Manufacturing method of high-density terminal module and high-density terminal module

Abstract

A method for manufacturing a high-density terminal module includes: attaching a transient substrate to a carrier substrate via a first desiccant layer, the carrier substrate having multiple carrier regions, the first desiccant being selected from the group consisting of low-temperature hydrolytic adhesive, cold-dissolving adhesive, and thermally dissolving adhesive, wherein each carrier region has multiple openings, a vacuum nozzle action area, and a terminal adhesion area; attaching multiple sets of columnar conductors to the terminal adhesion areas of the carrier regions via a second desiccant layer, the sets of columnar conductors being correspondingly erected above the terminal adhesion areas of the carrier regions and distributed in the terminal adhesion areas of the carrier regions in a predetermined pattern, wherein the debonding conditions of the second desiccant are different from those of the first desiccant; performing a curing process on the second desiccant layer to fix the sets of columnar conductors; performing a first debonding operation on the first desiccant layer to remove the transient substrate and the first desiccant layer; and performing a longitudinal cutting process along the boundaries of the carrier regions to produce multiple terminal modules.

Description

[Technical Field]

[0001] This invention relates to terminal modules, and more particularly to a high-density terminal module used in semiconductor packaging. [Previous Technology]

[0002] With the evolution of semiconductor manufacturing processes, the packaging of many chips has involved the installation of high-density pin terminals on wafers or circuit boards.

[0003] However, the traditional pin terminal installation process usually uses a pick and place method, which results in poor pin terminal installation efficiency.

[0004] In addition, the packaging process of conventional high-density leaded chips uses solder balls as leads. In detail, the lead forming process includes: forming a plurality of through holes on a substrate by etching; performing an electroplating process on the through holes to form a plurality of conductive through holes; and fixing a solder ball on the opening of each of the conductive through holes to form a lead structure.

[0005] However, the pin formation process still has the following disadvantages: 1. The etching process is not easy to produce through holes with a high aspect ratio on the substrate; 2. The electroplating process increases costs; and 3. The instability of the solder ball fixing process can also cause height differences in the pin bonding points.

[0006] To solve the above problems, there is an urgent need in the field for a novel high-density terminal module. [Summary of the Invention]

[0007] One objective of the present invention is to provide a method for manufacturing a high-density terminal module, which can set multiple sets of terminals on multiple carrier areas of a tooling board by a batch terminal arranging process and cut the tooling board by a batch cutting process to produce multiple terminal modules, thereby efficiently meeting the pin mounting requirements of multiple circuit units on a wafer or a circuit board.

[0008] Another object of the present invention is to provide a method for manufacturing a high-density terminal module, which can optimize the resin sealing effect of each circuit unit by providing a plurality of openings on the carrier substrate of each terminal module, wherein each circuit unit is attached to the carrier substrate and a resin sealing process is performed in an injection mold through the openings of the carrier substrate.

[0009] Another object of the present invention is to provide a method for manufacturing a high-density terminal module, which can effectively prevent the columnar conductor from being tilted by lateral impact, and can also ensure that the central area of ​​the terminal module is fully injected with resin.

[0010] Another object of the present invention is to provide a method for manufacturing a high-density terminal module, which can remove impurities between each of the circuit units and the carrier substrate by means of the openings before the top-fill resin sealing process is performed.

[0011] To achieve the above objective, a method for manufacturing a high-density terminal module is proposed, comprising: attaching a transient substrate to a carrier substrate via a layer of a first desiccant, the carrier substrate having multiple carrier areas, the first desiccant being selected from the group consisting of low-temperature hydrolytic adhesive, cold-dissolving adhesive, and thermally dissolving adhesive, wherein each carrier area has multiple openings, a vacuum nozzle action area, and a terminal adhesion area; attaching multiple sets of columnar conductors to the terminal adhesion areas of the carrier areas via a layer of a second desiccant, the sets of columnar conductors being correspondingly erected above the terminal adhesion areas of the carrier areas and all being distributed in the terminal adhesion areas of the carrier areas in a predetermined pattern, wherein the debonding conditions of the second desiccant are different from those of the first desiccant; and performing a curing process on the second desiccant to fix the sets of columnar conductors. A first debonding operation is performed on the first debonded adhesive layer to remove the transient substrate and the first debonded adhesive layer; and a longitudinal cutting process is performed on the carrier substrate along the boundaries of the carrier areas to produce a plurality of terminal modules.

[0012] In one embodiment, the method of manufacturing the high-density terminal module further includes using a vacuum nozzle device to adsorb the vacuum nozzle action area of ​​the terminal module to pick up the terminal module.

[0013] In one embodiment, the terminal modules are used to thermo-press-bond with a plurality of circuit units on a wafer or a circuit board to provide pins for a plurality of pads of each circuit unit, and the pads of each circuit unit have the same distribution pattern as the predetermined pattern.

[0014] In one embodiment, after each terminal module is joined to the corresponding circuit unit, each circuit unit can undergo an injection resin sealing process in an injection mold through the openings of the carrier substrate while a unit of the carrier substrate is attached.

[0015] In one embodiment, after the injection resin sealing process, each of the circuit units can remove one of the units of the second desiccant layer to which it is attached and the unit of the carrier substrate via a second desiccant operation.

[0016] In one embodiment, after the top-fill resin sealing process, each of the circuit units can remove one of the units of the second descalable layer to which it is attached and the unit of the carrier substrate by a grinding operation.

[0017] In possible embodiments, the material of the columnar conductor may include gold, silver, platinum, copper, nickel, tin, lead or manganese.

[0018] In possible embodiments, the material of the transient substrate may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4).

[0019] In possible embodiments, the material of the carrier substrate may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4).

[0020] In one embodiment, the longitudinal cutting process is implemented using a laser device.

[0021] In one embodiment, the thickness of the carrier substrate at the boundary of the carrier regions is less than the thickness of the remaining portion.

[0022] To achieve the above objective, the present invention further proposes a high-density terminal module, which is the terminal module manufactured by the method described above for manufacturing a high-density terminal module.

[0023] To enable your review committee to further understand the structure, features, purpose and advantages of the present invention, detailed description of the preferred embodiments is attached below with drawings.

Implementation Method

[0025] Please refer to Figure 1, which illustrates a flowchart of one embodiment of the manufacturing method of the high-density terminal module of the present invention.

[0026] As shown in Figure 1, the manufacturing method of the high-density terminal module includes: attaching a transient substrate to a carrier substrate via a layer of first desiccant, the carrier substrate having multiple carrier areas, the first desiccant being selected from a group consisting of low-temperature hydrolytic adhesive, cold-dissolving adhesive, and thermally dissolving adhesive, wherein each carrier area has multiple openings, a vacuum nozzle action area, and a terminal adhesion area (step a); attaching multiple sets of columnar conductors to the terminal adhesion areas of the carrier areas via a layer of second desiccant, the sets of columnar conductors correspondingly standing upright in the carrier areas. The terminal adhesion areas are all distributed in a predetermined pattern above the terminal adhesion areas of the carrier areas, wherein the debonding conditions of the second debonded adhesive are different from those of the first debonded adhesive (step b); a curing process is performed on the second debonded adhesive layer to fix the columnar conductors (step c); a first debonding operation is performed on the first debonded adhesive layer to remove the transient substrate and the first debonded adhesive layer (step d); and a longitudinal cutting process is performed on the carrier substrate along the boundaries of the carrier areas to generate a plurality of terminal modules (step e).

[0027] After the process is completed, the resulting terminal modules can be thermo-pressed to correspond with multiple circuit units on a wafer or a circuit board to provide pins for multiple pads of each circuit unit. It is worth mentioning that the pads of each circuit unit have the same distribution pattern as the predetermined pattern. Accordingly, the present invention enables batch mounting of terminals for multiple circuit units on a wafer or a circuit board.

[0028] In addition, the above-mentioned method for manufacturing high-density terminal modules may further include using a vacuum nozzle device to adsorb the vacuum nozzle working area of ​​the terminal modules to pick up the terminal modules, wherein the nozzle diameter of the vacuum nozzle device is about 6mm.

[0029] It is worth mentioning that after each terminal module is joined to the corresponding circuit unit, each circuit unit can undergo an injection-type resin sealing process in an injection mold through the openings of the unit on the carrier substrate, while the unit is attached to the carrier substrate. Furthermore, before performing the injection-type resin sealing process, these openings can also be used to remove impurities between each circuit unit and the unit on the carrier substrate.

[0030] It is worth mentioning that the traditional side-injection resin sealing process may cause the columnar conductor to be skewed by impact, and the injected resin is not easy to reach the central area of ​​the terminal module; while the design of the present invention can not only make each of the circuit units accept the top-injection resin sealing process to effectively avoid the columnar conductor being skewed by impact, but also make the central area of ​​the terminal module fully injected with resin.

[0031] In addition, after the top-fill resin sealing process, each of the circuit units can remove the attached unit of the second desiccant layer and the unit of the carrier substrate by a second debonding operation, or remove the attached unit of the second desiccant layer and the unit of the carrier substrate by a grinding operation. The second debonding operation is substantially mutually exclusive with the first debonding operation. For example, when the first debonding operation is a low-temperature hydrolysis operation, the second debonding operation is a high-temperature hydrolysis operation (that is, the second desiccant is a high-temperature hydrolytic adhesive in this case); when the first debonding operation is a cold debonding operation, the second debonding operation is a hot debonding operation; and so on.

[0032] In addition, the material of the columnar conductor may include gold, silver, platinum, copper, nickel, tin, lead or manganese; the material of the transient substrate may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4); the material of the carrier substrate may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4).

[0033] In addition, the longitudinal cutting process is implemented using a laser device.

[0034] In addition, it is worth mentioning that the thickness of the boundary of the carrier substrate in these carrier areas may be less than the thickness of the rest of the substrate to facilitate the longitudinal cutting process.

[0035] In addition, in possible embodiments, the hydrolysis threshold temperature of the low-temperature hydrolyzed adhesive is about 25°C, the hydrolysis threshold temperature of the high-temperature hydrolyzed adhesive is about 80°C, the debonding threshold temperature of the cold-dissolving adhesive is about 20°C, and the debonding threshold temperature of the thermal-dissolving adhesive is about 50°C.

[0036] As can be seen from the above description, the present invention can efficiently batch manufacture high-density terminal modules according to the aforementioned high-density terminal module manufacturing method to meet the needs of advanced semiconductor packaging processes. Please refer to Figures 2a to 2d, which are schematic diagrams of the manufacturing process of the high-density terminal module of the present invention. As shown in Figures 2a to 2d, the high-density terminal module is formed through the following steps (i) to (iv):

[0037] (a) A transient substrate 10 is attached to a carrier substrate 12 via a first descalable adhesive 11. The carrier substrate 12 has a plurality of carrier areas 12a (as shown in FIG2a). The first descalable adhesive 11 may be a low-temperature hydrolyzable adhesive, a cold descalable adhesive, or a thermal descalable adhesive. The low-temperature hydrolyzable adhesive has a first hydrolysis threshold temperature, the cold descalable adhesive has a first descaling threshold temperature below room temperature, and the thermal descalable adhesive has a second descaling threshold temperature above room temperature.

[0038] (ii) Multiple sets of columnar conductors 14 are attached to the carrier areas 12a via a layer of second descalable adhesive 13. The sets of columnar conductors 14 are correspondingly erected above the carrier areas 12a and are distributed in the carrier areas 12a in a predetermined pattern. A curing process is performed on the layer of second descalable adhesive 13 to fix the sets of columnar conductors 14. The fixing process is a heat curing process or an ultraviolet light curing process (as shown in Figure 2b).

[0039] (iii) A first debonding operation is performed on the first debonded adhesive layer 11 to remove the transient substrate 10 and the first debonded adhesive layer 11 (as shown in FIG2c), wherein, when the first debonded adhesive layer 11 is the low-temperature hydrolyzable adhesive, the first debonding operation includes placing the first debonded adhesive layer 11 in water below the first hydrolysis threshold temperature; when the first debonded adhesive layer 11 is the cold-dissolving adhesive, the first debonding operation includes placing the first debonded adhesive layer 11 in a space below the first debonding threshold temperature; when the first debonded adhesive layer 11 is the thermally dissolving adhesive, the first debonding operation includes placing the first debonded adhesive layer 11 in a space above the second debonding threshold temperature; and

[0040] (iv) A longitudinal cutting process is performed on the carrier substrate 12 along the boundaries of the carrier areas 12a to produce a plurality of terminal modules 15 (as shown in FIG2d).

[0041] In detail, the material of the columnar conductor 14 may include gold, silver, platinum, copper, nickel, tin, lead or manganese.

[0042] In addition, the terminal modules 15 are used to thermo-press and bond with a plurality of circuit units on a wafer or a circuit board to provide pins for a plurality of pads of each circuit unit, and the pads of each circuit unit have the same distribution pattern as the predetermined pattern to facilitate batch mounting of pins.

[0043] Please refer to Figures 3a to 3c together, which are schematic diagrams of three embodiments of the terminal module 15. As shown in Figures 3a to 3c, each of the bearing areas has a vacuum nozzle action area 15a, multiple openings 15b and a terminal adhesion area 15c.

[0044] Accordingly, the manufacturing method of the high-density terminal module of the present invention can utilize a vacuum suction device (not shown in the figure) to adsorb the vacuum suction nozzle action area 15a of the terminal modules 15 to pick up the terminal modules 15, wherein the suction nozzle diameter of the vacuum suction device is approximately 6 mm. In addition, the terminal adhesion area 15c of the bearing area can adhere a plurality of columnar conductors 14 via a layer of second desiccant 13, wherein the debonding conditions of the second desiccant 13 are different from those of the first desiccant 11.

[0045] It is worth mentioning that after each terminal module 15 is joined to the corresponding circuit unit, each circuit unit can undergo an injection-type resin sealing process in an injection mold through the openings 15b of the unit on the carrier substrate 12, while one unit of the carrier substrate 12 is attached to it. In addition, before performing the injection-type resin sealing process, the openings 15b can also be used to remove impurities between each circuit unit and the unit on the carrier substrate 12.

[0046] In addition, after the injection-type resin sealing process, each of the circuit units can remove one unit of the second desiccant layer 13 and the unit of the carrier substrate 12 attached to it via a second debonding operation, or remove one unit of the second desiccant layer 13 and the unit of the carrier substrate 12 attached to it via a grinding operation. The second debonding operation is substantially mutually exclusive with the first debonding operation. For example, when the first debonding operation is a low-temperature hydrolysis operation, the second debonding operation is a high-temperature hydrolysis operation (that is, the second desiccant is a high-temperature hydrolytic adhesive in this case); when the first debonding operation is a cold debonding operation, the second debonding operation is a hot debonding operation; and so on.

[0047] In addition, the material of the transient substrate 10 may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4); and the material of the carrier substrate 12 may include aluminum, copper, stainless steel or glass-reinforced epoxy laminate (FR4).

[0048] In addition, the longitudinal cutting process can be implemented using a laser device.

[0049] In addition, it is worth mentioning that the thickness of the carrier substrate 12 at the boundary of the carrier area 12a may be less than the thickness of the rest of the portion to facilitate the longitudinal cutting process.

[0050] Based on the above design, the present invention has the following advantages: 1. The manufacturing method of the high-density terminal module of the present invention can set multiple sets of terminals on multiple carrier areas of a tooling plate by a batch terminal alignment process, and cut the tooling plate by a batch cutting process to produce multiple terminal modules, thereby efficiently meeting the pin mounting requirements of multiple circuit units on a wafer or a circuit board; 2. The manufacturing method of the high-density terminal module of the present invention can provide multiple openings on the carrier substrate of each terminal module, so that each circuit unit can be subjected to an injection resin sealing process in an injection mold through the openings of the carrier substrate while one unit of the carrier substrate is attached, thereby optimizing the resin sealing effect of each circuit unit; Third, the manufacturing method of the high-density terminal module of the present invention can effectively prevent the columnar conductor from being tilted by lateral impact, and can also ensure that the central area of ​​the terminal module is fully injected with resin; and fourth, the manufacturing method of the high-density terminal module of the present invention can remove impurities between each circuit unit and the carrier substrate by means of these openings before performing the above-injection resin sealing process.

[0051] The embodiments disclosed in this case are preferred embodiments. Any partial changes or modifications that are derived from the technical ideas of this case and can be easily deduced by those skilled in the art are not outside the scope of the patent rights of this case.

[0052] In summary, this case demonstrates that its purpose, means and effects are distinct from conventional technology, and its invention is practical and meets the requirements for a patent. We earnestly request that your esteemed examiner carefully review the case and grant a patent as soon as possible to benefit society. This is our utmost prayer. [Simplified Explanation of the Diagram]

[0024] Figure 1 illustrates a flowchart of one embodiment of the manufacturing method of the high-density terminal module of the present invention; Figures 2a to 2d are schematic diagrams of the manufacturing process of the high-density terminal module of the present invention; and Figures 3a to 3c are schematic diagrams of three embodiments of the terminal module of the present invention.

Claims

1. A method for manufacturing a high-density terminal module, comprising: attaching a transient substrate to a carrier substrate via a first desiccant, the carrier substrate having a plurality of carrier regions, wherein the first desiccant is selected from the group consisting of low-temperature hydrolyzable adhesives, cold-dissolving adhesives, and thermally dissolving adhesives, wherein... Each of the carrier areas has multiple openings, a vacuum nozzle area, and a terminal adhesion area; multiple sets of columnar conductors are adhered to the terminal adhesion areas of the carrier areas via a layer of second descalable adhesive. These sets of columnar conductors are correspondingly erected above the terminal adhesion areas of the carrier areas and are distributed in a predetermined pattern within the terminal adhesion areas of the carrier areas. The debonding conditions of the second descalable adhesive are different from those of the first descalable adhesive; a curing process is performed on the second descalable adhesive layer to fix the sets of columnar conductors; a first debonding operation is performed on the first descalable adhesive layer to remove the transient substrate and the first descalable adhesive layer; and a longitudinal cutting process is performed along the boundaries of the carrier areas to generate multiple terminal modules.

2. The method for manufacturing a high-density terminal module as described in claim 1, further comprising using a vacuum nozzle device to adsorb the vacuum nozzle action area of ​​the terminal modules to pick up the terminal modules.

3. The method for manufacturing a high-density terminal module as described in claim 1, wherein, These terminal modules are used to thermocouple with multiple circuit units on a wafer or a circuit board to provide pins for multiple pads of each circuit unit, and the pads of each circuit unit have the same distribution pattern as the predetermined pattern.

4. The method for manufacturing a high-density terminal module as described in claim 3, wherein, After each terminal module is joined to the corresponding circuit unit, each circuit unit can undergo an injection resin sealing process in an injection mold through the openings of the carrier substrate, with one of the units attached to the carrier substrate.

5. The method for manufacturing a high-density terminal module as described in claim 4, wherein, After the resin sealing process, each of the circuit units can remove the second adhesive layer to which it is attached and the unit of the carrier substrate via a second debonding operation.

6. The method for manufacturing a high-density terminal module as described in claim 4, wherein, After the resin sealing process, each of the circuit units can have the second removable adhesive layer attached to it and the unit on the carrier substrate removed by a grinding operation.

7. The method for manufacturing a high-density terminal module as described in claim 1, wherein, The material of the columnar conductor comprises one metal selected from the group consisting of gold, silver, platinum, copper, nickel, tin, lead and manganese.

8. A method for manufacturing a high-density terminal module as described in claim 1, wherein, The material of the transient substrate is selected from the group consisting of aluminum, copper, stainless steel and glass-reinforced epoxy laminate (FR4).

9. A method for manufacturing a high-density terminal module as described in claim 1, wherein, The material of the substrate is selected from the group consisting of aluminum, copper, stainless steel and glass-reinforced epoxy laminate (FR4).

10. A method for manufacturing a high-density terminal module as described in claim 1, wherein, The longitudinal cutting process is achieved using a laser device.

11. A method for manufacturing a high-density terminal module as described in claim 1, wherein, The thickness of the substrate at the boundaries of these bearing areas is less than the thickness of the rest.

12. A high-density terminal module, which is manufactured by the method of manufacturing a high-density terminal module as described in any one of claims 1 to 9.

Images