Reactive by-product collection system

Abstract

The reaction byproduct capture system of the present invention is designed for use in confined spaces and has a structure that prevents the generation of reaction byproducts within the connecting pipe and is easy to replace. It includes: a vacuum pump; a capture device; a vacuum pump housing and fixing part, including a moving device that surrounds and moves the vacuum pump fixed on the ground, a leveling device for adjusting the level, and a fixing device fixed to the ground; a load-bearing part, mounted on the upper end of the housing and fixing part to support the load of the capture device, and equipped with a transfer device for adjusting the position of the capture device and replacing the capture device; a capture device support part, mounted on the upper part of the load-bearing part to surround and fix the capture device; a pipe that vertically connects the vacuum pump and the capture device and absorbs gaps; and a valve installed to control the flow path of waste gas flowing through the pipe.

Description

Technical Field

[0001] The present invention relates to a reaction byproduct capture system for use in confined spaces, having a structure that prevents the generation of reaction byproducts within connecting pipes and is easily replaceable. More specifically, the invention relates to a capture system that utilizes the confined sub-factory structure of an existing semiconductor manufacturing facility, consisting of a double-layer structure consisting of a main factory and a sub-factory, to provide a replaceable capture device structure that is vertically connected to a vacuum pump via a pipe to increase the capture processing capacity, thereby solving the problem of insufficient reaction byproduct capture processing capacity due to increased process gas usage. Prior Art

[0002] Generally speaking, the semiconductor manufacturing process consists of two main stages: the front-end process (manufacturing process) and the back-end process (assembly process). The front-end process involves repeatedly depositing thin films on wafers and selectively etching these films within various process chambers to create specific patterns, ultimately producing semiconductor chips. The back-end process involves separating the wafers produced in the front-end process and then combining them with lead frames to assemble the finished product.

[0003] At this time, in the process of depositing a thin film on the wafer or etching the thin film deposited on the wafer, precursors and reaction gases such as TiCl4 (titanium tetrachloride), NH3 (ammonia), SiH4 (monosilane), SiCl2H2 (dichlorosilane), WF6 (tungsten hexafluoride), and Hf (hafnium) are injected into the processing chamber through a gas injection system and performed at high temperature. During the process, a large amount of harmful gases containing various inert gases, corrosive foreign substances, and toxic components are generated inside the processing chamber.

[0004] In order to purify and discharge such harmful gases, a scrubber is installed at the rear end of a vacuum pump that creates a vacuum state in a process chamber used to manufacture semiconductors. The scrubber purifies the exhaust gas discharged from the process chamber and releases it into the atmosphere.

[0005] However, the scrubber primarily purifies reaction byproducts in the form of process gases. Therefore, when the reaction byproducts solidify after being discharged outside the processing chamber, they may adhere to the exhaust line and cause an increase in exhaust pressure. Alternatively, when they flow into the vacuum pump, they may induce pump failure, causing harmful gases to flow back into the processing chamber and contaminate the wafer.

[0006] Therefore, most semiconductor manufacturing equipment is equipped with a reaction byproduct capture device, which is used to condense the exhaust gas between the processing chamber and the vacuum pump and capture it in a powder or solid state.

[0007] On the other hand, conventional semiconductor manufacturing facilities equipped with the processing chamber, the capture device, and the vacuum pump are generally composed of a two-story structure semiconductor manufacturing facility and a three-story structure semiconductor manufacturing facility.

[0008] First, a double-layer semiconductor manufacturing facility structure consists of a main factory and a sub-factory double-layer structure, wherein in the main factory, the processing chamber and the embedded capture device are connected by vertical pipes and installed in a clean room, and the sub-factory is installed with a vacuum pump connected to the processing chamber and the embedded capture device through vertical pipes to provide a vacuum state.

[0009] In addition, the three-layer structure of the semiconductor manufacturing facility consists of a main factory, an intermediate factory and a sub-factory. In the main factory, the processing chamber is installed in a clean room, the intermediate factory is equipped with a large-capacity capture device connected to the processing chamber through a vertical pipe and capable of capturing a large amount of reaction by-products, and the sub-factory is equipped with a vacuum pump connected to the large-capacity capture device through a vertical pipe to provide a vacuum state.

[0010] The structural advantage of a three-tiered semiconductor manufacturing facility as described above is that, even if the amount of process gas used increases as the semiconductor process changes, the capacity increase can be accommodated by increasing the capacity of the large-capacity capture device in the intermediate plant or replacing the large-capacity capture device.

[0011] However, a structural problem with double-layer semiconductor manufacturing facilities is that as semiconductor processes change and the amount of process gas used increases, the physical space structure is small and the embedded capture device is difficult to accommodate and handle.

[0012] In other words, when installing an embedded capture device in a two-story semiconductor manufacturing facility, the complex semiconductor manufacturing facility, which includes a processing chamber, has difficulty providing space to install a large-capacity capture device optimized for the limited clean room space. Therefore, if the input of process gas increases due to changes in the semiconductor manufacturing process, the reaction byproduct capture and processing capacity of the embedded capture device, which is optimized for the original process, will quickly reach its limit.

[0013] In this case, the semiconductor process can only be interrupted and the capture device updated to a new one or through a cleaning process before the capture process can be restarted, resulting in the disadvantage of shortening the maintenance cycle.

[0014] Of course, the embedded capture device installed in the main plant can be removed and a large-capacity capture device can be installed in the sub-plant. However, in this case, there is a structural problem that it cannot be installed on the top of the vacuum pump using a vertical pipe connection due to the vertical height.

[0015] Therefore, as shown in Figure 7, the exhaust gas discharged from the lower exhaust pipe of the large-capacity capture unit to the subsidiary plant must be connected to the upper end of the vacuum pump via a curved piping structure. This curved piping structure is achieved by bending the pipe upward, then downward, and then connecting it to the upper end of the vacuum pump. The reason for this piping structure is that the capture unit has a downward-discharging structure, while the vacuum pump, due to its pump structure, typically draws in air from the upper end and discharges it to the side. Therefore, a curved piping structure connecting from the lower end to the upper end is essential.

[0016] However, this duct structure creates a problem where exhaust gas flowing through it collides with the duct at each bend, changing its flow path and creating vortices. This can lead to the formation of reaction byproducts. These reaction products can clog the ducts through which the exhaust gas flows, dramatically reduce vacuum efficiency, or cause reaction byproducts to flow back into the capture device. This makes it an unsuitable installation structure for semiconductor manufacturing equipment.

[0017] Therefore, a capture system is needed that does not have a semiconductor manufacturing facility consisting of an upper and lower structure of a main factory and a sub-factory, but instead has a vacuum pump structure vertically connected to a capture device with an increased capacity through a pipeline. The capture device can cope with the situation where the amount of process gas input increases due to changes in the semiconductor process. Conventional Technology Literature

[0018] <Patent Document> Patent Document 1: Korean Patent No. 10-1806480 (December 1, 2017) Patent Document 2: Korean Patent No. 10-0717837 (May 7, 2007) Patent Document 3: Korean Patent No. 10-0862684 (October 2, 2008) Patent Document 4: Korean Patent No. 10-1447629 (September 29, 2014) Summary of the Invention

[0019] Technical Issues

[0020] In order to solve the above-mentioned problems, the purpose of the present invention is to provide a capture system for a narrow space. For the original semiconductor manufacturing facilities consisting of a main factory with a processing chamber installed in a clean room and a sub-factory with a vacuum pump installed, when the use of process gas increases, it is difficult to install a large-capacity capture device due to the narrow spatial structure of the sub-factory. The capture system of the present invention utilizes the vertical spatial structure of this sub-factory to provide a replaceable structure with a larger processing capacity than the embedded capture device while being connected by vertical pipes at the location where the vacuum pump has been installed, thereby increasing the capture and processing capacity of reaction by-products. Technical Plan

[0021] The present invention aims to achieve the above-mentioned objectives and eliminate the shortcomings of the past, and provides a reaction by-product capture system for use in a confined space, having a structure that prevents the generation of reaction by-products in a connecting pipe and is easily replaceable, comprising: a vacuum pump fixed to the floor of a sub-factory, the sub-factory constituting the lower floor of a main factory; a capture device for capturing reaction by-products from exhaust gas exhausted from a processing chamber and discharging them downward; a vacuum pump storage and fixing portion, comprising a moving device that surrounds the vacuum pump fixed on the floor and moves, a leveling device installed for adjusting the level, and a fixing device fixed to the floor; a bearing portion installed at the upper end of the vacuum pump storage and fixing portion to support the load of the capture device, and having a transfer device used when adjusting the position of the capture device and replacing the capture device; a capture device support portion installed at the upper part of the bearing portion to surround and fix the capture device; a pipe vertically connecting the vacuum pump and the capture device and absorbing the gap; and a valve installed in the flow path for controlling the exhaust gas flowing through the pipe.

[0022] As a preferred embodiment, the capture device is a capture device with increased capacity, which is larger than the capacity of the embedded capture device and smaller than the capacity of the large-capacity capture device.

[0023] As a preferred embodiment, the vacuum pump storage and fixing portion uses welding or fastening devices to form a structure of multiple horizontal frames and multiple vertical frames, and is an octagonal structure with an open portion with one side open so that the vacuum pump can enter.

[0024] As a preferred embodiment, the moving device is composed of a rotating body of any one of a plurality of freely rotating casters, balls, or rollers, the horizontal adjustment device is composed of a bolt portion fastened to the frame and a ground support portion contacting the ground, and the bolt portion is raised and lowered by the rotation of the ground support portion, and the fixing device is composed of a vertical fastening portion fastened to the frame with bolts and a horizontal fastening portion fastened to the ground, and one or more long holes are formed on the vertical fastening portion and the horizontal fastening portion respectively.

[0025] As a preferred embodiment, the carrying portion is formed with an opening portion that opens from the side where the capture device enters to the central part of the installation pipe, and is equipped with a transfer device for carrying and replacing a capture device with increased capacity and adjusting the position of the capture device.

[0026] As a preferred embodiment, the transfer device is equipped with multiple bearing parts installed on both sides of the upper end of the storage and fixing part, and is composed of any rotating body among casters, rollers or balls.

[0027] As a preferred embodiment, the capture device support portion uses welding or fastening devices to form a structure with multiple horizontal frames and multiple vertical frames, and is an octagonal structure with an open part with an open side, so that the capture device can enter the load-bearing part, and a limiter is inserted into the storage part protruding to the outside of the vertical frames on both sides of the open part to prevent the capture device from falling.

[0028] As a preferred embodiment, the capture device support portion is equipped with support pads for absorbing impact and preventing separation on the inner sides of the three horizontal frames constituting the upper end, so as to support the outer side surface of the capture device in contact. Effects of the Invention

[0029] The reaction byproduct capture system of the present invention having the above-mentioned characteristics has the following effects: utilizing the narrow sub-factory structure of the original semiconductor manufacturing facility consisting of a main factory with a processing chamber installed in a clean room and a sub-factory with a vacuum pump installed, connecting it to the vacuum pump originally fixed to the ground through a vertical pipe while installing a capture device with a processing capacity relatively larger than that of the original embedded capture device. By equipping it with this structure, the problems of insufficient reaction byproduct capture processing capacity of the embedded capture device connected to the processing chamber through a vertical pipe in the clean room of the main factory in the past due to the increase in the use of process gas in order to manufacture more semiconductors, and the difficulties in maintenance such as repair or replacement caused by installation in the clean room are solved.

[0030] In addition, the present invention provides a replaceable capture device in a narrow sub-factory structure that increases the reaction by-product capture and processing capacity and is connected to a vacuum pump via a vertical pipe. This has the effect of solving the problem of reaction by-products generated by vortices when the waste gas flows through the pipe due to the curved pipe structure that is inevitably accompanied by the connection between the vacuum pump and the capture device when a large-capacity capture system is installed in the narrow space of the original sub-factory. Without adding a new semiconductor manufacturing plant, the factory structure consisting of the upper and lower layers of the original main plant and sub-factory can be used to increase the reaction by-product capture and processing capacity.

[0031] As described above, the present invention is a useful invention with various effects and is expected to be widely used in industry. Simple diagram description

[0032] Figure 1 is a diagram showing an example of the structure of a reaction byproduct capture system for a narrow space according to one embodiment of the present invention; [] Figure 2 is a diagram showing an example of an exploded structure of a reaction byproduct capture system for a narrow space according to an embodiment of the present invention; Figure 3 is a diagram showing an example structure of a reaction byproduct capture system for a narrow space in addition to the capture device, the vacuum pump and the pipeline; Figure 4 is a diagram showing an example of the process of carrying a capture device for capturing reaction byproducts in a narrow space in a system according to one embodiment of the present invention; Figure 5 is a diagram showing an example of a process of replacing a capture device in a reaction byproduct capture system for a narrow space according to an embodiment of the present invention; FIG6 is an exemplary diagram showing the structure of a semiconductor manufacturing plant in which a reaction byproduct capture system for a narrow space according to an embodiment of the present invention is installed; and FIG. 7 is a diagram showing an example of a structure of a conventional semiconductor manufacturing plant in which a large-capacity reaction byproduct capture system is installed in a narrow space. Implementation Method

[0033] The following describes in detail the structure and functions of the embodiments of the present invention in conjunction with the accompanying drawings. In addition, when describing the present invention, if it is judged that a detailed description of a related well-known function or structure may unnecessarily obscure the main points of the present invention, the detailed description will be omitted.

[0034] Figure 1 is an example diagram showing the structure of a reaction by-product capture system for a narrow space according to an embodiment of the present invention; Figure 2 is an example diagram showing the decomposed structure of a reaction by-product capture system for a narrow space according to an embodiment of the present invention; Figure 3 is an example diagram showing the structure of a reaction by-product capture system for a narrow space excluding the capture device, vacuum pump and pipeline according to an embodiment of the present invention.

[0035] As shown in the figure, the reaction byproduct capture system for a narrow space of the present invention is composed of a vacuum pump 1, a capture device 2, a vacuum pump storage and fixing portion 3, a carrying portion 4, a capture device support portion 5 and a pipeline 6.

[0036] A reaction byproduct capture system for use in a confined space, having the structure described above, is a capture system installed in a confined sub-factory. When the amount of process gas used in semiconductor manufacturing increases, a capture device with an increased capacity can be installed at the upper end of the vacuum pump installed by default in the sub-factory to increase the reaction byproduct capture and processing capacity. The semiconductor manufacturing facility consists of a main fabrication (Main Fab) at the upper end and a sub-factory (Sub Fabrication, Sub Fab) at the lower end, so that the sub-factory has a limited spatial structure.

[0037] The vacuum pump 1 is a device that provides a vacuum state to the processing chamber and the capture device and discharges exhaust gas discharged from the capture device to a scrubber.

[0038] The fan of this vacuum pump, driven by a motor or engine, simultaneously exhausts air from the duct to an outlet on one side. This creates a vacuum within the processing chamber and capture device through the suction force generated by the inlet on the other side. The incoming exhaust gas is then discharged through the outlet and duct to the scrubber.

[0039] To this end, the vacuum pump is generally constructed with a pipeline in the following manner, that is, an inlet 11 is formed at the top, which is connected to the lower outlet of the capture device through a vertical pipeline, and an outlet 12 is formed in the side direction, which is connected to the scrubber through a pipeline.

[0040] However, in the present invention, the engine or motor structure, power supply device, and pipeline structure used for the operation of the vacuum pump are not the core matters of the present invention. Therefore, when necessary, reference can be made to the well-known vacuum pumps used in the semiconductor process, and no further details will be given.

[0041] Regarding the vacuum pump, once the installation of a processing chamber or the like for semiconductor manufacturing within a clean room of a main factory is complete and a vertical duct for exhausting exhaust gas extends downward to a subsidiary factory, the vacuum pump is installed at the corresponding location and secured to the ground. However, for convenience, the drawings of one embodiment do not show the fastening structure for securing the vacuum pump to the ground. However, in the present invention, the description is based on the vacuum pump being secured to the ground.

[0042] The vacuum pump occupied a significant portion of the indoor height of the sub-factory, which had limited workspace. During installation, approximately 1 meter of space was available, and the height standard for high-altitude work, which was 2 meters or less, was adhered to. Therefore, the physical space available for additional equipment above the vacuum pump was reduced.

[0043] The capture device 2 is a capture device with an increased capacity that captures reaction by-products from the exhaust gas exhausted from the processing chamber and exhausts the resulting product to a lower portion.

[0044] This capture device can have the same conventional internal structure as known capture devices. For example, it can include the following: a housing mounted on the exhaust line between the processing chamber and the vacuum pump, receiving exhaust gas flowing into the upper inlet 21 and discharging it to the lower outlet 22, thereby capturing reaction byproducts in the exhaust gas discharged from the processing chamber; a heater to prevent the exhaust gas flowing into the housing from condensing at the inlet and providing capture temperature conditions within the housing; and an internal capture tower mounted within the housing to capture particulate reaction byproducts in the inflowing exhaust gas.

[0045] However, the important thing about the capture device of the present invention is that it uses the following capture device, that is, since the semiconductor manufacturing facility is composed of a main factory at the top and a sub-factory at the bottom, the narrow sub-factory has a limited space structure. In order to be installed in the narrow sub-factory and solve the problem of insufficient reaction by-product capture and processing capacity caused by the increase in process gas usage, while increasing the reaction by-product capture and processing capacity in the exhaust gas, it has a vertical height that can be installed in a narrow space structure.

[0046] In other words, the embedded capture devices previously installed in the clean rooms of main factories needed to be frequently replaced to address the problem of insufficient capture and processing capacity for reaction byproducts due to increased process gas usage. This frequently required interruptions to the semiconductor process, making it difficult to smoothly execute the semiconductor process. The large-capacity capture devices typically installed in intermediate factories were difficult to use in subsidiary factories due to their physical size.

[0047] Therefore, if a capture device with a larger capacity than an embedded capture device is used as in the present invention, it can provide relatively sufficient capacity to smoothly execute the semiconductor manufacturing process while also having a vertical height size that can address the physical space limitations of the sub-factory.

[0048] Specifically, the increased-capacity capture device of the present invention is preferably larger than the capacity of an embedded capture device and smaller than the capacity of a large-capacity capture device. This capacity is limited because the height of a limited workspace is typically around 2 meters. This is the optimal capacity when a conventional vacuum pump is installed via vertical piping to provide a normal vacuum state to the processing chamber and capture device.

[0049] In the case of this capacity, the vertical height limit can be less than 1m, and the application has a much larger capacity than the previous embedded system.

[0050] The reason for using less than 1m is that in the sub-factory structure, the space occupied by the vacuum pump is roughly less than 1m. However, if the vertical pipelines and various necessary structures for carrying and replacing the capture device are excluded, the actual vertical size of the available space is less than 1m.

[0051] However, the present invention is not limited to specific values ​​constituting the volume, as long as a capture device having the above-mentioned capacity and a vertical height of less than 1m with free space for installation in a vacuum pump is provided, and a capacity greater than that of a conventional embedded capture device is provided.

[0052] For reference, considering the vertical pipeline to the vacuum pump, the free space for loading and replacement, and the safety of workers due to high-altitude work, large-capacity capture devices with a height of about 1m cannot be installed vertically.

[0053] After the vacuum pump storage and fixing portion 3 moves to the space where the vacuum pump is located, it enters and stores the vacuum pump from the direction of the open portion, thereby providing a structure that surrounds the outside of the vacuum pump in three directions. When the vacuum pump is located on the inside, it is fixed to the ground, thereby stably protecting the vacuum pump while providing support to prevent the structure installed on the upper portion from shaking.

[0054] To this end, the vacuum pump storage and fixing part 3 is formed into a structure by welding or fastening a plurality of horizontal frames 3a and a plurality of vertical frames 3b, and is composed of an octagonal structure having an open part 3c with one side open so that the vacuum pump can enter.

[0055] The vacuum pump storage fixing portion 3 constructed as described above provides stable support force when vibration occurs during the semiconductor manufacturing process or when vacuum occurs in the pipeline or when exhaust gas flows.

[0056] To this end, a moving device 31, a horizontal adjustment device 32 and a fixing device 33 are installed at the lower part of the horizontal frame constituting the lower end of the vacuum pump storage and fixing part 3.

[0057] The moving device 31 is composed of freely rotating casters, balls, rollers or other rotating bodies. Preferably, two are installed on each of the lower two side horizontal frames installed along the length direction, and are configured to stably support the load and travel during movement.

[0058] In addition, after the horizontal adjustment device 32 is moved by the moving device 31 so that the vacuum pump is located inside for storage, it adjusts the vertical height by being close to the ground in a manner that it is no longer movable at the corresponding location, thereby adjusting the level.

[0059] By means of the level adjustment device 32, the vacuum pump storage fixing portion 3 can maintain a horizontal state even when the ground is uneven, and provide an inactive fixed state.

[0060] The leveling device 32 can be installed on the lower horizontal or vertical frame, preferably on the lower portion of each of the four vertical frames. This installation helps stabilize the center of gravity during leveling and supports vertical loads without exposing the upper ends of the bolts when raising or lowering the bolts.

[0061] The horizontal adjustment device 32 is composed of a bolt portion 32a connected to the frame and a ground support portion 32b in contact with the ground. If the ground support portion 32b is rotated to one side, the bolt portion 32a protrudes or is retracted from the vertical frame, thereby causing the ground support portion 32b to rise and fall.

[0062] Therefore, after the ground support part 32b is rotated and contacts the ground, if it continues to rotate, the moving device 31 is separated from the ground, and the position of the vacuum pump storage fixing part 3 is fixed. In the case of misalignment, the rotation direction of any one or more of the four level adjustment devices is adjusted to protrude or retract, thereby adjusting the level.

[0063] In addition, like the moving device 31, two fixing devices 33 are installed on the horizontal frames at both ends of each lower part, so that when the horizontal adjustment is completed by the horizontal adjustment device 32, the vacuum pump storage fixing part 3 is fixed to the ground.

[0064] The fixing device 33 consists of a bent bracket structure, with a vertical fastening portion 331 on one side bolted to the lower frame, and a horizontal fastening portion 332 on the other side secured to the ground using a fastening device such as an anchor bolt. The vertical and horizontal fastening portions each have one or more elongated holes 331a and 332a.

[0065] Therefore, by adjusting the height of the horizontal adjustment device 32, even if the height of the horizontal frame of the vertical fastening portion changes slightly, the fastening height can be fully adjusted within the range of the long hole.

[0066] Similarly, the horizontal fastening portion can also adjust the fastening positions at predetermined intervals when fastening fastening devices such as anchor bolts to the ground.

[0067] The bearing portion 4 is installed to protrude inward from the upper end of the receiving and fixing portion to support the weight of the capture device and enable the vacuum pump and pipeline located at the lower portion to be vertically connected.

[0068] At this time, in order to connect the pipe between the vacuum pump located at the bottom and the capture device, the support part is installed in a state where an open part 4a is formed. The open part 4a is open from the side where the capture device enters at least to the central part of the installation pipe. In order to stably support the load of the support part, the horizontal frame 3a that constitutes the upper part of the storage fixing part and the multiple support members 4b installed on the vertical frame 3b protrude inward and support the lower part, so that the support part has a stable structure in an outward eight-shaped shape.

[0069] In addition, the carrying part 4 is equipped with a transfer device 41 so that it can move smoothly during the process of carrying and replacing the capture device with increased capacity, and the position of the vacuum pump room located at the bottom can be easily adjusted in the carrying state.

[0070] If the load-carrying unit 4, equipped with this transfer device 41, is raised to the load-carrying unit above the vacuum pump using a lift or forklift, the operator uses the transfer device 41 to horizontally move the capture device and align the discharge port protruding from the bottom of the capture device with the inlet protruding from the top of the vacuum pump, thereby adjusting the vertical pipe connection. This transfer device equipped with a load-carrying unit allows the capture device's position to be adjusted while supporting its weight.

[0071] The transfer devices 41 are provided in plurality on the support portion 4 mounted on either side of the upper end of the storage and fixing portion 3. Preferably, these devices are constructed from casters, rollers, or balls, etc., to reduce friction during movement while adequately supporting the load of the capture device. Preferably, six transfer devices are installed on each side, for a total of twelve, each capable of supporting a load of 400 kg. Each transfer device can be individually secured to the plate forming the support portion 4, allowing for replacement in the event of a malfunction or other repair.

[0072] The capture device support portion 5 is a structure that surrounds and supports the capture device so as to prevent damage or safety accidents caused by falling when the capture device is supported on the upper portion of the support portion.

[0073] To this end, the capture device support portion 5 is formed into a structure by welding or fastening a plurality of horizontal frames 5a and a plurality of vertical frames 5b, and is composed of an octagonal structure having an open portion 5c with one side open so that the capture device can enter the supporting portion.

[0074] However, to prevent the capture device from falling through the open side opening 5c ​​when it is moved inward and positioned, the capture device support portion has protruding receiving portions 51a at a point on each vertical frame 5b located on both sides of the opening. When the stopper 51 is stored, the capture device is prevented from falling. In this case, the stopper 51 can be configured to be fixed to the receiving portion by a fastening device and cannot be separated.

[0075] In addition, support pads 52 for absorbing shock and preventing separation are respectively provided on the inner sides of the three horizontal frames 5a constituting the upper end of the capture device support portion 5, thereby supporting the outer side surfaces of the capture device in contact.

[0076] The support pad 52 is preferably made of an elastic silicone pad. If made of this material, when the capture device is installed, it can shrink due to contact and generate elastic force to stably support the capture device, thereby absorbing various impacts during operation or preventing the capture device from separating.

[0077] Pipe 6 is a pipe that vertically connects the vacuum pump and the capture device. It is configured in the form of a bellows instead of a straight pipe. Therefore, even if a certain degree of gap occurs between the inlet protruding from the upper part of the vacuum pump and the outlet protruding from the lower part of the capture device, it can be absorbed and the position can be easily adjusted to connect vertically.

[0078] At this time, a valve 61 is formed at the lower part of the pipe to control the flow path of the exhaust gas flowing through the pipe. As an embodiment, the valve 61 is installed on the upper end side of the vacuum pump and the lower part of the pipe to control the opening and closing of the exhaust gas flow path.

[0079] The upper end structure of the valve protrudes to form a tube connected to the pipeline, and the lower end structure protrudes to form a tube connected to the upper end inlet of the vacuum pump.

[0080] As mentioned above, the valves connecting the upper and lower ends of the capture device and vacuum pump can be automatic or manual valves, opening and closing the flow path of the exhaust gas flowing through the pipe. The automatic valves are internally opened and closed by an actuator or other mechanism based on a remote signal, while the manual valves are internally opened and closed mechanically by rotating a knob (handle). For reference, this flow of exhaust gas is generated by drawing air into the processing chamber and capture device through the inlet pipe of the vacuum pump, creating a vacuum state.

[0081] The above-mentioned valve types and structures can be selected from known valves, so the specific internal structure will not be described in detail.

[0082] The vacuum pump receiving and fixing portion 3, the bearing portion 4, and the capture device support portion 5 described above are configured to be constructed in an integrated manner from the beginning, or to be assembled into one piece on site by welding or bolts, accessories or known fastening devices without separation.

[0083] Figure 4 is an example diagram showing the process of carrying a capture device on a reaction byproduct capture system for a narrow space according to an embodiment of the present invention; Figure 5 is an example diagram showing the process of replacing a capture device in a reaction byproduct capture system for a narrow space according to an embodiment of the present invention; and Figure 6 is an example diagram showing the structure of a semiconductor manufacturing plant in which a reaction byproduct capture system for a narrow space according to an embodiment of the present invention is installed.

[0084] With reference to the accompanying drawings, the installation and replacement process of the capture system for use in confined spaces according to the present invention, as well as a semiconductor manufacturing plant in which such a capture system is installed, will be described. For ease of description, the following example uses a structure in which the storage and fixing portion 3, the carrying portion 4, and the capture device support portion 5 are integrated from the outset. References not shown in the accompanying drawings refer to Figures 1 to 3.

[0085] After the storage and fixing part 3 equipped with a moving device 31 is moved to the vacuum pump 1 installed and fixed in the sub-factory b with a limited vertical height space (for example, about 2 meters) and surrounds it, the level adjustment device 32 is used to adjust the height according to the ground condition and align it to the level, and then it is fixed to the ground using fastening devices such as anchor bolts.

[0086] Then, using a lifter f or a forklift, the capture device is placed on the transfer device 41 of the carrier 4 located at the upper end of the vacuum pump. In this case, while being elastically supported by the support pad 52 formed inside the capture device support portion 5, which has one side open, the capture device is moved horizontally by the moving device to align the discharge port protruding from the lower part of the capture device with the inlet protruding from the upper part of the vacuum pump.

[0087] Then, with the positions aligned, the open side of the capture device support 5 is blocked with a stopper 51 to prevent the increased-capacity capture device from falling. When this step is performed, the height, including the vacuum pump and capture device, is less than 2 meters, making installation easy and enabling the expansion of reaction byproduct processing capacity through the sub-plant.

[0088] Then, the pipe 6 installed at the upper end of the vacuum pump to absorb the gap is used to connect the discharge ports protruding to the lower part of the capture device.

[0089] Then, the upper inlet of the capture device is connected to the vertical pipe that exhausts the exhaust gas from the processing chamber d installed inside the clean room c of the main factory a. Depending on the situation, this process can also be performed before connecting the pipe.

[0090] After the process is completed, the processing chamber of the main plant, the capture device and the vacuum pump are connected through vertical pipes, and the vacuum pump is connected to the scrubber using horizontal pipes in the side direction.

[0091] Then, open the valve 61 installed between the lower part of the pipeline 6 and the upper end of the vacuum pump.

[0092] Then, the vacuum pump is started to form a vacuum state inside the capture device and the processing chamber, and process gas is supplied to the processing chamber to manufacture semiconductors on the wafer. After the reaction by-products contained in the exhaust gas discharged during this process are captured in the capture device, the remaining exhaust gas is discharged to the scrubber e through the vacuum pump located at the bottom.

[0093] As described above, the present invention, while having a capture device with increased capacity, eliminates the curved piping structure conventionally used to connect the large-capacity capture device to the vacuum pump. Therefore, during operation, the exhaust gas discharged from the capture device to the vacuum pump does not swirl at the bend of the curved piping, thereby preventing the generation of reaction byproducts within the piping.

[0094] Then, after the capture device in the increased capacity state has been operating for a longer period of time than the previous embedded capture device, if the processing capacity reaches its limit, the operation of the processing chamber is terminated or switched to an idle state, and then the valve 61 of the pipeline 6 is closed. The capture device with the limiter removed is horizontally moved from the load-bearing part using a lift or a forklift, loaded, and then lowered, and then a new capture device with increased capacity is replaced.

[0095] The present invention is not limited to the above-mentioned specific preferred embodiments. Without exceeding the scope of the invention as defined in the patent application, technicians in the technical field to which the present invention belongs may make various changes in its implementation, and such changes are also within the scope of the patent application.

[0096] 1: Vacuum pump 11: Inlet 12: Exhaust port 2: Capture device 21: Inlet 22: Exhaust port 3: Vacuum pump storage and fixing part 3a: Horizontal frame 3b: Vertical frame 3c: Open Department 31: Mobile Device 32: Horizontal adjustment device 32a: Bolt part 32b: Ground support 33: Fixtures 331: Vertical fastening portion 332: horizontal fastening portion 331a, 332a: long holes 4: Bearing part 4a: Opening 4b: Supporting member 41: Transfer device 5: Capture device support 5a: Horizontal frame 5b: Vertical frame 5c: Open Department 51: Limiter 51a: Storage 52: Support pad 6: Pipeline 61: Valve a: Main factory b: Sub-factory c: Clean room d: Processing chamber e: Scrubber f: lift

Claims

1. A reaction byproduct capture system, comprising a structure for capturing reaction byproducts in confined spaces that prevents the formation of reaction byproducts within connecting pipes and is easily replaceable, and includes: A vacuum pump (1) is fixed to the ground of a sub-factory, which constitutes the lower level of a main factory; A capture device (2), the capture device (2) having a capacity greater than that of an embedded capture device, for capturing reaction byproducts from exhaust gas discharged from a processing chamber and discharging them downwards; a vacuum pump housing and fixing part (3), including a moving device (31) that surrounds the vacuum pump fixed on the ground and moves thereby, a leveling device (32) for adjusting the level, and a fixing device (33) fixed on the ground; a bearing part (4), mounted on the upper end of the vacuum pump housing and fixing part (3) to support the load of the capture device (2), and having a transfer device (41) for adjusting the position of the capture device and replacing the capture device; a capture device support part (5), mounted on the upper part of the bearing part (4) to surround and fix the capture device (2); a pipe (6), vertically connecting the vacuum pump (1) and the capture device (2) and absorbing gaps; and a valve (61), installed in the flow path of exhaust gas flowing through the pipe.

2. The reaction byproduct capture system according to claim 1, wherein, The vacuum pump housing and fixing part (3) uses welding or fastening devices to form a structure of a plurality of horizontal frames (3a) and a plurality of vertical frames (3b), and is an octagonal structure with an open part (3c) on one side so that the vacuum pump (1) can enter.

3. The reaction byproduct capture system according to claim 1, wherein, The moving device (31) is composed of one or more rotating bodies, such as a plurality of freely rotating casters, balls, or rollers; wherein the leveling device (32) is composed of a bolt part (32a) fixed to the frame and a ground support part (32b) in contact with the ground, and the bolt part (32a) is raised and lowered by rotating the ground support part (32b); and wherein the fixing device (33) is composed of a vertical fastening part (331) fastened to the frame by bolts and a horizontal fastening part (332) fastened to the ground, and one or more elongated holes (331a, 332a) are formed on the vertical fastening part and the horizontal fastening part, respectively.

4. The reaction byproduct capture system according to claim 1, wherein, The carrying part (4) has an opening (4a) that opens from the side where the capturing device (2) enters to the central part where the pipe is installed, and has a transfer device (41) for carrying and replacing the capturing device (2) with increased capacity and for adjusting the position of the capturing device (2).

5. The reaction byproduct capture system according to claim 4, wherein, The transfer device (41) is equipped with a plurality of bearing parts (4) on both sides of the upper end of the vacuum pump housing and fixing part (3), and is composed of any one of the following rotating bodies: caster, roller or ball.

6. The reaction byproduct capture system according to claim 1, wherein, The capture device support (5) is formed by welding or fastening a plurality of horizontal frames (5a) and a plurality of vertical frames (5b) into a structure, and is an octagonal structure with an open part (5c) on one side so that the capture device (2) can enter the support part (4). A limiter (51) is inserted in a storage part (51a) protruding to the outside of the vertical frames (5b) on both sides of the open part (5c) to prevent the capture device (2) from falling.

7. The reaction byproduct capture system according to claim 1, wherein, The capture device support (5) is equipped with a support pad (52) for absorbing impact and preventing separation on the inner side of a horizontal frame (5a) that forms the three sides of the upper end, so as to support the outer side of the capture device (2) that is in contact.

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