Thermal bridge for an electrical component

Abstract

This invention discloses a thermal bridge comprising an upper bridge assembly (202) and a lower bridge assembly (204). The upper bridge assembly includes a plurality of upper plates (300) disposed in an upper plate stack (302), and the lower bridge assembly includes a plurality of lower plates (400) disposed in a lower plate stack (402). A plurality of outer ends (408) of the lower plates face and are thermally coupled to an electrical component (102). The upper and lower plates are disposed in a pair of plates (230). An elastic element (203) forces the upper and lower plates of the pair of plates apart. The upper plates include a plurality of upper limit tabs (312), and the lower plates include a plurality of lower limit tabs (412). The upper and lower limit tabs operate to limit the separation of the upper and lower plates against the opening force of the elastic element.

Description

Technical Field

[0001] This invention relates to heat dissipation of electrical components. Prior Technology

[0002] Some systems or devices have designated components that require the transfer of heat energy (or heat). Some systems use electrical components (such as electrical connectors) to transmit data and / or power to, or from, different systems or devices. Some systems use electrical components (such as pluggable modules) to transmit data signals in the form of optical and / or electrical signals over (multiple) communication cables. Some systems use electrical components (such as integrated circuits) to control systems. Electrical components define the sources of heat generation within the system.

[0003] A common challenge faced by electrical system developers is thermal management. The heat generated by electrical components within a system can degrade system performance or even damage its components. To dissipate this heat, a system includes a thermal component, such as a radiator, which engages a heat source, absorbs heat from the heat source, and carries the heat away. The radiator is typically thermally coupled to another thermal component at yet another thermal interface. Components lose efficiency at each thermal interface. Furthermore, achieving efficient thermal coupling at interfaces is difficult due to the limited area of ​​the thermal interface and variations in surface texture (such as due to the surface flatness of the interface surfaces).

[0004] Therefore, there is a need for a heat transfer assembly that can efficiently transfer heat energy away from electrical components. Summary of the Invention

[0005] According to the present invention, a thermal bridge is provided and includes an upper bridge assembly comprising a plurality of upper plates disposed in an upper plate stack. Each upper plate has a front end and a rear end; each upper plate has a plurality of sides between the front end and the rear end; each upper plate has an inner end and an outer end. The thermal bridge includes a lower bridge assembly comprising a plurality of lower plates disposed in a lower plate stack; each lower plate has a front end and a rear end; each lower plate has a plurality of sides between the front end and the rear end; each lower plate has an inner end and an outer end. The plurality of outer ends of the lower plates are configured to face and thermally couple to an electrical component; the plurality of sides of the lower plates face the plurality of sides of the upper plates to thermally interface the lower plates with the upper plates. The thermal bridge includes a resilient element disposed between the upper bridge assembly and the lower bridge assembly. The resilient element includes an upper resilient member engaging the upper plates, which deflects the upper plates by an opening force generally away from the lower plates; the resilient element also includes a lower resilient member engaging the lower plates, which deflects the lower plates by an opening force generally away from the upper plates. The upper and lower plates are configured as a pair. The resilient element forces the upper and lower plates of the pair apart. The upper plates include a plurality of upper limit tabs. The lower plates include a plurality of lower limit tabs. The upper and lower limit tabs operate to limit the separation of the upper and lower plates against the opening force of the resilient element. Simple Explanation of the Diagram

[0006] Figure 1 is a front perspective view of a communication system and thermal bridge according to an exemplary embodiment, which is used for heat dissipation of at least one electrical component of the communication system.

[0007] Figure 2 is an exploded view of a thermal bridge according to an exemplary embodiment.

[0008] Figure 3 illustrates various pairs of plates according to an exemplary embodiment, including an upper plate and a lower plate that are configured opposite to each other.

[0009] Figure 4 illustrates various pairs of plates according to an exemplary embodiment, including an upper plate and a lower plate configured as a pair relative to each other.

[0010] Figure 5 is a cross-sectional view of a portion of a thermal bridge according to an exemplary embodiment, showing the elastic element and bridge frame relative to the first pair of upper and lower plates.

[0011] Figure 6 is an enlarged view of a portion of the thermal bridge shown in Figure 5 according to an exemplary embodiment.

[0012] Figure 7 is a cross-sectional view of a portion of a thermal bridge according to an exemplary embodiment, showing the elastic element and bridge frame relative to the second pair of upper and lower plates.

[0013] Figure 8 is an enlarged view of a portion of the thermal bridge shown in Figure 7 according to an exemplary embodiment.

[0014] Figure 9 is a cross-sectional view of a portion of the thermal bridge, showing the thermal bridge under compression according to an exemplary embodiment.

[0015] Figure 10 is a cross-sectional view of a portion of a thermal bridge, illustrating a thermal bridge according to an exemplary embodiment. Implementation

[0016] Figure 1 is a front perspective view of a communication system 100 and a thermal bridge 200 according to an exemplary embodiment, used for heat dissipation of at least one electrical component 102 of the communication system 100. The thermal bridge 200 is configured to be thermally coupled to the electrical component 102 at a lower thermal interface 104 at its bottom. In an exemplary embodiment, a heat transfer device 106 is configured to dissipate heat from the thermal bridge 200. For example, the thermal bridge 200 is configured to be thermally coupled to the heat transfer device 106 at an upper thermal interface 108. The thermal bridge 200 thermally connects the electrical component 102 and the heat transfer device 106 to dissipate heat from the electrical component 102. The heat transfer device 106 may be a heat sink, such as a finned heat sink, configured to cool the air by transferring heat to a passing airflow. In various other embodiments, the heat transfer device 106 may be a heat sink, a cooling plate with liquid cooling, etc.

[0017] In one exemplary embodiment, the thermal bridge 200 is compressible between the electrical component 102 and the heat transfer device 106. In one exemplary embodiment, the lower thermal interface 104 is conformable to the shape of the electrical component 102, while the upper thermal interface 108 is conformable to the shape of the heat transfer device 106 for efficient heat transfer therebetween. For example, the thermal bridge 200 may be a stacked plate structure in which individual plates are movable relative to each other to conform to the electrical component 102 and the heat transfer device 106.

[0018] In one exemplary embodiment, electrical component 102 is mounted to a circuit board 110. In various embodiments, electrical component 102 may be a communication connector, such as a socket connector, head connector, plug connector, or other type of communication connector. In other various embodiments, electrical component 102 may be an electronic package, such as an integrated circuit. In other various embodiments, electrical component 102 may be a pluggable module, such as an I / O transceiver module. Other types of electrical components may also be provided in alternative embodiments.

[0019] In one exemplary embodiment, the thermal bridge 200 includes an upper bridge assembly 202, a lower bridge assembly 204, an elastic element 206 between the upper bridge assembly 202 and the lower bridge assembly 204, and a bridge frame 208 for holding the upper bridge assembly 202 and the lower bridge assembly 204 together. The lower bridge assembly 204 is configured to thermally bond the electrical component 102. The upper bridge assembly 202 is configured to dissipate heat to the external environment and / or the heat transfer device 106. The upper bridge assembly 202 is in thermal communication with the lower bridge assembly 204 to dissipate heat from the lower bridge assembly 204 to cool the electrical component 102.

[0020] The elastic element 206 offsets the upper bridge assembly 202 and the lower bridge assembly 204 apart. The upper bridge assembly 202 and the lower bridge assembly 204 are compressible relative to each other. For example, the upper bridge assembly 202 and the lower bridge assembly 204 are compressible between the electrical component 102 and the heat transfer device 106 (e.g., compressing the elastic element 206).

[0021] Bridge frame 208 provides support for the upper bridge assembly 202 and the lower bridge assembly 204. In one exemplary embodiment, bridge frame 208 provides internal support through the upper bridge assembly 202 and the lower bridge assembly 204. Internal support eliminates the need for an external frame, providing more surface area for heat dissipation and / or for thermal interface heat transfer device 106. However, in an alternative embodiment, bridge frame 208 may extend around the outer periphery of the thermal bridge 200, such as along the sides and ends, leaving a top and bottom to form a thermal interface with electrical component 102 and heat transfer device 106.

[0022] In one exemplary embodiment, the elastic element 206 presses the upper bridge assembly 202 outward against the bridge frame 208 in a first offset direction (e.g., upward), and the elastic element 206 presses the lower bridge assembly 204 outward against the bridge frame 208 in a second offset direction (e.g., downward). The upper bridge assembly 202 and the lower bridge assembly 204 can be held in place by the bridge frame 208 in a manner that allows the upper bridge assembly 202 and the lower bridge assembly 204 to float with a limited amount of movement relative to the bridge frame 208.

[0023] Figure 2 is an exploded view of a thermal bridge 200 according to an exemplary embodiment. The thermal bridge 200 includes an upper bridge assembly 202 and a lower bridge assembly 204. An elastic element 206 is located between the upper bridge assembly 202 and the lower bridge assembly 204. A bridge frame 208 is configured to hold the upper bridge assembly 202 and the lower bridge assembly 204. In one exemplary embodiment, the elastic element 206 is a multi-piece elastic element having a first elastic element 206a at a first end and a second elastic element 206b at a second end. The first and second elastic elements cooperate to form the elastic element 206. In an alternative embodiment, the elastic element 206 may be a single piece (e.g., only the first elastic element 206a). In one exemplary embodiment, the bridge frame 208 is a multi-piece elastic element having a first bridge frame 208a at a first side and a second bridge frame 208b at a second side. The first and second bridge frame elements cooperate to form the bridge frame 208. In an alternative embodiment, the bridge frame 208 may be a single piece (e.g., only the first bridge frame 208a).

[0024] In one exemplary embodiment, the bridge frame 200 is a parallelepiped (e.g., typically box-shaped). For example, the thermal bridge 200 includes a top 270, a bottom 272, a front 274, a rear 276, a first side 280, and a second side 282. The top 270 may be a general plane. The bottom 272 may be a general plane. The front 274 may be a general plane. The rear 276 may be a general plane. The first side 280 may be a general plane. The second side 282 may be a general plane. However, in alternative embodiments, the thermal bridge 200 may have other shapes. The frame structure used to hold the thermal bridge 200 together is defined by the bridge frame 208. The bridge frame 208 is typically contained within the thermal bridge 200, such that the outer surfaces of the thermal bridge 200 (e.g., top 270, bottom 272, front 274, rear 276, first side 280, and second side 282) are each exposed and usable for heat dissipation and / or for interfacing with other components, such as electrical component 102 and / or heat transfer device 106 (both shown in FIG. 1). The bridge frame 208 allows the thermal bridge 200 to have a large usable external surface area. In one exemplary embodiment, the bridge frame 208 is exposed at the first side 280 and the second side 282, preferably with a small footprint, to hold the upper bridge assembly 202 and the lower bridge assembly 204 together.

[0025] In one exemplary embodiment, no portion of the bridge frame 208 extends along the top 270 or the bottom 272. The bridge frame 208 is positioned away from the upper heat interface 108 such that it does not obstruct the upper heat interface 108 and provides a large usable surface area for interfaced heat transfer devices 106. The bridge frame 208 is positioned away from the lower heat interface 104 such that it does not obstruct the lower heat interface 104 and provides a large usable surface area for interfaced electrical components 102. In one exemplary embodiment, no portion of the bridge frame 208 extends along the front 274 or the rear 276.

[0026] In one exemplary embodiment, the upper bridge assembly 202 and the lower bridge assembly 204 each include a plurality of plates arranged in a plate stack. These plates are staggered to provide thermal conductivity between the upper bridge assembly 202 and the lower bridge assembly 204. Each plate is movable relative to each other such that it can be individually hinged to conform to the electrical component 102 and / or the heat transfer device 106. For example, each plate may conform to the electrical component 102 at the lower thermal interface 104 to provide improved contact and / or proximity between the thermal bridge 200 and the electrical component 102, and / or each plate may conform to the heat transfer device 106 at the upper thermal interface 108 to provide improved contact and / or proximity between the thermal bridge 200 and the heat transfer device 106. Gaps or intervals may be provided between the plates of the upper bridge assembly 202 and the lower bridge assembly 204 to allow compressive movement of the resilient element 206 between the upper bridge assembly 202 and the lower bridge assembly 204.

[0027] In one exemplary embodiment, the upper bridge assembly 202 includes a plurality of upper plates 300 disposed in an upper plate stack 302. Each upper plate 300 has a side portion 304 extending between an inner end 306 and an outer end 308 of the upper plate 300. The inner end 306 faces the lower bridge assembly 204. The outer end 308 faces outward, such as towards the heat transfer device 106. Alternatively, the various upper plates 300 may have different shapes, such as different heights and / or different features between the inner end 306 and the outer end 308.

[0028] In one exemplary embodiment, the lower bridge assembly 204 includes a plurality of lower plates 400 disposed in a lower plate stack 402. Each lower plate 400 has a side portion 404 extending between an inner end 406 and an outer end 408 of the lower plate 400. The inner end 406 faces the upper bridge assembly 202. The outer end 408 faces outward, such as towards the electrical component 102 (shown in FIG. 1). Alternatively, the various lower plates 400 may have different shapes and / or heights between the inner end 406 and the outer end 408.

[0029] In one exemplary embodiment, the upper plate 300 and the lower plate 400 are configured as a pair of plates 230. Each pair of plates 230 includes one of a plurality of upper plates 300 and one of a plurality of lower plates 400. The upper plates 300 and lower plates 400 of the pair of plates 230 are aligned with each other. For example, the upper plates 300 and lower plates 400 are vertically stacked, with the upper plate 300 above the lower plate 400. The pair of plates 230 are stacked together to form a thermal bridge 200 with a stacked configuration. A bridge frame 208 holds the pair of plates 230 in a stacked configuration. An elastic element 206 is configured to be located between the upper plates 300 and the lower plates 400, with the upper plates 300 and lower plates 400 separated.

[0030] Please also refer to Figures 3 and 4, which illustrate various pairs of plates 230, including an upper plate 300 and a lower plate 400 configured relative to each other as a pair of plates 230. Figure 3 shows a first pair 232. Figure 4 shows a second pair 234. The upper plate 300 of the first pair 232 is different from the upper plate 300 of the second pair 234. The lower plate 400 of the first pair 232 is different from the lower plate 400 of the second pair 234.

[0031] In one exemplary embodiment, the upper plate 300 includes an upper recess 310 for receiving the bridge frame 208. In one exemplary embodiment, the upper recess 310 is excessively large relative to the bridge frame 208 to allow the upper plate 300 to move relative to the bridge frame 208, such as in the vertical direction, to allow compression when mated with the heat transfer device 106.

[0032] In one exemplary embodiment, the upper plate 300 includes an upper limit tongue 312 for positioning the upper plate 300 relative to the lower plate 400 and / or relative to the bridge frame 208. The upper limit tongue 312 may engage the lower plate 400 and / or the bridge frame 208 to position the upper plate 300 within the upper plate stack 302. The upper limit tongue 312 restricts vertical movement of the upper plate 300, such as restricting the upper plate 300 from separating from the lower plate 400. The resilient element 206 may press the upper plate 300 outward (e.g., upward) until the upper limit tongue 312 bottoms against the lower plate 400, the bridge frame 208, or other intermediate structures.

[0033] In one exemplary embodiment, the upper limit tongue 312 extends into and / or from a portion of the upper recess 310. The upper limit tongue 312 is contained within the cover or periphery of the upper plate 300. In one exemplary embodiment, each upper plate 300 includes a plurality of upper limit tongues 312, such as at opposite sides of the upper plate 300.

[0034] Each upper limit tongue 312 includes an arm 314 and a finger 316. The arm 314 extends from a major portion of the upper plate 300. In the embodiment, the arm 314 extends vertically, such as perpendicular to the bottom edge of the upper plate 300. The finger 316 extends from the arm 314. For example, the finger 316 may generally extend horizontally, such as perpendicular to the arm 314. The upper limit tongue 312 may be hook-shaped, such as J-shaped. The arm 314 and / or the finger 316 may form an upper recess 310. The upper recess 310 is configured to receive a portion of the lower plate 400 (e.g., the lower limit tongue) and / or a portion of the bridge frame 208 (e.g., a spar).

[0035] In one exemplary embodiment, the upper limit tongue 312 includes a stop surface 318. The stop surface 318 is configured to engage the lower plate 400 (e.g., the lower limit tongue of the lower plate 400) and / or the bridge frame 208 to limit or control the positioning of the upper plate 300 in the thermal bridge 200. In this embodiment, the stop surface 318 is an upper surface of the upper limit tongue 312.

[0036] In one exemplary embodiment, the upper plate 300 includes an upper bridge plate 320 (FIG. 4) and an upper partition plate 322 (FIG. 3). The upper partition plate 322 is located between the upper bridge plates 320. Both the upper bridge plate 320 and the upper partition plate 322 include an upper limit tongue 312.

[0037] Referring to Figure 4, each upper bridge plate 320 includes a base 330 at an outer end 308 and overlapping regions 342, 344 at an inner end 306, configured to overlap with the adjacent lower plate 400 of the lower bridge assembly 204. In various embodiments, the upper bridge plate 320 includes a first bridge portion 332 extending downward from the base 330 and a second bridge portion 334 extending downward from the base 330, wherein an upper gap 336 is located between the first bridge portion 332 and the second bridge portion 334. In one exemplary embodiment, the upper gap 336 receives a portion of the resilient element 206. The upper gap 336 is open at the inner end 306, such as to receive the lower plate 400 of the lower bridge assembly 204. The upper gap 336 is defined by an edge 338 extending along the base 330 and the first bridge portion 332, the second bridge portion 334. The edge 338 at the top of the upper gap 336 is configured to engage the resilient element during assembly.

[0038] An upper limit tongue 312 extends from the inner end 306 of the upper bridge plate 320. In the embodiment, the upper limit tongue 312 is located on the opposite side of the base 330. For example, the arm portion 314 is located at the side edge of the base 330, and the finger portion 316 extends inward from the arm portion 314. An upper recess 310 is located inside the arm portion 314. The upper recess 310 receives multiple portions of the lower plate 400 (e.g., the lower limit tongue).

[0039] In one exemplary embodiment, the first bridge portion 332 defines an overlapping region 342 at a side 304 of the upper bridge plate 320, while the second bridge portion 334 defines an overlapping region 344 at a side 304 of the upper bridge plate 320. The overlapping regions 342 and 344 are configured to overlap with the adjacent lower plate 400 of the lower bridge assembly 204. The overlapping regions 342 and 344 provide a large surface area for thermal coupling to the lower plate.

[0040] Referring to Figure 3, each upper spacer 322 includes a spacer base 350 at its outer end 308 and a spacer tongue 352 extending from the spacer base 350. The spacer tongue 352 extends from the inner end 306 of the upper spacer 322. The spacer tongue 352 may be centered approximately along the spacer base 350. The bottom edge of the spacer tongue 352 may engage the elastic element 206 during assembly.

[0041] The upper limit tongue 312 extends from the inner end 306 of the upper spacer 322. In the embodiment, the upper limit tongue 312 is located on the opposite side of the base 330. For example, the arm 314 is located near the side edge of the base 330 (e.g., spaced inward from the edge), and the finger 316 extends outward from the arm 314. The upper recess 310 is located outside the arm 314. The upper recess 310 receives multiple portions of the lower plate 400 (e.g., the lower limit tongue).

[0042] In one exemplary embodiment, the lower plate 400 includes a recess 410 for receiving the bridge frame 208. In one exemplary embodiment, the recess 410 is oversized relative to the bridge frame 208 to allow the lower plate 400 to move relative to the bridge frame 208, such as in a vertical direction, to allow compression when mated with the heat transfer device 106.

[0043] In one exemplary embodiment, the lower plate 400 includes a lower limiting tongue 412 for positioning the lower plate 400 relative to the upper plate 300 and / or relative to the bridge frame 208. The lower limiting tongue 412 may engage the upper plate 300 and / or the bridge frame 208 to position the lower plate 400 within the lower plate stack 402. The lower limiting tongue 412 restricts vertical movement of the lower plate 400, such as restricting the lower plate 400 from separating from the upper plate 300. The resilient element 206 may press the lower plate 400 outward (e.g., downward) until the lower limiting tongue 412 contacts the upper plate 300, the bridge frame 208, or other intermediate structures.

[0044] In one exemplary embodiment, the lower limiting tongue 412 extends into and / or from a portion of the recess 410. The lower limiting tongue 412 is contained within the cover or periphery of the lower plate 400. In one exemplary embodiment, each lower plate 400 includes a plurality of lower limiting tongues 412, such as at opposite sides of the lower plate 400.

[0045] Each lower limit tongue 412 includes an arm 414 and a finger 416. The arm 414 extends from a major portion of the lower plate 400. In the embodiment, the arm 414 extends vertically, such as perpendicular to the bottom edge of the lower plate 400. The finger 416 extends from the arm 414. For example, the finger 416 may generally extend horizontally, such as perpendicular to the arm 414. The lower limit tongue 412 may be hook-shaped, such as J-shaped. The arm 414 and / or the finger 416 may form a recess 410. The recess 410 is configured to receive a portion of the upper plate 300 (e.g., the upper limit tongue 312) and / or a portion of the bridge frame 208 (e.g., a spar).

[0046] In one exemplary embodiment, the lower limiting tongue 412 includes a stop surface 418. The stop surface 418 is configured to engage the upper plate 300 (e.g., the upper limit tongue 312 of the upper plate 300) and / or the bridge frame 208 to limit or control the positioning of the lower plate 400 in the thermal bridge 200. In this embodiment, the stop surface 418 is the lower surface of the lower limiting tongue 412.

[0047] In one exemplary embodiment, the lower plate 400 includes a lower bridge plate 420 (FIG. 3) and a lower spacer plate 422 (FIG. 4). The lower spacer plate 422 is located between the lower bridge plates 420. Both the lower bridge plate 420 and the lower spacer plate 422 include a lower limiting tongue 412.

[0048] Referring to Figure 3, each lower bridge plate 420 includes a base 430 at an outer end 408 and overlapping regions 442, 444 at an inner end 406, configured to overlap with the adjacent upper plate 300 of the upper bridge assembly 202. For example, the overlapping regions 442, 444 overlap with the overlapping regions 342, 344 of the upper bridge plate 320. In various embodiments, the lower bridge plate 420 includes a first bridge portion 432 extending upward from the base 430 and a second bridge portion 434 extending upward from the base 430, wherein a lower gap 436 is located between the first bridge portion 432 and the second bridge portion 434. The lower gap 436 is open at the inner end 406 to receive a spacer tongue 352 corresponding to the first bridge portion 332 of the upper spacer plate. The lower gap 436 is defined by an edge 438 extending along the base 430 and the first bridge portion 432 and the second bridge portion 434. Edge 438 guides the spacer tongue 352 into the lower gap 436. Alternatively, edge 438 may be chamfered to guide the spacer tongue 353 into the lower gap 436. Edge 438 at the bottom of the lower gap 436 is configured to engage the elastic element 206 during assembly. For example, the elastic element 206 may be received in the lower gap 436.

[0049] The lower limiting tongue 412 extends from the inner end 406 of the lower bridge plate 420. In the embodiment, the lower limiting tongue 412 is located on the opposite side of the base 430. For example, the arm 414 is located at the side edge of the base 430, and the finger 416 extends inward from the arm 414. The recess 410 is located inside the arm 414. The recess 410 receives the upper limiting tongue 312 of the upper spacer 322. The lower limiting tongue 412 and the upper limiting tongue 312 work together to limit the separation of the upper plate 300 and the lower plate 400 against the opening force of the elastic element 206. For example, the fingers 316, 416 can directly engage with each other to position the upper plate 300 relative to the lower plate 400. The fingers 316, 416 can engage the bridge frame 208 to stop separation.

[0050] In one exemplary embodiment, a first bridge portion 432 defines an overlapping region 442 at a side 404 of the lower bridge plate 420, and a second bridge portion 434 defines an overlapping region 444 at a side 404 of the lower bridge plate 420. The overlapping regions 442 and 444 are configured to overlap with the overlapping regions 342 and 344 of the adjacent upper bridge plate 320. The overlapping regions 442 and 444 provide a large surface area for thermal coupling to the upper bridge plate 320. The overlapping regions 442 and 444 are configured to overlap with the overlapping regions 342 and 344 by an overlap distance sufficient to allow efficient heat transfer between the lower plate 400 and the upper plate 300. The sides of the plurality of plates can slide relative to each other to allow movement between the upper plate 300 and the lower plate 400 and to change the overlap distance.

[0051] Referring to Figure 4, each lower spacer 422 includes a spacer base 450 at its outer end 408 and a spacer tongue 452 extending from the spacer base 450. The spacer tongue 452 extends from the inner end 406 of the lower spacer 422. The spacer tongue 452 may be centered generally along the spacer base 450. In one exemplary embodiment, the spacer tongue 452 is configured to align with, for example, an upper gap 336 of the corresponding upper bridge plate 320, such as to be received in the upper gap 336. The spacer tongue 452 may be guided into the upper gap 336 by an edge 338. The edge 338 may be chamfered to guide the spacer tongue 452 into the upper gap 336. The top edge of the spacer tongue 452 may engage the resilient element 206 during assembly.

[0052] The lower limiting tongue 412 extends from the inner end 406 of the lower partition 422. In this embodiment, the lower limiting tongue 412 is located on the opposite side of the base 430. For example, the arm 414 is located near the side edge of the base 430 (e.g., separated inward from the edge), while the finger 416 extends outward from the arm 414. The recess 410 is located outside the arm 414. The recess 410 receives the upper limiting tongue 312 of the upper bridge plate 320. The lower limiting tongue 412 and the upper limiting tongue 312 work together to limit the separation of the upper plate 300 and the lower plate 400 against the opening force of the elastic element 206. For example, 316, 416 can directly engage with each other to position the upper plate 300 relative to the lower plate 400. The fingers 316, 416 can engage the bridge frame 208 to stop separation.

[0053] Please refer back to Figure 2. The elastic element 206 is separate and isolated from the upper bridge assembly 202 and the lower bridge assembly 204. The elastic element 206 may be an embossed component. The elastic element 206 is made of a thin metal material, making it flexible. In one exemplary embodiment, the elastic element 206 includes a plurality of elastic plates 210 disposed in a stack of elastic plates located between the upper bridge assembly 202 and the lower bridge assembly 204. In one exemplary embodiment, the elastic element 206 includes a first elastic plate 210a and a second elastic plate 210b, which are components of the first and second elastic elements 206, respectively. In this embodiment, the first elastic plate 210a and the second elastic plate 210b are stacked vertically to provide elasticity in the vertical direction. Other types of elastic elements 206, such as coil springs, leaf springs, C-slot springs, etc., may also be used in alternative embodiments. In this option, the elastic element 206 can be segmented into a plurality of elastic fingers separated by gaps, which can move independently of each other to provide independent elastic pressure.

[0054] The elastic element 206 is configured to be received in the upper gap 336 and the lower gap 436. The elastic element 206 is located between the upper plate 300 and the lower plate 400. For example, the elastic element 206 is located between the edge 438 at the top of the spacer tongue 352 and the lower gap 436, and the elastic element 206 is located between the edge 338 at the bottom of the spacer tongue 452 and the upper gap 336. The elastic plate 210 is compressible between the upper plate 300 and the lower plate 400. In the embodiment, the elastic plate 210 is a cup-shaped leaf spring, which is arranged back-to-back to form the spring element 206. The elastic plate 210 is configured in an up-facing and down-facing manner. Alternatively, multiple up-facing and down-facing elements can be configured as an elastic stack. Any number of elastic plates 210 can be provided depending on the required elastic force, the spacing between the upper plate 300 and the lower plate 400, and the size of the elastic plate 210. In alternative embodiments, other types of elastic elements can be provided.

[0055] The elastic element 206 extends between a first side portion 212 and a second side portion 214. The elastic element 206 includes tongues 216 and 218 at the first side portion 212 and the second side portion 214, respectively. The tongues 216 and 218 are used to position the elastic element 206 relative to the bridge frame 208. The tongues 216 and 218 can engage the bridge frame 208 to internally position the elastic element 206 within the thermal bridge 200. The tongues 216 and 218 can be welded to the bridge frame 208.

[0056] In one exemplary embodiment, the bridge frame 208 includes a connecting element 220 extending internally through the upper bridge assembly 202 and the lower bridge assembly 204. For example, the bridge frame 208 may include a first connecting element 220a and a second connecting element 220b, which are components of the first bridge frame 208a and the second bridge frame 208b. The connecting element 220 is configured to capture the upper plate 300 in the upper plate stack 302 and the lower plate 400 in the lower plate stack 402. In one exemplary embodiment, the connecting element 220 is received in an upper recess 310 and a lower recess 410 between the upper plate 300 and the lower plate 400. The connecting element 220 may be located between an upper limit tongue 312 and a lower limit tongue 412. For example, fingers 316, 416 may be located on opposite sides of the connecting element 220. The connecting element 220 restricts the separation of the upper plate 300 and the lower plate 400. The upper limit tongue 312 engages the connecting element 220 to restrict the upper plate 300 from separating (moving upward). The lower limit tongue 412 engages the connecting element 220 to restrict the lower plate 400 from separating (moving downward).

[0057] In one exemplary embodiment, the connecting element 220 is a spar and may be referred to hereinafter as spar 220. The connecting element 220 may be coupled to a first side plate 222 or a second side plate 224 of the bridge frame 208. For example, the connecting element 220 may be latched to or welded to the first side plate 222 or the second side plate 224. In one exemplary embodiment, the connecting element 220 includes one or more upper connecting elements and one or more lower connecting elements. The upper and lower connecting elements 220 may be arranged side-by-side. The upper and lower connecting elements 220 may be received in an upper recess 310 and a lower recess 410, such as between fingers 316, 416.

[0058] In one exemplary embodiment, the bridge frame 208 includes a first side plate 222 at a first side of the upper bridge assembly 202 and a first side of the lower bridge assembly 204, and a second side plate 224 at a second side of the upper bridge assembly 202 and a second side of the lower bridge assembly 204. A connecting element 220 extends between the first side plate 222 and the second side plate 224. In various embodiments, the connecting element 220 may be integrally formed with the first side plate 222 and / or the second side plate 224. For example, the first side plate 222, the second side plate 224, and the connecting element 220 may be stamped from a sheet of metal. In alternative embodiments, the connecting element 220 may be separate from and secured to the first side plate 222 and the second side plate 224, such as by welding, crimping, latching, clamping, using fasteners, or otherwise securing the connecting element 220 to the first side plate 222 and the second side plate 224.

[0059] In one exemplary embodiment, the connecting element 220 is a flat, planar spar configured to pass through the upper plate 300 and the lower plate 400. For example, the connecting element 220 may be formed from a sheet of metal by stamping. The connecting element 220 is typically rectangular in cross-section. However, other types of connecting elements 220 may be used in alternative embodiments. For example, the connecting element 220 may be a round or square pin formed by an extrusion process. Other types of connecting elements 220 may be used in alternative embodiments. In other embodiments, the bridge frame 208 may include a first side plate 222 and a second side plate 224 without using the connecting element 220.

[0060] Figure 5 is a cross-sectional view of a portion of a thermal bridge 200 according to an exemplary embodiment, showing the elastic element 206 and bridge frame 208 relative to the upper plate 300 and lower plate 400 of the second pair 234. Figure 6 is an enlarged view of a portion of the thermal bridge 200 shown in Figure 5. Figure 7 is a cross-sectional view of a portion of a thermal bridge 200 according to an exemplary embodiment, showing the elastic element 206 and bridge frame 208 relative to the upper plate 300 and lower plate 400 of the first pair 232. Figure 8 is an enlarged view of a portion of the thermal bridge 200 shown in Figure 7. Figures 7 and 8 show the upper spacer 322 and the lower bridge plate 420. Figures 5 and 6 show the upper bridge plate 320 and the lower spacer 422.

[0061] During assembly, the elastic element 206 is located between the upper plate 300 and the lower plate 400. The elastic element 206 offsets and separates the upper plate 300 and the lower plate 400 from each other. The upper limit tongue 312 and the lower limit tongue 412 control the positioning of the upper plate 300 and the lower plate 400 in the plate stack. For example, the upper limit tongue 312 and the lower limit tongue 412 restrict the separation of the upper plate 300 and the lower plate 400 at a predetermined outer limit. The elastic element 206 is compressible between the upper plate 300 and the lower plate 400, such as when mating with the electrical component 102 and the heat transfer device 106.

[0062] Referring to Figure 5, the lower partition plate 422 is aligned with the upper bridge plate 320. The spacer tongue 452 is aligned with the upper gap 336. When the thermal bridge 200 is compressed or expands, the spacer tongue 452 can move in / out of the upper gap 336 and / or move within it. The edge 338 of the upper gap 336 guides the spacer tongue 452 within the upper gap 336. Referring to Figure 7, the upper partition plate 322 is aligned with the lower bridge plate 420. The spacer tongue 352 is aligned with the lower gap 436. When the thermal bridge 200 is compressed or expands, the spacer tongue 352 can move in / out of the lower gap 436 and / or move within it. The edge 438 of the lower gap 436 guides the spacer tongue 352 within the lower gap 436.

[0063] The resilient element 206 is received in the upper gap 336 between the upper plate 300 and the lower plate 400. The resilient element 206 presses down the upper plate 300 in an upward offset direction and the lower plate 400 in a downward offset direction. The resilient element 206 tends to separate the upper plate 300 from the lower plate 400 to press the upper plate 300 into thermal engagement with the heat transfer device 106 and the lower plate 400 into thermal engagement with the electrical component 102. The upper plate 300 and the lower plate 400 can move independently relative to each other and relative to adjacent upper plates 300 and lower plates 400. The upper plate 300 is configured to float relative to the lower plate 400, and the resilient element 206 allows the upper plate 300 and the lower plate 400 to float. Therefore, the upper mating interface is compliant with the heat transfer device 106, and the lower mating interface is compliant with the electrical component 102.

[0064] Bridge frame 208 is located between upper plate 300 and lower plate 400. For example, connecting element 220 extends from first side plate 222 at its end and passes through upper recess 310 and lower recess 410 (e.g., through the entire stack). Upper limit tongue 312 and lower limit tongue 412 intersect connecting element 220 to position upper plate 300 and lower plate 400 relative to each other and define outward extension limits of upper plate 300 and lower plate 400 relative to each other. For example, stop surface 318 of upper limit tongue 312 (e.g., top surface of finger 316) engages lower surface of connecting element 220, while stop surface 418 of lower limit tongue 412 (e.g., top surface of finger 416) engages upper surface of connecting element 220. Connecting element 220 limits the separation of upper plate 300 and lower plate 400 from each other. The elastic element 206 presses upward against the upper plate 300 until the stop surface 318 engages with the connecting element 220. The elastic element 206 presses downward against the lower plate 400 until the stop surface 418 engages with the connecting element 220.

[0065] Figure 9 is a cross-sectional view of a portion of a thermal bridge 200 according to an exemplary embodiment, showing the thermal bridge 200 in a compressed state. In the compressed state (compared to the expanded state shown in Figures 5 and 7), the elastic element 206 is compressed between the upper plate 300 and the lower plate 400. When connected to electrical components and / or heat transfer devices 106, the upper plate 300 and / or the lower plate 400 can move relative to each other to the compressed position. For example, the bases move toward each other in the compressed state.

[0066] When compressed, the upper limit tongue 312 moves relative to the lower limit tongue 412. For example, the finger 316 moves away from the finger 416, increasing the gap between the stop surfaces 318 and 418. The gap or interval between the fingers 316 and 416 increases under compression. The upper finger 316 can move away from the connecting element 220, and / or the lower finger 416 can move away from the connecting element 220.

[0067] Figure 10 is a cross-sectional view of a portion of the thermal bridge 200, showing the thermal bridge 200 according to an exemplary embodiment. Figure 10 illustrates the thermal bridge 200, which has an elastic element 206 located between the upper plate 300 and the lower plate 400. The thermal bridge 200 is configured without the connecting element 220 (shown in Figure 5). Conversely, the upper limit tongue 312 directly engages the lower limit tongue 412 in the extended state to restrict the separation of the upper plate 300 and the lower plate 400. The stop surfaces 318, 418 directly engage with each other in the extended state.

[0068] 100: Communication System 102: Electrical components 104: Lower heating interface 106: Heat transfer device 108: Upper heating interface 110: Circuit board 200: Thermal Bridge 202: Upper Bridge Assembly 204: Lower Bridge Assembly 206: Elastic element 206a: First elastic element 206b: Second elastic element 208: Bridge frame 208a: First bridge frame 208b: Second bridge frame 210: Flexible plate 210a: First elastic plate 210b: Second elastic plate 212: First side 214: Second side 216: Tongue part 218:Language 220: Connecting element / spar 220a: First connecting element 220b: Second connecting element 222: First side plate 224: Second side panel 230: Paired boards 232: The first pair 234: The second pair 270: Top 272: Bottom 274: Front 276: Rear 280: First side 282: Second side 300:On the board 302: Upper plate stack 304: Side 306: Internal end 308: External 310: Upper concave part 312: Upper limit tongue part 314: Arm 316: Finger part 318: Stop surface 320: Upper bridge plate 322: Upper partition 330: Base 332: First Bridge Section 334: The Second Bridge Section 336: Upper gap 338: Edge 342: Overlapping region 344: Overlapping region 350: Base 352: Spacing protrusion 400: Lower plate 402: Lower plate stack 404: Side 406: Internal end 408: External 410: concave part 412: Lower limit protruding tongue 414: Arm 416: Finger part 418: Stop surface 420: Lower bridge plate 422: Lower partition plate 430: Base 432: First Bridge Section 434: Second Bridge Section 436: Lower gap 438: Edge 442: Overlapping region 444: Overlapping region 450: Base 452: Spacing protrusion

Claims

1. A thermal bridge (200) comprising: an upper bridge assembly (202) including a plurality of upper plates (300) disposed in an upper plate stack (302), each upper plate having a front end and a rear end, each upper plate having a plurality of sides (304) between the front end and the rear end, each upper plate having an inner end (306) and an outer end (308); a lower bridge assembly (204) including a plurality of lower plates (400) disposed in a lower plate stack (402), each lower plate having a front end and a rear end, each lower plate having a plurality of sides (344) between the front end and the rear end, each lower plate having an inner end (406) and an outer end (408), the outer ends of the lower plates being configured to face and thermally couple to an electrical component (102), the sides of the lower plates facing the sides of the upper plates to thermally interface the lower plates and the upper plates; An elastic element (206) is disposed between the upper bridge assembly and the lower bridge assembly. The elastic element includes an upper elastic member engaging the upper plates and deflecting the upper plates with an opening force generally away from the lower plates. The elastic element also includes a lower elastic member engaging the lower plates and deflecting the lower plates with an opening force generally away from the upper plates. The upper plates and the lower plates are configured as a pair (230). The elastic element forces the upper plates of the pair of plates to separate from the lower plates. The upper plates include an upper limit tongue (312), and the lower plates include a lower limit tongue (412). The upper limit tongue and the lower limit tongue are configured to limit the separation of the upper plates and the lower plates against the opening force of the elastic element.

2. The thermal bridge (200) as described in claim 1, wherein the upper limit tongue (312) and the lower limit tongue (412) include vertical movement of the upper plate (300) and the lower plate (400) in a predetermined restricted space.

3. The thermal bridge (200) as described in claim 1, wherein the upper plate (300) includes an upper recess (310) with an upper limit tongue (312) extending along a bottom of the upper recess, the upper recess receiving the lower limit tongue (412) of the corresponding lower plate (400) of the pair of plates (230), the lower plate including a lower recess (410) with the lower limit tongue (412) extending along a top of the lower recess, the lower recess receiving the upper limit tongue of the corresponding upper plate of the pair of plates.

4. The thermal bridge (200) as described in claim 1, wherein the upper limit tongue (312) is located at the front end and the rear end of the upper plate (300), and the lower limit tongue (412) is located at the front end and the rear end of the lower plate (400).

5. The thermal bridge (200) as described in claim 1, wherein the upper limit tongue (312) is hook-shaped, which causes the corresponding lower limit tongue (412) to engage in the recess of the hook-shaped upper limit tongue.

6. The thermal bridge (200) as described in claim 1, wherein the upper limit tongue (312) directly interfaces with the lower limit tongue (412) to restrict the separation of the upper plate (300) and the lower plate (400).

7. The thermal bridge (200) as described in claim 1, wherein the upper limit tongue (312) and the lower limit tongue (412) are connected by an intermediate structure to restrict the separation of the upper plate (300) and the lower plate (400).

8. The thermal bridge (200) as described in claim 1 further includes a bridge frame (208) including a wing beam (220) that passes through the thermal bridge (200) between the upper plate stack (302) and the lower plate stack (402), wherein the upper limit tongues (312) are configured to engage the wing beam to limit separation between the upper plates (300) and the lower plates (400), and the lower limit tongues (412) are configured to engage the wing beam to limit separation between the upper plates and the lower plates.

9. The thermal bridge (200) as described in claim 8, wherein the spar (220) includes an upper surface and a lower surface, the upper limit tongues (312) extending below the spar to engage the lower surface, and the lower limit tongues (412) extending above the spar to engage the upper surface.

10. The thermal bridge (200) as claimed in claim 1, wherein the upper bridge assembly (202) includes an upper thermal interface configured to be thermally coupled to a heat transfer device (106), the upper plates (300) and the lower plates (400) being movable relative to each other, movable relative to the electrical component (102), and movable relative to the heat transfer device.

11. The thermal bridge (200) as claimed in claim 1 further includes a bridge frame (208) comprising a first side plate (222) at a first side of the upper bridge assembly and a first side of the lower bridge assembly (204) and a second side plate (224) at a second side of the upper bridge assembly (202) and a second side of the lower bridge assembly, the upper plates being held between the first side plate and the second side plate in the upper plate stack (302), and the lower plates being held between the first side plate and the second side plate in the lower plate stack (402).

12. The thermal bridge (200) as claimed in claim 1, wherein the upper plates (300) include a plurality of upper overlapping regions and the lower plates (400) include a plurality of lower overlapping regions, the upper bridge assembly (202) and the lower bridge assembly (204) being nested such that the upper overlapping regions thermally interface with the lower overlapping regions to thermally couple the upper plates and the lower plates.

13. The thermal bridge (200) as claimed in claim 1, wherein the upper plates (300) include an upper bridge plate (320) and an upper spacer (322) between the upper bridge plates, the lower plates (400) include a lower bridge plate (420) and a lower spacer (422) between the lower bridge plates, the upper bridge plates being aligned with the lower spacers, and the lower bridge plates being aligned with the upper spacers.

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