Resin molding apparatus and method for manufacturing resin molded articles
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- TOWA
- Filing Date
- 2024-03-12
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TB001903531_001 
Figure TWG2TB001903531_002 
Figure TWG2TB001903531_003
Abstract
Description
Resin Molding Apparatus and Method for Manufacturing Resin Molded Product The present invention relates to a technique for a resin molding apparatus and a method for manufacturing a resin molded product. In Patent Document 1, a resin molding apparatus for compression molding a workpiece is disclosed. In the resin molding apparatus described in Patent Document 1, a suction device is connected to a suction path formed in an upper mold. The suction path opens at multiple locations on the lower surface (mold surface) of the upper mold. By operating the suction device and sucking air through the suction path, the workpiece can be adsorbed and held on the upper mold. [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Laid-Open No. 2023-3677 [Problems to be Solved by the Invention] Here, for a workpiece as described in Patent Document 1, deformation (warpage) may sometimes occur due to the influence of electronic components fixed to the workpiece or the resin after molding. In the resin molding apparatus as described in Patent Document 1, if the workpiece adsorbed on the upper mold deforms away from the upper mold and the suction path is partially opened, the air pressure in the entire suction path becomes the same as the air pressure in the space below the workpiece, and the workpiece cannot be adsorbed, and there is a risk that the workpiece will fall from the upper mold. The present invention has been made in view of the above circumstances, and the problem to be solved is to provide a resin molding apparatus and a method for manufacturing a resin molded product that can prevent the molded object from falling even when the molded object warps. [Means for Solving the Problems] The problem to be solved by the present invention is as described above. To solve this problem, in the resin molding apparatus of the present invention, a molding object is disposed between an upper mold and a lower mold and compression molding is performed. In the resin molding apparatus, a plurality of adsorption holes are formed in the upper mold, and the plurality of adsorption holes are formed to open on the lower surface of the upper mold for adsorbing the molding object. The resin molding apparatus includes: a first adsorption mechanism capable of sucking air from at least one first adsorption hole among the plurality of adsorption holes; and a second adsorption mechanism capable of sucking air from at least one second adsorption hole among the plurality of adsorption holes and capable of independently sucking air through the second adsorption hole from the first adsorption mechanism. In addition, the method for manufacturing a resin molded product of the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, including: an adsorption step of adsorbing the molding object on the lower surface of the upper mold; and a mold clamping step of clamping the upper mold and the lower mold. [Effects of the Invention] According to the present invention, the molded object can be prevented from falling even when the molded object warps. <Resin Molding Apparatus 100 (First Embodiment)> First, the resin molding apparatus 100 of the first embodiment will be described with reference to FIG. 1. The resin molding apparatus 100 shown in FIG. 1 is an apparatus capable of resin molding by a compression molding method. The resin molding apparatus 100 of the present embodiment can resin-seal electronic components such as semiconductor wafers fixed to a substrate W as a molding object to manufacture a resin molded product. As the substrate W, a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate can be used. In addition, wiring may or may not be applied to the substrate W. In each of the embodiments described below, it is assumed that a circular-shaped substrate W is used. The resin molding apparatus 100 mainly includes a lower mold holder 110, an upper mold holder 120, a sealing member 130, a lower mold 140, an upper mold 150, a decompression pump 160, a central adsorption pump 170, an outer adsorption pump 180, a mold clamping mechanism 190, and the like. The lower mold holder 110 supports the lower mold 140. The lower mold holder 110 includes a bottom surface portion 110a that supports the lower mold 140 from below, and a side surface portion 110b that is formed so as to surround the lower mold 140 from the side. The upper mold holder 120 supports the upper mold 150. The upper mold holder 120 includes an upper surface portion 120a that supports the upper mold 150 from above, and a side surface portion 120b that is formed so as to surround the upper mold 150 from the side. By the lower mold holder 110 and the upper mold holder 120, a space (accommodation space) for accommodating the molding dies (the lower mold 140 and the upper mold 150) during resin molding is formed. In addition, a decompression path 121, a central adsorption path 122, and an outer adsorption path 123 are formed in the upper mold holder 120. The decompression path 121 is an air suction path for sucking air when decompressing the accommodation space of the molding dies. The decompression path 121 is formed to connect the inside of the upper mold holder 120 (the accommodation space of the molding dies) to the outside. The decompression path 121 is formed to open on the lower surface of the upper surface portion 120a at a position not overlapping with the upper mold 150 (around the upper mold 150). The central adsorption path 122 is an air suction path for sucking air when adsorbing the substrate W using the central adsorption hole 151a formed in the upper mold 150. The central adsorption path 122 is formed to connect the inside of the upper mold holder 120 (the accommodation space of the molding dies) to the outside. The central adsorption path 122 is formed to open on the lower surface of the upper surface portion 120a at a position overlapping with the central adsorption hole 151a of the upper mold 150. The outer suction path 123 is an air suction path for sucking air when sucking the substrate W using the outer suction holes 151b formed in the upper mold 150. The outer suction path 123 is formed to connect the inside of the upper mold holder 120 (the accommodation space of the forming die) with the outside. The outer suction path 123 is formed to open at the lower surface of the upper surface portion 120a at a position overlapping the outer suction holes 151b of the upper mold 150. The decompression path 121, the central suction path 122, and the outer suction path 123 are formed independently of each other (not connected to each other). Furthermore, FIG. 1 etc. are schematic diagrams, and the specific shapes of the decompression path 121, the central suction path 122, and the outer suction path 123 are not particularly limited. That is, each path can also be appropriately bent or branched as needed. The sealing member 130 is used to seal the gap between the lower mold holder 110 and the upper mold holder 120. The sealing member 130 is in a rectangular ring shape and is formed of an elastic raw material. The sealing member 130 is disposed, for example, on the bottom surface of the side surface portion 120b of the upper mold holder 120 (the portion facing the side surface portion 110b of the lower mold holder 110). When the lower mold holder 110 approaches the upper mold holder 120, the sealing member 130 is clamped between the lower mold holder 110 and the upper mold holder 120, whereby the gap between the lower mold holder 110 and the upper mold holder 120 can be sealed. Furthermore, in the illustrated example, an example in which the sealing member 130 is provided on the upper mold holder 120 is shown, but for example, the sealing member 130 can also be provided on the lower mold holder 110, or the sealing member 130 can be provided on both the lower mold holder 110 and the upper mold holder 120. In addition, a plurality of sealing members 130 can also be provided. As a first example, another sealing member 130 different from the sealing member 130 disposed between the upper mold holder 120 and the lower mold holder 110 can also be disposed at the middle portion of the side surface portion 120b of the upper mold holder 120. In this case, the other sealing member 130 is clamped by the two side surface portions 120b. As a second example, another sealing member 130 different from the sealing member 130 disposed between the upper mold holder 120 and the lower mold holder 110 can also be disposed at the middle portion of the side surface portion 110b of the lower mold holder 110. In this case, the other sealing member 130 is clamped by the two side surface portions 110b. In addition, the shape of the sealing member 130 is not limited to a rectangular ring shape, and can also be, for example, a circular ring shape. The lower mold 140 forms the lower part of the forming die. The lower mold 140 mainly includes a bottom surface member 141, a side surface member 142, an elastic member 143, etc. The bottom member 141 forms the bottom surface of the chamber C. The bottom member 141 is formed to have a circular shape in plan view. The bottom member 141 is formed to have an appropriate vertical width. The bottom member 141 is arranged in a state of being placed at the central portion of the bottom surface portion 110a of the lower mold holder 110. The side member 142 surrounds the bottom member 141 from the side. The side member 142 is in a frame shape and is formed to have an appropriate vertical width. A hollow portion penetrating the side member 142 vertically is formed in the side member 142. The hollow portion of the side member 142 is formed to have a shape that is substantially the same as the outer shape of the bottom member 141 in plan view. Thus, the side member 142 is formed in a circular frame shape in plan view. The bottom member 141 is arranged in the hollow portion of the side member 142. The side member 142 is arranged in a state of being placed on the bottom surface portion 110a of the lower mold holder 110 via the elastic member 143. The upper surface of the side member 142 is located above the upper surface of the bottom member 141. The chamber C for resin molding is defined by the side member 142, the bottom member 141, and the upper mold 150. The elastic member 143 is arranged between the side member 142 and the bottom surface portion 110a of the lower mold holder 110. The elastic member 143 is formed of, for example, a compression coil spring that can expand and contract vertically. Furthermore, suction holes (not shown) for sucking and holding a release film (not shown) are appropriately formed on the upper surface of the lower mold 140 (the bottom member 141 and the side member 142). By making the suction holes negative pressure using a pump or the like (not shown), the release film can be sucked and held. The upper mold 150 forms the upper part of the molding die. The upper mold 150 is formed to have a circular shape in bottom view. The upper mold 150 is formed to have an appropriate vertical width. The upper mold 150 is fixed to the central portion of the lower surface of the upper surface portion 120a of the upper mold holder 120. Suction holes 151 are formed in the upper mold 150. The suction holes 151 shown in FIGS. 2(a) and 2(b) are for sucking the substrate W. The suction holes 151 are formed so as to penetrate the upper mold 150 vertically. As shown in FIG. 2(b), a plurality of suction holes 151 are formed over the entire area of the range (circular range) facing the adsorbed substrate W. In the present embodiment, the plurality of suction holes 151 are classified into central suction holes 151a and outer suction holes 151b. A plurality of central suction holes 151a and outer suction holes 151b are provided respectively. The central suction hole 151a is a suction hole 151 formed within a specified range at the center (geometric center) of the shape (circular) of the substrate W in a top view. A group composed of a plurality of central suction holes 151a is formed within the specified range. In the present embodiment, the suction holes 151 inside the region L (the region indicated by the dotted line in FIG. 2(b)) that is concentric with the substrate W are set as the central suction holes 151a. The specified range corresponds to the region L. The specified range can be a range including the center (geometric center) of the region for sucking the substrate W. The outer suction hole 151b is a suction hole 151 formed around the central suction hole 151a. In the present embodiment, the suction holes 151 outside the region L (the region surrounding the region L) are set as the outer suction holes 151b. Furthermore, the central suction hole 151a and the outer suction hole 151b in the present embodiment are respectively one embodiment of the first suction hole and the second suction hole of the present invention. In a state where the upper mold 150 is mounted on the upper mold holder 120, the central suction hole 151a is connected to the central suction path 122 of the upper mold holder 120. In addition, the outer suction hole 151b is connected to the outer suction path 123 of the upper mold holder 120. The decompression pump 160 is used to suck air from the decompression path 121. The decompression pump 160 is connected to the decompression path 121 of the upper mold holder 120 via a decompression connection path 161 composed of an appropriate hose or the like. When the decompression pump 160 operates in a state where the lower mold holder 110 and the upper mold holder 120 are in close contact via the sealing member 130, the accommodation space of the molding die is decompressed via the decompression path 121. Thereby, voids generated in the resin molded product can be suppressed. Furthermore, the decompression pump 160 in the present embodiment is one embodiment of the decompression mechanism of the present invention. The central suction pump 170 is used to suck air from the central suction path 122. The central suction pump 170 is connected to the central suction path 122 of the upper mold holder 120 via a connection path 171 composed of an appropriate hose or the like. When the central suction pump 170 operates, air is sucked from the central suction hole 151a of the upper mold 150 via the central suction path 122. Thereby, the substrate W can be sucked and held by the central suction hole 151a. The outer adsorption pump 180 is used to suck air from the outer adsorption path 123. The outer adsorption pump 180 is connected to the outer adsorption path 123 of the upper mold holder 120 via a connection path 181 composed of an appropriate hose or the like. When the outer adsorption pump 180 operates, air is sucked from the outer adsorption holes 151b on the outer side of the upper mold 150 via the outer adsorption path 123. Thereby, the substrate W can be adsorbed and held on the outer adsorption holes 151b. Furthermore, the central adsorption pump 170 and the outer adsorption pump 180 are respectively one embodiment of the first pump and the second pump of the present invention. Thus, in the first embodiment, a central adsorption mechanism A for sucking air from the central adsorption holes 151a and an outer adsorption mechanism B for sucking air from the outer adsorption holes 151b are provided independently. The central adsorption mechanism A includes a central adsorption pump 170, a connection path 171, and a central adsorption path 122. The outer adsorption mechanism B includes an outer adsorption pump 180, a connection path 181, and an outer adsorption path 123. By the central adsorption mechanism A and the outer adsorption mechanism B, air can be sucked independently from each of the central adsorption holes 151a and the outer adsorption holes 151b. Furthermore, the central adsorption mechanism A and the outer adsorption mechanism B of the present embodiment are respectively one embodiment of the first adsorption mechanism and the second adsorption mechanism of the present invention. The mold clamping mechanism 190 raises and lowers the lower mold 140 to perform mold clamping and mold opening and the like. As the mold clamping mechanism 190, a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. can be used. The mold clamping mechanism 190 is disposed below the lower mold holder 110 and can raise and lower the lower mold 140 via the lower mold holder 110. Furthermore, the operations of the respective parts of the resin molding device 100 are appropriately controlled by a control device (not shown). <Manufacturing method of resin molded product> Next, an example of the manufacturing method of a resin molded product using the resin molding device 100 will be described. As shown in FIG. 3, the manufacturing method of the resin molded product of the present embodiment mainly includes: a film arranging step S10, a loading step S20, a decompression step S30, a mold clamping step S40, a resin molding step S50, a mold opening step S60, and an unloading step S70. These will be described in sequence below. The film arranging step S10 is a step of arranging a release film (not shown) on the lower mold 140. Specifically, in the film arranging step S10, the release film is carried into the molding die by a prescribed conveying device. The release film is adsorbed on the upper surface of the lower mold 140 and held in a shape along the upper surface of the lower mold 140. By providing a demolding film on the lower mold 140, adhesion of the resin material R to the surface of the lower mold 140 can be prevented. Further, in the case where foreign matter adheres to the surface of the lower mold 140 (demolding film), the foreign matter can be easily removed by replacing the demolding film. Moreover, in the film arrangement step S10, not only can a demolding film be arranged on the lower mold 140, but a demolding film can also be arranged on the upper mold 150. After the demolding film is adsorbed to the lower mold 140, it is transferred from the film arrangement step S10 to the loading step S20. The loading step S20 is a step of loading the resin material R and the substrate W into the molding die. Specifically, in the loading step S20, the resin material R is loaded into the molding die by a predetermined conveying device. As shown in FIG. 1, the resin material R is accommodated inside the lower mold 140 (inside the side member 142). Moreover, as the resin material R, various states of resin such as solid powder-like resin (including granular resin) and liquid-like resin can be used. In addition, in the loading step S20, the substrate W is loaded into the molding die by a predetermined conveying device. As shown in FIG. 1, by operating the central suction pump 170 of the central suction mechanism A and the outer suction pump 180 of the outer suction mechanism B, the substrate W is adsorbed to the suction holes 151 (central suction hole 151a and outer suction hole 151b) of the upper mold 150. Here, with respect to the substrate W, warping may occur due to the influence of the fixed electronic components or the like (difference in linear expansion coefficient). However, by adsorbing the substrate W along the lower surface of the upper mold 150 using the suction holes 151 (central suction hole 151a and outer suction hole 151b), it can be held in a state where the warping of the substrate W is corrected. Moreover, in the loading step S20, on the basis of the suction using the suction holes 151, the substrate W can also be held on the upper mold 150 by a mechanical gripper (not shown) provided on the upper mold 150. Thereby, even if an abnormality occurs in the suction using the suction holes 151 by any chance, the substrate W can be prevented from falling. In addition, the order of loading the resin material R and the substrate W is not particularly limited. Either the resin material R or the substrate W can be loaded into the molding die first, and further, the resin material R and the substrate W can also be loaded into the molding die simultaneously. Moreover, the loading step S20 of the present embodiment is an embodiment of the suction step of the present invention. After the loading of the resin material R and the substrate W is completed, it is transferred from the loading step S20 to the decompression step S30. The decompression step S30 is a step of decompressing the accommodation space of the molding die. Specifically, by driving the mold clamping mechanism 190, the lower mold holder 110 rises toward the upper mold holder 120. When the lower mold holder 110 rises to a specified position, the upper surface of the side surface portion 110b contacts the lower surface of the side surface portion 120b of the upper mold holder 120 via the sealing member 130. Thereby, the accommodation space of the molding die (lower mold 140 and upper mold 150) is sealed (refer to FIG. 4). Furthermore, in this state, the lower mold 140 and the upper mold 150 do not contact each other yet. In this state, by operating the decompression pump 160, the accommodation space of the molding die is decompressed (evacuated). Thereby, air or gas in the resin material R can be discharged, and generation of voids in the resin molded product can be suppressed. In addition, when the substrate W is held by a mechanical chuck, before the lower mold 140 and the upper mold 150 contact each other (in a state where there is a gap between the lower mold 140 and the upper mold 150), the holding by the chuck is released. Thus, by releasing the holding by the chuck in a state where there is a gap between the lower mold 140 and the upper mold 150, it is not necessary to form a recess in the lower mold 140 to avoid contact between the chuck and the lower mold 140. Thereby, the side member 142 having a small frame thickness can be used. In this case, the chamber C can be ensured to be wide. Here, when the decompression pump 160 operates to decompress the accommodation space, the air pressure difference between the upper and lower sides of the substrate W adsorbed to the upper mold 150 decreases. Specifically, the difference between the air pressure inside the adsorption hole 151 to which the substrate W is adsorbed and the air pressure on the lower side (accommodation space) of the substrate W becomes smaller. When the air pressure inside the adsorption hole 151 is smaller than the air pressure on the lower side of the substrate W, the substrate W is pressed upward from the lower side, and the substrate W is adsorbed to the upper mold 150. Regarding the adsorption force for adsorbing the substrate W, the greater the pressure difference between the air pressure inside the adsorption hole 151 and the air pressure on the lower side of the substrate W, the greater it is. If the air pressure difference between the adsorption hole 151 and the accommodation space decreases, then as described above, when the substrate W warps, the warpage of the substrate W cannot be corrected by the adsorption force of the adsorption hole 151 that decreases due to the decrease in the pressure difference, and the substrate W may move away from the upper mold 150. FIG. 4 shows an example in which the outer peripheral portion of the substrate W bends (warps) downward away from the upper mold 150. In the case where such deformation occurs, the outer adsorption holes 151b formed on the outer side among the plurality of adsorption holes 151 move away from the substrate W and are connected to the accommodation space. In this state, even if the outer adsorption pump 180 operates, the pressure difference between the air pressure in the outer adsorption hole 151b and the air pressure in the accommodation space disappears, so that the substrate W cannot be adsorbed by the outer adsorption hole 151b. However, in the present embodiment, the substrate W is adsorbed via the central adsorption hole 151a through a path independent of the outer adsorption hole 151b. Therefore, even if the outer adsorption hole 151b is connected to the accommodation space, the pressure difference between the pressure in the central adsorption hole 151a and the pressure in the accommodation space can be ensured to a certain extent, and the substrate W can be adsorbed by the central adsorption hole 151a. Thus, by adsorbing the substrate W using a plurality of independent paths, the dropping of the substrate W can be prevented. After the decompression of the accommodation space, the process transfers from the decompression step S30 to the mold clamping step S40. The mold clamping step S40 is a step of closing (clamping) the molding die (the lower die 140 and the upper die 150). Specifically, in the mold clamping step S40, first, the resin material R accommodated in the chamber C is heated by a heating mechanism (not shown) provided on the lower die 140. As the resin material R, a thermosetting resin material is used. When the temperature of the thermosetting resin material rises, the viscosity of the resin material temporarily decreases, and then the resin material hardens. When the resin material R is heated, the viscosity of the resin material R decreases. When the resin material R is a solid resin material, the resin material R melts by heating. Next, by driving the mold clamping mechanism 190, the lower die holder 110 rises while vertically compressing the sealing member 130. Along with this, the lower die 140 rises toward the upper die 150. When the lower die 140 rises to a specified position, the upper surface of the side member 142 contacts the lower surface of the upper die 150 via the substrate W, and the lower die 140 (the space accommodating the resin material R) is blocked from above by the upper die 150. Furthermore, in the present embodiment, an example where the lower die 140 contacts the upper die 150 via the substrate W is shown, but for example, the substrate W may be formed to be sized to be accommodated inside the chamber C, and the lower die 140 and the upper die 150 may be in direct contact. Furthermore, by driving the mold clamping mechanism 190, the bottom member 141 of the lower die 140 rises further toward the upper die 150. At this time, since the side member 142 contacts the upper die 150, it does not rise. That is, the bottom member 141 rises relative to the side member 142. When the bottom member 141 rises, the resin material R accommodated in the lower die 140 is pressurized. When the bottom member 141 rises to a certain extent, the mold clamping is completed. After the mold clamping is completed, the process transfers from the mold clamping step S40 to the resin molding step S50. The resin molding step S50 is a step of hardening the resin material R to perform resin molding. Specifically, in the resin molding step S50, the resin material R is held under pressure for a specified time. Thereby, the temperature of the thermosetting resin material R further rises, and the resin material R hardens. As a result, resin molding of the substrate W can be performed. After the resin material R hardens, the process transfers from the resin molding step S50 to the mold opening step S60. The mold opening step S60 is a step of opening (mold opening) the molding die (lower mold 140 and upper mold 150). Specifically, as shown in FIG. 5, in the mold opening step S60, by driving the mold clamping mechanism 190, the lower mold 140 descends in a manner away from the upper mold 150. Thereby, the lower mold 140 moves away from the lower surface of the upper mold 150. Here, due to the difference in the thermal shrinkage rates of the substrate W and the resin material R during cooling by mold opening, there is a possibility that the resin-molded substrate W (resin molded product) may be deformed (warped). For example, FIG. 5 shows an example in which the outer peripheral portion of the resin-molded substrate W is bent downward. In the case of such deformation, the outer adsorption holes 151b formed on the outer side among the plurality of adsorption holes 151 are separated from the substrate W and connected to the accommodation space. In this state, even if the outer adsorption pump 180 operates, the differential pressure between the air pressure in the outer adsorption holes 151b and the air pressure in the accommodation space disappears, so the adsorption force decreases, and the substrate W cannot be adsorbed by the outer adsorption holes 151b. However, in the present embodiment, the substrate W is adsorbed through the central adsorption hole 151a via a path independent of the outer adsorption hole 151b. Therefore, even if the outer adsorption hole 151b is connected to the accommodation space, the differential pressure between the air pressure in the central adsorption hole 151a and the air pressure in the accommodation space can be ensured to a certain extent, and the substrate W can be adsorbed by the central adsorption hole 151a. Thus, by adsorbing the substrate W using a plurality of independent paths, the substrate W can be prevented from falling. After the mold opening is completed, the process transfers from the mold opening step S60 to the unloading step S70. The unloading step S70 is a step of unloading the resin molded product from the molding die. In the unloading step S70, the resin molded product is unloaded from the molding die by a specified conveying device. Thus, in the present embodiment, before and after resin molding, even when the substrate W (resin molded product) adsorbed to the upper mold 150 is deformed, the substrate W can be prevented from falling. Furthermore, in FIG. 5 and the like, an example in which the central portion of the lower surface of the substrate W is sealed with resin is shown. However, for example, a method (overmold) in which not only the central portion of the lower surface of the substrate W but also the edge portion of the substrate W is sealed with resin can also be performed. <Resin Molding Device 200 (Second Embodiment)> Hereinafter, the resin molding device 200 of the second embodiment will be described with reference to FIG. 6. The difference between the resin molding device 200 of the second embodiment and the resin molding device 100 of the first embodiment is that two valves (the central adsorption valve 220 and the outer adsorption valve 230) can be used to suck air independently from the central adsorption hole 151a and the outer adsorption hole 151b. Therefore, the following mainly describes this difference, and the description of the same structure as that of the first embodiment is omitted. The resin molding device 200 of the second embodiment includes an adsorption pump 210, a central adsorption valve 220, and an outer adsorption valve 230. The adsorption pump 210 is used to suck air from the central adsorption path 122 and the outer adsorption path 123. The adsorption pump 210 is connected to the central adsorption path 122 and the outer adsorption path 123 of the upper mold holder 120 via a connection path 211 composed of an appropriate hose or the like. Specifically, the connection path 211 connected to the adsorption pump 210 branches into two connection paths 211a and 211b in the middle part. One of the connection paths 211a is connected to the central adsorption path 122 of the upper mold holder 120. The other connection path 211b is connected to the outer adsorption path 123 of the upper mold holder 120. Furthermore, the connection path 211b and the outer adsorption path 123 in this embodiment are one embodiment of the suction path of the present invention. The central adsorption valve 220 switches whether air flows in the connection path 211a by opening and closing the connection path 211a. The central adsorption valve 220 is provided in the middle part of the connection path 211a. The outer adsorption valve 230 switches whether air flows in the connection path 211b by opening and closing the connection path 211b. The outer adsorption valve 230 is provided in the middle part of the connection path 211b. Furthermore, the outer adsorption valve 230 in this embodiment is one embodiment of the valve of the present invention. Thus, in the second embodiment, the central adsorption valve 220, the connection path 211a, and the central adsorption path 122 (hereinafter referred to as "central adsorption mechanism A") for sucking air from the central adsorption hole 151a and the outer adsorption valve 230, the connection path 211b, and the outer adsorption path 123 (hereinafter referred to as "outer adsorption mechanism B") for sucking air from the outer adsorption hole 151b are provided independently. In addition, in the second embodiment, a common adsorption pump 210 is used, and the central adsorption mechanism A and the outer adsorption mechanism B are used to suck air. In the second embodiment configured as described above, when the substrate W is adsorbed to the upper mold 150 in the loading step S20, the adsorption pump 210 is operated with the central adsorption valve 220 and the outer adsorption valve 230 open. Thereby, the substrate W can be adsorbed to the central adsorption hole 151a and the outer adsorption hole 151b. In addition, as described above, in the pressure reduction step S30, the mold opening step S60, etc., when the outer peripheral portion of the substrate W moves away from the upper mold 150 due to the warping of the substrate W (see FIGS. 4, 5, etc.), the outer adsorption valve 230 of the outer adsorption mechanism B is closed. In this state, the substrate W can be held by the central adsorption hole 151a. In addition, even if the outer adsorption hole 151b is connected to the accommodation space due to the warping of the substrate W, by closing the outer adsorption valve 230, the differential pressure between the air pressure in the central adsorption hole 151a and the air pressure in the accommodation space can be ensured to a certain extent, and the substrate W can be prevented from falling. Furthermore, the timing for opening and closing the outer adsorption valve 230 can be arbitrarily set. For example, when the timing at which the substrate W warps is known in advance corresponding to the resin molded product to be manufactured, the outer adsorption valve 230 can be configured to be closed according to this timing. In addition, various sensors or the like can also be used to detect whether the substrate W is warped, and the operation of the outer adsorption valve 230 can be controlled corresponding to the detection result. In addition, when manufacturing a resin molded product with the central adsorption valve 220 always open (when only the outer adsorption valve 230 is opened and closed), it is not necessarily necessary to provide the central adsorption valve 220. <Resin molding apparatus 300 (third embodiment)> Hereinafter, the resin molding apparatus 300 of the third embodiment will be described with reference to FIG. 7. The difference between the resin molding apparatus 300 of the third embodiment and the resin molding apparatus 100 of the first embodiment is that the outer adsorption mechanism B for sucking air from the outer adsorption hole 151b is composed of more (two in the illustrated example) independent paths. Therefore, the following mainly describes this difference, and the description of the same structure as that of the first embodiment is omitted. In the resin molding apparatus 300 of the third embodiment, the outer adsorption hole 151b formed outside the central adsorption hole 151a is further classified into two types of adsorption holes 151 (the first outer adsorption hole 151ba and the second outer adsorption hole 151bb). The first outer adsorption hole 151ba is formed inside the plurality of outer adsorption holes 151b. In addition, the second outer adsorption hole 151bb is formed outside the first outer adsorption hole 151ba. In addition, a first outer adsorption path 123a connected to the first outer adsorption hole 151ba and a second outer adsorption path 123b connected to the second outer adsorption hole 151bb are formed in the upper mold retainer 120. The outer adsorption mechanism B can adsorb the substrate W to the first outer adsorption hole 151ba through the first outer adsorption pump 180a, the first connection path 181a, and the first outer adsorption path 123a. In addition, the outer adsorption mechanism B can adsorb the substrate W to the second outer adsorption hole 151bb through the second outer adsorption pump 180b, the second connection path 181b, and the second outer adsorption path 123b. Thus, the adsorption of the first outer adsorption hole 151ba and the second outer adsorption hole 151bb to the substrate W can be independently performed through a plurality of independent paths. By configuring the outer adsorption mechanism B in this way, the substrate W can be appropriately adsorbed corresponding to the warping condition of the substrate W. For example, when the warping of the substrate W is relatively large and the substrate W is far from the first outer adsorption hole 151ba and the second outer adsorption hole 151bb, the substrate W can be adsorbed through the central adsorption hole 151a to prevent the substrate W from falling. In addition, when the warping of the substrate W is relatively small and the substrate W is far from the second outer adsorption hole 151bb (the case of not being far from the first outer adsorption hole 151ba), the substrate W can be adsorbed through the central adsorption hole 151a and the first outer adsorption hole 151ba to more firmly adsorb and hold the substrate W. Furthermore, in the third embodiment, an example in which the outer adsorption mechanism B is composed of two independent paths is shown, but the present invention is not limited thereto, and it can also be composed of three or more independent paths. In addition, in the third embodiment, an example in which the substrate W is independently adsorbed from three types of adsorption holes 151 (the central adsorption hole 151a, the first outer adsorption hole 151ba, and the second outer adsorption hole 151bb) using three pumps (the central adsorption pump 170, the first outer adsorption pump 180a, and the second outer adsorption pump 180b) is shown, but the present invention is not limited thereto. For example, as in the second embodiment (refer to FIG. 6), it can also be configured to independently adsorb the substrate W from three types of adsorption holes 151 using valves. In addition, it can also be configured to appropriately combine a plurality of pumps and valves to independently adsorb the substrate W from a plurality of types of adsorption holes 151. <Modification Example of the Arrangement of the Adsorption Holes 151> Hereinafter, a modification example of the arrangement of the adsorption holes 151 will be described with reference to FIGS. 8(a) and 8(b). In the first to third embodiments, an example is shown in which, on the premise of using a substrate W having a circular shape, suction holes 151 are formed in a range facing the circular-shaped substrate W (circular range) (see (b) of FIG. 2). However, the present invention is not limited to this, and the suction holes 151 can be formed in any range corresponding to the shape of the substrate W. For example, in FIGS. 8(a) and 8(b), an example (modification example) of the arrangement of the suction holes 151 when assuming the use of a substrate W having a rectangular shape (square shape) is shown. In the examples shown in FIGS. 8(a) and 8(b), the suction holes 151 are formed throughout the entire area of the range facing the rectangular-shaped substrate W (rectangular range). In addition, in the examples of FIGS. 8(a) and 8(b), the suction holes 151 formed in a predetermined range (region L) including the center (geometric center) of the shape (rectangle) of the substrate W in a plan view are set as the central suction holes 151a. Furthermore, the arrangements of the first suction holes (central suction holes 151a) and the second suction holes (outer suction holes 151b) of the present invention are not limited to the examples shown in the above embodiments, and can be arbitrarily set. That is, as long as the first suction holes and the second suction holes of the present invention can independently suck air (suction of the substrate W), the arrangements of the two can be arbitrarily set. Furthermore, generally, it is assumed that the outer peripheral portion of the substrate W is deformed (warped) away from the upper mold 150. Therefore, it is preferable to set the second suction holes so as to surround the periphery of the first suction holes, and more preferably, the range including the center of the substrate W is set as the first suction holes. In addition, when the warping mode of the substrate W is known in advance, the first suction holes and the second suction holes can be set at positions corresponding to the warping of the substrate W. For example, when using a long substrate W (such as a rectangular substrate W), when it is known in advance that the two end portions in the length direction are warped, the suction holes 151 that suck the two end portions in the length direction of the substrate W can be set as the second suction holes, and the suction holes 151 that suck the central portion in the length direction of the substrate W can be set as the first suction holes. As described above, the embodiments of the present invention have been described. However, the present invention is not limited to the above embodiments, and can be appropriately changed within the scope of the technical idea of the invention described in the claims. For example, in the above embodiments, an example of using a circular substrate W (see (a) and (b) of FIG. 2) is mainly shown. However, the shape of the substrate W is not limited to this, and any shape of the substrate W can be used. In addition, corresponding to the shape of the substrate W (circular, rectangular, etc.), the shapes of the respective parts (lower mold 140, upper mold 150, etc.) of the resin molding apparatus 100 can be arbitrarily changed to a circular shape in a plan view, a rectangular shape in a plan view, etc. In addition, the method for manufacturing a resin molded product shown in each of the above-described embodiments (refer to FIG. 3) is an example and can be appropriately changed. For example, in each of the above-described embodiments, an example is shown in which after depressurizing the accommodation space in the depressurization step S30, the mold clamping step S40 is performed. However, the depressurization step S30 and the mold clamping step S40 can also be performed simultaneously. In addition, in each of the above-described embodiments, an example is shown in which after disposing the release film in the film disposition step S10, the resin material R is carried in the carry-in step S20. For example, the resin material R can also be disposed on the release film to be disposed on the lower mold 140, and then the release film and the resin material R can be disposed on the lower mold 140 together. In addition, in each of the above-described embodiments, an example is shown in which a resin material R having thermosetting properties is used as the resin material. However, the present invention is not limited thereto, and a resin material having thermoplastic properties can also be used. Further, in each of the above-described embodiments, an example is shown in which the number of each of the central adsorption holes 151a and the outer adsorption holes 151b is two or more. However, the number of each of the central adsorption holes 151a and the outer adsorption holes 151b can also be one. <Addendum> The resin molding apparatuses 100, 200, 300 according to the first aspect of the present disclosure dispose a molding object (substrate W) between the upper mold 150 and the lower mold 140 and perform compression molding. In the resin molding apparatuses 100, 200, 300, a plurality of adsorption holes 151 are formed in the upper mold 150. The plurality of adsorption holes 151 are formed so as to open on the lower surface of the upper mold 150 and are used for adsorbing the molding object. The resin molding apparatuses 100, 200, 300 include: a first adsorption mechanism (central adsorption mechanism A) capable of sucking air from at least one first adsorption hole (central adsorption hole 151a) among the plurality of adsorption holes 151; and a second adsorption mechanism (outer adsorption mechanism B) capable of sucking air from at least one second adsorption hole (outer adsorption hole 151b) among the plurality of adsorption holes 151 and capable of independently sucking air through the second adsorption hole from the first adsorption mechanism. According to the resin molding apparatuses 100, 200, 300 of the first aspect of the present disclosure, even when the molding object (substrate W) warps, the falling of the molding object can be prevented. That is, by adsorbing the molding object by using the mutually independent first adsorption mechanism and the second adsorption mechanism, even when it is impossible to adsorb by one of the adsorption mechanisms due to the warping of the molding object, the other adsorption mechanism can be used to adsorb and hold the molding object. In the resin molding apparatuses 100, 200, and 300 according to the second aspect based on the first aspect, a plurality of the first adsorption holes (central adsorption holes 151a) and a plurality of the second adsorption holes (outer adsorption holes 151b) are respectively provided. The plurality of the second adsorption holes are formed around a group composed of the plurality of the first adsorption holes on the lower surface of the upper mold 150. In the resin molding apparatuses 100, 200, and 300 according to the second aspect of the present disclosure, even when warping occurs in the outer peripheral portion of the object to be molded (substrate W), the object to be molded can be appropriately held on the upper mold 150. In the resin molding apparatus 100 according to the third aspect based on the first aspect or the second aspect, the first adsorption mechanism (central adsorption mechanism A) includes a first pump (central adsorption pump 170) that sucks air from the first adsorption hole (central adsorption hole 151a), and the second adsorption mechanism (outer adsorption mechanism B) includes a second pump (outer adsorption pump 180) that sucks air from the second adsorption hole (outer adsorption hole 151b). In the resin molding apparatus 100 according to the third aspect of the present disclosure, it is possible to prevent the object to be molded from falling without performing complicated control such as opening and closing of a valve. In the resin molding apparatus 200 according to the fourth aspect based on any one of the first aspect to the third aspect, the second adsorption mechanism (outer adsorption mechanism B) includes: a suction path (connection path 211b, outer adsorption path 123) that is connected to the second adsorption hole (outer adsorption hole 151b) and guides the air sucked from the second adsorption hole; and a valve (outer adsorption valve 230) that can switch whether air flows in the suction path. In the resin molding apparatus 200 according to the fourth aspect of the present disclosure, even when a common pump (adsorption pump 210) is used in the first adsorption mechanism and the second adsorption mechanism, it is possible to prevent the object to be molded from falling. The resin molding apparatuses 100, 200, and 300 according to the fifth aspect based on any one of the first aspect to the fourth aspect further include a decompression mechanism (decompression pump 160), and the decompression mechanism (decompression pump 160) can decompress the space (accommodation space) in which the upper mold 150 and the lower mold 140 are arranged. In the resin molding apparatuses 100, 200, and 300 according to the fifth aspect of the present disclosure, it is possible to decompress the accommodation space to suppress the generation of voids in the resin molded product, and it is possible to prevent the object to be molded from falling during decompression. The manufacturing method of the resin molded product according to the sixth aspect is a manufacturing method of a resin molded product using the resin molding device 100, resin molding device 200, or resin molding device 300 according to any one of the first to fifth aspects, including: an adsorption step (carrying-in step S20) of adsorbing the object to be molded (substrate W) to the lower surface of the upper mold 150; and a mold clamping step S40 of clamping the upper mold 150 and the lower mold 140. According to the manufacturing method of the resin molded product of the sixth aspect of the present disclosure, even when the object to be molded (substrate W) warps, the falling of the object to be molded can be prevented. 100, 200, 300: resin molding device 110: lower mold holder 110a: bottom surface part 110b: side surface part 120: upper mold holder 120a: upper surface part 120b: side surface part 121: decompression path 122: central adsorption path 123: outer adsorption path 123a: first outer adsorption path 123b: second outer adsorption path 130: sealing member 140: lower mold 141: bottom surface member 142: side surface member 143: elastic member 150: upper mold 151: adsorption hole 151a: central adsorption hole 151b: outer adsorption hole 151ba: first outer adsorption hole 151bb: second outer adsorption hole 160: decompression pump 161: decompression connection path 170: central adsorption pump 171, 181, 211, 211a, 211b: connection path 180: outer adsorption pump 180a: first outer adsorption pump 180b: second outer adsorption pump 181a: first connection path 181b: second connection path 190: mold clamping mechanism 210: adsorption pump 220: central adsorption valve 230: outer adsorption valve A: central adsorption mechanism B: outer adsorption mechanism C: chamber L: region R: resin material W: substrate S10: film arrangement step S20: carrying-in step S30: decompression step S40: mold clamping step S50: resin molding step S60: mold opening step S70: carrying-out step FIG. 1 is a front sectional view showing the structure of a resin molding apparatus according to the first embodiment. (a) of FIG. 2 is a front sectional view showing an upper mold holder and an upper mold. (b) of FIG. 2 is a bottom view of the upper mold. FIG. 3 is a flowchart showing a method for manufacturing a resin molded product. FIG. 4 is a front sectional view of the resin molding apparatus in a state where the accommodation space of the molding die is sealed. FIG. 5 is a front sectional view of the resin molding apparatus with the mold opened. FIG. 6 is a front sectional view showing the structure of a resin molding apparatus according to the second embodiment. FIG. 7 is a front sectional view showing the structure of a resin molding apparatus according to the third embodiment. (a) of FIG. 8 is a front sectional view showing an upper mold holder and an upper mold of a modified example. (b) of FIG. 8 is a bottom view of the upper mold of the modified example. 100: Resin molding apparatus 110: Lower mold holder 110a: Bottom surface portion 110b: Side surface portion 120: Upper mold holder 120a: Upper surface portion 120b: Side surface portion 121: Decompression path 122: Central adsorption path 123: Outer adsorption path 130: Sealing member 140: Lower mold 141: Bottom surface member 142: Side surface member 143: Elastic member 150: Upper mold 151: Adsorption hole 151a: Central adsorption hole 151b: Outer adsorption hole 160: Decompression pump 161: Decompression connection path 170: Central adsorption pump 171: Connection path 180: Outer adsorption pump 181: Connection path 190: Mold clamping mechanism A: Central adsorption mechanism B: Outer adsorption mechanism C: Chamber R: Resin material W: Substrate
Claims
1. A resin molding apparatus comprising a molding object disposed between an upper mold and a lower mold for compression molding, wherein a plurality of adsorption holes are formed in the upper mold, the plurality of adsorption holes being formed to open on the lower surface of the upper mold for adsorbing the molding object, and the resin molding apparatus comprising: The first adsorption mechanism is capable of drawing air from at least one of the plurality of adsorption holes. And a second adsorption mechanism, capable of drawing air from at least one of the plurality of adsorption holes, and capable of independently drawing air through the second adsorption hole from the first adsorption mechanism, preventing the shaped object from falling even if the shaped object adsorbed on the lower surface of the upper mold warps and moves away from the second adsorption hole.
2. The resin molding apparatus of claim 1, wherein a plurality of first adsorption holes and a plurality of second adsorption holes are provided, and the plurality of second adsorption holes are formed on the lower surface of the upper mold around a group consisting of a plurality of first adsorption holes.
3. The resin molding apparatus as claimed in claim 1 or 2, wherein the first adsorption mechanism includes a first pump that draws air from the first adsorption orifice, and the second adsorption mechanism includes a second pump that draws air from the second adsorption orifice.
4. The resin molding apparatus as claimed in claim 1 or 2, wherein the second adsorption mechanism comprises: The suction path is connected to the second adsorption hole to guide the air drawn from the second adsorption hole; And a valve that can switch whether air flows through the suction path.
5. The resin molding apparatus as claimed in claim 1 or 2 further includes a pressure-reducing mechanism capable of reducing pressure in the space where the upper mold and the lower mold are disposed.
6. A method for manufacturing a resin molded article, comprising using a resin molding apparatus as described in any one of claims 1 to 5, comprising: The adsorption step causes the shaped object to be adsorbed onto the lower surface of the upper mold; The process includes a mold-closing step, in which the upper mold and the lower mold are closed together.