Processing unit

Abstract

[Problem] In the case of arranging a suction device in a machining device such as a grinding device, reduce the vibration transmitted from the suction device to the machining device. [Solution] A machining device unit is provided, comprising: a machining device including a chuck table for suction and holding a workpiece and a machining unit for machining the workpiece held by the chuck table; a suction device for supplying negative pressure to the chuck table; a first base for supporting the machining device; and a second base for supporting the suction device. The second base has a plurality of retractable legs at its bottom, which are configured to pass through a through hole in the first base without contacting the first base. When transporting the machining device and the suction device, the second base can be supported by the first base by shortening the protruding length of each of the plurality of legs. When the machining device and the suction device are placed on the ground, the protruding length of each of the plurality of legs is extended, thereby allowing the second base to stand independently without contacting the first base.

Description

Technical Field

[0001] The present invention relates to a processing device unit equipped with a processing device and a suction device. The processing device includes a chuck table for sucking and holding a workpiece and a processing unit for processing the workpiece sucked and held by the chuck table. The suction device supplies negative pressure to the chuck table. Prior Art

[0002] In the process of manufacturing semiconductor device wafers, after multiple devices are formed on the front side of a wafer such as a single crystal silicon substrate, the back side of the wafer is ground and thinned in order to make the final manufactured semiconductor device wafer the target thickness.

[0003] A grinding device is used to thin wafers. The grinding device has a circular chuck table that can rotate while holding the wafer under suction. The chuck table has a circular frame with a circular porous plate fixed to a circular recess formed in the center of the frame.

[0004] The upper surface of the frame is roughly flush with the upper surface of the multi-hole plate, functioning as a holding surface for suctioning and holding the wafers. A suction device, such as a vacuum pump, provided separately from the grinding device is connected to the multi-hole plate via a tube (see, for example, Patent Document 1). The negative pressure generated by the suction device is transmitted to the multi-hole plate via the tube.

[0005] While grinding machines and suction machines are typically sold, transported, and installed separately, the suction machine is also required when using the grinding machine. Packing and transporting the grinding machine and suction machine separately is more time-consuming and labor-intensive than packaging and transporting them together. Furthermore, starting the grinding machine requires proper connection of the grinding machine and suction machine using tubing and electrical wiring.

[0006] In contrast, if the suction device is placed inside the grinding device and fixed relative to the grinding device, and the grinding device and the suction device are further packaged and transported in a state where they are appropriately connected with pipes, electrical wiring, etc., the connection operation can be omitted and the time and labor for packaging can be reduced.

[0007] However, if the suction device is placed inside the grinding device and is operated while being fixed relative to the grinding device, there is a problem that the vibration generated by the suction device is transmitted to the grinding device, causing defects such as cracks and breakage in the wafer being ground by the grinding device. [Conventional technical literature] [Patent Document]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-124701 Summary of the Invention

[0009] [Problems to be Solved by the Invention] The present invention is completed in view of the above-mentioned problems, and its purpose is to reduce the vibration transmitted from the suction device to the processing device when the suction device is arranged in a processing device such as a grinding device.

[0010] [Technical means to solve the problem] According to one aspect of the present invention, a processing device unit is provided, which comprises: a processing device, which includes a chuck table for sucking and holding a workpiece and a processing unit for processing the workpiece sucked and held by the chuck table; a suction device, which supplies negative pressure to the chuck table; a first base, which supports the processing device; and a second base, which supports the suction device, the second base having a plurality of legs that can be respectively extended and retracted at the bottom, the plurality of legs being configured to pass through a through hole provided in the first base without contacting the first base, when transporting the processing device and the suction device, the second base can be supported by the first base by shortening the protruding length of each of the plurality of legs, and when the processing device and the suction device are set on the ground, the protruding length of each of the plurality of legs is extended, whereby the second base is free-standing without contacting the first base.

[0011] Preferably, each of the plurality of legs has a shaft portion having a spiral groove formed therein, and the protruding length of each shaft portion can be changed by rotating each shaft portion.

[0012] Preferably, the processing unit has a spindle and processes the workpiece held by the chuck table by a processing tool installed on the spindle, or the processing unit has a laser beam irradiation unit and processes the workpiece held by the chuck table by irradiating the workpiece with a laser beam.

[0013] [Effects of the invention] A processing device unit according to one embodiment of the present invention comprises: a first base supporting a processing device; and a second base supporting a suction device. The second base has a plurality of legs at its bottom that are individually retractable.

[0014] When transporting the processing device and suction device, the protruding length of each leg of the second base is shortened, allowing the second base to be supported by the first base. Conversely, when the processing device and suction device are placed on the ground, the protruding length of each leg of the second base is extended, allowing the second base to stand independently without contact with the first base.

[0015] Furthermore, the legs of the second base, which is installed on the ground, are arranged so as not to contact the first base but to pass through the through-hole formed in the first base. Therefore, the vibration transmitted from the suction device to the processing device can be reduced. Simple diagram description

[0016] FIG1 is a perspective view of a grinding device unit. FIG2 is a perspective view of the first base and the second base. FIG3 is a partial cross-sectional side view of the vicinity of the through hole of the first base. FIG4 is a partial cross-sectional side view of the suction device etc. arranged on the ground. FIG5 is a perspective view of the first base and the second base when the grinding device and the suction device are transported integrally. FIG6 is a partial cross-sectional side view of the attraction device supported by the first base. Implementation Method

[0017] An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. FIG1 is a perspective view of a grinding device unit (processing device unit) 2. The X-axis (left-right direction), Y-axis (front-back direction), and Z-axis (grinding feed direction, vertical direction, and height direction) shown in FIG1 are orthogonal to each other.

[0018] The grinding device unit 2 includes a grinding device (processing device) 4 for grinding (processing) a wafer (workpiece) 11. Each component of the grinding device 4 is supported by a first base 6 formed by assembling a frame 6a into a rectangular parallelepiped shape.

[0019] In addition, although external covers, doors, etc. for constituting a frame are provided on the side and top of the first base 6, the external covers, doors, etc. provided on the substantially upper half of the first base 6 are omitted in FIG. 1 .

[0020] A leg portion 6b is provided at each of the four corners of the bottom of the first base 6. Leg portion 6b has a shaft portion 6c with a spiral groove formed on its side. A disc-shaped pedestal portion 6d is fixed to the bottom of shaft portion 6c, which contacts the floor A in a clean room or other room.

[0021] The shaft portion 6c is rotatably coupled to a screw hole (not shown) formed in the frame 6a. By rotating the shaft portion 6c, the height of the first base 6 relative to the ground A can be adjusted. Furthermore, the number of legs 6b may be four or more.

[0022] A horizontal multi-jointed robot arm 8 for transporting wafers 11 is provided on the front side (one side in the Y-axis direction) of the rectangular first space defined by the first base 6. Cassette placement areas 10a and 10b are located on both sides of the robot arm 8 in the X-axis direction.

[0023] A cassette 12 a capable of accommodating one or more wafers 11 is arranged in the cassette arrangement area 10 a , and a cassette 12 b capable of accommodating one or more wafers 11 is also arranged in the cassette arrangement area 10 b .

[0024] The wafer 11 has a predetermined diameter (eg, approximately 200 mm) and is primarily formed of single-crystal silicon. A plurality of predetermined dividing lines (dicing streets) are set in a grid pattern on the front side of the wafer 11.

[0025] An IC (Integrated Circuit) or other element (not shown) is formed in each of the rectangular regions divided by the plurality of dividing lines. In contrast, no element is formed on the back side of the wafer 11.

[0026] Furthermore, there are no restrictions on the type, quantity, shape, structure, size, and arrangement of the components formed on the wafer 11. There is also no restriction on the type, material, size, shape, and structure of the wafer 11.

[0027] A positioning mechanism 14 is provided on the rear side (the other side in the Y-axis direction) of the cassette 12a. The wafers 11 contained in the cassette 12a are transported to the positioning mechanism 14 by the robot arm 8 and positioned at a predetermined position by the positioning mechanism 14.

[0028] A base end portion of a loading arm 16 for transporting the wafer 11 is provided adjacent to the alignment mechanism 14 in the X-axis direction. The loading arm 16 includes a suction pad for sucking and holding the wafer 11 at its front end portion.

[0029] The loading arm 16 holds the wafer 11 aligned by the alignment mechanism 14 by suction pads, and then rotates around the rotation axis at the base end to transport the wafer 11 to the chuck table 18 located at the loading and unloading position B.

[0030] A disk-shaped rotating table 20 is provided behind the loading arm 16. A rotation drive source such as a motor (not shown) is connected to the lower portion of the rotating table 20. The rotation drive source rotates the rotating table 20 around a rotation axis substantially parallel to the Z-axis direction.

[0031] Three chuck tables 18 are arranged on the turntable 20 at approximately equal intervals along the circumference of the turntable 20 to respectively attract and hold the wafer 11. Each chuck table 18 is positioned at a loading / unloading position B, a rough grinding position C, and a fine grinding position D as the turntable 20 rotates.

[0032] For example, the chuck table 18 positioned at the loading and unloading position B is positioned at the rough grinding position C by rotating the rotary table 20 120 degrees clockwise in a plan view.

[0033] Next, the chuck table 18 is positioned at the fine grinding position D by rotating the rotary table 20 another 120 degrees clockwise in a plan view, and then the rotary table 20 is rotated 240 degrees counterclockwise in a plan view to return to the loading and unloading position B.

[0034] The chuck table 18 comprises a disc-shaped frame formed of non-porous ceramic. A disc-shaped recess is formed in the upper portion of the frame, and a disc-shaped porous plate is fixed to the recess. The disc-shaped porous plate has an outer diameter that is approximately the same as the inner diameter of the recess formed of the porous ceramic.

[0035] The porous plate is connected to the suction device 52 described later through a flow path (not shown) formed in the frame and a tube (not shown) connected to the frame. The negative pressure generated by the suction device 52 is transmitted to the porous plate.

[0036] The top surface of the ceramic plate is roughly flush with the top surface of the frame, serving as a holding surface for attracting and holding wafer 11. The holding surface has a conical shape with the center slightly protruding from the periphery. However, the amount of protrusion is as small as 20 μm, for example.

[0037] The rotation axis of the chuck table 18 is slightly inclined relative to the Z-axis and is positioned approximately parallel to a portion of the holding surface and the grinding surface defined by the lower surfaces of multiple grinding stones (described later). A rotational drive source such as a motor (not shown) is connected to the rotation axis, allowing the chuck table 18 to rotate about this axis.

[0038] A columnar first support structure 22a is provided behind the rough grinding position C, and a first grinding feed unit 24a is provided in front of the first support structure 22a. Similarly, a columnar second support structure 22b is provided behind the fine grinding position D, and a second grinding feed unit 24b is provided in front of the second support structure 22b.

[0039] The first grinding and feeding unit 24a and the second grinding and feeding unit 24b each include a pair of guide rails 26 arranged substantially parallel to the Z-axis direction. A moving plate 28 is mounted on the pair of guide rails 26 so as to be slidable along the guide rails 26 .

[0040] A nut portion (not shown) is provided on the rear side of the movable plate 28 , to which a screw shaft 30 arranged substantially parallel to the guide rail 26 is rotatably connected via a plurality of balls (not shown).

[0041] A motor 32 such as a stepping motor is connected to the upper end of the screw shaft 30. When the screw shaft 30 is rotated by the motor 32, the moving plate 28 moves along the Z-axis direction.

[0042] A rough grinding unit (processing unit) 34a for rough grinding the wafer 11 is fixed to the front surface side of the movable plate (not shown) of the first grinding and feeding unit 24a. Similarly, a fine grinding unit (processing unit) 34b for fine grinding the wafer 11 is fixed to the front surface side of the movable plate 28 of the second grinding and feeding unit 24b.

[0043] The rough grinding unit 34a and the fine grinding unit 34b each include a cylindrical spindle housing 36. The spindle housing 36 houses a portion of a cylindrical spindle 36a disposed along the Z-axis direction.

[0044] A motor such as a servo motor (not shown) is provided near the upper end of the main shaft 36 a . The lower end of the main shaft 36 a protrudes downward from the lower end of the main shaft housing 36 .

[0045] The center of the upper surface of the disc-shaped mounting member 42 is fixed to the lower end of the spindle 36a. A rough grinding wheel (processing tool) 44a is mounted on the lower surface of the mounting member 42 of the rough grinding unit 34a. The rough grinding wheel 44a includes an annular base having approximately the same diameter as the mounting member 42.

[0046] On the underside of the annular base, a number of roughly rectangular rough grinding stones are arranged at approximately equal intervals along the circumference of the annular base. These rough grinding stones are formed by abrasive grains such as diamond or cBN (cubic boron nitride) fixed to a bonding material such as metal, resin, or vitrified bond.

[0047] A finishing grinding wheel (processing tool) 44b is mounted on the lower surface side of the mounting member 42 of the finishing grinding unit 34b. The finishing grinding wheel 44b is substantially the same as the rough grinding wheel 44a.

[0048] However, a plurality of finishing grinding stones each having an average grain size smaller than that of the roughing grinding stone are arranged at substantially equal intervals along the circumferential direction of the annular base of the finishing grinding wheel 44b.

[0049] A grinding water supply nozzle (not shown) for supplying grinding water, such as pure water, is located directly below each of the rough grinding unit 34a and the fine grinding unit 34b. Furthermore, a thickness gauge 46 is located near each chuck table 18 positioned at the rough grinding position C and the fine grinding position D to measure the thickness of the wafer 11 during grinding.

[0050] When performing rough grinding, first, the front side of the wafer 11 is sucked and held by the chuck table 18 disposed at the loading and unloading position B. Then, the rotary table 20 is rotated to move the chuck table 18 to the rough grinding position C.

[0051] While the chuck table 18 and the spindle 36a of the rough grinding unit 34a are rotated at predetermined rotational speeds, the rough grinding unit 34a is fed downward for processing. When the grinding surfaces defined by the lower surfaces of the plurality of rough grinding grindstones rotating about the spindle 36a come into contact with the back side of the wafer 11, the back side is rough-ground by the rough grinding wheel 44a.

[0052] In addition, during the rough grinding, grinding water is supplied to the processing area where the wafer 11 contacts the rough grinding stone. After the rough grinding, the chuck table 18 at the rough grinding position C is moved to the fine grinding position D.

[0053] Thereafter, the chuck table 18 and the spindle 36a of the fine grinding unit 34b are rotated at predetermined rotational speeds, while the fine grinding unit 34b is fed downward for machining.

[0054] When the grinding surfaces defined by the bottom surfaces of the plurality of lapping stones rotating about the spindle 36a come into contact with the back side of the wafer 11, the back side is lapping by the lapping wheel 44b. During lapping, grinding water is supplied to the processing area where the wafer 11 and the lapping stones come into contact.

[0055] An unloading arm 48 is provided at a position adjacent to the loading arm 16 in the X-axis direction. The unloading arm 48 has a suction pad for sucking and holding the wafer 11.

[0056] After fine grinding, the unloading arm 48 attracts and holds the wafer 11 disposed on the chuck table 18 at the loading and unloading position B with a suction pad, and transports the wafer 11 to the cleaning unit 50 .

[0057] The cleaning unit 50 includes a rotating table that suctions and holds the wafers 11. A cleaning nozzle for supplying pure water and an air nozzle for supplying dry air are located near the rotating table. After being spin-cleaned and dried in the cleaning unit 50, the wafers 11 are transferred by the robot arm 8 and stored in their original cassettes 12a.

[0058] Negative pressure is supplied from the suction device 52 to the suction pads of the chuck table 18, the loading arm 16, and the unloading arm 48. The suction device 52 includes a suction source (not shown) such as a vacuum pump for generating negative pressure.

[0059] Since the suction source is typically a fluid machine that generates negative pressure by rotating rotor blades or vanes, the suction device 52 vibrates as the suction source operates. The various components of the suction device 52 are supported by a second base 54 formed by assembling a frame 54a into a rectangular parallelepiped shape (see Figure 2).

[0060] 2 is a perspective view of the first base 6 and the second base 54. The second rectangular parallelepiped space defined by the second base 54 is smaller than the first space defined by the first base 6. The second base 54 is disposed in the lower portion of the front side of the first space of the first base 6.

[0061] The second base 54 also has exterior covers and doors on its sides and top to form a frame, but these are omitted in Figure 2 . Legs 54b are provided at each of the four corners of the bottom of the second base 54. Each leg 54b is positioned so as to extend through a through-hole 6e (see Figure 3 ) provided in the frame 6a of the first base 6.

[0062] FIG3 is a partial cross-sectional side view of the vicinity of through-hole 6e of first base 6. As shown in FIG3 , the diameter of through-hole 6e is larger than the diameter of shaft portion 54c of leg portion 54b, allowing shaft portion 54c to be inserted into through-hole 6e without contacting frame 6a (i.e., first base 6).

[0063] A spiral groove is formed on the side of the shaft portion 54c, and the shaft portion 54c is rotatably connected to a screw hole (not shown) formed in the frame 54a. By rotating the shaft portion 54c, the protruding length 54e of the shaft portion 54c relative to the frame 54a is changed.

[0064] A disc-shaped pedestal 54d, which contacts the floor A within a clean room or other indoor space, is fixed to the bottom of the shaft 54c. Each pedestal 54d is located below each frame 6a. For example, when an operator rotates the pedestal 54d using a tool, the shaft 54c rotates, and the protruding length 54e expands or contracts.

[0065] FIG4 is a partial cross-sectional side view of the suction device 52 and the like installed on the floor A. When the grinding device 4 and the suction device 52 are installed on the floor A, the leg portion 6b of the grinding device 4 is positioned on the floor A, and as shown in FIG4 , the protruding length 54e of each shaft portion 54c is extended.

[0066] Thus, the suction device 52 is supported by the ground A via the legs 54 b. In particular, the second base 54 is free-standing without contacting the first base 6 .

[0067] Furthermore, the frame 54a and the exterior cover of the second base 54 do not contact the frame 6a and the exterior cover of the first base 6, and the shaft portion 54c of the second base 54 does not contact the frame 6a of the first base 6 in the through hole 6e.

[0068] Therefore, even if the suction device 52 is operated, the vibration transmitted from the suction device 52 to the grinding device 4 can be reduced compared to the case where the second base 54 is in contact with the first base 6.

[0069] In contrast, when the grinding device 4 and the suction device 52 are transported, the protruding length 54e of each shaft portion 54c of the second base 54 is shortened, so that the base portion 54d is lifted from the ground A, and the second base 54 is supported by the first base 6.

[0070] FIG5 is a perspective view of the first base 6 and the second base 54 when the grinding device 4 and the suction device 52 are transported integrally. FIG6 is a partial cross-sectional side view of the suction device 52 supported by the first base 6.

[0071] In this embodiment, the grinding device 4 and suction device 52 can be packaged and transported together while being properly connected by tubing, electrical wiring, etc. This eliminates the need for connection work and reduces packaging time and effort. Furthermore, the vibration transmitted through the tubing, electrical wiring, etc. is negligibly small compared to the vibration transmitted when the frames 6a and 54a are in contact with each other.

[0072] The grinding device unit 2 includes a control unit (not shown) that controls the operation of the grinding device 4 and the suction device 52. The control unit is composed of a computer including a processor (processing device) such as a CPU (Central Processing Unit) and a memory (storage device).

[0073] Memory devices include main memory devices such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), and ROM (Read Only Memory), as well as auxiliary memory devices such as flash memory, hard disk drives, and solid-state drives. Auxiliary memory devices store predetermined software. By following this software and operating the processing device, the control unit's functions are realized.

[0074] As described above, in the grinding device unit 2 of this embodiment, when transporting the grinding device 4 and the suction device 52, the second base 54 is supported by the first base 6 by shortening the protruding length 54e of each shaft portion 54c, thereby supporting the suction device 52 by the first base 6 of the grinding device 4.

[0075] In contrast, when the grinding device 4 and the suction device 52 are installed on the floor A, by extending the protruding length 54e of each shaft portion 54c, the second base 54 is free from contact with the first base 6 and stands independently of the first base 6. This reduces the vibration transmitted from the suction device 52 to the grinding device 4.

[0076] Furthermore, the structures and methods of the above-described embodiments may be appropriately modified and implemented without departing from the scope of the present invention. For example, a grinding device, a lathe cutting device, a cutting device, or a laser processing device (none of which are shown) may be used as the processing device in place of the grinding device 4.

[0077] (Variation 1) The following describes a case where a grinding device is used as a processing device. The grinding device includes a grinding unit (processing unit). The grinding unit, chuck table, and other components of the grinding device are supported by the first base 6 described above. The grinding unit includes a spindle arranged along the Z-axis direction.

[0078] A rotational drive source, such as a motor, is provided near the upper end of the spindle, and a disc-shaped grinding wheel is mounted on the lower end of the spindle through a disc-shaped mounting member. In other words, the grinding wheel (processing tool) is mounted on the spindle through the mounting member.

[0079] The grinding wheel has a disc-shaped pressure plate that contacts the mounting member. A polishing pad is fixed to the lower surface of the pressure plate. The polishing pad contains abrasive grains formed of diamond or other materials and a backing material such as foamed resin or non-woven fabric to fix the abrasive grains.

[0080] When polishing the wafer 11, the disk-shaped chuck table first sucks and holds one side of the wafer 11. Then, the chuck table is rotated, and the grinding wheel rotating around the spindle is lowered at a predetermined processing feed speed to polish the other side of the wafer 11.

[0081] (Variant 2) Next, we will describe a case where a cutting tool device is used as a processing device. The cutting tool device includes a cutting tool unit (processing unit). The cutting tool unit, chuck table, and other components of the cutting tool device are supported by the first base 6 described above.

[0082] The turning tool cutting unit has a main shaft arranged along the Z-axis direction. A rotation drive source such as a motor is provided near the upper end of the main shaft, and a circular turning tool wheel is mounted on the lower end of the main shaft through a circular mounting member.

[0083] That is, the turning wheel (processing tool) is mounted on the spindle through a mounting member. The turning wheel has a disc-shaped base, and a cutting blade formed of diamond or the like is fixed on the lower surface side of the base.

[0084] The chuck table of the turning tool cutting device has a substantially flat holding surface that is arranged substantially parallel to the XY plane. Furthermore, the chuck table is configured to perform processing feed along the X-axis direction using a ball screw-type movement mechanism.

[0085] When the wafer 11 is cut with a turning tool, first, one side of the wafer 11 is sucked and held by a disk-shaped chuck table. Then, the height position of the cutting edge of the turning wheel rotating around the main shaft is positioned at a predetermined height.

[0086] Then, the chuck table is fed from the outside of the turning tool cutting unit toward the bottom of the turning tool cutting unit in the X-axis direction, thereby performing turning tool cutting on the other side of the wafer 11.

[0087] (Variation 3) Next, a case where a cutting device is used as a processing device will be described. The cutting device includes a cutting unit (processing unit). The components of the cutting device, such as the cutting unit and the chuck table, are supported by the first base 6 described above.

[0088] The cutting unit is configured to be capable of indexing feed along the Y-axis direction and cutting feed along the Z-axis direction. The cutting unit has a main shaft arranged along the Y-axis direction.

[0089] A rotational drive source, such as a motor, is located near the base of the spindle, and a cutting blade with an annular cutting edge is mounted on the front end of the spindle via a cylindrical mounting member. In other words, the cutting blade (processing tool) is mounted on the spindle via the mounting member.

[0090] Cutting blades can be hub-type or hubless (so-called washer-type). They have a circular cutting edge. The cutting edge is formed by abrasive grains such as diamond or cBN (cubic boron nitride) fixed to a binder such as metal, resin, or vitrified bond.

[0091] The cutting device's chuck table also has a substantially flat holding surface that is arranged approximately parallel to the XY plane. Furthermore, the chuck table is configured to be capable of processing and feeding along the X-axis direction using a ball screw-type movement mechanism.

[0092] When dicing the wafer 11, first, a disk-shaped chuck table sucks and holds one side of the wafer 11. Then, the lower end of the dicing blade rotating around the main shaft is positioned at a predetermined height.

[0093] In this state, the chuck table is fed relative to the dicing blade to cut the wafer 11. By cutting, a half-cut groove from the other side (upper surface) not reaching the one side (lower surface) and a fully cut groove from the other side to the one side are formed on the wafer 11.

[0094] (Variant 4) Next, a description will be given of a case where a laser processing device is used as the processing device. The laser processing device includes a laser beam irradiation unit (processing unit). The components of the laser processing device, such as the laser beam irradiation unit and the chuck stage, are supported by the first base 6 described above.

[0095] The laser beam irradiation unit includes a laser oscillator. The laser oscillator uses Nd:YAG, Nd:YVO4, or the like as a laser medium. The laser oscillator emits a pulsed laser beam having a wavelength that can penetrate the wafer 11 (for example, 1064 nm when the wafer 11 is a silicon single crystal wafer).

[0096] The laser beam can be converted into a predetermined harmonic by passing through a nonlinear optical crystal. For example, the wavelength of the laser beam is converted into a wavelength that is absorbed by the wafer 11 (355 nm in the case where the wafer 11 is a silicon single crystal wafer).

[0097] The laser beam irradiation unit includes an irradiation head with a focusing lens. The laser beam is irradiated from the irradiation head toward the wafer 11 in a manner of focusing at a height position corresponding to the wafer 11 attracted and held by the holding surface of the chuck table.

[0098] The chuck table has a substantially flat holding surface that is arranged substantially parallel to the XY plane. Furthermore, the chuck table is configured to enable machining feed along the X-axis and indexing feed along the Y-axis using a ball screw-type movement mechanism.

[0099] When laser processing is performed on the wafer 11, first, one side of the wafer 11 is held by suction on a disk-shaped chuck stage. Then, the focal point of the laser beam is positioned inside the wafer 11 or near the other side of the wafer 11.

[0100] In this state, laser processing is performed on wafer 11 by feeding the chuck stage toward the focal point. When the laser beam has a wavelength that allows it to penetrate wafer 11, a modified region with reduced mechanical strength is formed near the focal point. When the laser beam has a wavelength that is absorbed by wafer 11, the region near the focal point is ablated.

[0101] 2: Grinding device unit (processing device unit) 4: Grinding device (processing device) 6: First base 6a: Skeleton 6b: Legs 6c: shaft 6d: pedestal part 6e:Through hole 8: Robotic Arm 10a, 10b: Cassette configuration area 12a, 12b: Cassette 11: Wafer (processed object) 14: Positioning mechanism 16: Loading arm 18: Chuck table 20: Rotating table 22a: First support structure 22b: Second support structure 24a: First grinding feed unit 24b: Second grinding feed unit 26: Guide rail 28: Mobile board 30: Screw shaft 32: Motor 34a: Rough grinding unit (machining unit) 34b: Fine grinding unit (machining unit) 36: Spindle housing 36a: spindle 42: Mounting parts 44a: Rough grinding wheel 44b: Lapping wheel 46:Thickness gauge 48: Unloading arm 50: Cleaning unit 52: Suction device 54: Second base 54a: Skeleton 54b: Legs 54c: shaft 54d:pedestal part 54e: protruding length A: Ground B: Moving in and out C: Rough grinding position D: Fine grinding position

Claims

1. A processing apparatus unit, characterized in that it comprises: a processing apparatus including a chuck table for attracting and holding a workpiece and a processing unit for processing the workpiece held by the chuck table; a suction device for supplying negative pressure to the chuck table; a first base for supporting the processing apparatus; and a second base for supporting the suction device, the second base having a plurality of retractable legs at its bottom, the plurality of legs being configured to pass through a through hole in the first base without contacting the first base; when transporting the processing apparatus and the suction device, the second base can be supported by the first base by shortening the protruding length of each of the plurality of legs; when the processing apparatus and the suction device are placed on the ground, the protruding length of each of the plurality of legs is extended, thereby allowing the second base to stand independently without contacting the first base.

2. The processing apparatus unit as described in claim 1, wherein, Each of the multiple legs has a shaft portion with a spiral groove, and the protruding length of each shaft portion can be changed by rotating each shaft portion.

3. The processing unit as described in claim 1 or 2, wherein, The machining unit has a spindle and uses a machining tool mounted on the spindle to process the workpiece held by the chuck table. Alternatively, the machining unit has a laser beam irradiation unit and processes the workpiece by irradiating it with a laser beam.

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