Near-infrared absorbing components, near-infrared absorbing hardened films and optical components

Abstract

The objective of this invention is to provide a near-infrared absorbing composition that exhibits excellent storage stability and can form a hardened film with excellent resistance to damp heat, as well as a near-infrared absorbing hardened film and an optical component using the same. The near-infrared absorbing composition of the present invention, which is a solution, contains the following components (A) to (E); (A) Composition: Copper complexes coordinated with compounds having the structure shown in general formula (I); (B) Components: Compounds having the structure shown in general formula (II); (C) Components: Compounds having the structure shown in general formula (III) or (IV); (D) Composition: Compounds having the structure shown in general formula (V); (E) Component: Polar term δ of Hansen's solubility parameter The value of P is in the range of 3 to 6, and the hydrogen bond term δ Solvents with an H value in the range of 3 to 6.

Description

Technical Field

[0001] The present invention relates to a near-infrared absorbing composition, a near-infrared absorbing cured film, and an optical member. Prior Art

[0002] In recent years, solid-state imaging devices capable of capturing color images have been used in video cameras, digital still cameras, and mobile phones with camera functions. Examples of solid-state imaging devices include CCD (Charge Coupled Device) and CMOS (Complementary Metal Oxide Semiconductor) image sensors. These solid-state imaging devices utilize silicon photodiodes (SiPDs) sensitive to light in the near-infrared wavelength range in their light-receiving sections. Therefore, sensitivity correction is required for these devices. Near-infrared cutoff filters, often used as optical filters, are often used for this purpose.

[0003] These near-infrared cut filters are broadly categorized into absorptive and reflective types. Conventionally, reflective filters utilize light reflection from a dielectric multilayer film to block infrared and ultraviolet rays.

[0004] However, reflective layers suitable for reflective filters tend to be dependent on the angle of incidence. Therefore, recent research has focused on total absorption filters. In recent years, optical filters using films containing light absorbers have attracted attention.

[0005] Optical filters containing films containing light absorbers are also advantageous in miniaturizing and thinning imaging devices. When light is incident, the transmittance characteristics of these optical filters are less affected by the angle of incidence. Therefore, even when light is incident at an angle, good images with minimal color shift can be captured.

[0006] In recent years, near-infrared absorbing compositions using copper phosphonate complexes have been disclosed as materials for producing such near-infrared cut filters.

[0007] For example, Patent Document 1 discloses a near-infrared absorbing composition comprising a near-infrared absorber containing a phosphonic acid compound and copper ions, and a Ti compound. However, the composition disclosed in Patent Document 1 leaves room for improvement in terms of storage stability and the moisture and heat resistance of the cured film.

[0008] Patent Document 2 discloses an infrared-absorbing composition containing a light absorber and an alkoxysilane monomer. The light absorber is formed from a phosphonic acid having a phenyl group or a halogenated phenyl group and copper ions. However, the composition disclosed in Patent Document 2 has problems with storage stability and the moisture and heat resistance of the cured film. [Prior Art Literature] [Patent Document]

[0009] [Patent Document 1] International Publication No. 2019-221061 [Patent Document 2] International Publication No. 2018-173386 Summary of the Invention

[0010] [Problems to be Solved by the Invention]

[0011] The present invention has been made in view of the above-mentioned situation. The problem to be solved by the present invention is to provide a near-infrared absorbing composition that has excellent storage stability and can form a cured film with excellent moisture and heat resistance, as well as a near-infrared absorbing cured film and an optical member using the same. [Methods for solving the problem]

[0012] To solve the above-mentioned problems, the present inventors have examined the causes of the above-mentioned problems. As a result, the present inventors have discovered that the above-mentioned problems can be solved by containing a specific copper phosphonate complex, a specific phosphate ester, a specific Ti compound, a specific Si compound, and a specific solvent, thereby achieving the present invention. That is, the above-mentioned problems of the present invention are solved by the following means.

[0013] 1. A near-infrared absorbing composition comprising the following components (A) to (E);

[0014] (A) component: a copper complex coordinated by a compound having a structure represented by the following general formula (I);

[0015]

[0016] [In the general formula (I), R 1 is an alkyl group having 1 to 20 carbon atoms, which may further have a substituent];

[0017] (B) component: a compound having a structure represented by the following general formula (II);

[0018]

[0019] [In general formula (II), R2 represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms, which may further have a substituent; R21 to R24 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; m represents the average number of structural units in which all of R21 to R24 are hydrogen atoms, and is within the range of 0 to 19; n represents the average number of structural units in which at least one of R21 to R24 is an alkyl group having 1 to 4 carbon atoms, and is within the range of 0 to 19; m+n represents the total of m and n, and is within the range of 1 to 20; Z represents a structural unit selected from the following general formulas (Z-1) and (Z-2)];

[0020]

[0021] (C) component: a compound having a structure represented by the following general formula (III) or (IV); General formula (III) Formula (IV) [In general formulas (III) and (IV), m is an integer of 1 to 4; R4 is an alkylene group having 1 to 30 carbon atoms, which may further have a substituent; R3 and R5 are each independently an alkyl group having 1 to 30 carbon atoms, which may further have a substituent];

[0022] (D) component: a compound having a structure represented by the following general formula (V); General formula (V) [In general formula (V), R6 is a vinyl group, a styryl group, an acryloxy group, a methacryloxy group, a mercapto group, an epoxy group, an epoxycyclohexyl group, or a glycidoxy group, which may further have a substituent; R7 is an alkyl group having 1 to 3 carbon atoms; m is an integer from 0 to 8; and n is 0 or 1];

[0023] (E) Component: A solvent having a Hansen solubility parameter (polarity term δP) value in the range of 3 to 6 and a hydrogen bonding term (δH) value in the range of 3 to 6.

[0024] 2. The near-infrared absorbing composition according to item 1, wherein the compound having the structure represented by general formula (II) simultaneously has at least one partial structure satisfying the following condition (i) and at least one partial structure satisfying the following condition (ii), Condition (i): R 21 to R 24 are all hydrogen atoms; Condition (ii): At least one of R 21 to R 24 is an alkyl group having 1 to 4 carbon atoms; In the general formula (II), m and n are each in the range of 1 to 19.

[0025] 3. The near-infrared absorbing composition according to item 1, wherein the content of the component (C) relative to the component (A) is in the range of 1 to 30% by mass.

[0026] 4. The near-infrared absorbing composition according to item 1, wherein the content of the component (D) relative to the component (A) is in the range of 1 to 30% by mass.

[0027] 5. The near-infrared absorbing composition according to item 1, wherein R 6 in the aforementioned general formula (V) is an acryloxy group or a methacryloyloxy group.

[0028] 6. The near-infrared absorbing composition according to item 1, wherein the component (E) is cyclopentyl methyl ether or 4-methyltetrahydropyran.

[0029] 7. A near-infrared absorbing cured film, characterized in that it is a cured product containing the near-infrared absorbing composition as described in any one of items 1 to 6.

[0030] 8. An optical component comprising a cured product of the near-infrared absorbing composition according to any one of items 1 to 6.

[0031] The above-mentioned means of the present invention can provide a near-infrared absorbing composition having excellent storage stability and capable of forming a cured film having excellent moisture and heat resistance, as well as a near-infrared absorbing cured film and an optical member using the same.

[0032] The mechanism by which the effects of the present invention are exhibited or acted upon is not yet clear, but is speculated as follows.

[0033] In a composition containing a copper phosphonate complex and a phosphate ester, the phosphate ester acts as a dispersant for the copper phosphonate complex. Adding only a titanium compound degrades the storage stability of the near-infrared absorbing composition. This is presumably due to the cross-linking effect of the titanium compound.

[0034] The near-infrared-absorbing composition of the present invention further contains a Si compound and a specific solvent. This suppresses the crosslinking of the Ti compound, improving the storage stability of the near-infrared-absorbing composition. Furthermore, during the formation of the cured film, the suppressed crosslinking of the Ti compound is revealed by removing the solvent. Furthermore, a synergistic effect of the crosslinking between the Ti and Si compounds is also achieved. These effects improve the moisture and heat resistance of the cured film. Simple diagram description

[0035] FIG1 is a schematic cross-sectional view showing an example of the structure of a near-infrared cut filter. FIG2 is a schematic cross-sectional view showing an example of the structure of an image sensor for a solid-state imaging device. FIG3 is a schematic cross-sectional view showing an example of the structure of a camera module. Implementation Method

[0036] [Modes of carrying out the invention]

[0037] The near-infrared absorbing composition of the present invention is characterized by containing the above-mentioned components (A) to (E). These characteristics are common to or correspond to the technical features of the following embodiments.

[0038] As an embodiment of the present invention, the compound having a structure represented by general formula (II) preferably has at least one partial structure satisfying the following condition (i) and at least one partial structure satisfying the following condition (ii). m and n in general formula (II) are each preferably within the range of 1 to 19. This enhances the dispersant effect of component (B). Condition (i): R 21 to R 24 are all hydrogen atoms. Condition (ii): At least one of R 21 to R 24 is an alkyl group having 1 to 4 carbon atoms.

[0039] In an embodiment of the present invention, the content of component (C) relative to component (A) is preferably within a range of 1 to 30% by mass. This ensures a good balance between the storage stability of the near-infrared-absorbing composition and the moisture-heat resistance of the near-infrared-absorbing cured film.

[0040] In an embodiment of the present invention, the content of component (D) relative to component (A) is preferably within a range of 1 to 30% by mass. This ensures a good balance between the storage stability of the near-infrared-absorbing composition and the moisture-heat resistance of the near-infrared-absorbing cured film.

[0041] In an embodiment of the present invention, R6 in the aforementioned general formula (V) is preferably an acryloxy group or a methacryloyloxy group. This further improves the storage stability of the near-infrared absorbing composition and the moisture and heat resistance of the cured film.

[0042] In an embodiment of the present invention, component (E) is preferably cyclopentyl methyl ether or 4-methyltetrahydropyran. These can disperse the near-infrared absorbing composition in an appropriate state, thereby further improving the storage stability of the near-infrared absorbing composition.

[0043] The near-infrared absorbing cured film of the present invention is characterized by being a cured product containing the near-infrared absorbing composition of the present invention.

[0044] The optical member of the present invention is characterized by comprising a cured product of the near-infrared absorbing composition of the present invention.

[0045] The present invention, its components, and embodiments and aspects thereof are described in detail below. In this application, "~" is used to include the numerical values ​​described before and after it as lower and upper limits.

[0046] [Overview of the Near-Infrared Absorbing Composition of the Present Invention] The near-infrared absorbing composition of the present invention is characterized by containing the following components (A) to (E).

[0047] [(A) ingredient] Component (A) is a copper complex coordinated with a compound having the structure represented by the following general formula (I). The compound having the structure represented by the following general formula (I) is a phosphonic acid compound. In other words, component (A) is a copper phosphonate complex. Component (A) is a near-infrared absorber.

[0048]

[0049] [In the general formula (I), R 1 is an alkyl group having 1 to 20 carbon atoms, which may further have a substituent].

[0050] Examples of the substituent that R 1 may have include the following. Alkyl (e.g., methyl, ethyl, trifluoromethyl, isopropyl, etc.) Alkoxy groups (e.g., methoxy, ethoxy, etc.) Halogen atoms (such as fluorine atoms) ·Cyanide Nitro Dialkylamino groups (e.g. dimethylamino, etc.) ·Trialkylsilyl (such as trimethylsilyl)

[0051] In terms of good heat and moisture resistance and near-infrared absorption, R1 is preferably an alkyl group having 1 to 20 carbon atoms. In terms of achieving both near-infrared absorption and visible light transmittance, R1 is more preferably an alkyl group having 1 to 4 carbon atoms.

[0052] Examples of phosphonic acids in which R 1 is an alkyl group having 1 to 20 carbon atoms include the following. Methylphosphonic acid Ethylphosphonic acid Propylphosphonic acid Butylphosphonic acid ·Pentylphosphonic acid Hexylphosphonic acid ·Heptylphosphonic acid Octylphosphonic acid Nonylphosphonic acid Decylphosphonic acid

[0053] The compound having the structure represented by the general formula (I) in the component (A) is particularly preferably propylphosphonic acid and butylphosphonic acid.

[0054] The near-infrared absorbing composition may contain, as the component (A), a plurality of copper complexes coordinated with phosphonic acids having different alkyl groups.

[0055] As the compound having the structure represented by general formula (I), a commercially available product can be used.

[0056] The copper complex coordinated with the compound having the structure represented by general formula (I) only needs to be coordinated with at least one compound having the structure represented by general formula (I). The copper complex may also be coordinated with a compound other than the compound having the structure represented by general formula (I).

[0057] The structure of the copper complex coordinated by the compound having the structure represented by the general formula (I) is represented by the following general formula (IC), for example.

[0058]

[0059] R 1 in the following general formula (IC) is the same as R 1 in general formula (I).

[0060] Among the hydroxyl groups in phosphonic acid, those directly bonded to the phosphorus atom are called "reactive hydroxyl groups." In the general formula (IC), the two reactive hydroxyl groups of a phosphonic acid react with the same copper ion to form a copper complex. However, the form of the copper phosphonate complex is not limited to this.

[0061] The near-infrared absorbing composition may contain one or more components (A).

[0062] Phosphonic acid can be synthesized by referring to the well-known methods described in, for example, JP-A-2016-94512 and JP-A-2016-124903.

[0063] In the near-infrared absorbing composition, the copper phosphonate complex is mainly in the form of microparticles.

[0064] The content of component (A) in the near-infrared-absorbing composition is preferably within the range of 3-40% by mass, more preferably within the range of 10-30% by mass. A content of 3% by mass or greater facilitates the formation of a thick cured film. A content of 10% by mass or greater further enhances the formation of a thick cured film. A content of 40% by mass or less suppresses particle aggregation and increases in the viscosity of the composition, improving the storage stability of the composition. A content of 30% by mass or less further improves the storage stability of the composition.

[0065] From the perspective of spectral properties, copper complex particles are preferably uniformly dispersed during the formation of a cured film. Therefore, the smaller the particle size of the copper complex particles in the near-infrared-absorbing composition (dispersion), the better. The average particle size of the copper complex particles in the near-infrared-absorbing composition is preferably 200 nm or less, more preferably 100 nm or less, and even more preferably 80 nm or less. This average particle size can be measured by dynamic light scattering using an ELSZ-1000ZS manufactured by Otsuka Electronics Co., Ltd.

[0066] [(B) ingredient] Component (B) is a compound having the structure represented by the following general formula (II), and is a phosphate compound. Component (B) contributes to the formation of nano-sized particles during the formation of the copper phosphonate complex. Furthermore, component (B) helps maintain the dispersion of the copper phosphonate complex particles in the medium.

[0067]

[0068] [In general formula (II), R2 is an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms, which may further have a substituent; R21 to R24 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; m represents the average number of structural units in which all of R21 to R24 are hydrogen atoms, and is within the range of 0 to 19; n represents the average number of structural units in which at least one of R21 to R24 is an alkyl group having 1 to 4 carbon atoms, and is within the range of 0 to 19; m+n represents the total number of m and n, and is within the range of 1 to 20; and Z represents a structural unit selected from the following general formulas (Z-1) and (Z-2)].

[0069]

[0070] When all of R 21 to R 24 are hydrogen atoms, the structure in parentheses in the formula is called an "ethylene oxide structure," and m in the formula is the average number of ethylene oxide structural units added.

[0071] The partial structure in the parentheses in the formula where at least one of R 21 to R 24 is an alkyl group having 1 to 4 carbon atoms and the others are hydrogen atoms is also referred to as an "alkyl-substituted ethylene oxide structure," where n is the average number of alkyl-substituted ethylene oxide structural units added.

[0072] In the compound having the structure represented by general formula (II), either m or n is 1 or greater. This allows the compound to have a high ability to form a complex with copper and to be highly effective as a dispersant.

[0073] The compound having the structure represented by general formula (II) has at least one partial structure satisfying the following condition (i) and at least one partial structure satisfying the following condition (ii). This enhances the effect of component (B) as a dispersant. Condition (i): R 21 to R 24 are all hydrogen atoms. Condition (ii): At least one of R 21 to R 24 is an alkyl group having 1 to 4 carbon atoms.

[0074] In general formula (II), m and n are each preferably within the range of 1 to 19. This compound, by combining an oxirane structure with an alkyl-substituted oxirane structure, increases the number of isomers, thereby increasing entropy and contributing to enhanced effectiveness as a dispersant. Furthermore, this compound suppresses the steric hindrance of the substituents (R 21 to R 24), allowing the copper complex to form a finely dispersed state. Thus, the effects of the oxirane structure and the alkyl-substituted oxirane structure are well-balanced. Consequently, this compound can further improve the dispersibility and dispersion stability of the near-infrared absorbing composition.

[0075] In the general formula (II), it is more preferable that at least one of R 21 to R 24 is a methyl group from the viewpoint of the dispersibility of the copper complex.

[0076] In the general formula (II), R 2 is preferably an alkyl group having 6 to 16 carbon atoms, which is preferred from the viewpoint of the dispersibility and wet heat resistance of the copper complex.

[0077] The compound having the structure represented by general formula (II) becomes a diester when Z is formula (Z-1), and becomes a monoester when Z is formula (Z-2).

[0078] The mixing ratio of the diester to the monoester is preferably such that the molar ratio of the monoester is within a range of 20 to 95% relative to the total amount of the diester and the monoester.

[0079] Specific examples of the compound having the structure represented by the general formula (II) are shown in the following Tables I to V. The compound having the structure represented by the general formula (II) of the present invention is not limited to these.

[0080] In Tables I to V, there are exemplary compounds in which both (Z-1) and (Z-2) are listed in the "Structure" column of "Z". Such exemplary compounds are mixtures of compounds in which Z is of formula (Z-1) and compounds in which Z is of formula (Z-2).

[0081]

[0082]

[0083]

[0084]

[0085]

[0086] Exemplary compound II-1 will be specifically described. Exemplary compound II-1 is a mixture of a compound (diester) in which Z is formula (Z-1) and a compound (monoester) in which Z is formula (Z-2).

[0087] The compound (monoester) wherein Z is formula (Z-2) is represented by the structure of the following exemplary compound II-1-1. The compound (diester) wherein Z is formula (Z-1) is represented by the structure of the following exemplary compound II-1-2.

[0088]

[0089] In Example Compound II-1, the molar ratio of the compound (monoester) in which Z is represented by Formula (Z-2) is 50%. That is, Example Compound II-1 contains the same molar amount of Example Compound II-1-1 and Example Compound II-1-2.

[0090] m and n are average addition numbers. Therefore, even in the exemplary compound 1 where m is 5 and n is 5, the number of ethylene oxide structures in one molecule is not limited to 5, and the number of ethylene oxide structures substituted with alkyl groups is not limited to 5.

[0091] In general formula (II), the order of the ethylene oxide structure and the alkyl-substituted ethylene oxide structure is not particularly limited; compounds having random arrangements of these structures are also included in the compound having the structure represented by general formula (II). The order of the ethylene oxide structure and the alkyl-substituted ethylene oxide structure can be arbitrarily varied by the synthesis method.

[0092] The compound having the structure represented by general formula (II) can be synthesized, for example, by referring to the methods described in the following literature. Japanese Patent Application Laid-Open No. 2005-255608 Japanese Patent Application Publication No. 2015-000396 Japanese Patent Application Publication No. 2015-000970 Japanese Patent Application Publication No. 2015-178072 Japanese Patent Application Publication No. 2015-178073 Japanese Patent No. 4422866 International Publication No. 2019-221061

[0093] The near-infrared absorbing composition may contain one or more components (B).

[0094] The content of component (B) is preferably within the range of 40-80% by mass, more preferably 50-70% by mass, relative to component (A). This allows for a better balance between the dispersibility of the near-infrared absorbing composition, the storage stability of the near-infrared absorbing composition, and the moisture and heat resistance of the cured film.

[0095] When the proportion of component (B) is low, the proportion of component (A), which is effective for near-infrared absorption, increases, improving near-infrared absorption. Furthermore, it has been found that the phosphate compound in component (B) causes white turbidity in high-temperature, high-humidity environments. Therefore, by reducing the proportion of component (B), the heat and humidity resistance of the cured film is improved. However, a certain amount of the phosphate compound is required to maintain the dispersion of the copper complex particles.

[0096] [(C) ingredient] Component (C) is a compound having a structure represented by the following general formula (III) or (IV), and is a Ti compound.

[0097] General formula (III) Formula (IV)

[0098] [In general formulas (III) and (IV), m is an integer of 1 to 4; R4 is an alkylene group having 1 to 30 carbon atoms, which may further have a substituent; R3 and R5 are each independently an alkyl group having 1 to 30 carbon atoms, which may further have a substituent].

[0099] The alkyl group having 1 to 30 carbon atoms represented by R 3 and R 5 may have a linear or branched chain.

[0100] Examples of the alkyl group having 1 to 30 carbon atoms include the following. ·methyl ·Ethyl n-propyl Isopropyl n-Butyl tert-butyl n-Hexyl 2-Ethylhexyl n-octyl 2-Butyloctyl 2-Hexyloctyl n-decyl 2-Hexyldecyl n-dodecyl n-stearyl Isostearyl

[0101] R 3 and R 5 are preferably alkyl groups having 6 to 20 carbon atoms.

[0102] The alkylene group having 1 to 30 carbon atoms represented by R 4 may have a straight chain or a branched chain.

[0103] Examples of the alkylene group having 1 to 30 carbon atoms include the following. Methylene ·Ethylene n-propyl ·Isopropyl n-butylene tert-butyl ·n-Shinji ·2-Ethylhexyl ·n-octyl ·2-Butylselenoctyl ·2-Hexyloctyl n-decyl ·2-Hexyldecyl n-dodecyl · n-stearyl ·Isostearyl

[0104] R 4 is preferably an alkylene group having 6 to 20 carbon atoms.

[0105] Examples of the substituent that each of R 3 and R 5 may have include the following. Alkyl (e.g., methyl, ethyl, trifluoromethyl, isopropyl, etc.) Alkoxy groups (e.g., methoxy, ethoxy, etc.) Halogen atoms (such as fluorine atoms) ·Cyanide Nitro Dialkylamino groups (e.g. dimethylamino, etc.) ·Trialkylsilyl (such as trimethylsilyl) ·Triarylsilyl (such as triphenylsilyl) ·Triheteroarylsilyl (e.g., tripyridylsilyl) Benzyl Aryl (e.g. phenyl) Heteroaryl (e.g., pyridyl, carbazolyl, etc.) Condensed ring groups (e.g., 9,9'-dimethylfluorene, carbazole, dibenzofuran, etc.)

[0106] The compound having the structure represented by general formula (III) is preferably a compound forming a chelate structure. Examples of such compounds include the following titanium chelate compounds. ·Ethylene dioleate titanium ·Propylene dioleate titanium ·Butyl titanium dioleate ·Titanium dioleate ·Titanium dioleate ·2-Ethyl-1,3-propyldioleate titanium ·Titanium dioleate

[0107] Specific examples of the compound having the structure represented by general formula (III) are shown below. The compound having the structure represented by general formula (III) of the present invention is not limited to these.

[0108]

[0109]

[0110] The compound having the structure represented by general formula (III) is also available as a commercial product. Examples of commercial products include "Orgatix TC245" (manufactured by Matsumoto Fine Chemicals Co., Ltd.).

[0111] The compound having the structure represented by general formula (IV) is more preferably a compound forming an acylate structure. Examples of such compounds include the following titanium acylate compounds. Titanium octanoate Titanium decanoate Titanium laurate Titanium myristate Titanium palmitate Titanium stearate Titanium isostearate

[0112] Specific examples of the compound having the structure represented by general formula (IV) are shown below. The compound having the structure represented by general formula (IV) of the present invention is not limited to these.

[0113]

[0114] The compound having the structure represented by general formula (IV) is available as a commercial product. Examples of commercial products include "Orgatix TC-800" (manufactured by Matsumoto Fine Chemicals Co., Ltd.).

[0115] The compound having the structure represented by the general formula (III) or the general formula (IV) can be obtained by referring to the synthesis method described in, for example, Japanese Patent Application Laid-Open No. 2011-219704.

[0116] The near-infrared absorbing composition may contain one or more components (C).

[0117] The content of component (C) relative to component (A) is preferably within the range of 1 to 30% by mass, more preferably within the range of 3 to 20% by mass. This ensures a good balance between the storage stability of the near-infrared-absorbing composition and the moisture and heat resistance of the near-infrared-absorbing cured film. When the content of component (C) is above a certain level, the moisture and heat resistance of the cured film is likely to be improved. When the content of component (C) is below a certain level, the storage stability of the near-infrared-absorbing composition is likely to be improved.

[0118] [(D) ingredient] Component (D) is a compound having the structure represented by the following general formula (V), which is a Si compound. The compound having the structure represented by general formula (V) inhibits the crosslinking of the Ti compound in the near-infrared-absorbing composition, thereby improving the storage stability of the near-infrared-absorbing composition. Furthermore, during the formation of the cured film, the crosslinking effects of the Ti compound and the Si compound are synergistic. Therefore, the combined use of the Ti and Si compounds improves the moisture and heat resistance of the cured film compared to the use of the Ti compound alone.

[0119] General formula (V)

[0120] [In general formula (V), R6 is a vinyl group, a styryl group, an acryloxy group, a methacryloxy group, a mercapto group, an epoxy group, an epoxycyclohexyl group, or a glycidoxy group, which may further have a substituent; R7 is an alkyl group having 1 to 3 carbon atoms; m is an integer from 0 to 8; and n is 0 or 1].

[0121] R6 is preferably an acryloyloxy group or a methacryloyloxy group. This further improves the storage stability of the near-infrared absorbing composition and the moisture and heat resistance of the cured film.

[0122] Specific examples of the compound having the structure represented by general formula (V) are shown below. The compound having the structure represented by general formula (V) of the present invention is not limited to these.

[0123]

[0124]

[0125] The compound having the structure represented by general formula (V) is available as a commercial product. Examples of commercial products include the following. KBM-1003 KBE-1003 KBM-1083 KBM-303 KBM-402 KBM-403 KBE-402 KBE-403 KBM-4803 KBM-1403 KBM-502 KBM-503 KBE-502 KBE-503 KBM-5803 KBM-5103 KBM-802 KBM-803 (made by Shin-Etsu Chemical Co., Ltd.)

[0126] The near-infrared absorbing composition may contain one or more components (D).

[0127] The compound having the structure represented by the general formula (V) can be obtained by referring to the synthesis method described in, for example, Japanese Patent Application Laid-Open No. 9-157280.

[0128] The content of component (D) relative to component (A) is preferably within the range of 1 to 30% by mass, more preferably within the range of 3 to 20% by mass. This ensures a good balance between the storage stability of the near-infrared-absorbing composition and the moisture and heat resistance of the near-infrared-absorbing cured film. When the content of component (D) is above a certain level, the moisture and heat resistance of the cured film is likely to be improved. When the content of component (D) is below a certain level, the storage stability of the near-infrared-absorbing composition is likely to be improved.

[0129] [(E) ingredient] (E) The component is a solvent whose polarity term δP of the Hansen solubility parameter is in the range of 3 to 6 and whose hydrogen bonding term δH is in the range of 3 to 6.

[0130] The Hansen solubility parameter (HSP) is a value that serves as an indicator of a substance's solubility. The HSP is a three-dimensional representation of the solubility parameter introduced by Hildebrand, which is split into three components: the dispersion term δD, the polar term δP, and the hydrogen bonding term δH.

[0131] The dispersion term δ D represents the energy derived from the dispersion force. The polar term δ P represents the energy derived from the polar force. The hydrogen bonding term δ H represents the energy derived from the hydrogen bonding force.

[0132] In the present invention, the unit of δ D, δ P and δ H is MPa 1 / 2.

[0133] The definition and calculation method of HSP value are described in the following literature. Charles M. Hansen, Hansen Solubility Parameters: A Users Handbook (CRC Press, 2007)

[0134] Compounds with similar HSP value vectors can be judged to have high solubility. The similarity of vectors can be determined by HSP distance.

[0135] The HSP system not only determines solubility, but can also be used as an indicator of the degree to which a substance can easily exist in other substances, that is, its dispersibility.

[0136] The HSP of each solvent used in the present invention is a value obtained using the following commercially available computer software. 「Hansen Solubility Parameters in Practice(HSPiP)」

[0137] The component (E) is not particularly limited except for the above-mentioned requirements of HSP, but is preferably an ether solvent.

[0138] From the viewpoint of dispersibility, the solvent of the component (E) preferably has a cycloalkyl group or a cyclic ether group.

[0139] From the viewpoint of dispersibility, the cycloalkyl group is more preferably a cyclopentyl group or a cyclohexyl group. From the viewpoint of dispersibility, the cyclic ether group is more preferably a tetrahydrofuranyl group or a tetrahydropyranyl group.

[0140] The term "dispersibility" refers to the property or function of a dispersion medium that allows the components constituting the near-infrared absorbing composition to be dispersed in the near-infrared absorbing composition in an appropriate state.

[0141] The so-called "storage stability" refers to the performance or function of maintaining the appropriate state of the dispersion state of the various components that make up the near-infrared absorbing composition with little or no change over time or changes in environmental conditions.

[0142] Component (E) is more preferably cyclopentyl methyl ether or 4-methyltetrahydropyran, with cyclopentyl methyl ether being particularly preferred. These can disperse the near-infrared absorbing composition in an appropriate state, thereby further improving the storage stability of the near-infrared absorbing composition.

[0143] Specific examples and comparative examples of the solvent of component (E) are shown in Table VI, but the solvent of the present invention is not limited to these.

[0144]

[0145] The boiling point of the solvent of the component (E) is preferably within the range of 80 to 150° C. from the viewpoint of preventing cracks during formation of the cured film.

[0146] The near-infrared absorbing composition may contain one or more components (E).

[0147] A content of the component (E) of 50 to 95% by mass relative to the total mass of the near-infrared absorbing composition is more preferable from the viewpoints of dispersibility and storage stability.

[0148] As long as the effects of the present invention are not impaired, other solvents may be used in combination. Preferred examples of other solvents include aliphatic hydrocarbon solvents, ether solvents, and the like.

[0149] [Near infrared absorbing hardened film] The near-infrared absorbing cured film of the present invention is characterized by being a cured product containing a near-infrared absorbing composition.

[0150] The near-infrared absorbing cured film of the present invention is suitable for constituting the following for CCD, CMOS, or other light-receiving elements. ·Visual sensitivity correction component Light metering components Heat absorbing components Compound optical filter Lens components (glasses, sunglasses, goggles, optical systems, optical waveguide systems) Fiber components (optical fibers) Noise reduction components Plasma display front panels and other displays or display filters Projector front panel Light source hot line cut-off component Tone correction component Lighting brightness adjustment components Optical components (optical amplifiers, wavelength conversion components, etc.) Faraday element Optical communication functional devices such as isolators ·Components for optical discs

[0151] A near-infrared-absorbing cured film can be produced, for example, by the following procedure. First, a resin material is dissolved in the near-infrared-absorbing composition (dispersion) of the present invention to prepare a coating liquid for forming the near-infrared-absorbing cured film. This coating liquid is then applied to a substrate by wet coating. The coating film is then cured by a specific heating treatment.

[0152] Examples of wet coating methods include the following. ·Drip casting method Distributor method Spin coater method Slit spin coater method Slit coater method Screen printing method Applicator method

[0153] The thickness of the near-infrared absorbing cured film is preferably in the range of 10 to 500 μm, more preferably in the range of 10 to 300 μm.

[0154] The resin material preferably has high light transmittance to visible light and near infrared light, and can disperse fine particles of the near infrared absorbing composition.

[0155] Component (A) of the copper phosphonate complex is a relatively low-polarity substance and disperses well in hydrophobic materials. Therefore, the resin material used to form the near-infrared-absorbing film is preferably a resin material having a polysiloxane structure, or a resin material having an acrylic group, an epoxy group, or a phenyl group. Resins having a polysiloxane structure are particularly preferred because they are resistant to thermal decomposition, have high transmittance to visible light and near-infrared radiation, and exhibit high heat resistance.

[0156] Examples of resin materials having a polysiloxane structure include the following. KR-255 KR-300 KR-2621-1 KR-211 KR-311 KR-216 KR-212 KR-251 (all manufactured by Shin-Etsu Chemical Co., Ltd.)

[0157] Examples of resin materials having an epoxy group include the following. KJC-X5 (manufactured by Shin-Etsu Chemical Co., Ltd.) EpiFine series (manufactured by KISCO)

[0158] As the resin material having an acrylic group, a (meth)acrylate monomer is preferred. Examples of the (meth)acrylate monomer include the following. Alkyl (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, and n-butyl (meth)acrylate Modified (meth)acrylates such as phenoxy (meth)acrylate Multifunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate and pentaerythritol tetra(meth)acrylate

[0159] As the resin material for forming the near-infrared absorbing film, a polymer (resin polymer) can be used. Examples of the polymer (resin polymer) include the following. Polymers of (meth)acrylate compounds Polymers of aromatic vinyl compounds such as styrene, α-methylstyrene, methoxystyrene, and divinylbenzene Cyclic olefin polymer (COP)

[0160] In this specification, "(meth)acrylic group" means both "methacrylic group" and "acrylic group".

[0161] The coating liquid for forming a near-infrared-absorbing hardened film may contain other additives, as long as the intended effects of the present invention are not impaired. Examples of these additives include sensitizers, crosslinking agents, hardening accelerators, polymerization initiators, fillers, thermal hardening accelerators, thermal polymerization inhibitors, and plasticizers. The coating liquid may further contain other additives. Examples of these additives include conductive particles, fillers, defoaming agents, flame retardants, leveling agents, release accelerators, antioxidants, fragrances, surface tension adjusters, chain transfer agents, and surface treatment agents. By appropriately incorporating these ingredients into the coating liquid, the stability, film properties, and other properties of the near-infrared-absorbing hardened film can be adjusted.

[0162] [Spectral properties of near-infrared absorbing composition (dispersion liquid)] The average spectral transmittance of the near-infrared absorbing composition in the wavelength range of 450-600 nm is preferably 70% or higher, more preferably 80% or higher, and even more preferably 90% or higher. This value is measured when the near-infrared absorbing composition is diluted with a solvent so that the maximum spectral transmittance at a wavelength of 850-1000 nm is 10%. This improves the visible light transmittance of the cured film.

[0163] As a measuring device for the spectral transmittance, for example, a spectrophotometer V-570 manufactured by JASCO Corporation can be used.

[0164] [Spectral characteristics of near-infrared absorbing cured film] The near-infrared absorbing hardened film has an average spectral transmittance of 80% or more in the wavelength range of 450 to 600 nm, and is preferably excellent in terms of visible light transmittance.

[0165] The near-infrared absorbing cured film has an average spectral transmittance of 10% or less in the wavelength range of 850 to 1000 nm, and is excellent in near-infrared absorbing properties.

[0166] The near-infrared absorbing cured film has an average spectral transmittance of 1% or less in the wavelength range of 850 to 1080 nm, which is excellent in terms of near-infrared absorption.

[0167] The spectral transmittance decreases as the wavelength increases within the range of 600-700 nm. The cutoff wavelength is defined as the wavelength where the spectral transmittance reaches 50% within the range of 600-800 nm. The cutoff wavelength of the near-infrared absorbing cured film for light incident at an angle of 0° relative to the surface is preferably within the range of 600-750 nm. This improves the near-infrared absorption properties of the cured film.

[0168] [Optical components] The optical component of the present invention is characterized by being a cured product containing a near-infrared absorbing composition.

[0169] The near-infrared absorbing cured film of the present invention can be used as various optical members or parts.

[0170] Hereinafter, an example of applying the near-infrared absorbing composition or the near-infrared absorbing cured film as an optical member or component will be described.

[0171] (Near infrared cut filter) The optical component of the present invention is, for example, a near-infrared cut filter. The near-infrared cut filter comprises, for example, a transparent dielectric substrate having a near-infrared absorbing layer on at least one surface. The near-infrared absorbing layer is a cured product of the near-infrared absorbing composition of the present invention.

[0172] It is preferable to further provide a dielectric multilayer film on at least one surface of the transparent dielectric substrate in that the spectral characteristics of the near-infrared cut filter can be adjusted more freely.

[0173] The near-infrared absorbing layer and the dielectric multilayer film may be provided in contact with the transparent dielectric substrate or may be provided with another intermediate layer interposed therebetween.

[0174] FIG1 is a schematic cross-sectional view showing a configuration example of a near-infrared cut filter.

[0175] The near infrared cut filter 9 shown in FIG1 includes a near infrared absorbing layer 22 on one surface of a transparent dielectric substrate 21. The near infrared cut filter 9 further includes a dielectric multilayer film 23 on the other surface of the transparent dielectric substrate 21.

[0176] The material of the transparent dielectric substrate is not particularly limited as long as it achieves the objectives of the present invention. The transparent dielectric substrate can be made of, for example, glass or optical resin. Examples of optical resins include polycarbonate (PC), polymethyl methacrylate (PMMA), cycloolefin polymer (COP), and polysilicone.

[0177] The thickness of the transparent dielectric substrate is preferably 0.01-1 mm.

[0178] Since the transparent dielectric substrate must allow visible light to pass through, the average spectral transmittance within the wavelength range of 450-600nm is preferably above 80%.

[0179] The near-infrared absorbing layer can be formed using the near-infrared absorbing cured film of the present invention.

[0180] A near-infrared absorbing hardened film is directly formed on a transparent dielectric substrate as a near-infrared absorbing layer to manufacture a near-infrared cutoff filter.

[0181] Dielectric multilayer films are formed by laminating multiple layers of materials with different refractive indices, controlling the transmittance of light at different wavelengths. By combining a dielectric multilayer film with a near-infrared absorption layer, the spectral characteristics of the near-infrared cut filter can be more freely adjusted.

[0182] The spectral characteristics of a dielectric multilayer film can be adjusted by adjusting the thickness and material type of each layer. For example, the following dielectrics can be used as the materials for each layer of the dielectric multilayer film. Titanium oxide Silicon oxide Alumina Zirconia Tantalum pentoxide Niobium pentoxide Lanthanum oxide Iridium oxide Zinc oxide Zinc sulfide Indium oxide Silicon dioxide Alumina Lanthanum fluoride Magnesium fluoride Sodium aluminum hexafluoride

[0183] A near-infrared cutoff filter comprising a dielectric multilayer can be manufactured by laminating dielectric layers on a transparent dielectric substrate. Examples of lamination methods include vacuum deposition, chemical vapor deposition, and sputtering.

[0184] A near-infrared cutoff filter having a dielectric multilayer film can also be manufactured by bonding a separately produced dielectric multilayer film to a transparent dielectric substrate using an adhesive.

[0185] (Image sensor for solid-state imaging device) The near-infrared cutoff filter can be incorporated into a solid-state imaging element image sensor. A solid-state imaging element image sensor primarily comprises a solid-state imaging element substrate equipped with a light-receiving element. In addition to the near-infrared cutoff filter, a solid-state imaging element image sensor may also include a planarization layer, a glass substrate, and other components.

[0186] Image sensors for solid-state imaging devices can also include a planarization layer, a glass substrate, and other components in addition to a near-infrared cutoff filter.

[0187] FIG2 is a schematic cross-sectional view showing an example of the structure of an image sensor for a solid-state imaging device.

[0188] The solid-state imaging device image sensor 14 shown in FIG2 comprises a solid-state imaging device substrate 10 having a light-receiving device on the light-receiving side of a polysilicone substrate, a planarization layer 8 provided on solid-state imaging device substrate 10, a near-infrared cut filter 9 provided on planarization layer 8, and a glass substrate 3 (translucent substrate) positioned above near-infrared cut filter 9. These components are bonded together using an adhesive 2.

[0189] (Camera Module) The solid-state image sensor can be incorporated into a camera module. The camera module can also include an image sensor, an imaging lens, a lens holder, and a light-shielding and electromagnetic shield.

[0190] FIG3 is a schematic cross-sectional view showing an example of the structure of a camera module.

[0191] The camera module 1 shown in FIG3 includes the same solid-state imaging element image sensor, lens holder 5, imaging lens 4, and light-shielding and electromagnetic shield 6 as in FIG2 . The solid-state imaging element image sensor, as in FIG2 , is composed of a solid-state imaging element substrate 10, a planarization layer 8, a near-infrared cutoff filter 9, and a glass substrate 3. The light-shielding and electromagnetic shield 6 is positioned to surround the solid-state imaging element image sensor. These components are bonded together using an adhesive 7.

[0192] Furthermore, the camera module 1 is connected to the circuit board 12 of the mounting substrate via the solder balls 11 (connection material) of the connection member.

[0193] In the camera module 1, incident light L from the outside sequentially passes through the imaging lens 4, the glass substrate 3, the near-infrared cut filter 9, and the flattening layer 8. Thereafter, the incident light L reaches the light-receiving element of the solid-state imaging element substrate 10. [Example]

[0194] The present invention is described in detail below using examples, but the present invention is not limited thereto. In the following examples, unless otherwise specified, operations were performed at room temperature (25°C). In the following examples, unless otherwise specified, "%" and "parts" refer to "mass %" and "mass parts," respectively.

[0195] <Preparation of Near-Infrared Absorbing Composition> Near-infrared absorbing composition No. 1 was prepared according to the following method.

[0196] The following compounds and solvents were mixed in the following amounts, stirred for 3 hours, and the solution was filtered to remove insoluble matter to prepare solution A. Copper(II) acetate monohydrate 18g 800g tetrahydrofuran

[0197] The compound having the structure represented by the following general formula (II) was dissolved in the following solvent in the following amount to prepare a solution. Solution A was added thereto and stirred at room temperature for 30 minutes to prepare solution B. Exemplary compound II-66 10g 70g tetrahydrofuran

[0198] A compound having a structure represented by the following general formula (I) was dissolved in the following solvent in the following amount to prepare a solution C. Butylphosphonic acid 12g 70g tetrahydrofuran

[0199] While stirring Solution B, Solution C was added thereto, and the mixture was stirred at room temperature for 16 hours. The resulting solution was designated Solution D.

[0200] Place the entire amount of Solution D and 300 g of methylcyclohexane into a flask. While heating to 50-100°C, remove the solvent and remove the acetic acid using a rotary evaporator. Then, add 300 g of cyclopentyl methyl ether. Repeat the desolventizing process three times using a rotary evaporator. This replaces the solvent with cyclopentyl methyl ether, adjusting the concentration of component (A) to 10% by mass. The resulting solution is referred to as Solution E.

[0201] The compound having the structure represented by the following general formula (III) and the compound having the structure represented by the following general formula (V) were dissolved in the following solvent in the following amounts. This was added to 100 g of Solution E and stirred at room temperature for 30 minutes to obtain Near Infrared Absorbing Composition No. 1. Exemplary compound III-2 1.0g Exemplary compound V-10 1.0g Cyclopentyl methyl ether 10g

[0202] Near-infrared absorbing compositions Nos. 2 to 36 were prepared in the same manner as the preparation of near-infrared absorbing composition No. 1, except that the following points were changed as shown in Tables VII and VIII. Types of compounds having the structure represented by general formula (I) Types of compounds having the structure represented by general formula (II) Type and amount of compound having the structure represented by general formula (III) or (IV) Type and amount of compound having the structure represented by general formula (V) Solvent type

[0203] <Evaluation of Dispersibility> The dispersibility of the near-infrared absorbing composition was evaluated by measuring the average particle size of the particles in the composition. The composition was diluted with toluene to a solids concentration of 0.5% by mass. The average particle size was measured by dynamic light scattering using an ELSZ-1000ZS manufactured by Otsuka Electronics Co., Ltd. The evaluation was performed according to the following criteria, which served as a measure of dispersibility. The evaluation results are reported in the table below.

[0204] A: The average particle size is 100 nm or less. B: The average particle size is more than 100 nm and 150 nm or less. C: The average particle size is more than 150 nm and 200 nm or less. D: The average particle size exceeds 200 nm.

[0205] <Evaluation of storage stability> The storage stability of the near-infrared absorbing composition was evaluated by measuring the change in particle size and viscosity of the near-infrared absorbing composition over time.

[0206] (Change in particle size) The near-infrared-absorbing composition was allowed to stand at room temperature for 7 days. The average particle size of the particles in the near-infrared-absorbing composition was then measured using the same method as above. The average particle size change rate [%] was calculated based on the average particle size before and after standing. The average particle size change rate [%] was evaluated according to the following criteria. The evaluation results are reported in the table below.

[0207] A: The average particle size change rate is less than 10%. B: The average particle size variation rate is 10% or more and less than 30%. C: The average particle size variation rate is 30% or more and less than 50%. D: The average particle size variation rate is 50% or more.

[0208] (Viscosity Change) The viscosity of the near-infrared absorbing composition was measured. The near-infrared absorbing composition was then heated at 45°C for two days. After heating, the viscosity of the near-infrared absorbing composition was measured again. The viscosity change rate [%] was calculated based on the viscosities before and after heating. The viscosity change rate [%] was evaluated according to the following criteria. The evaluation results are reported in the table below.

[0209] A: The viscosity change rate is less than 10%. B: The viscosity change rate is 10% or more and less than 30%. C: The viscosity change rate is 30% or more and less than 50%. D: The viscosity change rate is more than 50%.

[0210]

[0211]

[0212] The results shown in Table VIII indicate that the near-infrared absorbing composition of the present invention has excellent dispersibility and storage stability.

[0213] <Production of Near-Infrared Absorption Cured Film> The near-infrared absorbing composition was mixed with the following resin materials in the combinations shown in Tables IX and X, such that the solid content of the resin materials reached 70% by mass. This prepared coating solutions for forming near-infrared absorbing cured films Nos. 1 to 60, respectively.

[0214] The details of the resin materials used are as follows. (Resin material No. 1) A solution containing 80% by mass of 2-ethylhexyl methacrylate, 19% by mass of trimethylolpropane triacrylate, and 1.0% by mass of a polymerization initiator, Perbutyl ND (manufactured by NOF Corporation) (Resin material No. 2) Silicone resin KR311 (manufactured by Shin-Etsu Chemical Co., Ltd.) (Resin material No. 3) A solution prepared by dissolving 20% ​​by mass of Dianal BR-87 (manufactured by Mitsubishi Chemical Corporation) in cyclopentyl methyl ether

[0215] A coating liquid for forming a near-infrared-absorbing cured film was cast onto a glass substrate. The coating amount was adjusted to a thickness that achieved a maximum spectral transmittance of 10% within the wavelength range of 850-1000 nm after curing. The glass substrate coated with the coating liquid was pre-baked on a hot plate at 110°C for 2 minutes.

[0216] The composition was then cured by heating on a hot plate. When using resin material 1, the heating temperature was set to 120°C and the heating time was set to 1 hour. When using resin material 2, the heating temperature was set to 180°C and the heating time was set to 1 hour. When using resin material 3, the heating temperature was set to 120°C and the heating time was set to 15 minutes.

[0217] In this manner, near-infrared absorbing cured films Nos. 1 to 60 were produced.

[0218] <Evaluation of Wet Heat Resistance of Near-Infrared Absorbing Cured Film> Calculate the average transmittance (T ave1) of the near-infrared absorbing cured film in the wavelength range of 700 to 1200 nm immediately after production. Next, allow the near-infrared absorbing cured film to stand for 1000 hours in an environment of 85°C and 85% RH. Calculate the average transmittance (T ave2) of the near-infrared absorbing cured film in the wavelength range of 700 to 1200 nm after standing.

[0219] Calculate the decrease in visible light transmittance at T ave2 relative to T ave1 (T ave1 - T ave2). Evaluate the decrease in visible light transmittance according to the following criteria and use it as a measure of heat and humidity resistance. The evaluation results are reported in the table below.

[0220] A: The decrease in average penetration rate did not reach 3%. B: The average penetration rate decreases by more than 3% and less than 5%. C: The average penetration rate decreases by more than 5% and less than 10%. D: The average penetration rate decreases by more than 10%.

[0221]

[0222]

[0223] As can be seen from Table IX and Table X, the near-infrared absorbing cured film of the present invention has excellent resistance to moist heat.

[0224] The above results confirm that the near-infrared absorbing composition of the present invention has excellent storage stability and can form a cured film with excellent moisture and heat resistance.

[0225] 1: Camera module 2: Adhesive 3: Glass substrate 4: Camera lens 5: Lens bracket 6: Light shading and electromagnetic shielding 7: Adhesive 8: Planarization layer 9:Near infrared cut filter 10: Solid-state imaging element substrate 11: Solder balls 12: Circuit board 14: Image sensor for solid-state imaging device 21: Transparent dielectric substrate 22:Near infrared absorption layer 23: Dielectric multilayer film

Claims

1. A near-infrared absorbing composition, characterized by containing the following components (A) to (E); (A) Component: a copper complex coordinated with a compound having the structure shown in the following general formula (I); [in general formula (I), R1 is an alkyl group having 1 to 20 carbon atoms, and may further have substituents]; (B) Component: a compound having the structure shown in the following general formula (II); [In general formula (II), R2 represents an alkyl group having 1 to 20 carbon atoms or an aryl group having 6 to 20 carbon atoms, which may further have substituents; R21 to R24 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; m represents the average addition number of the partial structural units of R21 to R24 that are all hydrogen atoms, and is in the range of 0 to 19; n represents the average addition number of the partial structural units of R21 to R24 that are at least one alkyl group having 1 to 4 carbon atoms, and is in the range of 0 to 19; m+n represents the total number of m and n, and is in the range of 1 to 20; Z represents the structural unit selected from the following general formulas (Z-1) and (Z-2)]; (C) Composition: A compound having the structure shown in the following general formula (III) or (IV); General formula (III) General formula (IV) [In general formulas (III) and (IV), m is an integer from 1 to 4; R4 is an alkyl group having 1 to 30 carbon atoms, which may further have substituents; R3 and R5 are each independently an alkyl group having 1 to 30 carbon atoms, which may further have substituents]; (D) Composition: A compound having the structure shown in the following general formula (V); General formula (V) [In general formula (V), R6 is vinyl, styryl, acryloxy, methacryloxy, mercapto, epoxy, epoxycyclohexyl, or epoxypropoxy, which may further have substituents; R7 is an alkyl group having 1 to 3 carbon atoms; m is an integer from 0 to 8; n is 0 or 1]; (E) Composition: A solvent with a polarity term δP of Hansen solubility parameters in the range of 3 to 6 and a hydrogen bonding term δH in the range of 3 to 6; The content of the aforementioned composition (A) in the near-infrared absorbing composition is in the range of 3 to 40% by mass. The content of component (B) relative to component (A) is in the range of 40 to 80% by mass. The content of component (C) relative to component (A) is in the range of 1 to 30% by mass. The content of component (D) relative to component (A) is in the range of 1 to 30% by mass.

2. The near-infrared absorbing composition of claim 1, wherein the aforementioned compound having the structure shown in general formula (II) simultaneously has at least one partial structure satisfying condition (i) and a partial structure satisfying condition (ii), wherein condition (i): all of R21 to R24 are hydrogen atoms; condition (ii): at least one of R21 to R24 is an alkyl group having 1 to 4 carbon atoms; and m and n in the aforementioned general formula (II) are in the range of 1 to 19.

3. The near-infrared absorbing composition of claim 1, wherein R6 of the aforementioned general formula (V) is acryloxy or methacryloxy.

4. The near-infrared absorbing composition of claim 1, wherein the aforementioned component (E) is cyclopentylmethyl ether or 4-methyltetrahydropyran.

5. A near-infrared absorbing curing film, characterized in that it is a curing material containing a near-infrared absorbing composition as claimed in any one of claims 1 to 4.

6. An optical component, characterized in that it is a hardened material containing a near-infrared absorbing composition as claimed in any one of claims 1 to 4.

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