Apparatus for forming the sealing resin used in compression molding, method for forming the resin, and compression molding apparatus.
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- YAMAHA INTELLIGENT MACHINE CO LTD
- Filing Date
- 2024-03-25
- Publication Date
- 2026-08-01
Smart Images
Figure TWG2TB001903534_001 
Figure TWG2TB001903534_002 
Figure TWG2TB001903534_003
Abstract
Description
Forming device, forming method, and compression molding device for a sealing resin used in compression molding The present invention relates to a forming device, a forming method, and a compression molding device for a sealing resin used in compression molding. As an example of a resin sealing device and a resin sealing method for sealing a workpiece having an electronic component mounted on a substrate with a sealing resin and processing it into a molded product, there is known one using a compression molding method. The compression molding method is a technique in which a predetermined amount of sealing resin is supplied to a sealing region (cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is disposed in the sealing region, and resin sealing is performed by an operation of clamping with the upper mold and the lower mold. As an example, there is known a technique in which, when using a sealing mold having a cavity provided in the upper mold, the sealing resin is supplied together to the central position on the workpiece for forming. On the other hand, there is known a technique in which, when using a sealing mold having a cavity provided in the lower mold, a release film (hereinafter, sometimes simply referred to as "film") covering the mold surface including the cavity and the sealing resin are supplied for forming (see Patent Document 1: Japanese Patent Application Laid-Open No. 2019-145550). [Prior Art Documents] [Patent Documents] [Patent Document 1] Japanese Patent Application Laid-Open No. 2019-145550 [Problems to be Solved by the Invention] For example, as a workpiece, in the case of resin-sealing a strip-shaped electronic component (semiconductor chip) connected by a wire, in the compression molding method in which a cavity is provided in the upper mold, the wire portion of the workpiece held on the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied to the workpiece and is deformed, so there is a problem that resin sealing is difficult. Therefore, generally, a compression molding method is adopted in which the workpiece is held on the upper mold, a cavity is provided in the lower mold, and a sealing resin (as an example, granular resin) is supplied into the cavity. However, in a structure where the upper mold holds the workpiece and the lower mold is provided with a cavity, in the case of a thin or large workpiece, there is a problem that it is difficult to hold the workpiece in the upper mold and it is easy to cause dropping. In addition, a structure that usually supplies the sealing resin into the cavity of the lower mold through a diaphragm is used. However, if a thick molded product is to be formed to a thickness (here, the thickness of the resin part after molding) exceeding 1 mm, there is a problem that the molding stroke becomes large, the film bites into the molded product, and it is easy to cause molding defects. Furthermore, when granular resin is used as the sealing resin, the film biting is likely to occur. In addition, there are not only problems of generating dust or being difficult to handle, but also problems of being difficult to evenly supply (disperse) the sealing resin to the entire area of the cavity provided in the lower mold, and it is easy to cause uneven distribution. In addition, there is the following problem: when the sealing resin is dispersed, the air contained in the gaps between the particles and the gas components generated by degassing from the sealing resin during melting cannot be discharged and remain in the molded product, thus easily causing molding defects. Especially in the case of a workpiece on which an electronic component is mounted through a wire connection, there may also be wire flow (deformation or cutting of the wire) caused by the resin flow in the cavity during resin sealing. On the other hand, regardless of the arrangement of the cavity, in the case where an electronic component is missing in the workpiece to be sealed (for example, not mounted for removal, or dropped after mounting), since the total amount of resin required for sealing increases, it becomes a cause of insufficient resin amount and molding defects. Conversely, in the case of supplying a resin amount that is excessive compared to the required amount, since the overflow amount increases, it becomes a cause of more waste. Therefore, it is important to accurately form an appropriate amount of sealing resin for each workpiece. [Means for Solving the Problem] The present invention has been made in view of the above circumstances, and its object is to provide a forming device and a forming method for accurately forming a sealing resin in an appropriate amount, which is easy to handle, and can solve the problems of the structure with a cavity provided in the upper mold and the structure with a cavity provided in the lower mold, prevent the occurrence of molding defects caused by resin flow, uneven distribution, residual gas, and dust generation during molding, and form a compression molding device and a compression molding method for a molded product with a large thickness dimension. The present invention solves the above problems by the solving means as described in the following embodiments. The essential conditions of the present invention include: a temporary forming part that temporarily forms a base resin of an embodiment to form a temporarily formed resin for sealing a workpiece; a measuring part that measures the weight or shape of the temporarily formed resin; and a removing mechanism that removes a part of the temporarily formed resin when the result measured by the measuring part is more than the weight required for sealing the workpiece or larger than the required shape. In addition, it is preferable that the removing mechanism has a processing tool for processing the temporarily formed resin. The forming device for the sealing resin according to another embodiment is a forming device for forming a sealing resin for compression molding of a workpiece by tablet-pressing a base resin. The requirements for the forming device include: a tablet-pressing die that houses an initially set amount of the base resin and tablet-presses it into the sealing resin having a specified shape corresponding to the shape of the workpiece; and a removing mechanism that removes a part of the sealing resin formed by tablet-pressing so as to be a specified amount. For example, as the workpiece, a workpiece having a structure in which electronic components are mounted on a base material is used. In addition, for the workpiece, the specified shape is preferably a shape that does not contact the electronic components when the sealing resin is placed on the base material. Furthermore, as the base resin, a powder resin is preferably used. In addition, for the sealing resin, it preferably has a plate-shaped or块状 main body portion, and a plurality of leg portions erected on one surface of the main body portion. Furthermore, as the leg portions, it is preferable to include a plurality of leg portions having different resin amounts. In addition, it preferably includes a control arithmetic unit that controls the operation of the removing mechanism. The control arithmetic unit calculates the required resin amount based on data obtained by measuring the number of the electronic components mounted on one base material for each workpiece, thereby setting the specified amount and controlling the operation of the removing mechanism so as to be the specified amount. In addition, it is preferable that the removing mechanism has a removing tool for removing a part of the leg portions so as to be the specified amount. In addition, a method for forming a sealing resin according to an embodiment is a method for forming a sealing resin for compression molding of a workpiece by tablet-pressing a base resin. The requirements for the method for forming the sealing resin include: a tablet-pressing step of housing an initially set amount of the base resin in a tablet-pressing die and tablet-pressing it to form the sealing resin having a specified shape corresponding to the shape of the workpiece; and a removing step of removing a part of the sealing resin formed by tablet-pressing so as to be a specified amount. In addition, it is preferable that the tablet-pressing step is carried out at a temperature at which the base resin does not thermoset, so that the formed sealing resin can be thermoset in a subsequent compression molding step. In addition, the requirements of a compression molding device according to an embodiment include: a formal molding section that performs formal molding by sealing a workpiece with a temporarily molded resin obtained by temporarily molding a base resin; a measurement section that measures the weight or shape of the temporarily molded resin; and a removal mechanism that removes a part of the temporarily molded resin when the result of measurement by the measurement section is greater than the weight required for sealing the workpiece or greater than the required shape. In addition, preferably, the removal mechanism has a processing tool for processing the temporarily molded resin. In addition, a compression molding device according to another embodiment is a compression molding device that seals a workpiece with a sealing resin and processes it into a molded product. The requirements of the compression molding device include a removal mechanism that removes a part of the sealing resin formed by pressing so that the amount becomes a specified amount. [Advantages of the Invention] According to the forming device and forming method of the present invention, the resin amount of the formed sealing resin can be appropriately changed for fine adjustment. Therefore, an appropriate amount of sealing resin can be accurately formed for each workpiece. In addition, if the sealing resin formed by the forming device and forming method is used, it is possible to solve the problems of the structure with a cavity provided in the upper mold and the structure with a cavity provided in the lower mold, prevent the occurrence of molding defects caused by resin flow, uneven distribution, residual gas, and dust generation during molding, and form a compression molding device and a compression molding method for a molded product with a large thickness dimension. In addition, compared with pellet resins, etc., the handling during supply or installation becomes easier in particular. (Compression Molding Device and Compression Molding Method) A forming device 100 and a forming method for a sealing resin according to an embodiment of the present invention are a device and a method for forming a sealing resin R for compression molding of a workpiece W. First, an overview of a compression molding device 1 and a compression molding method for resin-sealing (compression molding) the workpiece W using the sealing resin R will be described. Here, FIG. 1 is a plan view (schematic diagram) showing an example of the compression molding device 1. Furthermore, for ease of explanation, the left-right direction (X direction), the front-rear direction (Y direction), and the up-down direction (Z direction) may be indicated by arrows in the figure. In addition, in all the figures used to explain the respective embodiments, components having the same function are denoted by the same reference numerals, and repeated explanations thereof may be omitted. The workpiece W to be sealed has a structure in which electronic components Wb are mounted on a base material Wa. More specifically, examples of the base material Wa include plate-like members such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers. In addition, examples of the electronic components Wb include semiconductor wafers, micro electro mechanical system (MEMS) wafers, passive components, heat sinks, conductive members, gaskets, and the like. Furthermore, the shape of the base material Wa is a rectangular shape (elongated shape), a square shape, a circular shape, or the like. In addition, the number of electronic components Wb mounted on one base material Wa is set to one or more (for example, in a matrix form or the like). Examples of the method of mounting the electronic components Wb on the base material Wa include methods using wire bonding packaging, flip chip packaging, and the like. Alternatively, in the case of a structure in which the base material (glass or metal carrier plate) Wa is peeled off from the formed product Wp after resin sealing, there is also a method of attaching the electronic components Wb using a thermally peelable adhesive tape or an ultraviolet curable resin that is cured by ultraviolet irradiation. In addition, as an example of the film F, a film material having excellent heat resistance, easy peelability, flexibility, and stretchability is preferably used, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene chloride, and the like. Furthermore, the film F is also used when forming the sealing resin R in the forming device 100 described later. As shown in FIG. 1, the compression molding device 1 mainly includes the following parts: a supply unit 10A that supplies the workpiece W and the like; a pressing unit 10B that resin-seals the workpiece W to process the formed product Wp and the like; and a storage unit 10C that stores the formed product Wp and the like. As an example, along the X direction in FIG. 1, the supply unit 10A, the pressing unit 10B, and the storage unit 10C are arranged in sequence. However, it is not limited to the above structure, and the equipment structure or the number of units (especially the number of pressing units) in the unit, the arrangement order of the units, and the like can be changed. In addition, it can also be set to a structure including units other than the above (not shown in the figure). In addition, in the compression molding device 1, the guide rails 20 are linearly arranged across the respective units. A transfer device (first loader) 22 for transferring the workpiece W and the sealing resin R, and a transfer device (second loader) 24 for transferring the molded product Wp (which can also be used for transferring the sealing resin R) are arranged so as to be movable between the specified units along the guide rails 20. However, the structure is not limited to the above, and it may also be configured to include a shared (one) transfer device (loader) for transferring the workpiece W, the sealing resin R, and the molded product Wp (not shown). In addition, the transfer device may also be configured to include a robot arm or the like instead of a loader. In addition, in the compression molding device 1, a control unit 30 for controlling the operation of each mechanism in each unit is arranged in the supply unit 10A (it may also be arranged in other units). The pressing unit 10B includes a pair of sealing molds whose mold opening and closing are performed by a pressing device 250. As an example, the sealing mold may be configured such that a mold cavity is provided in the upper mold (sealing mold 202), and as another example, it may also be configured such that a mold cavity is provided in the lower mold (sealing mold 302). As an example, with reference to FIGS. 2 to 5, the steps of the compression molding method implemented by the compression molding device 1 when using the sealing mold 202 are described. In this case, a film supply unit 211 is provided in the pressing device 250, and the film supply unit 211 supplies a film F for covering the mold surface 204a (specified area) of the inner surface of the upper mold 204 including the mold cavity 208. Furthermore, as an example, the film F is in a roll shape, but it may also be in a strip shape. First, a preparation step (sealing preparation step) is implemented. Specifically, the steps of adjusting the upper mold 204 and the lower mold 206 to a specified temperature (for example, 100°C to 300°C) and heating them are implemented. In addition, the steps of operating the film supply unit 211 to supply a new film F and adsorbing it so as to cover the specified area of the mold surface 204a of the inner surface of the upper mold 204 including the mold cavity 208 are implemented. After the preparation step, a workpiece holding step of holding the workpiece W on the workpiece holding portion 205 of the lower mold 206 is implemented. Specifically, the workpiece W supplied from the supply cassette 12 is held by the first loader 22 and the workpiece W is carried into the sealing mold 202 and held on the workpiece holding portion 205 of the lower plate 242 (mold surface 206a). After the workpiece holding step, a resin placing step of placing the sealing resin R on the workpiece W held on the workpiece holding portion 205 is implemented (refer to FIG. 2). Specifically, the sealing resin R formed in a sealing resin forming device (sometimes simply referred to as "forming device") 100 described later is held by the first loader 22 (it may also be other transfer devices) and carried into the sealing mold 202 and placed on the workpiece W held on the workpiece holding portion 205. Alternatively, as another example of the resin placement step, it can also be implemented as a step of placing the sealing resin R formed in the forming device 100 above the workpiece W before the workpiece holding step. In this case, the workpiece holding step becomes a step of holding the workpiece W in a state where the sealing resin R is placed on the workpiece holding portion 205. That is, the first loader 22 holds the workpiece W in a state where the sealing resin R is placed thereon and transfers the workpiece W into the sealing die 202, and holds it on the workpiece holding portion 205. It has the advantage that the workpiece W and the sealing resin R are transferred into the sealing die 202 at one time, rather than separately transferring the workpiece W and the sealing resin R into the sealing die 202. Next, a resin sealing step of sealing the workpiece W with the sealing resin R to process it into a molded product Wp is performed. Specifically, a mold closing step is performed in which the sealing die 202 is closed, and the cavity mold member 226 is relatively lowered in the cavity 208 surrounded by the holder 228 to heat and press the workpiece W against the sealing resin R. Furthermore, FIG. 3A is an enlarged view of part III in FIG. 2, and in the mold closing step, the sealing resin R is softened and melted from the state of FIG. 3A to the state of FIG. 3B. Thereby, the sealing resin R thermally hardens, thus completing the resin sealing (compression molding) (refer to FIG. 4). Furthermore, the subsequent steps following the mold closing step are the same as the previous compression molding method. As a general outline, a mold opening step is performed in which the sealing die 202 is opened, and the molded product Wp is separated from the used film F and the molded product Wp is taken out (refer to FIG. 5). Next, a molded product unloading step is performed in which the molded product Wp is unloaded from the sealing die 202 by the second loader 24 and transferred to the storage unit 10C. As an example, the unloaded molded product Wp is stored in the storage cassette 14. In addition, after or in parallel with the molded product unloading step, a step is performed in which the film supply unit 211 is operated to send out the used film F from the sealing die 202, and a new film F is fed into and installed in the sealing die 202. The above are the main steps of the compression molding method using the compression molding device 1 including the sealing die 202. However, the order of the above steps is an example, and the order can be changed or implemented in parallel as long as it is not hindered. As another example, with reference to FIGS. 6 to 8, the steps of the compression molding method implemented using the compression molding device 1 including the sealing die 302 are described. In this case, a film supply unit 311 is provided in the pressing device 250, and the film supply unit 311 supplies a film F for covering the mold surface 306a (specified area) of the inner surface of the lower mold 306 including the cavity 308. Furthermore, as an example, the film F is in a roll shape, but it can also be in a strip shape. First, perform the preparation step (sealing preparation step). Specifically, perform the step of adjusting the upper mold 304 and the lower mold 306 to a specified temperature (for example, 100°C to 300°C) and heating them. Additionally, perform the step of operating the film supply unit 311 to supply a new film F and adsorbing it in a manner that covers a specified area of the mold surface 306a of the lower mold 306 that includes the mold cavity 308. After the preparation step, perform the workpiece holding step of holding the workpiece W on the workpiece holding portion 305 of the upper mold 304. Specifically, the workpiece W supplied from the supply cassette 12 is held by the first loader 22 and carried into the sealing mold 302, and is held on the workpiece holding portion 305 of the upper plate 342 (mold surface 304a). After the workpiece holding step, perform the resin holding step (moreover, it can also be performed before or in parallel with the workpiece holding step). The resin holding step includes the following steps. Hold the sealing resin R in the mold cavity 308 of the lower mold 306 (refer to FIG. 6). Specifically, the sealing resin R formed in the forming device 100 is held by the first loader 22 (it can also be other conveying devices) and carried into the sealing mold 302, and is housed in the mold cavity 308 (specifically, placed on the upper surface of the mold cavity module 326). Next, perform the resin sealing step of sealing the workpiece W with the sealing resin R to process it into a formed product Wp. Specifically, perform the step of closing the sealing mold 302, and causing the mold cavity module 326 to relatively rise in the mold cavity 308 surrounded by the clamp 328 to heat and press the sealing resin R against the workpiece W in the closing mold step. Thereby, the sealing resin R thermally hardens, and resin sealing (compression molding) is completed (refer to FIG. 7). Moreover, the subsequent steps following the closing mold step are the same as the previous compression molding method. As a general overview, perform the step of opening the sealing mold 302, separating the formed product Wp from the used film F, and taking out the formed product Wp (refer to FIG. 8). Next, perform the formed product搬出 step of carrying out the formed product Wp from the sealing mold 302 by the second loader 24 and conveying it to the storage unit 10C. As an example, the carried-out formed product Wp is stored in the storage cassette 14. Additionally, after or in parallel with the formed product搬出 step, perform the step of operating the film supply unit 311 to send out the used film F from the sealing mold 302, and sending a new film F into and installing it in the sealing mold 302. The above are the main steps of the compression molding method using the compression molding device 1 including the sealing mold 302. However, the above order of steps is an example, and the order can be changed before and after or implemented in parallel as long as it is not hindered. [First Embodiment] (Sealing Resin Forming Apparatus) Next, a forming apparatus 100 (first embodiment) for forming a sealing resin R used in the compression molding apparatus 1 and the compression molding method will be described with reference to FIGS. 9 to 12. The forming apparatus 100 processes a base resin Rm to form the sealing resin R. Here, FIG. 9 is a plan view (schematic view) showing an example of the forming apparatus 100. Further, the forming apparatus 100 can be provided either inside or outside the apparatus of the compression molding apparatus 1. In the present embodiment, as the base resin Rm and the sealing resin R formed from the base resin Rm, a thermosetting resin (for example, an epoxy resin containing a filler, etc., but not limited thereto) is used. The sealing resin R is formed into a solid / semi-solid resin having a prescribed shape corresponding to the shape of the workpiece W as a whole (details will be described later). Usually, the "whole" for one sealing requirement amount (the amount per workpiece W at a time), but it may also be configured to form the "whole" of the sealing requirement amount in a divided state of a plurality (for example, about two or three). In addition, the so-called "semi-solid" means a state that is not in a completely solid state but is melted to the so-called B-stage state. Further, it is preferable to use a powder resin (form) as the thermosetting resin (property) in the base resin Rm. However, it is not limited thereto, and a structure using a granular resin, a crushed resin, a solid resin, a liquid resin, or a resin obtained by combining a plurality of these may also be provided. As shown in FIG. 9, the forming apparatus 100 includes a tablet press die 102, and the tablet press die 102 has a pair of dies for opening and closing the die (for example, a die assembled from a plurality of die blocks, die plates, die columns, etc. including alloy tool steel or other members). In addition, it includes a pressing device 150 for driving the tablet press die 102 to open and close. In addition, it includes a control arithmetic unit 170 for controlling the operation of each mechanism. Here, a side view (schematic view) of the pressing device 150 is shown in FIG. 10. In addition, a side sectional view (schematic view) of the tablet press die 102 is shown in FIG. 11, and a front sectional view (schematic view) at the XII-XII position is shown in FIG. 12. As shown in FIG. 10, the pressing device 150 includes a pair of platens 154, 156, a plurality of tie rods 152 on which the pair of platens 154, 156 are mounted, and a driving device that moves (lifts and lowers) the platen 156, etc. Specifically, the driving device includes a driving source (for example, an electric motor) 160 and a drive transmission mechanism (for example, a ball screw or a toggle mechanism) 162, etc. (however, it is not limited thereto). In the present embodiment, the platen 154 on the upper side in the vertical direction is set as a fixed platen (the platen fixed to the tie rod 152), and the platen 156 on the lower side is set as a movable platen (the platen that can be slidably held on the tie rod 152 and lifted and lowered). However, it is not limited thereto, and it may be reversed up and down, that is, the upper side is set as the movable platen and the lower side is set as the fixed platen, or both the upper side and the lower side may be set as movable platens (not shown in the figures). On the other hand, as shown in FIG. 10, the tablet press die 102 includes an upper die 104 on the upper side in the vertical direction and a lower die 106 on the lower side as a pair of dies disposed between the pair of platens 154, 156 in the pressing device 150. The upper die 104 is assembled to the upper-side platen (the fixed platen 154 in the present embodiment), and the lower die 106 is assembled to the lower-side platen (the movable platen 156 in the present embodiment). The upper die 104 and the lower die 106 approach / separate from each other to perform mold closing / mold opening (the vertical direction (up and down direction) becomes the mold opening / closing direction). In the tablet press die 102 of the present embodiment, the upper die 104 constitutes a so-called "pestle type", and the lower die 106 constitutes a so-called "mortar type". An upper die film supply unit 113 and a lower die film supply unit 111 are provided in the pressing device 150. The upper die film supply unit 113 supplies a film F for covering the die surface 104a (a specified area) of the upper die 104, and the lower die film supply unit 111 supplies a film F for covering the die surface 106a (a specified area) of the inner surface of the lower die 106 including the mold cavity 108. Furthermore, as an example, the film F is in a roll shape, but it may also be in a long strip shape. Next, the lower die 106 of the tablet press die 102 will be described in detail. As shown in FIGS. 11 and 12, the lower die 106 includes a lower die groove 110, a mold cavity module 126 held therein, a holder 128, etc. The lower die groove 110 is fixed to the upper surface of the support plate 114 via support columns 112. A mold cavity 108 is provided on the upper surface (the surface on the side of the upper die 104) of the lower die 106. A predetermined amount of base resin Rm is accommodated in the mold cavity 108. The holder 128 is configured in a ring shape so as to surround the cavity module 126, and is assembled (however, not limited to this assembly structure) in such a way that it can move up and down separably (float) relative to the upper surface of the support plate 114 via the push pin 122 and the holding spring 124 (for example, a biasing member exemplified by a coil spring). The cavity module 126 constitutes the inside (bottom) of the cavity 108, and the holder 128 constitutes the side portion of the cavity 108. Furthermore, the shape or number of the cavities 108 provided in one lower mold 106 is appropriately set (one or more). In addition, the lower mold 106 is provided with a suction path (hole or groove, etc.) (not shown) communicating with the suction device on the upper surface of the holder 128 or at the boundary portion between the holder 128 and the cavity module 126. Thereby, the film F supplied from the lower mold film supply unit 111 can be adsorbed and held on the mold surface 106a including the inner surface of the cavity 108. In addition, in the present embodiment, a lower mold heating mechanism (not shown) for heating the lower mold 106 to a specified temperature is provided. The lower mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power source, etc., and the heating is controlled by the control operation unit 170. As an example, the heater is configured to be built into the lower mold groove 110 and apply heat to the entire lower mold 106 and the base resin Rm accommodated in the cavity 108. At this time, the lower mold 106 is heated so that the base resin Rm becomes a specified temperature (for example, 50 °C to 80 °C) at which it does not thermoset (formally cure). Furthermore, as an example, the lower mold 106 has a structure with a movable holder (holder 128), and as another example, it may also have a structure without a movable holder (not shown). Next, the upper mold 104 of the tablet press mold 102 will be described in detail. As shown in FIGS. 11 and 12, the upper mold 104 includes a tablet press plate 142, and the tablet press plate 142 is formed (tablet pressed) in such a way as to press a specified amount of the base resin Rm accommodated in the cavity 108 of the lower mold 106 into a sealing resin R having a specified shape corresponding to the shape of the workpiece W (details of the forming method will be described later). The tablet press plate 142 is held (fixed) in the upper mold groove 140. As an example, a leg forming groove (including a recess) 143 for forming the leg Rb of the sealing resin R is provided on the lower surface (the surface on the lower mold 106 side) of the tablet press plate 142. In the present embodiment, in order to form the sealing resin R including a plurality of legs Rb having different resin amounts, a plurality of leg forming grooves 143 having different recess volumes (that is, the inner diameter / depth of the recess) are provided. As an example, the shape (recess volume) of the leg forming groove 143 is set so as to be able to form a plurality of legs Rb having different resin amounts (as an example, 1 g, 2 g, 3 g, 5 g, etc.). Furthermore, the foot formation groove 143 is provided in the pressing plate 142, but it can also be provided in the cavity mold member 126, or in both. In addition, the upper mold 104 is provided with a suction path (holes or grooves, etc., not shown) communicating with the suction device in the pressing plate 142 and the like. Thereby, the film F supplied from the upper mold film supply unit 113 can be adsorbed and held on the mold surface 104a. In addition, in the present embodiment, an upper mold heating mechanism (not shown) for heating the upper mold 104 to a specified temperature is provided. The upper mold heating mechanism includes a heater (for example, a heating wire heater), a temperature sensor, a power source, etc., and the heating is controlled by the control arithmetic unit 170. As an example, the heater is configured to be built into the upper mold groove 140 and apply heat to the entire upper mold 104. At this time, the upper mold 104 is heated to a specified temperature (for example, 50°C to 80°C) such that the base resin Rm held (accommodated) in the lower mold 106 does not become thermoset (formally cured). Furthermore, as a characteristic structure of the present embodiment, the forming device 100 includes a removing mechanism 180 that removes a part of the sealed resin R formed by pressing so that the sealed resin R becomes a specified amount after pressing. The removing mechanism 180 includes a removing tool that removes a part of the sealed resin R (as an example, the foot part Rb). The "removing" in this application is defined as a broad concept of removal such as shearing, cutting, and breaking off. As an example of the removing tool, a metal knife cutting tool for mechanical removal, a thermal melting cutting tool for thermal melting removal, etc. (both not shown) can be used. Accordingly, by removing a part of the sealed resin R formed by pressing, the resin amount of the sealed resin R after pressing (after forming) can be appropriately changed for fine adjustment. Therefore, an appropriate amount of the sealed resin R can be accurately formed for each workpiece W. As described above, if various (as an example, 1 g, 2 g, 3 g, 5 g, etc.) foot parts Rb with different resin amounts are formed in the sealed resin R, the operation of removing the foot part Rb to make the sealed resin R a specified amount can be performed quickly and easily. Furthermore, as an example, if the foot part Rb to be removed is cylindrical, the removal becomes easy, but it is not limited to the above shape. Furthermore, as another embodiment, the removing mechanism 180 can be provided in the compression molding device 1 (refer to FIG. 21) instead of the forming device 100. As an example, it is provided in the supply unit 10A, but it is not limited to this, and it can also be provided in other units (not shown). In the case of the above embodiment, the operation control of the removing mechanism 180 is performed by the control unit 30. (Method for Forming Sealing Resin) Next, the steps of the method for forming the sealing resin according to the present embodiment implemented using the forming apparatus 100 will be described. Here, FIGS. 13 to 15 are explanatory diagrams of the respective steps, and are illustrated as front sectional views in the same direction as FIG. 12. First, a preparation step (tableting preparation step) is implemented. The preparation step includes the following steps. A lower mold heating step of adjusting the lower mold 106 to a prescribed temperature (a temperature at which the base resin Rm and the sealing resin R do not undergo formal hardening, for example, 50°C to 80°C) and heating it by the lower mold heating mechanism is implemented. In addition, an upper mold heating step of adjusting the upper mold 104 to a prescribed temperature (a temperature at which the base resin Rm and the sealing resin R do not undergo formal hardening, for example, 50°C to 80°C) and heating it by the upper mold heating mechanism is implemented. In addition, a lower mold film supply step of operating the lower mold film supply unit 111 to supply a new film F and adsorbing it so as to cover a prescribed area of the mold surface 106a of the lower mold 106 including the cavity 108 is implemented. In addition, an upper mold film supply step of operating the upper mold film supply unit 113 to supply a new film F and adsorbing it so as to cover a prescribed area of the mold surface 104a of the upper mold 104 is implemented. After the preparation step, a tableting step is implemented as follows: a solid / semi-solid resin having a prescribed shape (described later) whose overall shape corresponds to the shape of the workpiece W is formed by tableting the base resin Rm. Specifically, an initial set amount (a resin amount that is more than or equal to the maximum required amount assumed for each workpiece W) of the base resin Rm is accommodated in the cavity 108 of the lower mold 106 using a dispenser, a transfer device, etc. (not shown) (refer to FIG. 13). Next, the pressing device 150 is operated to close the tableting die 102 that has been heated to the prescribed temperature (refer to FIG. 14). At this time, the cavity mold member 126 relatively rises within the cavity 108, and the base resin Rm is tableted (clamped and pressed) using the cavity mold member 126 and the tableting plate 142. Thereby, a solid / semi-solid sealing resin R having a prescribed shape and not thermally hardened (formally hardened) is formed. At this time, the base resin Rm that has entered the leg formation groove 143 of the tableting plate 142 via the film F becomes the leg portion Rb of the sealing resin R, and the other (remaining) base resin Rm becomes the main body portion Ra of the sealing resin R (the detailed structure of the sealing resin R will be described later). Furthermore, as a modification of the tableting step, a part of the base resin Rm may be held (deposited, gripped, etc.) on the upper mold 104 (not shown). In addition, the leg formation groove 143 is provided in the tableting plate 142, but may be provided in the cavity mold member 126, or may be provided in both. It is important that the tablet pressing step be carried out at a temperature at which the base resin Rm does not undergo thermal hardening (formal hardening) (by heating the lower mold 106 and the upper mold 104 to a temperature at which thermal hardening (formal hardening) does not occur), so that the formed sealing resin R can undergo thermal hardening (formal hardening) in the subsequent resin sealing step (a step of a compression molding method). As described above, the "temperature at which thermal hardening does not occur" also depends on the material of the base resin Rm, but as a specific example, it is about 50°C to 80°C (about 70°C in this embodiment). Here, the "prescribed shape" of the sealing resin R will be described. As an example, in the case of the sealing resin R used in the compression molding device 1 including the sealing mold 202, the "prescribed shape" is a shape that does not contact the electronic component Wb (the electronic component Wb having a wire includes the wire) when placed on the base material Wa of the workpiece W. As an example, as shown in FIG. 2, the sealing resin R preferably has the following shape, that is, a sealing resin R having a plate-shaped or块状 main body Ra and leg portions Rb intermittently (or continuously) erected on one surface of the main body Ra (the surface facing the electronic component Wb of the workpiece W) (but not limited to this shape). The main body Ra is preferably sized to enter the cavity 208 in a top view, and is sized slightly smaller than the shape of the cavity 208 (especially the cavity mold 226) when considering resin flow. In addition, the leg portion Rb requires a height H that does not contact the electronic component Wb (refer to FIG. 3A), but contact to the extent that the wire does not undergo plastic deformation is not excluded. In addition, the leg portion Rb is disposed at a position that does not contact the electronic component Wb in a top view of the main body Ra and at a position where the main body Ra does not tilt when placed on the base material Wa of the workpiece W. Furthermore, it is preferably disposed between the electronic components Wb or at the outer peripheral position of the electronic component Wb so as not to damage the wiring (especially the wire) of the workpiece W at all during forming. Details of specific structural examples (FIGS. 16 and 17) of the sealing resin R will be described later. As another example shown in FIG. 6, in the case of the sealing resin R used in the compression molding device 1 including the sealing mold 302, the "prescribed shape" is a shape such that when the upper mold 304 gradually approaches the lower mold 306 during the closing of the sealing mold 302, and in a state where the front end portion (upper end portion) of the leg portion Rb of the sealing resin R accommodated in the cavity 308 contacts the base material Wa of the workpiece W held by the workpiece holding portion 305, the main body Ra of the sealing resin R does not contact the electronic component Wb (the electronic component Wb having a wire includes the wire) of the workpiece W. Furthermore, the specific shape of the sealing resin R is the same as that of the sealing resin R used in the compression molding device 1 including the sealing mold 202 described above (refer to FIGS. 16 and 17). Here, a structural example (shape) of the sealing resin R will be described with reference to FIGS. 16 and 17. The sealing resin R is formed into a shape having a plate-like or块状 main body Ra and a plurality of legs Rb erected on one surface of the main body Ra. In the present embodiment, the legs Rb are provided with a variety of resin amounts (appropriately set such as 1 g, 2 g, 3 g, 5 g, etc.) different from each other (the number of grams of the portion protruding from the standing surface of the main body Ra). First, in the example of the sealing resin R shown in FIG. 16, all (or a part may also be) of the legs Rb are formed into convex bodies Rb1 to Rb4 arranged in a dot-like manner. As an example, at the four corners of the main body Ra (or positions other than the four corners), there are provided legs Rb1 for placement (standing) to ensure a distance for the main body Ra not to come into contact with the electronic component Wb. In addition, a plurality of legs Rb with different resin amounts are respectively provided at positions other than the four corners of the main body Ra (or positions of the four corners). These are for removal (for adjustment of the resin amount) in the removal step described later. Specifically, there are provided a leg Rb2 with a resin amount of 1 g, a leg Rb3 with a resin amount of 2 g, and a leg Rb4 with a resin amount of 5 g. Furthermore, the above types are only examples, and the resin amount (number of grams) or the number of settings is appropriately set. In addition, as an example, if the legs Rb2 to Rb4 to be removed are formed into a cylindrical shape, the removal becomes easy, but it is not limited to the above shape. According to the above sealing resin R, by removing a part of the legs Rb (appropriately setting the combination and the number from Rb2 to Rb4) in the sealing resin R after tablet forming, the resin amount of the sealing resin R can be adjusted. Therefore, an appropriate amount of the sealing resin R can be accurately prepared for each workpiece W for compression molding. In addition, due to the structure in which the legs Rb are arranged in a dot-like manner as columns, the flow of the sealing resin R placed on the workpiece W during compression molding can be suppressed. Therefore, wire flow and the like can be prevented, and the forming quality can be improved. Next, in the example of the sealing resin R shown in FIG. 17, a part of the legs Rb is formed into convex bodies Rb5 arranged in a linear manner. In the above example, as the legs for placement (standing) to ensure a distance for the main body Ra not to come into contact with the electronic component Wb, Rb1 and Rb5 can be used. Furthermore, regarding the legs Rb2 to Rb4 for adjusting the resin amount removed, the structure is the same as that of the sealing resin R shown in FIG. 16. According to the above sealing resin R, resin flow can be intentionally generated from the legs Rb5 having a dike-like structure with a specified length to promote the filling of the sealing resin R into the narrow part of the workpiece W (for example, between the substrate Wa and the electronic component Wb connected by flip chip bonding). Therefore, gas can be prevented from remaining in the formed product Wp, and the forming quality can be improved. Next, the subsequent steps of the tablet pressing step will be described. After the tablet pressing step, a mold opening step of the tablet pressing mold 102 is performed, and the sealing resin R is separated from the used film F and the sealing resin R is taken out (refer to FIG. 15). In the present embodiment, by including the lower mold film supply step and the upper mold film supply step, the film F is disposed on both the mold surface 106a of the lower mold 106 and the mold surface 104a of the upper mold 104. Therefore, the demolding of the sealing resin R formed by tablet pressing becomes easy, and thus defects caused by resin adhesion to the mold can be prevented. After the mold opening step, or in parallel, the following film supply steps (lower mold film supply step, upper mold film supply step) are performed, that is: the lower mold film supply unit 111 and the upper mold film supply unit 113 are operated to send out the used film F from the tablet pressing mold 102, and a new film F is sent into and installed in the tablet pressing mold 102. In addition, after the mold opening step, a removing step of removing a part of the sealing resin R is performed so that the sealing resin R formed by the tablet pressing step becomes a "specified amount". Specifically, for each workpiece W to be sealed, the number of the presence or absence of the electronic parts Wb mounted on one substrate Wa (the number of mounted parts or missing parts, and may further include the case of measuring the height of the electronic parts Wb) is measured by a measuring mechanism or the like (not shown), and the total volume of the electronic parts Wb is subtracted from the volumes of the cavities 208 and 308 of the sealing molds 202 and 302. Thereby, the control arithmetic unit 170 calculates the resin amount (gram) required for resin sealing (compression molding) and sets the "specified amount". Next, a part of the sealing resin R is removed in such a manner as to become the set "specified amount" (furthermore, the control arithmetic unit 170 can control the operation of the removing mechanism 180, or the operation of the removing mechanism 180 can also be operated by an operator). At this time, in order to form the "specified shape" (a shape that does not contact the electronic parts Wb), it is necessary not to remove several (for example, four corners) legs Rb. In addition, since it is premised on removal, it is necessary to use a base resin Rm having a resin amount (set as an "initial set amount") that is more (or equal to) the maximum required amount assumed for each workpiece W while also considering the missing rate of the electronic parts Wb, etc., to previously form the sealing resin R by tablet pressing. As a specific removing method, a part of the legs Rb (a part of the legs Rb among multiple ones, which can be the whole of the legs Rb or a part thereof) is removed by a removing tool provided in the removing mechanism 180. As described above, for example, mechanical removal can be performed by a metal knife cutting tool, or thermal melting removal can be performed by a thermal melting cutting tool. The leg portion Rb of this embodiment is formed of a plurality of different resin amounts (as an example, 1 g, 2 g, 3 g, 5 g, etc.), whereby the operation of removing the leg portion Rb so as to become the set specified amount of the sealing resin R can be performed quickly and easily. Further, as an example, if the leg portion Rb to be removed is cylindrical, the removal becomes easy, but the shape is not limited to the above shape. By including the above steps, the resin amount of the sealing resin R after tableting (after formation) can be appropriately changed for fine adjustment. As a specific example, when the sealing resin R after tableting (after formation) has the structure (shape) shown in FIG. 16, when reducing the resin amount (total amount) of the sealing resin R by, for example, 8 g, it is only necessary to remove the leg portion Rb2 with a resin amount of 1 g, the leg portion Rb3 with a resin amount of 2 g, and the leg portion Rb4 with a resin amount of 5 g within the dashed line frame in FIG. 18 one by one (other combinations are also possible). In this way, an appropriate amount (the above-mentioned "specified amount") of the sealing resin R can be supplied to the workpiece W. Therefore, it is possible to prevent the occurrence of molding defects caused by insufficient resin amount required for resin sealing. Further, it is possible to prevent the occurrence of waste caused by supplying an excessive amount of resin compared to the required amount. As the base resin Rm, it is preferably a powder resin. Accordingly, compared with the case of using a granular resin or a crushed resin, the "specified amount" of resin can be adjusted and supplied extremely accurately. However, it is not limited to a powder resin. Furthermore, as another embodiment, when the removing mechanism 180 is provided in the compression molding device 1, the above-mentioned removing step may be implemented as a step in the compression molding method in the compression molding device 1 (before the resin sealing step). As described above, according to the forming device 100 and the forming method of the present invention, the resin amount of the formed sealing resin R can be appropriately changed for fine adjustment, so that an appropriate amount of the sealing resin R can be accurately formed for each workpiece W. In addition, by making the forming device 100 for the sealing resin R and the compression molding device 1 different devices, the compression molding device 1 can be made not affected by the dust when tableting the powder resin in the forming device 100, and the compression molding device 1 can be easily placed in a clean room. In addition, the forming device 100 for the sealing resin R and the compression molding device 1 can also be docked, whereby the data of the resin amount of the specified amount obtained by measuring each workpiece W supplied to the compression molding device 1 is sent to the forming device 100, and a part is removed so that the sealing resin R becomes the specified amount. As described above, as one embodiment, the removing mechanism 180 is provided in the forming device 100, but as another embodiment, it may also be provided in the compression molding device 1. In addition, when using the sealing resin R formed by the forming device 100 and the forming method, the compression molding device 1 and the compression molding method that achieve the following effects can be realized. Specifically, by the compression molding device 1 and the compression molding method, it is possible to prevent the occurrence of molding defects caused by resin flow, uneven distribution, residual gas, and dust generation during molding. In addition, not to mention thin molded products Wp (thickness dimension less than 1 mm), thick molded products Wp (thickness dimension of 1 mm or more) can also be formed. Furthermore, although the upper limit of the thickness dimension depends on various setting conditions, it is considered that it can be sufficiently formed up to about 10 mm. In addition, the handling during supply or installation becomes easy. Furthermore, by the compression molding device 1 and the compression molding method, it is possible to solve the problems that occur when the structure has a cavity provided in the upper mold. That is, in a conventional compression molding device having a cavity provided in the upper mold, for example, when performing a mold closing step on a workpiece W such as a workpiece W on which an electronic component (semiconductor chip) Wb connected by a wire in a tape form is mounted, the wire portion of the workpiece held on the lower mold comes into contact with the sealing resin previously supplied to the cavity or the sealing resin supplied onto the workpiece and is deformed or cut off. Therefore, there is a problem that resin sealing is difficult. To solve this problem, by adopting the following structure, its solution can be realized. The structure uses the sealing resin R formed by the device and method of the present embodiment, that is, a solid / semi-solid resin formed into a specified shape corresponding to the shape of the workpiece W. Specifically, during the mold closing step, softening and melting caused by heating of the sealing resin R are performed in such a way as to transfer from FIG. 3A to FIG. 3B. At this time, a state is achieved in which the resin (specifically, the main body portion Ra) uniformly abuts against all the wires (see FIG. 3B). Therefore, deformation and cutting of the wires can be prevented. Furthermore, in fact, when the inventors of the present application conducted experiments using the sealing resin R formed by the device and method of the present embodiment in the compression molding device 1, the following results could be confirmed: compared with a conventional compression molding device having a structure in which the workpiece W is held on the upper mold, a cavity is provided in the lower mold, and a sealing resin (specifically, a granular resin) is supplied to the cavity, deformation and cutting of the wires can be prevented, and the molding quality is improved. On the other hand, by means of the compression molding device 1 and the compression molding method, it is also possible to solve the problems that occur when the structure with a cavity is provided in the lower mold. That is, in the previous compression molding device with a cavity provided in the lower mold, especially when using granular resin as the sealing resin, the particle diameter or height (lamination thickness) of the sealing resin (granular resin) accommodated in the cavity does not become uniform. Therefore, for example, there are cases where it does not completely become a liquid state (low viscosity state) depending on the type and melting state of the granular resin, and there are the following problems: when performing the mold closing step on a workpiece W such as an electronic component (semiconductor wafer) Wb connected by a wire with a tape mounted thereon, as shown in FIG. 19, depending on the position, the wire portion of the workpiece held by the upper mold comes into strong (obvious) local contact with the sealing resin (granular resin) and is deformed or cut. Furthermore, as shown in FIG. 20, there are problems that the resin flow in the cavity occurs significantly and the wire portion is deformed or cut. To solve this problem, by adopting the following structure, its solution can be achieved. The structure uses the sealing resin R formed by the device and method of the present embodiment, that is, a solid / semi-solid resin formed into a specified shape corresponding to the shape of the workpiece W. Specifically, for the same reason as described with reference to FIGS. 3A and 3B above, because during the mold closing step, softening and melting are performed by heating the sealing resin R to a state where the resin (specifically, the main body portion Ra) uniformly abuts against all the wires. In addition, according to the compression molding device 1 shown in FIG. 21, the resin amount of the formed sealing resin R can be appropriately changed for fine adjustment, so that the occurrence of molding defects due to the excess or deficiency of the resin amount can be prevented. [Second Embodiment] Next, the second embodiment of the present invention will be described. The basic structure of the forming device 100 for the sealing resin R in this embodiment is the same as that of the first embodiment. Hereinafter, the description will focus on the differences. FIG. 22 is a plan view (schematic view) showing an example of the forming device 100 in this embodiment. The forming device 100 includes a temporary forming portion 101 that forms a sealing resin (temporary forming resin) R for compression molding of the workpiece W by temporarily forming a base resin Rm. As an example, "temporary forming" is "tabletting", and the temporary forming portion 101 includes a pressing device 150. Furthermore, the structure of the pressing device 150 is the same as that of the first embodiment. However, "temporary forming" is not limited to "tabletting", and other structures (not shown) other than the pressing device 150 may be provided in the temporary forming portion 51. In this embodiment, a structure including one temporary forming portion 101 is provided, but a structure including multiple temporary forming portions 101 (not shown) may also be provided. In addition, the forming device 100 includes a measurement unit 190 that measures the sealing resin (temporary forming resin) R. As an example, the measurement unit 190 includes a weighing scale and is configured to measure the weight of the temporary forming resin R. Alternatively, as another example, the measurement unit 190 includes an image processing device and is configured to measure the shape of the temporary forming resin R. In addition, the forming device 100 includes a removing mechanism 180. When the result of the measurement by the measurement unit 190 is heavier in weight or larger in shape than the "specified amount" (the same as in the first embodiment) required for sealing the workpiece W, the removing mechanism 180 removes a part of the sealing resin (temporary forming resin) R. Furthermore, for the movement between the respective mechanisms (temporary forming unit 101, measurement unit 190, removing mechanism 180), a known transfer device (loader, robot, etc.) can be used (not shown). As an example, the removing mechanism 180 can be configured to have the same structure as that in the first embodiment. Alternatively, as another example, the removing mechanism 180 can be configured to have a processing tool for processing the sealing resin (temporary forming resin) R. Specifically, a known machining center (or a processing device similar thereto) can be used. According to this structure, the difference relative to the "specified amount" can be removed with high precision. The above example is a structure in which the measurement unit 190 and the removing mechanism 180 are provided in the forming device 100. Alternatively, as another example, the measurement unit 190 and the removing mechanism 180 can also be provided in the compression molding device 1 (refer to FIG. 23). Specifically, as shown in FIG. 23, the measurement unit 190 and the removing mechanism 180 are provided in the supply unit 10A of the compression molding device 1. However, they can also be provided in other units (not shown). In addition, the pressing unit 10B of the compression molding device 1 includes a formal forming unit 201 that performs formal forming by sealing the workpiece W with the temporarily formed sealing resin (temporary forming resin) R. As an example, the formal forming unit 201 includes a pressing device 250. Furthermore, the structure of the pressing device 250 is the same as the above structure. The present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention. 1: Compression forming device 10A: Supply unit 10B: Pressing unit 10C: Storage unit 12: Supply cassette 14: Storage cassette 20: Guide rail 22: Conveyor device (first loader) 24: Conveyor device (second loader) 30: Control unit 100: Sealing resin forming device (forming device) 101: Temporary forming part 102: Pressing die 104, 204, 304: Upper die 104a, 106a, 204a, 206a, 304a, 306a: Die surface 106, 206, 306: Lower die 108, 208, 308: Mold cavity 110: Lower die groove 111: Lower die film supply part 112: Support column 113: Upper die film supply part 114: Support plate 122: Pushing pin 124: Clamping spring 126, 226, 326: Mold cavity module 128, 228, 328: Clamp 140: Upper die groove 142: Pressing plate 143: Foot forming groove 150: Pressing device 152: Pull rod 154: Pressing plate (fixed pressing plate) 156: Pressing plate (movable pressing plate) 160: Drive source (electric motor) 162: Drive transmission mechanism (ball screw, toggle mechanism) 170: Control operation unit 180: Removal mechanism 190: Measuring unit 201: Formal forming part 202, 302: Sealing die 205: Workpiece holding part 211: Film supply part 242: Lower plate 250: Pressing device 305: Workpiece holding part 311: Film supply part 342: Upper plate F: Demolding film H: Height R: Sealing resin (temporary forming resin) Ra: Main body part Rb: Foot part Rb1, Rb2, Rb3, Rb4, Rb5: Convex body (foot part) Rm: Base resin W: Workpiece Wa: Base material (glass or metal carrier plate) Wb: Electronic component (semiconductor wafer) Wp: Formed product X, Y, Z: Directions FIG. 1 is a plan view showing an example of a compression molding apparatus for a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. FIG. 2 is an explanatory view for explaining an example of a compression molding method for a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. FIG. 3A is an enlarged view of part III in FIG. 2. FIG. 3B is an explanatory view following FIG. 3A. FIG. 4 is an explanatory view following FIG. 3B. FIG. 5 is an explanatory view following FIG. 4. FIG. 6 is an explanatory view for explaining another example of a compression molding method for a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. FIG. 7 is an explanatory view following FIG. 6. FIG. 8 is an explanatory view following FIG. 7. FIG. 9 is a plan view showing an example of a forming apparatus for a sealing resin according to a first embodiment of the present invention. FIG. 10 is a side view showing an example of a pressing apparatus of the forming apparatus shown in FIG. 9. FIG. 11 is a side cross-sectional view showing an example of a tablet die of the forming apparatus shown in FIG. 9. FIG. 12 is a front cross-sectional view (cross-sectional view taken along line XII-XII in FIG. 11) showing an example of a tablet die of the forming apparatus shown in FIG. 9. FIG. 13 is an explanatory view of a forming method for a sealing resin according to an embodiment of the present invention. FIG. 14 is an explanatory view following FIG. 13. FIG. 15 is an explanatory view following FIG. 14. FIG. 16 is a perspective view showing an example of a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. FIG. 17 is a perspective view showing another example of a sealing resin formed by a forming apparatus and a forming method according to an embodiment of the present invention. FIG. 18 is a perspective view showing an example of a sealing resin after performing a removing step in a forming method for a sealing resin according to an embodiment of the present invention. FIG. 19 is an explanatory view of a prior compression molding method. FIG. 20 is an explanatory view of a prior compression molding method. FIG. 21 is a plan view showing an example of a compression molding apparatus according to another embodiment of the present invention. FIG. 22 is a plan view showing an example of a forming apparatus for a sealing resin according to a second embodiment of the present invention. FIG. 23 is a plan view showing an example of a compression molding apparatus according to another embodiment of the present invention. 100: Forming apparatus for sealing resin (forming apparatus) 101: Temporary forming part 102: Tablet die 111: Lower mold film supply part 113: Upper mold film supply part 150: Pressing apparatus 170: Control arithmetic unit 180: Removing mechanism 190: Measuring part F: Film X, Y, Z: Directions
Claims
1. An apparatus for forming a sealing resin, characterized in that it comprises: A temporary molding section temporarily molds a base resin to form a temporary molding resin for sealing a workpiece, the temporary molding resin comprising a plate-shaped or block-shaped main body and multiple legs erected on one side of the main body; a measuring section measures the weight or shape of the temporary molding resin; a removal mechanism removes a portion of the multiple legs if the result of the measurement by the measuring section is greater than the weight required for sealing the workpiece or larger than the required shape; and a conveying section for placing the temporary molding resin, after removing a portion of the multiple legs, onto the workpiece so that the main body does not contact the workpiece.
2. The sealing resin forming apparatus as claimed in claim 1, wherein, The removal mechanism has processing tools for processing the temporarily molded resin.
3. A sealing resin forming apparatus for forming a sealing resin for compression molding of a workpiece by pressing a base resin into sheets, the forming apparatus being characterized by comprising: A tableting mold that holds an initial set amount of the base resin and tablets it in such a way that the sealing resin has a predetermined shape corresponding to the shape of the workpiece; a removal mechanism that removes a portion of the sealing resin formed during tableting in such a predetermined amount, wherein the sealing resin has a plate-shaped or block-shaped main body and multiple legs erected on one side of the main body, the removal mechanism having a removal tool for removing a portion of the legs in such a predetermined amount; and a conveying unit for placing the sealing resin after removing a portion of the legs onto the workpiece in such a way that the main body does not contact the workpiece.
4. The sealing resin forming apparatus as described in claim 3, wherein, As the workpiece, a workpiece having a structure in which electronic components are mounted on a substrate is used, wherein the specified shape is a shape that does not come into contact with the electronic components when the sealing resin is placed on the substrate.
5. The sealing resin forming apparatus as claimed in claim 4, comprising a control calculation unit that controls the operation of the removal mechanism, the control calculation unit calculating the required amount of resin based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece, thereby setting the predetermined amount and controlling the operation of the removal mechanism in such a way as to achieve the predetermined amount.
6. The sealing resin forming apparatus as claimed in claim 3, wherein, The foot includes various types of feet with different amounts of resin.
7. The apparatus for forming a sealing resin as claimed in claim 3 or 4, wherein, Powdered resin is used as the base resin.
8. A compression molding apparatus, characterized in that it comprises: The formal molding section performs formal molding by sealing the workpiece with a temporary molding resin formed from a base resin. The temporary molding resin includes a plate-shaped or block-shaped main body and multiple legs erected on one side of the main body. A measuring section measures the weight or shape of the temporary molding resin. A removal mechanism removes a portion of the multiple legs if the result of the measurement by the measuring section is greater than the weight required for sealing the workpiece or larger than the required shape. A conveying section places the temporary molding resin, after removing a portion of the multiple legs, onto the workpiece so that the main body does not contact the workpiece.
9. The compression molding apparatus as claimed in claim 8, wherein, The removal mechanism has processing tools for processing the temporarily molded resin.
10. A compression molding apparatus for processing a workpiece into a molded article by sealing it with a sealing resin, characterized in that it includes a removal mechanism that removes a portion of the sealing resin formed by pressing into a predetermined amount, the sealing resin including a plate-shaped or block-shaped main body and a plurality of legs erected on one side of the main body, the removal mechanism being configured to remove a portion of the plurality of legs; and a conveying unit for placing the sealing resin after the removal of the plurality of legs onto the workpiece at a position such that the main body does not contact the workpiece.
11. A method for forming a sealing resin, comprising compressing a base resin into a sheet to form a sealing resin for compression molding of a workpiece, the method being characterized by comprising: The tableting step involves receiving an initial set amount of the base resin in a tableting mold and pressing it into a tablet to form a sealing resin having a predetermined shape corresponding to the shape of the workpiece. The removal step involves removing a portion of the sealing resin formed during tableting in a predetermined amount. The workpiece is a structure having electronic components mounted on a substrate. The predetermined shape is a shape that does not contact the electronic components when the sealing resin is placed on the substrate. The removal step includes the following steps: calculating the required amount of resin based on data obtained by measuring the number of electronic components mounted on a substrate for each workpiece, thereby setting the predetermined amount, and removing a portion of the sealing resin in a predetermined amount. The tableting step includes a step of forming the sealing resin, which has a plate-shaped or block-shaped main body and multiple legs erected on one side of the main body. The removal step includes removing a portion of the plurality of legs disposed on the sealing resin; and a conveying step, placing the sealing resin, after removing a portion of the plurality of legs, on the workpiece so that the main body does not contact the workpiece.
12. The method for forming the sealing resin as described in claim 11, wherein, The tableting step includes the step of forming the sealing resin, wherein the sealing resin has multiple feet with different amounts of resin as the feet.
13. The method for forming the sealing resin as described in claim 11, wherein, Powdered resin is used as the base resin.
14. The method for forming the sealing resin as described in claim 11, wherein, The tableting step is performed at a temperature at which the base resin will not thermocure, so that the resulting sealing resin can be thermocured in a subsequent compression molding step.