Multi-sided antenna module employing antennas on multiple sides of a package substrate for enhanced antenna coverage, and related fabrication methods

Abstract

A multi-sided antenna module employing antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage, and a related method for manufacturing the antenna module. The multi-sided antenna module includes integrated circuit (IC) chips disposed on a first side of the packaged substrate. The multi-sided antenna module further includes a first substrate antenna layer and a second substrate antenna layer respectively disposed on the first and second sides of the packaged substrate. The first substrate antenna layer includes first antennas disposed on the first side of the packaged substrate adjacent to the IC chips. The second substrate antenna layer includes second antennas disposed on a second side of the packaged substrate opposite to the first side of the packaged substrate. In this manner, the multi-sided antenna module (including antennas on multiple sides of the packaged substrate) provides antenna coverage extending from both sides of the packaged substrate to provide coverage in multiple directions.

Description

[Technical Field]

[0001] The field of this case relates to antenna modules (also known as "antenna in package" (AiP)) that integrate antennas with integrated circuit (IC) packages to integrate radio frequency (RF) chips with antennas. [Previous Technology]

[0002] Modern smartphones and other portable devices have expanded the use of different wireless links using various technologies across different RF bands. For example, fifth-generation (5G) cellular networks (often referred to as 5G New Radio (NR)) encompass frequencies in the 24.25 to 86 GHz range, with the lower frequency of 19.25 GHz (24.25-43.5 GHz) more likely to be used by mobile devices. This spectrum for 5G communications falls within the millimeter wave (mmWave) or millimeter band range. Millimeter waves offer higher data rates compared to lower frequencies, such as those used for Wi-Fi and current cellular networks.

[0003] Radio frequency (RF) transceivers supporting millimeter-wave spectrum are integrated into mobile devices and other portable devices designed to support millimeter-wave communication signals. To support the integration of the RF transceiver into the device, it can be integrated into an RF integrated circuit (RFIC) transceiver chip ("RFIC chip") provided as part of an integrated circuit (IC) package (also known as an RFIC package). A conventional RFIC package includes one or more RFIC chips, a power management IC (PMIC), and passive electronic components (e.g., inductors, capacitors, etc.) mounted to one side of the package substrate as a support structure. The package substrate supports a metallized structure to provide chip-to-chip interfaces and external signal interfaces to the RFIC chips. If it is desired to integrate one or more antennas with the RFIC chips in the same package, the RFIC package can be provided as an antenna module. This is also known as an "antenna in package" (AiP). In an antenna module, one or more antennas capable of receiving and radiating electrical RF signals as electromagnetic (EM) signals are directly incorporated into the IC package. Antenna modules may include a plurality of antennas (also referred to as antenna arrays) to provide signal coverage over a desired large area around the IC package. Antenna elements may be mounted to the package substrate of the IC package and electrically coupled to the RFIC chips(s) within the antenna module via one or more metallization structures in the package substrate. For example, the RFIC chips(s) may be mounted to a first planar surface on a first top side of the package substrate of the antenna module, and the antenna array may be mounted to a second planar surface on a second bottom side of the package substrate opposite the first side to provide a planar antenna module. The radiation pattern of the antenna extends outward from and orthogonal to the second planar surface to provide directional antenna coverage. Multiple antenna modules may be provided in different physical locations within an RF device (such as, for example, a mobile phone) to provide antenna coverage in multiple directions. [Summary of the Invention]

[0004] The various embodiments disclosed in the detailed description include a multi-sided antenna module employing antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage. A related method of manufacturing the antenna module is also disclosed. The antenna module includes a layer comprising one or more integrated circuit (IC) dies (e.g., radio frequency (RF) IC (RFIC) dies) disposed on a first side of the packaged substrate. The packaged substrate provides mounting support for the IC dies and also includes one or more metallization layers comprising metal interconnects to provide electrical interfaces for signal routing to the IC dies. In an exemplary embodiment, to include antenna coverage in an additional direction in the multi-sided antenna module, the multi-sided antenna module further includes a first substrate antenna layer and a second substrate antenna layer disposed on respective first and second sides of the packaged substrate. The first substrate antenna layer includes one or more first antennas disposed on the first side of the packaged substrate adjacent to the IC dies. The second substrate antenna layer includes one or more second antennas disposed on a second side of the packaged substrate opposite to the first side of the packaged substrate. The first and second antennas in the corresponding first and second substrate antenna layers are electrically coupled to IC chips via metal interconnects in the metallization layers of the package substrate. The first antennas in the first substrate antenna layer have an antenna radiation pattern extending in a first direction outward from a first side of the package substrate. For example, the first antennas may include patch antennas oriented parallel to a first surface on the first side of the package substrate to provide an antenna radiation pattern extending outward from the first side of the package substrate and orthogonal to the package substrate. The second antennas in the second substrate antenna layer have an antenna radiation pattern extending in a second direction outward from a second side of the package substrate. For example, the second antennas may include patch antennas oriented parallel to a second surface on a second side of the package substrate to provide an antenna radiation pattern extending outward from the second side of the package substrate and orthogonal to the package substrate.

[0005] In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage extending from both sides of the package substrate to provide antenna coverage in multiple directions. By providing a multi-sided antenna module employing antennas on multiple sides of the package substrate, additional antenna coverage directions can be achieved for RF devices incorporating the multi-sided antenna module, and this is achieved with fewer antenna modules compared to those originally required when such antenna modules have antenna coverage in a single direction. Since each multi-sided antenna module includes (multiple) IC chips, the use of multi-sided antenna modules reduces the number of IC chips used in the RF device to achieve the desired multi-directional antenna coverage, thereby reducing costs and the area required in the RF device for such antenna modules.

[0006] In another exemplary embodiment, interference between the IC die and the first substrate antenna layer on the first side of the package substrate can be mitigated by an RF shield disposed between the IC die and the first substrate antenna layer. For example, the first substrate antenna layer may be mounted on the surface of (a) layers disposed on the RF shield disposed on the first side of the package substrate.

[0007] Different exemplary embodiments exist in which the first antennas disposed on a first side of the package substrate of the multi-sided antenna module are electrically coupled to the package substrate to achieve electrical connectivity to the IC chips. In one exemplary embodiment, the first antennas are coupled to a layer stack disposed on an RF mask of the IC chips. The layer stack includes a metal layer (e.g., a copper layer) extending on the surface of the RF mask and downward along the sidewall of the package molding formed on the IC chips to a metal pad on a first surface on the first side of the package substrate. These metal pads are electrically coupled to metal interconnects in an upper metal layer adjacent to the first surface on the first side of the package substrate, which in turn is electrically coupled to the RFIC chips. In another exemplary embodiment, to couple the first antennas to the package substrate to achieve electrical connectivity to the IC chips, vertical channels are formed in the package molding adjacent to the IC chips. These vertical channels extend downward to the first surface of the package substrate. After the vertical channels are formed, an RF mask can be disposed on the package molding such that the RF mask is positioned around the package molding surrounding the RFIC chips. Metal interconnects are formed in the vertical channels and coupled to metal interconnects in an upper metal layer on a first surface adjacent to the first side of the package substrate, which in turn are electrically coupled to the RFIC chips. First antennas are mounted above the vertical channels and extend between the top surfaces of each side of the vertical channels in the package molding. The first antennas are electrically coupled to the metal interconnects formed in the vertical channels.

[0008] Accordingly, in one exemplary embodiment, an antenna module is provided. The antenna module includes a packaging substrate, the packaging substrate including a first side and a second side opposite to the first side. The antenna module also includes a first substrate antenna layer disposed on the first side of the packaging substrate, the first substrate antenna layer including one or more first antennas. The antenna module also includes a first layer comprising one or more IC chips. The first layer is disposed on the first side of the packaging substrate between the packaging substrate and the first substrate antenna layer. The antenna module also includes a second substrate antenna layer disposed on the second side of the packaging substrate, the second substrate antenna layer including one or more second antennas.

[0009] In another exemplary embodiment, a method for manufacturing an antenna module is provided. The method includes the steps of: providing a packaging substrate, the packaging substrate including a first surface on a first side and a second surface on a second side opposite to the first side. The method also includes the steps of: disposing a second substrate antenna layer including one or more second antennas adjacent to the second surface on the second side of the packaging substrate. The method also includes the steps of: disposing a first layer including one or more integrated circuit (IC) dies adjacent to the first surface on the first side of the packaging substrate. The method also includes the steps of: disposing a first substrate antenna layer including one or more first antennas adjacent to the first layer, such that the first layer is disposed on the first side of the packaging substrate between the first substrate antenna layer and the packaging substrate.

Implementation Method

[0020] Several exemplary forms of this case are now described with reference to the accompanying drawings. The term "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any form described herein as "exemplary" is not necessarily to be construed as superior to or better than other forms.

[0021] The various embodiments disclosed in the detailed description include a multi-sided antenna module employing antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage. A related method of manufacturing the antenna module is also disclosed. The multi-sided antenna module includes a layer comprising one or more integrated circuit (IC) dies (e.g., radio frequency (RF) IC (RFIC) dies) disposed on a first side of the packaged substrate. The packaged substrate provides mounting support for the IC dies and also includes one or more metallization layers comprising metal interconnects for providing electrical interfaces for signal routing to the IC dies. In an exemplary embodiment, to include antenna coverage in an additional direction in the multi-sided antenna module, the multi-sided antenna module further includes a first substrate antenna layer and a second substrate antenna layer disposed on respective first and second sides of the packaged substrate. The first substrate antenna layer includes one or more first antennas disposed on the first side of the packaged substrate adjacent to the IC dies. The second substrate antenna layer includes one or more second antennas disposed on a second side of the packaged substrate opposite to the first side of the packaged substrate. The first and second antennas in the corresponding first and second substrate antenna layers are electrically coupled to IC chips via metal interconnects in the metallization layers of the package substrate. The first antennas in the first substrate antenna layer have an antenna radiation pattern extending in a first direction outward from a first side of the package substrate. For example, the first antennas may include patch antennas oriented parallel to a first surface on the first side of the package substrate to provide an antenna radiation pattern extending outward from the first side of the package substrate and orthogonal to the package substrate. The second antennas in the second substrate antenna layer have an antenna radiation pattern extending in a second direction outward from a second side of the package substrate. For example, the second antennas may include patch antennas oriented parallel to a second surface on a second side of the package substrate to provide an antenna radiation pattern extending outward from the second side of the package substrate and orthogonal to the package substrate.

[0022] In this manner, the multi-sided antenna module, including antennas on multiple sides of the package substrate, provides antenna coverage extending from both sides of the package substrate to provide antenna coverage in multiple directions. By providing a multi-sided antenna module employing antennas on multiple sides of the package substrate, additional antenna coverage directions can be achieved for the RF device incorporating the multi-sided antenna module, and this is achieved by using fewer antenna modules compared to those originally required when such an antenna module has antenna coverage in a single direction. Since each multi-sided antenna module includes (multiple) IC chips, the use of multi-sided antenna modules reduces the number of IC chips used in the RF device to achieve the desired multi-directional antenna coverage, thereby reducing costs and the area required in the RF device for such antenna modules.

[0023] Accordingly, Figures 1A-1C are side views of an exemplary multi-sided (multi-antenna) module 100 employing a first antenna 102 and a second antenna 104 on corresponding first sides 106F and second sides 106S of a package substrate 108 for achieving enhanced antenna coverage. In this example, as shown in Figure 1A, the second antenna 104 is disposed on a second side 106S of the package substrate 108 opposite to the first side 106F on which the first antenna 102 is disposed. As discussed in more detail below, in order to include antenna coverage in additional directions in the multi-sided antenna module 100, the multi-sided antenna module 100 includes a first substrate antenna layer 110F and a second substrate antenna layer 110S disposed on corresponding first sides 106F and second sides 106S of the package substrate 108. The first substrate antenna layer 110F includes a plurality of first antennas 102(1)-102(4) disposed on a first side 106F of the package substrate 108 adjacent to the IC chips 112(1)-112(4) in the first layer 114. For example, the IC chips 112(1)-112(4) may be RFIC chips that include circuitry related to processing, transmitting and / or receiving RF signals. The IC chips 112(1)-112(4) are electrically coupled to one or more of the first antennas 102(1)-102(4) and the second antennas 104(1)-104(4) via the package substrate 108 to receive and transmit RF signals.

[0024] In this manner, the multi-sided antenna module 100 in FIG1A (including first antennas 102(1)-102(4) and second antennas 104(1)-104(4) on the first side 106F and the second side 106S of the packaging substrate 108) provides antenna coverage extending from both the first side 106F and the second side 106S of the packaging substrate 108 to provide antenna coverage in multiple directions. The first antennas 102(1)-102(4) and the second antennas 104(1)-104(4) have corresponding first antenna radiation patterns 116F and second antenna radiation patterns 116S extending outward from the packaging substrate 108 in the first direction 118F and the second direction 118S (in this example, the two directions are opposite to each other). Therefore, in this example, by providing the first antennas 102(1)-102(4) of the first substrate antenna layer 110F on the first side 106F of the packaging substrate 108, the first antennas 102(1)-102(4) can be oriented to have a first antenna radiation pattern 116F extending outward from the packaging substrate 108 and away from the packaging substrate 108 in the vertical direction (Z-axis direction). Thus, the first antenna radiation pattern 116F extends in the first direction 118F that does not intersect with the packaging substrate 108. Similarly, in this example, by providing the second antennas 104(1)-104(4) of the second substrate antenna layer 110S on the second side 106S of the packaging substrate 108, the second antennas 104(1)-104(4) can be oriented to have a second antenna radiation pattern 116S extending outward from the second side 106S of the packaging substrate 108 and away from the packaging substrate 108 in the vertical direction (Z-axis direction). Thus, the second antenna radiation pattern 116S extends in the second direction 118S that does not intersect with the packaging substrate 108.

[0025] Figure 1B illustrates additional details of the multi-sided antenna module 100 in Figure 1A. Referring to Figure 1B, the IC chips 112(1)-112(4) are encapsulated in a package molding 120 by encapsulating the IC chips 112(1)-112(4) with molding compound 122. Optional RF shielding members 124 are disposed on the IC chips 112(1)-112(4) in the first layer 114 to shield the IC chips 112(1)-112(4) from electromagnetic interference. The second substrate antenna layer 110S includes a plurality of second antennas 104(1)-104(4) disposed on a second side 106S of the package substrate 108 opposite to the first side 106F of the package substrate 108 in the vertical direction (Z-axis direction). The first antenna 102(1)-102(4) and the second antenna 104(1)-104(4) in the corresponding first substrate antenna layer 110F and second substrate antenna layer 110S are electrically coupled to one or more of the IC chips 112(1)-112(4) via metal interconnects 126 in one or more metallization layers 128 of the packaging substrate 108.

[0026] For example, the first antenna 102(1)-102(4) may be a patch antenna oriented parallel to the first surface 130F on the first side 106F of the package substrate 108. This orientation of the first antenna 102(1)-102(4) provides a first antenna radiation pattern 116F (FIG. 1A) extending outward from the first side 106F of the package substrate 108 in the vertical direction (Z-axis direction) and orthogonal to the first surface 130F of the package substrate 108. Similarly, the second antenna 104(1)-104(4) may be a patch antenna oriented parallel to the second surface 130S on the second side 106S of the package substrate 108. The orientation of the second antenna 104(1)-104(4) provides a second antenna radiation pattern 116S (Fig. 1A) extending outward from the first side 106F of the package substrate 108 in the vertical direction (Z-axis direction) and in a second direction 118S orthogonal to the second surface 130S of the package substrate 108.

[0027] Therefore, as in the multi-sided antenna module 100 of FIG1A, additional antenna coverage directions can be achieved for the RF device incorporating the multi-sided antenna module 100, and this is achieved by using fewer antenna modules compared to those originally required when such antenna modules have antenna coverage in a single direction. Using the multi-sided antenna module 100 in an RF device can reduce the total number of IC chips used in the RF device to achieve the desired multi-directional antenna coverage, resulting in cost and area reduction, since fewer multi-sided antenna modules 100 are needed to achieve the desired antenna coverage. This is illustrated, for example, in FIG2, which is a side perspective view of an exemplary RF device 200 including the multi-sided antenna module 100 of FIG1 and another antenna module 202 without multi-directional antenna coverage. For example, RF device 200 may be a fifth-generation (5G) wireless device configured to transmit and receive 5G cellular RF signals in a spectrum ranging from 450 MHz to 6 GHz and from 24.25 GHz to 52.6 GHz (as a non-limiting example). As shown in FIG2, multi-sided antenna module 100 has a first antenna radiation pattern 116F and a second antenna radiation pattern 116S extending outward from multi-sided antenna module 100 in a corresponding first direction 118F and a second direction 118S. The first antenna 102(1)-102(4) and the second antenna 104(1)-104(4) in multi-sided antenna module 100 of RF device 200 may be designed to support 5G spectrum and are therefore 5G antennas. In this example, due to the orientation of the RF device 200 in FIG2 and the orientation of the multi-sided antenna module 100 in the RF device 200, the first antenna radiation pattern 116F and the second antenna radiation pattern 116S extending in the corresponding first direction 118F and second direction 118S are in the horizontal direction (Y-axis direction). Alternatively, the antenna module 202 in the RF device 200 includes an antenna only on one side of its package substrate, and thus has an antenna radiation pattern 116 in a single direction 206.

[0028] FIG1C is a partial side view of the multi-sided antenna module 100 in FIG1A and FIG1B, illustrating additional exemplary details of how the first antenna 102(1)-102(4) and the second antenna 104(1)-104(4) can be electrically coupled to the package substrate 108 to support the electrical connectivity between the first antenna 102(1)-102(4) of the first substrate antenna layer 110F and the second antenna 104(1)-104(4) of the second substrate antenna layer 110S and the IC die 112(1)-112(4). The second antenna 104(1)-104(2) of the second substrate antenna layer 110S is electrically coupled to the IC die 112(1)-112(4) via metal interconnects 126 in the metallization layer 128 of the package substrate 108. Because the second antennas 104(1)-104(2) of the second substrate antenna layer 110S are disposed on the package substrate 108 and directly adjacent to the package substrate 108 without an intervening IC die layer on the second side, the second antennas 104(1)-104(2) can be directly coupled to one or more of the IC dies 112(1)-112(4) via the metallization layer 128 of the package substrate 108. The metal interconnects 126 electrically coupled to the second antennas 104(1)-104(4) are connected to the metal pads 150F on the second surface 146S of the package substrate 108 that are coupled to one or more of the IC dies 112(1)-112(4).

[0029] Continuing to refer to FIG1C, in order to electrically couple the first antennas 102(1)-102(4) to one or more of the IC chips 112(1)-112(4), the multi-sided antenna module 100 includes a conductive substrate 132 disposed horizontally on the packaging molding 120 between the packaging molding 120 and the first substrate antenna layer 110F. In this example, the conductive substrate 132 includes a first dielectric layer 134, a second dielectric layer 136, and a conductive layer 138 of metal material 141 disposed between the first dielectric layer 134 and the second dielectric layer 136. The first dielectric layer 134 and the second dielectric layer 136 electrically insulate and isolate the conductive layer 138 to prevent short circuits in the conductive layer 138 and to provide flexibility to the conductive substrate 132 to avoid damage to the conductive layer 138. A conductive layer 138 is disposed on a first surface 140 of the encapsulation molding 120 and secured to the encapsulation molding 120 via an adhesive layer 142 disposed between the conductive substrate 132 and the encapsulation molding 120. To electrically couple the conductive layer 138 to the metal interconnects 126 in the metallization layer 128 of the encapsulation substrate 108, the conductive substrate 132 is also disposed on a sidewall 144 of the encapsulation molding 120 extending downward to the first surface 146F of the encapsulation substrate 108. This establishes an adjoining sidewall 144 of the encapsulation molding 120 and a shoulder region 148 of the encapsulation substrate 108. The conductive substrate 132 then extends from the sidewall 144 of the encapsulation molding 120 to the shoulder region 148 to contact the first surface 146F on the first side 106F of the encapsulation substrate 108. The first contact pad 152F is disposed on the first surface 146F of the package substrate 108. The first contact pad 152F is coupled to the conductive layer 138 of the conductive substrate 132 and the metal interconnect 126 of the metallization layer 128 adjacent to the first surface 146F of the package substrate 108 to provide a signal routing path between the first antenna 102(1)-102(4) and the IC die 112(1)-112(4).

[0030] Multi-sided antenna modules, such as the multi-sided antenna module 100 in Figures 1A-1C, can be manufactured according to different manufacturing processes. For example, Figure 3 is a flowchart illustrating an exemplary manufacturing process 300 for manufacturing a multi-sided antenna module (such as the multi-sided antenna module 100 in Figures 1A-1C). The manufacturing process 300 in Figure 3 is discussed with reference to the multi-sided antenna module 100 in Figures 1A-1C as an example.

[0031] Accordingly, the first step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 in Figures 1A-1C is to provide a packaging substrate 108, which includes a first surface 146F on a first side 106F and a second surface 146S on a second side 106S opposite to the first side 106F (block 302 in Figure 3). The next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to configure a second substrate antenna layer 110S including one or more second antennas 104(1)-104(4) adjacent to the second surface 146S on the second side 106S of the packaging substrate 108 (block 304 in Figure 3). The next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to configure a first layer 114 comprising one or more IC dies 112(1)-112(4) adjacent to a first surface 146F on a first side 106F of the package substrate 108 (block 306 in FIG. 3). The next step in the exemplary manufacturing process 300 for manufacturing the multi-sided antenna module 100 is to configure a first substrate antenna layer 110F comprising one or more first antennas 102(1)-102(4) adjacent to the first layer 114, such that the first layer 114 is disposed on the first side 106F of the package substrate 108 between the first substrate antenna layer 110F and the package substrate 108 (block 308 in FIG. 3).

[0032] Other manufacturing processes may be used to manufacture the exemplary multi-sided antenna module 100 of Figures 1A-1C. In this regard, Figures 4A and 4B are flowcharts illustrating another exemplary manufacturing process 400 for manufacturing the multi-sided antenna module 100 of Figures 1A-1C. Figures 5A-5E illustrate exemplary manufacturing stages 500A-500E during the manufacturing of the multi-sided antenna module 100 of Figures 1A-1C according to the exemplary manufacturing process 400 in Figures 4A and 4B. The manufacturing process 400 in Figures 4A and 4B will be discussed in conjunction with the manufacturing stages 500A-500E in Figures 5A-5E.

[0033] Accordingly, as shown in manufacturing stage 500A in FIG5A, the first step in the manufacturing process 400 for manufacturing the multi-sided antenna module 100 in FIG1A-FIG1C includes providing a packaging substrate 108 and setting a second substrate antenna layer 110S including second antennas 104(1)-104(4) on a second surface 146S adjacent to a second side 106S of the packaging substrate 108 (block 402 in FIG4A). As shown in manufacturing stage 500B in FIG5B, the next step in the manufacturing process 400 for manufacturing the multi-sided antenna module 100 in FIG1A-FIG1C includes setting a first layer 114 including IC chips 112(1)-112(4) on a first surface 146F adjacent to a first side 106F of the packaging substrate 108 (block 404 in FIG4A). As shown in manufacturing stage 500C in FIG5C, the next step in manufacturing process 400 for manufacturing the multi-sided antenna module 100 in FIG1A-FIG1C includes encapsulating IC dies 112(1)-112(4) in a first layer 114 with molding compound 122 to form a package molding 120 on IC dies 112(1)-112(4) (block 406 in FIG4A). Manufacturing process 400 may also include forming an RF shield 124 adjacent to the first layer 114 and the package molding 120 on IC dies 112(1)-112(4) to RF shield IC dies 112(1)-112(4) in the first layer 114 (block 406 in FIG4A).

[0034] As shown in manufacturing stage 500D in FIG5D, the next step in manufacturing process 400 for manufacturing the multi-sided antenna module 100 in FIG1A-FIG1C includes disposing a conductive substrate 132 on a packaging mold 120 and extending the conductive substrate 132 on the sidewall 144 of the packaging mold 120 and contacting the first surface 146F (block 408 in FIG4B) of the packaging substrate 108. An adhesive layer 142 may be first disposed on the packaging mold 120 before applying the conductive substrate 132 to secure the conductive substrate 132 to the packaging mold 120. As shown in manufacturing stage 500E of FIG5E, the next step in manufacturing process 400 for manufacturing the multi-sided antenna module 100 of FIG1A-FIG1C includes setting a first substrate antenna layer 110F having first antennas 102(1)-102(4) adjacent to a conductive substrate 132 above a package molding 120, such that a first layer 114 of IC chips 112(1)-112(4) is disposed on a first side 106F of the package substrate (108) between the first substrate antenna layer 110F and the package substrate 108 (block 410 in FIG4B). The first antennas 102(1)-102(4) are set to contact the conductive substrate 132 to electrically couple the first antennas 102(1)-102(4) to the package substrate 108 and further to one or more of the IC chips 112(1)-112(4).

[0035] FIG6 is a side view of another exemplary multi-sided antenna module 600 for achieving enhanced antenna coverage, which may also employ a package substrate 108, on a corresponding first side 106F and a second side 106S, for first antenna 102 and second antenna 104. Common elements between the multi-sided antenna module 600 in FIG6 and the multi-sided antenna module 100 in FIG1A-FIG. The discussion of such common elements in the multi-sided antenna module 100 in FIG1A-FIG. ... Instead, as discussed in more detail below and illustrated in FIG. 6, the multi-sided antenna module 600 includes channels 602(1)-602(4), in which, in this example, channels 602(1)-602(4) are vertical channels 602(1)-602(4) extending in the Z-axis direction. The vertical channels 602(1)-602(4) are disposed between IC dies 112(1)-112(4) in the first layer 114 to provide areas for corresponding metal interconnects 604(1)-604(4) extending downward to the package substrate 108. In this way, it is not necessary to provide a conductive layer and extend it downward to the package substrate 108 around the sidewalls of the package molding (as is generally the case in the multi-sided antenna module 100 in FIG. 1A-1C).

[0036] Accordingly, as shown in FIG6, vertical channels 602(1)-602(4) are configured to extend downward through the encapsulation molding 120 to the first surface 146F of the encapsulation substrate 108. In this example, vertical channels 602(1)-602(4) extend in a vertical direction (Z-axis direction) orthogonal to the first surface 146F of the encapsulation substrate 108. For example, vertical channels 602(1)-602(4) may be formed in the encapsulation molding 120 via laser drilling during the manufacture of the multi-sided antenna module 600. Metal interconnects 604(1)-604(4) formed of a metallic material are provided in vertical channels 602(1)-602(4). Metal interconnects 604(1)-604(4) extend downward in vertical channels 602(1)-602(4) to the first surface 146F of the package substrate 108 and contact metal interconnects 126 in the metallization layer 128 of the package substrate 108. RF masking material is disposed on the package molding 120 in which vertical channels 602(1)-602(4) are disposed to form individual RF masking elements 606(1)-606(4) for the respective IC chips 112(1)-112(4). Therefore, when the first substrate antenna layer 110F having the first antennas 102(1)-102(4) is provided in the multi-sided antenna module 600, the first antennas 102(1)-102(4) are configured to span the corresponding vertical channels 602(1)-602(4) formed in the package molding 120 and to contact the metal interconnects 604(1)-604(4) so ​​that the first antennas 102(1)-102(4) can be electrically coupled to the package substrate 108 via the metal interconnects 604(1)-604(4).

[0037] The multi-sided antenna module 600 in FIG. 6 can be manufactured according to the manufacturing process 300 in FIG. 3. The multi-sided antenna module 600 in FIG. 6 can also be manufactured according to other manufacturing processes. In this regard, FIG. 7A and FIG. 7B are flowcharts illustrating another exemplary manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG. 6. FIG. 8A-8E illustrate exemplary manufacturing stages 800A-800E during the manufacturing of the multi-sided antenna module 600 in FIG. 6 according to the exemplary manufacturing process 700 in FIG. 7A and FIG. 7B. The manufacturing process 800 in FIG. 7A and 7B will be discussed in conjunction with the manufacturing stages 800A-800E in FIG. 8A-8E.

[0038] Accordingly, as shown in manufacturing stage 800A in FIG8A, the first step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG6 includes providing a packaging substrate 108 and setting a second substrate antenna layer 110S including second antennas 104(1)-104(4) on a second surface 146S adjacent to a second side 106S of the packaging substrate 108 (block 702 in FIG7A). As shown in manufacturing stage 800B in FIG8B, the next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG6 includes setting a first layer 114 including IC dies 112(1)-112(4) on a first surface 146F adjacent to a first side 106F of the packaging substrate 108 (block 704 in FIG7A). As shown in manufacturing stage 800C in FIG8C, the next step in manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG6 includes encapsulating IC dies 112(1)-112(4) in a first layer 114 with molding compound 122 to form a package molding 120 on IC dies 112(1)-112(4) (block 706 in FIG7A). Manufacturing process 700 may also include forming an RF shield 124 adjacent to the first layer 114 and the package molding 120 on IC dies 112(1)-112(4) to RF shield IC dies 112(1)-112(4) in the first layer 114 (block 706 in FIG7A).

[0039] As shown in manufacturing stage 800D in FIG8D, the next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG6 includes forming vertical channels 602(1)-602(4) extending downward to the first surface 146F of the package substrate 108 (block 708 in FIG7B) in the package molding 120. This forms an opening in the RF mask 124 to form separate RF mask 606(1)-606(4) adjacent to the corresponding IC dies 112(1)-112(4). As an example, the vertical channels 602(1)-602(4) may be formed via laser-drilled openings in the package molding 120. Metal material can then be disposed in vertical channels 602(1)-602(4) to form metal interconnects 604(1)-604(4) electrically coupled to metal interconnects 126 in the package substrate 108 (block 708 in FIG. 7B). Next, as shown in manufacturing stage 800E in FIG. 8D, the next step in the manufacturing process 700 for manufacturing the multi-sided antenna module 600 in FIG. 6 includes disposing the first antennas 102(1)-102(4) of the first substrate antenna layer 110F on the package molding 120 and on the vertical channels 602(1)-602(4) (block 710 in FIG. 7B). In this example, the first antenna 102(1)-102(4) is configured to span the corresponding vertical channels 602(1)-602(4) formed in the package molding 120 and to contact the metal interconnects 604(1)-604(4) so ​​that the first antenna 102(1)-102(4) can be electrically coupled to the package substrate 108 via the metal interconnects 604(1)-604(4).

[0040] Multi-sided antenna modules with antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage (including, but not limited to, those in Figures 1A-1C, 5A-5E, 6 and 8A-8E, and those manufactured according to any of the processes in Figures 3-4B and 7A-7B, and those of any type disclosed herein) may be provided in or integrated into any wireless communication device and / or processor-based device. Examples not limited to these include: set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, Global Positioning System (GPS) devices, mobile phones, cellular phones, smartphones, SIP phones, tablet devices, tablet phones, servers, computers, portable computers, mobile computing devices, wearable computing devices (e.g., smartwatches, health or fitness trackers, glasses, etc.), desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, drones, and multi-rotor aircraft.

[0041] FIG9 illustrates an exemplary wireless communication device 900 including RF elements formed by one or more ICs 902, wherein any of the ICs 902 may include a multi-sided antenna module 903 for implementing enhanced antenna coverage on multiple sides of an antenna using a packaged substrate, including but not limited to the multi-sided antenna modules of FIG1A-FIG, FIG5A-FIG, FIG6 and FIG8A-FIG, and those manufactured according to any of FIG3-FIG, FIG7A-FIG, and FIG7A-FIG, and those of any type disclosed herein. As an example, the wireless communication device 900 may be included in or provided in any of the above-described devices. As shown in FIG9, the wireless communication device 900 includes a transceiver 904 and a data processor 906. The data processor 906 may include memory for storing data and code. The transceiver 904 includes a transmitter 908 and a receiver 910 supporting bidirectional communication. Generally, the wireless communication device 900 may include any number of transmitters 908 and / or receivers 910 for any number of communication systems and frequency bands. All or part of the transceiver 904 can be implemented on one or more analog ICs, RFICs, mixed-signal ICs, etc.

[0042] The transmitter 908 or receiver 910 can be implemented using a superheterodyne architecture or a direct conversion architecture. In a superheterodyne architecture, the signal is converted in multiple stages between the RF and the baseband frequency; for example, for receiver 910, it is converted from RF to intermediate frequency (IF) in one stage, and then from IF to the baseband frequency in another stage. In a direct conversion architecture, the signal is converted between the RF and the baseband frequency in one stage. Superheterodyne and direct conversion architectures can use different circuit blocks and / or have different requirements. In the wireless communication device 900 in Figure 9, the transmitter 908 and receiver 910 are implemented using a direct conversion architecture.

[0043] In the transmission path, the data processor 906 processes the data to be transmitted and provides I and Q analog output signals to the transmitter 908. In the exemplary wireless communication device 900, the data processor 906 includes digital-to-analog converters (DACs) 912(1), 912(2) to convert the digital signals generated by the data processor 906 into I and Q analog output signals (e.g., I and Q output currents) for further processing.

[0044] Within transmitter 908, low-pass filters 914(1) and 914(2) filter the I and Q analog output signals, respectively, to remove unwanted signals caused by the preceding digital-to-analog conversion. Amplifiers (AMPs) 916(1) and 916(2) amplify the signals from low-pass filters 914(1) and 914(2), respectively, and provide I and Q baseband signals. Upconverter 918 upconverts the I and Q baseband signals from the transmit (TX) local oscillator (LO) signal generator 922 via mixers 920(1) and 920(2) to provide upconverted signal 924. Filter 926 filters upconverted signal 924 to remove unwanted signals caused by upconversion and noise in the receive band. Power amplifier (PA) 928 amplifies upconverted signal 924 from filter 926 to obtain the desired output power level and provide the transmit RF signal. The transmitted RF signal is routed through a duplexer or switch 930 and transmitted via antenna 932.

[0045] In the receiving path, antenna 932 receives signals transmitted from the base station and provides received RF signals, which are routed through duplexer or switch 930 and provided to low noise amplifier (LNA) 934. Duplexer or switch 930 is designed to operate with specific receive (RX) and TX duplexer frequencies separated, such that the RX signal is isolated from the TX signal. The received RF signal is amplified by LNA 934 and filtered by filter 936 to obtain the desired RF input signal. Down-conversion mixers 938(1) and 938(2) mix the output of filter 936 with the I and Q RX LO signals (i.e., LO_I and LO_Q) from RX LO signal generator 940 to generate I and Q baseband signals. The I and Q fundamental frequency signals are amplified by AMPs 942(1) and 942(2) and further filtered by low-pass filters 914(1) and 914(2) to obtain I and Q analog input signals, which are provided to data processor 906. In this example, data processor 906 includes analog-to-digital converters (ADCs) 946(1) and 946(2) to convert the analog input signals into digital signals to be further processed by data processor 906.

[0046] In the wireless communication device 900 of FIG9, the TX LO signal generator 922 generates I and Q TX LO signals for up-conversion, while the RX LO signal generator 940 generates I and Q RX LO signals for down-conversion. Each LO signal is a periodic signal with a specific base frequency. The TX phase-locked loop (PLL) circuit 948 receives timing information from the data processor 906 and generates control signals for adjusting the frequency and / or phase of the TX LO signals from the TX LO signal generator 922. Similarly, the RX PLL circuit 950 receives timing information from the data processor 906 and generates control signals for adjusting the frequency and / or phase of the RX LO signals from the RX LO signal generator 940.

[0047] Figure 10 illustrates an example of a processor-based system 1000. The components of the processor-based system 1000 are ICs 1002. Some or all of the ICs 1002 in the processor-based system 1000 may be provided as an IC package 1004 employing a multi-sided antenna module 903 for implementing enhanced antenna coverage on multiple sides of the package substrate, including but not limited to those in Figures 1A-1C, 5A-5E, 6, and 8A-8E, as well as those manufactured according to any of the processes in Figures 3-4B and 7A-7B, and those of any type disclosed herein. In this example, the processor-based system 1000 may be formed as an IC package 1004 as a system-on-a-chip (SoC) 1006. Processor-based system 1000 includes a central processing unit (CPU) 1008, which includes one or more processors 1010, which may also be referred to as CPU cores or processor cores. CPU 1008 may have cache memory 1012 coupled to CPU 1008 for fast access to temporarily stored data. CPU 1008 is coupled to system bus 1014 and may be coupled to master and slave devices included in the processor-based system 1000. As is well known, CPU 1008 communicates with these other devices by exchanging address, control, and data information on system bus 1014. For example, CPU 1008 may communicate bus transaction requests to memory controller 1016, which is an instance of a slave device. Although not shown in FIG. 10, multiple system buses 1014 may be provided, each forming a different texture.

[0048] Other master and slave devices may be connected to the system bus 1014. As illustrated in FIG10, as an example, such devices may include a memory system 1020 comprising a memory controller 1016 and (various) memory arrays 1018, one or more input devices 1022, one or more output devices 1024, one or more network interface devices 1026, and one or more display controllers 1028. Each of the memory system 1020, one or more input devices 1022, one or more output devices 1024, one or more network interface devices 1026, and one or more display controllers 1028 may be provided in the same or different IC packages. The (various) input devices 1022 may include any type of input device, including but not limited to input keys, switches, voice processors, etc. The (various) output devices 1024 may include any type of output device, including but not limited to audio, video, other visual indicators, etc. (All) Network interface device 1026 can be any device configured to allow data exchange to and from network 1030. Network 1030 can be any type of network, including but not limited to wired or wireless networks, private or public networks, local area networks (LANs), wireless local area networks (WLANs), wide area networks (WANs), Bluetooth™ networks, and the Internet. (All) Network interface device 1026 can be configured to support any type of communication protocol desired.

[0049] The CPU 1008 may also be configured to access the display controllers 1028 via the system bus 1014 to control information sent to one or more displays 1032. The display controllers 1028 send information to be displayed to the displays 1032 via one or more video processors 1034, which process the information to be displayed into a format suitable for the displays 1032. As an example, the display controllers 1028 and the video processors 1034 may be included as IC packages 1004 and in the same or different IC packages 1004, and in the same or different IC packages containing the CPU 1008. The displays 1032 may include any type of display, including but not limited to cathode ray tube (CRT), liquid crystal display (LCD), plasma display, light-emitting diode (LED) display, etc.

[0050] Those skilled in the art will further appreciate that the various illustrative logic blocks, modules, circuits, and algorithms described herein can be implemented as electronic hardware, stored in memory or another computer-readable medium and executed by a processor or other processing device, or a combination of both. The memory disclosed herein can be of any type and size and can be configured to store any type of information desired. To clearly illustrate this interchangeability, various illustrative elements, blocks, modules, circuits, and steps have been generally described above in their functional form. How such functionality is implemented depends on the specific application, design choices, and / or design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as deviating from the scope of this work.

[0051] The various illustrative logic blocks, modules, and circuits described herein in conjunction with the various states disclosed herein may be implemented or executed using a processor, digital signal processor (DSP), application-specific integrated circuit (ASIC), field-programmable gate array (FPGA) or other programmable logic device, individual gate or transistor logic, individual hardware element, or any combination thereof designed to perform the functions described herein. The processor may be a microprocessor, but in alternative embodiments, the processor may be any known processor, controller, microcontroller, or state machine. The processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors coordinated with a DSP core, or any other such configuration).

[0052] The various forms disclosed herein can be embodied in hardware and instructions stored in the hardware, and can reside in, for example, random access memory (RAM), flash memory, read-only memory (ROM), electrically programmable ROM (EPROM), electronically erasable programmable ROM (EEPROM), registers, hard disks, removable disks, CD-ROMs, or any other form of computer-readable media known in the art. Exemplary storage media are coupled to a processor so that the processor can read and write information from / to the storage media. In alternatives, the storage media can be integrated into the processor. The processor and storage media can reside in an ASIC. The ASIC can reside in a remote station. In alternatives, the processor and storage media can reside as separate components in a remote station, base station, or server.

[0053] It should also be noted that the operational steps described in any of the exemplary embodiments herein are described for the purpose of providing examples and discussion. The described operations may be performed in many different orders other than those illustrated. Furthermore, the operations described in a single operational step may actually be performed in multiple different steps. Additionally, one or more operational steps discussed in the exemplary embodiments may be combined. It should be understood that, as will be apparent to those skilled in the art, many different modifications may be made to the operational steps illustrated in the flowchart. Those skilled in the art will also understand that information and signals can be represented using any of a variety of different techniques and skills. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referred to throughout the foregoing description may be represented by voltage, current, electromagnetic waves, magnetic fields or magnetic particles, light fields or light particles, or any combination thereof.

[0054] The prior description of this invention is provided so that anyone skilled in the art can make or use it. Various modifications to this invention will be apparent to those skilled in the art, and the universal principles defined herein can be applied to other variations. Therefore, this invention is not intended to be limited to the examples and designs described herein, but should be given the broadest scope consistent with the principles and novel features disclosed herein.

[0055] Each implementation example is described in the following numbered specifications / clauses: 1. An antenna module comprising: a package substrate including a first side and a second side opposite to the first side; a first substrate antenna layer disposed on the first side of the package substrate, the first substrate antenna layer including one or more first antennas; a first layer including one or more integrated circuit (IC) dies disposed on the first side of the package substrate between the package substrate and the first substrate antenna layer; and a second substrate antenna layer disposed on the second side of the package substrate, the second substrate antenna layer including one or more second antennas. 2. The antenna module of claim 1, further comprising: a radio frequency (RF) shield disposed between the first layer and the first substrate antenna layer. 3. The antenna module of any one of claims 1-2, wherein: the one or more first antennas are electrically coupled to the package substrate; and the one or more second antennas are electrically coupled to the package substrate. 4. An antenna module as described in any one of clauses 1-3, further comprising: a conductive layer disposed between the first layer and the first substrate antenna layer, the conductive layer comprising a conductive material; wherein: the conductive layer is electrically coupled to each of the one or more first antennas; and the conductive layer is electrically coupled to at least one metal interconnect in the metallization layer of the package substrate. 5. An antenna module as described in clause 4, further comprising: a package molding disposed on the one or more IC chips, the package molding including sidewalls; wherein the conductive layer is further disposed on the sidewalls of the package molding. 6. An antenna module as described in clause 5, wherein: the package substrate extends horizontally beyond a vertical plane extending beyond the sidewalls of the package molding to establish a shoulder region adjacent to the sidewalls of the package molding and the package substrate; and the conductive layer extends from the sidewalls of the package molding to the shoulder region to contact a first surface on a first side of the package substrate. 7. The antenna module of any one of clauses 4-6 further comprises: a conductive substrate, the conductive substrate including a first dielectric layer, a second dielectric layer, and a conductive layer disposed between the first dielectric layer and the second dielectric layer; the conductive substrate is disposed between the first substrate antenna layer and the first layer. 8. The antenna module of any one of clauses 5-7 further comprises an adhesive layer disposed between the conductive layer and the encapsulation molding, the adhesive layer coupling the conductive layer to the encapsulation molding.9. An antenna module as described in any one of clauses 1-3, further comprising: one or more antenna metal interconnects extending from a first surface of the antenna layer of the first substrate to a first surface on a first side of the package substrate; and each of the one or more antenna metal interconnects being coupled to a first antenna among one or more first antennas in the antenna layer of the first substrate and a metal interconnect in a metallization layer of the package substrate. 10. An antenna module as described in clause 9, further comprising: one or more channels extending from a first surface of the antenna layer of the first substrate to a first surface of the package substrate; each of the one or more antenna metal interconnects being disposed in one of the channels. 11. An antenna module as described in clause 10, wherein each of the one or more channels is adjacent to one of one or more IC chips in the first layer. 12. An antenna module as claimed in any of claims 10-11, further comprising: a packaging molding element disposed on the one or more IC chips; the one or more channels each extending from a first surface of the first substrate antenna layer and passing through the packaging molding element downward to the first surface of the packaging substrate. 13. An antenna module as claimed in any of claims 10-12, wherein each of the one or more first antennas extends horizontally across two adjacent channels of the one or more channels. 14. An antenna module as claimed in any of claims 1-13, wherein: the one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction not intersecting the packaging substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction not intersecting the packaging substrate. 15. An antenna module of any one of clauses 1-14, wherein: the first substrate antenna layer is disposed on a first surface on a first side of the package substrate; the second substrate antenna layer is disposed on a second surface on a second side of the package substrate; the one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction orthogonal to the first surface of the package substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction orthogonal to the first surface of the package substrate.16. An antenna module of any one of claims 1-14, wherein: the first substrate antenna layer is disposed on a first surface on a first side of the package substrate; the second substrate antenna layer is disposed on a second surface on a second side of the package substrate; the one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction that does not intersect the package substrate and is orthogonal to the first surface of the package substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction that does not intersect the package substrate and is orthogonal to the second surface of the package substrate. 17. An antenna module of any one of claims 1-16, wherein: the one or more first antennas include one or more first patch antennas, each parallel to the package substrate; and the one or more second antennas include one or more second patch antennas, each parallel to the package substrate. 18. An antenna module of any one of claims 1-18, wherein the antenna includes a 5G antenna. 19. An antenna module as described in any of Clauses 1-18, which is integrated into a device selected from the group consisting of: set-top boxes, entertainment units, navigation devices, communication devices, fixed location data units, mobile location data units, Global Positioning System (GPS) devices, mobile phones, cellular phones, smartphones, SIP phones, tablet devices, tablet phones, servers, computers, portable computers, mobile computing devices, wearable computing devices, desktop computers, personal digital assistants (PDAs), monitors, computer monitors, televisions, tuners, radios, satellite radios, music players, digital music players, portable music players, digital video players, video players, digital video disc (DVD) players, portable digital video players, automobiles, vehicle components, avionics systems, unmanned aerial vehicles, and multi-rotor aircraft. 20. A method of manufacturing an antenna module, comprising the steps of: providing a packaging substrate, the packaging substrate including a first surface on a first side and a second surface on a second side opposite to the first side; disposing a second substrate antenna layer including one or more second antennas adjacent to the second surface on the second side of the packaging substrate; disposing a first layer including one or more integrated circuit (IC) dies adjacent to the first surface on the first side of the packaging substrate; and disposing a first substrate antenna layer including one or more first antennas adjacent to the first layer, such that the first layer is disposed on the first side of the packaging substrate between the first substrate antenna layer and the packaging substrate. 21. The method of claim 20, further comprising the steps of: electrically coupling the one or more first antennas to the packaging substrate; and electrically coupling the one or more second antennas to the packaging substrate.22. The method of any one of claims 20-21, further comprising the step of: encapsulating the one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies; and wherein providing the first substrate antenna layer comprises providing the first substrate antenna layer including the one or more antennas on the package molding, such that the first layer is provided on a first side of the package substrate between the first substrate antenna layer and the package substrate. 23. The method of claim 22, further comprising the step of: forming a radio frequency (RF) mask adjacent to the first layer to RF mask the one or more IC dies in the first layer. 24. The method of any one of clauses 20-23, further comprising the steps of: forming a conductive layer comprising a conductive material adjacent to the first layer; wherein setting the first substrate antenna layer comprises setting the first substrate antenna layer comprising the one or more first antennas adjacent to the conductive layer such that the first layer is disposed on a first side of the package substrate between the conductive layer and the package substrate; and the method further comprising the steps of: electrically coupling the conductive layer to each of the one or more first antennas; and electrically coupling the conductive layer to at least one metal interconnect in a metallization layer of the package substrate. 25. The method of claim 24, further comprising the steps of: encapsulating one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies, the package molding including sidewalls; wherein providing the first substrate antenna layer includes providing the first substrate antenna layer including the one or more antennas on the package molding such that the first layer is disposed on a first side of the package substrate between the first substrate antenna layer and the package substrate; and the method further comprising the step of: forming the conductive layer on the sidewall of the package molding. 26. The method of claim 25, wherein forming the conductive layer further comprises the step of: providing the conductive layer adjacent to the sidewall of the package molding extending to a shoulder region adjacent to the sidewall of the package molding and the package substrate to contact a first surface of the package substrate. 27. The method of claim 25, further comprising the step of: forming a conductive substrate adjacent to the first layer, the conductive substrate including a first dielectric layer, a second dielectric layer, and the conductive layer disposed between the first dielectric layer and the second dielectric layer. 28. The method of Clause 27 further includes the step of: providing an adhesive layer between the conductive substrate and the package molding to couple the conductive substrate to the package molding.29. The method of any one of claims 20-28, further comprising the steps of: forming one or more antenna metal interconnects extending from a first surface of the first substrate antenna layer to a first surface on a first side of the package substrate; and coupling each of the one or more antenna metal interconnects to a first antenna among one or more first antennas in the first substrate antenna layer and to a metal interconnect in a metallization layer of the package substrate. 30. The method of claim 29, further comprising the steps of: forming one or more channels extending from a first surface of the first substrate antenna layer to a first surface on a first side of the package substrate; and disposing each of the one or more antenna metal interconnects in one of the channels. 31. The method of Clause 30 further includes the steps of: encapsulating the one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies; and wherein forming the one or more channels includes the one or more channels laser-drilled in the package molding from a first surface of the first substrate antenna layer to a first surface on a first side of the package substrate. [Simplified Explanation of the Diagram]

[0010] Figures 1A-1C are side views of an exemplary multi-sided (multi-side) antenna module with antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage;

[0011] FIG2 is a side perspective view of an exemplary radio frequency (RF) device including a multi-sided (multi-side) antenna module (such as the multi-sided antenna module in FIG1A-FIG1C) with antennas on multiple sides of a packaged substrate for achieving enhanced antenna coverage;

[0012] Figure 3 is a flowchart illustrating an exemplary manufacturing process for manufacturing the multi-sided antenna modules in Figures 1A-1C;

[0013] Figures 4A and 4B are flowcharts illustrating another exemplary manufacturing process for manufacturing a multi-sided antenna module (including but not limited to the multi-sided antenna modules in Figures 1A-1C), which employs antennas on multiple sides of a package substrate and an outer substrate having an integrated metal layer for mounting secondary antennas on the IC die side of the package substrate and electrically coupling the secondary antennas to the package substrate;

[0014] Figures 5A-5E illustrate exemplary manufacturing stages during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process in Figures 4A and 4B;

[0015] FIG6 is a side view of another exemplary multi-sided antenna module for achieving enhanced antenna coverage using antennas on multiple sides of a package substrate and having a channel disposed in a package molding formed in the IC die and extending down to a first surface on a first side of the package substrate to electrically connect a second antenna on the first side of the package substrate to a metal interconnect of the package substrate.

[0016] Figures 7A and 7B are flowcharts illustrating another exemplary manufacturing process for manufacturing a multi-sided antenna module (including but not limited to the multi-sided antenna module in Figure 6), which is used to achieve enhanced antenna coverage of antennas on multiple sides of a package substrate and has channels disposed in a package molding formed in the IC die and extending down to a first surface on a first side of the package substrate to electrically connect a second antenna on the first side of the package substrate to a metal interconnect of the package substrate.

[0017] Figures 8A-8E illustrate exemplary manufacturing stages during the manufacture of a multi-sided antenna module according to the exemplary manufacturing process in Figures 4A and 4B;

[0018] FIG9 is a block diagram of an exemplary wireless communication device including RF elements provided in one or more IC packages, wherein one or more of such IC packages may include multi-sided antenna modules for implementing enhanced antenna coverage on multiple sides of an antenna using a package substrate, including but not limited to the multi-sided antenna modules in FIG1A-FIG1C, FIG5A-FIG5E, FIG6 and FIG8A-FIG8E and according to any of the manufacturing processes in FIG3-FIG4B and FIG7A-FIG7B; and

[0019] FIG10 is a block diagram of an exemplary processor-based system that may include RF elements provided in one or more IC packages, wherein one or more of such IC packages may include multi-sided antenna modules for implementing enhanced antenna coverage on multiple sides of an antenna using a package substrate, including but not limited to the multi-sided antenna modules in FIG1A-FIG1C, FIG5A-FIG5E, FIG6 and FIG8A-FIG8E and according to any of the manufacturing processes in FIG3-FIG4B and FIG7A-FIG7B. [Biomaterial Storage]

[0057] Domestic storage information (please note in order of storage institution, date, and number): None. International storage information (please note in order of storage country, institution, date, and number): None.

Claims

1. An antenna module, comprising: A packaging substrate, the packaging substrate including a first side and a second side opposite to the first side; A first substrate antenna layer disposed on a first side of the package substrate, the first substrate antenna layer including one or more first antennas; a first layer including one or more integrated circuit (IC) chips disposed on the first side of the package substrate between the package substrate and the first substrate antenna layer; a second substrate antenna layer disposed on a second side of the package substrate, the second substrate antenna layer including one or more second antennas; and a conductive layer horizontally disposed between the first layer and the first substrate antenna layer, the conductive layer being continuously located below the first substrate antenna layer.

2. The antenna module of claim 1 further includes: A radio frequency (RF) shield is disposed between the first layer and the first substrate antenna layer.

3. The antenna module as described in request item 1, wherein: The one or more first antennas are configured to be electrically coupled to the package substrate; and the one or more second antennas are configured to be electrically coupled to the package substrate.

4. The antenna module as described in claim 1: wherein the conductive layer comprises a conductive material; wherein: The conductive layer is electrically coupled to each of the first antennas in the one or more first antennas; and the conductive layer is electrically coupled to at least one metal interconnect in a metallization layer of the package substrate.

5. The antenna module as described in claim 4 further includes: A package molding is disposed on one or more IC dies, the package molding includes a sidewall; The conductive layer is further disposed on the sidewall of the encapsulation molding.

6. The antenna module as described in request item 5, wherein: The packaging substrate extends in a horizontal direction beyond a vertical plane beyond the sidewall of the packaging mold to establish a shoulder region adjacent to the sidewall of the packaging mold and the packaging substrate; and the conductive layer extends from the sidewall of the packaging mold to the shoulder region to contact a first surface on the first side of the packaging substrate.

7. The antenna module of claim 4 further includes: A conductive substrate includes a first dielectric layer, a second dielectric layer, and a conductive layer disposed between the first dielectric layer and the second dielectric layer; the conductive substrate is disposed between the first substrate antenna layer and the first layer.

8. The antenna module of claim 5 further includes an adhesive layer disposed between the conductive layer and the encapsulation molding, the adhesive layer coupling the conductive layer to the encapsulation molding.

9. The antenna module of claim 1 further includes: One or more antenna metal interconnects extend from a first surface of the antenna layer of the first substrate to a first surface on the first side of the package substrate; and each of the one or more antenna metal interconnects is coupled to a first antenna among the one or more first antennas in the antenna layer of the first substrate and a metal interconnect in a metallization layer of the package substrate.

10. The antenna module of claim 9 further includes: One or more channels extend from the first surface of the first substrate antenna layer to the first surface of the package substrate; each of the one or more antenna metal interconnects is disposed in one of the channels.

11. The antenna module of claim 10, wherein each of the one or more channels is adjacent to one of the one or more IC chips in the first layer.

12. The antenna module of claim 10 further includes: A package molding component disposed on one or more IC dies; The one or more channels each extend from a first surface of the first substrate antenna layer and pass through the packaging molding down to the first surface of the packaging substrate.

13. The antenna module of claim 10, wherein each of the one or more first antennas extends in a horizontal direction across two adjacent channels of the one or more channels.

14. The antenna module as described in request item 1, wherein: The one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction that does not intersect with the packaging substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction that does not intersect with the packaging substrate.

15. The antenna module as described in request item 1, wherein: The first substrate antenna layer is disposed on a first surface on the first side of the package substrate; the second substrate antenna layer is disposed on a second surface on the second side of the package substrate; the one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction orthogonal to the first surface of the package substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction orthogonal to the first surface of the package substrate.

16. The antenna module as described in Request 1, wherein: The first substrate antenna layer is disposed on a first surface on the first side of the packaging substrate; the second substrate antenna layer is disposed on a second surface on the second side of the packaging substrate; the one or more first antennas in the first substrate antenna layer are oriented to have a first antenna radiation pattern extending in a first direction that does not intersect with the packaging substrate and is orthogonal to the first surface of the packaging substrate; and the one or more second antennas in the second substrate antenna layer are oriented to have a second antenna radiation pattern extending in a second direction that does not intersect with the packaging substrate and is orthogonal to the second surface of the packaging substrate.

17. The antenna module as described in claim 1, wherein: The one or more first antennas include one or more first patch antennas, each parallel to the package substrate; and the one or more second antennas include one or more second patch antennas, each parallel to the package substrate.

18. The antenna module of claim 1, wherein the antenna includes a 5G antenna.

19. The antenna module of claim 1, wherein the antenna module is integrated into a device selected from the group consisting of: a set-top box, an entertainment unit, a navigation device, a communication device, a fixed location data unit, a mobile location data unit, a Global Positioning System (GPS) device, a mobile phone, a cellular phone, a smartphone, a SIP phone, a tablet device, a tablet phone, a server, a computer, a portable computer, a mobile computing device, a wearable computing device, a desktop computer, a digital assistant (PDA), a monitor, a computer monitor, a television, a tuner, a radio, a satellite radio, a music player, a digital music player, a portable music player, a digital video player, a video player, a digital video disc (DVD) player, a portable digital video player, an automobile, a vehicle component, an avionics system, a drone, and a multi-rotor aircraft.

20. A method of manufacturing an antenna module, comprising the steps of: providing a packaging substrate, the packaging substrate including a first surface on a first side and a second surface on a second side opposite to the first side; disposing a second substrate antenna layer including one or more second antennas adjacent to the second surface on the second side of the packaging substrate; disposing a first layer including one or more integrated circuit (IC) chips adjacent to the first surface on the first side of the packaging substrate; disposing a first substrate antenna layer including one or more first antennas adjacent to the first layer, such that the first layer is disposed on the first side of the packaging substrate between the first substrate antenna layer and the packaging substrate; and horizontally disposing a conductive layer between the first layer and the first substrate antenna layer, the conductive layer being continuously located below the first substrate antenna layer.

21. The method of claim 20 further includes the steps of: electrically coupling the one or more first antennas to the package substrate; and electrically coupling the one or more second antennas to the package substrate.

22. The method of claim 20 further includes the steps of: encapsulating one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies; and wherein the step of disposing the first substrate antenna layer includes the steps of: disposing the first substrate antenna layer including the one or more antennas on the package molding, such that the first layer is disposed on the first side of the package substrate between the first substrate antenna layer and the package substrate.

23. The method of claim 22 further includes the step of: forming a radio frequency (RF) mask adjacent to the first layer to RF mask the one or more IC chips in the first layer.

24. The method of claim 20: wherein the conductive layer comprises a conductive material; wherein the step of disposing the first substrate antenna layer comprises the following steps: disposing the first substrate antenna layer, including the one or more antennas, adjacent to the conductive layer, such that the first layer is disposed on the first side of the package substrate between the conductive layer and the package substrate; and the method further comprises the following steps: The conductive layer is electrically coupled to each of the one or more first antennas; and at least one metal interconnect electrically coupled the conductive layer to a metallization layer of the packaging substrate.

25. The method of claim 24 further includes the steps of: encapsulating one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies, the package molding including a sidewall; wherein the step of setting the first substrate antenna layer includes the steps of: setting the first substrate antenna layer including the one or more antennas on the package molding such that the first layer is set on the first side of the package substrate between the first substrate antenna layer and the package substrate; and the method further includes the steps of: forming the conductive layer on the sidewall of the package molding.

26. The method of claim 25, wherein the step of forming the conductive layer further comprises the step of: configuring the conductive layer to extend adjacent to the sidewall of the package molding to a shoulder region adjacent to the sidewall of the package molding and the package substrate to contact the first surface of the package substrate.

27. The method of claim 25 further includes the step of: forming a conductive substrate adjacent to the first layer, the conductive substrate including a first dielectric layer, a second dielectric layer, and the conductive layer disposed between the first dielectric layer and the second dielectric layer.

28. The method of claim 27 further includes the step of: providing an adhesive layer between the conductive substrate and the packaging mold to couple the conductive substrate to the packaging mold.

29. The method of claim 20 further includes the steps of: forming one or more antenna metal interconnects extending from a first surface of the first substrate antenna layer to a first surface on the first side of the package substrate; and coupling each of the one or more antenna metal interconnects to a first antenna among the one or more first antennas in the first substrate antenna layer and a metal interconnect in a metallization layer of the package substrate.

30. The method of claim 29 further includes the steps of: forming one or more channels extending from the first surface of the first substrate antenna layer to the first surface on the first side of the package substrate; and disposing each of the one or more antenna metal interconnects in one of the channels.

31. The method of claim 30 further includes the step of: encapsulating the one or more IC dies in the first layer with a molding compound to form a package molding on the one or more IC dies; and wherein the step of forming the one or more channels includes the step of: laser drilling holes in the package molding from the first surface of the first substrate antenna layer to the one or more channels on the first surface of the first side of the package substrate.

32. An antenna module, comprising: A packaging substrate, the packaging substrate including a first side and a second side opposite to the first side; A first substrate antenna layer disposed on a first side of the package substrate, the first substrate antenna layer including one or more first antennas; a first layer including one or more integrated circuit (IC) dies disposed on the first side of the package substrate between the package substrate and the first substrate antenna layer; a second substrate antenna layer disposed on a second side of the package substrate, the second substrate antenna layer including one or more second antennas; and a conductive layer comprising a conductive material disposed between the first layer and the first substrate antenna layer, wherein the conductive layer is electrically coupled to each of the one or more first antennas and electrically coupled to at least one metal interconnect in a metallization layer of the package substrate; A package molding is disposed on one or more IC chips, the package molding includes a sidewall, wherein a package substrate extends in a horizontal direction beyond a vertical plane of the sidewall of the package molding to establish a shoulder region adjacent to the sidewall of the package molding and the package substrate; and a conductive layer extends from the sidewall of the package molding to the shoulder region to contact a first surface on the first side of the package substrate.

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