the liquid sample, wherein the condenser element is part of the housing and / or can be configured or disposed in a space of the housing; and at least one temperature changing device for creating a temperature difference between the condenser element and the evaporated liquid of the liquid sample.

Description

Technical Field

[0001] This invention relates to a processing apparatus for processing liquid samples. Furthermore, this invention relates to a processing system including such a processing apparatus. Prior Technology

[0002] In the pharmaceutical manufacturing process of biosimilar drugs, most biopharmaceuticals require a cell line development process. Cell line development is a method used to select proteins / antibodies to achieve high yields and optimize their quality. However, on the other hand, cell line development is an extremely complex, labor-intensive, and expensive process. Most pharmaceutical companies spend about six months on cell line development.

[0003] One of the core tools required in cell line development is the bioreactor used for cell culture. The process begins with the culture of single cells and scales up to a batch production scale through selection and proportionally increasing repetitive transfer steps. Therefore, different sizes of bioreactors are needed for different stages and quantities of cells, ranging from microscale bioreactors to large-scale batch production bioreactors. However, there are limitations to optimizing the cell culture environment in a smaller bioreactor. An ideal bioreactor typically requires cells to grow continuously in a suspension, dynamically monitor biological signals, and implement feedback control of dissolved oxygen content and pH. Achieving these functions in a microscale bioreactor is difficult.

[0004] A processing device and a porous carrier are known to be used, the porous carrier comprising a plurality of reservoirs, for receiving liquid samples in a bioreactor, such as 96 reservoirs. During operation, the processing device is attached to the porous carrier. The processing device may be a means by which fluid can be supplied to or removed from the reservoir containing the liquid sample, in order to move and / or mix the liquid sample.

[0005] When processing liquid samples in a bioreactor, partial evaporation of the liquid sample is possible. Evaporation is further accelerated when the liquid sample is moved and / or mixed as mentioned above. This can lead to problems where cell culture may be disturbed or even terminated due to changes in the physical conditions of the liquid sample. Specifically, the oxygen content and / or pH of the liquid sample changes when it evaporates. The changes in the physical conditions of the liquid are significant when the volume of the liquid sample is low, specifically one microliter. In such cases, even a small amount of evaporation of the liquid sample can lead to significant changes in the physical conditions. Summary of the Invention

[0006] The object of the present invention is to provide a processing apparatus that, in particular, reduces the risk of changes in the physical conditions of a liquid during operation of the processing apparatus.

[0007] This objective is achieved by a processing apparatus for processing a liquid sample, the processing apparatus comprising: at least one condenser element for condensing the evaporated liquid of the liquid sample; a housing positioned such that the condenser element is in fluid connection with a container having the liquid sample, wherein the condenser element is part of the housing and / or can be configured or disposed in a space of the housing; and at least one temperature changing device for creating a temperature difference between the condenser element and the evaporated liquid of the liquid sample.

[0008] The processing apparatus of the present invention has the following advantages: it includes a condenser element by which the evaporated liquid sample is condensed. This ensures that the liquid loss of the liquid sample by evaporation is low and does not lead to a significant change in the physical conditions of the liquid sample. Specifically, compared with known processing apparatuses, changes in oxygen content and / or pH value can be reduced.

[0009] The liquid sample depends on the application of the processing apparatus. If the processing apparatus is used in a bioreactor, the liquid sample includes a biological particle. The biological particle may be a cell or a microorganism. The liquid sample may contain a liquid and at least one biological particle. The liquid may promote the growth of the biological particle, specifically the cell or microorganism, disposed in the liquid. If the processing apparatus is used in a chemical reactor, the liquid sample may include one or more chemical reagents.

[0010] As mentioned above, liquid sample processing may include supplying or removing fluid, specifically gas, and / or mixing and / or moving the liquid sample and / or agitating the biological particles of the liquid sample into a container. Movement of the liquid sample may be performed to apply shear stress, for example, to cells by means of the moved liquid. Mixing of the liquid sample is understood as a process in which the components of the liquid sample, specifically biological particles, are moved relative to each other in a manner that forms a new configuration. The processing apparatus may perform at least one of the aforementioned processing steps. Liquid processing may also include filtering the liquid sample using a filter in one of the processing apparatus.

[0011] A condenser element is an element through which evaporated gas is condensed. Liquid condenses on a surface of the condenser element. In a first stage, the condensed liquid can adhere to the condenser element. In a second stage, the condensed liquid can fall directly from the condenser element back into the reservoir and thus back onto the liquid sample. This can occur when the condensed liquid has reached a certain volume and / or weight, causing it to fall due to gravity acting on it.

[0012] The condenser element may be part of the housing. As explained below, this means that the condenser element and the housing are not separate components. Alternatively, the condenser element and the housing may be separate components. In this case, the condenser element may be disposed within the space of the housing. This means that the condenser element may be releasably connected to the housing.

[0013] The temperature changing device can be any device by means of which the temperature of the condenser element and / or the temperature of the evaporated liquid of the liquid sample can be directly or indirectly controlled. This device is used to ensure that the temperature of the condenser element is different from the temperature of the evaporated liquid of the liquid sample. The temperature difference between the temperature of the condenser element and the temperature of the evaporated liquid of the liquid sample can be set to a predetermined value by means of at least one temperature changing device. Alternatively, the temperature difference can not be set to a predetermined value.

[0014] The processing unit is configured such that the housing can be positioned to be fluidly connected to the container. This means the housing can move relative to the container. Specifically, the housing can be moved to a position where the condenser element is fluidly connected to the liquid sample and therefore also to the evaporated liquid portion of the liquid sample. A fluid connection exists between the two components when fluid can flow from one component to another or vice versa. The fluid connection is permanent during operation of the processing unit. This means the fluid connection cannot be interrupted by components such as valves.

[0015] In one specific example, the condenser element is positioned such that the condensed liquid flows back into the container and / or drips onto the liquid sample in the container. Therefore, a simple method can be used to prevent liquid loss from the liquid sample.

[0016] The processing apparatus may include at least one control unit for controlling at least one temperature changing device. The control unit may control the temperature changing device such that the condenser element and the evaporated liquid of the liquid sample have different temperatures. Specifically, the control unit may control the temperature changing device such that the temperature of the condenser element is lower than the temperature of the evaporated liquid of the liquid sample. In the case of a processing apparatus or a processing system described later having several temperature changing devices, all temperature changing devices may be controlled by the same control unit. Alternatively, the temperature changing devices may be controlled by different control units. The control unit is an electrical or electronic control unit and / or may include at least one processor or is a processor.

[0017] The processing apparatus may include a cover component. A condenser element may be part of the cover component. In this case, the cover component is formed in one piece. A simple way to form the condenser element is by deep-drawing the cover component. The condenser element may be formed such that it protrudes from the remaining cover component. Specifically, the condenser element protrudes from the remaining cover component in the direction toward the housing. Thus, a compact processing apparatus is achieved, consisting of only a few components, specifically only two components, namely the cover component and one of the bottom components discussed below.

[0018] The condenser element may specifically have a rectangular shape in its cross-section. A portion of the rectangular shape extends into the housing. Alternatively, the condenser element may specifically have a conical shape in its cross-section. A portion of the conical shape extends into the housing. The provided conical shape has its tip disposed in the housing, offering the advantage of allowing condensate to move to the tip and flow back from the tip into the housing. This advantage lies in the fact that at the tip, the volume and / or mass of condensate required for the condensate to fall due to gravity is reached more quickly than in a rectangular shape, causing the condensate to fall back into the housing more quickly compared to an example where the condenser element has a rectangular shape.

[0019] According to one specific example, the processing apparatus may include a first temperature changing device for heating or cooling one of the cover components. The first temperature changing device allows, specifically, the remaining cover component and the condenser element to have different temperatures within a predetermined time period. Specifically, if the first temperature changing device heats the cover component, specifically the remaining component of the cover component excluding the condenser element, the condenser element may have a lower temperature than the remaining cover component. Due to the temperature difference between the remaining cover component and the condenser element, condensation on the surface of the condenser element is improved.

[0020] The first temperature changing device may be placed on the cover member. Specifically, the first temperature changing device may be placed directly on the cover member, specifically on the remaining part of the cover member excluding the condenser element. The first temperature changing device may be configured to cover the cover member. This can be achieved when the first temperature changing device is configured as a heating or cooling plate. The condenser element extends from the remaining cover member in a direction away from the first temperature changing device. The temperature of the cover member may be controlled by the aforementioned control unit.

[0021] The first temperature changing device may include at least one through-hole. The location of the through-hole depends on the location of the condenser element. Specifically, the through-hole may be positioned such that the first temperature changing device does not cover the condenser element. The through-hole may have the same dimensions as the condenser element. Alternatively, the through-hole and the condenser element may be coaxially arranged. This avoids the condenser element being directly heated by the first temperature changing device, but rather by the remaining cover components. The number of through-holes may correspond to the number of condenser elements.

[0022] According to one specific example, the housing may have a bottom component. The bottom component may include at least one hollow extension tube that is at least partially configurable or disposed within a container containing a liquid sample. Additionally, the cover component and the bottom component may define a space. The hollow extension tube may also define a portion of the space. Specifically, the extension tube may define that portion of the space in its circumferential direction. The extension tube may be open at one end, specifically the end facing the container. This allows the liquid sample to be drawn into or dispensed from the hollow extension tube into the container, specifically into the liquid sample, by applying different pressures within the space. When the processing device is attached to the container, the extension tube may protrude into the liquid sample.

[0023] The cover and bottom components can be securely fastened together. Specifically, the connection can be configured so that it cannot be detached without damaging the cover and / or bottom components. For example, the cover and bottom components can be welded together. At the end of the assembly process, a compact processing device in a modular form is achieved. This means that the processing device can consist of only one component. This simplifies the use of the processing device in the laboratory because users do not need to operate with several components.

[0024] The condenser element may correspond to at least a portion of the bottom component. Specifically, the condenser element may correspond to at least a portion of the extension tube. In other words, if there is a temperature difference between the extension tube and the evaporated liquid of the liquid sample, the evaporated liquid of the liquid sample may condense on the extension tube.

[0025] Alternatively, a portion of the cover assembly may be configured within or extend into the extension tube. When at least one plane, perpendicular to the length axis of the extension tube, comprises a portion of the condenser element and a portion of the extension tube, the condenser element extends into the extension tube. An example including the aforementioned condenser element has the advantage that, during operation, the evaporated liquid of the liquid sample condenses on the cover assembly, i.e., the condenser of the cover assembly and the extension tube, resulting in low loss of the liquid sample.

[0026] The thermal conductivity of the condenser element may differ from that of the cover and / or bottom components. Specifically, the condenser element may have a lower thermal conductivity than the cover and / or bottom components. This achieves a lower temperature for the condenser element than the cover and / or bottom components during operation of the processing apparatus. Consequently, the temperature of the condenser element is lower than the temperature of the evaporated liquid in the liquid sample. Therefore, the evaporated liquid in the liquid sample is improved by condensation through the condenser element.

[0027] The condenser element and housing are formed such that a gap exists between the condenser element and the extension tube. This gap achieves a fluid connection between the connecting component and the housing. In other words, this gap is necessary so that pressure applied to the space, specifically to the portion of the space surrounded by the extension tube, can be applied to the liquid sample.

[0028] The condenser element may have at least one stepped portion disposed outside the extension tube. Specifically, the stepped portion may be disposed between a portion of the condenser element disposed in the housing and a portion of the connecting element directly connected to the cover member. Being outside the extension tube means that the stepped portion is configured such that there is no plane perpendicular to the length axis of the extension tube that includes both the stepped portion and a portion of the extension tube. The stepped portion increases the surface area of ​​the condenser element on which the evaporated liquid can condense. Therefore, the stepped portion reduces the risk that the evaporated liquid will not be carried back into the housing. The stepped portion may be configured such that there is a plane including a portion of the stepped portion and a portion of the space defined by the extension tube. In this specific example, the condensed liquid falls directly from the stepped portion into the housing by gravity.

[0029] The processing apparatus includes a connection component for connecting the fluid in the space to a pressure control system. The pressure control system is configured to provide a positive or negative pressure to the processing apparatus, specifically to the space. Therefore, the connection component ensures that the provided positive or negative pressure is applied to the space of the processing apparatus and thus to the liquid sample via an extension tube. Additionally, the pressure control system can be configured to alternately apply positive or negative pressure to the processing apparatus. Negative or positive pressure can be applied to the processing apparatus multiple times. By applying positive or negative pressure to the processing apparatus in the aforementioned manner, it is ensured that the liquid sample located in the container is processed, specifically mixed.

[0030] The pressure control system may include at least one gas storage tank. Specifically, the pressure control system may include a first gas storage tank having a positive pressure and a second gas storage tank having a negative pressure. A positive pressure is a pressure higher than atmospheric pressure. A negative pressure is a pressure lower than atmospheric pressure. Alternatively, the pressure control system may include one or more valves for controlling fluid flow to the processing device and / or one or more pumps for generating positive or negative pressure.

[0031] The processing device may include another connection component for fluidly connecting the space to a measuring device, specifically. The measuring device may be a pressure sensor for measuring the pressure within the space. The measurement results can be used to control the pressure control system discussed above.

[0032] According to one specific example, the cover component may include a circumferential edge surrounding a portion of the bottom component. Specifically, the edge surrounds the bottom component in a circumferential direction. A bottom plate of the bottom component may be directly connected to the circumferential edge. An extension tube extends from the bottom plate in a direction toward the receiving seat. The extension tube may extend further along its length axis than the circumferential edge. This allows the extension tube to extend into the receiving seat, as discussed in more detail below.

[0033] The connecting member and / or another connecting member may protrude from the cover member. Alternatively, the connecting member and / or another connecting member may protrude from the same cover member side. Both connecting members may protrude from the cover member side in the same direction.

[0034] According to one specific example, the processing apparatus may include a bottom component comprising a plurality of extension tubes. Additionally, the processing apparatus may include a plurality of condenser elements. Specifically, the number of extension tubes may correspond to the number of condenser elements. Thus, at least one extension tube, specifically only one extension tube, extends into a container. Providing a plurality of condenser elements ensures that at least a portion of the evaporated liquid from the liquid sample disposed in each container falls back into the respective container.

[0035] According to one specific example, the processing apparatus may include a cover component comprising a first wall portion and a second wall portion. The first wall portion defines a first chamber. The second wall portion and a bottom component define a second chamber fluidly connected to the first chamber. In this specific example, the space discussed above includes both the first and second chambers.

[0036] It has been observed that containers positioned near the edge of the processing device have a higher evaporation rate than containers positioned further away from the edge. Because the edge is in contact with the external environment, containers positioned near the edge of the processing device have a higher temperature than containers positioned more internally within the porous carrier. Containers positioned near the edge of the processing device also have more direct contact with the surrounding air, meaning they lose vapor more easily. Furthermore, the temperature control device below the container is not perfect in terms of heat distribution. By placing the connecting member and the edge on the same side of the cover member, the disparity between the edge and the center of the processing device is amplified and worsened. A container is considered "near the edge" when no other container is positioned between the edge and a container along the horizontal plane of the porous carrier. These near-edge containers are those positioned at the outer edge of a matrix of porous carriers (where multiple containers are arranged in a matrix).

[0037] A gas inlet is provided adjacent to a container configured near its edge. Specifically, an air inlet can worsen the situation because the incoming gas flow will transfer the evaporated gas from one container to another, resulting in undesirable contamination. A first wall portion having a first chamber provides a modified airflow that does not amplify and effectively counteracts the aforementioned disadvantages. Specifically, a similar temperature system is possible for the container near the edge compared to a container disposed within a porous carrier. Therefore, the evaporation rate of the container near the edge can be reduced. Furthermore, this provides protection against the transfer of evaporated liquid from the container near the edge to adjacent containers because the airflow is directed outwards, preventing gas passing through the container near the edge from subsequently passing through another container.

[0038] The cover component may have at least one orifice for fluid connection between the first chamber and the second chamber. One or more orifices may be disposed in the second wall portion. A plane may be present, comprising at least one or more orifices, wherein the plane is perpendicular to the length axis of the extension tube. The plane may also include a portion of the second wall portion. By distributing the orifices in this way, it is ensured that gas entering or leaving the second chamber, specifically air, flows in a direction parallel to the length axis of the extension tube.

[0039] The first wall portion may include an attachment portion for attaching the first wall portion to the second wall portion, wherein a section of the second wall portion defined by the attachment portion includes at least one hole. The attachment portion may protrude from the remaining first wall portion toward the second wall portion. Thus, in an attached state, a gap exists between the remaining first wall portion and the remaining second wall portion. This section of the second wall portion also defines the first chamber. The remaining parts of the second wall portion do not define the first chamber.

[0040] The attachment portion surrounds a part of the first chamber. The first wall portion and the second wall portion can be securely connected to each other in a specific way. Specifically, the attachment portion of the first wall portion can be welded to the second wall portion.

[0041] One or more holes may be disposed in the central region of the cover component. The central region of the cover component excludes a region of the circumferential edge of the cover component. Furthermore, this region is disposed away from the edge of the cover component and includes a center of the cover component. The edge has several portions, specifically four edge portions, each of which extends along one side of the cover component. One or more holes may be disposed between opposing edge portions of the cover component. The edge portions may be opposite each other relative to a plane extending parallel to the two edge portions. At least one hole may be disposed in a section of the cover component, which is disposed between two extension tubes. At least one of these extension tubes, specifically two extension tubes, is not disposed near an edge portion of the cover component. Therefore, it is ensured that the extension tubes are disposed in the central region of the cover component. This hole positioning ensures that at least one hole is disposed away from the edge of the cover component, so that gas exchange does not occur in a region near the edge of the cover component. This avoids the aforementioned disadvantages.

[0042] The first wall portion can be configured such that when a positive pressure is applied by the pressure control system, gas flows from the first chamber to the second chamber. The positive pressure acts in the extension tube. Alternatively, the first wall portion can be configured such that when a negative pressure is applied by the pressure control system, gas flows from the second chamber to the first chamber. The negative pressure acts in the extension tube. Therefore, in terms of airflow, the first chamber is positioned between the pressure control system and the second chamber.

[0043] According to a specific example, the first wall portion may be specifically and securely connected to the second wall portion. The first wall portion and the bottom component may be configured opposite to each other relative to the second wall portion. The first wall portion may be disposed on the second wall portion. The second wall portion may be specifically and securely connected to the bottom component and / or the condenser element may be part of the second wall portion. Secure connection means that the two components are connected such that when one of the components moves, the two components move together. In addition, the components cannot move relative to each other. The processing device has a stacked configuration including a cover component, specifically the first wall portion and the second wall portion, and the bottom component.

[0044] The connecting component can extend from the first wall portion. Therefore, it is ensured that the pressure applied by the pressure control system acts first on the first chamber and then on the second chamber.

[0045] According to another aspect of the present invention, a processing system is provided. The processing system includes a container and an inventive processing device. In the processing system, a housing is positioned such that a condenser element is in fluid connection with the container. The processing device can be disposed on the container or a porous carrier including several containers. In this position, at least a portion of an extension tube can be disposed in the container. The extension tube extends into the container such that the space of the processing device is in fluid connection with a liquid sample disposed in the container. As previously mentioned, the extension tube can protrude into the liquid sample. Therefore, the extension tube can have a hollow portion in which the liquid sample is disposed. In addition, the extension tube can have another hollow portion specifically disposed above the hollow portion, in which no liquid sample is disposed but the evaporated liquid of the liquid sample is disposed.

[0046] The processing device is disposed on the container, specifically on the top of the container. Specifically, the processing device is disposed on the container such that its circumferential edge contacts the container. The circumferential edge contacts an upper portion of the container.

[0047] The container may be part of a porous carrier. The porous carrier includes a plurality of containers. A processing device including a bottom component with several extension tubes may be placed on the porous carrier. Thus, at least one extension tube extends at least partially into one container. In that specific example, a circumferential edge may contact an upper portion of the porous carrier. The plurality of containers may be arranged in a matrix.

[0048] According to one specific example, the processing system may include a second temperature changing device for heating or cooling the container. Thus, the second temperature changing device heats or cools the liquid sample and / or the evaporated liquid of the liquid sample. Therefore, by means of the second temperature device, it can be ensured that the temperature of the evaporated liquid of the liquid sample is different from that of the condenser element. The first temperature changing device and the second temperature changing device may be configured opposite to each other relative to the container and / or the bottom component. This achieves a compact, structured processing system.

[0049] The container may be specifically disposed directly on the second temperature changing device. The container may be formed such that it covers the second temperature changing device. The second temperature changing device may be a heating plate. The temperature of the heating plate may be controlled by a control unit.

[0050] The processing system may also have a control unit for controlling the pressure control system. Specifically, the control unit can control whether a positive or negative pressure is applied to the processing unit by the pressure control system. The control unit can also control a first temperature changing device and / or a second temperature changing device.

[0051] At least one control unit can control the first temperature changing device to raise or lower the temperature of the cover component and / or the bottom component, specifically by 30 to 60 degrees Celsius. As mentioned above, because the cover component is connected to the bottom component, the temperature of the bottom component can be changed by the first temperature changing device. This connection allows heat to be conducted between the cover component and the bottom component. If the control unit raises the temperature of the cover component, the temperature of the remaining parts of the cover component and the bottom component is higher than the temperature of the condenser element. The evaporated liquid of the liquid sample is heated by at least the bottom component, specifically the extension tube, such that the temperature difference between the evaporated liquid of the liquid sample and the condenser element increases. The temperature of the condenser element corresponds to the ambient temperature, specifically at the start of operation when the heating device and / or another heating device begins to heat the cover component and / or the container. When the condenser element is part of the cover component, the surface of the condenser element on which the evaporated liquid is condensed is disposed in a surface surrounded by the extension tube.

[0052] At least one control unit can control the second temperature changing device to raise the temperature of the evaporated liquid sample, specifically by 30 to 60 degrees Celsius. The condenser element can be maintained at, for example, ambient temperature, thereby increasing the temperature difference between the condenser element and the evaporated liquid sample.

[0053] At least one control unit can control a first temperature changing device to raise the temperature of the cover component and control a second temperature changing device to raise the temperature of the evaporated liquid sample. Alternatively, at least one control unit can control a first temperature changing device to lower the temperature of the cover component and control a second temperature changing device to raise the temperature of the evaporated liquid sample. In both cases, the temperature difference between the condenser element and the evaporated liquid sample can be easily increased.

[0054] The processing system may have a temperature sensor to measure the temperature of the cover component and / or bottom component and / or container and / or liquid sample. Simple Explanation of the Diagram

[0055] In the figures, the objects of the invention are schematically shown, wherein elements that have the same or similar functions generally have the same reference numerals. Figure 1 shows a side view of a processing system having a processing device according to a first specific example. Figure 2 shows an exploded view of one of the processing devices according to a second specific example. Figure 3 shows a perspective view of one of the processing devices according to the second specific example, viewed from above. Figure 4 shows a perspective view of one of the processing devices according to the second specific example, viewed from below. Figure 5 shows a side view of a cross-section of the processing device according to the second specific example. Figure 6 shows a perspective view of a processing system with one of the processing devices. Figure 7 shows a side view of one of the processing systems shown in Figure 6. Figure 8A illustrates the first stage of the condensation process using the processing system shown in Figure 1. Figure 8B illustrates the second stage of the condensation process using the processing system shown in Figure 1. Figure 8C illustrates the third stage of the condensation process using the processing system shown in Figure 1. Figure 9 illustrates a processing system having a processing device according to a third specific example. Figure 10 shows the processing system of Figure 9, in which a negative pressure is applied in the extension tube. Implementation

[0056] Figure 1 shows a side view of a processing system 18 having a processing apparatus 1 according to a first specific example and a porous carrier 21. The porous carrier 21 includes a plurality of containers 6. Each of the containers 6 includes a liquid sample 2.

[0057] The processing apparatus 1 is used to process a liquid sample 2 and includes a housing 29. The housing 29 includes a cover member 3 and a bottom member 4. The bottom member 4 includes a plurality of hollow extension tubes 5, each of which is partially disposed in a separate container 6, each of which has a liquid sample 2. The extension tubes 5 extend from a bottom plate 23 toward a container 21. The processing apparatus 1 includes a plurality of condenser elements 9 for condensing the evaporated liquid of the liquid sample 2. The condenser elements 9 are part of the cover member 3 and partially disposed in the hollow extension tubes 5. All condenser elements 9 and extension tubes 5 are formed identically, such that only the structure and function of one condenser element and extension tube 5 will be described below. In addition, the processing apparatus 1 includes a first temperature changing device 13 for creating a temperature difference between the temperature of the condenser elements 9 and the temperature of the evaporated liquid of the liquid sample 2.

[0058] The processing device 1 includes a cover member 3 fixedly connected to a bottom member 4. A space 10 is defined between the cover member 3 and the bottom member 4. Additionally, a hollow extension tube 4 defines the space 10 in the circumferential direction of each extension tube 5. The extension tube 5 extends within a container 6, such that it protrudes into the liquid sample 2 and / or has a cylindrical shape. Specifically, the outer diameter of the extension tube 5 is smaller than the inner diameter of a container wall 22. Therefore, a gap 11 exists between the extension tube 5 and the container wall 22. The extension tube 5 has an opening at its end opposite to the bottom plate 23. The space 10 is fluidly connected to the container via this opening.

[0059] Additionally, the processing apparatus 1 includes a connecting component 7 that fluidly connects the space 10 to a pressure control system 8 of the processing system 18. The pressure control system 8 is configured to apply a positive or negative pressure. Due to the fluid connection between the space 10 and the pressure control system 8 via the connecting component 7, the pressure control system 8 applies a positive or negative pressure to the space 10. By applying a negative pressure in the space 10, the liquid sample 2 is drawn into the extension tube 5, and by applying a positive pressure in the space 10, the liquid sample 2 disposed in the extension tube 5 is distributed into the containers 6. The space 10 is designed such that by applying a pressure in the space 10, that pressure is applied to all containers 6 via the respective extension tubes 5.

[0060] The processing device 1 is placed on the porous carrier 21, as will be explained in more detail later. As mentioned earlier, the porous carrier 21 includes a plurality of receptacles 6, wherein the number of receptacles 6 corresponds to the number of extension tubes 5.

[0061] The condenser element 9 is part of the cover component 3. The condenser element 9 has a rectangular shape, wherein only a portion of the condenser element 9 is disposed in the housing 6.

[0062] The first temperature changing device 13 is specifically disposed directly on the cover member 3. Since the condenser element 9 extends from the remaining cover member 3 toward the porous carrier 21, when the first temperature changing device 13 heats the cover member 3, at least a portion of the condenser element 9 disposed in the container 6 has a different temperature than the remaining cover member 3. The cover member 3 heats the gas disposed in the space 10. The first temperature changing device 13 may be a heating plate covering the cover member 3. Since the bottom member 4 is connected to the cover member 3, when the cover member 3 is heated by the temperature changing device 13, the bottom member is also heated. In this case, the bottom member 4, specifically the extension tube 5, also heats the evaporated liquid of the liquid sample 2 and thus increases the temperature difference between the condenser element 9 and the evaporated liquid of the liquid sample.

[0063] The processing system 18 includes a second temperature device 19. The second temperature device 19 is used to heat the porous carrier 21, specifically the liquid sample 2 disposed in the container 6. The porous carrier 21 is disposed on the second temperature device 19. Specifically, the porous carrier 21 is placed on the second temperature device 19. The second temperature device 19 may be a heating plate. The first temperature device 13 and the second temperature device 19 may be arranged opposite each other with respect to the porous carrier 21 and / or the bottom component 4. The second temperature device 19 can heat the porous carrier 21, and therefore, heat the liquid sample 2 disposed in the porous carrier 21 and the evaporated liquid sample.

[0064] The processing system 18 includes a control unit 20 for controlling one of the first temperature changing device 13 and the second temperature changing device 19. Alternatively, the first temperature changing device 13 and the second temperature changing device 19 can be controlled by different control units 20 (not shown). The control unit 20 can control the first temperature changing device 13 and the second temperature changing device 19 such that the cover component 3 and / or the porous carrier 21 reach a predetermined temperature. The processing system 18 includes a temperature sensor (not shown) for measuring the temperature of the cover component 3 and / or the bottom component 4 and / or the porous carrier 21 and / or the liquid sample 2. The control unit 20 controls the first temperature changing device 13 and / or the second temperature changing device 19 based on the measured temperature value.

[0065] Additionally, control unit 20 can control pressure control system 8. Alternatively, pressure control system 8 can be controlled by a different control unit. The control unit is electrically or electronically connected to heating device 13 and another heating device 19. Furthermore, the control unit is electrically or electronically connected to the pressure control system. Electrical connections are shown in dashed lines in Figure 1.

[0066] Figure 2 shows an exploded view of a processing device 1 according to a second specific example. This processing device 1 differs from the processing device 1 shown in Figure 1 in the shape of the condenser element 9. In the specific example shown in Figure 2, the condenser element 9 has a conical shape.

[0067] The processing device 1 includes another connecting member 15. This other connecting member 15 is used for fluidly connecting the space 10 to a measuring device (not shown). The measuring device may be a pressure sensor. The pressure sensor measures the pressure within the space 10. Alternatively, the measuring device may be a temperature sensor for measuring the temperature of the cover member 3. The connecting member 7 and the other connecting member 15 extend in the same direction from the same cover member side 17.

[0068] The cover component 3 has a circumferential edge 14. The circumferential edge 14 defines the space 10 in the circumferential direction of the processing device 10. The circumferential edge 14 extends in the same direction as the condenser element 9.

[0069] The condenser elements 9 are arranged in a matrix structure. This means that there are several columns and rows, each containing several condenser elements 9. The condenser elements 9 are arranged adjacent to each other at intervals. The number and arrangement of the extension tubes 5 are the same as the number and arrangement of the condenser elements 9.

[0070] Figure 3 shows a perspective view of one of the processing devices according to the second specific example, viewed from above. Figure 3 shows that the condenser element 9 shown in Figure 2 can be formed by the deep-draw cover member 3. Therefore, a recess 24 exists in the position where the condenser element 9 is arranged.

[0071] Figure 4 shows a perspective view of one of the processing devices 1 according to the second embodiment, viewed from below. It is evident from this view that the bottom plate 23 is securely connected to the edge 14. Furthermore, it is apparent that the extension tube 5 extends further than the edge 14 in the direction away from the cover member 3.

[0072] Figure 5 shows a side view of a cross-section of the processing apparatus 1 according to a second specific example. A portion of a conical condenser element 9 is disposed in an extension tube 5. The condenser element 9 includes two stepped portions 12. The stepped portions 12 are disposed outside the extension tube 5. Specifically, both stepped portions 12 are disposed at a position of the condenser element 9 between the tip 26 of the conical condenser element 9 and the connection portion 27 in which the condenser element 9 is connected to the cover member 3. The stepped portions 12 are displaced relative to each other along a length axis L of the extension tube.

[0073] Figure 6 shows a perspective view of a processing system 18 having a processing device 1, and Figure 7 shows a side view of the processing system shown in Figure 6. The processing device 1 can be configured according to the first or second embodiment described above or the third embodiment described below. This means that the condenser element 9 can have a rectangular shape or a conical shape.

[0074] The first temperature changing device 13 is formed as a heating plate and attached to the cover member 3. The first temperature changing device 13 has a through hole 25 in the area where the condenser element 9 is disposed. Therefore, the heating plate does not cover the condenser element 9. The first temperature changing device 13 includes a connecting portion 30, by means of which it can be connected to other components (not shown) of the processing system 18. The processing device 1 is placed on the porous carrier 21 by means of the edge 14. The porous carrier 21 is disposed on the second temperature changing device 19. The second temperature changing device 19 has an extension 31 extending in the vertical direction. The extension 31 simplifies the movement of the processing system 18.

[0075] Figures 8A to 8C illustrate different stages of the condensation process using one of the processing systems 1 shown in Figure 1. If the processing apparatus according to the second embodiment shown in Figures 2 to 8 is used instead of the processing system shown in Figure 1, the condensation process is substantially the same for the processing apparatus according to the second embodiment.

[0076] Figure 8A illustrates the first stage of the condensation process, in which the liquid in liquid sample 2 begins to evaporate. The initiation and spread of evaporation of liquid sample 2 can be influenced by controlling the first temperature changing device 13 and the second temperature device 19. Specifically, the first temperature changing device 13 and the second temperature device 19 can be controlled to have a predetermined temperature. In the present case, both temperature changing devices 13 and 19 heat their respective components.

[0077] The bottom component 4 is heated by the cover component 3 and has a temperature that is substantially the same as that of the cover component 3. The extension tube 4 and / or the remaining cover component heat the evaporated liquid sample. The second temperature changing device 19 heats the container 6, and thus heats the liquid sample 2 and the evaporated liquid of the liquid sample.

[0078] Because the condenser element 9 extends from the cover member 3 toward the porous carrier 21, the condenser element 9 has a different temperature from the remaining cover member 3, which is in direct contact with the heating device 13. Specifically, the condenser element 9 has a lower temperature than the remaining cover member 3 and / or the porous carrier 21 and / or the liquid sample 2 and / or the evaporated liquid sample. At the start of operation, the temperature of the condenser element 9 is the ambient temperature.

[0079] Figure 8B illustrates the second stage of the condensation process using the processing system 1 shown in Figure 1. In the second stage, condensate 28 is disposed on the condenser element 9. Specifically, condensate 28 is disposed on a portion of the condenser element 9 that is disposed in the housing 6.

[0080] Figure 8C illustrates the third stage of the condensation process using the processing system 1 shown in Figure 1. In the third stage, the condensed liquid 28 has such a volume and / or mass that it falls back into the container 6 due to gravity, and thus back onto the liquid sample 2.

[0081] Figure 9 illustrates a processing system 18 having a processing device 1 according to a third embodiment. The processing device 1 differs structurally from the processing device shown in Figure 1 in that the cover member 3 is not attached to the cover member 3. Another difference is that no temperature changing device is attached to the cover member 3. However, in one embodiment (not illustrated), the temperature changing device may be disposed on the cover member 3, as shown in other embodiments.

[0082] The cover component 3 includes a first wall portion 32 and a second wall portion 34, which protrude from the remaining first wall portion 32 toward the second wall portion 34. The first wall portion 32 defines a first chamber 33 and includes a connection component 7 for fluid connection to the pressure control system 8. The second wall portion 34 and the bottom component 4 define a second chamber 35. The first wall portion 32 and the second wall portion 34 are securely connected to each other. In addition, the first wall portion 32 is disposed on the second wall portion 34.

[0083] The first wall portion 32 includes an attachment portion 36. The attachment portion 36 is disposed on and contacts the second wall portion 34. An orifice 36 for ensuring fluid connection between the first chamber 33 and the second chamber 35 is disposed in a specific section of the second wall portion 34. This section of the second wall portion 34 contacts the attachment portion 36. The orifice 36 is disposed in a plane E perpendicular to the length axis L of the extension tube 5. The orifice 36 is disposed in a region of the second wall portion 34 that connects to and / or is disposed between condenser elements 9.

[0084] The cover member 3 has one edge 14 comprising a plurality of edge portions. The edge portions extend along one side of the cover member 3. As is evident from Figure 9, a hole 36 is disposed in one region of the cover member 3, which is disposed between two edge portions 14a and / or between two extension tubes 5, each of the two extension tubes being disposed close to the respective edge portion 14a.

[0085] Figure 10 illustrates the processing system of Figure 9, in which a negative pressure is applied in the extension tube 5 by means of a pressure control system 8 (not shown). This causes the level of the liquid sample 2 in the container 6 to rise. Gas disposed in the second chamber 35 flows through the hole 36 into the first chamber 35 and flows out of the processing device 1 via the connecting member 7. The gas flow is indicated by arrows in Figure 10.

[0086] 1: Processing device 2: Liquid sample 3: Cover component 4: Bottom components 5: Hollow extension tube 6: Seat 7: Connecting components 8: Pressure Control System 9: Condenser components 10: Space 11: Gap 12: Steps 13: First temperature changing device 14: Circumferential edge 14a: Edge portion 15: Another connecting component 17: Cover component side 18: Processing System 19: Second temperature changing device 20: Control Unit 21: Porous carrier 22: Reservoir wall 23: Bottom plate 24: concave part 25: Through hole 26: Tip 27: Connection part 28: Condensed liquid 29: Shell 30: Connection part 31: Extension 32: First Wall Section 33: First Room 34: Second wall section 35: Second Room 36: Kong 37: Attachment E: Plane L: Length axis

Claims

1. A processing apparatus (1) for processing a liquid sample (2), the processing apparatus (1) comprising at least one condenser element (9) for condensing the evaporated liquid of the liquid sample (2); a housing (29) positioned such that the condenser element (9) is in fluid connection with a container (6) having the liquid sample (2), wherein the condenser element (9) is part of the housing (29) and / or can be disposed or disposed in a space (10) of the housing (29); and at least one temperature changing device (13, 19) for forming a temperature difference between the condenser element (9) and the evaporated liquid of the liquid sample, wherein the housing (29) has a cover member and a bottom member (4), and the condenser element (9) is part of the cover member, and the bottom member (4) includes at least one hollow extension tube (5) that can be at least partially disposed in the container (6) having the liquid sample.

2. The processing apparatus (1) as described in claim 1, wherein, The condenser element (9) is positioned such that the condensed liquid flows back into the container (6) and / or drips onto the liquid sample (2) in the container (6).

3. The processing device (1) as requested in item 1 or 2, wherein, a. The processing apparatus (1) includes at least one control unit (20) for controlling the at least one temperature changing device (13) such that the condenser element (9) and the evaporated liquid of the liquid sample (2) have different temperatures, and / or, b. The at least one control unit (20) controls the at least one temperature changing device (13, 19) such that the temperature of the condenser element (9) is lower than the temperature of the evaporated liquid of the liquid sample (2).

4. The processing apparatus (1) as described in claim 1, wherein, a. The condenser element (9) is part of the cover component (3), and / or, b. The cover component (3) is formed in one piece, and / or, c. The condenser element (9) is formed by deep drawing the cover component (3), and / or, d. The condenser element (9) protrudes from a remaining cover component (3), and / or, e. The condenser element (9) has a thermal conductivity different from that of the remaining cover component (3).

5. The processing apparatus (1) as described in claim 1, wherein, The processing device (1) includes a first temperature changing device (13) for heating or cooling one of the cover components (3), wherein a. the first temperature changing device (13) is placed on the cover component (3), and / or, b. the first temperature changing device (13) covers the cover component (3), and / or, c. the first temperature changing device (13) is a plate, and / or, d. the first temperature changing device (13) includes at least one through hole (25).

6. The processing apparatus (1) as described in claim 1, wherein, The condenser element (9) corresponds to at least a portion of the bottom component (4).

7. The processing apparatus (1) as described in claim 1, wherein, The cover component (3) includes a circumferential edge (14) surrounding one part of the bottom component (4).

8. The processing apparatus (1) as described in claim 7, wherein, a. The bottom component (4) is directly connected to the circumferential edge (14), and / or, b. The extension tube (5) extends further than the circumferential edge (14) along one of the length axes (L) of the extension tube (5).

9. The processing apparatus (1) as described in claim 1, wherein, The condenser element (9) has at least one stepped portion (12), which a. is disposed outside the extension tube (5) and / or, b. is disposed in a plane including a stepped portion component and a space portion defined by the extension tube (5).

10. The processing apparatus (1) as claimed in claim 1, wherein, The number of extension tubes (5) corresponds to the number of condenser elements (9) connected to the cover component (3).

11. The processing apparatus (1) as claimed in claim 1, wherein, The cover component (3) includes a first wall portion (32) defining a first chamber (33) and a second wall portion (34), wherein the second wall portion (34) and the bottom component (4) are defined as fluidly connected to a second chamber (35) of the first chamber (33).

12. The processing apparatus (1) as claimed in claim 11, wherein, The cover component (3) has at least one hole (36) for fluidly connecting the first chamber (33) to the second chamber (35).

13. The processing apparatus (1) as described in claim 12, wherein, a. The at least one hole (36) is disposed in the second wall portion (34), and / or, b. The first wall portion (32) includes an attachment portion (37) for attaching the first wall portion (32) to the second wall portion (34), wherein a section of the second wall portion defined by the attachment portion (37) includes the at least one hole (36), and / or, c. A plane (E) including one or more holes (36) is perpendicular to a length axis (L) of the extension tube (5), and / or, d. The one or more holes (36) are disposed in a central region of the cover member (3), and / or, e. The one or more holes (36) are disposed between two edge portions (14a) of the cover member (3), and / or, f. The one or more holes (36) are disposed in a section of the cover member (3) between two extension tubes (5).

14. The processing apparatus (1) as described in claim 11, wherein, a. The first wall portion (32) is configured such that when the pressure control system (8) can apply a positive pressure, gas flows from the first chamber (33) to the second chamber (35), and / or, b. The first wall portion (32) is configured such that when the pressure control system (8) can apply a negative pressure, gas flows from the second chamber (35) to the first chamber (33), and / or, c. The first wall portion (32) is connected to the second wall portion (34), and / or, d. The first wall portion (32) and the bottom component (4) are configured opposite to each other relative to the second wall portion (34), and / or, e. The first wall portion (32) is disposed on the second wall portion (34).

15. The processing apparatus (1) as claimed in claim 11, wherein, a. The second wall portion (34) is connected to the bottom component (4), and / or, b. The condenser element (9) is part of the second wall portion (34), and / or, c. The connecting component (7) extends from the first wall portion (32).

16. A processing system (18) having a housing (6) and a processing apparatus (1) according to any one of claims 1 to 15, wherein, The housing (29) is positioned such that the condenser element (9) is in fluid connection with the container (6).

17. The processing system (18) of request item 16, wherein, a. The processing device (1) is disposed on the container (6), and / or, b. The circumferential edge (14) is in contact with the container (6).

18. The processing system (18) of request item 16 or 17, wherein, The processing system (18) includes a second temperature changing device (19) for heating or cooling one of the containers (6), wherein, a. the container (6) is disposed on the second temperature changing device (19), and / or, b. the container (6) covers the second temperature changing device (19), and / or, c. the first temperature changing device (13) and the second temperature changing device (19) are disposed opposite to each other relative to the container (6) and / or the bottom component (4).

19. The processing system (18) of request item 16, wherein, a. The at least one control unit (20) controls the first temperature changing device (13) to raise or lower the temperature of the cover component (3) and / or the bottom component (4), and / or, b. The at least one control unit (20) controls the second temperature changing device (19) to raise the evaporation temperature, and / or, c. The at least one control unit (20) controls the first temperature changing device (13) to raise the temperature of the cover component (3), and controls the second temperature changing device (19) to raise the temperature of the evaporated liquid of the liquid sample, and / or, d. The at least one control unit (20) controls the first temperature changing device (13) to lower the temperature of the cover component (3), and controls the second temperature changing device (19) to raise the temperature of the evaporated liquid of the liquid sample.

20. The processing system (18) of request item 16, wherein, a. The processing system (18) includes a porous carrier (21) comprising a plurality of receptacles (6), wherein an extension tube (5) extends into each of the receptacles (6), and / or, b. The processing system (18) includes a pressure control system (8) fluidly connected to the connection member (7) of the processing device (1), wherein the pressure control system (8) is configured to apply a positive pressure or a negative pressure in the space (10) of the processing device (1).

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