An open-loop temperature control system and a temperature control method thereof

Abstract

This invention provides an open-loop temperature control system and a temperature control method. The open-loop temperature control system includes a main control unit, a main heating plate, a temperature compensation unit, and an auxiliary control unit. The main heating plate is electrically connected to the main control unit to perform temperature regulation under the control of the main control unit. The auxiliary control unit, which includes an electrically connected auxiliary control unit and a power regulation unit, drives the temperature compensation unit to perform temperature compensation regulation on the main heating plate under the control of the auxiliary control unit. This effectively controls the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to an open-loop temperature control system and a temperature control method. Prior Art

[0002] Currently, substrate baking equipment is frequently used during semiconductor substrate processing. During the heating and baking process, substrate temperature uniformity is crucial to achieving process specifications. Existing technologies, such as Chinese patent application publication number CN103792974A, employ a technical solution to improve the temperature uniformity of the hot plate by optimizing the heating circuit and appropriately increasing the number of heater zones.

[0003] However, increasing the number of heater zones will significantly increase the heater development cycle and R&D cost expenditure, significantly increase the cost of the temperature control part, and at the same time take up more space for installing hardware and impose stricter control requirements during the heater manufacturing process, which can easily cause the heater yield to decrease, which in turn is passed on to increased heater costs.

[0004] By increasing the partitions to optimize the heating circuit, this approach will produce more outgoing line designs, making the routing more complicated and increasing the difficulty of designing the surrounding structure of the heater.

[0005] Therefore, it is necessary to develop a new open-loop temperature control system and temperature control method to solve the above problems existing in the existing technology. Summary of the Invention

[0006] An object of the present invention is to provide an open-loop temperature control system and a temperature control method using the open-loop temperature control system, so as to effectively control the temperature uniformity of a semiconductor substrate with the lowest possible manufacturing and maintenance costs.

[0007] To achieve the above object, the open-loop temperature control system of the present invention includes: Main control unit; A main heating plate, electrically connected to the main control unit, to adjust the temperature under the control of the main control unit; A temperature compensation portion, arranged corresponding to the main heating plate; Auxiliary control unit, the power adjustment unit is electrically connected to the temperature compensation unit, so as to drive the temperature compensation unit to perform temperature compensation adjustment on the main heating plate under the control of the auxiliary control unit.

[0008] The open-loop temperature control system of the present invention has the following beneficial effects: the main heating plate is electrically connected to the main control unit to perform temperature adjustment under the control of the main control unit, and is combined with the auxiliary control unit including an electrically connected auxiliary control unit and a power adjustment unit to drive the temperature compensation unit under the control of the auxiliary control unit to perform temperature compensation adjustment on the main heating plate, thereby effectively controlling the temperature uniformity of the semiconductor substrate with the lowest possible manufacturing and maintenance costs.

[0009] Preferably, the open-loop temperature control system further comprises a signal isolation unit electrically connected to the auxiliary control unit and the power regulation unit, so as to perform the isolation processing on the signal output by the auxiliary control unit before sending it to the power regulation unit.

[0010] Further preferably, the signal isolation unit is an optical isolation unit or a magnetic coupling isolation unit.

[0011] Preferably, the power regulation unit includes a pulse width modulation unit electrically connected to the temperature compensation part and the auxiliary control unit, so as to drive the temperature compensation part to perform the temperature compensation adjustment by adjusting the duty cycle of the signal output by the auxiliary control unit.

[0012] Further preferably, the pulse width modulation unit is an AC pulse width modulation unit or a DC pulse width modulation unit.

[0013] Preferably, the auxiliary control unit further includes a compensation temperature feedback unit electrically connected to the temperature compensation unit and the auxiliary control unit to collect real-time temperature information of the temperature compensation unit and feed it back to the auxiliary control unit.

[0014] Preferably, the temperature compensation portion includes a plurality of temperature compensation units, and the plurality of temperature compensation units are respectively arranged corresponding to different areas of the main heating plate.

[0015] The temperature control method of the present invention comprises: S0: providing an open-loop temperature control system, the open-loop temperature control system comprising a main control unit, a main heating plate electrically connected to the main control unit, a temperature compensation unit corresponding to the main heating plate, and an auxiliary control unit comprising an auxiliary control unit and a power adjustment unit electrically connected thereto, the power adjustment unit being electrically connected to the temperature compensation unit; S1: The main control unit adjusts the temperature of the main heating plate; S2: Control information is sent to the power regulating unit through the auxiliary control unit, and the power regulating unit drives the temperature compensation part to perform temperature compensation adjustment on the main heating plate according to the control information.

[0016] The temperature control method of the present invention has the beneficial effect of: after the temperature of the main heating plate is adjusted by the main control unit, control information is sent to the power adjustment unit by the auxiliary control unit, and the power adjustment unit drives the temperature compensation unit to perform temperature compensation adjustment on the main heating plate according to the control information, thereby effectively controlling the temperature uniformity of the semiconductor substrate with the lowest possible manufacturing and maintenance costs.

[0017] Preferably, the auxiliary control unit further includes a signal isolation unit electrically connected to the auxiliary control unit and the power regulation unit. In step S2, the step of controlling the power regulation unit through the auxiliary control unit includes: the signal isolation unit isolates the control information and then sends it to the power regulation unit.

[0018] Preferably, the auxiliary control unit further includes a compensation temperature feedback unit electrically connected to the temperature compensation unit and the main control unit. During the execution of step S2, the real-time temperature information of the temperature compensation unit is collected by the compensation temperature feedback unit and fed back to the auxiliary control unit.

[0019] Further preferably, the real-time temperature information fed back by the compensation temperature feedback unit includes multiple average temperature values ​​of different areas of the main heating plate, the auxiliary control unit pre-stores target temperature difference information, and the control information includes temperature difference adjustment information. In step S2, the step of sending control information to the power adjustment unit through the auxiliary control unit includes: the auxiliary control unit calculates the temperature difference information based on the multiple average temperature values; the auxiliary control unit generates the temperature difference adjustment information based on the temperature difference information and the target temperature difference information, and sends the temperature difference adjustment information to the power adjustment unit.

[0020] Further preferably, the temperature compensation adjustment includes temperature rise adjustment, and the temperature compensation part includes a plurality of temperature compensation units arranged corresponding to different areas of the main heating plate. In the step S2, the step of the power adjustment unit driving the temperature compensation part to perform temperature compensation adjustment on the main heating plate according to the control information includes: the power adjustment unit drives the sub-temperature compensation unit corresponding to the area where the lowest average temperature value among the several average temperature values ​​is located to perform the temperature rise adjustment on the main heating plate according to the temperature difference adjustment information until the auxiliary control unit determines that the temperature difference information is consistent with the target temperature difference information.

[0021] Further preferably, the auxiliary control unit also pre-stores preset standard deviation information, and the control information also includes standard deviation adjustment information. In step S2, the step of sending the control information to the power adjustment unit through the auxiliary control unit includes: after the auxiliary control unit determines that the temperature difference information is consistent with the target temperature difference information, the standard deviation information is calculated based on several new average temperature values ​​fed back by the compensation temperature feedback unit; the auxiliary control unit generates the standard deviation adjustment information based on the standard deviation information and the preset standard deviation information, and sends the standard deviation adjustment information to the power adjustment unit.

[0022] Further preferably, the temperature compensation adjustment includes cooling adjustment, and in the step S2, the step in which the power adjustment unit drives the temperature compensation part to perform the temperature difference compensation adjustment on the main heating plate according to the temperature difference adjustment information includes: the power adjustment unit drives the multiple temperature compensation units to synchronously perform the cooling adjustment on different areas corresponding to the main heating plate according to the standard deviation adjustment information until the auxiliary control unit determines that the standard deviation information is consistent with the preset standard deviation information. Simple diagram description

[0023] Figure 1 is a first functional block diagram of an open-loop temperature control system according to an embodiment of the present invention; Figure 2 is a second functional block diagram of an open-loop temperature control system according to an embodiment of the present invention; Figure 3 is a third functional block diagram of an open-loop temperature control system according to an embodiment of the present invention; FIG4 is a flow chart of a temperature control method according to an embodiment of the present invention. Implementation Method

[0024] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any further progress are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein shall have the common meanings understood by those skilled in the art in the field to which the present invention belongs. The words "including" and similar words used herein mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0025] Existing technology typically uses zoned control to adjust the temperature uniformity of the main heating plate. For example, the main heating plate can be divided into seven, thirteen, or fifteen zones. Considering the layout requirements of functional components and the limitations of wiring installation, the number of zones of the main heating plate cannot be infinite. Each zone includes multiple temperature measurement sampling points. For example, if temperature measurement of a particular zone, such as the first zone, indicates that the temperature uniformity does not meet process requirements, a temperature increase adjustment is required, and the first zone is controlled to increase its temperature. However, this adjustment can lead to the following problem: the average temperature of some of the multiple temperature measurement sampling points within the first zone may be lower than the target temperature, while the temperature of some of these temperature measurement sampling points may be higher than the target temperature, and the temperature difference between these and the target temperature is likely to be different. Even for individual temperature control zones with temperatures below the target temperature, the temperature difference between these and the target temperature is likely to be different. Therefore, temperature adjustment of a single zone can easily lead to temperature unevenness across the entire main heating plate.

[0026] In addition, the above-mentioned zoning control method requires independent temperature control for each zone, which significantly increases the cost of the temperature control part, and the finer the zoning, the higher the cost.

[0027] An embodiment of the present invention provides an open-loop temperature control system and a temperature control method using the open-loop temperature control system, so as to effectively control the temperature uniformity of a semiconductor substrate with the lowest possible manufacturing and maintenance costs.

[0028] FIG1 is a first functional block diagram of an open-loop temperature control system according to an embodiment of the present invention.

[0029] 1 , the open-loop temperature control system shown in FIG1 includes a main control unit 11, a main heating plate 12, a temperature compensation unit 13 and an auxiliary control unit 14.

[0030] In some embodiments, referring to FIG. 1 , the main heating plate 12 is electrically connected to the main control unit 11 to perform temperature adjustment under the control of the main control unit 11 .

[0031] In some specific embodiments, the main control unit 11 includes a host computer electrically connected to the main heating plate 12. The specific structure of the main heating plate and the communication mode between the host computer and the main heating plate are conventional technical means for those skilled in the art.

[0032] In some embodiments, the temperature compensation portion 13 is provided corresponding to the main heating plate 12 .

[0033] In some embodiments, referring to FIG. 1 , the auxiliary control unit 14 includes an auxiliary control unit 141 and a power adjustment unit 142 electrically connected to each other. The power adjustment unit 142 is electrically connected to the temperature compensation unit 13 to drive the temperature compensation unit 13 under the control of the auxiliary control unit 141 to perform temperature compensation adjustment on the main heating plate 12, thereby effectively controlling the temperature uniformity of the semiconductor substrate with minimal manufacturing and maintenance costs.

[0034] In some specific embodiments, the auxiliary control unit 141 is a host computer and is set independently from the main control unit 11.

[0035] In some embodiments, the power adjustment unit 142 includes a pulse width modulation unit electrically connected to the temperature compensation unit 13 and the auxiliary control unit 141, so as to drive the temperature compensation unit 13 to perform the temperature compensation adjustment on the main heating plate 12 by adjusting the duty cycle of the signal output by the auxiliary control unit 141.

[0036] In some embodiments, the pulse width modulation unit is an AC pulse width modulation unit or a DC pulse width modulation unit.

[0037] In some specific embodiments, the AC pulse width modulation unit is an AC power regulator.

[0038] In some specific embodiments, the DC pulse width modulation unit is a DC power regulator.

[0039] In some embodiments, the temperature compensation portion 13 includes a plurality of temperature compensation units, and the plurality of temperature compensation units are respectively arranged corresponding to different areas of the main heating plate 12.

[0040] FIG2 is a second functional block diagram of the open-loop temperature control system according to an embodiment of the present invention.

[0041] 1 and 2 , compared to the open-loop temperature control system shown in FIG1 , the open-loop temperature control system shown in FIG2 further includes a signal isolation unit 143 electrically connected to the auxiliary control unit 141 and the power regulation unit 142 to perform the isolation processing on the signal output by the auxiliary control unit 141 before sending it to the power regulation unit 142.

[0042] In some embodiments, the signal isolation unit 143 is an optical isolation unit or a magnetic coupling isolation unit.

[0043] In some specific embodiments, the optical isolation unit is an optical coupler to perform optical coupling isolation on the signal output by the auxiliary control unit 141.

[0044] In some specific embodiments, the magnetic coupling isolation unit is a magnetic coupling isolator to perform magnetic coupling isolation on the signal output by the auxiliary control unit 141.

[0045] FIG3 is a third functional block diagram of the open-loop temperature control system according to an embodiment of the present invention.

[0046] In some embodiments, referring to Figures 2 and 3, compared with the open-loop temperature control system shown in Figure 2, in the open-loop temperature control system shown in Figure 3, the auxiliary control unit 14 also includes a compensation temperature feedback unit 144 electrically connected to the temperature compensation unit 13 and the auxiliary control unit 141 to collect the real-time temperature information of the temperature compensation unit 13 and feed it back to the auxiliary control unit 141.

[0047] In some specific embodiments, the compensation temperature feedback unit 144 is a thermal resistor sensor.

[0048] The embodiment of the present invention further provides a temperature control method, referring to FIG4 , comprising: S0: providing the open-loop temperature control system; S1: The main control unit adjusts the temperature of the main heating plate; S2: Control information is sent to the power regulating unit through the auxiliary control unit, and the power regulating unit drives the temperature compensation part to perform temperature compensation adjustment on the main heating plate according to the control information.

[0049] In step S2 of some embodiments, the step of controlling the power regulating unit 142 through the auxiliary control unit 141 includes: the signal isolation unit 143 isolates the control information sent by the auxiliary control unit 141 and then sends it to the power regulating unit 142.

[0050] In some embodiments, during the execution of step S2, the real-time temperature information of the temperature compensation unit 13 is collected by the compensation temperature feedback unit 144 and fed back to the auxiliary control unit 141.

[0051] In some embodiments, the real-time temperature information fed back by the compensation temperature feedback unit 144 includes multiple average temperature values ​​of different areas of the main heating plate 12, the auxiliary control unit 1411 pre-stores target temperature difference information, and the control information includes temperature difference adjustment information.

[0052] In step S2 of some embodiments, the step of sending control information to the power adjustment unit 142 through the auxiliary control unit 141 includes: the auxiliary control unit 141 calculates the temperature difference information based on the multiple average temperature values; the auxiliary control unit 141 generates the temperature difference adjustment information based on the temperature difference information and the target temperature difference information, and sends the temperature difference adjustment information to the power adjustment unit 142.

[0053] In some embodiments, the temperature compensation adjustment includes temperature increase adjustment.

[0054] In step S2 of some embodiments, the step in which the power adjustment unit 142 drives the temperature compensation part 13 to perform temperature compensation adjustment on the main heating plate 12 according to the control information includes: the power adjustment unit 142 drives the sub-temperature compensation unit corresponding to the area where the lowest average temperature value among the multiple average temperature values ​​is located to perform the temperature increase adjustment on the main heating plate 12 according to the temperature difference adjustment information, until the auxiliary control unit 141 determines that the temperature difference information is consistent with the target temperature difference information.

[0055] In some embodiments, the auxiliary control unit 141 also pre-stores preset standard deviation information, and the control information also includes standard deviation adjustment information.

[0056] In step S2 of some embodiments, the step of sending control information to the power adjustment unit 142 through the auxiliary control unit 141 includes: after the auxiliary control unit 141 determines that the temperature difference information is consistent with the target temperature difference information, the standard deviation information is calculated based on the multiple new average temperature values ​​fed back by the compensation temperature feedback unit 144; the auxiliary control unit 141 generates the standard deviation adjustment information based on the standard deviation information and the preset standard deviation information, and sends the standard deviation adjustment information to the power adjustment unit 142.

[0057] In some embodiments, the temperature compensation adjustment includes cooling adjustment.

[0058] In step S2 of some embodiments, the step in which the power adjustment unit 142 drives the temperature compensation part 13 to perform the temperature difference compensation adjustment on the main heating plate 12 according to the temperature difference adjustment information includes: the power adjustment unit 142 drives the multiple temperature compensation units to synchronously perform the temperature reduction adjustment on different areas corresponding to the main heating plate 12 according to the standard deviation adjustment information until the auxiliary control unit 141 determines that the standard deviation information is consistent with the preset standard deviation information.

[0059] In some embodiments, the open-loop temperature control system further includes a heating cavity, wherein the temperature compensation unit and the main heating plate are disposed in the heating cavity.

[0060] In some embodiments, the auxiliary control unit 14, except for the auxiliary control unit 141, comprises a compensation control unit, which is disposed within the heating chamber. The auxiliary control unit 141 is electrically connected to the compensation control unit.

[0061] In some embodiments, the main heating plate 12, at least one sub-temperature compensation unit and a compensation control unit are provided in the heating chamber.

[0062] In some embodiments, the bottom surface of the main heating plate 12 includes at least one temperature control compensation area. The specific location of the temperature control compensation area and the distance between adjacent temperature control compensation areas are determined by the structural performance, process requirements, and installation conditions of the main heating plate 12 itself.

[0063] In some specific embodiments, the plurality of temperature control compensation areas are distributed in an array relative to the center of the bottom surface control area. Specific array distribution types include, but are not limited to, an annular array and a rectangular array.

[0064] In some embodiments, the top surface of the compensation control unit is adjacent to the bottom surface of the main heating plate 12, i.e., a cavity region is enclosed between the top surface of the compensation control unit and the bottom surface of the main heating plate 12. At least one temperature compensation unit is disposed in the region between the main heating plate 12 and the compensation control unit and is electrically connected to the compensation control unit. This allows wiring within the heating cavity to be centralized between the heating plate 12 and the compensation control unit, avoiding complex wiring design and facilitating disassembly, assembly, and maintenance of the semiconductor substrate heating device.

[0065] In some embodiments, the sub-temperature compensation unit is arranged corresponding to the temperature control compensation area to perform temperature compensation adjustment on the temperature control compensation area under the control of the compensation control unit.

[0066] In some embodiments, the auxiliary control unit 141 is disposed outside the heating chamber and electrically connected to the compensation control unit. Furthermore, by electrically connecting the compensation control unit and the auxiliary control unit 141 via a single communication lead, temperature compensation adjustment of the main heating plate 12 can be achieved through control of the compensation control unit, further avoiding complex wiring designs and facilitating disassembly, assembly, and maintenance of the semiconductor substrate heating device.

[0067] In some specific embodiments, the compensation control unit includes a printed circuit board (PCB), and at least one of the power adjustment unit 142, the signal isolation unit 143 and the compensation temperature feedback unit 144 is arranged on the PCB.

[0068] In some specific embodiments, the power adjustment unit 142, the signal isolation unit 143 and the compensation temperature feedback unit 144 are all arranged on a PCB.

[0069] The control implemented by the compensation control unit on at least one of the sub-temperature compensation units can be synchronous control or independent control.

[0070] In some embodiments, the sub-temperature compensation unit includes a heat conducting element or a cooling element to heat or cool the temperature control compensation area corresponding to the bottom surface of the main heating plate 12.

[0071] In some embodiments, the sub-temperature compensation unit and the main heating plate 12 interact in a contact manner, that is, the distance between the top of the sub-temperature compensation unit and the corresponding temperature control compensation area is equal to 0, so as to achieve mutual fit.

[0072] While the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the invention as described herein. Furthermore, the invention described herein is susceptible to other embodiments and may be practiced or implemented in a variety of ways.

[0073] 11: Main control unit 12: Main heating plate 13: Temperature compensation unit 14: Auxiliary control unit 141: Auxiliary control unit 142: Power regulation unit 143:Signal isolation unit 144: Compensation temperature feedback unit

Claims

1. An open-loop temperature control system, comprising: One main control unit; A main heating plate is electrically connected to the main control unit to regulate the temperature under the control of the main control unit; A temperature compensation unit is provided corresponding to the main heating plate; and an auxiliary control unit includes an auxiliary control unit and a power adjustment unit electrically connected to each other. The power adjustment unit is electrically connected to the temperature compensation unit to drive the temperature compensation unit to perform temperature compensation adjustment on the main heating plate under the control of the auxiliary control unit; and a signal isolation unit is also provided to be electrically connected to the auxiliary control unit and the power adjustment unit to isolate the signal output by the auxiliary control unit before sending it to the power adjustment unit.

2. The open-loop temperature control system as described in claim 1, wherein, The signal isolation unit is either an optical isolation unit or a magnetically coupled isolation unit.

3. The open-loop temperature control system as described in claim 1, wherein, The power regulation unit includes a pulse width modulation unit electrically connected to the temperature compensation unit and the auxiliary control unit, so as to drive the temperature compensation unit to perform temperature compensation regulation by adjusting the duty cycle of the signal output by the auxiliary control unit.

4. The open-loop temperature control system as described in claim 3, wherein, The pulse width modulation unit is either an AC pulse width modulation unit or a DC pulse width modulation unit.

5. The open-loop temperature control system as described in claim 1 further includes a heating cavity, wherein the temperature compensation unit and the main heating plate are disposed in the heating cavity, and all other units of the auxiliary control unit except the auxiliary control unit are disposed in the heating cavity.

6. The open-loop temperature control system as described in claim 1, wherein, The auxiliary control unit also includes a compensation temperature feedback unit electrically connected to the temperature compensation unit and the auxiliary control unit, for collecting real-time temperature information from the temperature compensation unit and feeding it back to the auxiliary control unit.

7. The open-loop temperature control system as described in claim 1, wherein, The temperature compensation section includes a plurality of temperature compensation units, which are respectively arranged in different areas of the main heating plate.

8. A temperature control method, comprising: S0： An open-loop temperature control system is provided, comprising a main control unit, a main heating plate electrically connected to the main control unit, a temperature compensation unit corresponding to the main heating plate, and an auxiliary control unit comprising an auxiliary control unit and a power adjustment unit electrically connected to each other, the power adjustment unit being electrically connected to the temperature compensation unit, and a signal isolation unit electrically connected to the auxiliary control unit and the power adjustment unit; S1: The main control unit adjusts the temperature of the main heating plate; S2: The auxiliary control unit sends control information to the power adjustment unit, and the power adjustment unit drives the temperature compensation unit to perform temperature compensation adjustment on the main heating plate according to the control information. In step S2, the step of controlling the power adjustment unit by the auxiliary control unit includes the signal isolation unit isolating the control information before sending it to the power adjustment unit.

9. The temperature control method as described in claim 8, wherein, The auxiliary control unit also includes a temperature compensation feedback unit electrically connected to the temperature compensation unit and the main control unit. During the execution of step S2, the temperature compensation feedback unit collects real-time temperature information of the temperature compensation unit and feeds it back to the auxiliary control unit.

10. The temperature control method as described in claim 9, wherein, The real-time temperature information fed back by the temperature compensation feedback unit includes multiple average temperature values ​​of different areas of the main heating plate. The auxiliary control unit pre-stores target temperature difference information. The control information includes temperature difference adjustment information. In step S2, the step of sending the control information to the power adjustment unit through the auxiliary control unit includes: the auxiliary control unit calculates a temperature difference information based on the average temperature values; the auxiliary control unit generates the temperature difference adjustment information based on the temperature difference information and the target temperature difference information, and sends the temperature difference adjustment information to the power adjustment unit.

11. The temperature control method as described in claim 10, wherein, The temperature compensation adjustment includes a temperature rise adjustment. The temperature compensation unit includes a plurality of temperature compensation units corresponding to different areas of the main heating plate. In step S2, the power adjustment unit drives the temperature compensation unit according to the control information. The step of performing the temperature compensation adjustment on the main heating plate includes: the power adjustment unit drives the sub-temperature compensation unit corresponding to the area where the lowest average temperature value among these average temperature values ​​is located to perform the temperature rise adjustment on the main heating plate according to the temperature difference adjustment information, until the auxiliary control unit determines that the temperature difference information is consistent with the target temperature difference information.

12. The temperature control method as described in claim 11, wherein, The auxiliary control unit also stores a preset standard deviation information. The control information also includes standard deviation adjustment information. In step S2, the step of sending control information to the power adjustment unit through the auxiliary control unit includes: after the auxiliary control unit determines that the temperature difference information and the target temperature difference information are consistent, it calculates a standard deviation information based on the plurality of new average temperature values ​​fed back by the compensation temperature feedback unit; the auxiliary control unit generates the standard deviation adjustment information based on the standard deviation information and the preset standard deviation information, and sends the standard deviation adjustment information to the power adjustment unit.

13. The temperature control method as described in claim 12, wherein, The temperature compensation adjustment includes a cooling adjustment. In step S2, the step of the power adjustment unit driving the temperature compensation unit to perform the temperature difference compensation adjustment on the main heating plate according to the temperature difference adjustment information includes: the power adjustment unit driving the temperature compensation units to perform the cooling adjustment on different areas corresponding to the main heating plate synchronously according to the standard deviation adjustment information, until the auxiliary control unit determines that the standard deviation information is consistent with the preset standard deviation information.

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