Sheet picking method and sheet picking apparatus

Abstract

This invention discloses a sheet-picking method and a sheet-picking device. The sheet-picking method includes: a preparation step: fixing an object to be processed on a stage; wherein the object to be processed includes an adhesive film, a plurality of sheets bonded to the adhesive film at intervals, and a plurality of fragments bonded to the adhesive film and respectively adjacent to the plurality of sheets; a pushing step: pushing the adhesive film with a pusher to lift one of the sheets, defined as a target sheet; and a picking step: using a sheet picker to hold and separate the target sheet from the adhesive film, and using a fragment processor arranged around the sheet picker to remove at least one of the fragments adjacent to the target sheet and detached from the adhesive film.

Description

[Technical Field]

[0001] This invention relates to an acquisition method and acquisition device, and more particularly to a slice acquisition method and slice acquisition device. [Previous Technology]

[0002] Existing sheet-removal methods or devices mostly focus on how to remove the target sheet from multiple sheets. However, there are often particles around the multiple sheets. During the process of removing the target sheet, the particles may fly up and fall onto other sheets, thus causing contamination.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned defects. [Summary of the Invention]

[0004] The present invention provides a slice acquisition method and a slice acquisition device, which can improve the defects that may occur in existing slice acquisition methods or existing slice acquisition devices.

[0005] This invention discloses a sheet-picking method, comprising: a preparation step: fixing an object to be processed onto a stage; wherein the object to be processed comprises: an adhesive film having a first surface and a second surface located on opposite sides; a plurality of sheets, spaced apart from each other and adhered to the first surface; and a plurality of fragments, adhered to the first surface and respectively adjacent to the plurality of sheets; a pushing step: pushing a pusher against the second surface of the adhesive film to lift one of the sheets, defined as a target sheet; and a picking step: using a sheet picker to hold and separate the target sheet from the adhesive film, and using a fragment processor disposed around the sheet picker to remove at least one of the fragments adjacent to the target sheet and detached from the adhesive film.

[0006] This invention also discloses a sheet-grabbing device, comprising: a stage for fixing an adhesive film; wherein the adhesive film has a first surface and a second surface located on opposite sides, and the adhesive film has a plurality of sheets spaced apart from each other and a plurality of fragments respectively adjacent to the plurality of sheets bonded to the first surface; a pusher disposed corresponding to the stage and facing the second surface of the adhesive film; wherein the pusher is used to push a sheet, defined as a target sheet, by pushing against the second surface of the adhesive film; and a picking mechanism disposed corresponding to the pusher, and the picking mechanism comprising: a sheet picker for holding the target sheet to separate the target sheet from the adhesive film; and a fragment processor disposed around the sheet picker; wherein, during the separation of the target sheet from the adhesive film, the fragment processor is used to remove at least one fragment adjacent to the target sheet and detached from the adhesive film.

[0007] An embodiment of the present invention further discloses a sheet picking method, which includes: a preparation step: fixing an object to be processed on a stage; wherein the object to be processed includes: an adhesive film having a first surface and a second surface located on opposite sides; a plurality of sheets, spaced apart from each other and adhered to the first surface; and a plurality of fragments, adhered to the first surface and respectively adjacent to the plurality of sheets; and a separation step: using a sheet picker to pick up one of the sheets, which is defined as a target sheet, and using a pusher to push against the second surface of the adhesive film to lift the target sheet, so that the target sheet separates from the adhesive film, and using a fragment processor arranged around the sheet picker to remove at least one of the fragments adjacent to the target sheet and detached from the adhesive film.

[0008] In summary, the sheet-retrieving method and sheet-retrieving device disclosed in the embodiments of the present invention can remove the fragments that have detached from the adhesive film by means of the fragment processor arranged around the sheet-retrieving device, thereby effectively preventing the flying fragments from contaminating the sheet outside the target sheet.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention in any way.

Implementation Method

[0023] The following specific embodiments illustrate the implementation of the "sheet acquisition method and sheet acquisition device" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustration only and are not depictions based on actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0024] It should be understood that although terms such as “first,” “second,” and “third” may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term “or” as used herein may include, as appropriate, any combination of any one or more of the associated listed items.

[0025] [Example 1]

[0026] Please refer to Figures 1 to 8, which illustrate Embodiment 1 of the present invention. As shown in Figure 1, this embodiment discloses a slice extraction method S100, which preferably includes (or implements) the following steps in sequence: a preparatory step S110, a preparation step S120, a pushing step S130, and an extraction step S140, but the present invention is not limited thereto. For example, the pushing step S130 and the extraction step S140 may be implemented simultaneously in at least part of the process; or, in other embodiments of the present invention not shown, the preparatory step S110 may be omitted or replaced in other ways according to actual needs. The following will describe the multiple steps S110 to S140 of the slice extraction method S100 in sequence.

[0027] The pre-processing step S110: As shown in Figures 1 to 3, a workpiece M to be processed and a single-piece picking device 100 are provided. In this embodiment, the workpiece M to be processed includes an adhesive film M1 and at least one plate M2 placed on the adhesive film M1. The plate M2 has multiple transverse dividing lines T1 and multiple longitudinal dividing lines T2 formed in the pre-processing step S110 to form multiple separate pieces M21 and multiple fragments M22. In this embodiment, the plate M2 is elongated and there are multiple pieces. The pieces M2 can be a carrier board, a circuit board, a glass plate, a ceramic plate, or a wafer, depending on actual needs. This invention does not limit the types of materials used.

[0028] It should be further noted that the plurality of horizontal dividing lines T1 are preferably parallel to each other, and the plurality of vertical dividing lines T2 are preferably parallel to each other and perpendicular to any one of the horizontal dividing lines T1. In this embodiment, the plurality of horizontal dividing lines T1 and the plurality of vertical dividing lines T2 are formed by cutting, but the present invention is not limited thereto. For example, in other embodiments of the present invention not illustrated, the plurality of horizontal dividing lines T1 and the plurality of vertical dividing lines T2 may also be formed by methods other than cutting (such as etching) according to actual needs.

[0029] Further, after implementing the preceding step S110, the adhesive film M1 has a first surface M11 and a second surface M12 located on opposite sides, a plurality of sheets M21 are bonded to the first surface M11 at intervals and preferably arranged in a matrix, and a plurality of fragments M22 are bonded to the first surface M11 and are respectively adjacent to the plurality of sheets M21.

[0030] Furthermore, two transverse dividing channels T1 or two longitudinal dividing channels T2 are formed between any two adjacent sheet bodies M21, and each fragment M22 is located between two adjacent transverse dividing channels T1 or two adjacent longitudinal dividing channels T2, while each sheet body M21 is surrounded by a plurality of fragments M22. That is to say, in this embodiment, the plurality of fragments M22 refers to invalid sheet bodies located around each sheet body M21, but is not limited thereto.

[0031] Furthermore, the chip acquisition device 100 includes a platform 1, a pusher 2 disposed corresponding to the platform 1, and an acquisition mechanism 3 disposed corresponding to the pusher 2. In this embodiment, the number of pushers 2 and the number of acquisition mechanisms 3 are each described as one. The acquisition mechanism 3 includes a chip acquirer 31 and a fragment processor 32 disposed around the chip acquirer 31, but the present invention is not limited thereto.

[0032] It should be noted that the following description first outlines the positional conditions and functional requirements of each component of the sheet-grabbing device 100, and its specific structure can be adjusted and varied according to actual needs, and is not limited to the embodiment described herein. The platform 1 is used to fix the adhesive film M1, so that the pusher 2 and the picking mechanism 3 are located on opposite sides of the object to be processed M; that is, the pusher 2 faces the second surface M12 of the adhesive film M1, while the picking mechanism 3 faces the first surface M11 of the adhesive film M1 (or faces multiple sheets M21).

[0033] Further, the pusher 2 can be used to push a sheet M21, defined as a target sheet M21a, by pushing against the second surface M12 of the adhesive film M1. The sheet picker 31 of the picking mechanism 3 is used to pick up the target sheet M21a so that the target sheet M21a separates from the adhesive film M1. During the separation of the target sheet M21a from the adhesive film M1, the particle processor 32 is used to remove at least one particle M22 adjacent to the target sheet M21a and detached from the adhesive film M1.

[0034] Furthermore, although the chip acquisition device 100 is described in this embodiment as being applied to the chip acquisition method S100, the present invention is not limited thereto. For example, in other embodiments of the present invention not illustrated, the chip acquisition device 100 may also be applied alone (e.g., for sale) or applied to other methods besides the chip acquisition method S100; or, the chip acquisition method S100 may also be implemented using other devices besides the chip acquisition device 100.

[0035] Preparation step S120: As shown in Figures 1 and 3, the object to be processed M is fixed to the stage 1 of the sheet picking device 100. In this embodiment, the peripheral part of the object to be processed M (or the adhesive film M1) is fixed to the stage 1, and the above-mentioned fixing method can be changed according to design requirements.

[0036] The pushing step S130: As shown in Figures 1 and 4, the pusher 2 pushes against the second surface M12 of the adhesive film M1 to push up one of the sheets M21, which is defined as the target sheet M21a. In this embodiment, the pusher 2 includes at least one ejector 21 and an adsorption unit 22 located outside the at least one ejector 21, and the number of the at least one ejector 21 is shown in the figures as a structure including multiple ejector pins, but it can be adjusted according to design requirements.

[0037] Further, in the pushing step S130 of this embodiment, the pusher 2 (through the adsorption unit 22) adsorbs and fixes a portion of the adhesive film M1, which is located outside the target sheet M21a and is defined as a fixed segment M13, while the portion of the adhesive film M1 adhered to the target sheet M21a is defined as a lifting segment M14, and the adhesive film M1 also includes a stretching segment M15 connected between the fixed segment M13 and the lifting segment M14, which is adhered to a plurality of fragments M22 surrounding the target sheet M21a.

[0038] That is to say, the fixed segment M13 is roughly annular and surrounds the target sheet M21a and the multiple fragments M22 around it, and is adsorbed and fixed by the adsorption unit 22 through the fixed segment M13, so that only the lifting segment M14 and the stretching segment M15 of the adhesive film M1 will be affected by the subsequent extraction step S140.

[0039] The extraction step S140: As shown in Figures 1 and 5, the target sheet M21a is held and separated from the adhesive film M1 by the sheet extractor 31, and at least one of the fragments M22 adjacent to the target sheet M21a and detached from the adhesive film M1 is removed by the fragment processor 32 arranged around the sheet extractor 31. The stretching segment M15 vibrates as the target sheet M21a separates from the adhesive film M1, forcing at least one of the plurality of fragments M22 adhered to it to detach. It should be noted that only a portion of the plurality of fragments M22 located around the target sheet M21a may detach from the adhesive film M1 and be removed by the fragment processor 32; the remaining fragments M22 still located on the adhesive film M1 will not contaminate other sheets M21 and therefore do not necessarily need to be removed.

[0040] As described above, in this embodiment, the sheet picking method S100 and the sheet picking device 100 can remove the fragments M22 that have detached from the adhesive film M1 by means of the fragment processor 32 arranged around the sheet picker 31, thereby effectively preventing the flying fragments M22 from contaminating the sheet M21 other than the target sheet M21a.

[0041] Further, in this embodiment, the sheet picker 31 includes a first negative pressure unit 311, and the first negative pressure unit 311 has a suction hole 312 for suctioning the target sheet M21a. That is, the sheet picker 31 is, for example, a vacuum nozzle, but the present invention is not limited thereto.

[0042] Furthermore, in this embodiment, the particle processor 32 includes a second negative pressure unit 321, and the second negative pressure unit 321 has a suction channel 322 for suctioning at least one of the particles M22. The suction channel 322 is annularly surrounding the outside of the suction hole 312, and the position of the suction channel 322 is preferably higher than the position of the suction hole 312, but is not limited thereto.

[0043] It should be noted that, in this embodiment, the adsorption unit 22, the first negative pressure unit 311, and the second negative pressure unit 321 can each be composed of a vacuum device and other components (such as multiple pipelines), but they can be adjusted and changed according to actual needs, and are not limited here.

[0044] Furthermore, as shown in Figures 3 and 6 to 8, the sheet-collecting device 100 further includes a carrier 4 and a waste area 5 disposed adjacent to the carrier 4, and the waste area 5 is used for discarding the fragments M22. In the collecting step S140, the fragment processor 32 can further discard at least one of the fragments M22 it has taken into the waste area 5. Specific embodiments can vary according to design requirements. Several feasible forms are listed below for illustration, but are not limited thereto.

[0045] In the configurations shown in Figures 3, 6, and 7, after the picking mechanism 3 moves and places the target sheet M21a onto the carrier 4 via the sheet picker 31, the picking mechanism 3 moves and discards at least one of the particles M22 it has picked up to the waste area 5 via the particle processor 32. The particle processor 32 has a temporary storage area 323 connected to the suction channel 322, and the temporary storage area 323 surrounds the suction hole 312 for placing at least one of the particles M22 picked up by the suction channel 322. Furthermore, the waste area 5 preferably covers the area directly below the temporary storage area 323, so as to facilitate the one-time discarding of all particles M22 adsorbed in the temporary storage area 323 into the waste area 5.

[0046] Further, the temporary storage area 323, projected orthographically towards the object M to be processed, preferably covers the plurality of fragments M22 located around the target sheet M21a, to prevent the fragments M22 detached from the adhesive film M1 from flying out of the range of the temporary storage area 323. Furthermore, the temporary storage area 323 is illustrated in FIG. 2 as a plurality of suction holes, but is not limited thereto. For example, in other embodiments of the present invention not shown, the temporary storage area 323 may also be a groove-shaped structure communicating with the suction channel 322.

[0047] In the state shown in FIG8, during the process of separating the target sheet M21a from the adhesive film M1, the second negative pressure unit 321 of the particle processor 32 can be used to move at least one particle M22 adjacent to the target sheet M21a and detached from the adhesive film M1 through the suction channel 322 to the waste area 5.

[0048] It should be further noted that although the waste zone 5 shown in FIG3 is illustrated as being located adjacent to the carrier 4, the present invention is not limited thereto. For example, in other embodiments of the present invention not illustrated, the waste zone 5 may also be configured within the particle processor 32 to shorten the length of the suction channel 322 and reduce the distance the particle M22 travels to the waste zone 5.

[0049] Furthermore, after completing the picking step S140, the sheet picking method S100 (or the sheet picking device 100) can repeatedly execute the pushing step S130 and the picking step S140 to place other sheets M21 onto the carrier 4. In addition, in other embodiments not illustrated in this invention, when the picking mechanism 3 places the target sheet M21a onto the carrier 4, the pusher 2 can simultaneously execute the pushing step S130 to improve overall lifting efficiency.

[0050] [Example 2]

[0051] Please refer to Figures 9 and 10, which illustrate Embodiment 2 of the present invention. Since this embodiment is similar to Embodiment 1 described above, the similarities between the two embodiments will not be repeated (e.g., the sheet acquisition device 100). The differences between this embodiment and Embodiment 1 described above are roughly as follows:

[0052] The preceding step S110: A plurality of transverse dividing lines T1 and a plurality of longitudinal dividing lines T2 are formed on the substrate M2 placed on the adhesive film M1 to form a plurality of separate sheets M21. A transverse dividing line T1 or a longitudinal dividing line T2 is formed between any two adjacent sheets M21, and a plurality of fragments M22 are located within the plurality of transverse dividing lines T1 and the plurality of longitudinal dividing lines T2. In this embodiment, the substrate M2 is described as a wafer, and the sheet M21 is a wafer, but the present invention is not limited thereto.

[0053] It should be further noted that the plurality of transverse dividing lines T1 are preferably parallel to each other, and the plurality of longitudinal dividing lines T2 are preferably parallel to each other and perpendicular to any one of the transverse dividing lines T1. In this embodiment, the plurality of transverse dividing lines T1 and the plurality of longitudinal dividing lines T2 are formed by cutting, and the plurality of fragments M22 refer to the debris generated during the cutting process of the sheet M2. That is to say, the number and structure of the fragments M22 present around each sheet M21 are uncertain.

[0054] In the picking step S140, the target sheet M21a is picked up by the sheet picker 31 and separated from the adhesive film M1, and at least one fragment M22 adjacent to the target sheet M21a and detached from the adhesive film M1 is removed by the fragment processor 32 arranged around the sheet picker 31. The stretching segment M15 vibrates as the target sheet M21a separates from the adhesive film M1, forcing at least one fragment M22 adhered to it to detach.

[0055] [Example 3]

[0056] Please refer to Figures 11 to 13, which illustrate Embodiment 3 of the present invention. Since this embodiment is similar to Embodiments 1 and 2 above, the similarities between the above embodiments will not be repeated (e.g., the sheet-grabbing device 100 and the object to be processed M). The differences between this embodiment and Embodiments 1 and 2 are roughly described as follows:

[0057] In this embodiment, the slice extraction method S100 sequentially includes (or implements): a pre-step S110, a preparation step S120, and a separation step S150. The pre-step S110 and the preparation step S120 in this embodiment are largely the same as in Embodiment 1 or Embodiment 2, and will not be described in detail here. The separation step S150 in this embodiment is equivalent to integrating the pushing step S130 and the extraction step S140 described in Embodiment 1.

[0058] More specifically, the separation step S150: as shown in Figures 11 and 12, a piece M21, defined as a target piece M21a, is held by the piece picker 31, and the target piece M21a is pushed against the second surface M12 of the adhesive film M1 by the pusher 2 to lift the target piece M21a, so that the target piece M21a is separated from the adhesive film M1, and at least one piece M22 adjacent to the target piece M21a and detached from the adhesive film M1 is removed by the particle processor 32 arranged around the piece picker 31.

[0059] It should be noted that the target sheet M21a may be first held by the sheet grabber 31 and then pushed up by the pusher 2 according to the design requirements; or, the target sheet M21a may be simultaneously held by the sheet grabber 31 and pushed up by the pusher 2 according to the design requirements. The present invention does not impose any restrictions on this.

[0060] Furthermore, in the separation step S150, the pusher 2 adsorbs and fixes a portion of the adhesive film M1, which is located outside the target sheet M21a and is defined as the fixing segment M13. The portion of the adhesive film M1 that is adhered to the target sheet M21a is defined as the lifting segment M14. The adhesive film M1 also includes the stretching segment M15 connected between the fixing segment M13 and the lifting segment M14, which is adhered to at least one of the fragments M22 adjacent to the target sheet M21a.

[0061] [Technical Effects of the Embodiments of the Invention]

[0062] In summary, the sheet picking method and sheet picking device disclosed in the embodiments of the present invention can remove the fragments that have detached from the adhesive film by means of the fragment processor arranged around the sheet picker, thereby effectively preventing the flying fragments from contaminating the sheet outside the target sheet.

[0063] The above-disclosed content is only a preferred and feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the patent scope of the present invention. [Simplified Explanation of the Diagram]

[0010] Figure 1 is a schematic flowchart of the slice extraction method according to Embodiment 1 of the present invention.

[0011] Figure 2 is a schematic diagram of the preliminary steps in Figure 1.

[0012] Figure 3 is a schematic diagram of the preparation steps in Figure 1.

[0013] Figure 4 is a schematic diagram of the pushing steps in Figure 1.

[0014] Figure 5 is a schematic diagram of the extraction steps in Figure 1.

[0015] Figure 6 is a schematic diagram of the target sheet in Figure 5 being placed on the carrier.

[0016] Figure 7 is a schematic diagram of the fragments in Figure 6 being discarded into the waste area.

[0017] Figure 8 is another schematic diagram of the extraction steps in Figure 1.

[0018] Figure 9 is a schematic diagram of the preliminary steps of Embodiment 2 of the present invention.

[0019] Figure 10 is a schematic diagram of the extraction steps in Embodiment 2 of the present invention.

[0020] Figure 11 is a schematic flowchart of the slice extraction method of Embodiment 3 of the present invention.

[0021] Figure 12 is a schematic diagram of the separation steps in Figure 11 (I).

[0022] Figure 13 is a schematic diagram of the separation steps in Figure 11 (II).

Claims

1. A method for capturing a slice, comprising: A preparation step: fixing an object to be processed onto a stage; wherein the object to be processed comprises: an adhesive film having a first surface and a second surface located on opposite sides; a plurality of sheets spaced apart from each other and adhered to the first surface; and a plurality of fragments adhered to the first surface and respectively adjacent to the plurality of sheets; a pushing step: pushing a pusher against the second surface of the adhesive film to lift one of the sheets, defined as a target sheet; and a picking step: using a sheet picker to hold and separate the target sheet from the adhesive film, and using a fragment processor arranged around the sheet picker to remove at least one of the fragments adjacent to the target sheet and detached from the adhesive film.

2. The fragment extraction method as described in claim 1, wherein, The sheet-collecting method, prior to the preparation step, further includes: a pre-step: forming a plurality of transverse dividing lines and a plurality of longitudinal dividing lines on a plate placed on the adhesive film to form a plurality of sheets separated from each other; wherein, two transverse dividing lines or two longitudinal dividing lines are formed between any two adjacent sheets, and each particle is located between two adjacent transverse dividing lines or between two adjacent longitudinal dividing lines, and each sheet is surrounded by a plurality of particles.

3. The fragment extraction method as described in claim 2, wherein, In the pushing step, the pusher adsorbs and fixes a portion of the adhesive film, which is located outside the target sheet and is defined as a fixed segment. The portion of the adhesive film adhered to the target sheet is defined as a lifting segment. The adhesive film also includes a stretching segment connected between the fixed segment and the lifting segment, which adheres to a plurality of the fragments surrounding the target sheet. In the picking step, the stretching segment vibrates due to the separation of the target sheet from the adhesive film, thereby forcing at least one of the plurality of fragments adhered to it to detach.

4. The fragment extraction method as described in claim 1, wherein, The sheet-collecting method, prior to the preparation step, further includes: a pre-step: forming a plurality of transverse dividing lines and a plurality of longitudinal dividing lines on a plate placed on the adhesive film to form a plurality of sheets separated from each other; wherein, a transverse dividing line or a longitudinal dividing line is formed between any two adjacent sheets, and the plurality of fragments are located within the plurality of transverse dividing lines and the plurality of longitudinal dividing lines.

5. The fragment extraction method as described in claim 4, wherein, In the pushing step, the pusher adsorbs and fixes a portion of the adhesive film, which is located outside the target sheet and is defined as a fixed segment. The portion of the adhesive film adhering to the target sheet is defined as a lifting segment. The adhesive film also includes a stretching segment connected between the fixed segment and the lifting segment, which adheres to at least one of the fragments adjacent to the target sheet. In the picking step, the stretching segment vibrates due to the separation of the target sheet from the adhesive film, thereby forcing at least one of the fragments it adheres to to detach.

6. A sheet acquisition device, comprising: A stage for fixing an adhesive film; wherein the adhesive film has a first surface and a second surface located on opposite sides, and the adhesive film has a plurality of sheets spaced apart from each other and a plurality of particles respectively adjacent to the plurality of sheets bonded to the first surface; a pusher disposed corresponding to the stage and facing the second surface of the adhesive film; wherein the pusher is used to push a sheet, defined as a target sheet, by pushing against the second surface of the adhesive film; and a picking mechanism disposed corresponding to the pusher, and the picking mechanism includes: a sheet picker for adsorbing the target sheet to separate the target sheet from the adhesive film; and a particle processor disposed around the sheet picker; wherein, during the separation of the target sheet from the adhesive film, the particle processor is used to remove at least one particle adjacent to the target sheet and detached from the adhesive film.

7. The slice acquisition apparatus as described in claim 6, wherein, The chip extractor includes a first negative pressure unit, and the first negative pressure unit has a suction hole for sucking up the target chip; the particle processor includes a second negative pressure unit, and the second negative pressure unit has a suction channel for sucking up at least one of the particles.

8. The slice acquisition device as described in claim 7, wherein, The suction channel is arranged in a ring around the outside of the suction hole, and the position of the suction channel is higher than the position of the suction hole.

9. The slice acquisition device as described in claim 7, wherein, The particle processor has a temporary storage area communicating with the suction channel, and the temporary storage area surrounds the suction hole for placing at least one of the particles sucked by the suction channel.

10. The slice acquisition device as described in claim 7, wherein, The sheet-collecting device further includes a waste area; wherein, after the collecting mechanism moves and places the target sheet onto a carrier via the sheet-collector, the collecting mechanism moves and discards at least one of the fragments it has collected into the waste area via the fragment processor.

11. The slice acquisition apparatus as described in claim 7, wherein, The sheet-collecting device further includes a waste zone; wherein, during the separation of the target sheet from the adhesive membrane, the second negative pressure unit of the particle processor can be used to move at least one particle adjacent to the target sheet and detached from the adhesive membrane through the suction channel to the waste zone.

12. A method for capturing a slice, comprising: A preparation step: fixing an object to be processed onto a stage; wherein the object to be processed comprises: an adhesive film having a first surface and a second surface located on opposite sides; a plurality of sheets spaced apart from each other and adhered to the first surface; and a plurality of fragments adhered to the first surface and respectively adjacent to the plurality of sheets; and a separation step: using a sheet picker to pick up one of the sheets, defined as a target sheet, and using a pusher to push against the second surface of the adhesive film to lift the target sheet, causing the target sheet to separate from the adhesive film, and using a fragment processor arranged around the sheet picker to remove at least one of the fragments adjacent to the target sheet and detached from the adhesive film.

13. The slice extraction method as described in claim 12, wherein, The sheet-collecting method, prior to the preparation step, further includes: a pre-step: forming a plurality of transverse dividing lines and a plurality of longitudinal dividing lines on a plate placed on the adhesive film to form a plurality of sheets separated from each other; wherein, two transverse dividing lines or two longitudinal dividing lines are formed between any two adjacent sheets, and each particle is located between two adjacent transverse dividing lines or between two adjacent longitudinal dividing lines, and each sheet is surrounded by a plurality of particles.

14. The fragment extraction method as described in claim 13, wherein, In the separation step, the pusher adsorbs and fixes a portion of the adhesive film, which is located outside the target sheet and is defined as a fixed segment. The portion of the adhesive film adhering to the target sheet is defined as a lifting segment. The adhesive film also includes a stretching segment connected between the fixed segment and the lifting segment, which is adhered to a plurality of the fragments surrounding the target sheet. The stretching segment vibrates when the target sheet separates from the adhesive film, thereby forcing at least one of the plurality of fragments it is adhered to to detach.

15. The slice extraction method as described in claim 12, wherein, The sheet-collecting method, prior to the preparation step, further includes: a pre-step: forming a plurality of transverse dividing lines and a plurality of longitudinal dividing lines on a plate placed on the adhesive film to form a plurality of sheets separated from each other; wherein, a transverse dividing line or a longitudinal dividing line is formed between any two adjacent sheets, and the plurality of fragments are located within the plurality of transverse dividing lines and the plurality of longitudinal dividing lines.

16. The fragment extraction method as described in claim 15, wherein, In the separation step, the pusher adsorbs and fixes a portion of the adhesive film, which is located outside the target sheet and is defined as a fixed segment. The portion of the adhesive film adhering to the target sheet is defined as a lifting segment. The adhesive film also includes a stretching segment connected between the fixed segment and the lifting segment, which adheres to at least one of the fragments adjacent to the target sheet. The stretching segment vibrates when the target sheet separates from the adhesive film, so as to force the at least one of the fragments it adheres to detach.

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