Resin molding apparatus and resin molded product manufacturing method

Abstract

This invention reduces wear caused by mold sliding in a resin molding apparatus in which the molding die slides along a sliding direction intersecting the locking direction. The resin molding apparatus of this invention includes: a locking mechanism 10 for locking the molding die 51 and molding die 52 via base members 2 to 4; a molding die sliding mechanism 20 for sliding the molding die 51 and molding die 52 between a locked position Q and a protruding position R located further outward than the base members 2 to 4 in a sliding direction intersecting the locking direction; and a spacing changing mechanism 30 for changing the spacing between the opposing surfaces of the base members 2 to 4 and the molding die 51 and molding die 52 when the molding die 51 and molding die 52 slide between the locked position Q and the protruding position R by the molding die sliding mechanism 20.

Description

Resin Molding Apparatus and Method for Manufacturing Resin Molded Product The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. Conventionally, as shown in Patent Document 1, in a compression molding apparatus, it is considered to move a fixed mold (lower mold) supported on a fixed platen between a mold clamping position and a lead-out position outside the mold. Specifically, the following structure is provided: on the fixed platen, a guide plate formed with a guide rail and a guide groove is provided, and a sliding plate supporting the fixed mold (lower mold) slides along the guide rail and the guide groove of the guide plate. [Prior Art Documents] [Patent Documents] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-165134 [Problems to be Solved by the Invention] However, when moving the fixed mold (lower mold) between the mold clamping position and the lead-out position outside the mold, wear occurs on the sliding surfaces of the sliding plate and the guide plate. Therefore, the present invention has been completed to solve the above problems, and its main problem is to reduce wear caused by the sliding of a molding die in a resin molding apparatus in which the molding die slides in a sliding direction intersecting the mold clamping direction. [Means for Solving the Problems] That is, the resin molding apparatus of the present invention is characterized by including: a mold clamping mechanism that clamps a molding die via a base member; a molding die sliding mechanism that slides the molding die between a clamped mold clamping position and a protruding position located outside the base member in a sliding direction intersecting the mold clamping direction; and a gap changing mechanism that changes the gap between the opposing surfaces of the base member and the molding die when the molding die is slid between the mold clamping position and the protruding position by the molding die sliding mechanism. [Effects of the Invention] According to the present invention configured as described above, in a resin molding apparatus in which a molding die slides in a sliding direction intersecting the mold clamping direction, wear caused by the sliding of the molding die can be reduced. Next, the technology of the present invention will be further described in detail with examples. However, the present invention is not limited to the following technology. The resin molding apparatus of Technology 1 of the present invention is characterized by including: a mold clamping mechanism that clamps a molding die via a base member; a molding die sliding mechanism that slides the molding die between a clamped mold clamping position and a protruding position located outside the base member in a sliding direction intersecting the mold clamping direction; and a gap changing mechanism that changes the gap between the opposing surfaces of the base member and the molding die when the molding die is slid between the mold clamping position and the protruding position by the molding die sliding mechanism. In the case of this resin molding device, when the molding die is slid between the mold clamping position and the protruding position by the molding die sliding mechanism, the interval between the opposing surfaces of the base member and the molding die is changed. As a result, the opposing surfaces of the base member and the molding die can be separated during sliding. As a result, wear caused by the sliding of the molding die can be reduced. Further, by moving the molding die to the protruding position, a transfer object can be transferred to the molding die at the protruding position. As a result, it is not necessary to increase the interval between the molding dies when the mold is opened, and the resin molding device can be made lower in height. Preferably, in addition to the structure of the above-described Technique 1, in the resin molding device of Technique 2 of the present invention, the molding die has an upper die and a lower die, the molding die sliding mechanism is provided corresponding to the upper die and the lower die, respectively, and the interval changing mechanism is provided corresponding to the upper die and the lower die, respectively. With this structure, the upper die and the lower die can be independently moved to the protruding position, and a transfer object can be transferred to the upper die and the lower die, respectively. Further, wear caused by the sliding of the upper die and the lower die at this time can be reduced. Preferably, in addition to the structure of Technique 1 or Technique 2, in the resin molding device of Technique 3 of the present invention, the molding die sliding mechanism and the interval changing mechanism are configured using a common drive actuator. With this structure, the structure of the resin molding device having the molding die sliding mechanism and the interval changing mechanism can be simplified. As a specific embodiment of configuring the molding die sliding mechanism and the interval changing mechanism using a common drive actuator, preferably, in addition to the structure of Technique 1 or Technique 2, in the resin molding device of Technique 4 of the present invention, the molding die sliding mechanism includes: a support frame that supports the molding die; and a drive actuator that moves the support frame in the sliding direction. The interval changing mechanism includes a cam mechanism provided between the molding die and the base member. As the drive actuator moves the support frame, the cam mechanism changes the interval between the opposing surfaces of the molding die and the base member. With this structure, the cam mechanism of the interval changing mechanism can be operated by the drive actuator of the molding die sliding mechanism. Preferably, in addition to any one of the structures of Techniques 1 to 4, in the resin molding device of Technique 5 of the present invention, the interval changing mechanism causes the opposing surfaces of the molding die and the base member not to contact each other at the mold clamping position and to be in a state of having a gap therebetween, and the mold clamping mechanism performs mold clamping so that the opposing surfaces of the molding die and the base member contact each other. With this structure, wear caused by sliding between the mold clamping position and the protruding position can be further reduced. Preferably, in addition to any of the structures of the above-described Techniques 1 to 5, the resin molding apparatus according to Technique 6 of the present invention has a positioning portion in the mold sliding mechanism, and the positioning portion contacts the mold moving toward the mold clamping position to position the mold at the mold clamping position. With this structure, the mold is positioned at the mold clamping position by the positioning portion, so that the reproducibility of the mold clamping position can be improved, and thus the quality of the resin molded product can be improved. Preferably, in addition to any of the structures of the above-described Techniques 1 to 6, the resin molding apparatus according to Technique 7 of the present invention further considers the following structure: the base member has a fixed platen; a movable platen that can be lifted and lowered by a mold clamping mechanism; and an intermediate platen disposed between the fixed platen and the movable platen. The mold has an upper mold and a lower mold, which are respectively disposed between the fixed platen and the intermediate platen, and between the intermediate platen and the movable platen. That is, the mold has a structure including multiple sets of upper and lower molds. Moreover, preferably, the resin molding apparatus according to Technique 7 further includes: a pair of side wall members disposed on both lateral sides of the movable platen and the intermediate platen; a lifting and sliding mechanism that slides the intermediate platen in the vertical direction relative to the pair of side wall members; and a lifting linkage mechanism that links the lifting of the intermediate platen to the lifting of the movable platen. The lifting linkage mechanism has: a boom mechanism with one end fixed to the side wall member and the other end moving together with the movable platen, which expands and contracts with the lifting of the movable platen; and a connecting mechanism that connects the cross-link portion of the boom mechanism and the intermediate platen. With this structure, the number of molds can be increased, and thus the productivity of the resin molded product can be improved. In addition, since the multiple intermediate platens are linked to the lifting of the movable platen by the boom mechanism, even if a structure is adopted in which molds are respectively disposed between the multiple intermediate platens, the enlargement of each member can be prevented, the enlargement of the entire apparatus can be suppressed, and high-rigidity members are not required. Preferably, in addition to any of the structures of the above-described Techniques 1 to 7, the resin molding apparatus according to Technique 8 of the present invention further includes a transfer mechanism that transfers a transfer object to the mold located at the protruding position. Preferably, in addition to the structure of Technique 8, the transfer mechanism of the resin molding apparatus according to Technique 9 of the present invention has: a molding object transfer mechanism that transfers a molding object to the mold located at the protruding position; and a resin material transfer mechanism that transfers a resin material to the mold located at the protruding position. Preferably, in addition to the structure of the technology 9, the resin molding apparatus of the technology 10 of the present invention has a molded object transfer mechanism including: a molded object supply unit that supplies the molded object to the molding die located at the protruding position; and a molded object pickup unit that picks up the resin-molded molded object from the molding die located at the protruding position. Preferably, in addition to the structure of the technology 9 or 10, the resin molding apparatus of the technology 11 of the present invention has a resin material transfer mechanism including: a resin material supply unit that supplies the resin material to the molding die located at the protruding position; and a film recovery unit that recovers the used release film from the molding die located at the protruding position. Moreover, the following method for manufacturing a resin molded product is also an aspect of the present invention. The method for manufacturing a resin molded product uses any one of the resin molding apparatuses of the technologies 1 to 11 to manufacture a resin molded product, and includes: a transfer step of transferring a molded object to the molding die located at the protruding position; a resin molding step of clamping the molding die located at the clamping position to perform resin molding on the molded object; and a take-out step of taking out the resin-molded molded object from the molding die located at the protruding position. <1. First Embodiment of the Present Invention> Hereinafter, a first embodiment of the resin molding apparatus of the present invention will be described with reference to the accompanying drawings. In addition, in any of the drawings shown below, for ease of understanding, appropriate omissions or exaggerations are made and schematically depicted. For the same components, the same reference numerals are given and the description is appropriately omitted. <1-1. Overall Structure of the Resin Molding Apparatus> The resin molding apparatus 100 of the first embodiment is an apparatus for manufacturing a resin molded product P by resin-sealing electronic components Wx fixed to a substrate W as a molded object using a resin material J. Here, examples of the substrate W include metal substrates, resin substrates, glass substrates, ceramic substrates, circuit boards, semiconductor substrates, lead frames, silicon wafers, glass wafers, etc. In addition to these, the substrate W may also be a carrier without wiring. Moreover, examples of the resin material J include powdery or granular resins (including granular resins), liquid resins, etc. Moreover, examples of the electronic component Wx include electronic components such as semiconductor wafers, resistor elements, capacitor elements, or electronic components in a form in which at least one of these electronic components is resin-sealed. As shown in FIG. 1, the resin molding apparatus 100 includes a substrate supply / storage module A, two resin molding modules B, and a resin material supply module C as components. Each component (each module A to C) is detachable and replaceable with respect to each other component. The substrate supply / storage module A has: a substrate receiving part 11 that receives the pre-formed substrate W from the outside; a substrate storage part 12 that stores the completely formed substrate W (resin molded product P); a substrate transfer mechanism 13 that transfers the pre-formed substrate W and the resin molded product P; and a transfer mechanism 14 such as a transfer robot that transfers, i.e., hands over, the pre-formed substrate W and the resin molded product P to and from the substrate transfer mechanism 13. The substrate transfer mechanism 13 transfers the pre-formed substrate W from the substrate supply / storage module A to the resin molding module B, and supplies the pre-formed substrate W to the molding dies 5a and 5b in the resin molding module B. After the resin molding of the pre-formed substrate W, the substrate transfer mechanism 13 receives the completely formed substrate W after resin molding, i.e., the resin molded product P, from the molding dies 5a and 5b in the resin molding module B, and transfers it to the substrate supply / storage module A. Moreover, the transfer mechanism 14 hands over the pre-formed substrate W from the substrate receiving part 11 to the substrate transfer mechanism 13, and hands over the resin molded product P from the substrate transfer mechanism 13 to the substrate storage part 12. Each resin molding module B has an upper die 51 which is the first die for holding the substrate W and a lower die 52 which is the second die having a cavity 52C. By clamping these dies, resin sealing is performed on the electronic component Wx fixed to the substrate W by resin molding using the resin material J. Furthermore, the specific structure of the resin molding module B will be described later. The resin material supply module C has a moving platform 15, a resin material storage part 16 placed on the moving platform 15, a resin material input mechanism 17 that measures the resin material J and inputs it into the resin material storage part 16, and a resin material transfer mechanism 18 that transfers the resin material storage part 16 and supplies the resin material J to the cavity 52C of the lower die 52. Here, the resin material storage part 16 is constituted by using a holding frame that holds the release film F, and the resin material J is input onto the release film F held by the holding frame by the resin material input mechanism 17. The moving platform 15 moves within the resin material supply module C between the resin input position of the resin material input mechanism 17 and the transfer position for handing over the resin material storage part 16 to the resin material transfer mechanism 18. Moreover, the resin material transfer mechanism 18 transfers the resin material storage part 16 containing the resin material J from the resin material supply module C to the resin molding module B, and supplies the release film F and the resin material J to the molding dies 5a and 5b in the resin molding module B. Subsequently, the resin material transfer mechanism 18 transfers the resin material storage part 16 after the resin material J has been supplied from the resin molding module B to the resin material supply module C. <1-2. Specific Structure of Resin Molding Module B> As shown in FIGS. 2 and 3, the resin molding module B includes: a fixed platen 2; a movable platen 3 that can be lifted and lowered by a clamping mechanism 10; an intermediate platen 4 disposed between the fixed platen 2 and the movable platen 3; a first molding die 5a and a second molding die 5b respectively disposed between the fixed platen 2 and the intermediate platen 4 and between the intermediate platen 4 and the movable platen 3 and including an upper die 51 and a lower die 52; a pair of side wall members 61, 62 disposed on both lateral sides (here, the left and right sides) of the movable platen 3 and the intermediate platen 4; a lifting and sliding mechanism 7 that slides the intermediate platen 4 relative to the pair of side wall members 61, 62 in the vertical direction; and a lifting linkage mechanism 8 that links the lifting of the intermediate platen 4 to the lifting of the movable platen 3. On the lower surface of the fixed platen 2, the upper die 51 of the first molding die 5a is provided directly or via other members. Moreover, on the left and right sides of the fixed platen 2, a pair of side wall members 61, 62 are connected. Furthermore, a pair of side wall members 61, 62 may also be integrally formed with the fixed platen 2. The fixed platen 2 of the present embodiment has a substantially rectangular flat plate shape when viewed from above. On the upper surface of the movable platen 3, the lower die 52 of the second molding die 5b is provided directly or via other members. Moreover, the movable platen 3 is lifted and lowered by a clamping mechanism 10 provided below the movable platen 3. Furthermore, the movable platen 3 of the present embodiment has a substantially rectangular flat plate shape when viewed from above. Moreover, a fixing member 31 is connected to the movable platen 3, and the lower end portion (lower end link portion 813) of a boom mechanism 81 described later is fixed to the fixing member 31. The clamping mechanism 10 of the present embodiment is a linear movement type that uses a ball screw mechanism that converts the rotation of a servo motor or the like into linear movement to lift and lower the movable platen, but it may also be a link type that uses a link mechanism such as a crank link to transmit the power source of a servo motor or the like to the movable platen. On the upper surface of the intermediate platen 4, the lower die 52 of the first molding die 5a is provided directly or via other members. Moreover, on the lower surface of the intermediate platen 4, the upper die 51 of the second molding die 5b is provided directly or via other members. Furthermore, the intermediate platen 4 of the present embodiment has a substantially rectangular flat plate shape when viewed from above. Here, with reference to FIG. 4, the first molding die 5a and the second molding die 5b will be described. The upper die 51 of each molding die 5a, 5b adsorbs and holds the back surface of the substrate W. A suction port (not shown) is formed on the lower surface of the upper die 51, and a suction flow path (not shown) connected to the suction port is formed inside the upper die 51. The suction flow path is connected to an external suction device (not shown). Moreover, the lower dies 52 of the respective forming dies 5a and 5b have a cavity 52C that houses the electronic component Wx and the resin material J fixed to the substrate W. Specifically, the lower die 52 has a bottom member 521 that forms the bottom surface of the cavity 52C and a side member 522 that surrounds the bottom member 521. The cavity 52C is formed by the upper surface of the bottom member 521 and the inner peripheral surface of the side member 522. Moreover, the side member 522 is disposed so as to be relatively movable up and down with respect to the bottom member 521. Specifically, the side member 522 is supported by a plurality of elastic members 524 such as disc springs with respect to the bottom plate 523 of the lower die 52. Further, in order to improve the mold release property of the resin molded product P, the lower die 52 of the present embodiment is covered with a mold release film F. Moreover, an air exhaust passage (not shown) may be provided on the upper surface of the side member 522 (the contact surface between the side member 522 and the substrate W) to exhaust air or gas. In addition, a sealing structure 50 (not shown in FIGS. 2 and 5) is provided around the upper die 51 and the lower die 52, and the sealing structure 50 includes a side wall portion for evacuating the periphery of the forming dies 5a and 5b during resin molding and sealing members such as O-rings. As shown in FIGS. 2 and 3, a pair of side wall members 61 and 62 fix the fixed platen 2 at a prescribed height with respect to the base 101 and slidably support the intermediate plate 4. Here, the upper end portions of the respective side wall members 61 and 62 are connected to the fixed platen 2, and the lower end portions of the side wall members 61 and 62 are connected to the base 101. Further, the respective side wall members 61 and 62 of the present embodiment are in the shape of vertically long flat plates extending in the vertical direction. The elevating and sliding mechanism 7 moves the intermediate plate 4 linearly in the vertical direction with respect to the pair of side wall members 61 and 62. Specifically, the elevating and sliding mechanism 7 has a linear movement track 71 extending linearly and a linear movement block 72 that slides on the linear movement track 71. In the present embodiment, flat side plates 41 are connected to the left and right sides of the intermediate plate 4, the linear movement blocks 72 are provided on the side plates 41, and the linear movement tracks 71 are provided on the inner surfaces of the side wall members 61 and 62 in the vertical direction (vertical direction). Specifically, as shown in FIG. 5, two linear movement tracks 71 are provided side by side in the front-rear direction on the inner surfaces of the respective side wall members 61 and 62, and two rows of linear movement blocks 72 are provided on each side plate 41 corresponding to the two linear movement tracks 71. Here, the row of linear movement blocks 72 provided on each side plate 41 includes two linear movement blocks 72 (refer to FIG. 2). That is, a total of four linear movement blocks 72 are provided on each side plate 41. Specifically, as shown in FIGS. 2 and 5, two linear movement tracks 71 are provided on the inner surfaces of the respective side wall members 61, 62. Here, the two linear movement tracks 71 extend in the vertical direction (the plumb direction). Moreover, the two linear movement tracks 71 are arranged in the front-rear direction. On the other hand, linear movement blocks 72 are provided on the respective side plates 41. Here, the linear movement blocks 72 are arranged in two parallel rows in the front-rear direction in the respective side plates 41 so as to correspond to the two linear movement tracks 71. In each side plate 41, two linear movement blocks 72 are arranged in the vertical direction (the plumb direction) in each row. That is, a total of four linear movement blocks 72 are provided on each side plate 41. Further, for example, in the portion of the linear movement block 72 covered by the connecting member 822 described later in FIG. 2, one more linear movement block 72 may be additionally arranged for each side plate 41, and a total of six linear movement blocks 72 may be arranged. As shown in FIGS. 2, 3, 5 to 7, the lifting linkage mechanism 8 synchronizes the lifting of the intermediate plate 4 with the lifting of the movable platen 3 to synchronize the mold clamping and mold opening of the first forming die 5a and the second forming die 5b. That is, the lifting linkage mechanism 8 can set the mold clamping speed of the first forming die 5a to be the same as the mold clamping speed of the second forming die 5b, and can perform mold clamping simultaneously. Specifically, the lifting linkage mechanism 8 includes: a boom mechanism 81 that expands and contracts by the lifting of the movable platen 3; and a connecting mechanism 82 that connects the cross-linking rod portion 811 of the boom mechanism 81 and the intermediate plate 4. As shown in FIG. 2, the boom mechanism 81 is provided on the left and right outer sides of the pair of side wall members 61, 62. That is, the movable platen 3 and the intermediate plate 4 are lifted and linked by the two left and right boom mechanisms 81. Further, the left and right boom mechanisms 81 have the same structure. Specifically, as shown in FIGS. 3 and 6, each boom mechanism 81 includes a cross-linking rod portion 811, an upper end link portion 812, and a lower end link portion 813. The cross-linking rod portion 811 crosses the first link 81a and the second link 81b at the central portions thereof, and rotatably connects the crossing portion by a rotating shaft 81c. Moreover, the upper end link portion 812 rotatably connects the lower end portions of the third link 81d and the fourth link 81e to the upper end portions of the first link 81a and the second link 81b by rotating shafts 81f, respectively, and rotatably connects the upper end portions of the third link 81d and the fourth link 81e to each other by a rotating shaft 81g. Further, the lower end link portion 813 rotatably connects the upper end portions of the fifth link 81h and the sixth link 81i to the lower end portions of the first link 81a and the second link 81b by rotating shafts 81j, respectively, and rotatably connects the lower end portions of the fifth link 81h and the sixth link 81i to each other by a rotating shaft 81k. Further, the upper end portion (upper link portion 812) of the boom mechanism 81 is fixed to the upper end portions of the side wall members 61 and 62, and the lower end portion (lower link portion 813) of the boom mechanism 81 is fixed to the fixing member 31 that moves together with the movable platen 3. Therefore, the lower end portion (lower link portion 813) of the boom mechanism 81 is connected to the movable platen 3 via the fixing member 31 and moves along with the movement of the movable platen 3. In the present embodiment, as shown in FIG. 6, the rotation axis 81c of the cross link portion 811, the rotation axis 81g of the upper link portion 812, and the rotation axis 81k of the lower link portion 813 of the boom mechanism 81 are arranged in the vertical direction (the direction of gravity), and are arranged so as to be located at the center in the width direction of the side wall members 61 and 62 when viewed from the side. As shown in FIGS. 2, 3, 5, and 7, the connection mechanism 82 connects the cross link portion 811 of the boom mechanism 81 and the intermediate plate 4. Specifically, the connection mechanism 82 includes a connection member 821 connected to the cross link portion 811, a connection member 822 that connects the connection member 821 to the intermediate plate 4, and elastic members 823a and 823b interposed between the connection member 821 and the connection member 822. Further, the left and right connection mechanisms 82 have the same structure. As shown in FIGS. 3, 5, and 6, the connection member 821 is connected to the cross link portion 811 without hindering the expansion and contraction of the boom mechanism 81. Specifically, the connection member 821 has a rectangular long shape, and the central portion thereof is connected to the rotation axis 81c of the cross link portion 811. The connection member 821 is extended in the front-rear direction (the horizontal direction). The connection member 822 connects the connection member 821 to the intermediate plate 4. In the present embodiment, the connection member 822 is respectively connected to side plates 41 (refer to FIG. 2) connected to both side portions (here, the left and right sides) of the intermediate plate 4. The connection member 822 extends outward from the front and rear of the side wall members 61 and 62 (refer to FIG. 5). The elastic members 823a and 823b are used to absorb the deviation such as the thickness of the substrate W, and are provided interposed between the connection member 822 and the connection member 821. Moreover, the elastic members 823a and 823b are provided outside the side wall members 61 and 62. Specifically, as shown in FIGS. 2, 3, 5, and 7, the elastic members 823a and 823b include: an upper elastic member 823a that absorbs the upward displacement of the intermediate plate 4 relative to the connection member 821; and a lower elastic member 823b that absorbs the downward displacement of the intermediate plate 4 relative to the connection member 821. As shown in FIG. 7, these elastic members 823a and 823b constitute displacement absorption mechanisms 83a and 83b provided on the connection member 822. The displacement absorption mechanisms 83a and 83b are respectively provided on the upper side and the lower side of the connection member 821 in the connection member 822. The upper displacement absorption mechanism 83a has: an upper contact portion 831 that contacts the upper surface of the connection member 821; an upper elastic member 823a that applies a force (biasing force) to the upper contact portion 831 toward the upper surface of the connection member 821; and an upper support portion 832 that supports the upper contact portion 831 so as to be movable upward. Further, the lower displacement absorption mechanism 83b has: a lower contact portion 833 that contacts the lower surface of the connection member 821; a lower elastic member 823b that applies a force (biasing force) to the lower contact portion 833 toward the lower surface of the connection member 821; and a lower support portion 834 that supports the lower contact portion 833 so as to be movable downward. The upper support portion 832 and the lower support portion 834 are fixed relative to the connection member 822. Here, an upper stopper 831a is formed on the upper contact portion 831, and the upper stopper 831a protrudes around so as to be able to contact the upper surface of the upper support portion 832 to restrict downward movement. A lower stopper 833a is formed on the lower contact portion 833, and the lower stopper 833a protrudes around so as to be able to contact the lower surface of the lower support portion 834 to restrict upward movement. Moreover, the connection member 822 has: an upper protruding portion 822a that protrudes on the upper side of the upper end surface of the upper contact portion 831 so as to form an opposing surface; and a lower protruding portion 822b that protrudes on the lower side of the lower end surface of the lower contact portion 833 so as to form an opposing surface. Further, a gap is provided between the upper end surface of the upper contact portion 831 and the lower surface of the upper protruding portion 822a of the connection member 822 (the opposing surface of the upper end surface of the upper contact portion 831) such that they do not contact due to the operation of the displacement absorption mechanisms 83a and 83b described later. Also, a gap is provided between the lower end surface of the lower contact portion 833 and the upper surface of the lower protruding portion 822b of the connection member 822 (the opposing surface of the lower end surface of the lower contact portion 833) such that they do not contact due to the operation of the displacement absorption mechanisms 83a and 83b. Next, the basic operations of the displacement absorbing mechanism 83a and the displacement absorbing mechanism 83b will be described. In the initial state of the displacement absorbing mechanism 83a and the displacement absorbing mechanism 83b (refer to FIG. 7), the elastic member 823a is in a state where its upper end contacts the lower surface of the upper protrusion 822a of the connecting member 822 (the opposing surface of the upper end surface of the upper contact portion 831), and its lower end contacts the upper surface of the upper stopper 831a of the upper contact portion 831 without expansion or contraction. Moreover, in the initial state of the displacement absorbing mechanism 83a and the displacement absorbing mechanism 83b, the elastic member 823b is in a state where its upper end contacts the lower surface of the lower stopper 833a of the lower contact portion 833, and its lower end contacts the upper surface of the lower protrusion 822b of the connecting member 822 (the opposing surface of the lower end surface of the lower contact portion 833) without expansion or contraction. And when the intermediate plate 4 is displaced relatively downward with respect to the connecting member 821, as shown in FIG. 8(a), the connecting member 822 connected to the intermediate plate 4 is displaced relatively downward with respect to the connecting member 821. Then, in a state where the connecting member 821 and the upper contact portion 831 are stationary, the upper support portion 832 and the upper protrusion 822a of the connecting member 822 are also displaced relatively downward, so the upper elastic member 823a contracts. In other words, the connecting member 821 and the upper contact portion 831 move relatively upward with respect to the upper protrusion 822a of the connecting member 822, and the upper elastic member 823a contracts. Thus, the relative downward displacement of the intermediate plate 4 with respect to the connecting member 821 is absorbed. On the other hand, when the intermediate plate 4 is displaced relatively upward with respect to the connecting member 821, as shown in FIG. 8(b), the connecting member 822 connected to the intermediate plate 4 is displaced relatively upward with respect to the connecting member 821. Then, in a state where the connecting member 821 and the lower contact portion 833 are stationary, the lower support portion 834 and the lower protrusion 822b of the connecting member 822 are also displaced relatively upward, so the lower elastic member 823b contracts. In other words, the connecting member 821 and the lower contact portion 833 move relatively downward with respect to the lower protrusion 822b of the connecting member 822, and the lower elastic member 823b contracts. Thus, the relative upward displacement of the intermediate plate 4 with respect to the connecting member 821 is absorbed. Furthermore, in the resin molding apparatus 100 of the present embodiment, as shown in FIGS. 2, 5, and 7, a guiding mechanism 84 is further provided between the connecting member 821 and the connecting member 822. The guiding mechanism 84 guides the movement when the connecting member 821 and the connecting member 822 move relatively. The guiding mechanism 84 guides the vertical movement of the connecting member 821, and is disposed between the facing surfaces of the connecting member 821 and the connecting structure member 822. Specifically, the guiding mechanism 84 includes a linear movement track 841 disposed on one of the connecting member 821 or the connecting structure member 822, and a linear movement block 842 disposed on the other of the connecting member 821 or the connecting structure member 822. In the present embodiment, the linear movement track 841 is provided on the connecting structure member 822, and the linear movement block 842 is provided on the connecting member 821. <1-3. Specific Structure of the Resin Molding Apparatus 100> Further, as shown in FIGS. 9 to 13(b), the resin molding apparatus 100 of the present embodiment further includes: a molding die sliding mechanism 20 that slides the opened molding dies 5a and 5b in a sliding direction intersecting the mold clamping direction; and a gap changing mechanism 30 that changes the gap between the base member and the facing surfaces (the surfaces facing each other in the mold clamping direction) of the molding dies 5a and 5b when the molding die sliding mechanism 20 slides the molding dies 5a and 5b. Further, in FIGS. 1 to 4 and 6, the illustrations of the molding die sliding mechanism 20 and the gap changing mechanism 30 are omitted. Here, the mold clamping direction is the vertical direction (the plumb direction), and the sliding direction is the front-rear direction (the direction orthogonal to the vertical direction and the left-right direction). Moreover, the base member of the present embodiment is the fixed platen 2, the movable platen 3, and the intermediate platen 4. As shown in FIGS. 9 to 12, the molding die sliding mechanism 20 is provided corresponding to the upper die 51 and the lower die 52 in the molding dies 5a and 5b, respectively. And the molding die sliding mechanism 20 slides the upper die 51 and the lower die 52 between the mold clamped position Q after mold clamping and the protruding position R located more outward in the sliding direction than the base members 2 to 4. Specifically, the molding die sliding mechanism 20 includes: a support frame 201 that supports the upper die 51 or the lower die 52; a guiding portion 202 that guides the movement of the support frame 201 along the sliding direction with respect to the base members 2 to 4; and a driving actuator 203 that moves the support frame 201 along the sliding direction. As shown in FIGS. 9 to 12, the support frame 201 has an upper die support frame 201a that supports the upper die 51 and a lower die support frame 201b that supports the lower die 52. As shown in FIGS. 10(a) and 10(b), each of the support frames 201a and 201b has a rectangular frame shape in a plan view, and is configured to support the upper die 51 or the lower die 52 in its opening. Further, the upper die support frame 201a movably supports the upper die 51 in the clamping direction and has a stopper portion 204 for placing the edge of the upper die 51. The stopper portion 204 is provided corresponding to the four corners of the upper die 51 (refer to FIGS. 10(a) and 10(b)). Moreover, the lower die support frame 201b movably supports the lower die 52 in the clamping direction and has an elastic body 205 for supporting the edge of the lower die 52. The elastic body 205 is provided corresponding to the four corners of the lower die 52 (refer to FIGS. 10(a) and 10(b)) and supports the lower die 52 via a contact portion 206 that contacts the lower die 52. Furthermore, the contact portion 206 is movably provided on the lower die support frame 201b. As shown in FIGS. 9 to 12, the guiding portion 202 is provided between a fixed member 40 fixed to the base members 2 to 4 and the support frame 201. Specifically, the guiding portion 202 is constituted by using a linear motion guide and has: a linear motion track 202a provided on one of the fixed member 40 or the support frame 201 and extending linearly along the sliding direction; and a moving linear motion block 202b provided on the other of the fixed member 40 or the support frame 201 and sliding on the linear motion track 202a. As shown in FIGS. 9 to 12, the driving actuator 203 is provided corresponding to each support frame 201 and moves the support frame 201 along the guiding portion 202. By this driving actuator 203, the upper die 51 and the lower die 52 move between the clamping position Q and the protruding position R. The driving actuator 203 of the present embodiment has a rack 203a provided on the support frame 201, a pinion 203b meshing with the rack 203a, and a motor 203c such as a servo motor for rotating the pinion 203b. Furthermore, the driving actuator 203 is not limited to using the structure of the rack and pinion and may be one using a ball screw mechanism or a cylinder. In the present embodiment, the upper die 51 of the first molding die 5a provided on the lower surface of the fixed platen 2 has a structure that slides via an upper die support frame 201a through a fixing member 40 fixed to the fixed platen 2. The lower die 52 of the first molding die 5a provided on the upper surface of the intermediate platen 4 has a structure that slides via a lower die support frame 201b through a fixing member 40 fixed to the intermediate platen 4. Further, the upper die 51 of the second molding die 5b provided on the lower surface of the intermediate platen 4 has a structure that slides via an upper die support frame 201a through a fixing member 40 fixed to the intermediate platen 4. That is, the lower die support frame 201b of the lower die 52 of the first molding die 5a and the upper die support frame 201a of the upper die 51 of the second molding die 5b are provided with a structure that slides through a common fixing member 40. Furthermore, the lower die 52 of the second molding die 5b provided on the upper surface of the movable platen 3 has a structure that slides via a lower die support frame 201b through a fixing member 40 fixed to the movable platen 3. Moreover, as shown in FIGS. 9, 11 to 13(b), the molding die sliding mechanism 20 has a positioning portion 207 that contacts the sides of the upper die 51 and the lower die 52 that have moved to the mold clamping position Q to position the upper die 51 and the lower die 52 at the mold clamping position Q. The positioning portion 207 positions the upper die 51 and the lower die 52 in the horizontal direction (front-rear direction and left-right direction) with respect to the base members 2 to 4. Furthermore, the molding die sliding mechanism 20 may also be configured such that it does not have the above-described positioning portion 207, and in addition to the above-described positioning portion 207, the upper die 51 and the lower die 52 are positioned at the mold clamping position Q by position control using a drive actuator 203. As shown in FIGS. 9 to 13(b), the interval changing mechanism 30 is provided corresponding to the upper die 51 and the lower die 52 in the molding die 5a and the molding die 5b in the same manner as the molding die sliding mechanism 20. And when the upper die 51 and the lower die 52 slide between the mold clamping position Q and the protruding position R by the molding die sliding mechanism 20, the interval changing mechanism 30 changes the interval between the facing surfaces of the base members 2 to 4 and the upper die 51 and the lower die 52. The interval changing mechanism 30 provided corresponding to the upper die 51 of the first forming die 5a changes the interval between the lower surface of the fixed platen 2 where the upper die 51 is mounted and the upper surface of the upper die 51 of the first forming die 5a that is mounted on the upper surface of the fixed platen 2. The interval changing mechanism 30 provided corresponding to the lower die 52 of the first forming die 5a changes the interval between the upper surface of the intermediate platen 4 where the lower die 52 is mounted and the lower surface of the lower die 52 of the first forming die 5a that is mounted on the lower surface of the intermediate platen 4. The interval changing mechanism 30 provided corresponding to the upper die 51 of the second forming die 5b changes the interval between the lower surface of the intermediate platen 4 where the upper die 51 is mounted and the upper surface of the upper die 51 of the second forming die 5b that is mounted on the upper surface of the intermediate platen 4. The interval changing mechanism 30 provided corresponding to the lower die 52 of the second forming die 5b changes the interval between the upper surface of the movable platen 3 where the lower die 52 is mounted and the lower surface of the lower die 52 of the second forming die 5b that is mounted on the lower surface of the movable platen 3. Specifically, the interval changing mechanism 30 is constituted by using the drive actuator 203 of the forming die sliding mechanism 20. Moreover, the interval changing mechanism 30 has a cam mechanism 301 provided intervening between the upper die 51 and the lower die 52 and the base members 2 to base members 4. And in this interval changing mechanism 30, accompanying the movement of the drive actuator 203 with respect to the support frame 201, the cam mechanism 301 changes the interval between the facing surfaces of the upper die 51 and the lower die 52 and the base members 2 to base members 4. The cam mechanism 301 of the present embodiment includes: a first cam portion 302 having contact surfaces provided on the upper die 51 and the lower die 52; and a second cam portion 303 fixed with respect to the base members 2 to base members 4 and contacting the contact surfaces of the first cam portion 302. Here, as shown in the "Structure of the First Cam Portion" in FIG. 9, the contact surface has: an inclined surface 302a for narrowing or expanding the interval between the facing surfaces of the upper die 51 and the lower die 52 and the base members 2 to base members 4; and a flat surface 302b for maintaining the narrowed interval. Moreover, two first cam portions 302 are respectively provided on both sides of the upper die 51 and the lower die 52, and two second cam portions 303 are respectively provided on both sides of the base members 2 to base members 4 corresponding to the first cam portions 302. Furthermore, the second cam portion 303 may include a roller member, a rotating body (bearing), a bushing, or the like. <1-3-1. Mechanism for Changing the Interval between the Upper Die 51 and the Base Members 2 and 4> Specifically, the cam mechanism 301 corresponding to the upper die support frame 201a has a structure that lifts the upper die 51 placed on the stopper portion 204 of the upper die support frame 201a from the stopper portion 204. As shown in the "Structure of the First Cam Portion (a)" in FIG. 9, the inclined surface 302a of the first cam portion 302 is a downward-facing surface and is a surface with an upward slope from the protruding position R toward the clamping position Q. With this structure, when the upper die 51 slides from the protruding position R toward the clamping position Q, as shown in Fig. 13(a), the inclined surface 302a of the first cam portion 302 contacts the corresponding second cam portion 303 and straddles it. The upper die 51 is lifted from the stopper portion 204, and the upper surface of the upper die 51 approaches the lower surfaces of the base members 2 and 4, and the interval therebetween becomes smaller. Furthermore, at the clamping position Q, the flat surface 302b of the first cam portion 302 is in contact with the second cam portion 303. On the other hand, when the upper die 51 slides from the clamping position Q toward the protruding position R, the first cam portion 302 of the upper die 51 separates from the corresponding second cam portion 303. The upper die 51 moves under the action of its own weight and is placed on the stopper portion 204. The upper surface of the upper die 51 separates from the lower surfaces of the base members 2 and 4, and the interval therebetween becomes larger. <1-3-2. Mechanism for changing the interval between the lower die 52 and the base members 3 and 4> Specifically, the cam mechanism 301 corresponding to the lower die support frame 201b is structured to press the lower die 52 of the elastic body 205 and the contact portion 206 supported by the lower die support frame 201b toward the elastic body 205 (base members 2 to 4) side. The inclined surface 302a of the first cam portion 302 is an upward-facing surface, as shown in "Structure of the First Cam Portion (b)" in Fig. 9, and is a surface with a downward slope from the protruding position R toward the clamping position Q. With this structure, when the lower die 52 slides from the protruding position R toward the clamping position Q, as shown in Fig. 13(b), the inclined surface 302a of the first cam portion 302 of the lower die 52 contacts the corresponding second cam portion 303, and the lower die 52 is pressed toward the elastic body 205 side. The lower surface of the lower die 52 approaches the upper surfaces of the base members 3 and 4, and the interval therebetween becomes smaller. Furthermore, at the clamping position Q, the flat surface 302b of the first cam portion 302 is in contact with the second cam portion 303. On the other hand, when the lower die 52 slides from the clamping position Q toward the protruding position R, the first cam portion 302 of the lower die 52 separates from the corresponding second cam portion 303. The lower die 52 moves upward by the force applied from the elastic body 205, and the lower surface of the lower die 52 separates from the upper surfaces of the base members 3 and 4, and the interval therebetween becomes larger. Here, the cam mechanism 301 of the interval change mechanism 30 causes the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 not to contact each other at the mold clamping position Q, and to be in a state where a slight gap is formed. Then, the mold clamping mechanism 10 clamps the molding dies 5a and 5b, and the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 contact each other. At this time, since the upper die 51 and the lower die 52 are in close contact with the base members 2 to 4, the first cam portion 302 and the second cam portion 303 provided on the upper die 51 and the lower die 52 are separated, and the cam mechanism 301 will not be damaged due to mold clamping. Furthermore, the cam mechanism 301 may also be configured such that the opposing surfaces of the upper die 51 and the lower die 52 and the base members 2 to 4 contact each other at the mold clamping position Q. <1-4. Specific structures of the transfer mechanisms 13 and 18> Next, the specific structures of the substrate transfer mechanism 13 and the resin material transfer mechanism 18 of the present embodiment will be described. The substrate transfer mechanism 13 transfers the substrate W and the resin molded product P, which are objects to be transferred, to the upper die 51 located at the protruding position R. As shown in FIG. 11, the substrate transfer mechanism 13 moves to the transfer position X1 for transferring the substrate W and the resin molded product P to the upper die 51 located at the protruding position R. Here, the transfer position X1 refers to a position where the substrate transfer mechanism 13 is located below the upper die 51 at the protruding position R and is used for transferring, that is, exchanging, the substrate W and the resin molded product P. Furthermore, when the substrate transfer mechanism 13 transfers the substrate W and the resin molded product P to the upper die 51, the lower die 52 is located at the mold clamping position Q and does not interfere with the transfer of the substrate W and the resin molded product P relative to the upper die 51. Moreover, the substrate transfer mechanism 13 is configured to move in the left-right direction between the transfer position X1 and a retracted position (not shown). Here, the transfer position X1 can also be expressed as an exchange position for exchanging the substrate W, which is an object to be transferred, between the upper die 51, which is a molding die at the protruding position R, and the substrate transfer mechanism 13. Specifically, as shown in FIG. 1, the substrate transfer mechanism 13 includes: a substrate supply unit 131 that supplies the substrate W to the upper die 51 located at the protruding position R; and a substrate pickup unit 132 that picks up the resin molded product P from the upper die 51 located at the protruding position R. The substrate supply unit 131 and the substrate pickup unit 132 are provided corresponding to each upper die 51, and these are arranged horizontally side by side in the left-right direction. Furthermore, the substrate transfer mechanism 13 moves left and right at the transfer position X1, and continuously performs the pickup operation of the substrate pickup unit 132 and the supply operation of the substrate supply unit 131. When performing the pickup operation of the substrate pickup unit 132, the substrate pickup unit 132 is located below the upper die 51 at the protruding position R, and when performing the supply operation of the substrate supply unit 131, the substrate supply unit 131 is located below the upper die 51 at the protruding position R. The resin material transfer mechanism 18 transfers the resin material J and the release film F, which are transfer objects, to the lower mold 52 located at the protruding position R. As shown in FIG. 12, the resin material transfer mechanism 18 moves to the transfer position X2 for transferring the resin material J and the release film F to the lower mold 52 located at the protruding position R. Here, the transfer position X2 refers to the position where the resin material transfer mechanism 18 is located above the lower mold 52 at the protruding position R and is used for transferring, that is, handing over, the resin material J and the release film F. Furthermore, when the resin material transfer mechanism 18 transfers the resin material J and the release film F to the lower mold 52, the upper mold 51 is located at the mold clamping position Q and does not interfere with the transfer of the resin material J and the release film F relative to the lower mold 52. Moreover, the resin material transfer mechanism 18 is configured to move in the left-right direction between the transfer position X2 and a retracted position (not shown). Here, the transfer position X2 can also be expressed as the handover position for handing over the resin material J, which is the transfer object, between the forming die, that is, the lower mold 52, located at the protruding position R and the resin material transfer mechanism 18. Specifically, as shown in FIG. 1, the resin material transfer mechanism 18 includes: a resin material supply unit 181 that supplies the resin material J and the pre-use release film F to the lower mold 52 located at the protruding position R; and a film recovery unit 182 that recovers the used-up release film F from the lower mold 52 located at the protruding position R. The resin material supply unit 181 and the film recovery unit 182 are provided corresponding to each lower mold 52, and these are arranged horizontally side by side in the left-right direction. Moreover, the resin material transfer mechanism 18 moves left and right at the transfer position X2, and continuously performs the recovery operation of the film recovery unit 182 and the supply operation of the resin material supply unit 181. When performing the recovery operation of the film recovery unit 182, the film recovery unit 182 is located above the lower mold 52 at the protruding position R, and when performing the supply operation of the resin material supply unit 181, the resin material supply unit 181 is located above the lower mold 52 at the protruding position R. <1-5. An Example of the Operation of the Resin Molding Apparatus 100> Next, an example of the operation of the resin molding apparatus 100 will be described with reference to FIGS. 1, 2, 4, and FIGS. 8(a) and (b). The operations shown below are performed, for example, by controlling each part of the resin molding apparatus 100 by a control unit COM provided in the substrate supply / 收纳 module A. Furthermore, the control unit COM is a dedicated or general-purpose computer having a central processing unit (CPU), an internal memory, an input / output interface, an analog / digital (AD) converter, and the like. <1-5-1. Overall Operation> First, in a state where each molding die 5a, 5b is opened by the lifting linkage mechanism 8 (refer to Fig. 2), the substrate W is conveyed and held on the upper die 51 of each molding die 5a, 5b by the substrate supply / storage module A shown in Fig. 1. Moreover, the release film F and the resin material J are accommodated in the cavity 52C of the lower die 52 of each molding die 5a, 5b by the resin material supply module C. Thus, the substrate W, which is the object to be molded, the release film F, and the resin material J are supplied to each molding die 5a, 5b. Next, the movable platen 3 is raised by the clamping mechanism 10. Along with the raising of the movable platen 3, the boom mechanism 81 contracts, and the intermediate plate 4 connected to the rotation shaft 81c of the cross-linking rod portion 811 of the boom mechanism 81 rises. Here, along with the raising of the movable platen 3, the periphery of the molding die 5a and the molding die 5b is sealed by the sealing structure 50 shown in Fig. 5, and the periphery of the molding die 5a and the molding die 5b is evacuated by a vacuum pump (not shown). And, the upper surface of the lower die 52 of each molding die 5a, 5b (specifically, the upper surface of the side member 522, or the release film F when the release film F exists) contacts the substrate W adsorbed and held on the upper die 51. At this time, when the timing of the lower die 52 in the first molding die 5a and the second molding die 5b contacting the upper die 51 is different, the upper elastic member 823a or the lower elastic member 823b deforms prior to the elastic member 524 of the lower die 52. That is, the spring constants of the upper elastic member 823a and the lower elastic member 823b are smaller than the spring constant of the elastic member 524 of the lower die 52. For example, when the lower die 52 (the lower die 52 of the first molding die 5a) on the intermediate plate 4 contacts the substrate W adsorbed and held on the corresponding upper die 51 prior to the lower die 52 (the lower die 52 of the second molding die 5b) on the movable platen 3, the intermediate plate 4 is displaced downward relative to the connecting member 821, and the upper elastic member 823a contracts (refer to Fig. 8(a)). On the other hand, when the lower die 52 (the lower die 52 of the second molding die 5b) on the movable platen 3 contacts the substrate W adsorbed and held on the corresponding upper die 51 prior to the lower die 52 (the lower die 52 of the first molding die 5a) on the intermediate plate 4, the intermediate plate 4 is displaced upward relative to the connecting member 821, and the lower elastic member 823b contracts (refer to Fig. 8(b)). By these, the difference in the timing when the lower die 52 in the first forming die 5a and the second forming die 5b contacts the upper die 51 is eliminated, and the mold clamping operation is performed. Moreover, the upper elastic members 823a and the lower elastic members 823b absorb not only the deviation in the thickness of the substrate W, but also deviations such as the amount of the resin material J accommodated in the cavity 52C and the volume of the electronic component Wx fixed to the substrate W. Subsequently, the mold clamping mechanism 10 further raises the movable platen 3, whereby the mold clamping of the first forming die 5a and the second forming die 5b is completed. By maintaining this state for a specified time (e.g., the curing time of the resin material J), the resin forming is completed. Thus, the mold clamping of each forming die 5a, 5b is performed using the lifting linkage mechanism 8, and the resin forming is carried out. Subsequently, when the mold clamping mechanism 10 lowers the movable platen 3, each forming die 5a, 5b is opened. Then, the resin formed product P is accommodated in the substrate accommodating portion 12 (refer to FIG. 1) by the substrate supply / accommodation module A. Thus, the mold of each forming die 5a, 5b is opened using the lifting linkage mechanism 8, and the substrate W (resin formed product P), which is the object to be formed by resin, is taken out from each forming die 5a, 5b and accommodated in the substrate accommodating portion 12, thereby manufacturing the resin formed product P. <Details of the transfer steps before (after) the resin forming step> Next, the details of the transfer steps before (after) the resin forming step will be described with reference to FIGS. 11 to 14 and the like. (Resin formed product picking step: S1 (refer to FIG. 14)) In the state where each forming die 5a, 5b has been opened (refer to FIG. 2), as shown in FIG. 11, by the forming die sliding mechanism 20, the upper die 51 of each forming die 5a, 5b is moved together from the mold clamping position Q to the protruding position R (the first upper die sliding step). Moreover, the substrate transfer mechanism 13 moves to the transfer position X1. Furthermore, in the first upper die sliding step, as shown in FIG. 13(a), by the interval changing mechanism 30, the interval between the opposing surfaces of the base member 2, the base member 4 and the upper die 51 becomes larger. And the substrate picking portion 132 of the substrate transfer mechanism 13 picks up the resin formed product P together from the upper die 51 located at the protruding position R. (Substrate supply step before forming: S2 (refer to FIG. 14)) Next, the substrate supply portion 131 of the substrate transfer mechanism 13 supplies the pre - formed substrate W together to the upper die 51 located at the protruding position R and holds it (substrate transfer step). Subsequently, by the forming die sliding mechanism 20, the upper die 51 holding the pre - formed substrate W is moved together from the protruding position R to the mold clamping position Q (the second upper die sliding step). Moreover, the substrate transfer mechanism 13 moves to the retracted position. Furthermore, in the second upper die sliding step, as shown in FIG. 13(a), by the interval changing mechanism 30, the interval between the opposing surfaces of the base member 2, the base member 4 and the upper die 51 becomes smaller. (Step of Recycling Film after Use: S3 (refer to FIG. 14)) As shown in FIG. 12, by means of the forming die sliding mechanism 20, the lower dies 52 of the respective forming dies 5a and 5b are simultaneously moved from the mold clamping position Q to the protruding position R (first lower die sliding step). Moreover, the resin material conveying mechanism 18 is moved to the conveying position X2. Further, in the first lower die sliding step, as shown in FIG. 13(b), by means of the interval changing mechanism 30, the intervals between the facing surfaces of the base members 3, 4 and the lower die 52 are enlarged. And the film recycling part 182 of the resin material conveying mechanism 18 simultaneously recycles the used release film F from the lower die 52 located at the protruding position R. (Step of Supplying Resin Material: S4 (refer to FIG. 14)) Next, the resin material supply part 181 of the resin material conveying mechanism 18 supplies the release film F before use and the resin material J to the lower die 52 (resin material conveying step). Subsequently, by means of the forming die sliding mechanism 20, the lower die 52 supplied with the release film F and the resin material J is simultaneously moved from the protruding position R to the mold clamping position Q (second lower die sliding step). Moreover, the resin material conveying mechanism 18 is moved to the retracted position. Further, in the second lower die sliding step, as shown in FIG. 13(b), by means of the interval changing mechanism 30, the intervals between the facing surfaces of the base members 3, 4 and the lower die 52 are reduced. Subsequently, the following resin forming step is performed. And the resin formed product P picked up by the substrate conveying mechanism 13 is stored in the substrate storage part 12 (refer to FIG. 1). Furthermore, the used release film F recovered by the resin material conveying mechanism 18 is discarded into a waste bin (not shown). <1-5-3. Sliding Action of the Upper Die 51 and Moving Action of the Substrate Conveying Mechanism 13> In the present embodiment, prior to the first sliding action of the upper die 51 toward the protruding position R performed by the forming die sliding mechanism 20, the first moving action of the substrate conveying mechanism 13 toward the conveying position X1 where the substrate W is handed over and conveyed to the upper die 51 located at the protruding position R is started, or the first sliding action is performed in a manner that at least a part of the period overlaps with the first moving action. Performing the first sliding action in a manner that at least a part of the period overlaps with the first moving action means that the first moving action and the first sliding action are simultaneously executed in at least a part of the period, or there is a period of simultaneous execution between the first moving action and the first sliding action. Specifically, as shown in (a) of FIG. 15 for the first operation mode and (a) to (e) of FIG. 16, it is conceivable to perform the first sliding operation after the first moving operation is completed. That is, after the substrate transfer mechanism 13 moves to the transfer position X1 (refer to (a) of FIG. 16), the forming die sliding mechanism 20 starts to slide the upper die 51 to move it to the protruding position R (refer to (b) of FIG. 16). And, by the substrate pickup portion 132 of the substrate transfer mechanism 13, the resin molded product P is picked up from the upper die 51 located at the protruding position R (refer to (c) of FIG. 16). Moreover, the pre-formed substrate W is supplied to the upper die 51 located at the protruding position R by the substrate supply portion 131 of the substrate transfer mechanism 13 (refer to (d) of FIG. 16). After the pre-formed substrate W is supplied from the substrate transfer mechanism 13 to the upper die 51, the forming die sliding mechanism 20 starts to slide the upper die 51 to move it to the clamping position Q (refer to (e) of FIG. 16). After the upper die 51 moves to the clamping position Q, the substrate transfer mechanism 13 retreats from the transfer position X1 to the retreat position. By previously moving the substrate transfer mechanism 13 to the transfer position X1 in this way, the time that the upper die 51 stays at the protruding position R can be shortened, thereby preventing the temperature of the upper die 51 from dropping, and moreover, preventing contamination (such as adhesion or mixing of foreign substances, etc.) of the upper die 51 or the resin molded product P. Moreover, it is also conceivable to complete the first moving operation and the first sliding operation simultaneously or within a specified time. At this time, as shown in (b) of FIG. 15 for the second operation mode, the time for the substrate transfer mechanism 13 to move from the retreat position to the transfer position X1 is calculated. It is also possible to previously calculate this moving time and store it in the memory. Furthermore, the moving time for the upper die 51 to move from the clamping position Q to the protruding position R is previously calculated. And, the sliding operation of the upper die 51 is performed according to the time when the substrate transfer mechanism 13 reaches the transfer position X1. Thereby, when the substrate transfer mechanism 13 reaches the transfer position X1, the upper die 51 reaches the protruding position R. Moreover, after the substrate W is supplied from the substrate transfer mechanism 13, the sliding operation of the upper die 51 from the protruding position R toward the clamping position Q and the operation of the substrate transfer mechanism 13 from the transfer position X1 toward the retreat position are started simultaneously or at a specified timing. In this way, the first moving operation of the substrate transfer mechanism 13 and the first sliding operation of the upper die 51 are completed simultaneously or within a specified time, thereby shortening the cycle time of the resin molding apparatus 100 and improving the productivity of the resin molding apparatus 100. In addition, as a mode of performing the first sliding motion in such a manner that it overlaps at least a part of the first moving motion, the sliding movement of the upper mold 51 may also be started before the substrate transfer mechanism 13 reaches the transfer position X1, so that before the upper mold 51 reaches the protruding position R, the substrate transfer mechanism 13 reaches the transfer position X1. That is, it may also be that during the movement of the upper mold 51 from the self-locking mold position Q to the protruding position R, the substrate transfer mechanism 13 reaches the transfer position X1. Even with this structure, the time during which the upper mold 51 stays at the protruding position R can be shortened, thereby preventing the temperature of the upper mold 51 from dropping, and moreover, preventing contamination (such as adhesion or mixing of foreign substances, etc.) of the upper mold 51 or the resin molded product P. Moreover, it may also be that the sliding movement of the upper mold 51 is started before the substrate transfer mechanism 13 reaches the transfer position X1, so that after the upper mold 51 has reached the protruding position R, the substrate transfer mechanism 13 reaches the transfer position X1. <1-5-4. Sliding motion of the lower mold 52 and moving motion of the resin material transfer mechanism 18> Prior to the second sliding motion of the lower mold 52 toward the protruding position R performed by the molding die sliding mechanism 20, the second moving motion of the resin material transfer mechanism 18 toward the transfer position X2 where the demolding film F and the resin material J are transferred and交接 (i.e., transferred) to the lower mold 52 located at the protruding position R is started, or the second sliding motion is performed in such a manner that it overlaps at least a part of the second moving motion. Performing the second sliding motion in such a manner that it overlaps at least a part of the second moving motion means that the second moving motion and the second sliding motion are executed simultaneously during at least a part of the period, or there is a period of simultaneous execution between the second moving motion and the second sliding motion. Specifically, as shown in FIG. 17(a) the first operation mode and FIGS. 18(a) to 18(e), it is conceivable to perform the second sliding operation after the second moving operation is completed. That is, after the resin material conveying mechanism 18 moves to the conveying position X2 (refer to FIG. 18(a)), the forming die sliding mechanism 20 starts to slide the lower die 52 to move it to the protruding position R (refer to FIG. 18(b)). Moreover, by means of the film recovery unit 182 of the resin material conveying mechanism 18, the used release film F is recovered from the lower die 52 located at the protruding position R (refer to FIG. 18(c)). Moreover, by means of the resin material supply unit 181 of the resin material conveying mechanism 18, the release film F before use and the resin material J are supplied to the lower die 52 located at the protruding position R (refer to FIG. 18(d)). After the release film F before use and the resin material J are supplied to the lower die 52 from the resin material conveying mechanism 18, the forming die sliding mechanism 20 starts to slide the lower die 52 to move it to the clamping position Q (refer to FIG. 18(e)). After the lower die 52 moves to the clamping position Q, the resin material conveying mechanism 18 retreats from the conveying position X2 to the retreat position. By previously moving the resin material conveying mechanism 18 to the conveying position X2 in this way, the time for the lower die 52 to stay at the protruding position R can be shortened, thereby preventing the temperature of the lower die 52 from dropping, and moreover, preventing the contamination of the lower die 52 (such as the adhesion or mixing of foreign substances, etc.). Moreover, it is also conceivable to complete the second moving operation and the second sliding operation simultaneously or within a specified time. At this time, as shown in FIG. 17(b) the second operation mode, the time for the resin material conveying mechanism 18 to move from the retreat position to the conveying position X2 is calculated. The moving time can also be calculated in advance and stored in the memory. Furthermore, the moving time for the lower die 52 to move from the clamping position Q to the protruding position R is calculated in advance. And, the sliding operation of the lower die 52 is performed according to the time when the resin material conveying mechanism 18 reaches the conveying position X2. Thereby, when the resin material conveying mechanism 18 reaches the conveying position X2, the lower die 52 reaches the protruding position R. Moreover, after the release film F and the resin material J are supplied from the resin material conveying mechanism 18, the sliding operation of the lower die 52 from the protruding position R toward the clamping position Q and the movement of the resin material conveying mechanism 18 from the conveying position X2 toward the retreat position are started simultaneously or at a specified timing. In this way, the second moving operation of the resin material conveying mechanism 18 and the second sliding operation of the lower die 52 are completed simultaneously or within a specified time, thereby shortening the cycle time of the resin molding apparatus 100, and thus improving the productivity of the resin molding apparatus 100. In addition, as a mode of performing the second sliding operation in a manner that overlaps at least a part of the second moving operation, the sliding movement of the lower mold 52 can also be started before the resin material conveying mechanism 18 reaches the conveying position X2, so that before the lower mold 52 reaches the protruding position R, the resin material conveying mechanism 18 reaches the conveying position X2. That is, it can also be that during the period when the lower mold 52 moves from the self-locking mold position Q toward the protruding position R, the resin material conveying mechanism 18 reaches the conveying position X2. Even with this structure, the time for the lower mold 52 to stay at the protruding position R can be shortened, thereby preventing the temperature of the lower mold 52 from dropping, and moreover, preventing contamination of the lower mold 52 (such as adhesion or mixing of foreign substances, etc.). Moreover, it can also be that the sliding movement of the lower mold 52 is started before the resin material conveying mechanism 18 reaches the conveying position X2, so that after the lower mold 52 has reached the protruding position R, the resin material conveying mechanism 18 reaches the conveying position X2. <1-6. Effects of the First Embodiment> According to the resin molding apparatus 100 of the present embodiment, the first moving operation of the substrate conveying mechanism 13 toward the conveying position X1 for conveying the pre-formed substrate W and the resin molded product P to the upper mold 51 located at the protruding position R is started earlier than the first sliding operation toward the protruding position R performed by the molding die sliding mechanism 20, or the first sliding operation is performed in a manner that overlaps at least a part of the first moving operation. Therefore, the time for the upper mold 51 to stay at the protruding position R can be shortened. As a result, the temperature drop of the upper mold 51 located at the protruding position R can be prevented, and thus the temperature maintenance of the upper mold 51 can be easily performed. Moreover, the contamination of the upper mold 51 can be reduced, or the cycle time can be shortened. Therefore, the resin molded product P can be manufactured while satisfying conditions such as temperature maintenance of the upper mold 51, reduction of contamination of the upper mold 51, or shortening of the cycle time. Moreover, the second moving operation of the resin material conveying mechanism 18 toward the conveying position X2 for conveying the demolding film F and the resin material J to the lower mold 52 located at the protruding position R is started earlier than the second sliding operation toward the protruding position R performed by the molding die sliding mechanism 20, or the second sliding operation is performed in a manner that overlaps at least a part of the second moving operation. Therefore, the time for the lower mold 52 to stay at the protruding position R can be shortened. As a result, the temperature drop of the lower mold 52 located at the protruding position R can be prevented, and thus the temperature maintenance of the lower mold 52 can be easily performed. Moreover, the contamination of the lower mold 52 can be reduced, or the cycle time can be shortened. Therefore, the resin molded product P can be manufactured while satisfying conditions such as temperature maintenance of the lower mold 52, reduction of contamination of the lower mold 52, or shortening of the cycle time. Furthermore, when the molding dies 5a and 5b are slid between the mold clamping position Q and the protruding position R by the molding die sliding mechanism 20, the intervals between the opposing surfaces of the base members 2 to 4 and the molding dies 5a and 5b are changed. Thus, the opposing surfaces of the base members 2 to 4 and the molding dies 5a and 5b can be separated from each other during sliding. As a result, the wear caused by the sliding of the molding dies 5a and 5b can be reduced. Moreover, by moving the molding dies 5a and 5b to the protruding position R, the transfer objects (pre-formed substrate W, resin molded product P, release film F, and resin material J) can be transferred to the molding dies 5a and 5b at the protruding position R. As a result, it is not necessary to increase the interval between the molding dies 5a and 5b when the mold is opened, and the resin molding device 100 can be made to have a lower height. The connecting mechanism 82 between the cross-linking rod portion 811 of the link arm mechanism 81 and the intermediate plate 4 includes a connecting member 821 connected to the cross-linking rod portion 811, a connecting member 822 that connects the connecting member 821 to the intermediate plate 4, and elastic members 823a and 823b interposed between the connecting member 821 and the connecting member 822. Therefore, deviations such as the thickness of the substrate W in each of the molding dies 5a and 5b can be absorbed. For example, even if there is a deviation in the thickness of the pre-formed substrate W held by the upper die 51 of the first molding die 5a and the thickness of the pre-formed substrate W held by the upper die 51 of the second molding die 5b, the elastic members 823a and 823b are elastically deformed, and the deviations such as the thickness of these pre-formed substrates W can still be absorbed and the mold can be clamped. As a result, in the resin molding device 100 that clamps a plurality of molding dies 5a and 5b, the mold clamping of the plurality of molding dies 5a and 5b can be synchronized, and the deviations such as the thickness of the pre-formed substrate W in each of the molding dies 5a and 5b can be absorbed to perform resin molding. Moreover, since the link arm mechanism 81 is used to link the lifting of the movable platen 3 and the lifting of the intermediate plate 4, the enlargement of each member can be prevented, and the enlargement of the entire device can also be suppressed. Thus, highly rigid members are not required either. <2. Second Embodiment of the Present Invention> Next, the second embodiment of the present invention will be described. Furthermore, hereinafter, the parts different from the first embodiment will be described, and the same components will be denoted by the same reference numerals. The resin molding apparatus 100 of the second embodiment is different from the first embodiment (the structure having two sets of molding dies using one intermediate plate 4) in that it has a structure with multiple intermediate plates 4 and multiple sets of molding dies. For example, it may also be configured as follows: a structure with two intermediate plates 4 and three sets of molding dies, a structure with three intermediate plates 4 and four sets of molding dies, a structure with four intermediate plates 4 and five sets of molding dies, and a structure with five or more intermediate plates 4 and six or more sets of molding dies. Specifically, as shown in FIG. 19, in the resin molding apparatus 100, a plurality of intermediate plates 4 are arranged in the vertical direction between the fixed platen 2 and the movable platen 3. Moreover, molding dies 5b and 5c each including an upper die 51 and a lower die 52 are provided between the plurality of intermediate plates 4. Furthermore, in FIG. 19, the structure from the fixed platen 2 to the three intermediate plates 4 is illustrated, and the parts below that are omitted. Similar to the first embodiment, the plurality of intermediate plates 4 are respectively connected to the plurality of cross link portions 811 of the swing arm mechanism 81 via the connection mechanism 82. Thus, the plurality of intermediate plates 4 are lifted and lowered in联动 with the lifting and lowering of the movable platen 3. Here, as shown in FIG. 20, the swing arm mechanism 81 includes a plurality of cross link portions 811, an upper link portion 812, and a lower link portion 813 corresponding to the number of the plurality of intermediate plates 4. And the plurality of cross link portions 811 are connected in series. Specifically, among adjacent cross link portions 811, the upper end portion of the first link 81a of one cross link portion 811 is rotatably connected to the upper end portion of the second link 81b of another cross link portion 811 by a rotating shaft 81l, and the upper end portion of the second link 81b of one cross link portion 811 is rotatably connected to the upper end portion of the first link 81a of another cross link portion 811 by a rotating shaft 81m. Furthermore, the structures of the upper link portion 812 and the lower link portion 813 are the same as those of the first embodiment. Moreover, the side plates 41 respectively connected to the plurality of intermediate plates 4 are arranged so as to be horizontally offset without interfering with each other. Specifically, as shown in FIG. 19, the side plates 41 of the intermediate plates 4 adjacent to each other in the vertical direction are arranged so as to be offset left and right (in the horizontal direction) from each other. For example, it is configured such that the side panel 41a of the uppermost first intermediate plate 4 is located on the inner side, and the side panel 41b of the second intermediate plate 4 from the top is located on the outer side. Also, it is configured such that the side panel 41b of the second intermediate plate 4 from the top is located on the outer side, and the side panel 41c of the third intermediate plate 4 from the top is located on the inner side. Here, in the side panel 41b of the second intermediate plate 4 from the top, a through-hole or cutout portion (not shown) or the like is formed over the movement range of the linear movement block 842 in such a manner as not to hinder the movement of the linear movement block 842 disposed on the inner side panels 41a and 41c (the uppermost first and the third from the top). <2-1. Effects of the Second Embodiment> According to the resin molding apparatus 100 of the present embodiment, in addition to the effects of the first embodiment, resin molding can be performed using three or more molding dies 5a to 5c, thereby improving the productivity of the resin molded product P. Moreover, the side panels 41 of the plurality of intermediate plates 4 are arranged so as to be horizontally offset without interfering with each other, and thus the height dimension of the resin molding apparatus 100 can be suppressed. <3. Other Modified Embodiments> Furthermore, the present invention is not limited to the above-described embodiments. For example, in the structures of FIGS. 2 and 3, a base member may be additionally provided between the fixed platen 2 and the upper die 51 of the molding die 5a, between the intermediate plate 4 and the lower die 52 of the molding die 5a, between the intermediate plate 4 and the upper die 51 of the molding die 5b, or between the movable platen 3 and the lower die 52 of the molding die 5b. Moreover, in the above-described embodiment, the connecting member 822 extends outward from the front and rear of the side wall members 61 and 62, but as shown in FIGS. 21(a) to 21(c), it may be configured such that the connecting member 822 and the connecting member 821 are connected via through-holes 6H formed in the side wall members 61 and 62. Specifically, in the side wall members 61 and 62, through-holes 6H are formed in portions corresponding to the cross-linking rod portion 811. Here, the through-holes 6H are formed in such a manner as not to interfere with the movement of the connecting member 822 in consideration of the movement amount of the intermediate plate 4. The connecting member 822 is connected to the side panel 41 of the intermediate plate 4 and extends to the outside of the side wall members 61 and 62 via the through-holes 6H of the side wall members 61 and 62, and supports elastic members 823a and 823b (displacement absorbing mechanisms 83a and 83b) on the outside of the side wall members 61 and 62. By these elastic members 823a and 823b (displacement absorbing mechanisms 83a and 83b), the connecting member 822 is connected to the connecting member 821. Moreover, a guiding mechanism 84 is provided between the connecting member 821 and the linking member 822. Specifically, the guiding mechanism 84 includes a linear movement track 841 provided on one of the connecting member 821 or the linking member 822, and a linear movement block 842 provided on the other of the connecting member 821 or the linking member 822. The plurality of forming dies used in the first embodiment and the second embodiment may be the same forming dies as each other, or may be different forming dies from each other. Here, when the plurality of forming dies are different from each other, the upper dies may be different from each other, or the lower dies may be different from each other. In the above-described embodiment, the linear movement track 71 of the lifting and sliding mechanism 7 is provided on the side wall members 61 and 62, and the linear movement block 72 is provided on the side panel 41. However, the linear movement track 71 of the lifting and sliding mechanism 7 may be provided on the side panel 41, and the linear movement block 72 may be provided on the side wall members 61 and 62. In the above-described embodiment, the structure is such that the boom mechanism 81 is used to interlock the plurality of forming dies 5a and 5b. However, other types of lifting interlocking mechanisms 8 such as a lever mechanism (Japanese Patent Laid-Open No. 2019-77144) or a rack and pinion mechanism (Japanese Patent Laid-Open No. 2010-094931) may also be used. For example, as shown in FIG. 22(a), the lifting interlocking mechanism 8 using a lever mechanism has an arm 60 that rotates about a fulcrum 60a at one end, and the movable platen 3 and the intermediate plate 4 are connected to different positions of the arm 60 via a connecting member 70a and a connecting member 70b. And when the movable platen 3 is driven by the clamping mechanism 10, accordingly, the arm 60 rotates about the fulcrum 60a, and the intermediate plate 4 connected to the arm 60 moves up and down in联动 with the movable platen 3. Moreover, as shown in FIG. 22(b), the lifting interlocking mechanism 8 using a rack and pinion mechanism has a pair of racks 80a and 80b and a pinion 80c that meshes with the racks 80a and 80b. One of the racks 80a is provided on the side wall members 61 and 62, and the other rack 80b is provided on the side of the movable platen 3. And a pinion 80c that meshes with the pair of racks 80a and 80b is provided on the side of the intermediate plate 4. By rotating the pinion 80c forward or backward using a motor (not shown), the movable platen 3 and the intermediate plate 4 move up and down in联动. The forming die of the above-described embodiment has a plurality of sets of upper dies 51 and lower dies 52. However, it may also be a structure having one set of upper die 51 and lower die 52. In this case, the base member is the fixed platen 2 and the movable platen 3. And the upper die 51 slides relative to the fixed platen 2 in a sliding direction that intersects the clamping direction by the forming die sliding mechanism 20. Moreover, the lower die 52 slides relative to the movable platen 3 in a sliding direction that intersects the clamping direction by the forming die sliding mechanism 20. In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof. [Industrial Applicability] According to the present invention, in a resin molding apparatus in which a molding die slides in a sliding direction intersecting the mold clamping direction, wear generated due to the sliding of the molding die can be reduced. 2: Fixed platen (base member) 3: Movable platen (base member) 4: Intermediate plate (base member) 5a, 5b, 5c: Molding die 6H: Through-hole 7: Lifting and sliding mechanism 8: Lifting linkage mechanism 10: Clamping mechanism 11: Substrate receiving part 12: Substrate storage part 13: Substrate transfer mechanism (formed object transfer mechanism) 14: Handover mechanism 15: Moving platform 16: Resin material storage part 17: Resin material input mechanism 18: Resin material transfer mechanism 20: Molding die sliding mechanism 30: Spacing change mechanism 31: Fixing member 40: Fixed member 41, 41a, 41b, 41c: Side panel 50: Sealing structure 51: Upper mold 52: Lower mold 52C: Mold cavity 60: Arm 60a: Fulcrum 61, 62: Pair of side wall members 70a, 70b, 822: Connecting member 71, 202a, 841: Linear movement track 72, 202b, 842: Linear movement block 80a, 80b, 203a: Rack 80c, 203b: Pinion 81: Boom mechanism 81a: First connecting rod 81b: Second connecting rod 81c, 81f, 81g, 81j, 81k, 81l, 81m: Rotation axis 81d: Third connecting rod 81e: Fourth connecting rod 81h: Fifth connecting rod 81i: Sixth connecting rod 82: Connecting mechanism 83a, 83b: Displacement absorption mechanism 84: Guiding mechanism 100: Resin molding device 101: Base 131: Substrate supply part (formed object supply part) 132: Substrate picking part (formed object picking part) 181: Resin material supply part 182: Film recovery part 201: Support frame 201a: Upper mold support frame (support frame) 201b: Lower mold support frame (support frame) 202: Guiding part 203: Driving actuator 203c: Motor 204: Stopper part 205: Elastic body 206: Contact part 207: Positioning part 301: Cam mechanism 302: First cam part 302a: Inclined surface 302b: Flat surface 303: Second cam part 521: Bottom member 522: Side member 523: Bottom plate 524, 823a, 823b: Elastic member 811: Cross-linking part 812: Upper end connecting rod part 813: Lower end connecting rod part 821: Connecting member 822a: Upper protruding part 822b: Lower protruding part 831: Upper contact part 831a: Upper stopper 833a: Lower stopper 832: Upper support part 833: Lower contact part 834: Lower support part A: Substrate supply / storage module B: Resin molding module C: Resin material supply module COM: Control part F: Demolding film J: Resin material P: Resin molded product (formed object molded by resin) Q: Clamping position R: Protruding position S1: Resin molded product picking stepS2: Substrate supply step before forming S3: Film recycling step after use S4: Resin material supply step W: Object to be formed Wx: Electronic component X1: Transfer position X2: Transfer position FIG. 1 is a plan view schematically showing the structure of a resin molding apparatus according to a first embodiment of the present invention. FIG. 2 is a front view schematically showing the structure of the resin molding apparatus according to the first embodiment. FIG. 3 is a side view schematically showing the structure of the resin molding apparatus according to the first embodiment. FIG. 4 is a view schematically showing the structure of a molding die according to the first embodiment. FIG. 5 is an enlarged sectional view schematically showing the peripheral structure of a side wall member according to the first embodiment. FIG. 6 is an enlarged view schematically showing a boom mechanism according to the first embodiment. FIG. 7 is an enlarged sectional view schematically showing the peripheral structure of an elastic member according to the first embodiment. FIGS. 8(a) and (b) are sectional views schematically showing the operation of the elastic member according to the first embodiment. FIG. 9 is a side view mainly showing a molding die sliding mechanism and a spacing changing mechanism according to the first embodiment. FIG. 10(a) is a plan view mainly showing a molding die sliding mechanism of an upper die according to the first embodiment, and FIG. 10(b) is a plan view mainly showing a molding die sliding mechanism of a lower die according to the first embodiment. FIG. 11 is a side view showing a state where the upper die is moved to a protruding position in the first embodiment. FIG. 12 is a side view showing a state where the lower die is moved to a protruding position in the first embodiment. FIGS. 13(a) is a side view schematically showing the spacing change between the upper die and a base member in the first embodiment, and FIG. 13(b) is a side view schematically showing the spacing change between the lower die and the base member. FIG. 14 is a flowchart of a method for manufacturing a resin molded product in the first embodiment. FIG. 15 is a flowchart showing the operation of a substrate transfer mechanism and the sliding operation of the upper die in the first embodiment. FIGS. 16(a) to (e) are schematic views showing respective states of the operation of the substrate transfer mechanism and the sliding operation of the upper die in the first embodiment. FIGS. 17(a) and (b) are flowcharts showing the operation of a resin material transfer mechanism and the sliding operation of the lower die in the first embodiment. FIGS. 18(a) to (e) are schematic views showing respective states of the operation of the resin material transfer mechanism and the sliding operation of the lower die in the first embodiment. FIG. 19 is a front view schematically showing the structure of a resin molding apparatus according to a second embodiment. FIG. 20 is a side view schematically showing the structure of the resin molding apparatus according to the second embodiment. FIGS. 21(a) to (c) are a side view, a sectional view, and a front view schematically showing the peripheral structure of an elastic member according to a modified embodiment. FIGS. 22(a) and (b) are front views schematically showing the structure of a resin molding apparatus according to the modified embodiment. 2: Fixed platen (base member) 3: Movable platen (base member) 4: Intermediate plate (base member) 13: Substrate transfer mechanism (object to be formed transfer mechanism) 20: Forming die sliding mechanism 30: Spacing change mechanism 40: Fixed member 51: Upper die 52: Lower die 202a: Linear movement track 202b: Linear movement block 203a: Rack 203b: Pinion 131: Substrate supply section (object to be formed supply section) 132: Substrate pick-up section (object to be formed pick-up section) 201: Support frame 201a: Upper die support frame (support frame) 201b: Lower die support frame (support frame) 202: Guide section 203: Driving actuator 203c: Motor 204: Stopper section 205: Elastic body 206: Contact section 207: Positioning section 301: Cam mechanism 302: First cam section 303: Second cam section Q: Clamping position R: Protrusion position X1: Transfer position

Claims

1. A resin molding apparatus, comprising: The mold-locking mechanism locks the forming mold via the base component; A molding die sliding mechanism that allows the molding die to slide between a locked position and a protruding position located further outward than the base member in a sliding direction along a horizontal direction orthogonal to the locking direction; and a spacing changing mechanism that changes the spacing between the opposing surfaces of the base member and the molding die when the molding die is slid between the locked position and the protruding position in the sliding direction by means of the molding die sliding mechanism.

2. The resin molding apparatus of claim 1, wherein the molding die has an upper die and a lower die, the molding die sliding mechanism is provided corresponding to the upper die and the lower die respectively, and the interval changing mechanism is provided corresponding to the upper die and the lower die respectively.

3. The resin molding apparatus as claimed in claim 1 or 2, wherein the molding die sliding mechanism and the interval changing mechanism are configured using a common drive actuator.

4. The resin molding apparatus as claimed in claim 1 or 2, wherein the molding die sliding mechanism comprises: a support frame for supporting the molding die; and a drive actuator for moving the support frame along the sliding direction, the spacing changing mechanism having a cam mechanism disposed between the molding die and the base member, wherein, with the movement of the support frame by the drive actuator, the cam mechanism changes the spacing between the opposing surfaces of the molding die and the base member.

5. The resin molding apparatus as claimed in claim 1 or 2, wherein the spacing change mechanism causes the opposing surfaces of the molding die and the base member to be separated by a gap at the mold-locking position, and the mold-locking mechanism performs mold locking, wherein the opposing surfaces of the molding die and the base member are in contact with each other.

6. The resin molding apparatus as claimed in claim 1 or 2, wherein the molding die sliding mechanism has a positioning part that contacts the molding die moving toward the locking position to position the molding die at the locking position.

7. The resin molding apparatus as claimed in claim 1 or 2, wherein the base member has: a fixed platform; a movable platform capable of being raised and lowered by the mold-locking mechanism; and an intermediate plate disposed between the fixed platform and the movable platform, the molding die having an upper mold and a lower mold respectively disposed between the fixed platform and the intermediate plate and between the intermediate plate and the movable platform, the resin molding apparatus further comprising: A pair of sidewall members are disposed on the sides of the movable platform and the intermediate plate; A lifting and sliding mechanism that allows the middle plate to slide in the vertical direction relative to the pair of side wall members; and a lifting linkage mechanism that links the lifting of the middle plate to the lifting of the movable platform, the lifting linkage mechanism having: a boom mechanism, one end of which is fixed relative to the side wall members, and the other end of which moves together with the movable platform and extends and retracts by the lifting of the movable platform; And a connecting mechanism that connects the cross link portion of the boom mechanism and the intermediate plate.

8. The resin molding apparatus as claimed in claim 1 or 2, further comprising: The conveying mechanism conveys the object to be conveyed by the forming mold located at the protruding position.

9. The resin molding apparatus of claim 8, wherein the conveying mechanism comprises: a molding object conveying mechanism for conveying the molding die located at the protruding position; and a resin material conveying mechanism for conveying resin material to the molding die located at the protruding position.

10. The resin molding apparatus of claim 9, wherein the object conveying mechanism comprises: an object supply unit for supplying the object to the molding die located at the protruding position; and an object receiving unit for receiving the resin-molded object from the molding die located at the protruding position.

11. The resin molding apparatus of claim 9, wherein the resin material conveying mechanism comprises: a resin material supply unit for supplying the resin material to the molding die located at the protruding position; and a film recycling unit for recycling the used demolding film from the molding die located at the protruding position.

12. A method for manufacturing a resin molded article, comprising using a resin molding apparatus as described in any one of claims 1 to 11 to manufacture the resin molded article, the method comprising: The conveying step involves conveying the shaped object to the forming mold located at the protruding position; In the resin molding step, the molding die located at the mold-locking position is locked to perform resin molding on the object to be molded. And the removal step, in which the resin-molded object is removed from the molding die located at the protruding position.

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