Photosensitive compositions, filters, image display devices, and solid-state photographic elements

Abstract

The object of the present invention is to provide a photosensitive composition that inhibits water stains on the film after development, has good heat resistance, and can form excellent patterns. This problem can be solved by the following photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), wherein the photopolymerization initiator (C) comprises a compound (C1) represented by the following general formula (1) and an oxime photopolymerization initiator (C2). General formula (1) (In general formula (1), R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms. R3 represents a hydrogen atom or a monovalent substituent.)

Description

[Technical Field]

[0001] This invention relates to a photosensitive composition and its use. [Previous Technology]

[0002] A color filter, used in image display devices or solid-state imaging elements, obtains a filter pattern of a first color by, for example, the following steps: coating a photosensitive composition onto a transparent substrate such as glass, and removing the solvent from the coating by drying; irradiating the coating with radiation through a photomask having a desired pattern shape to harden it (hereinafter referred to as exposure); subsequently cleaning and removing the unexposed portions of the coating (hereinafter referred to as development); and then, if necessary, performing a heat treatment (hereinafter referred to as post-baking) to fully harden the hardened film. Furthermore, filter patterns of other colors can be formed and produced by performing the same operations.

[0003] The developing step uses an alkaline developer to clean and remove unexposed areas. However, this results in missing or peeling exposed areas, causing defects in the pattern shape. Furthermore, when the coating is exposed to the alkaline developer, discoloration (hereinafter referred to as water stains) occurs. Therefore, a photosensitive composition is needed that does not produce pattern shape defects or water stains during the developing step. Additionally, there is the issue of color change during the post-baking step.

[0004] Furthermore, as a measure to improve water stains, Patent Document 1 discloses a coloring photosensitive resin composition comprising an alkali-soluble resin with a specific structure and an oxime fluorene derivative compound as a photopolymerization initiator. Patent Document 2 discloses a photoresist composition comprising a fluorinated surfactant with a specific structure. As a measure to improve pattern defects during development, Patent Document 3 discloses a coloring composition comprising a polymerizable compound having an epoxy alkane structure. [Prior Art Documents] [Patent Documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2017-173787 [Patent Document 2] Japanese Patent Application Publication No. 2016-102212 [Patent Document 3] Japanese Patent Application Publication No. 2014-142582 [Summary of the Invention]

[0006] [The problem the invention aims to solve]

[0007] However, none of the compositions described in Patent Documents 1 to 3 can satisfy all aspects of water stains, pattern shape and heat resistance to a certain or higher level.

[0008] The object of the present invention is to provide a photosensitive composition that inhibits water stains on the film after development, has good heat resistance, and can form excellent patterns. [Means for solving the problem]

[0009] This invention relates to a photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), wherein the photopolymerization initiator (C) comprises a compound (C1) represented by the following general formula (1) and an oxime photopolymerization initiator (C2). General Formula (1) [Chemical 1]

[0010] (In general formula (1), R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms. R3 represents a hydrogen atom or a monovalent substituent.) [Effects of the Invention]

[0011] According to the present invention, a photosensitive composition is provided that inhibits water stains on the developed film, has good heat resistance, and can form excellent patterns. Additionally, the present invention can provide a filter, an image display device, and a solid-state imaging element.

Implementation Method

[0012] Hereinafter, the form of the photosensitive composition used to implement the present invention will be described in detail. Furthermore, the present invention is not limited to the following embodiments, and can be implemented in variations that can solve the problems.

[0013] In this invention, "(meth)acrylic," "(meth)acrylate," "(meth)acrylic acid," "(meth)acrylate," or "(meth)acrylamide" respectively mean "acrylic and / or methacrylic," "acrylate and / or methacrylate," "acrylic acid and / or methacrylic acid," "acrylate and / or methacrylate," or "acrylamide and / or methacrylamide." Additionally, "CI" refers to the Colour Index (CI; published by The Society of Dyers and Colourists). The polymerizable unsaturated group is an ethylene-unsaturated double bond. Furthermore, regarding the molecular weight of the compounds in this invention, for low-molecular-weight compounds with a definite molecular weight, the value is calculated (formula weight) or determined using electrospray ionization-mass spectrometry (ESI-MS). For compounds with a molecular weight distribution, the molecular weight is the weight-average molecular weight converted from polystyrene, determined using gel permeation chromatography with tetrahydrofuran as the solvent. A monomer is a compound that forms a resin through polymerization. A monomer is in its unreacted state, while a monomer unit is in the resin state formed after monomer polymerization. A polymerizable compound is a compound that forms a film through polymerization.

[0014] <Photosensitive Composition> One embodiment of the present invention relates to a photosensitive composition. The photosensitive composition of the present invention comprises an alkaline soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), and is characterized in that the photopolymerization initiator (C) comprises a compound (C1) represented by the following general formula (1) and an oxime photopolymerization initiator (C2). General Formula (1) [Chemical 2]

[0015] (In general formula (1), R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms. R3 represents a hydrogen atom or a monovalent substituent.)

[0016] The mechanism by which the problem of the present invention can be solved in the photosensitive composition of the structure described above is not yet clear, but it is speculated as follows. Compared with 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one or 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone, which are photopolymerization initiators that have been widely used in the field of color filters since the past, the compound (C1) represented by general formula (1) has a rigid and hydrophobic fluorene skeleton with high heat resistance, so it is speculated that a curing film with high resistance can be obtained. In addition, the curing film has moderate cohesion due to the π-π interaction of the two benzene rings. Therefore, it is speculated that the structure can be made to moderately soften with respect to heat while suppressing defects in the pattern during development, and to cause thermal sagging during post-baking, resulting in a good cross-sectional shape of the pattern. Furthermore, by using a specific oxime-based photopolymerization initiator (C2) with a different absorption wavelength than the compound (C1) represented by general formula (1) and high sensitivity, the wavelength range of light that can be used for photopolymerization can be expanded, and reactivity can be improved. Therefore, it is speculated that, for example, for compositions containing colorants that are difficult for light to penetrate to the depth of the film, the reaction will also occur, suppressing water stains on the film after development, and improving the pattern shape and heat resistance.

[0017] Hereinafter, the components contained in or may be contained in the photosensitive composition of one embodiment will be described in detail.

[0018] [Photopolymerization initiator (C)] The photosensitive composition of the present invention comprises a compound (C1) represented by general formula (1) and an oxime photopolymerization initiator (C2) as a photopolymerization initiator (C).

[0019] (Compound (C1) represented by general formula (1)) The photosensitive composition of the present invention contains a compound (C1) represented by general formula (1) as a photopolymerization initiator (C).

[0020] General Formula (1) [Chemical 3] (In general formula (1), R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms. R3 represents a hydrogen atom or a monovalent substituent.)

[0021] R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms. The alkyl groups having 1 to 8 carbon atoms can be straight-chain, branched, cyclic, or formed by their bonding. Examples include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, hexyl, heptyl, octyl, 2-ethylhexyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. From the viewpoint of suppressing water stains and the shape of the pattern, straight-chain alkyl groups having 3 to 8 carbon atoms are preferred, and straight-chain alkyl groups having 4 to 6 carbon atoms are more preferred.

[0022] R3 represents a hydrogen atom or any monovalent substituent. Examples of monovalent substituents include: alkyl groups with 1 to 20 carbon atoms, such as methyl and ethyl; alkoxy groups with 1 to 20 carbon atoms, such as methoxy and ethoxy; halogen atoms, such as F, Cl, Br, and I; alkyl groups with 1 to 20 carbon atoms; alkyl ester groups with 1 to 20 carbon atoms; alkoxy carbonyl groups with 1 to 20 carbon atoms; haloalkyl groups with 1 to 20 carbon atoms; aromatic cyclic groups with 4 to 20 carbon atoms; amino groups; aminoalkyl groups with 1 to 20 carbon atoms; hydroxyl groups; nitro groups; cyano groups; benzoyl groups that may have substituents; and thenoyl groups that may have substituents. Examples of substituents that may be present in benzoyl groups or thenoyl groups include alkyl groups with 1 to 10 carbon atoms, alkoxy groups with 1 to 10 carbon atoms, and alkoxy carbonyl groups with 1 to 10 carbon atoms. From the perspective of free radical generation efficiency, hydrogen atoms and nitro groups are preferred, and hydrogen atoms are more preferred.

[0023] The method for manufacturing the compound (C1) represented by general formula (1) can be exemplified by methods described in Japanese Patent Publication No. 2019-507108 and Japanese Patent Publication No. 2019-528331.

[0024] Hereinafter, specific examples of compounds (C1) represented by general formula (1) are shown. However, the present invention is not limited to these.

[0025] [Chemistry 4] Chemical formula (2) Chemical formula (3) Chemical formula (4)

[0026] Among the compounds of chemical formula (2) to chemical formula (4), from the viewpoint of water stain suppression, pattern shape and heat resistance, the compound of chemical formula (2) is preferred.

[0027] The compound (C1) represented by general formula (1) can be used alone or in combination with two or more.

[0028] (Oxime-based photopolymerization initiator (C2)) Examples of oxime-based photopolymerization initiators (C2) include compounds containing one oxime group in one molecule (C2a) and compounds containing two oxime groups in one molecule (C2b). From the viewpoint of suppressing water stains, compounds containing two oxime groups in one molecule (C2b) are more preferred.

[0029] [Compounds containing one oxime group in one molecule (C2a)] Commercially available examples of compounds containing one oxime group in one molecule (C2a) include: IRGACURE OXE-01, IRGACURE OXE-02, IRGACURE OXE-03, and IRGACURE OXE-04 manufactured by BASF; and ADEKA arkls N-1919, ADEKA arkls NCI-730, and ADEKA arkls NCI-831 manufactured by ADEKA. (arkls) NCI-930, TRONLY TR-PBG-301, TRONLY TR-PBG-304, TRONLY TR-PBG-305, TRONLY TR-PBG-309, TRONLY TR-PBG-314, TRONLY TR-PBG-358, TRONLY TR-PBG-380, TRONLY TR-PBG-365, TRONLY TR-PBG-610, TRONLY TR-PBG-3054, TRONLY TR-PBG-3057 manufactured by Changzhou Qiangli New Materials Co., Ltd., IGM resin (IGM The following products are manufactured by Resins: OMNIRAD 1312, OMNIRAD 1314, and OMNIRAD 1316; Samyang Corporation: SPI-02, SPI-03, SPI-04, SPI-06, and SPI-07; and Daito Chemix: DFI-020, DFI-036, and EOX-01.

[0030] Specific examples of compounds (C2a) containing an oxime group in one molecule may be listed below. However, the present invention is not limited to these.

[0031] [Chemical 5] Chemical formula (5) [Chemical 6] Chemical formula (6) Chemical formula (7) Chemical formula (8)

[0032] The methods for manufacturing compounds of chemical formula (5) to chemical formula (8) can be exemplified by methods described in Japanese Patent Publication No. 2004-534797, Japanese Patent Application Publication No. 2008-80068, Japanese Patent Publication No. 2012-526185, International Publication No. 2015 / 036910, International Publication No. 2015 / 152153, Japanese Patent Publication No. 2016-504270, and Japanese Patent Publication No. 2017-512886.

[0033] From the viewpoint of pattern shape and heat resistance, the compound (C2a) containing an oxime group in one molecule is preferably one or more of the group consisting of compounds selected from chemical formulas (5) to (8).

[0034] A compound (C2a) containing one oxime group in one molecule can be used alone or in combination with two or more.

[0035] 〔Compounds containing two oxime groups in one molecule (C2b)〕Compounds containing two oxime groups in one molecule (C2b) include, for example, compounds described in Japanese Patent Application Publication No. 2005-215378, Japanese Patent Application Publication No. 2011-105713, Japanese Patent Application Publication No. 2017-523465, and Japanese Patent Application Publication No. 2021-011486. ​​Among these, compounds represented by the following general formula (9) are preferred.

[0036] General Formula (9) [Chemical 7] In general formula (9), X1 and X2 independently represent carbonyl bonds (-CO-) or single bonds. X3 represents a single bond or a sulfur atom. R1 represents an alkyl group with 1 to 20 carbon atoms, and R2 and R3 independently represent a hydrogen atom, an alkyl group with 1 to 20 carbon atoms, a heterocyclic group with 2 to 30 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an arylalkyl group with 7 to 30 carbon atoms. R4 and R5 independently represent an alkyl group with 1 to 20 carbon atoms, a heterocyclic group with 2 to 30 carbon atoms, an aryl group with 6 to 30 carbon atoms, or an arylalkyl group with 7 to 30 carbon atoms.

[0037] In general formula (9), X1 and X2 independently represent carbonyl bonds (-CO-) or single bonds. In particular, from the viewpoint of solubility in organic solvents, it is preferable that at least one of X1 and X2 is a carbonyl bond (-CO-), and more preferably that X1 and X2 are carbonyl bonds (-CO-).

[0038] In general formula (9), X3 is a single bond or a sulfur atom, preferably a single bond.

[0039] In general formula (9), R1 represents an alkyl group having 1 to 20 carbon atoms. The alkyl group having 1 to 20 carbon atoms can be any of the following: linear, branched, cyclic, or combinations thereof. In addition, it can also be an alkyl group substituted with a halogen atom, amino group, nitro group, etc. Examples include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, amyl, isopentyl, pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, nonyl, decyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. Among these, ethyl, propyl, and isopropyl are preferred.

[0040] In general formula (9), R2 and R3 independently represent a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a heterocyclic group having 2 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms. The alkyl group having 1 to 20 carbon atoms can be any of the following: linear, branched, cyclic, or combinations thereof. In addition, it can also be an alkyl group substituted with a halogen atom, amino group, nitro group, etc. For example, methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, pentyl, hexyl, heptyl, octyl, isooctyl, 2-ethylhexyl, nonyl, isononyl, decyl, isodecyl, undecyl, dodecyl, hexadecyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl, etc. Among these, pentyl, hexyl, heptyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, cyclohexylmethyl are preferred. Examples of heterocyclic groups with 2-30 carbon atoms include: pyridyl, pyrimidinyl, furanyl, tetrahydrofuranyl, dioxacyclopentyl, imidazoalkyl, oxazolyl, piracetamyl, morpholinyl, etc. Examples of aryl groups with 6-30 carbon atoms include: phenyl, tolyl, xylyl, ethylphenyl, naphthyl, anthraceneyl, etc. Aryl groups can also be substituted with halogen atoms, amino groups, nitro groups, etc. Examples of arylalkyl groups with 7-30 carbon atoms include: benzyl, α-methylbenzyl, α,α-dimethylbenzyl, phenylethyl, etc. Arylalkyl groups can also be substituted with halogen atoms, amino groups, nitro groups, etc.

[0041] Of these, from the viewpoint of solubility in organic solvents, R2 and R3 are preferably at least one of a straight-chain alkyl group having 1 to 20 carbon atoms, and from the viewpoint of solubility in organic solvents and inhibition of water stains, R2 and R3 are more preferably a straight-chain alkyl group having 1 to 20 carbon atoms and a cyclic alkyl group having 1 to 20 carbon atoms.

[0042] In general formula (9), R4 and R5 independently represent alkyl groups having 1 to 20 carbon atoms, heterocyclic groups having 2 to 30 carbon atoms, aryl groups having 6 to 30 carbon atoms, or arylalkyl groups having 7 to 30 carbon atoms. The alkyl groups having 1 to 20 carbon atoms can be any of the following: linear, branched, cyclic, or combinations thereof. In addition, they can also be alkyl groups substituted with halogen atoms, amino groups, nitro groups, etc. Examples include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, tert-butyl, pentyl, isopentyl, pentyl, hexyl, cyclopentyl, cyclopentylmethyl, cyclohexyl, etc. Among these, methyl, ethyl, propyl, and isopropyl are preferred from the viewpoint of reactivity. Examples of heterocyclic groups having 2 to 30 carbon atoms include: pyridyl, pyrimidinyl, furanyl, tetrahydrofuranyl, dioxacyclopentyl, imidazoalkyl, oxazolyl, pirimidinyl, morpholinyl, etc. Examples of aryl groups with 6 to 30 carbon atoms include phenyl, tolyl, xylyl, ethylphenyl, naphthyl, and anthracene. Aryl groups can also be substituted with halogen atoms, amino groups, nitro groups, etc. Of these, phenyl is preferred from a reactivity point of view. Examples of arylalkyl groups with 7 to 30 carbon atoms include benzyl, α-methylbenzyl, α,α-dimethylbenzyl, and phenylethyl. Arylalkyl groups can also be substituted with halogen atoms, amino groups, nitro groups, etc.

[0043] Of these, from the viewpoint of reactivity, R4 and R5 are preferably methyl, ethyl or phenyl, more preferably methyl or ethyl.

[0044] There are no particular limitations on the method of manufacturing the compound represented by general formula (9), and known methods may be used. For example, the methods described in Japanese Patent Publication No. 2017-523465 and Japanese Patent Publication No. 2021-011486 may be used.

[0045] Hereinafter, specific examples of compounds (C2b) containing two oxime groups in one molecule are shown. However, the present invention is not limited to these.

[0046] [Chemistry 8] Chemical formula (10) Chemical formula (11) [Chemistry 9] Chemical formula (12) Chemical formula (13)

[0047] Of the chemical formulas (10) to (13), from the viewpoint of suppressing water stains, the compound of chemical formula (10) is preferred.

[0048] A compound containing two oxime groups in one molecule (C2b) may be used alone or in combination with two or more.

[0049] From the viewpoints of water stain suppression, pattern shape and heat resistance, the mass ratio of the compound (C1) represented by general formula (1) to the oxime photopolymerization initiator (C2) is preferably 90:10 to 10:90, more preferably 80:20 to 20:80, and particularly preferably 70:30 to 30:70.

[0050] From the viewpoints of water stain suppression, pattern shape and heat resistance, the total content of the compound (C1) represented by general formula (1) and the oxime photopolymerization initiator (C2) in 100% by mass of photopolymerization initiator (C) is preferably 60% to 100% by mass, more preferably 80% to 100% by mass.

[0051] (Other photopolymerization initiators (C3)) The photosensitive composition of the present invention may contain a compound (C1) represented by general formula (1) and a photopolymerization initiator (C3) other than an oxime photopolymerization initiator (C2) (hereinafter also referred to as other photopolymerization initiators (C3)).

[0052] Other photopolymerization initiators (C3) are not particularly limited as long as they are compounds that can initiate the polymerization of polymerizable compounds (B) by light, and well-known photopolymerization initiators can be used. Examples include: 4-phenoxydichloroacetophenone, 4-tert-butyl-dichloroacetophenone, diethoxyacetophenone, 1-(4-isopropylphenyl)-2-hydroxy-2-methylpropane-1-one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinylpropane-1-one, 2-(dimethylamino)-1-[4-(4-morpholinyl)phenyl]-2-(benzyl)-1-butanone, or 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone and other acetophenone compounds; Triazine compounds such as 2,4,6-trichlorotriazine, 2-phenyl-4,6-bis(trichloromethyl)triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)triazine, 2-piperyl-4,6-bis(trichloromethyl)triazine, 2,4-bis(trichloromethyl)-6-styryltriazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)triazine, 2-(4-methoxy-naphtho-1-yl)-4,6-bis(trichloromethyl)triazine, 2,4-trichloromethyl-(piperyl)-6-triazine, or 2,4-trichloromethyl-(4'-methoxystyryl)-6-triazine; Acrylphosphine compounds such as bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide or diphenyl-2,4,6-trimethylbenzoylphosphine oxide; quinone compounds such as 9,10-phenanthroquinone, camphorquinone, and ethylanthraquinone; borate ester compounds; gazoazole compounds; imidazole compounds; or diacene compounds, etc.

[0053] Other photopolymerization initiators (C3) may be used alone or in combination of two or more.

[0054] From the viewpoint of photocurability, the content of photopolymerization initiator (C) is preferably 1 to 100 parts by mass relative to 100 parts by mass of polymerizable compound (B), more preferably 3 to 50 parts by mass, and particularly preferably 5 to 30 parts by mass.

[0055] [Alkali-soluble resin (A)] The photosensitive composition of the present invention comprises an alkali-soluble resin (A). The alkali-soluble resin (A) is an adhesive resin.

[0056] The alkali-soluble resin (A) can be any resin that dissolves in an alkaline developer, and known resins can be used. The alkali-soluble resin (A) preferably has alkali-soluble groups such as carboxyl groups, phosphate groups, sulfonic acid groups, hydroxyl groups, and phenolic hydroxyl groups. Among these, carboxyl groups are preferred. Specifically, examples include acrylic resins with acidic groups, α-olefin / maleic acid (anhydride) copolymers, styrene / styrene sulfonic acid copolymers, ethylene / (meth)acrylic acid copolymers, or isobutylene / maleic acid (anhydride) copolymers. Furthermore, the alkali-soluble resin (A) may contain polymerizable unsaturated groups such as vinyl, (meth)allyl, or (meth)acrylic acid, and thermosetting groups such as epoxy or oxetyl.

[0057] The weight average molecular weight (Mw) of the alkali-soluble resin (A) is preferably 2,000 to 40,000, more preferably 3,000 to 30,000, and particularly preferably 4,000 to 25,000.

[0058] From the viewpoint of developability, the acid value of the alkali-soluble resin (A) is preferably 30 mgKOH / g to 200 mgKOH / g, more preferably 40 mgKOH / g to 180 mgKOH / g.

[0059] In 100% by mass of the non-volatile components of the photosensitive composition, the content of alkali-soluble resin (A) is preferably 1% to 80% by mass, more preferably 5% to 60% by mass.

[0060] Alkali-soluble resin (A) can be used alone or in combination with two or more.

[0061] (Alkali-soluble resin (A1)) From the viewpoint of water stain suppression and heat resistance, the alkali-soluble resin (A) is preferably an alkali-soluble resin (A1) containing a monomer unit (a1) containing an alicyclic hydrocarbon and a monomer unit (a2) containing a polymerizable unsaturated group. It is conceivable that the alicyclic hydrocarbon structure, which has high hydrophobicity and combines flexibility and rigidity, has low affinity for the developer, and can form a tough film. Moreover, it is conceivable that by having polymerizable unsaturated groups, the resins can be cross-linked by exposure, thereby forming a tougher hardened film, and thus obtaining a pattern with suppressed water stains and good heat resistance.

[0062] The alkali-soluble resin (A1) is not particularly limited as long as it contains a monomer unit (a1) containing an alicyclic hydrocarbon and a monomer unit (a2) containing a polymerizable unsaturated group; any known resin may be used. Examples include: copolymers of monomers forming alicyclic hydrocarbon monomer units (a1) and monomers forming monomer units (a2) containing polymerizable unsaturated groups; copolymers in which monomer units (a1) containing alicyclic hydrocarbon monomer units (a1) and other monomers capable of copolymerizing with said monomers are reacted with a compound having polymerizable unsaturated groups to introduce monomer units (a2); and copolymers obtained using the method described in Japanese Patent Application Publication No. 2008-165059. Furthermore, the monomer unit (a2) containing a polymerizable unsaturated group is a unit that contains a polymerizable unsaturated group in said unit. In addition, the alkali-soluble group can be present at any site in the resin (A1).

[0063] [Monomer unit (a1) containing alicyclic hydrocarbon] Examples of monomers forming the monomer unit (a1) containing alicyclic hydrocarbon include: isobornyl methacrylate, cyclohexyl methacrylate, dicyclopentyl methacrylate, dicyclopentenyl methacrylate, dicyclopentyloxyethyl methacrylate, dicyclopentenyloxyethyl methacrylate, adamantyl methacrylate, etc. Among these, dicyclopentyl methacrylate, dicyclopentenyl methacrylate, and dicyclopentyloxyethyl methacrylate are preferred from the viewpoint of water stain suppression and pattern shape.

[0064] From the viewpoint of water stain suppression and pattern shape, the content of alicyclic hydrocarbon monomer unit (a1) in all the constituent units of the alkali soluble resin (A1) is preferably 1 mol% to 60 mol%, more preferably 1 mol% to 40 mol.

[0065] [Monomer unit (a2) containing polymerizable unsaturated group] Methods for making alkali-soluble resin (A1) contain monomer unit (a2) containing polymerizable unsaturated group include, for example, the methods shown in (i) to (iii) below.

[0066] <Method (i)> Method (i) for example, firstly synthesizes a polymer (precursor) of an epoxy-containing monomer and other monomers. Subsequently, the epoxy group of the precursor is added to a carboxyl-containing monomer (modified compound).

[0067] Examples of epoxy-containing monomers include glycidyl methacrylate, methyl glycidyl methacrylate, 2-glycidyloxyethyl methacrylate, 3,4-epoxybutyl methacrylate, and 3,4-epoxycyclohexyl methacrylate. Among these, glycidyl methacrylate is preferred from the viewpoint of reactivity.

[0068] Examples of monomers containing carboxyl groups include: acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, etc. Among these, acrylic acid and methacrylic acid are preferred.

[0069] From the viewpoint of reproducibility, the product obtained by adding the epoxy group of the epoxy-containing monomer unit to the carboxyl group of the carboxyl-containing monomer and then reacting the product with an acid anhydride is preferably a monomer unit containing a polymerizable unsaturated group (a2).

[0070] Examples of acid anhydrides include: tetrahydrophthalic anhydride, phthalic anhydride, hexahydrophthalic anhydride; succinic anhydride, maleic anhydride, etc.

[0071] <Method (ii)> Method (ii) for example, firstly synthesizes a polymer (precursor) of a carboxyl-containing monomer and other monomers. Subsequently, a portion of the carboxyl group of the precursor is added to an epoxy-containing monomer (modified compound), thereby having a carboxyl group and a polymerizable unsaturated group.

[0072] <Method (iii)> Method (iii) for example, firstly synthesizes polymers (precursors) of hydroxyl-containing monomers, carboxyl-containing monomers, and other monomers. Subsequently, the hydroxyl groups of the precursors are reacted with the isocyanate groups of the monomers (modified compounds) containing isocyanate groups.

[0073] Among monomers containing hydroxyl groups, examples include: 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate, 2-hydroxybutyl methacrylate, or 3-hydroxybutyl methacrylate, or 4-hydroxybutyl methacrylate, glycerol mono(meth)acrylate, or cyclohexanediol mono(meth)acrylate, etc. (meth)acrylate hydroxyalkyl esters.

[0074] Monomers containing isocyanate groups include, for example, 2-(meth)propenyl ethyl isocyanate, 2-(meth)propenyl oxyethyl isocyanate, or 1,1-bis[methpropenyl oxy]ethyl isocyanate, etc.

[0075] From the viewpoint of pattern shape, the content of monomer unit (a2) containing polymerizable unsaturated group in all the constituent units of alkali soluble resin (A1) is preferably 5 mol% to 80 mol%, more preferably 10 mol% to 80 mol.

[0076] [Monomer unit (a3) ​​with a glass transition temperature of 0°C or less in the homopolymer] From the viewpoint of pattern shape, the alkali-soluble resin (A1) is preferably a monomer unit (a3) ​​containing a glass transition temperature of 0°C or less in the homopolymer (other than (a1) and (a2)). More preferably, it is a monomer unit (a3) ​​with a glass transition temperature of -10°C or less in the homopolymer, and particularly preferably, it is a monomer unit (a3) ​​with a glass transition temperature of -30°C or less in the homopolymer. Furthermore, the term homopolymer refers to a homopolymer of each monomer, and the glass transition temperature values ​​are those shown in "Polymer Handbook, Third Edition, John Wiley & Sons, 1989" edited by Brandrup, J. Immergut, EH.

[0077] Examples of monomers forming the homopolymer unit (a3) ​​with a glass transition temperature below 0°C include: phenoxyethyl acrylate (-22°C), lauryl acrylate (-3°C), 2-ethylhexyl acrylate (-50°C), n-hexyl acrylate (-57°C), n-butyl acrylate (-48°C), isobutyl acrylate (-40°C), ethyl acrylate (-24°C), lauryl methacrylate (-65°C), n-hexyl methacrylate (-5°C), 2-ethylhexyl methacrylate (-10°C), 2-methoxyethyl acrylate (-50°C), tetrahydrofurfuryl acrylate (-12°C), etc. Among these, 2-ethylhexyl acrylate and 2-methoxyethyl acrylate are preferred.

[0078] From the viewpoint of pattern shape, in all the constituent units of the alkali-soluble resin (A1), the content of monomer units (a3) ​​with a glass transition temperature of 0°C or less of the homopolymer is preferably 1 mol% to 50 mol%, more preferably 5 mol% to 40 mol.

[0079] 〔Other monomer units (a4)〕 The alkali-soluble resin (A1) may contain monomer units other than (a1) to (a3) ​​(hereinafter also referred to as other monomer units (a4)).

[0080] Monomers forming other monomer units (a4) may include, for example, methyl methacrylate, ethyl methacrylate, isopropyl methacrylate, n-butyl methacrylate, tert-butyl methacrylate, stearate methacrylate, phenyl methacrylate, benzyl methacrylate, and other meth acrylates; hydroxyl-containing meth acrylates such as 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate or 3-hydroxypropyl methacrylate, and glyceryl monomethacrylate; epoxy-containing meth acrylates such as glycidyl methacrylate, methyl glycidyl methacrylate, 2-glycidyloxyethyl methacrylate, 3,4-epoxybutyl methacrylate, and 3,4-epoxycyclohexyl methacrylate; and unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, itaconic acid, maleic acid, and fumaric acid. (Meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, diacetone (meth)acrylamide, or acrylamide morpholine and other (meth)acrylamide derivatives; ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, or isobutyl vinyl ether and other vinyl ether derivatives; vinyl acetate, or vinyl propionate and other fatty acid vinyl esters; Phenylacetinimide, Methylmaleimide, Ethylmaleimide, 1,2-Dimaleimide ethane, 1,6-Dimaleimide hexane, 3-maleimide propionic acid, 6,7-Methylenedioxy-4-methyl-3-maleimide coumarin, 4,4'-Dimaleimide diphenylmethane, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane, N,N'-1,3-phenylene dimaleimide, N,N'-1,4-phenylene dimaleimide, N-(1-pyrene)maleimide, N-(2,4,6-trichlorobenzene) N-substituted maleimides include N-(4-aminophenyl)maleimide, N-(4-nitrophenyl)maleimide, N-benzylmaleimide, N-bromomethyl-2,3-dichloromaleimide, N-succinimino-3-maleimide benzoate, N-succinimino-3-maleimide propionate, N-succinimino-4-maleimide butyrate, N-succinimino-6-maleimide hexanoate, N-[4-(2-benzimidazolyl)phenyl]maleimide, and 9-maleimide acridine. 2-(meth)propenyl oxyethyl acid phosphate, compounds formed by reacting the hydroxyl groups of the above-described hydroxyl-containing (meth)acrylates with phosphoric acid esterifying agents such as phosphorus pentoxide or polyphosphoric acid, etc.Dimethyl-2,2'-[oxobis(methylene)]bis-2-acrylate, diethyl-2,2'-[oxobis(methylene)]bis-2-acrylate, di(n-propyl)-2,2'-[oxobis(methylene)]bis-2-acrylate, di(isopropyl)-2,2'-[oxobis(methylene)]bis-2-acrylate, di(2-ethylhexyl)-2,2'-[oxobis(methylene)]bis-2-acrylate, etc. These monomers can be used alone or in combination of two or more.

[0081] Alkali-soluble resin (A1) can be used alone or in combination with two or more.

[0082] From the viewpoint of water stain suppression and pattern shape, the content of alkali-soluble resin (A1) in 100% by mass of alkali-soluble resin (A) is preferably 30% to 100% by mass, more preferably 50% to 100% by mass.

[0083] (Alkali-soluble resin (A2)) The photosensitive composition of the present invention may contain an alkali-soluble resin other than alkali-soluble resin (A1) (hereinafter also referred to as alkali-soluble resin (A2)) as alkali-soluble resin (A).

[0084] The photosensitive composition of the present invention comprises a polymeric compound (B).

[0085] Examples of polymerizable compounds (B) include monomers and oligomers having polymerizable unsaturated groups. Examples of polymerizable unsaturated groups include vinyl, (methyl)allyl, and (meth)acrylyl groups with vinyl unsaturated double bonds. Furthermore, the weight average molecular weight or formula weight of polymerizable compound (B) is preferably less than 2000.

[0086] (Deltalactone-modified polymeric compound (B1)) From the viewpoint of suppressing water stains, the polymeric compound (B) is preferably a polymeric compound (B1) that has been modified with lactone.

[0087] The lactone-modified polymeric compound (B1) is a compound having an intramolecular structure modified by lactone. The lactone-modified polymeric compound (B1) can be obtained by esterifying a polyol such as trimethylolethane, di-trimethylolethane, trimethylolpropane, di-trimethylolpropane, pentaerythritol, tripentaerythritol, glycerol, diglycerol, or trimethylolmelamine with (meth)acrylic acid and ε-caprolactone or other lactone compounds. The lactone-modified polymeric compound (B1) is preferably a compound represented by the following general formula (14).

[0088] General Formula (14) [Chemistry 10]

[0089] In general formula (14), all six R are bases represented by general formula (15) below, or one to five of the six R are bases represented by general formula (15) below, and the rest are bases represented by general formula (16) below.

[0090] General Formula (15) [Chemistry 11]

[0091] In general formula (15), R1 represents a hydrogen atom or a methyl group, m is an integer of 1 or 2, and * is a bond bonded to the oxygen atom of general formula (14).

[0092] General Formula (16) [Chemistry 12]

[0093] In general formula (16), R1 represents a hydrogen atom or a methyl group, and * represents a bond bonded to an oxygen atom in general formula (14).

[0094] Polymer compounds (B1) modified with lactones are commercially available, for example, as the KAYARAD DPCA series manufactured by Nippon Kayaku Co., Ltd. Examples include: DPCA-20 (a compound in which m=1, the number of bases represented by formula (15)=2, and R1 is all hydrogen atoms in the general formulas (14) to (16), DPCA-30 (a compound in which m=1, the number of bases represented by formula (15)=3, and R1 is all hydrogen atoms in the general formulas (14) to (16), DPCA-60 (a compound in which m=1, the number of bases represented by formula (15)=6, and R1 is all hydrogen atoms in the general formulas (14) to (16), DPCA-120 (a compound in which m=2, the number of bases represented by formula (15)=6, and R1 is all hydrogen atoms in the general formulas (14) to (16), etc.

[0095] From the viewpoint of suppressing water stains, the lactone-modified polymeric compound (B1) is preferably a compound in which m=1 in the general formula (14) to general formula (16), the number of groups represented by general formula (15) is 2 to 6, and all R1 are hydrogen atoms. More preferably, it is a compound in which m=1 in the general formula (14) to general formula (16), the number of groups represented by general formula (15) is 2 or 3, and all R1 are hydrogen atoms.

[0096] The lactone-modified polymeric compound (B1) can be used alone or in combination with two or more.

[0097] From the viewpoint of suppressing water stains, the content of the lactone-modified polymeric compound (B1) in 100% by mass of the polymeric compound (B) is preferably 5% to 90% by mass, more preferably 10% to 85% by mass.

[0098] (Polymerizable compound (B2) having acid groups) From the viewpoint of pattern shape, the polymerizable compound (B) is preferably a polymerizable compound (B2) containing acid groups. Examples of acid groups in the polymerizable compound (B2) include sulfonic acid groups, carboxyl groups, phosphate groups, etc. Among these, carboxyl groups are preferred.

[0099] Polymerizable compounds with acid groups (B2) include, for example: esters of poly(meth)acrylates containing free hydroxyl groups and dicarboxylic acids; esters of polycarboxylic acids and monohydroxyalkyl esters of (meth)acrylates, etc. Examples of polyols include: ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, glycerol, trimethylolpropane, di-trimethylolpropane, pentaerythritol, dipentaerythritol, etc. Examples of dicarboxylic acids include: malonic acid, succinic acid, maleic acid, glutaric acid, phthalic acid, itaconic acid, etc. Examples of polycarboxylic acids include: trimellitic acid, pyromellitic acid, etc. Examples of monohydroxyalkyl esters of (meth)acrylate include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, pentaerythritol triacrylate, and 2-hydroxy-3-acrylic acid propyl methacrylate.

[0100] Commercially available polymeric compounds (B2) containing acid groups include Viscoat #2500P manufactured by Osaka Organic Co., Ltd., and Aronix M-5300, Aronix M-5400, Aronix M-5700, Aronix M-510, Aronix M-520, and Aronix M-521 manufactured by Toa Synthetic Co., Ltd.

[0101] The polymeric compound (B2) having an acid group can be used alone or in combination with two or more.

[0102] From the viewpoint of pattern formation, the content of the polymeric compound (B2) having an acid group in 100% by mass of the polymeric compound (B) is preferably 5% to 90% by mass, more preferably 10% to 85% by mass.

[0103] (Other polymeric compounds (B3)) The photosensitive composition of the present invention may contain polymeric compounds other than lactone-modified polymeric compounds (B1) and polymeric compounds having acid groups (B2) (hereinafter also referred to as other polymeric compounds (B3)) as polymeric compounds (B).

[0104] Other polymeric compounds (B3) include, for example: methyl methacrylate, ethyl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, cyclohexyl methacrylate, β-carboxyethyl methacrylate, polyethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, triethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, phenoxytetraethylene glycol (meth)acrylate, phenoxyhexaethylene glycol (meth)acrylate, trimethylolpropane PO modified tri(meth)acrylate, trimethylolpropane EO modified tri(meth)acrylate, isocyanuric acid EO modified di(meth)acrylate, isocyanuric acid EO modified tri(meth)acrylate, di- Trimethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, 1,6-hexanediol diglycidyl ether di(meth)acrylate, bisphenol A diglycidyl ether di(meth)acrylate, neopentyl glycol diglycidyl ether di(meth)acrylate, dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, tricyclodecyl(meth)acrylate, hydroxymethylated melamine (meth)acrylate, epoxy (meth)acrylate, urethane (meth)acrylate and other various acrylates and methacrylates, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth)acrylamide, N-hydroxymethyl (meth)acrylamide, N-vinylmethylamine, acrylonitrile, etc.

[0105] Commercially available products include: KAYARAD R-128H, KAYARAD R526, KAYARAD PEG400DA, KAYARAD MAND, KAYARAD NPGDA, KAYARAD R-167, KAYARAD HX-220, KAYARAD R-551, KAYARAD R712, KAYARAD R-604, and KAYARAD R-684, all manufactured by Nippon Kayaku Co., Ltd. Kayarad GPO-303, Kayarad TMPTA, Kayarad DPHA, Kayarad DPEA-12, Kayarad DPHA-2C, Kayarad D-310, Kayarad D-330; Aronix M-303, Aronix M-305, Aronix M-306, Aronix M-309, Aronix M-310 manufactured by Dong-A Synthetic Co., Ltd. Aronix M-321, Aronix M-325, Aronix M-350, Aronix M-360, Aronix M-313, Aronix M-315, Aronix M-400, Aronix M-402, Aronix M-403, Aronix M-404, Aronix M-405, Aronix M-406, Aronix M-450, Aronix Aronix M-452, Aronix M-408, Aronix M-211B, Aronix M-101A; Viscoat #310HP, Viscoat #335HP, Viscoat #700, Viscoat #295, Viscoat #330, Viscoat #360, Viscoat #GPT, Viscoat #400, Viscoat #405 manufactured by Osaka Organic Co., Ltd.Kyoei Chemical Co., Ltd. manufactures AH-600, AT-600, UA-306H, UA-306T, UA-306I, UA-510H, and UF-8001G; Shin-Nakamura Chemical Co., Ltd. manufactures NK ester A-9300, NK ester ABE-300, NK ester A-DOG, NK ester A-DCP, NK ester A-BPE-4, and NK ester UA-160TM; Miwon Specialty Chemical Co., Ltd. manufactures Miramer HR6060, Miramer HR6100, and Miramer HR6200; and Daicel (…). Allnex manufactures EECRYL 40, EECRYL 130, EECRYL 140, and EECRYL 145; Osaka Gas Chemicals manufactures OGSOL EA-0200 and OGSOL EA-0300, etc.

[0106] The polymeric compound (B) may be used alone or in combination with two or more.

[0107] In 100% by mass of the non-volatile components of the photosensitive composition, the content of the polymeric compound (B) is preferably 5% to 70% by mass, more preferably 10% to 60% by mass.

[0108] [Sensitizer (D)] From the viewpoint of pattern shape, the photosensitive composition of the present invention preferably contains a sensitizer (D).

[0109] Sensitizers (D) include, for example: unsaturated ketones represented by chalcone compounds, dibenzalacetone, etc.; 1,2-diketone compounds represented by azobenzene or camphorquinone, benzoin compounds, fluorene compounds, naphthoquinone compounds, anthraquinone compounds, xanthones, thioxanthones, xanthonone compounds, thioxanthonone compounds, coumarin compounds, coumarinone compounds, anthocyanin compounds, oxazine compounds, etc.; polymethyl pigments such as acridine compounds, acridine compounds, thiazine compounds, oxazine compounds, indoline compounds, azulene compounds, azulenium compounds, etc. The compounds include acid-lactone compounds, porphyrin compounds, tetraphenylporphyrin compounds, triarylmethane compounds, tetrabenzoporphyrin compounds, tetrapyrazinoporphyrazine compounds, phthalocyanine compounds, tetraazaporphyrazine compounds, tetraquinoxalinoporphyrazine compounds, naphthylphthalocyanine compounds, phthalocyanine compounds, pyranone compounds, thiopyrylium compounds, tetraphyrin compounds, annulene compounds, spiropyran compounds, spiroxazine compounds, thiospiropyran compounds, metal aromatic hydrocarbon complexes, organorurus complexes, or benzophenone compounds. Among these, from the viewpoint of pattern shape, thioxanthone compounds (D1) or benzophenone compounds (D2) are preferred, and thioxanthone compounds (D1) are more preferred.

[0110] (Thioxanthone compounds (D1)) Examples of thioxanthone compounds (D1) include: 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-dichlorothioxanthone, 2-isopropylthioxanthone, 4-isopropylthioxanthone, 1-chloro-4-propoxythioxanthone, etc. Among these, 2,4-diethylthioxanthone is preferred.

[0111] (Benzophenone compounds (D2)) Examples of benzophenone compounds (D2) include 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 2-aminobenzophenone, etc. Among these, 4,4'-bis(diethylamino)benzophenone is preferred.

[0112] The sensitizer (D) may be used alone or in combination with two or more.

[0113] From the viewpoint of pattern shape, the content of sensitizer (D) is preferably 5 to 100 parts by mass relative to 100 parts by mass of compound (C1) represented by general formula (1), more preferably 10 to 80 parts by mass, and particularly preferably 15 to 60 parts by mass.

[0114] The photosensitive composition of the present invention may contain a colorant (E).

[0115] The colorant (E) may be either a pigment or a dye, and may be used in combination.

[0116] (Pigment) Pigments are compounds classified as pigments in the color index. Examples of red pigments include: CI Pigment Red 1, 2, 3, 4, 5, 6, 7, 8, 9, 12, 14, 15, 16, 17, 21, 22, 23, 31, 32, 37, 38, 41, 47, 48, 48:1, 48:2, 48:3, 48:4, 49, 49:1, 49:2, 50:1, 52:1, 52:2, 53, 53:1, 53:2, 53:3, 57, 57:1, 57:2, 58:4, 60, 63, 63:1, 63:2, 6 4, 64:1, 68, 69, 81, 81:1, 81:2, 81:3, 81:4, 83, 88, 90:1, 101, 101:1, 104, 108, 108:1, 109, 112, 113, 114, 122, 123, 144, 146, 147, 149, 151, 166, 168, 169, 170, 172, 173, 174, 175, 176, 177, 178, 179, 181,1 84, 185, 187, 188, 190, 193, 194, 200, 202, 206, 207, 208, 209, 210, 214, 216, 220, 221, 224, 230, 231, 232, 233, 235, 236, 237, 238, 239, 242, 243, 245, 247, 249, 250, 251, 253, 254, 255, 256, 257, 258, 259, 2 Pigments described in Japanese Patent Application Publication No. 2014-134712 and Japanese Patent Publication No. 6368844, etc. Of these, from the viewpoints of heat resistance, light resistance and transmittance, CI Pigment Red 48: 1, 122, 177, 224, 242, 269, 254, 291, 295, 296, the pigments described in Japanese Patent Application Publication No. 2014-134712 and Japanese Patent Publication No. 6368844 are preferred, and CI Pigment Red 177, 254, 291, 295, 296, the pigments described in Japanese Patent Application Publication No. 2014-134712 and Japanese Patent Publication No. 6368844 are even more preferred.

[0117] Examples of orange pigments include: CI pigment orange 36, 38, 43, 64, 71, 73, etc.

[0118] Examples of yellow pigments include: CI Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 24, 31, 32, 34, 35, 35:1, 36, 36:1, 37, 37:1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 1 Pigments, etc., as described in Japanese Patent Application Publication No. 23, 126, 127, 128, 129, 138, 139, 147, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 173, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 192, 193, 194, 196, 198, 199, 213, 214, 231, 233, and Japanese Patent Application Publication No. 2012-226110. Among these, the preferred pigments are those described in CI Pigment Yellow 138, 139, 150, 185, 231, 233, and Japanese Patent Application Publication No. 2012-226110.

[0119] Examples of green pigments include: CI pigment green 1, 2, 4, 7, 8, 10, 13, 14, 15, 17, 18, 19, 26, 36, 37, 45, 48, 50, 51, 54, 55, 58, 59, 62, 63, etc. Among these, CI pigment green 36, 58, 59, 62, and 63 are preferred.

[0120] Examples of blue pigments include: CI pigment blue 1, 1:2, 9, 14, 15, 15:1, 15:2, 15:3, 15:4, 15:6, 16, 17, 19, 25, 27, 28, 29, 33, 35, 36, 56, 56:1, 60, 61, 61:1, 62, 63, 66, 67, 68, 71, 72, 73, 74, 75, 76, 78, 79, etc. Among these, CI pigment blue 15, 15:1, 15:2, 15:3, 15:4, and 15:6 are preferred.

[0121] Examples of purple pigments include: CI pigment violet 1, 1:1, 2, 2:2, 3, 3:1, 3:3, 5, 5:1, 14, 15, 16, 19, 23, 25, 27, 29, 31, 32, 37, 39, 42, 44, 47, 49, 50, etc. Among these, CI pigment violet 19 and 23 are preferred.

[0122] Examples of black pigments include: CI Pigment Black 1, 6, 7, 12, 20, 31, etc. Alternatively, at least two pigments selected from red, yellow, blue, green, and purple pigments may be used as black colorants.

[0123] Among pigments, inorganic pigments include, for example: titanium dioxide, barium sulfate, silicon dioxide, zinc white, lead sulfate, chrome yellow, zinc yellow, iron oxide (red iron oxide (III)), cadmium red, ultramarine, Prussian blue, chromium oxide green, cobalt green, brown earth, synthetic iron black, etc.

[0124] (Dyes) Examples of dyes include: acid dyes, direct dyes, basic dyes, salt-forming dyes, oil-soluble dyes, disperse dyes, reactive dyes, mordant dyes, vat dyes, sulfur dyes, etc. Additionally, derivatives of these dyes, or lake pigments formed by lake treatment of dyes, can also be listed.

[0125] The acid dye is preferably an acidic compound having an acidic group such as sulfonic acid or carboxylic acid [sulfonic acid group or carboxylic acid group]. Furthermore, a salt-forming compound consisting of the acid dye and a nitrogen-containing compound such as a quaternary ammonium salt compound, a tertiary amine compound, a secondary amine compound, or a primary amine compound is preferred. Additionally, a salt-forming compound consisting of a resin component having these functional groups and a salt of the acid dye is also preferred. Furthermore, by sulfonating the salt-forming compound to a sulfonylurea compound, a photosensitive composition with excellent resistance (lightfastness, solvent resistance) can be easily obtained. Furthermore, a salt-forming compound consisting of the acid dye and a compound having an onium salt group is also preferred due to its excellent resistance (lightfastness, solvent resistance). Moreover, a resin having a cationic group is preferred for the compound having an onium salt group.

[0126] Basic dyes can be used directly, but salt-forming compounds that form salts with organic acids or perchloric acid or their metal salts are preferred. Salt-forming compounds of basic dyes are preferred due to their excellent resistance (lightfastness, solvent resistance) or affinity for pigments. Furthermore, in the salt-forming compounds of basic dyes, the anionic component that acts as the anti-charge ion is preferably a salt-forming compound obtained by salting organic sulfonic acids, organic sulfuric acids, fluorine-containing phosphorus anionic compounds, fluorine-containing boron anionic compounds, cyano-containing nitrogen anionic compounds, anionic compounds containing conjugate bases of organic acids having halogenated hydrocarbon groups, and acidic dyes. In addition, if the salt-forming compound contains polymerizable unsaturated groups in its molecule, its resistance is further improved.

[0127] The chemical structures of dyes can be exemplified by those derived from azo dyes, diazo dyes, azomethyl base dyes (indoaniline dyes, indophenol dyes, etc.), dipyrrole methylene dyes, quinone dyes (benzoquinone dyes, naphthoquinone dyes, anthraquinone dyes, anthraquinone dyes, anthraquinone dyes, etc.), carbonium dyes (diphenylmethane dyes, triphenylmethane dyes, xanthones dyes, acridine dyes, etc.), quinone imine dyes (oxazine dyes, thiazine dyes, etc.), and acridine dyes. The pigment structures of dyes including polymethine dyes (oxocyanine dyes, cyanine dyes, arylidene dyes, styryl dyes, cyanine dyes, squaric acid endothelial dyes, croconium dyes, etc.), quinophthalone dyes, phthalocyanine dyes, subphthalocyanine dyes, violet ketone dyes, indigo dyes, thioindigo dyes, quinoline dyes, nitro dyes, nitroso dyes, rhodamine dyes, and their metal complex dyes.

[0128] Among these, from the viewpoint of color characteristics such as hue, color separation, and color unevenness, the pigment structure is preferably derived from pigments selected from azo dyes, oxalite dyes, cyanide dyes, triphenylmethane dyes, anthraquinone dyes, dipyrrole methylene dyes, squaric acid lacton dyes, quinoline ketone dyes, phthalocyanine dyes, and phthalocyanine dyes; more preferably, the pigment structure is derived from pigments selected from oxalite dyes, cyanide dyes, triphenylmethane dyes, anthraquinone dyes, dipyrrole methylene dyes, and phthalocyanine dyes.

[0129] Colorant (E) may be used alone or in combination with two or more.

[0130] In 100% by mass of the non-volatile components of the photosensitive composition, the content of colorant (E) is preferably 5% to 70% by mass, more preferably 10% to 60% by mass.

[0131] (Micronization of Pigment) The pigment is preferably used for micronization. The micronization method is not particularly limited; for example, wet milling, dry milling, or solvent extraction can be used. Among these, salt milling, a type of wet milling, is preferred. The average primary particle size of the micronized pigment, determined using a transmission electron microscope (TEM), is preferably 5 nm to 90 nm. Furthermore, from the viewpoint of dispersibility and contrast ratio, the average primary particle size is more preferably 10 nm to 70 nm.

[0132] Salt milling refers to the following process: using a kneader, two-rod roll mill, three-rod roll mill, ball mill, attritor, sand mill, or other mixing mills, a mixture of pigment, water-soluble inorganic salt, and water-soluble organic solvent is mechanically mixed while heated. The water-soluble inorganic salt and organic solvent are then removed by washing with water. The water-soluble inorganic salt acts as a crushing agent; its high hardness during salt milling causes the pigment to break down. By optimizing the conditions for salt milling pigment, pigments with extremely fine primary particle sizes, narrow distribution ranges, and sharp, fine particle distribution can be obtained.

[0133] Examples of water-soluble inorganic salts include sodium chloride, potassium chloride, and sodium sulfate. In terms of price, sodium chloride (table salt) is preferred. Regarding both processing and production efficiency, the amount of water-soluble inorganic salt used is preferably 50 to 2,000 parts by weight, more preferably 300 to 1,000 parts by weight, relative to 100 parts by weight of pigment.

[0134] Water-soluble organic solvents serve to wet pigments and water-soluble inorganic salts. They are solvents that dissolve (mix) in water but do not substantially dissolve the inorganic salts used. However, since the solvent is prone to evaporation when the temperature rises during salt milling, high-boiling-point solvents with a boiling point of 120°C or higher are preferred for safety reasons. Examples of solvents that can be used include: 2-methoxyethanol, 2-butoxyethanol, 2-(isopentyloxy)ethanol, 2-(hexyloxy)ethanol, diethylene glycol, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol, triethylene glycol monomethyl ether, liquid polyethylene glycol, 1-methoxy-2-propanol, 1-ethoxy-2-propanol, dipropylene glycol, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, liquid polypropylene glycol, etc. The amount of water-soluble organic solvent used is preferably 5 to 1,000 parts by weight relative to 100 parts by weight of pigment, and more preferably 50 to 500 parts by weight.

[0135] During the salt milling process, resin may be added as needed. The type of resin is not limited, but examples include: natural resin, modified natural resin, synthetic resin, and synthetic resin modified from natural resin. Preferably, it is a solid at room temperature and water-insoluble, and preferably partially soluble in the organic solvent. The amount of resin added is preferably 2 to 200 parts by weight relative to 100 parts by weight of pigment.

[0136] [Pigment Derivative (F)] The photosensitive composition of the present invention may contain pigment derivative (F).

[0137] Pigment derivatives (F) are compounds that have acidic, basic, or neutral groups in the residues of organic pigments. Examples of pigment derivatives (F) include: compounds with acidic substituents such as sulfonyl, carboxyl, or phosphate groups; amine salts of these compounds; compounds with basic substituents such as sulfonamide groups or tertiary amino groups at the terminal; and compounds with neutral substituents such as phenyl or phthalimide alkyl groups. Examples of organic pigments include: diketopyrrolopyrrole pigments, anthraquinone pigments, quinacridone pigments, dioxazine pigments, violet ketone pigments, perylene pigments, thiazide indigo pigments, triazine pigments, benzimidazolone pigments, benzisonidinole and other indole pigments; isoindoline pigments, isoindolineone pigments, quinoline ketone pigments, naphthol pigments, reduction pigments, metal complex pigments, azo, diazo, polyazo and other azo pigments, etc.

[0138] Specifically, known pigment derivatives described in the following publications can be cited: as diketopyrrolopyrrole pigment derivatives, examples include: Japanese Patent Application Publication No. 2001-220520, International Publication No. 2009 / 081930, International Publication No. 2011 / 052617, International Publication No. 2012 / 102399, and Japanese Patent Application Publication No. 2017-156397; as phthalocyanine pigment derivatives, examples include: Japanese Patent Application Publication No. 2007-226161, International Publication No. 2016 / 163351, Japanese Patent Application Publication No. 2017-165820, and Japanese Patent No. 575326. Japanese Patent Publication No. 6; examples of anthraquinone pigment derivatives include: Japanese Patent Application Publication No. 63-264674, Japanese Patent Application Publication No. 09-272812, Japanese Patent Application Publication No. 10-245501, Japanese Patent Application Publication No. 10-265697, Japanese Patent Application Publication No. 2007-079094, and International Publication No. 2009 / 025325; examples of quinacridone pigment derivatives include: Japanese Patent Application Publication No. 48-54128, Japanese Patent Application Publication No. 03-9961, and Japanese Patent Application Publication No. 2000-273383; examples of dioxazine pigment derivatives include: Japanese Patent Application Publication No. Japanese Patent Publication No. 2011-162662; as a thiazide-indigo pigment derivative, Japanese Patent Publication No. 2007-314785 can be cited; as a triazine pigment derivative, Japanese Patent Publication No. 61-246261, Japanese Patent Publication No. 11-199796, Japanese Patent Publication No. 2003-165922, Japanese Patent Publication No. 2003-168208, Japanese Patent Publication No. 2004-217842, and Japanese Patent Publication No. 2007-314681 can be cited; as a benzisoindole pigment derivative, Japanese Patent Publication No. 2009-57478 can be cited; as a quinoline pigment derivative... Examples of pigment derivatives include: Japanese Patent Application Publication No. 2003-167112, Japanese Patent Application Publication No. 2006-291194, Japanese Patent Application Publication No. 2008-31281, and Japanese Patent Application Publication No. 2012-226110; examples of naphthol-based pigment derivatives include: Japanese Patent Application Publication No. 2012-208329 and Japanese Patent Application Publication No. 2014-5439; examples of azo-based pigment derivatives include: Japanese Patent Application Publication No. 2001-172520 and Japanese Patent Application Publication No. 2012-172092; examples of acidic substituents include: Japanese Patent Application Publication No. 2004-307854.Examples of basic substituents include: Japanese Patent Application Publication Nos. 2002-201377, 2003-171594, 2005-181383, and 2005-213404. Furthermore, in these documents, pigment derivatives are sometimes referred to as derivatives, pigment derivatives, dispersants, pigment dispersants, or simply compounds, but compounds containing acidic, basic, or neutral substituents in the organic pigment residues described above have the same meaning as pigment derivatives.

[0139] The pigment derivative (F) may be used alone or in combination with two or more.

[0140] The content of pigment derivative (F) is preferably 1 to 20 parts by mass relative to 100 parts by mass of colorant (E), more preferably 2 to 10 parts by mass.

[0141] [Dispersion Resin (G)] The photosensitive composition of the present invention may contain a dispersion resin (G). The dispersion resin (G) is a resin used for dispersing the colorant (E).

[0142] The dispersion resin (G) is preferably a resin having an adsorption group that has a high affinity for the colorant (E). The adsorption group is preferably one or more of a basic group and an acidic group, and from the viewpoint of developability, it is preferably an acidic group.

[0143] Basic groups can be exemplified by: primary amino, secondary amino, tertiary amino, quaternary ammonium salt groups and nitrogen-containing heterocycles and other groups containing nitrogen atoms.

[0144] Acidic groups can be exemplified by carboxyl groups, phosphate groups, sulfonic acid groups, etc. Among these, from the viewpoint of the adsorption and development properties of pigments, carboxyl groups and phosphate groups are preferred.

[0145] The types of resins for dispersion resin (G) may include, for example: urethane resins; polycarboxylic acid esters such as polyacrylates, unsaturated polyamides, polycarboxylic acids, polycarboxylic acid (partial) amine salts, polycarboxylic acid ammonium salts, polycarboxylic acid alkylamine salts, polysiloxanes, long-chain polyaminoamine phosphates, hydroxyl-containing polycarboxylic acid esters, or modified forms thereof; amides or their salts formed by the reaction of poly(lower alkylimides) with polyesters having free carboxyl groups; water-soluble resins or water-soluble polymers such as (meth)acrylic acid-styrene copolymers, (meth)acrylic acid-(meth)acrylate copolymers, styrene-maleic acid copolymers, polyvinyl alcohol, and polyvinylpyrrolidone; polyester-based, modified polyacrylate-based, ethylene oxide / propylene oxide addition compounds, phosphate-based, etc.

[0146] Examples of molecular structures for the dispersion resin (G) include random structures, block structures, graft structures, comb structures, and star structures. Among these, block structures or comb structures are preferred from the viewpoint of dispersion stability.

[0147] Commercially available dispersion resins (G) include, for example, Disperbyk-101, Disperbyk-103, Disperbyk-107, Disperbyk-108, Disperbyk-110, Disperbyk-111, Disperbyk-116, Disperbyk-130, Disperbyk-140, Disperbyk-154, and Disperbyk-1 manufactured by BYK-Chemie Japan. 61. Disperbyk - 162. Disperbyk - 163. Disperbyk - 164. Disperbyk - 165. Disperbyk - 166. Disperbyk - 167. Disperbyk - 168. Disperbyk - 170. Disperbyk - 171. Disperbyk - 174. Disperbyk - 180. Disperbyk ( Disperbyk -181, Disperbyk -182, Disperbyk -183, Disperbyk -184, Disperbyk -185, Disperbyk -190, Disperbyk -2000, Disperbyk -2001, Disperbyk -2009, Disperbyk -2010, Disperbyk -2020, ...2, Disperbyk -183, Disperbyk -184, Disperbyk -185, Disperbyk -195, Disperbyk -2000, Disperbyk -2000, Disperbyk -2001, Disperbyk -2009, Disperbyk -2010, Disperbyk -2020, Disperbyk -2000, Disperbyk -2000, Disperbyk -2000, Disperbyk -2001, Disperbyk -2002, Disperbyk -2000, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -2002, Disperbyk -200 BYK-2025, BYK-2050, BYK-2070, BYK-2095, BYK-2150, BYK-2155, BYK-2163, BYK-2164, or Anti-Terra-U203, Anti-Terra-U204, or BYK-P104, BYK-P104S, BYK-220SOr Lactimon, Lactimon-WS, or Bykumen, etc., and the SOLSPERSE-3000, SOLSPERSE-9000, SOLSPERSE-13000, SOLSPERSE-13240, SOLSPERSE-13650, SOLSPERSE-13940, SOLSPERSE-16000, SOLSPERSE-17000, SOLSPERSE (SO...) manufactured by Lubrizol Corporation of Japan. SOLSPERSE - 18000, SOLSPERSE - 20000, SOLSPERSE - 21000, SOLSPERSE - 24000, SOLSPERSE - 26000, SOLSPERSE - 27000, SOLSPERSE - 28000, SOLSPERSE - 31845, SOLSPERSE - 32000, SOLSPERSE - 32500, SOLSPERSE - 32550, SOLSPERSE -33500, SOLSPERSE -32600, SOLSPERSE -34750, SOLSPERSE -35100, SOLSPERSE -36600, SOLSPERSE -38500, SOLSPERSE -41000, SOLSPERSE -41090, SOLSPERSE -53095, SOLSPERSE -55000, SOLSPERSE -56000, SOLSPERSE -76500, etc. The following models are manufactured by BASF (Japan): EFKA-46, EFKA-47, EFKA-48, EFKA-452, EFKA-4008, EFKA-4009, EFKA-4010, EFKA-4015, EFKA-4020, EFKA-4047, EFKA-4050, EFKA-4055, EFKA-4060, EFKA-4080, EFKA-4400, and EFKA-4401.EFKA-4402, EFKA-4403, EFKA-4406, EFKA-4408, EFKA-4300, EFKA-4310, EFKA-4320, EFKA-4330, EFKA-4340, EFKA-450, EFKA-451, EFKA-453, EFKA-4540, EFKA-4550, EFKA -4560, EFKA-4800, EFKA-5010, EFKA-5065, EFKA-5066, EFKA-5070, EFKA-7500, EFKA-7554, EFKA-1101, EFKA-120, EFKA-150, EFKA-1501, EFKA-1502, EFKA-1503, etc., Ajinomoto Precision Technology. Fine-Techno manufactures Ajisper PA111, Ajisper PB711, Ajisper PB821, Ajisper PB822, Ajisper PB824, etc., as disclosed in Japanese Patent Application Publication Nos. 2008-029901, 2009-155406, 2010-185934, and 20... Resins described in Japanese Patent Publication No. 11-157416, International Publication No. 2008 / 007776, Japanese Patent Application Publication No. 2008-029901, Japanese Patent Application Publication No. 2009-155406, Japanese Patent Application Publication No. 2010-185934, Japanese Patent Application Publication No. 2011-157416, Japanese Patent Application Publication No. 2009-251481, Japanese Patent Application Publication No. 2007-23195, and Japanese Patent Application Publication No. 1996-143651, etc.

[0148] Dispersible resin (G) can be used alone or in combination with two or more types.

[0149] From the viewpoint of dispersion stability, the content of dispersion resin (G) is preferably 3 to 200 parts by mass relative to 100 parts by mass of colorant (E), and more preferably 5 to 100 parts by mass.

[0150] [Thermosetting compound (H)] From the viewpoint of heat resistance, the photosensitive composition of the present invention preferably contains a thermosetting compound (H). Thus, during the heating step, the thermosetting compound (H) reacts, increasing the crosslinking density and thereby improving heat resistance.

[0151] The thermosetting compound (H) may also be a low-molecular-weight compound or a high-molecular-weight compound such as a resin. Examples of thermosetting compounds (H) include: epoxy compounds, oxetane compounds, benzoguanidine compounds, rosin-modified maleic acid compounds, rosin-modified fumaric acid compounds, melamine compounds, urea compounds, and phenolic compounds. Among these, epoxy compounds and oxetane compounds are preferred.

[0152] (Epoxy Compounds (H1)) Examples of epoxy compounds (H1) include: bisphenols (bisphenol A, bisphenol F, bisphenol S, bisphenol, bisphenol AD, etc.), phenols (phenol, alkyl-substituted phenols, aromatic-substituted phenols, naphthol, alkyl-substituted naphthols, dihydroxybenzene, alkyl-substituted dihydroxybenzene, dihydroxynaphthalene, etc.) and various aldehydes (formaldehyde, acetaldehyde, alkyl aldehydes, benzaldehyde, alkyl-substituted benzaldehyde, hydroxybenzene, naphthal, glutaraldehyde, o-phthalaldehyde, crotonaldehyde, cinnamaldehyde, etc.); condensation products of phenols and various diene compounds (dicyclopentadiene, terpenes, vinylcyclohexene, norbornene, vinylnorbornene, tetrahydroindene, divinylbenzene, divinylbiphenyl, diisopropenylbiphenyl, butadiene, isopentene, etc.). Polymers of phenols and ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, etc.); condensation polymers of phenols and aromatic dimethyl alcohols (benzyl dimethyl alcohol, α,α,α',α'-benzyl dimethyl alcohol, biphenyl dimethyl alcohol, α,α,α',α'-biphenyl dimethyl alcohol, etc.); condensation polymers of phenols and aromatic dichloromethyl alcohols (α,α'-dichloroxylene, dichloromethyl biphenyl, etc.); condensation polymers of bisphenols and various aldehydes; glycidyl ether epoxy resins, alicyclic epoxy resins, heterocyclic epoxy resins, aliphatic epoxy resins, glycidyl amine epoxy resins, glycidyl ester epoxy resins, etc., prepared by glycidylating alcohols, etc.

[0153] Commercially available products include, for example: EPICOAT 807, EPICOAT 815, EPICOAT 825, EPICOAT 827, EPICOAT 828, EPICOAT 190P, and EPICOAT 191P manufactured by Shell Epoxy Co., Ltd.; TECHMORE VG3101L manufactured by Mitsui Chemicals Co., Ltd.; and EPPN-201 and EPPN-501H manufactured by Nippon Kayaku Co., Ltd. EPPN-502H, EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1020; EPICOAT 1004, EPICOAT 1256, JER1032H60, JER157S65, JER157S70, JER152, JER154 manufactured by Nippon Epoxy Resin Co., Ltd.; CELLOXIDE 2021, EHPE-3150 manufactured by Daicel Chemical Co., Ltd.; Nagase Chemical Co., Ltd. The following Denacol products are manufactured by ChemteX: Denacol EX-211, Denacol EX-212, Denacol EX-252, Denacol EX-313, Denacol EX-314, Denacol EX-321, Denacol EX-411, Denacol EX-421, Denacol EX-512, and Denacol (DENA). Denacol EX-521, Denacol EX-611, Denacol EX-612, Denacol EX-614, Denacol EX-614B, Denacol EX-622, Denacol EX-711, Denacol EX-721, and Tepic-L, Tepic-H, and Tepic-S manufactured by Nissan Chemical Industries Co., Ltd.

[0154] In 100% by mass of the non-volatile components of the photosensitive composition, the content of epoxy compound (H1) is preferably 0.5% to 50% by mass, more preferably 1% to 40% by mass.

[0155] (Oxybutane compound (H2)) Oxybutane compound (H2) is a known compound having an oxybutane alkyl group. Examples of oxybutane compounds include monofunctional oxybutane compounds, difunctional oxybutane compounds, and trifunctional or higher oxybutane compounds.

[0156] Examples of functional oxetane compounds include: (3-ethyloxetane-3-yl) methyl acrylate, (3-ethyloxetane-3-yl) methyl methacrylate, 3-ethyl-3-hydroxymethyloxetane, 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-ethyl-3-(phenoxymethyl)oxetane, 3-ethyl-3-(2-methacryloxymethyl)oxetane, 3-ethyl-3-{[3-(triethoxysilyl)propoxy]methyl}oxetane, etc.

[0157] Commercially available products include, for example, OXE-10 and OXE-30 manufactured by Osaka Organic Chemical Industry Co., Ltd., and OXT-101 and OXT-212 manufactured by Toa Synthetic Co., Ltd.

[0158] Examples of difunctional oxetane compounds include: 4,4'-bis[(3-ethyl-3-oxetane)methoxymethyl]biphenyl, 1,4-bis[(3-ethyl-3-oxetane)methoxymethyl]benzene, 1,4-bis{[(3-ethyl-3-oxetane)methoxymethyl]benzene, di[1-ethyl(3-oxetane)]methyl ether, di[1-ethyl(3-oxetane)]methyl ether 3-Ethyl-3-hydroxymethyloxetane, 3-Ethyl-3-(2-ethylhexyloxymethyl)oxetane, 3-Ethyl-3-(2-phenoxymethyl)oxetane, 3,7-bis(3-oxetane)-5-oxa-nonane, 1,2-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]ethane, 1,3-bis[(3-ethyl-3-oxetane-butylmethoxy)methyl]propane, ethylene glycol bis(3- Ethyl-3-oxetane butyl methyl ether, dicyclopentenyl bis(3-ethyl-3-oxetane butyl methyl) ether, triethylene glycol bis(3-ethyl-3-oxetane butyl methyl) ether, tetraethylene glycol bis(3-ethyl-3-oxetane butyl methyl) ether, 1,4-bis(3-ethyl-3-oxetane butyl methoxy)butane, 1,6-bis(3-ethyl-3-oxetane butyl methoxy)hexane, polyethylene glycol bis(3-ethyl-3-oxetane butyl methoxy)butane Bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ether, ethylene oxide (EO) modified bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ether, propylene oxide (PO) modified bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ether, EO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ether, PO modified hydrogenated bisphenol A bis(3-ethyl-3-oxetanebutylmethyl) ether, EO modified bisphenol F (3-ethyl-3-oxetanebutylmethyl) ether, etc.

[0159] Commercially available products include, for example, OXBP and OXTP manufactured by Ube Industries, Ltd., and OXT-121 and OXT-221 manufactured by Toa Synthetic Co., Ltd.

[0160] Examples of trifunctional or higher-functional oxetane compounds include: pentaerythritol tris(3-ethyl-3-oxetane butylmethyl) ether, pentaerythritol tetra(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol hexa(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol penta(3-ethyl-3-oxetane butylmethyl) ether, dipentaerythritol tetra(3-ethyl-3-oxetane butylmethyl) ether, and caprolactone-modified dipentaerythritol hexa(3-ethyl-3-oxetane butylmethyl) ether. Polymers obtained by free radical polymerization of 3-ethyl-3-oxetane tetra(3-ethyl-3-oxetane butylmethyl) ether, caprolactone-modified dipentaerythritol penta(3-ethyl-3-oxetane butylmethyl) ether, di-trimethylolpropane tetra(3-ethyl-3-oxetane butylmethyl) ether, resins containing oxetane (e.g., oxetane-modified phenolic varnish resin as described in Japanese Patent No. 3783462) or (meth)acrylic acid monomers such as OXE-30.

[0161] In 100% by mass of the non-volatile components of the photosensitive composition, the content of oxetane compound (H2) is preferably 0.5% to 50% by mass, more preferably 1% to 40% by mass.

[0162] The melamine compound is a compound having a melamine ring structure. The melamine compound is preferably a hydroxymethyl or ether type compound, more preferably a melamine compound in which the average number of hydroxymethyl and / or ether groups in each melamine ring is 5.0 or more. If the number of hydroxymethyl or ether groups is moderate, it is easy to obtain appropriate heat resistance.

[0163] Commercially available products include, for example: Nikarach MW-30HM, Nikarach MW-390, Nikarach MW-100LM, Nikarach MX-750LM, Nikarach MW-30M, Nikarach MW-30, Nikarach MW-22, Nikarach MS-21, Nikarach MS-11, Nikarach MW-24X, Nikarach MS-001, etc., manufactured by Sanwa Chemical Co., Ltd. Nikarach MX-002, Nikarach MX-730, Nikarach MX-750, Nikarach MX-708, Nikarach MX-706, Nikarach MX-042, Nikarach MX-45, Nikarach MX-500, Nikarach MX-520, Nikarach MX-43, Nikarach MX-417, Nikarach MX-410, Cytec Industries, Japan Cytec Industries manufactures the following models: CYMEL 232, CYMEL 235, CYMEL 236, CYMEL 238, CYMEL 285, CYMEL 300, CYMEL 301, CYMEL 303, CYMEL 350, and CYMEL 370.

[0164] Among these, the average number of hydroxymethyl and / or ether groups in each melamine ring is 5.0 or more, including NIKALAC MW-30HM, NIKALAC MW-390, NIKALAC MW-100LM, NIKALAC MX-750LM, NIKALAC MW-30M, NIKALAC MW-30, NIKALAC MW-22, NIKALAC MS-21, NIKALAC MS-11, NIKALAC MW-24X, and NIKALAC MW-45 manufactured by Sanwa Chemical Co., Ltd., and NIKALAC MW-30HM, NIKALAC MW-390, NIKALAC MW-100LM, NIKALAC MX-750LM, NIKALAC MW-30M, NIKALAC MW-30, NIKALAC MW-22, NIKALAC MS-21, NIKALAC MS-11, NIKALAC MW-24X, and NIKALAC MW-45 manufactured by Japan Cytec Co., Ltd. Cymel 232, Cymel 235, Cymel 236, Cymel 238, Cymel 300, Cymel 301, Cymel 303, and Cymel 350 manufactured by Industries are preferred for improving crosslinking density.

[0165] Thermosetting compound (H) may be used alone or in combination with two or more.

[0166] [Curing Agent (Curing Accelerator)] To assist in the curing of the thermosetting compound (H), the photosensitive composition of the present invention may be used in conjunction with a curing agent (curing accelerator). Examples of curing agents include: amine compounds, acid anhydrides, active esters, carboxylic acid compounds, sulfonic acid compounds, etc. Examples of curing agents include: amine compounds (e.g., dicyandiamine, benzyldimethylamine, 4-(dimethylamino)-N,N-dimethylbenzylamine, 4-methoxy-N,N-dimethylbenzylamine, 4-methyl-N,N-dimethylbenzylamine, etc.), quaternary ammonium salt compounds (e.g., triethylbenzylammonium chloride, etc.), block isocyanate compounds (e.g., dimethylamine, etc.), imidazole derivative bicyclic amidine compounds and their salts (e.g., imidazole, 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, etc.). These include azoles, 2-phenylimidazoles, 4-phenylimidazoles, 1-cyanoethyl-2-phenylimidazoles, 1-(2-cyanoethyl)-2-ethyl-4-methylimidazoles, etc.), phosphorus compounds (such as triphenylphosphine), and S-triazine derivatives (such as 2,4-diamino-6-methacryloxyethyl-S-triazine, 2-vinyl-2,4-diamino-S-triazine, 2-vinyl-4,6-diamino-S-triazine / isocyanuric acid adduct, 2,4-diamino-6-methacryloxyethyl-S-triazine / isocyanuric acid adduct, etc.).

[0167] The hardener may be used alone or in combination with two or more.

[0168] The content of the curing agent is preferably 0.01 to 15 parts by mass relative to 100 parts by mass of the thermosetting compound (H).

[0169] [Thiol-based chain transfer agent (I)] The photosensitive composition of the present invention may contain a thiol-based chain transfer agent (I). When the thiol-based chain transfer agent (I) is used in conjunction with a photopolymerization initiator (C), sulfur free radicals that are not easily hindered by oxygen-induced polymerization are generated during free radical polymerization after light irradiation, thereby improving the photosensitivity of the photosensitive composition.

[0170] The thiol chain transfer agent (I) is preferably a polyfunctional thiol having two or more thiol groups (SH groups), more preferably a polyfunctional thiol having four or more thiol groups (SH groups). If the number of functional groups increases, the film can be easily photocured from the surface to the deepest part.

[0171] Examples of polyfunctional thiols include: hexane dithiol, decane dithiol, 1,4-butanediol dithiopropionate, 1,4-butanediol dithioglycolate, ethylene glycol dithioglycolate, ethylene glycol dithiopropionate, trimethylolpropane trithioglycolate, trimethylolpropane trithiopropionate, trimethylolpropane tri(3-mercaptobutyrate), pentaerythritol tetrathioglycolate, pentaerythritol tetrathiopropionate, tri(2-hydroxyethyl) isocyanurate of trimercaptopropionate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercapto-triazine, 2-(N,N-dibutylamino)-4,6-dimercapto-triazine, etc., preferably including: ethylene glycol dithiopropionate, trimethylolpropane trithiopropionate, pentaerythritol tetrathiopropionate.

[0172] Thiol chain transfer agents (I) can be used alone or in combination with two or more.

[0173] In 100% by mass of the non-volatile components of the photosensitive composition, the content of the thiol chain transfer agent (I) is preferably 1% to 10% by mass, more preferably 2% to 8% by mass. If it is present in an appropriate amount, the photosensitivity is improved and the surface of the hardened film is less prone to wrinkles.

[0174] [Polymerization Inhibitor (J)] The photosensitive composition of the present invention may contain a polymerization inhibitor (J).

[0175] Polymerization inhibitors (J) include, for example: catechol, resorcinol, 1,4-hydroquinone, 2-methylcatechol, 3-methylcatechol, 4-methylcatechol, 2-ethylcatechol, 3-ethylcatechol, 4-ethylcatechol, 2-propylcatechol, 3-propylcatechol, 4-propylcatechol, 2-n-butylcatechol, 3-n-butylcatechol, 4-n-butylcatechol, 2-tert-butylcatechol, 3-tert-butylcatechol, 4-tert-butylcatechol, 3,5-di-tert-butylcatechol and other alkylcatechol compounds; 2-methylresorcinol, 4-methylresorcinol, 2-ethylresorcinol, 4 Alkylresorcinol compounds such as ethylresorcinol, 2-propylresorcinol, 4-propylresorcinol, 2-n-butylresorcinol, 4-n-butylresorcinol, 2-tert-butylresorcinol, and 4-tert-butylresorcinol; alkylhydroquinone compounds such as methylhydroquinone, ethylhydroquinone, propylhydroquinone, tert-butylhydroquinone, and 2,5-di-tert-butylhydroquinone; phosphine compounds such as tributylphosphine, trioctylphosphine, tricyclohexylphosphine, triphenylphosphine, and tribenzylphosphine; phosphine oxide compounds such as trioctylphosphine oxide and triphenylphosphine oxide; phosphite compounds such as triphenylphosphite and trinonylphenylphosphite; and phloroglucin.

[0176] In 100% by mass of the non-volatile components of the photosensitive composition, the content of polymerization inhibitor (J) is preferably 0.01% to 0.4% by mass.

[0177] [Ultraviolet absorber (K)] The photosensitizing composition of the present invention may contain an ultraviolet absorber (K).

[0178] Ultraviolet absorber (K) is an organic compound with ultraviolet absorption function, such as: benzotriazole compounds, triazine compounds, benzophenone compounds, salicylic acid ester compounds, cyanoacrylate compounds and salicylate compounds, etc.

[0179] Examples of benzotriazole compounds include: 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(2'-hydroxy-5'-tert-octylphenyl)benzotriazole, 5% 2-methoxy-1 A mixture of methyl ethyl acetate with 95% phenylpropionic acid and 3-(2H-benzotriazol-2-yl)-(1,1-dimethylethyl)-4-hydroxy and C7-9 side chain and straight chain alkyl esters, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol, methyl 3-(3-(2 The reaction products of H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300, 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2,2'-methylenebis[6-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol], 2-(2H-benzotriazol-2-yl)-p-cresol, 2-(5-chloro-2H-benzotriazol-2-yl) -6-tert-butyl-4-methylphenol, 2-(3,5-di-tert-pentyl-2-hydroxyphenyl)benzotriazole, 2-[2-hydroxy-5-[2-(methacryloxy)ethyl]phenyl]-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate, 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazole-2-yl)phenyl]propionate.

[0180] Commercially available products include, for example: TINUVIN P, TINUVIN PS, TINUVIN 234, TINUVIN 326, TINUVIN 329, TINUVIN 384-2, TINUVIN 900, TINUVIN 928, TINUVIN 99-2, and TINUVIN 1130 manufactured by BASF Corporation of Japan; Adekastab LA-29, Adekastab LA-31RG, Adekastab LA-32, and Adekastab LA-36 manufactured by ADEKA Corporation; and Chemipro chemical products. Kasei Corporation manufactures KEMISORB 71, KEMISORB 73, KEMISORB 74, KEMISORB 79, and KEMISORB 279, while Otsuka Chemical manufactures RUNA-93, etc.

[0181] Examples of triazine compounds include: 2,4-bis(2,4-dimethylphenyl)-6-(2-hydroxy-4-n-octyloxyphenyl)-1,3,5-triazine, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)-glycidyl The reaction products of esters, 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-(hexyloxy)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexyloxy)ethoxy]phenol, 2,4,6-tris(2-hydroxy-4-hexyloxy-3-methylphenyl)-1,3,5-triazine, etc.

[0182] Commercially available products include: KEMISORB 102 manufactured by Chemipro Kasei, TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, TINUVIN 479, and TINUVIN 1577ED manufactured by BASF, Adekastab LA-46 and Adekastab LA-F70 manufactured by ADEKA, and CYASORB UV-1164 manufactured by Sun Chemical.

[0183] Examples of benzophenone compounds include: 2,4-di-hydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid, 2-hydroxy-4-n-octyloxybenzophenone, 2,2'-di-hydroxy-4-methoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 4-dodecoxy-2-hydroxybenzophenone, 2-hydroxy-4-octadecoxybenzophenone, 2,2'-dihydroxy-4,4'-dimethoxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, 2-hydroxy-4-methoxy-2'-carboxybenzophenone, etc.

[0184] Commercially available products include: KEMISORB 10, KEMISORB 11, KEMISORB 11S, KEMISORB 12, KEMISORB 111 manufactured by Chemipro Kasei; SEESORB 101 and SEESORB 107 manufactured by Shipro Kasei; Adekastab 1413 manufactured by ADEKA; and UV-12 manufactured by Sun Chemical.

[0185] Examples of salicylate compounds include: phenyl salicylate, p-octylphenyl salicylate, p-tert-butylphenyl salicylate, etc.

[0186] In a total of 100% by mass of photopolymerization initiator (C) and ultraviolet absorber (K), the content of ultraviolet absorber (K) is preferably 5% to 70% by mass.

[0187] [Antioxidant (L)] The photosensitive composition of the present invention may contain an antioxidant (L).

[0188] The antioxidant (L) prevents yellowing caused by oxidation of the photopolymerization initiator (C) or thermosetting compound (H) contained in the photosensitive composition during the thermal steps of thermosetting or indium tin oxide (ITO) annealing. Especially when the concentration of the colorant (E) in the photosensitive composition is high, the content of the polymerizable compound (B) is relatively reduced. Therefore, if this is addressed by increasing the amount of photopolymerization initiator (C) or adjusting the formulation of the thermosetting compound (H), the cured film is prone to yellowing. Therefore, by including an antioxidant, yellowing of the cured film caused by oxidation during the heating step is prevented.

[0189] Antioxidants (L) may include, for example, hindered phenolic, hindered amine, phosphorus, sulfur, and hydroxylamine compounds. Furthermore, in this specification, antioxidants are preferably compounds that do not contain halogen atoms.

[0190] Among these, hindered phenolic antioxidants, hindered amine antioxidants, phosphorus antioxidants, and sulfur antioxidants are preferred.

[0191] Hindered phenolic antioxidants include, for example: 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 1,1,3-tris-(2'-methyl-4'-hydroxy-5'-tert-butylphenyl)butane, 4,4'-butylene-bis-(2-tert-butyl-5-methylphenol), stearate 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythritol tetra[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 3,9-bis[2 -[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionic acid]-1,1-dimethylethyl]-2,4,8,10-tetraoxaspiro[5.5]undecane, 1,3,5-tris(3,5-di-tert-butyl-4-hydroxyphenylmethyl)-2,4,6-trimethylbenzene, 1,3,5-tris(3-hydroxy-4-tert-butyl-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6(1H,3H,5H)-trione, 2,2'-methylenebis(6-tert-butyl-4-ethylphenol), 2,2'-thiodiethylbis- (3,5-Di-tert-butyl-4-hydroxyphenyl)-propionate, N,N-hexamethylenebis(3,5-di-tert-butyl-4-hydroxy-hydroxycinnamic acid), isooctyl-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 4,6-bis(dodecylthiomethyl)-o-cresol, calcium salt of monoethyl 3,5-di-tert-butyl-4-hydroxybenzylphosphonate, 4,6-bis(octylthiomethyl)-o-cresol, bis[3-(3-(methyl-4-hydroxy-5-tert-butylphenyl)propionate]ethylenedioxydiethylene ester, 1,6-hexanediol bis[3-( 3,5-Di-tert-butyl-4-hydroxyphenyl)propionate, 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-tert-butylaniline)-1,3,5-triazine, 2,2'-thio-bis-(6-tert-butyl-4-methylphenol), 2,5-di-tert-pentyl-hydroquinone, 2,6-di-tert-butyl-4-nonylphenol, 2,2'-isobutylene-bis-(4,6-dimethylphenol), 2,2'-methylene-bis-(6-(1-methyl-cyclohexyl)-p-cresol), 2,4-dimethyl-6-(1-methyl-cyclohexyl)-phenol, etc.

[0192] Commercially available products include, for example: Adekastab AO-20, Adekastab AO-30, Adekastab AO-40, Adekastab AO-50, Adekastab AO-60, Adekastab AO-80, and Adekastab AO-330 manufactured by Adekastab; and Keminox 101, Keminox 179, Keminox 76, and Keminox 942 manufactured by Chemipro. 5. IRGANOX 1010, IRGANOX 1035, IRGANOX 1076, IRGANOX 1098, IRGANOX 1135, IRGANOX 1330, IRGANOX 1726, IRGANOX 1425WL, IRGANOX 1520L, IRGANOX 245, IRGANOX 259, IRGANOX 3114, IRGANOX 5057, and IRGANOX 565 manufactured by BASF (Japan), and produced by Sun Chemical (Sun Chemical). CYANOX products such as CY-1790 and CY-2777 manufactured by Chemical Company.

[0193] Hindered amine antioxidants include, for example: tetrakis(1,2,2,6,6-pentamethyl-4-piperidinyl)-1,2,3,4-butanetetracarboxylate, tetrakis(2,2,6,6-tetramethyl-4-piperidinyl)1,2,3,4-butanetetracarboxylate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, bis(2,2,6,6-tetramethyl-4-piperidinyl) sebacate, bis(1-undecyloxy-2,2,6,6-tetramethylpiperidin-4-yl) carbonate, 1,2,2,6,6-pentamethyl-4-piperidinyl methacrylate, 2,2 6,6-Tetramethyl-4-piperidinyl methacrylate, dimethyl succinate and 1-(2-hydroxyethyl)-4-hydroxy-2,2,6,6-tetramethylpiperidin condensation polymer, poly[[6-[(1,1,3,3-tetramethylbutyl)amino]-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]], ester of 4-hydroxy-2,2,6,6-tetramethyl-1-piperidinyl ethanol and 3,5,5-trimethylhexanoic acid, N,N'-4,7-tetra[4,6] -bis{N-butyl-N-(1,2,2,6,6-pentamethyl-4-piperidinyl)amino}-1,3,5-triazin-2-yl]-4,7-diazadecane-1,10-diamine, bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) sebacate and the reaction product of 1,1-dimethylethyl hydroperoxide with octane, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate, methyl 1,2,2,6,6-pentamethyl-4-piperidinyl sebacate Esters, poly[[6-morpholino-triazine-2,4-diyl]-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]-hexamethylene-[(2,2,6,6-tetramethyl-4-piperidinyl)imino]], 2,2,6,6-tetramethyl-4-piperidinyl-C12-21 and C18 unsaturated fatty acid esters, N,N'-bis(2,2,6,6-tetramethyl-4-piperidinyl)-1,6-hexamethylenediamine, 2-methyl-2-(2,2,6,6-tetramethyl-4-piperidinyl)amino-N-(2,2,6,6-tetramethyl-4-piperidinyl)propionylamine, etc.

[0194] Commercially available products include, for example: Adekastab LA-52, Adekastab LA-57, Adekastab LA-63P, Adekastab LA-68, Adekastab LA-72, Adekastab LA-77Y, Adekastab LA-77G, Adekastab LA-81, Adekastab LA-82, Adekastab LA-87, Adekastab LA-402F, and Adekastab LA-502XP, manufactured by Adekastab. (Chemipro chemical) Kasei Corporation manufactures KAMISTAB 29, KAMISTAB 62, KAMISTAB 77, and KAMISTAB 94; BASF Corporation manufactures TINUVIN 111FDL, TINUVIN 123, TINUVIN 144, TINUVIN 249, TINUVIN 292, and TINUVIN 5100; and Sun Chemical Corporation manufactures CYASORB UV-3346, CYASORB UV-3529, and CYASORB UV-3853, among others.

[0195] Examples of phosphorus-based antioxidants include: di(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, distearate pentaerythritol diphosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)2-ethylhexyl phosphite, tris(2,4-di-tert-butylphenyl) phosphite, tris(nonylphenyl) phosphite, tetra(C12-C15 alkyl)-4,4'-isopropylidene diphenyl Diphosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl isodecyl phosphite, tris(isodecyl) phosphite, triphenyl phosphite, tetra(2,4-di-tert-butylphenyl)-4,4-biphenyl diphosphite, tri(tridecyl) phosphite, phenyl isooctyl phosphite, phenyl isodecyl phosphite, phenyl di(tridecyl) phosphite, diphenyl isooctyl phosphite, diphenyl tridecyl phosphite Ester, 4,4'-isopropylidene diphenol alkyl phosphite, trinonylphenyl phosphite, tri-dinonylphenyl phosphite, tri(biphenyl) phosphite, di(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, di(nonylphenyl)pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, tetra-tetrazyl-4,4'-butylidene bis(3-methyl-6-tert-butylphenol) diphosphite, hexa-decayl phosphite Trialkyl 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane triphosphite, 3,5-di-tert-butyl-4-hydroxybenzyl phosphite diethyl ester, bis(4-tert-butylphenyl)sodium phosphite, 2,2-methylene-bis(4,6-di-tert-butylphenyl)-sodium phosphite, 1,3-bis(diphenoxyphosphoxy)-benzene, ethyl bis(2,4-di-tert-butyl-6-methylphenyl) phosphite, etc.

[0196] Commercially available products include, for example: Adekastab PEP-36, Adekastab PEP-8, Adekastab HP-10, Adekastab 2112, Adekastab 1178, Adekastab 1500, Adekastab C, Adekastab 135A, Adekastab 3010, and Adekastab TPP manufactured by Adekastab Corporation; IRGAFOS 168 manufactured by BASF Corporation of Japan; and Hostanox P-EPQ manufactured by Clariant Chemicals.

[0197] Examples of sulfur-based antioxidants include: 2,2-bis{[3-(dodecylthio)-1-oxopropoxy]methyl}propane-1,3-diylbis[3-(dodecylthio)propionate], 3,3'-thiodipropionate di-tetrazyl ester, 2,2-thio-diethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,4-bis[(octylthio)methyl]-o-cresol, 2,4-bis[(laurylthio)methyl]-o-cresol, etc.

[0198] Commercially available products include, for example, Adekastab AO-412S and Adekastab AO-503 manufactured by ADEKA Corporation, and KEMINOX PLS manufactured by Chemipro Kasei Corporation.

[0199] Antioxidants (L) can be used alone or in combination with two or more.

[0200] In 100% by mass of the non-volatile components of the photosensitive composition, the content of antioxidant (L) is preferably 0.5% to 5.0% by mass. When it is present in an appropriate amount, the transmittance, spectroscopic characteristics and sensitivity are improved.

[0201] [Leveling agent (M)] The photosensitive composition of the present invention may contain a leveling agent (M). As a result, the wettability and drying properties relative to the substrate during application are further improved.

[0202] Leveling agents (M) include, for example: silicone surfactants, fluorinated surfactants, nonionic surfactants, cationic surfactants, anionic surfactants, amphoteric surfactants, etc.

[0203] Examples of silicone surfactants include: linear polymers containing siloxane bonds, and modified siloxane polymers with organic groups introduced into the side chains or ends.

[0204] Commercially available products include, for example: BYK-300, BYK-306, BYK-310, BYK-313, BYK-315N, BYK-320, BYK-322, BYK-323, BYK-330, BYK-331, BYK-333, BYK-342, BYK-345, BYK-346, BYK-347, BYK-348, BYK-349, BYK-370, BYK-377, BYK-378, BYK-3455, BYK-UV3510, and BYK-UV3570 manufactured by BYK-Chemie, and Toray Dow Corning. The following models are manufactured by Corning: FZ-7002, FZ-2110, FZ-2122, FZ-2123, FZ-2191, FZ-5609; and by Shin-Etsu Chemical Industry Co., Ltd.: X-22-4952, X-22-4272, X-22-6266, KF-351A, KF-354L, KF-355A, KF-945, KF-640, KF-642, KF-643, X-22-4515, KF-6004, KP-341, etc.

[0205] Fluorine surfactants include, for example, surfactants or leveling agents having fluorocarbon chains.

[0206] Commercially available products include, for example: Surflon S-242, Surflon S-243, Surflon S-420, Surflon S-611, Surflon S-651, Surflon S-386 manufactured by AGC Seimi Chemical Co., Ltd.; and Megafac F-253, Megafac F-477, Megafac F-551, Megafac F-552, Megafac F-555, Megafac F-558, and Megafac F-253 manufactured by DIC Co., Ltd. Megafac F-560, Megafac F-570, Megafac F-575, Megafac F-576, Megafac R-40-LM, Megafac R-41, Megafac RS-72-K, Megafac DS-21; Sumitomo 3M FC-4430, FC-4432; Mitsubishi Materials Electronics & Chemicals EF-PP31N09, EF-PP33G1, EF-PP32C1; NEOS Ftergent 602A, etc.

[0207] Examples of nonionic surfactants include: polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether, polyoxyethylene oleyl ether, polyoxyethylene alkyl ether, polyoxyethylene myristyl ether, polyoxyethylene octyl dodecyl ether, polyoxyethylene alkylene alkyl ether, polyoxyethylene styrene phenyl ether, polyoxyethylene tribenzyl phenyl ether, polyoxyethylene polyoxypropylene glycol, polyoxyethylene alkylene alkenyl ether, polyoxyethylene nonyl phenyl ether, polyoxyethylene alkyl ether phosphate, sorbitol monolaurate, sorbitol monopalmitate, sorbitol monostearate, sorbitol distearate, sorbitol tristearate, and more. Sugar alcohol monooleate, dehydrated sorbitol trioleate, dehydrated sorbitol sesquioleate, polyoxyethylene dehydrated sorbitol monolaurate, polyoxyethylene dehydrated sorbitol monopalmitate, polyoxyethylene dehydrated sorbitol anhydride monostearate, polyoxyethylene dehydrated sorbitol tristearate, polyoxyethylene dehydrated sorbitol monooleate, polyoxyethylene dehydrated sorbitol triisostearate, tetraoleic polyoxyethylene sorbitol, glycerol monostearate, glycerol monooleate, polyethylene glycol monolaurate, polyethylene glycol monostearate, polyethylene glycol distearate, polyethylene glycol monooleate, polyoxyethylene cured castor oil, polyoxyethylene alkylamine, alkylalkanolamide, alkylimidazoline, etc.

[0208] Commercially available products include, for example: Emulgen 103, Emulgen 104P, Emulgen 106, Emulgen 108, Emulgen 109P, Emulgen 120, Emulgen 123P, Emulgen 130K, Emulgen 147, Emulgen 150, Emulgen 210P, Emulgen 220, and Emulgen (Em...) manufactured by Kao Corporation. Emulgen 306P, Emulgen 320P, Emulgen 350, Emulgen 404, Emulgen 408, Emulgen 409PV, Emulgen 420, Emulgen 430, Emulgen 705, Emulgen 707, Emulgen 709, Emulgen 1108, Emulgen 1118S-70, Emulgen 11 35S-70, Emulgen 1150S-60, Emulgen 2020G-HA, Emulgen 2025G, Emulgen LS-106, Emulgen LS-110, Emulgen LS-114, Emulgen MS-110, Emulgen A-60, Emulgen A-90, Emulgen B-66, Emulgen PP-290, Latemul PD-420, Latemul PD-430, Latemul PD-430S, Latemul PD-450, Rheodol SP-L10, Rheodol SP-P10, Rheodol SP-S10V, Rheodol SP-S20, Rheodol SP-S30V, Rheodol SP-O10V, Rheodol SP-O30V, Rheodol SuperSuper SP-L10, Rheodol AS-10V, Rheodol AO-10V, Rheodol AO-15V, Rheodol TW-L120, Rheodol TW-L106, Rheodol TW-P120, Rheodol TW-S120V, Rheodol TW-S320V, Rheodol TW-O120V, Rheodol TW-O106V, Rheodol TW-IS399C, Rheodol Super (Rheodol) Super) TW-L120, Rheodol 430V, Rheodol 440V, Rheodol 460V, Rheodol MS-50, Rheodol MS-60, Rheodol MO-60, Rheodol MS-165V, Emanon 1112, Emanon 3199V, Emanon 3299V, Emanon 3299RV, Emanon ( Emanon 4110, Emanon CH-25, Emanon CH-40, Emanon CH-60(K), Amiet 102, Amiet 105, Amiet 105A, Amiet 302, Amiet 320, Aminon PK-02S, Aminon L-02, Homogenol L-95, and Adeka Pronik manufactured by ADEKA. Pluronic L-23, Adeka Pluronic L-31, Adeka Pluronic L-44, Adeka Pluronic L-61, Adeka Pluronic L-62, Adeka Pluronic L-64, Adeka Pluronic L-71, Adeka Pluronic L-72, Adeka Pluronic L-101, Adeka Pluronic L-121, Adeka ...4, Adeka Pluronic L-71, Adeka Pluronic L-72, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka Pluronic L-121, Adeka PPluronic TR-701, Adeka Pluronic TR-702, Adeka Pluronic TR-704, Adeka Pluronic TR-913R, and (meth)acrylic acid-based (co)polymers Polyflow No.75, Polyflow No.90, Polyflow No.95, etc., manufactured by Kyoei Chemical Co., Ltd.

[0209] Catonic surfactants include, for example, alkylamine salts or alkyl quaternary ammonium salts or their ethylene oxide adducts, such as lauryltrimethylammonium chloride, stearyltrimethylammonium chloride, cetyltrimethylammonium chloride, etc.

[0210] Commercially available products include, for example, Acetamin 24, Quartamin 24P, Quartamin 60W, Quartamin 86P CONC manufactured by Kao Corporation.

[0211] Anionic surfactants include, for example, polyoxyethylene alkyl ether sulfates, sodium dodecylbenzene sulfonate, alkali salts of styrene-acrylic acid copolymers, sodium alkylnaphthalene sulfonate, sodium alkyl diphenyl ether disulfonate, monoethanolamine lauryl sulfate, triethanolamine lauryl sulfate, ammonium lauryl sulfate, monoethanolamine stearate, sodium stearate, sodium lauryl sulfate, monoethanolamine of styrene-acrylic acid copolymers, polyoxyethylene alkyl ether phosphates, etc.

[0212] Commercially available products include, for example: Ftergent 100 and Ftergent 150 manufactured by NEOS, and ADEKA HOPE YES-25, ADEKA COL TS-230E, ADEKA COL PS-440E, and ADEKA COL EC-8600 manufactured by ADEKA.

[0213] Examples of amphoteric surfactants include: alkyl betaine, lauryl betaine, cocamidopropyl betaine, stearyl betaine, alkyl dimethylaminoacetic acid betaine, and other alkyl betaines; alkyl amine oxides such as lauryl dimethylamine oxide, etc.

[0214] Commercially available products include: Amphitol 20AB, Amphitol 20BS, Amphitol 24B, Amphitol 55AB, Amphitol 86B, Amphitol 20Y-B, ​​Amphitol 20N, etc., manufactured by Kao Corporation.

[0215] Leveling agent (M) can be used alone or in combination with two or more.

[0216] In 100% by mass of the non-volatile components of the photosensitive composition, the leveling agent (M) content is preferably 0.001% by mass to 2.0% by mass, more preferably 0.005% by mass to 1.0% by mass. By being within the range described above, the balance between the coatability and adhesion of the photosensitive composition is further improved.

[0217] [Storage Stabilizer (N)] The photosensitive composition of the present invention may contain a storage stabilizer (N). Thus, the viscosity of the photosensitive composition is stabilized over time.

[0218] Storage stabilizers (N) can be listed as follows: benzyltrimethyl chloride, diethylhydroxylamine and other quaternary ammonium chloride, organic acids such as lactic acid and oxalic acid and their methyl ethers, tert-butylcatechol, tetraethylphosphine, tetraphenyl and other organophosphines, phosphites, etc.

[0219] Storage stabilizer (N) can be used alone or in combination with two or more.

[0220] In 100% by mass of the non-volatile components of the photosensitive composition, the content of the storage stabilizer (N) is preferably 0.1% to 10% by mass.

[0221] [Adhesion Enhancer (O)] The photosensitive composition of the present invention may contain an adhesion enhancer (O). This improves the adhesion between the film and the substrate. Furthermore, narrow patterns can be easily formed using photolithography.

[0222] Adhesion enhancers (O) include, for example, silane coupling agents. Examples of silane coupling agents include: vinyltrimethoxysilane, vinyltriethoxysilane, and other vinyl silanes; 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane. (Meth)acrylate silanes; 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropyltriethoxysilane, etc. epoxy silanes; N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethyl-butylene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane... Silane coupling agents include aminosilanes such as methoxysilane hydrochloride; mercapto compounds such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; styryl compounds such as p-styryltrimethoxysilane; urea compounds such as 3-ureopropyltriethoxysilane; thioethers such as bis(triethoxysilylpropyl)tetrasulfide; and isocyanates such as 3-isocyanatepropyltriethoxysilane.

[0223] The sealing enhancer (O) can be used alone or in combination with two or more.

[0224] In 100% by mass of the non-volatile components of the photosensitive composition, the content of the adhesion enhancer (O) is preferably 0.01% to 10% by mass, more preferably 0.05% to 5% by mass.

[0225] [Organic solvent (P)] The photosensitive composition of the present invention may contain an organic solvent (P).

[0226] Organic solvents (P) include, for example: 1,2,3-trichloropropane, 1-methoxy-2-propanol, ethyl lactate, 1,3-butanediol, 1,3-butylene glycol, 1,3-butanediol diacetate, 1,4-dioxane, 2-heptanone, 2-methyl-1,3-propanediol, 3,5,5-trimethyl-2-cyclohexen-1-one, 3,3,5-trimethylcyclohexanone, ethyl 3-ethoxypropionate, 3-methyl-1,3-butanediol, 3-methoxy-3-methyl-1-butanol, 3-methoxy-3-methylbutylacetate, 3-methoxybutanol, 3-methoxybutylacetate, 4-heptanone, m-xylene, m-diethyl Benzene, m-dichlorobenzene, N,N-dimethylacetamide, N,N-dimethylformamide, n-butyl alcohol, n-butylbenzene, n-propyl acetate, N-methylpyrrolidone, o-xylene, o-chlorotoluene, o-diethylbenzene, o-dichlorobenzene, p-chlorotoluene, p-diethylbenzene, sec-butylbenzene, tert-butylbenzene, γ-butyrolactone, isobutyl alcohol, isophorone, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monoethyl ether acetate, ethylene glycol monotert-butyl ether, ethylene glycol monobutyl ether, ethylene glycol... Ethylene glycol monobutyl ether acetate, ethylene glycol monopropyl ether, ethylene glycol monohexyl ether, ethylene glycol monomethyl ether, ethylene glycol monomethyl ether acetate, diisobutyl ketone, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoisopropyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether, cyclohexanol, cyclohexanol acetate, cyclohexanone, dipropylene glycol dimethyl ether, dipropylene glycol methyl ether acetate, dipropylene glycol monoethyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monopropyl ether ... Glycol monomethyl ether, diacetone alcohol, triacetin, tripropylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol diacetate, propylene glycol phenyl ether, propylene glycol monoethyl ether, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, propylene glycol monomethyl ether propionate, benzyl alcohol, methyl isobutyl ketone, methyl cyclohexanol, n-amyl acetate, n-butyl acetate, isoamyl acetate, isobutyl acetate, propyl acetate, diesters, etc. Among these, from the viewpoint of colorant dispersibility and adhesive resin solubility, diol acetates such as ethyl lactate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, ethylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate are preferred; alcohols such as benzyl alcohol and diacetone alcohol are preferred; or ketones such as cyclohexanone are preferred.

[0227] The organic solvent (P) may be used alone or in combination with two or more.

[0228] [Method for Manufacturing the Photosensitive Composition] The photosensitive composition of the present invention can be manufactured, for example, by formulating a colorant (E), a dispersion resin (G), a pigment derivative (F), and an organic solvent (P) and then dispersing them. Subsequently, it can be manufactured by formulating and mixing an alkali-soluble resin (A), a polymerizable compound (B), a photopolymerization initiator (C), etc., into the dispersion. Furthermore, the formulating materials and the timing of their formulation are arbitrary. Multiple dispersion steps may also be performed.

[0229] Dispersing machines used for dispersion processing include, for example, two-roll mills, three-roll mills, ball mills, horizontal sand mills, vertical sand mills, annular type bead mills, or grinding mills.

[0230] The average dispersed particle size (secondary particle size) of the colorant in the dispersion is preferably 30 nm to 200 nm, more preferably 40 nm to 200 nm. If the particle size is appropriate, it is easy to obtain a photosensitive composition with high dispersion stability.

[0231] The method for determining the average dispersed particle size (secondary particle size) is, for example, using the Nikkiso microtrack UPA-EX150 employing dynamic light scattering (fast Fourier transform, FFT) power spectroscopy. The particle transmittance is set to absorption mode, the particle shape to non-spherical, and the D50 particle size to the average diameter. The dilution solvent used for measurement is the organic solvent used in the dispersion. It is preferable to obtain results with small deviations when measuring a sample that has been treated with ultrasound immediately after sample adjustment.

[0232] Regarding the photosensitive composition, it is preferable to remove coarse particles of 5 μm or larger, preferably coarse particles of 1 μm or larger, and even more preferably coarse particles of 0.5 μm or larger, as well as mixed dust, by means of centrifugation, sintering sieving process, or membrane filter filtration. The photosensitive composition of the present invention preferably does not contain particles of 0.5 μm or larger, and more preferably does not contain particles of 0.3 μm or smaller.

[0233] <Filter> The filter of the present invention includes a substrate and a filter segment formed from the photosensitive composition of the present invention. The filter can be used for various applications. In this specification, the filter is preferably a color filter. In the case of a color filter, the filter segment has a red filter segment, a green filter segment, and a blue filter segment by suitably selecting the type of colorant (E) to be used. Instead of the filter segment, or in addition to the filter segment, a magenta filter segment, a cyan filter segment, a yellow filter segment, a white filter segment, a gray filter segment, and a black filter segment may also be provided. In addition, a transparent filter segment may also be provided. The substrate may include a transparent substrate and a reflective substrate. The transparent substrate may include, for example, a glass substrate. The reflective substrate may include, for example, a substrate in which an aluminum electrode or a metal thin film is used as a reflective surface.

[0234] [Method for manufacturing a filter] The method for manufacturing a filter may, for example, be to perform the following steps: (1) forming a layer (film) of a composition by coating a photosensitive composition on a substrate; (2) exposing a dielectric mask on the layer to form a pattern; (3) forming a patterned hard film by alkaline development of the unexposed portion; and (4) performing a heat treatment (post-baking) on ​​the pattern.

[0235] The manufacturing method of the filter will be described in detail below. (Step (1)) Step (1) of forming the composition layer involves coating the photosensitive composition onto a substrate by methods such as spin coating, roll coating, slot coating, casting coating, or inkjet coating, and drying (pre-baking) at a temperature of 50°C to 120°C for 10 to 120 seconds, using an oven or heating plate as needed. Examples of substrates include glass substrates and silicon substrates. Silicon substrates may have imaging elements such as charge-coupled devices (CCDs) or complementary metal-oxide-semiconductors (CMOSs) formed on their surfaces. In addition, an undercoating may be provided on the substrate as needed to improve adhesion to the upper layer, prevent material diffusion, and planarize the substrate surface. The film thickness of the layer is preferably 0.05 μm to 10.0 μm, more preferably 0.3 μm to 5 μm.

[0236] (Step (2)) The exposure step uses an exposure apparatus such as a stepper to expose a specific pattern onto the layer obtained in step (1) using a dielectric mask. A hardened film is thus obtained. Examples of radiation used for exposure include gamma rays, h rays, i rays, and ultraviolet rays.

[0237] (Step (3)) The hardened film obtained in step (2) is subjected to alkaline development treatment, in which the unexposed portion of the composition layer dissolves into the alkaline aqueous solution, leaving only the hardened portion, thereby obtaining a patterned hardened film. Examples of developing solutions include: sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, diethylamine, dimethylethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, choline, pyrrole, guanidine, 1,8-diazabicyclo-[5.4.0]-7-undecene, and other alkaline compounds. The concentration of the developing solution is preferably 0.001% to 10% by mass, more preferably 0.01% to 1% by mass. The pH of the alkaline developing solution is preferably 11 to 13, more preferably 11.5 to 12.5. If used at a suitable pH, the roughness or peeling of the pattern is suppressed, and the residual film rate after development is improved.

[0238] Examples of developing methods include immersion, spraying, and puddle methods. The developing temperature is preferably 15°C to 40°C. Furthermore, after alkaline development, rinsing with pure water is preferred.

[0239] (Step (4)) The heat treatment (post-baking) is to fully harden the patterned hardened film obtained in step (3) by heating. The heating temperature for post-baking is preferably 100°C to 300°C, more preferably 150°C to 250°C. In addition, the heating time is preferably about 2 minutes to 1 hour, more preferably about 3 minutes to 30 minutes.

[0240] <Image Display Device> The image display device of the present invention includes the filter of the present invention. Examples of image display devices include liquid crystal displays and organic electroluminescence (EL) displays. The form used for the image display device is not particularly limited as long as it functions as an image display device. For example, the structure described in "Next Generation Liquid Crystal Display Technology" (by Tatsuo Uchida, published by the Industrial Research Institute, 1994) can be cited. The definition of an image display device or details of each image display device are described, for example, in "Electronic Display Devices" (by Akio Sasaki, published by the Industrial Research Institute, 1990) and "Display Devices" (by Junsho Ibuki, published by Industrial Publishing, 1989).

[0241] <Solid-State Imaging Element> The solid-state imaging element of the present invention includes the filter of the present invention. There are no particular limitations on the form of the solid-state imaging element, and for example, it may have the following structure: a plurality of photodiodes constituting a light-receiving area of ​​a solid-state imaging element (CCD image sensor, CMOS image sensor, etc.) and a transmission electrode including polysilicon on a substrate; a light-shielding film having openings only to the light-receiving portion of the photodiodes on the photodiodes and the transmission electrode; a device protective film including silicon nitride formed on the light-shielding film to cover the entire surface of the light-shielding film and the light-receiving portion of the photodiodes; and a filter on the device protective film. Furthermore, it may also have a structure in which a light-gathering component (e.g., a microlens, etc. hereinafter the same) is present on the device protective film and below the filter (on the side closest to the substrate), or a structure in which a light-gathering component is present on the filter, etc. Additionally, the filter may also have a structure in which a hardened film forming each colored primitive is embedded in a space divided, for example, by an isolation wall into a grid-like structure. In this case, the isolation wall is preferably of a low refractive index relative to each colored primitive. Imaging devices including the solid-state imaging element of the present invention can be used for various purposes, such as digital cameras, electronic devices with imaging capabilities (mobile phones, smartphones, etc.), vehicle cameras, surveillance cameras, etc. [Examples]

[0242] Hereinafter, the present invention will be described in more detail by way of examples. However, the present invention is not limited to these examples. In addition, "parts" means "parts by mass" and "%" means "% by mass". In addition, in the present invention, non-volatile components or non-volatile component concentration refers to the mass residue after standing in an oven at 280°C for 30 minutes.

[0243] Prior to the examples, the determination methods are described. The weight average molecular weight (Mw), number average molecular weight (Mn), acid value (mgKOH / g), and amine value (mgKOH / g) of the resin are as follows.

[0244] (Average molecular weight of resin) The number-average molecular weight (Mn) and weight-average molecular weight (Mw) of the resin were determined using gel permeation chromatography (GPC) equipped with a refractive index (RI) detector. An HLC-8220GPC (manufactured by Tosoh Corporation) was used as the apparatus, with two separation columns connected in series. Two “TSK-GEL SUPER HZM-N” columns were connected in the packing material of both columns. The determination was performed at an oven temperature of 40°C, using tetrahydrofuran (THF) solution as the eluent, and a flow rate of 0.35 ml / min. The sample was dissolved in a solvent containing 1% by mass of the eluent, and injected in 20 μL. The average molecular weight is a polystyrene equivalent.

[0245] (Acid value of the resin) 80 ml of acetone and 10 ml of water were added to 0.5 g to 1 g of the resin solution and stirred until uniformly dissolved. A 0.1 mol / L potassium hydroxide (KOH) aqueous solution was used as the titrant, and titration was performed using an automatic titration apparatus ("COM-555", manufactured by Hiranuma Sangyo Co., Ltd.) to determine the acid value (mgKOH / g). Furthermore, the acid value per unit of non-volatile component of the resin was calculated based on the acid value of the resin solution and the concentration of non-volatile components in the resin solution.

[0246] (Amine value of resin) The amine value of resin is obtained by converting the measured total amine value (mgKOH / g) into non-volatile components according to the method of American Society for Testing Material (ASTM) D 2074.

[0247] <Manufacturing of Colorant (E)> (Micronized Red Pigment (E-1)) 100 parts of CI Pigment Red 254, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was placed in warm water and stirred for 1 hour using a high-speed mixer while heating to approximately 80°C to form a slurry. The slurry was then filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized red pigment (E-1).

[0248] (Micronized Red Pigment (E-2)) 100 parts of CI Pigment Red 177, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 60°C for 6 hours. Next, the kneaded mixture was placed in warm water and stirred at a high speed for 1 hour while heating to approximately 80°C to form a slurry. The slurry was then filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized red pigment (E-2).

[0249] (Micronized Blue Pigment (E-3)) 100 parts of CI Pigment Blue 15:6, 1,000 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 50°C for 12 hours. The mixture was then added to 3,000 parts of warm water and stirred at approximately 70°C using a high-speed mixer for about 1 hour to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized blue pigment (E-3).

[0250] (Micronized Purple Pigment (E-4)) 100 parts of CI Pigment Violet 23, 1,200 parts of sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 80°C for 6 hours. Next, the mixture was added to 8,000 parts of warm water and stirred at 80°C using a high-speed mixer for 2 hours to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 85°C for 24 hours, it was pulverized to obtain micronized purple pigment (E-4).

[0251] (Micronized Green Pigment (E-5)) 100 parts of CI Pigment Green 58, 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 70°C for 6 hours. The mixture was then added to 3,000 parts of warm water and stirred at 70°C using a high-speed mixer for 1 hour to form a slurry. The slurry was then filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized green pigment (E-5).

[0252] (Micronized Green Pigment (E-6)) According to the example disclosed in Japanese Patent Application Publication No. 2017-111398, a green pigment (E-6) of the following chemical formula (17) was obtained. 100 parts of green pigment (E-6), 1,200 parts of sodium chloride, and 120 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 70°C for 6 hours. The mixture was then added to 3,000 parts of warm water and stirred at 70°C using a high-speed mixer for 1 hour to form a slurry. The slurry was filtered, washed with water to remove sodium chloride and diethylene glycol, dried at 80°C for 24 hours, and then pulverized to obtain micronized green pigment (E-6). Chemical formula (17) [Chemical 13]

[0253] (Micronized Yellow Pigment (E-7)) 100 parts of CI Pigment Yellow 150, 700 parts of sodium chloride, and 180 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 80°C for 6 hours. The mixture was then added to 2,000 parts of warm water and stirred at 80°C for 1 hour using a high-speed mixer to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized yellow pigment (E-7).

[0254] (Micronized Yellow Pigment (E-8)) 100 parts of CI Pigment Yellow 139 (Novoperm Yellow P-M3R manufactured by Clariant), 800 parts of pulverized sodium chloride, and 100 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Seisakusho) and kneaded at 70°C for 12 hours. The mixture was then added to 3000 parts of warm water and stirred at a high speed for about 1 hour while heating to about 70°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 80°C for 24 hours, it was pulverized to obtain micronized yellow pigment (E-8).

[0255] (Micronized Yellow Pigment (E-9)) 100 parts of CI Pigment Yellow 185 (Paliotol Yellow D1155 manufactured by BASF Corporation, Japan), 700 parts of pulverized sodium chloride, and 180 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 80°C for 6 hours. Next, the mixture was added to 8 liters of warm water and stirred at 80°C using a high-speed mixer for 2 hours to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After drying at 85°C for 24 hours, it was pulverized to obtain micronized yellow pigment (E-9).

[0256] (Micronized Yellow Pigment (E-10)) According to the example disclosed in Japanese Patent Application Publication No. 2012-226110, a yellow pigment (E-10) of the following chemical formula (18) was obtained. 100 parts of yellow pigment (E-10), 700 parts of pulverized sodium chloride, and 180 parts of diethylene glycol were placed in a 1-gallon stainless steel kneader (manufactured by Inoue Manufacturing Co., Ltd.) and kneaded at 80°C for 6 hours. Then, the mixture was added to 8 liters of warm water and stirred with a high-speed mixer for 2 hours while heating to 80°C to form a slurry. The slurry was repeatedly filtered and washed with water to remove sodium chloride and diethylene glycol. After that, it was dried at 85°C for 24 hours and pulverized to obtain micronized yellow pigment (E-10). Chemical formula (18) [Chemical 14]

[0257] The average primary particle size of the micronized pigment is in the range of 5 nm to 120 nm.

[0258] (Dye (E-11)) A salt-forming compound, namely dye (E-11), comprising C1 Acid Red 52 and resin 1 having cationic groups on its side chains, was manufactured in the following order. 67.3 parts of methyl ethyl ketone were charged into a four-necked separable flask including a thermometer, stirrer, distillation tube, and cooler, and the mixture was heated to 75°C under a nitrogen atmosphere. Meanwhile, 34.0 parts of methyl methacrylate, 28.0 parts of n-butyl methacrylate, 28.0 parts of 2-ethylhexyl methacrylate, 10.0 parts of dimethylaminoethyl methacrylate, 6.5 parts of 2,2'-azobis(2,4-dimethylpentanonitrile), and 25.1 parts of methyl ethyl ketone were homogenized and then charged into a dropping funnel, which was then placed in the four-necked separable flask. The dropping process was carried out over 2 hours. Two hours after the addition was completed, the polymerization yield was confirmed to be over 98% based on the non-volatile components, with a weight average molecular weight (Mw) of 6,830, and the mixture was cooled to 50°C. 3.2 parts of chloromethane and 22.0 parts of ethanol were added, and the mixture was reacted at 50°C for 2 hours, then heated to 80°C for 1 hour and reacted for another 2 hours. This yielded resin 1 with a resin composition of 47% by mass and cationic groups on the ammonium side chains. The ammonium salt value of the obtained resin was 34 mgKOH / g. Next, 30 parts of resin 1 with cationic groups on the side chains (based on non-volatile components) were added to 2,000 parts of water, and the mixture was thoroughly stirred and heated to 60°C. Meanwhile, an aqueous solution was prepared by dissolving 10 parts of CI Acid Red 52 in 90 parts of water, and this solution was added dropwise to the resin solution. After the addition, the mixture was stirred at 60°C for 120 minutes to allow the reaction to proceed fully. To confirm the endpoint of the reaction, the reaction solution was added dropwise to filter paper, and the endpoint was determined when the exudation stopped, indicating that a salt-forming compound had been obtained. After stirring and cooling to room temperature, the mixture was filtered by suction and washed with water. The remaining salt-forming compound on the filter paper was then dried using a dryer to remove moisture, yielding 32 parts of a salt-forming compound of CI Acid Red 52 and resin 1 with cationic groups on the side chains, i.e., dye (E-11). At this point, the content of the component derived from CI Acid Red 52 in dye (E-11) was 25% by mass.

[0259] <Preparation of Alkali-Soluble Resin (A)> (Alkali-Soluble Resin (A1-1) Solution) 262.0 parts of propylene glycol monomethyl ether acetate (PGMAc) were placed in a reaction vessel equipped with a thermometer, cooling pipe, nitrogen inlet pipe, and stirring device in a separable four-necked flask. While injecting nitrogen into the vessel, the mixture was heated to 120°C. At this temperature, for 2.5 hours, 49.7 parts of 2-ethylhexyl acrylate (2-EHA), 99.4 parts of glycidyl methacrylate (GMA), 6.6 parts of dicyclopentanyl methacrylate (DCPMA), 19.0 parts of peroxytert-butyl-2-ethylhexanoate as a polymerization initiator, and PGMAc were added dropwise through a dropper. After the addition was complete, the mixture was stirred at 120°C for 2 hours to obtain the precursor. Subsequently, the flask was purged with air, and 50.4 parts of acrylic acid (AA) as a modifying compound, 0.6 parts of triphenylphosphine as a catalyst, and 0.2 parts of methylhydroquinone were added. The mixture was reacted at 110°C for 10 hours. This yielded a monomer unit (GMA+AA) formed by reacting the epoxy group of GMA with the carboxyl group of AA, introducing a monomer unit (a2) containing a polymerizable unsaturated group. Then, 21.3 parts of tetrahydrophthalic anhydride (THPA) as a modifying compound were added, and the mixture was reacted at 110°C for 4 hours. This caused a portion of the hydroxyl group of GMA+AA to react with THPA. Subsequently, PGMAc was added at a non-volatile content of 20% by mass to prepare an alkali-soluble resin (A1-1). The alkali-soluble resin (A1-1) contains monomer units (a1) containing alicyclic hydrocarbons, monomer units (a2) containing polymerizable unsaturated groups, and monomer units (a3) ​​of homopolymer with a glass transition temperature below 0°C. The alkali-soluble resin (A1-1) has an acid value of 38 mgKOH / g and a weight-average molecular weight of 12,000.

[0260] (Alkali-soluble resin (A1-2) solution ~ Alkali-soluble resin (A1-6) solution) The types and amounts of the formulation were changed in a manner that made up of the composition ratios listed in Table 1. Alkali-soluble resin (A1-2) ~ Alkali-soluble resin (A1-6) were synthesized using the same method as for alkali-soluble resin (A1-1). PGMAc was added, and the non-volatile component was set to 20% by mass.

[0261] [Table 1] Table 1 (A1-1) (A1-2) (A1-3) (A1-4) (A1-5) (A1-6) Composition ratio (Moll%) Alicyclic hydrocarbons The single-unit (a1) Isoborneol methacrylate 1 Dicyclopentyl methacrylate 3 1 1 5 30 Monomer unit containing polymerizable unsaturated groups (a2) GMA+AA 56 53 53 53 twenty one MAA+GMA 60 GMA+AA+THPA 14 17 39 GMA+AA+SAH 17 17 The homopolymer has monomer units with a glass transition temperature below 0°C (a3). 2-Ethylhexyl acrylate 27 29 29 2-Methoxyethyl Acrylate 29 Other single-unit cells (a4) benzyl methacrylate 10 styrene 10 methacrylic acid 25 acid value 38 45 44 45 110 79 Weight-average molecular weight (Mw) 12000 15000 15600 15100 16700 9000

[0262] In Table 1, MAA+GMA represents a monomer unit (a2) containing a polymerizable unsaturated group obtained by adding an epoxy group to the carboxyl group of GMA (hereinafter MAA (methacrylic acid)) in the precursor. GMA+AA+SAH represents a monomer unit (a2) containing a polymerizable unsaturated group obtained by reacting a portion of the hydroxyl group of GMA+AA with succinic anhydride (hereinafter SAH (succinic anhydride)).

[0263] (Alkali-soluble resin (A2-1) solution) 196 parts of cyclohexanone were added to a reaction vessel equipped with a thermometer, cooling pipe, nitrogen inlet pipe, dropper, and stirrer in a separable four-necked flask. The temperature was raised to 80°C, and the reaction vessel was purged with nitrogen. Over a period of 2 hours, a mixture of 25.1 parts of benzyl methacrylate, 23.0 parts of n-butyl methacrylate, 14.3 parts of 2-hydroxyethyl methacrylate, 13.4 parts of methacrylic acid, 24.1 parts of p-cumylphenol ethylene oxide modified acrylate (Aronix M110 manufactured by Toa Synthetic Co., Ltd.), and 1.1 parts of 2,2'-azobisisobutyronitrile was added dropwise through the dropper. After the addition was completed, the reaction was continued for another 3 hours to obtain an acrylic resin solution. After cooling to room temperature, approximately two portions of the resin solution were taken and dried at 180°C for 20 minutes. The non-volatile components were then measured. PGMAc was added to the previously synthesized resin solution at a non-volatile component concentration of 20% by mass to prepare an alkali-soluble resin solution (A2-1). The acid value was 87 mgKOH / g, and the weight-average molecular weight was 25,000.

[0264] (Alkali-soluble resin (A2-2) solution and alkali-soluble resin (A2-3) solution) Alkali-soluble resin (A2-2) and alkali-soluble resin (A2-3) were synthesized by changing the type and amount of the formulation in a manner that is in the composition ratio described in Table 2, adding PGMAc, and setting the non-volatile component to 20 by mass.

[0265] [Table 2] Table 2 (A2-1) (A2-2) (A2-3) Composition ratio (Moll%) Monomer unit containing alicyclic hydrocarbons (a1) Isoborneol methacrylate Dicyclopentyl methacrylate 10 Monomer unit containing polymerizable unsaturated groups (a2) GMA+AA twenty one MAA+GMA GMA+AA+THPA 39 GMA+AA+SAH Other single-unit cells (a4) benzyl methacrylate twenty two 65 10 styrene 30 methacrylic acid twenty four 25 n-Butyl methacrylate 25 2-Hydroxyethyl methacrylate 17 p-Cyclophenol Ethylene Oxide Modified Acrylate 12 acid value 87 95 76 Weight-average molecular weight (Mw) 25000 13000 11000

[0266] <Preparation of Polymerizable Compound (B)> (Polymerizable Compound (B2-2) with Acid Groups) 400 parts of dipentaerythritol pentaacrylate, 100 parts of PGMAc, and 0.5 parts of N,N-dimethylbenzylamine were added to a five-necked flask including a stirrer, reflux condenser, nitrogen inlet tube, thermometer, and dropper. The temperature was raised to 70°C, and a mixture of 66 parts of toluene diisocyanate and 66 parts of PGMAc was added dropwise over 2 hours via the dropper. After the addition, the reaction was carried out at 50°C–70°C for 8 hours, and the disappearance of the isocyanate absorption at 2180 cm⁻¹ was confirmed by infrared spectroscopy (IR). Subsequently, 35 parts of mercaptoacetic acid and 0.6 parts of 4-methoxyphenol were added, and the reaction was carried out at 50°C–60°C for 6 hours. The non-volatile component was adjusted to 50% by mass to obtain a polymeric compound with acid groups (B2-2).

[0267] <Preparation of Dispersion Resin (G)> (Dispersion Resin (G-1) Solution) In a reaction vessel including a gas inlet tube, thermometer, condenser, and stirrer, 10 parts of methacrylic acid, 100 parts of methyl methacrylate, 70 parts of isobutyl methacrylate, 20 parts of benzyl methacrylate, and 50 parts of PGMAc were added, and the mixture was purged with nitrogen. The reaction vessel was heated and stirred to 50°C, and 12 parts of 3-mercapto-1,2-propanediol were added. The temperature was raised to 90°C, and a solution prepared by adding 0.1 parts of 2,2'-azobisisobutyronitrile to 90 parts of PGMAc was added while reacting for 7 hours. The reaction was confirmed to have reached 95% by measuring the non-volatile components. 19 parts of pyromellitic anhydride, 50 parts of PGMAc, 50 parts of cyclohexanone, and 0.4 parts of 1,8-diazabicyclo-[5.4.0]-7-undecene as a catalyst were added, and the mixture was reacted at 100°C for 7 hours. The reaction was terminated after confirming that more than 98% of the anhydride had undergone half-esterification by acid value determination. PGMAc was added to dilute the solution to a non-volatile content of 30%, resulting in a dispersant (G-1) solution with an acid value of 70 mgKOH / g and a weight average molecular weight of 8,500.

[0268] (Dispersion resin (G-2) solution) 108 parts of 1-thiopropanetriol, 174 parts of pyromellitic anhydride, 650 parts of PGMAc, and 0.2 parts of monobutyltin oxide as a catalyst were charged into a reaction vessel including a gas inlet tube, thermometer, condenser, and stirrer. After purging with nitrogen, the reaction was carried out at 120°C for 5 hours (first step). By measuring the acid value, it was confirmed that more than 95% of the anhydride had undergone half-esterification. Next, the following compounds were added to the reaction vessel (based on a non-volatile content conversion of 160 parts): 200 parts of the compound obtained in the first step, 200 parts of 2-hydroxypropyl methacrylate, 200 parts of ethyl acrylate, 150 parts of tert-butyl acrylate, 200 parts of 2-methoxyethyl acrylate, 200 parts of methyl acrylate, 50 parts of methacrylic acid, and 663 parts of PGMAc. The reaction vessel was heated to 80°C, and 1.2 parts of 2,2'-azobis(2,4-dimethylpentanonitrile) were added. The reaction was carried out for 12 hours (second step). Non-volatile content determination confirmed that 95% of the reaction had occurred. Finally, 500 parts of a PGMAc dilution solution containing 50% non-volatile components of the compound obtained in step two, 27.0 parts of 2-methacryloyloxyethyl isocyanate (MOI), and 0.1 parts of hydroquinone were added, and the reaction was carried out until the peak at 2270 cm⁻¹ based on the isocyanate group disappeared, as confirmed by IR spectroscopy (step three). After confirming the disappearance of the peak, the reaction solution was cooled, and the non-volatile components were adjusted using PGMAc to obtain a dispersion resin (G-2) solution with 30% non-volatile components. The obtained dispersion resin (G-2) had an acid value of 68 mgKOH / g, an unsaturated double bond equivalent of 1,593, and a weight-average molecular weight of 13,000.

[0269] (Dispersion Resin (G-3) Solution) 30 parts of methyl methacrylate, 30 parts of n-butyl methacrylate, 20 parts of hydroxyethyl methacrylate, and 13.2 parts of tetramethylethylenediamine were added to a reaction apparatus equipped with a gas inlet pipe, condenser, stirring blades, and thermometer. The system was stirred at 50°C for 1 hour while nitrogen was flowing through it to purge the system with nitrogen. Next, 9.3 parts of ethyl bromoisobutyrate, 5.6 parts of cuprous chloride, and 133 parts of PGMAc were added. The mixture was heated to 110°C under a nitrogen flow to initiate the polymerization of the first block (B-block). After 4 hours of polymerization, a sample of the polymerization solution was taken for non-volatile component determination. Based on the non-volatile component conversion, the polymerization conversion rate was confirmed to be above 98%. Next, 61 parts of PGMAc and 20 parts of 1,2,2,6,6-pentamethylpiperidine methacrylate (manufactured by Hitachi Chemical Co., Ltd., not Fantryl FA-711MM) as the second block (A block) monomer were added to the reaction apparatus. The reaction was continued by stirring at 110°C under a nitrogen atmosphere. Two hours after the addition of 1,2,2,6,6-pentamethylpiperidine methacrylate, a sample of the polymerization solution was taken for non-volatile component determination. Based on the non-volatile component, the polymerization conversion rate to the second block (A block) was confirmed to be above 98%, and the reaction solution was cooled to room temperature to stop the polymerization. Then, PGMAc was added to dilute the non-volatile component to 30%, thereby obtaining a dispersion resin (G-3) solution with an amine value of 57 mgKOH / g per unit of non-volatile component and a number average molecular weight of 4,500 (Mn).

[0270] (Dispersion Resin (G-4) Solution) In a 500 mL round-bottom four-necked separable flask including a cooling tube, a funnel for adding, a nitrogen inlet, a stirrer, and a digital thermometer, 250 parts by weight of tetrahydrofuran (THF) and 5.81 parts by weight of dimethyl ketene methyltrimethylsilyl acetal as an initiator were added via the funnel, followed by thorough nitrogen purging. 0.5 parts by weight of a 1 mole / L acetonitrile solution of tetrabutylammonium m-chlorobenzoate as a catalyst was injected using a syringe. Using the funnel, 19.7 parts by weight of 2-hydroxyethyl methacrylate, 7.5 parts by weight of 2-ethylhexyl methacrylate, 12.9 parts by weight of n-butyl methacrylate, 10.7 parts by weight of benzyl methacrylate, and 30.9 parts by weight of methyl methacrylate were added dropwise over 60 minutes as solvent-friendly block monomers. The reaction flask was cooled using an ice bath to maintain the temperature below 40°C. One hour later, 18.3 parts by mass of dimethylaminopropyl methacrylamide, a block monomer with color material adsorption function, was added dropwise over a period of 20 minutes. After another hour of reaction, 1 part by mass of methanol was added to stop the reaction. The obtained block copolymer THF solution was redeprecipitated in hexane and purified by filtration and vacuum drying. Subsequently, 15.0 parts by mass of the obtained block copolymer was dissolved in 35 parts by mass of PGMAc in a 100 mL round-bottom flask, and 1.1 parts by mass of phenylphosphonic acid (0.5 molar equivalents relative to dimethylaminopropyl methacrylamide), a salt-forming component, was added. The mixture was stirred at 30°C for 20 hours, and PGMAc was added to adjust the concentration to obtain a dispersion resin (G-4) solution with 30% non-volatile components.

[0271] <Preparation of Dispersion> (Dispersion 1) Dispersion 1 was prepared by dispersing 0.5 mm diameter zirconia beads in an Eiger mill (M-250 MKII mini model manufactured by Eiger Japan) for 3 hours, followed by filtration using a 1.0 μm sieve. The following composition was obtained: Organic solvent (P-1) was PGMAc. Micronized blue pigment (E-3): 9.05 parts by mass Micronized purple pigment (E-4): 0.31 parts by mass Dye (E-11): 4.16 parts by mass Pigment derivative (F-1): 1.04 parts by mass Dispersion resin (G-1) solution: 3.47 parts by mass Alkali-soluble resin (A2-1) solution: 10.0 parts by mass Organic solvent (P-1): 71.97 parts by mass

[0272] Pigment derivative (F-1): The following structure [Chem.15]pc represents the phthalocyanine skeleton.

[0273] Except for changing the raw materials and quantities recorded in Table 3, dispersions 2 to 9 are prepared in the same manner as dispersion 1.

[0274] [Table 3] Table 3 Dispersion 1 Dispersion 2 Dispersion 3 Dispersion 4 Dispersion 5 Dispersion 6 Dispersion 7 Dispersion 8 Dispersion 9 Colorant (E) (E-1) 14.00 (E-2) 14.00 (E-3) 9.05 (E-4) 0.31 (E-5) 10.00 (E-6) 10.00 (E-7) 10.00 (E-8) 10.00 (E-9) 10.00 (E-10) 10.00 (E-11) 4.16 Pigment derivatives (F) (F-1) 1.04 (F-2) 4.00 4.00 4.00 (F-3) 2.00 Dispersion resin (G) solution (G-1) 3.47 7.00 10.00 10.00 10.00 10.00 10.00 (G-2) 10.00 10.00 7.00 10.00 10.00 (G-3) 7.00 7.00 (G-4) 10.00 10.00 10.00 Alkali soluble Resin (A) solution (A2-1) 10.00 10.00 10.00 10.00 10.00 10.00 10.00 Organic solvents (P) (P-1) 71.97 63.00 63.00 66.00 56.00 56.00 56.00 64.00 66.00

[0275] Pigment derivatives (F-2) in Table 3: The following structures [Chemical 16]

[0276] Pigment derivatives (F-3) in Table 3: The following structures [Chemical 17]

[0277] <Preparation of Photosensitive Composition> [Example 1] (Photosensitive Composition 1) The following raw materials were mixed and stirred, and filtered using a sieve with a pore size of 1.0 μm to obtain photosensitive coloring composition 1. Dispersion 1: 28.85 parts by mass Alkali-soluble resin (A1-2) solution: 9.0 parts by mass Polymerizing compound (B1-1): 5.0 parts by mass Polymerizing compound (B2-1): 1.2 parts by mass Compound represented by general formula (1) (C1-1): 0.70 parts by mass Oxime photopolymerization initiator (C2b-1): 0.50 parts by mass Sensitizer (D1-1): 0.30 parts by mass Thermosetting compound (H1-1): 0.30 parts by mass Polymerization inhibitor (J): 0.01 parts by mass Leveling agent (M): 1.00 parts by mass Organic solvent (P): 53.14 parts by mass

[0278] [Examples 2 to 35, Comparative Examples 1 to 3] (Photosensitive Composition 2 to 38) Except that the photosensitive composition 1 of Example 1 was changed to the raw materials and amounts described in Tables 4-1 to 4-4, photosensitive compositions 2 to 38 were prepared in the same manner as in Example 1.

[0279] [Table 4-1] Table 4-1 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 photosensitivity Composition 1 photosensitivity Composition 2 photosensitivity Composition 3 Photosensitivity Composition 4 photosensitivity Composition 5 photosensitivity Composition 6 Photosensitivity Composition 7 Photosensitivity Composition 8 Photosensitivity Composition 9 Photosensitivity Composition 10 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 2 3 4 5 6 7 8 9 Alkali soluble Resin (A) solution (A1) (A1-1) (A1-2) 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 (A1-3) (A1-4) (A1-5) (A1-6) (A2) (A2-2) (A2-3) Polymer compounds (B) (B1) (B1-1) 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 (B1-2) (B2) (B2-1) 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 (B2-2) (B3) (B3-1) Photopolymerization initiator (C) (C1) (C1-1) 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.30 (C1-2) 0.70 (C1-3) 0.70 (C2) (C2a-1) 0.50 (C2a-2) 0.50 (C2a-3) 0.50 (C2a-4) 0.50 (C2a-5) 0.50 (C2b-1) 0.50 0.50 0.50 0.90 (C2b-2) 0.50 (C3) (C3-1) (C3-2) Senser (D) (D1) (D1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.12 (D2) (D2-1) Thermosetting compounds (H) (H1) (H1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Polymerization inhibitors (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (P) 53.14 53.14 53.14 53.14 53.14 53.14 53.14 53.14 53.14 53.32

[0280] [Table 4-2] Table 4-2 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Photosensitive group Compound 11 Photosensitivity Composition 12 Photosensitivity Composition 13 Photosensitivity Composition 14 Photosensitivity Composition 15 Photosensitivity Composition 16 Photosensitivity Composition 17 Photosensitivity Composition 18 Photosensitivity Composition 19 Photosensitivity Composition 20 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 2 3 4 5 6 7 8 9 Alkali soluble Resin (A) solution (A1) (A1-1) 9.00 (A1-2) 9.00 9.00 9.00 9.00 9.00 9.00 (A1-3) 9.00 (A1-4) 9.00 (A1-5) 9.00 (A1-6) (A2) (A2-2) (A2-3) Polymer compounds (B) (B1) (B1-1) 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 (B1-2) (B2) (B2-1) 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 (B2-2) (B3) (B3-1) Photopolymerization initiator (C) (C1) (C1-1) 0.50 0.90 0.56 0.84 0.50 0.50 0.70 0.70 0.70 0.70 (C1-2) (C1-3) (C2) (C2a-1) (C2a-2) (C2a-3) (C2a-4) (C2a-5) (C2b-1) 0.70 0.30 0.40 0.60 0.50 0.50 0.50 0.50 0.50 0.50 (C2b-2) (C3) (C3-1) 0.20 (C3-2) 0.20 Senser (D) (D1) (D1-1) 0.20 0.40 0.25 0.35 0.30 0.30 0.30 0.30 0.30 0.30 (D2) (D2-1) Thermosetting compounds (H) (H1) (H1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Polymerization inhibitors (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (P) 53.24 53.04 53.43 52.85 53.14 53.14 53.14 53.14 53.14 53.14

[0281] [Table 4-3] Table 4-3 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30 Photosensitivity Composition 21 Photosensitivity Composition 22 Photosensitivity Composition 23 Photosensitivity Composition 24 Photosensitivity Composition 25 Photosensitivity Composition 26 Photosensitivity Composition 27 Photosensitivity Composition 28 Photosensitivity Composition 29 Photosensitivity Composition 30 dispersion 1 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 28.85 2 30.00 3 4 5 2.00 6 2.00 7 2.25 8 9 Alkali soluble Resin (A) solution (A1) (A1-1) (A1-2) 9.00 9.00 9.00 9.00 9.00 9.00 9.00 (A1-3) (A1-4) (A1-5) (A1-6) 9.00 (A2) (A2-2) 9.00 (A2-3) 9.00 Polymer compounds (B) (B1) (B1-1) 5.00 5.00 5.00 5.00 5.00 6.20 5.00 (B1-2) 5.00 (B2) (B2-1) 1.20 1.20 1.20 1.20 1.20 1.00 6.20 1.20 (B2-2) 0.40 (B3) (B3-1) 6.20 Photopolymerization initiator (C) (C1) (C1-1) 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.70 0.70 (C1-2) (C1-3) (C2) (C2a-1) (C2a-2) (C2a-3) (C2a-4) (C2a-5) (C2b-1) 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 (C2b-2) (C3) (C3-1) (C3-2) Senser (D) (D1) (D1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 (D2) (D2-1) 0.30 Thermosetting compounds (H) (H1) (H1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Polymerization inhibitors (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (P) 53.14 53.14 53.14 53.14 53.44 52.94 53.14 53.14 53.14 45.74

[0282] [Table 4-4] Table 4-4 Example 31 Example 32 Example 33 Example 34 Example 35 Comparative Example 1 Comparative Example 2 Comparative Example 3 Photosensitivity Composition 31 Photosensitivity Composition 32 Photosensitivity Composition 33 Photosensitivity Composition 34 Photosensitivity Composition 35 Photosensitivity Composition 36 Photosensitivity Composition 37 Photosensitivity Composition 38 dispersion 1 28.85 28.85 28.85 28.85 28.85 2 3 30.00 4 0.30 5 6 7 6.25 8 17.00 9 15.00 Alkali soluble Resin (A) solution (A1) (A1-1) (A1-2) 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 (A1-3) (A1-4) (A1-5) (A1-6) (A2) (A2-2) 2.89 (A2-3) Polymer compounds (B) (B1) (B1-1) 5.00 5.00 5.00 5.00 5.00 5.00 5.00 5.00 (B1-2) (B2) (B2-1) 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 (B2-2) (B3) (B3-1) Photopolymerization initiator (C) (C1) (C1-1) 0.70 0.70 0.70 0.70 0.70 1.20 (C1-2) (C1-3) (C2) (C2a-1) (C2a-2) (C2a-3) (C2a-4) 0.10 (C2a-5) (C2b-1) 0.50 0.50 0.50 0.40 0.50 0.50 (C2b-2) (C3) (C3-1) 0.70 1.20 (C3-2) Senser (D) (D1) (D1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 (D2) (D2-1) Thermosetting compounds (H) (H1) (H1-1) 0.30 0.30 0.30 0.30 0.30 0.30 0.30 Polymerization inhibitors (J) 0.01 0.01 0.01 0.01 0.01 0.01 0.01 0.01 Leveling agent (M) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Organic solvents (P) 45.74 49.69 79.10 53.14 53.44 53.14 53.14 53.14

[0283] The raw materials listed in Tables 4-1 to 4-4 are described below.

[0284] [Polymerizable Compound (B)] (Polymerizable Compound (B1) modified with lactone) B1-1: Kayarad DPCA-30 (manufactured by Nippon Kayaku Co., Ltd.) B1-2: Kayarad DPCA-20 (manufactured by Nippon Kayaku Co., Ltd.)

[0285] (Polymerizable compound with acid groups (B2)) B2-1: Aronix M-520 (manufactured by Toa Synthetic Co., Ltd.)

[0286] (Other polymeric compounds (B3)) B3-1: KAYARAD DPHA (manufactured by Nippon Kayaku Co., Ltd., a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate)

[0287] [Photopolymerization initiator (C)] (Compound (C1) represented by general formula (1)) C1-1: Compound of chemical formula (2) C1-2: Compound of chemical formula (3) C1-3: Compound of chemical formula (4)

[0288] (Oxime-based photopolymerization initiator (C2)) C2a-1: TRONLY TR-PBG-3057 (manufactured by Changzhou TRONLY New Materials Co., Ltd., a compound containing one oxime group in one molecule) C2a-2: Compound of the chemical formula (5) C2a-3: Compound of the chemical formula (6) C2a-4: Compound of the chemical formula (7) C2a-5: Compound of the chemical formula (8) C2b-1: Compound of the chemical formula (10) C2b-2: Compound of the chemical formula (13)

[0289] (Other photopolymerization initiators (C3)) C3-1: Omnirad 907 (manufactured by IGM Resins, acetophenone-based compound) C3-2: Omnirad 369 (manufactured by IGM Resins, acetophenone-based compound)

[0290] [Senser (D)] (Thioxanthone compound (D1)) D1-1: 2,4-Diethylthioxanthone (Benzophenone compound (D2)) D2-1: 4,4'-Bis(diethylamino)benzophenone

[0291] [Thermosetting compound (H)] (Epoxy compound (H1)) H1-1: EHPE-3150 (manufactured by Daicel)

[0292] [Polymerization Inhibitor (J)] J-1: 4-methylcatechol J-2: methylhydroquinone J-3: tert-butylhydroquinone The above are mixed in the same amount as (J-1) to (J-3) to obtain the polymerization inhibitor (J).

[0293] [Leveling Agent (M)] M-1: BYK-330 (manufactured by BYK-Chemie) M-2: Megafac F-551 (manufactured by DIC) Mix 1 part of each of (M-1) and (M-2) and dissolve them in 98 parts of PGMac to obtain a mixed solution as leveling agent (M).

[0294] [Organic solvent (P)] P-1: 30 parts of propylene glycol monomethyl ether acetate P-2: 30 parts of cyclohexanone P-3: 10 parts of ethyl 3-ethoxypropionate P-4: 10 parts of propylene glycol monomethyl ether P-5: 10 parts of cyclohexanol acetate P-6: 10 parts of dipropylene glycol methyl ether acetate, and (P-1) to (P-6) are mixed in the above-mentioned mass parts to form an organic solvent (P).

[0295] <Evaluation of Photosensitive Compositions> The obtained photosensitive compositions 1 to 38 (Examples 1 to 35, Comparative Examples 1 to 3) were evaluated for water stains, pattern shape (adhesion, cross-sectional shape), and heat resistance using the following methods. The evaluation results are shown in Table 5.

[0296] [Water Stain Evaluation] The obtained photosensitive composition was spin-coated onto a 100 mm × 100 mm, 0.7 mm thick glass substrate (Corning Eagle 2000) and dried at 70°C for 1 minute using a heated plate. Then, using a mask with a 100 μm wide stripe pattern, it was exposed to ultraviolet light under a high-pressure mercury lamp at an illuminance of 30 mW / cm² and 50 mJ / cm². Subsequently, it was developed by immersion in an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C for 40 seconds, followed by rinsing with pure water. The obtained pattern was observed using a Nikon ECLIPSE LV100POL model optical microscope to evaluate the degree of discoloration. The evaluation criteria are as follows, with a score of 3 or higher considered usable. 5: No water stains. 4: Water stains less than 10% of the overall area. 3: Water stains between 10% and 20% of the overall area. 2: Water stains between 20% and 30% of the overall area. 1: Water stains greater than 30% of the overall area.

[0297] [Pattern Shape Evaluation (1): Adhesion] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) with a length of 100 mm × width of 100 mm and a thickness of 0.7 mm using spin coating, and dried at 70°C for 1 minute using a heating plate. Subsequently, after cooling the substrate to room temperature, it was exposed to a high-pressure mercury lamp with a stripe pattern of 5 μm width units in the range of 5 μm to 25 μm using a photomask at an illuminance of 30 mW / cm2 and 50 mJ / cm2. Afterward, the substrate was spray-developed at 23°C using an aqueous developer containing 0.12% by mass of nonionic surfactant and 0.04% by mass of potassium hydroxide, washed with deionized water, air-dried, and heated at 230°C for 30 minutes in a clean oven. Spray development is performed on films formed from various photosensitive compositions to form patterns in the shortest possible time without development residue. Patterns with widths of 5 μm, 10 μm, 15 μm, 20 μm, and 25 μm on the obtained substrates were observed using an optical microscope to confirm the minimum linewidth of the remaining pattern. The evaluation criteria are as follows, with 3 or higher considered practical. 5: Residual lines less than 10 μm remain. 4: Residual lines greater than 15 μm remain. 3: Residual lines greater than 20 μm remain. 2: Residual lines greater than 25 μm remain. 1: No residual lines remain.

[0298] [Pattern Shape Evaluation (2): Cross-sectional Shape] The obtained photosensitive composition was applied to a glass substrate (Corning Eagle 2000) with a length of 100 mm × width of 100 mm and a thickness of 0.7 mm using spin coating, and dried at 70°C for 1 minute using a heated plate. Subsequently, after cooling the substrate to room temperature, it was exposed to a photomask with a 100 μm wide stripe pattern using a high-pressure mercury lamp at an illuminance of 30 mW / cm2 and 50 mJ / cm2. Afterward, the substrate was spray-developed at 23°C using an aqueous developer containing 0.12% by mass of nonionic surfactant and 0.04% by mass of potassium hydroxide, washed with deionized water, air-dried, and heated in a clean oven at 230°C for 30 minutes. Spray development was performed in the shortest time possible to form a pattern without development residue on the film formed by each photosensitive composition. The cross-sectional shape of the pattern was confirmed using a scanning electron microscope (S-3000H, manufactured by Hitachi High-Tech Co., Ltd.). Evaluation was conducted by acquiring a 100 μm wide SEM image of the cross-section of the striped pattern and measuring the cone angle between the substrate and the end of the pattern cross-section. The evaluation criteria are as follows, with 3 or higher considered usable: 5: Cone angle 30 degrees or more but less than 50 degrees; 4: Cone angle 50 degrees or more but less than 60 degrees; 3: Cone angle less than 30 degrees or 60 degrees or more but less than 70 degrees; 2: Cone angle 70 degrees or more but less than 90 degrees; 1: Cone angle 90 degrees or more.

[0299] [Heat Resistance Evaluation] The obtained photosensitive composition was spin-coated onto a glass substrate (Corning Eagle 2000) measuring 100 mm x 100 mm and 0.7 mm thick, with a dried film thickness of 2.0 μm, and dried at 70°C using a heated plate for 1 minute. After cooling the substrate to room temperature, it was exposed to a high-pressure mercury lamp at an illuminance of 30 mW / cm² and 50 mJ / cm². Subsequently, it was developed by immersion in an aqueous developer containing 0.12% nonionic surfactant and 0.04% potassium hydroxide at 23°C for 40 seconds, followed by rinsing with deionized water, air drying, and heating in a clean oven at 230°C for 30 minutes. The colorimetric properties ([L*(1), a*(1), b*(1)]) of the obtained coating under a C light source were measured using a microspectrophotometer (OSP-SP100 manufactured by Olympus Optics). Subsequently, as an evaluation of heat resistance, the colorimetric properties ([L*(2), a*(2), b*(2)]) under a C light source were measured after heating at 230°C for 1 hour, and the color difference ΔEab* was calculated using the following formula. The evaluation criteria are as follows, with values ​​of 3 or higher considered practical. ΔEab* = ((L*(2) - L*(1))² + (a*(2) - a*(1))² + (b*(2) - b*(1))²)¹ / ² 5: ΔEab* is less than 1 4: ΔEab* is 1 to 2 3: ΔEab* is 2 to 3 2: ΔEab* is 3 to 5 1: ΔEab* is 5 or more

[0300] [Table 5] Table 5 Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Example 9 Example 10 Water stain assessment 5 4 4 3 3 3 3 3 4 5 Pattern shape evaluation (1): Fit 5 4 4 3 3 4 3 4 5 5 Pattern shape evaluation (2): Cross-sectional shape 5 4 4 3 4 4 4 3 5 4 Heat resistance evaluation 5 4 4 3 4 3 4 4 5 5 Example 11 Example 12 Example 13 Example 14 Example 15 Example 16 Example 17 Example 18 Example 19 Example 20 Water stain assessment 5 4 5 5 5 5 5 5 5 5 Pattern shape evaluation (1): Fit 5 5 5 5 5 5 5 5 5 5 Pattern shape evaluation (2): Cross-sectional shape 5 5 5 5 5 5 5 5 5 3 Heat resistance evaluation 5 5 5 5 5 5 5 5 5 5 Example 21 Example 22 Example 23 Example 24 Example 25 Example 26 Example 27 Example 28 Example 29 Example 30 Water stain assessment 5 5 5 5 5 5 4 5 4 5 Pattern shape evaluation (1): Fit 5 3 3 5 5 5 5 5 5 5 Pattern shape evaluation (2): Cross-sectional shape 3 3 4 4 3 5 5 4 4 5 Heat resistance evaluation 5 5 4 5 5 5 5 5 5 5 Example 31 Example 32 Example 33 Example 34 Example 35 Comparative Example 1 Comparative Example 2 Comparative Example 3 Water stain assessment 5 5 5 5 5 2 2 1 Pattern shape evaluation (1): Fit 5 5 5 5 5 2 3 2 Pattern shape evaluation (2): Cross-sectional shape 5 5 5 5 5 5 2 2 Heat resistance evaluation 5 5 5 5 4 3 2 1

Claims

1. A photosensitive composition comprising an alkali-soluble resin (A), a polymerizable compound (B), and a photopolymerization initiator (C), wherein the alkali-soluble resin (A) comprises an alkali-soluble resin (A1), the alkali-soluble resin (A1) contains a monomer unit (a1) containing an alicyclic hydrocarbon and a monomer unit (a2) containing a polymerizable unsaturated group, wherein the content of the alicyclic hydrocarbon monomer unit (a1) in all the constituent units of the alkali-soluble resin (A1) is 1 mol% to 60 mol%, the photopolymerization initiator (C) comprises a compound (C1) represented by the following general formula (1) and an oxime photopolymerization initiator (C2), general formula (1) [Chemical 1] (in general formula (1), R1 and R2 independently represent hydrogen atoms or alkyl groups having 1 to 8 carbon atoms; R3 represents hydrogen atoms or monovalent substituents), and the polymerizable compound (B) comprises a lactone-modified polymerizable compound (B1).

2. The photosensitizing composition as claimed in claim 1, wherein, The oxime-based photopolymerization initiator (C2) comprises a compound (C2b) containing two oxime groups in one molecule.

3. The photosensitizing composition as claimed in claim 2, wherein, The compound containing two oxime groups in one molecule (C2b) is a compound represented by the following general formula (9), general formula (9) [Chem. 7] (in general formula (9), X1 and X2 independently represent carbonyl bonds (-CO-) or single bonds, X3 represents single bonds or sulfur atoms; R1 represents an alkyl group with 1 to 20 carbon atoms, R2 and R3 independently represent hydrogen atoms, alkyl groups with 1 to 20 carbon atoms, heterocyclic groups with 2 to 30 carbon atoms, aryl groups with 6 to 30 carbon atoms, or arylalkyl groups with 7 to 30 carbon atoms, and R4 and R5 independently represent alkyl groups with 1 to 20 carbon atoms, heterocyclic groups with 2 to 30 carbon atoms, aryl groups with 6 to 30 carbon atoms, or arylalkyl groups with 7 to 30 carbon atoms).

4. The photosensitizing composition as claimed in claim 1, wherein, The alkali-soluble resin (A1) is a resin containing monomer units (a3) ​​of homopolymer with a glass transition temperature below 0°C.

5. The photosensitizing composition as claimed in claim 1, further comprising a sensitizer (D).

6. The photosensitive composition as claimed in claim 1 further comprises a thermosetting compound (H).

7. A filter comprising: a substrate; and a filter segment formed of a photosensitive composition as described in any one of claims 1 to 6.

8. An image display device having a filter as described in claim 7.

9. A solid-state photographic element having a filter as described in claim 8.

Images