The electro-conductive contact pin

Abstract

This invention provides a conductive contact needle whose physical or electrical properties are improved in a conductive contact needle formed by stacking multiple metal layers. The conductive contact needle includes: a body portion formed by stacking multiple metal layers; and a tip portion located at the end side of the body portion and in contact with the multiple metal layers constituting the body portion at a mating surface with the body portion.

Description

[Technical Field]

[0001] This invention relates to a conductive contact needle. [Previous Technology]

[0002] A conductive contact pin is a contact pin used in a probe card or test socket to test an object by contacting it. The following is an example of a contact pin for a probe card.

[0003] Electrical characteristic tests of semiconductor devices are performed by bringing a semiconductor wafer close to a probe card with multiple conductive pins and making the conductive pins contact the corresponding electrode pads on the semiconductor wafer. After initial contact is achieved, the semiconductor wafer is brought closer to the probe card. This process is called overdrive. Overdrive involves elastically deforming the conductive pins, ensuring that all conductive pins make proper contact with the electrode pads even if there are deviations in the height of the electrode pads or the conductive pins themselves. Furthermore, the conductive pins elastically deform during overdrive, and their tips move across the electrode pads, thus scrubbing. This scrubbing removes the oxide film from the electrode pad surface and reduces contact resistance.

[0004] This type of conductive contact pin can be fabricated using Micro Electro Mechanical System (MEMS) processes. The process of fabricating the conductive contact pin using MEMS processes is described below. First, photoresist is coated onto the surface of a conductive substrate, and then the photoresist is patterned. Next, the photoresist is used as a mold, and metal material is deposited within the opening using electroplating. Finally, the photoresist and the conductive substrate are removed to obtain the conductive contact pin.

[0005] However, existing conductive contact pins have limitations in improving their physical or electrical properties.

[0006] [Prior Art Documents] [Patent Documents] [Patent Document 1] Korean Patent Registration No. 10-0449308 [Summary of the Invention]

[0007] [Problem to be Solved by the Invention] The present invention is made in order to solve the problems of the prior art mentioned above. The object of the present invention is to provide a conductive contact needle in which the physical or electrical properties of the conductive contact needle formed by stacking multiple metal layers are improved.

[0008] [Means for solving the problem] In order to achieve the objective of this invention, the conductive contact pin according to the invention includes: a body portion, which is formed by stacking a plurality of metal layers; and a tip portion, which is located at the end side of the body portion and is in contact with the plurality of metal layers constituting the body portion at the interface with the body portion.

[0009] In addition, the main body includes a first metal and a second metal, the first metal forming the outer surface of the main body and the second metal being located inside the main body.

[0010] In addition, the main body includes a first metal and a second metal, and the first metal (210) is formed of a metal selected from the following: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy, and the second metal (230) is formed of a metal selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof.

[0011] In addition, the tip portion has the same height as the main body portion.

[0012] In addition, the tip is embedded in the groove formed in the main body and is formed therein, and the three surfaces of the tip are in contact with the main body.

[0013] In addition, the tip is embedded in the main body and exposes three surfaces, and the tip is configured not to protrude from the end side of the main body.

[0014] In addition, at least a portion of the tip is embedded in the main body and exposes at least three surfaces.

[0015] Additionally, the tip portion includes: a first portion that is in contact with a plurality of metal layers constituting the main body portion at a mating surface with the main body portion; and a second portion that has a lower height than the first portion and is formed in the first portion to contact an object.

[0016] In addition, the tip portion includes: a first portion, which is in contact with a plurality of metal layers constituting the main body portion at the joint surface of the tip portion and the main body portion; and a second portion, which is formed at the same height as the first portion, has a width smaller than the width of the first portion, and is formed in the first portion to contact an object.

[0017] In addition, the tip portion includes: a first portion, which is in contact with a plurality of metal layers constituting the main body portion at a mating surface with the main body portion, and at least a portion thereof is embedded in the main body portion; and a second portion, which is formed in the first portion to contact an object.

[0018] In addition, a first joint portion is disposed on the main body portion at the joint surface, and a second joint portion is disposed in the tip portion so that it is joined to the first joint portion to form a joint reinforcement structure.

[0019] In addition, the first joint portion is disposed on the main body portion along the height direction of the joint surface, and the second joint portion is disposed on the tip portion along the height direction of the joint surface.

[0020] In addition, the first joint portion is disposed on the main body portion along the peripheral direction of the joint surface, and the second joint portion is disposed on the tip portion along the peripheral direction of the joint surface.

[0021] [Effects of the Invention] The present invention provides a conductive contact needle in which the physical or electrical properties of the conductive contact needle formed by stacking multiple metal layers are improved.

Implementation Method

[0023] The following content is merely illustrative of the principles of the invention. Therefore, even if not explicitly described or illustrated in this specification, those skilled in the art can implement the principles of the invention and invent various devices included within the concept and scope of the invention. In addition, all terms and embodiments listed in this specification should be understood in principle as being for the purpose of clearly understanding the concept of the invention only, and are not limited to the embodiments and states specifically listed above.

[0024] The objectives, features and advantages described herein will become even more apparent from the following detailed description in relation to the accompanying drawings, and thus the technical ideas of the invention can be readily implemented by those skilled in the art to which it pertains.

[0025] The embodiments described in this specification will be described with reference to cross-sectional and / or perspective views, which serve as ideal illustrations of the invention. To effectively illustrate the technical content, the thickness of the films and regions shown in these figures is exaggerated. The shapes of the illustrations may be varied due to manufacturing techniques and / or tolerances. Therefore, the embodiments of the invention are not limited to the specific shapes shown, but also include variations in shapes generated according to the manufacturing process. Technical terms used in this specification are for illustrative purposes only and are not intended to limit the invention. Unless the context clearly specifies otherwise, singular expressions include plural expressions. In this specification, it should be understood that terms such as "comprising" or "having" are intended to specify the presence of the features, numbers, steps, actions, constituent elements, components, or combinations thereof described in this specification, without precluding the presence or additional possibilities of one or more other features or numbers, steps, actions, constituent elements, components, or combinations thereof.

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing various embodiments, even if the embodiments differ, for convenience, the same names and reference numerals will be given to components that perform the same function. Furthermore, for convenience, structures and operations already described in other embodiments will be omitted.

[0027] On the other hand, the first to twelfth embodiments will be distinguished and described below, but embodiments that combine the configurations of each embodiment are also included in the preferred embodiments of the present invention. First Embodiment

[0028] Hereinafter, a conductive contact pin (100) according to a preferred first embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1(a) is a front perspective view of the conductive contact pin according to a preferred first embodiment of the present invention, FIG. 1(b) is an exploded front perspective view of the tip portion of the conductive contact pin at one end side according to a preferred first embodiment of the present invention, FIG. 2(a) is a rear perspective view of the conductive contact pin according to a preferred first embodiment of the present invention, FIG. 2(b) is an exploded rear perspective view of the tip portion of the conductive contact pin at the other end side according to a preferred first embodiment of the present invention, FIG. 3(a) is a plan view of the conductive contact pin according to a preferred first embodiment of the present invention, and FIG. 3(b) is a cross-sectional view AA of FIG. 3(a).

[0029] The conductive contact pin (100) according to a preferred first embodiment of the present invention includes: a main body (110) formed by stacking a plurality of metal layers; and a tip (150) located at the end side of the main body (110).

[0030] The main body (110) comprises a first metal (210) and a second metal (230) and is constructed by stacking multiple metal layers. Each stacked metal layer has a planar shape. The stacking direction of the multiple metal layers including the first metal (210) and the second metal (230) is the height direction (z direction) of the main body (110). On the xy plane, the planar metal layers are stacked in the height direction (z direction) to form the main body (110). Referring to Figure 1(a) and Figure 1(b), the first metal (210) consists of five layers and the second metal (230) consists of four layers, so the main body (110) is constructed by stacking nine metal layers.

[0031] The first metal (210) is a metal with relatively high wear resistance or hardness compared to the second metal (230), and the second metal (230) may be formed of a metal with relatively high electrical conductivity compared to the first metal (210).

[0032] The first metal (210) is preferably formed of a metal selected from the following: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys.

[0033] The second metal (230) is preferably formed of a metal selected from copper (Cu), silver (Ag), gold (Au) or an alloy thereof.

[0034] However, in addition to the metals mentioned above, the first metal (210) and the second metal (230) may be made of other metals and are not limited to the materials exemplified above.

[0035] By stacking multiple metal layers on the main body (110), the current carrying capacity of the conductive contact pin (100) can be increased by adjusting the content of metals with high conductivity.

[0036] The conductive contact pin (100) according to the preferred first embodiment of the present invention makes it easy to transmit high-frequency signals above 1 GHz.

[0037] Since the main body (110) is constructed of multiple metal layers in a multi-segmented manner, the thickness of each second metal (230) formed by multi-segmented stacking is thinner than that of a second metal (230) formed of a single material. When the second metal (230) is constructed of a single material rather than in a multi-segmented stacking manner, when transmitting high-frequency signals, the high-frequency signals are transmitted along the skin depth on the surface of the second metal (230) due to the skin effect, resulting in a portion inside the second metal (230) that is not transmitted.

[0038] Conversely, according to a preferred first embodiment of the present invention, when the conductive contact needle (100) transmits a high-frequency signal, a larger amount of current flows through the second metal (230), which has a higher conductivity than the first metal (210). Furthermore, due to the skin effect, the current flowing through the second metal (230) flows more through its surface than the current flowing inside the second metal (230). At this time, the multiple second metals (230) formed with a thin thickness and the skin effect of each second metal (230) contribute to increasing the number of transmission paths for the high-frequency signal, and minimize the portion of the second metal (230) not used for signal transmission, thereby maximizing the current density within the second metal (230). This improves the electrical characteristics of the conductive contact needle (100).

[0039] Thus, by utilizing a plurality of metals forming the main body (110) by alternately stacking a second metal (230) with a relatively high conductivity compared to the first metal (210) and a first metal (210) with a relatively low conductivity compared to the second metal (230), it is advantageous for the conductive contact needle (100) according to the present invention to measure high-frequency signals above 1 GHz. Here, the frequency of the high-frequency signal can be above 1 GHz and below 20 GHz. However, it is not limited to this.

[0040] The first metal (210) forms the outer surface of the main body (110). In order to improve the wear resistance of the conductive contact pin (100), the lowermost and uppermost layers of the main body (110) are formed of the first metal (210). The second metal (230) is located inside the main body (110).

[0041] The multiple metal layers constituting the main body (110) can be stacked alternately from the bottom layer in the order of first metal (210), second metal (230), and first metal (210). For example, the main body (110) can be stacked alternately in the order of palladium-cobalt (PdCo) alloy, copper (Cu), and palladium-cobalt (PdCo) alloy, or in the order of nickel (Ni), copper (Cu), and nickel (Ni). Alternatively, the main body (110) can be stacked alternately in the order of palladium-cobalt (PdCo) alloy, copper (Cu), nickel (Ni), copper (Cu), and palladium-cobalt (PdCo) alloy, in the order of first metal (210), second metal (230), and first metal (210).

[0042] Multiple metal layers may be formed as at least three layers. In other words, multiple metal layers may be formed as an odd number or an even number of layers, or more than three layers. However, the number of metal layers is not limited to this.

[0043] A tip (150) is disposed on the end side of the main body (110). The tip (150) is disposed on at least one end side of the main body (110). The tip (150) may have the same height as the main body (110).

[0044] The tip (150) may be formed of a metal of a different material than the metal layers constituting the main body (110), or of the same material as at least one of the metal layers constituting the main body (110). For example, in the case where the main body (110) is formed by alternating layers of nickel cobalt (NiCo) and copper (Cu), the tip (150) may be formed of rhodium (Rd) of a different material than the metal layers constituting the main body (110), or of nickel cobalt (NiCo) or copper (Cu) which are one of the metal layers constituting the main body (110).

[0045] The tip (150) may be formed of a single metal layer or composed of multiple metal layers. The tip (150) may be composed of at least one metal selected from the following: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloy, palladium-nickel (PdNi) alloy or nickel-phosphorus (NiPh) alloy, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloy, copper (Cu), silver (Ag), gold (Au) or alloys thereof. Considering the wear resistance of the tip (150), the tip (150) may be formed of a metal selected from: rhodium (Rd), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (Ph) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiPh) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys. On the other hand, considering the electrical conductivity of the tip (150), the tip (150) may be formed of a metal selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof. However, the material of the tip (150) is not limited to these.

[0046] The tip (150) is located on the end side of the main body (110) and is in contact with a plurality of metal layers constituting the main body (110) at the mating surface with the main body (110). A plurality of metal layers are disposed at the mating surface in the height direction (z direction) of the main body (110), and the tip (150) is in contact with the plurality of metal layers disposed in the height direction of the main body (110).

[0047] When measuring high-frequency signals using the conductive contact needle (100) according to a preferred embodiment of the present invention, the current through the tip (150) flows through the second metal (230) at the interface between the tip (150) and the main body (110), with more current flowing through the second metal (230) than through the first metal (210). The tip (150) functions as a distribution layer for uniformly transmitting high-frequency signals to the main body (110) between the contact object (not shown) and the main body (110). The tip (150) of a single material is in contact with the multiple metal layers of the main body (110) in the height direction of the tip (150), and a uniform current flows along the surface of each of the multiple second metals (230) arranged in the height direction.

[0048] Due to the skin effect, more high-frequency signals flow through the second metal (230) compared to the current flowing inside the second metal (230). Furthermore, because the thickness of the second metal (230) is reduced by the layered structure of the first metal (210) and the second metal (230), the overall usable current density across the cross-section of the second metal (230) can be maximized. This facilitates the transmission of high-frequency signals.

[0049] Unlike the preferred first embodiment of the present invention, when the tip (150) is connected to the main body (110) formed of a single material in its thickness direction, when transmitting high-frequency signals, the current flows along the outermost surface of the main body (110) according to the skin depth due to the skin effect, and there are areas inside the main body (110) where the current does not flow.

[0050] Conversely, according to a preferred first embodiment of the present invention, by utilizing multiple metal layers to thin the thickness (height) of the second metal (230), most of the thickness region of the second metal (230) becomes the region for high-frequency signal transmission. Thus, high-frequency signals can be transmitted over the entire thickness region of the second metal (230).

[0051] Since the tip (150) is formed of a single material and is arranged in a bulk form, high-frequency signals flow along the skin depth on the surface of the tip (150). The high-frequency signals flowing along the surface of the tip (150) are evenly distributed to a plurality of second metals (230) at the joint surface of the main body (110) and flow along the surface of the second metals (230), thereby facilitating the transmission of high-frequency signals.

[0052] The tip portion (150) may include: a first tip portion (150a) located on the first end side of the main body portion (110) and a second tip portion (150b) located on the second end side of the main body portion (110).

[0053] First, the first tip (150a) will be described with reference to FIG1(a) and FIG1(b).

[0054] A first tip (150a) is disposed on the first end side of the main body (110). The first tip (150a) is in contact with a plurality of metal layers constituting the main body (110) at the joint surface with the main body (110).

[0055] The first tip (150a) is configured with the same height as the main body (110). Therefore, the first tip (150a) is in contact with all the plurality of metal layers deposited in the height direction (z direction) of the main body (110).

[0056] A groove (120) is disposed on the first end side of the main body (110), and a first tip (150a) is disposed in the groove (120). The groove (120) is disposed in a recessed form in the first end face (111b) along the length direction (y direction) of the main body (110). In the inner region of the groove (120), an inner side surface (111a) is provided that exposes a plurality of metal layers stacked in the main body (110). The first end face (111b) of the main body (110) is positioned on both sides of the groove (120). In other words, the groove (120) is located between the first end faces (111b) of the main body (110). Since the main body (110) is constructed by stacking a plurality of metal layers in the height direction (z direction), the metal layers exposed at the inner side surface (111a) also have a form that is stacked in the height direction (z direction).

[0057] The first tip (150a) has an upper surface, a lower surface, and an outer side surface (151) connecting the upper surface and the lower surface. In the structure in which the first tip (150a) is embedded in the groove (120) of the main body (110), the inner side surface (111a) of the main body (110) and the outer side surface (151) of the tip (150) face each other and are joined together. The joint surface between the main body (110) and the tip (150) facing each other is a vertical plane perpendicular to the planar metal layer. In the vertical plane between the main body (110) and the first tip (150a) facing each other, the outer side surface (151) of the first tip (150a) is in contact with the plurality of metal layers constituting the main body (110).

[0058] As shown in Figures 1(a) and 1(b), when the first tip (150a) is cuboid in shape, the three outer side surfaces (151) of the first tip (150a) face each other with the inner side surfaces (111a) of the main body (110), and each outer side surface (151) is in contact with the plurality of metal layers constituting the main body (110). The first tip (150a) is configured not to protrude from the first end side of the main body (110). In other words, the first end surface (111b) and the exposed outer side surface of the first tip (150a) form a plane at the first end side of the conductive contact pin (100).

[0059] In the first end portion of the main body (110), the main body (110) has a shape in the width direction (x direction) arranged in the order of the first end face (111b) of the main body (110), the tip portion (150), and the first end face (111b) of the main body (110). On the other hand, the shape of the first tip portion (150a) is not limited to a cuboid shape, and can be formed by a cylinder or a polyhedron shape.

[0060] Next, the second tip (150b) will be described with reference to FIG2(a) and FIG2(b).

[0061] A second tip (150b) is disposed on the second end side of the main body (110). The second tip (150b) is in contact with a plurality of metal layers constituting the main body (110) at the joint surface with the main body (110).

[0062] The second tip (150b) differs from the first tip (150a) in that it is constructed to be connected to the second end face (111c) without being embedded inside the main body (110).

[0063] The second tip (150b) includes: a first portion (310) which is in contact with a plurality of metal layers constituting the main body (110) at a mating surface with the main body (110); and a second portion (320) which is formed on the first portion (310) and in contact with an object. The first portion (310) and the second portion (320) may be formed of the same material or of different materials.

[0064] The first part (310) is constructed with the same height as the main body (110). Therefore, the first part (310) is in contact with a plurality of metal layers deposited in the height direction (z direction) of the main body (110).

[0065] The second part (320) may be configured with a different height than the main body (110). For example, as shown in Figures 2(a) and 2(b), the height of the second part (320) may be lower than the height of the main body (110), or higher than the height of the main body (110). The width direction (x direction) length of the second part (320) may be the same as the width direction length of the first part (310). When the conductive contact pin (100) is viewed from the side, as shown in Figures 3(a) and 3(b), the second tip (150b) has a "└" shape.

[0066] The main body (110) includes a long, empty gap (115) extending along its length direction (y direction). Multiple metal layers constituting the main body (110) are exposed through the gap (115). The main body (110) includes multiple layers of a second metal (230), which is a metal with relatively high conductivity compared to the first metal (210), and the second metal (230) is planar in shape. Because of the formation of the gap (115), even if the length of the main body (110) is shortened, excessive contact pressure will not be induced. Therefore, the gap (115) allows for a shorter length of the main body (110), which is beneficial for transmitting high-frequency signals.

[0067] The oxide film of the contact object is removed by the tip (150) of at least one of the first tip (150a) and the second tip (150b) moving horizontally in the width direction (x direction) using an external force applied at both ends in the length direction (y direction).

[0068] The length of either the first tip (150a) or the second tip (150b) is in the range of 100 μm to 400 μm. The conductive contact pin (100) can be inserted into the guide plate of the probe card for use, in which case the end of the conductive contact pin (100) protrudes to the lower part of the guide plate (lower guide plate). In this state, if the conductive contact pin (100) is used repeatedly over a long period of time, foreign matter will adhere to the end side, and in order to remove it, a process of grinding the end is performed. Due to the process of grinding the end, the length of the conductive contact pin (100) becomes shorter. It is preferable that the protrusion length of the conductive contact pin (100) to the lower part of the guide plate (lower guide plate) is in the range of 100 μm to 400 μm. If the protrusion length is less than 100 μm due to the grinding process, the conductive contact pin (100) is replaced with a new one. By having a length of 100 μm to 400 μm, even if the end is polished within the range of 100 μm to 400 μm, the tip (150) can still be present at the end, thus maintaining the function of the tip (150).

[0069] During the polishing process, if the tip (150) is no longer present, it is preferable to replace it with a new conductive contact pin (100). Since the extent of the residual tip (150) can be confirmed by the appearance of the second stacked portion (120) exposed on the side of the conductive contact pin (100), the replacement period of the conductive contact pin (100) can be confirmed by the tip (150).

[0070] On the other hand, hundreds to thousands of guide holes are formed in the guide plate for the conductive contact pin (100) to be inserted into each guide hole. Taking into account the manufacturing tolerance of the guide holes in the guide plate and the alignment error between the conductive contact pin (100) and the contact object, the width of the tip (150) is in the range of 10 μm to 40 μm. In this way, even if a horizontal positional error occurs between the end of the conductive contact pin (100) and the contact object, the tip (150) can still contact the contact object.

[0071] The first tip (150a) may be the part that contacts the contact object. Therefore, the first tip (150a) may be formed of a metal with high wear resistance or hardness. For example, the first tip (150a) may be formed of a material with higher hardness than the second metal (230) constituting the main body (110). In this way, the wear resistance or hardness characteristics at the tip of the conductive contact needle (100) can be improved, and the content of metal with high conductivity in the main body (110) of the conductive contact needle (100) can be increased, thereby improving the current carrying capacity.

[0072] The second tip (150b) may be the portion that contacts the pad of the detection device. Therefore, the second tip (150b) may be formed of a metal with high electrical conductivity. For example, the second tip (150b) may be formed of a material with higher electrical conductivity than the first metal (210) constituting the main body (110). In this way, the contact resistance can be reduced, thereby improving the detection reliability of the conductive contact needle (100).

[0073] In contrast, the first tip (150a) and the second tip (150b) may be formed of the same metal. For example, both the first tip (150a) and the second tip (150b) may be formed of a palladium-cobalt (PdCo) alloy or of copper (Cu). However, this is not a limitation; any material that can improve the electrical, physical, and / or chemical properties of the conductive contact pin (100) may be included as a preferred embodiment of the present invention.

[0074] Hereinafter, a method for manufacturing a conductive contact pin (100) according to a preferred first embodiment of the present invention will be described. The method for manufacturing a conductive contact pin (100) includes the following steps: forming a main body portion (110), plating the internal space using a mold having an internal space to form a main body portion (110) composed of multiple metal layers; and forming an additional space in the mold at a position corresponding to the end side of the main body portion (110), and plating the additional space to form a tip portion (150). The mold may be formed of an anodized film, photoresist, silicon wafer or a similar material.

[0075] The step of forming the main body (110) is to electroplate the interior of the opening space using a mold with an opening space. By electroplating, a first metal (210) and a second metal (230) are included in the opening space and multiple metal layers are formed. Therefore, the main body (110) is formed by stacking multiple metal layers including the first metal (210) and the second metal (230), and each stacked metal layer has a planar shape.

[0076] After forming the main body (110), an additional space is formed in a mold and the additional space is electroplated to form a tip (150). During the formation of the tip (150), the tip (150) is integrated with the mating surface of the main body (110). Second Embodiment

[0077] Next, a second embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0078] Hereinafter, FIG4(a) and FIG4(b) will describe the conductive contact pin (100) according to a preferred second embodiment of the present invention. FIG4(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred second embodiment of the present invention, and FIG4(b) is an exploded perspective view of the tip portion (150) of FIG4(a). FIG4(a) and FIG4(b) are figures showing only a portion of the conductive contact pin (100).

[0079] The tip portion (150) according to the second embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0080] The tip portion (150) of the conductive contact needle (100) according to the preferred second embodiment of the present invention differs from the first tip portion (150a) and the second tip portion (150b) of the conductive contact needle (100) according to the first embodiment in that only a portion thereof is embedded in the main body portion (110).

[0081] According to the second embodiment, a portion of the tip (150) protrudes outward in the longitudinal direction from the first end face (111b) (or the second end face (111c)). Therefore, when the tip (150) contacts an object, the end face of the main body (110) does not contact the object, thereby improving the durability of the conductive contact pin (100) compared to the first tip (150a) according to the first embodiment. Furthermore, since a portion of the tip (150) is embedded in the main body (110), the rigidity is improved compared to the second tip (150b) according to the first embodiment. Third Embodiment

[0082] Next, a third embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0083] Hereinafter, FIG5(a) and FIG5(b) will describe a conductive contact pin (100) according to a preferred third embodiment of the present invention. FIG5(a) is a perspective view of the end side of the conductive contact pin (100) according to a preferred third embodiment of the present invention, and FIG5(b) is an exploded perspective view of the tip portion (150) of FIG5(a). FIG5(a) and FIG5(b) show only a portion of the conductive contact pin (100).

[0084] The tip portion (150) according to the third embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0085] The tip (150) of the conductive contact needle (100) according to the preferred third embodiment of the present invention differs from the first tip (150a) and second tip (150b) of the conductive contact needle (100) according to the first embodiment in the following aspects: it includes a first part (310) and a second part (320), and the first part (310) is embedded in the main body (110), the first part (310) is in contact with a plurality of metal layers constituting the main body (110) at the interface with the main body (110), and the second part (320) has a lower height than the first part (310) and is formed on the first part (310) to contact the object.

[0086] Since the tip portion (150) according to the third embodiment is constructed by embedding the first portion (310) in the groove portion (120) of the main body portion (110), its rigidity can be improved compared with the second tip portion (150b) according to the first embodiment. In addition, when the tip portion (150) contacts the object, the end face of the main body portion (110) does not contact the object, thereby improving the durability of the conductive contact pin (100) compared with the first tip portion (150a) according to the first embodiment.

[0087] Furthermore, by making the vertical cross-sectional area of ​​the second portion (320) smaller than that of the first portion (310), the contact pressure at the first portion (310) can be increased compared to the tip portion (150) according to the second embodiment. Fourth Embodiment

[0088] Next, a fourth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0089] Hereinafter, FIG. 6(a) and FIG. 6(b) will describe a conductive contact pin (100) according to a preferred fourth embodiment of the present invention. FIG. 6(a) is a perspective view of the end side of the conductive contact pin (100) according to a preferred fourth embodiment of the present invention, and FIG. 6(b) is an exploded perspective view of the tip portion (150) of FIG. 6(a). FIG. 6(a) and FIG. 6(b) show only a portion of the conductive contact pin (100).

[0090] The tip portion (150) according to the fourth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0091] The tip (150) of the conductive contact needle (100) according to the preferred fourth embodiment of the present invention differs from the first tip (150a) and second tip (150b) of the conductive contact needle (100) according to the first embodiment in the following aspects: it includes a first part (310) and a second part (320), and the first part (310) is embedded in the main body (110), the first part (310) is in contact with a plurality of metal layers constituting the main body (110) at the interface with the main body (110), and the second part (320) has a lower height than the first part (310) and is formed on the first part (310) to contact the object.

[0092] Since the tip portion (150) according to the fourth embodiment is constructed by embedding the first portion (310) in the groove portion (120) of the main body portion (110), its rigidity can be improved compared with the second tip portion (150b) according to the first embodiment. In addition, when the tip portion (150) contacts the object, the end face of the main body portion (110) does not contact the object, thereby improving the durability of the conductive contact pin (100) compared with the first tip portion (150a) according to the first embodiment.

[0093] Furthermore, the configuration of the tip (150) in the third embodiment, where the second part (320) is located at the center of the first part (310), differs from that in the third embodiment where the second part (310) is located eccentrically on one side of the first part (310). This allows for contact with the object at the center of the end of the conductive contact pin (100) compared to the tip (150) according to the third embodiment, thereby minimizing the bending moment caused by eccentricity. Fifth Embodiment

[0094] Next, a fifth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0095] Hereinafter, FIG. 7(a) and FIG. 7(b) will describe a conductive contact pin (100) according to a preferred fifth embodiment of the present invention. FIG. 7(a) is a perspective view of the end side of the conductive contact pin (100) according to a preferred fifth embodiment of the present invention, and FIG. 7(b) is an exploded perspective view of the tip portion (150) of FIG. 7(a). FIG. 7(a) and FIG. 7(b) show only a portion of the conductive contact pin (100).

[0096] The tip portion (150) according to the fifth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0097] The tip portion (150) of the conductive contact pin (100) according to the preferred fifth embodiment of the present invention differs from the first tip portion (150a) and second tip portion (150b) of the conductive contact pin (100) according to the first embodiment in that it includes a first portion (310) and a second portion (320), wherein the first portion (310) is in contact with a plurality of metal layers constituting the main body portion (110) at the interface with the main body portion (110), and the second portion (320) has the same height as the first portion (310) and has a width smaller than the width of the first portion (310), and is formed on the first portion (310) to contact the object.

[0098] Since the tip portion (150) according to the fifth embodiment is configured such that the first portion (310) is embedded in the groove portion (120) of the main body portion (110), the rigidity can be improved compared with the second tip portion (150b) according to the first embodiment. In addition, when the tip portion (150) contacts the object, the end face of the main body portion (110) does not contact the object, thereby improving the durability of the conductive contact pin (100) compared with the first tip portion (150a) according to the first embodiment.

[0099] Furthermore, the second portion (320) is located in the center of the first portion (310), and the width of the second portion (320) is smaller than the width of the first portion (310), which differs from the configuration of the tip (150) in the third and fourth embodiments. Therefore, when removing the oxide film by means of the tip (150), it has the effect of removing the oxide film in a higher area. Sixth Embodiment

[0100] Next, a sixth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0101] Hereinafter, FIG. 8(a) and FIG. 8(b) will describe a conductive contact pin (100) according to a preferred sixth embodiment of the present invention. FIG. 8(a) is a perspective view of the end side of the conductive contact pin (100) according to a preferred sixth embodiment of the present invention, and FIG. 8(b) is an exploded perspective view of the tip portion (150) of FIG. 8(a). FIG. 8(a) and FIG. 8(b) show only a portion of the conductive contact pin (100).

[0102] The tip portion (150) according to the sixth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0103] The tip portion (150) of the conductive contact pin (100) according to the preferred sixth embodiment of the present invention differs from the first tip portion (150a) and second tip portion (150b) of the conductive contact pin (100) according to the first embodiment in that it includes a first portion (310) and a second portion (320), wherein the first portion (310) is in contact with a plurality of metal layers constituting the main body portion (110) at the interface with the main body portion (110), and the second portion (320) has a height lower than the height of the first portion (310) and a width smaller than the width of the first portion (310), and is formed on the first portion (310) to contact the object.

[0104] Since the tip portion (150) according to the sixth embodiment is configured such that the first portion (310) is embedded in the groove portion (120) of the main body portion (110), the rigidity can be improved compared with the second tip portion (150b) according to the first embodiment. In addition, when the tip portion (150) contacts the object, the end face of the main body portion (110) does not contact the object, thereby improving the durability of the conductive contact pin (100) compared with the first tip portion (150a) according to the first embodiment.

[0105] Furthermore, the second part (320) is located in the center of the first part (310), and the width and height of the second part (320) are smaller than those of the first part (310) compared to the configuration of the tip (150) in the third to fifth embodiments. This increases the contact pressure at the center of the tip (150). Seventh Embodiment

[0106] Next, a seventh embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0107] Hereinafter, FIG. 9(a) and FIG. 9(b) will describe the conductive contact pin (100) according to a preferred seventh embodiment of the present invention. FIG. 9(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred seventh embodiment of the present invention, and FIG. 9(b) is an exploded perspective view of the tip portion (150) of FIG. 9(a). FIG. 9(a) and FIG. 9(b) show only a portion of the conductive contact pin (100).

[0108] The tip portion (150) according to the seventh embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0109] The tip (150) of the conductive contact pin (100) according to the preferred seventh embodiment of the present invention differs from the second tip (150b) of the conductive contact pin (100) according to the first embodiment in that it includes a first part (310) and a second part (320). The first part (310) is in contact with a plurality of metal layers constituting the main body (110) at the interface with the main body (110). The second part (320) has the same height as the first part (310) and is formed on the first part (310) to contact the object.

[0110] Accordingly, the tip (150) has the effect of removing the oxide film in a higher area compared to the second tip (150b) of the first embodiment. Eighth Embodiment

[0111] Next, an eighth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0112] Hereinafter, FIG. 10(a) and FIG. 10(b) will describe a conductive contact pin (100) according to a preferred eighth embodiment of the present invention. FIG. 10(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred eighth embodiment of the present invention, and FIG. 10(b) is an exploded perspective view of the tip portion (150) of FIG. 10(a). FIG. 10(a) and FIG. 10(b) are figures showing only a portion of the conductive contact pin (100).

[0113] The tip portion (150) according to the eighth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0114] The tip (150) of the conductive contact pin (100) according to the preferred eighth embodiment of the present invention differs from the second tip (150b) of the conductive contact pin (100) according to the first embodiment in that it includes a first part (310) and a second part (320), wherein the first part (310) is in contact with a plurality of metal layers constituting the main body (110) at the interface with the main body (110), and the second part (320) has a lower height than the first part (310) and is formed at the center of the first part (310) to contact the object.

[0115] In this way, compared with the second tip (150b) according to the first embodiment, the conductive contact pin (100) contacts the object at the center of its end, thereby minimizing the bending moment caused by eccentricity. Ninth Embodiment

[0116] Next, a ninth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0117] Hereinafter, FIG11(a) and FIG11(b) will describe the conductive contact pin (100) according to a preferred ninth embodiment of the present invention. FIG11(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred ninth embodiment of the present invention, and FIG11(b) is an exploded perspective view of the tip portion (150) of FIG11(a). FIG11(a) and FIG11(b) are figures showing only a portion of the conductive contact pin (100).

[0118] The tip portion (150) according to the ninth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0119] The tip portion (150) of the conductive contact pin (100) according to the preferred ninth embodiment of the present invention differs from the second tip portion (150b) according to the first embodiment in that it includes a first portion (310) and a second portion (320), wherein the first portion (310) is in contact with a plurality of metal layers constituting the main body portion (110) at the interface with the main body portion (110), and the second portion (320) has a height lower than the height of the first portion (310) and a width smaller than the width of the first portion (310), and is formed on the first portion (310) to contact the object.

[0120] In the aspect that the second part (320) is located in the center of the first part (310) and the width and height of the second part (320) are smaller than the width and height of the first part (310), the contact pressure at the center of the tip (150) can be increased compared with the second tip (150b) of the first embodiment.

[0121] As described above, the tip (150) may have the same height as the main body (110). Furthermore, the tip (150) is formed by embedding it in a groove formed in the main body (110), so that three surfaces of the tip (150) can be in contact with the main body (110). Additionally, the tip (150) is embedded in the main body (110) and exposes three surfaces, and the tip (150) may be configured not to protrude from the end side of the main body (110). Furthermore, at least a portion of the tip (150) may be embedded in the main body (110) and expose at least three surfaces.

[0122] On the other hand, the tip (150) may include: a first portion (310) which is in contact with a plurality of metal layers constituting the main body (110) at a mating surface with the main body (110); and a second portion (320) which has a lower height than the first portion (310) and is formed on the first portion (310) to contact an object.

[0123] Additionally, the tip (150) may include: a first portion (310) which is in contact with a plurality of metal layers constituting the main body (110) at the joint surface between the tip (150) and the main body (110); and a second portion (320) which is formed at the same height as the first portion (310), has a width smaller than the width of the first portion (310), and is formed on the first portion (310) to contact the object.

[0124] Additionally, the tip (150) may include: a first portion (310) that is in contact with a plurality of metal layers constituting the main body (110) at a mating surface with the main body (110), and at least a portion thereof is embedded in the main body (110); and a second portion (320) formed in the first portion (310) to contact an object. Tenth Embodiment

[0125] Next, a tenth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0126] Hereinafter, FIG12(a) and FIG12(b) will describe a conductive contact pin (100) according to a preferred tenth embodiment of the present invention. FIG12(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred tenth embodiment of the present invention, and FIG12(b) is an exploded perspective view of the tip portion (150) of FIG12(a). FIG12(a) and FIG12(b) are figures showing only a portion of the conductive contact pin (100).

[0127] The tip portion (150) according to the tenth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0128] The tip (150) of the conductive contact pin (100) according to the preferred tenth embodiment of the present invention differs from the first tip (150a) and the second tip (150b) according to the first embodiment in that it is in contact with a plurality of metal layers constituting the main body (110) at the interface with the main body (110), and its width is formed to be the same as the width of the main body (110).

[0129] In other words, the tip (150) of the conductive contact pin (100) according to the tenth embodiment is in contact with a plurality of metal layers constituting the main body (110) at the joint surface with the main body (110), and its width and height are formed to be the same as the width and height of the main body (110).

[0130] As a variation of the conductive contact pin (100) according to the tenth embodiment, the tip portion (150) may include: a first portion (310) that is in contact with a plurality of metal layers constituting the main body portion (110) at a mating surface with the main body portion (110); and a second portion (320) formed on the first portion (310) to contact an object. Here, the width and height of the first portion (310) are formed to be the same as the width and height of the main body portion (110). In addition, the second portion (320) may be formed to be smaller than the width and / or height of the first portion (310), and the second portion (320) may be disposed off-center to either side of the first portion (310) or located at the center of the first portion (310). Eleventh Embodiment

[0131] Next, the eleventh embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0132] Hereinafter, FIG. 13(a) and FIG. 13(b) will describe a conductive contact pin (100) according to a preferred eleventh embodiment of the present invention. FIG. 13(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred eleventh embodiment of the present invention, and FIG. 13(b) is an exploded perspective view of the tip portion (150) of FIG. 13(a). FIG. 13(a) and FIG. 13(b) are figures showing only a portion of the conductive contact pin (100).

[0133] The tip portion (150) according to the eleventh embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0134] The tip (150) of the conductive contact pin (100) according to the preferred eleventh embodiment of the present invention differs from the first tip (150a) and the second tip (150b) according to the first embodiment in the following aspects: it is in contact with a plurality of metal layers constituting the main body (110) at the joint surface with the main body (110), and is joined with the main body (110) as a bonding reinforcement structure.

[0135] In the mating surface between the tip portion (150) and the main body portion (110), a first mating portion (410) is disposed on the main body portion (110), and a second mating portion (420) is disposed on the tip portion (150) so as to form a mating reinforcement structure by mating with the first mating portion (410).

[0136] The first joint (410) is disposed on the main body (110) along the height direction of the joint surface, and the second joint (420) is disposed on the tip (150) along the height direction of the joint surface.

[0137] At the joint surface, a first joint portion (410) is disposed on the main body portion (110), and a second joint portion (420) is disposed on the tip portion (150) so as to form a joint reinforcement structure by being joined with the first joint portion (410).

[0138] A first connecting portion (410) formed by a recess is disposed in a groove (120) disposed in the main body (110). The first connecting portion (410) extends along the height direction of the main body (110) in a form that is recessed in the inner side surface (111a). At least one first connecting portion (410) is formed. Figure 13(b) shows a case where one is formed in each inner side surface (11a) of the groove (120) of the first connecting portion (410), but it is not limited to this. In addition, the shape of the first connecting portion (410) is not limited to the quadrilateral cross section shown in the figure, and any shape that can perform an anchoring effect can be included.

[0139] A second connecting portion (420) formed by a protrusion is disposed on the side of the tip portion (150) at a position corresponding to the first connecting portion (410) to engage with the first connecting portion (410). The second connecting portion (420) is disposed extending along the height direction of the tip portion (150) in a form that protrudes convexly from the side of the tip portion (150). The number of second connecting portions (420) is the same as the number of first connecting portions (410). The second connecting portions (420) and the first connecting portions (410) are engaged in shape.

[0140] The first connecting portion (410) disposed on the main body portion (110) and the second connecting portion (420) disposed on the tip portion (150) are joined together to form a joint reinforcement structure. Thereby, an anchoring effect is achieved between the tip portion (150) and the main body portion (110), so that the tip portion (150) can be more firmly joined to the main body portion (110).

[0141] On the other hand, unlike this, a second joint (420) is disposed in the main body (110) and a first joint (410) is disposed in the tip (150), thereby forming a joint reinforcement structure with each other.

[0142] The bonding reinforcement structure according to the eleventh embodiment can also be applied to the mating surface between the tip (150) and the main body (110) of the conductive contact pin (100) according to other embodiments. Twelfth Embodiment

[0143] Next, a twelfth embodiment of the present invention will be described. However, the embodiments described below focus on characteristic constituent elements compared with the first embodiment, and descriptions of constituent elements that are the same as or similar to those in the first embodiment are omitted as much as possible.

[0144] Hereinafter, FIG14(a) and FIG14(b) will describe the conductive contact pin (100) according to the preferred twelfth embodiment of the present invention. FIG14(a) is a perspective view of the end side of the conductive contact pin (100) according to the preferred twelfth embodiment of the present invention, FIG14(b) is an exploded perspective view of the tip portion (150) of FIG14(a), and FIG14(c) is a cross-sectional view along line A-A' of FIG14(a). FIG14(a) to FIG14(c) are figures showing only a portion of the conductive contact pin (100).

[0145] The tip portion (150) according to the twelfth embodiment may be a first tip portion (150a) located at the first end of the conductive contact needle (100), or a second tip portion (150b) located at the second end of the conductive contact needle (100).

[0146] The tip (150) of the conductive contact pin (100) according to the preferred twelfth embodiment of the present invention differs from the first tip (150a) and the second tip (150b) according to the first embodiment in that it is in contact with a plurality of metal layers constituting the main body (110) at the joint surface with the main body (110) and is joined with the main body (110) as a bonding reinforcement structure.

[0147] In the mating surface between the tip portion (150) and the main body portion (110), a first mating portion (410) is disposed on the main body portion (110), and a second mating portion (420) is disposed on the tip portion (150) to form a mating reinforcement structure by mating with the first mating portion (410).

[0148] The first joint portion (410) is disposed on the main body portion (110) along the periphery of the joint surface, and the second joint portion (420) is disposed on the tip portion (150) along the periphery of the joint surface.

[0149] A first joint (410) formed by a recess is disposed in a groove (120) disposed in the main body (110). The first joint (510) is configured to be recessed in the inner side surface (111a) and is configured along the periphery of the inner side surface (111a).

[0150] Referring to Figure 14(c), the first joint (510) is formed by making at least one of the plurality of metal layers constituting the main body (110) protrude relative to each other. The first joint (410) is formed by protruding at the joint surface along the upper and lower adjacent metal layers with one metal layer as a reference. In the case where the main body (110) is formed by alternately stacking a first metal (210) and a second metal (230) to form a plurality of metal layers, the first metal (210) protrudes relative to the upper and lower adjacent second metals (230) at the joint surface, and the first joint (410) is disposed between the first metals (210). This can be achieved by selectively etching the second metal (230) at the joint surface after the main body (110) is formed and before the tip (150) is formed.

[0151] A second joint (520) formed by a protrusion is disposed on the side of the tip (150) at a position corresponding to the first joint (510). The second joint (520) extends along the periphery of the tip (150) in a form that protrudes from the side of the tip (150). The number of second joints (520) is the same as the number of first joints (510).

[0152] The first connecting portion (510) disposed on the main body portion (110) and the second connecting portion (520) disposed on the tip portion (150) are joined together to form a joint reinforcement structure. In this way, the tip portion (150) can be more firmly joined to the main body portion (110).

[0153] The bonding reinforcement structure according to the twelfth embodiment can also be applied to the mating surface between the tip (150) and the main body (110) of the conductive contact pin (100) according to other embodiments.

[0154] The conductive contact pin (100) according to the preferred embodiment of the present invention described above is disposed in a detection device and used to make electrical and physical contact with a contact object to transmit electrical signals. The detection device may be a detection device for semiconductor manufacturing processes, and as an example, it may be a probe card or a test socket. The conductive contact pin (100) according to the preferred embodiment of the present invention may be a probe disposed in a probe card or a socket pin disposed in a test socket. However, it is not limited to this, and includes any pin that applies electricity to confirm whether the contact object is faulty.

[0155] As described above, although the invention has been described with reference to preferred embodiments, those skilled in the art can make various modifications or variations to the invention without departing from the spirit and scope of the invention as set forth in the following claims. [Simplified Explanation of the Diagram]

[0022] FIG1(a) is a front perspective view of a conductive contact pin according to a preferred first embodiment of the present invention. FIG1(b) is an exploded front perspective view of the tip portion of the conductive contact pin at one end according to a preferred first embodiment of the present invention. FIG2(a) is a rear perspective view of a conductive contact pin according to a preferred first embodiment of the present invention. FIG2(b) is an exploded rear perspective view of the tip portion of the conductive contact pin at the other end according to a preferred first embodiment of the present invention. FIG3(a) is a plan view of a conductive contact pin according to a preferred first embodiment of the present invention. FIG3(b) is a cross-sectional view AA of FIG3(a). FIG4(a) is a perspective view of the end side of a conductive contact pin according to a preferred second embodiment of the present invention. FIG4(b) is an exploded perspective view of the tip portion of FIG4(a). FIG5(a) is a perspective view of the end side of a conductive contact pin according to a preferred third embodiment of the present invention. FIG5(b) is an exploded perspective view of the tip portion of FIG5(a). Figure 6(a) is a perspective view of the end face of a conductive contact pin according to a preferred fourth embodiment of the present invention. Figure 6(b) is an exploded perspective view of the tip portion of Figure 6(a). Figure 7(a) is a perspective view of the end face of a conductive contact pin according to a preferred fifth embodiment of the present invention. Figure 7(b) is an exploded perspective view of the tip portion of Figure 7(a). Figure 8(a) is a perspective view of the end face of a conductive contact pin according to a preferred sixth embodiment of the present invention. Figure 8(b) is an exploded perspective view of the tip portion of Figure 8(a). Figure 9(a) is a perspective view of the end face of a conductive contact pin according to a preferred seventh embodiment of the present invention. Figure 9(b) is an exploded perspective view of the tip portion of Figure 9(a). Figure 10(a) is a perspective view of the end face of a conductive contact pin according to a preferred eighth embodiment of the present invention. Figure 10(b) is an exploded perspective view of the tip portion of Figure 10(a). Figure 11(a) is a perspective view of the end face of a conductive contact pin according to a preferred ninth embodiment of the present invention. Figure 11(b) is an exploded perspective view of the tip portion of Figure 11(a). Figure 12(a) is a perspective view of the end portion of a conductive contact pin according to a preferred tenth embodiment of the present invention. Figure 12(b) is an exploded perspective view of the tip portion of Figure 12(a). Figure 13(a) is a perspective view of the end portion of a conductive contact pin according to an eleventh embodiment of the present invention. Figure 13(b) is an exploded perspective view of the tip portion of Figure 13(a). Figure 14(a) is a perspective view of the end portion of a conductive contact pin according to a twelfth embodiment of the present invention. Figure 14(b) is an exploded perspective view of the tip portion of Figure 14(a). Figure 14(c) is a cross-sectional view along line A-A' of Figure 14(a).

Claims

1. A conductive contact pin, comprising: The main body is composed of multiple metal layers, including a first metal and a second metal. And a tip portion, located at the end side of the main body portion, and formed of a single material, and in contact with the plurality of metal layers constituting the main body portion in a mating surface with the main body portion, wherein the first metal and the second metal are different metals from each other, and the second metal is a metal with higher electrical conductivity than the first metal, wherein the mating surface is a vertical plane perpendicular to the planar shape of the plurality of metal layers, and is a vertical plane in which the main body portion and the tip portion face each other, and in the mating surface of the vertical plane in which the main body portion and the tip portion face each other, the outer side surface of the tip portion is in contact with all the plurality of metal layers constituting the main body portion.

2. The conductive contact pin as claimed in claim 1, wherein the first metal forms the outer surface of the body portion, and the second metal is located inside the body portion.

3. The conductive contact pin as claimed in claim 1, wherein the first metal (210) is formed of a metal selected from: rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel (Ni), manganese (Mn), tungsten (W), phosphorus (P) or alloys thereof, or palladium-cobalt (PdCo) alloys, palladium-nickel (PdNi) alloys or nickel-phosphorus (NiP) alloys, nickel-manganese (NiMn), nickel-cobalt (NiCo) or nickel-tungsten (NiW) alloys, and the second metal (230) is formed of a metal selected from copper (Cu), silver (Ag), gold (Au) or alloys thereof.

4. The conductive contact pin as claimed in claim 1, wherein the tip portion has the same height as the body portion.

5. The conductive contact pin as claimed in claim 1, wherein the tip portion is embedded in and formed in a groove formed in the body portion, and three faces of the tip portion are in contact with the body portion.

6. The conductive contact pin as claimed in claim 1, wherein the tip portion is embedded in the body portion and exposes three surfaces, and the tip portion is configured not to protrude from the end side of the body portion.

7. The conductive contact pin as claimed in claim 1, wherein at least a portion of the tip is embedded in the body and exposes at least three surfaces.

8. The conductive contact pin as claimed in claim 1, wherein the tip portion comprises: The first part is in contact with the plurality of metal layers constituting the main body in the mating surface with the main body; And a second part, having a lower height than the first part and formed on the first part to contact the object.

9. The conductive contact pin as claimed in claim 1, wherein the tip portion comprises: The first part is in contact with the plurality of metal layers constituting the main body at the joint surface between the tip and the main body; And a second portion, formed at the same height as the first portion, having a width smaller than the width of the first portion, and formed on the first portion to contact the object.

10. The conductive contact pin as claimed in claim 1, wherein the tip portion comprises: The first part is in contact with the plurality of metal layers constituting the main body in the mating surface with the main body, and at least a portion of it is embedded in the main body; And the second part, formed from the first part to come into contact with the object.

11. The conductive contact pin as claimed in claim 1, wherein a first bonding portion is disposed in the body portion of the mating surface, and a second bonding portion is disposed in the tip portion such that bonding to the first bonding portion forms a bonding reinforcement structure.

12. The conductive contact pin as claimed in claim 11, wherein the first coupling portion is disposed on the body portion along the height direction of the coupling surface, and the second coupling portion is disposed on the tip portion along the height direction of the coupling surface.

13. The conductive contact pin as claimed in claim 11, wherein the first coupling portion is disposed on the body portion along the peripheral direction of the mating surface, and the second coupling portion is disposed on the tip portion along the peripheral direction of the mating surface.

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