Composition for heat transfer fluid, device for heat transfer, and heat transfer method

Abstract

The present invention provides a composition for a heat transfer fluid comprising: a hexafluoropropylene trimer as shown in C9F18, and (i) CmF2m and / or CnF(2n-2) [where m is an integer of 4 to 12 and other than 9, and n is an integer of 4 to 12], (ii) water (wherein the water content is 0.0001 to 0.1 parts by mass relative to 100 parts by mass of the hexafluoropropylene trimer as shown in C9F18), and / or (iii) fluoride ions (wherein the fluoride ion content is 0.0000001 to 5 parts by mass relative to 100 parts by mass of the hexafluoropropylene trimer as shown in C9F18).

Description

Technical Field

[0001] The present disclosure relates to a composition for a heat transfer fluid, a heat transfer device, and a heat transfer method. Prior Art

[0002] The trimer of hexafluoropropene (HFP) is known to be used as a composition for a heat transfer fluid (Patent Document 1).

[0003] The trimer of HFP has a small global warming potential (GWP) and low toxicity, and thus has attracted attention as a substitute for chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs). [Prior Art Documents] [Patent Documents]

[0004] Patent Document 1: International Publication No. 2018 / 172919 Summary of the Invention Problems to be Solved by the Invention

[0005] In view of the above circumstances, an object of the present disclosure is to provide a composition for a heat transfer fluid of a novel mixture. Means for Solving the Problems

[0006] The inventors of the present invention have conducted intensive studies to solve the above problems, and as a result, have found that by coexisting a specific fluorocarbon with an HFP trimer, a specific amount of water, and / or a specific amount of fluoride ions, a composition for a heat transfer fluid of a novel mixture can be provided.

[0007] That is, the present disclosure includes the following aspects. [Item 1] A composition for a heat transfer fluid, comprising a hexafluoropropene trimer represented by C9F18, (i) CmF2m and / or CnF(2n-2) [wherein, m is an integer of 4 or more and 12 or less and other than 9, and n is an integer of 4 or more and 12 or less], (ii) water (wherein, with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C9F18, the content of the water is 0.0001 to 0.1 parts by mass), and / or (iii) fluoride ions (wherein, with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C9F18, the content of the fluoride ions is 0.0000001 to 5 parts by mass). [Item 2] The composition for a heat transfer fluid as described in Item 1, wherein the hexafluoropropylene trimer contains at least one compound selected from the group consisting of the compounds represented by the following formulas (I) to (III). [Item 3] The composition for a heat transfer fluid as described in Item 2, wherein the compound represented by the formula (I) is 85% by mass or more based on the total amount of the hexafluoropropylene trimer. [Item 4] The composition for a heat transfer fluid as described in Item 2, wherein the compound represented by the formula (I) is less than 85% by mass based on the total amount of the hexafluoropropylene trimer. [Item 5] The composition for a heat transfer fluid as described in Item 2, wherein the compound represented by the formula (I) is 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropylene trimer. [Item 6] The composition for a heat transfer fluid as described in Item 1, which contains a hexafluoropropylene trimer represented by C9F18, and (i) CmF2m and / or CnF(2n-2) [wherein, m is an integer of 4 or more and 12 or less and other than 9, and n is an integer of 4 or more and 12 or less]. [Item 7] The composition for a heat transfer fluid as described in Item 1, wherein m is an integer of 6 or more and 11 or less and other than 9, and n is an integer of 6 or more and 11 or less. [Item 8] The composition for a heat transfer fluid as described in Item 1, wherein, based on 100 parts by mass of the total amount of the hexafluoropropylene trimer represented by C9F18, the content of CmF2m and / or CnF(2n-2) is 0.0001 to 10 parts by mass. [Item 9] The composition for a heat transfer fluid as described in Item 1, which contains a hexafluoropropylene trimer represented by C9F18, and (ii) water. [Item 10] The composition for a heat transfer fluid as described in Item 1, which contains a hexafluoropropylene trimer represented by C9F18, and (iii) fluoride ions. [Item 11] The composition for a heat transfer fluid according to Item 1 further contains a hexafluoropropylene tetramer represented by C12F24, and the content of the hexafluoropropylene trimer is 80% by mass or more based on the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer. [Item 12] The composition for a heat transfer fluid according to Item 11, wherein the content of the hexafluoropropylene trimer is 90% by mass or more and 99.99% by mass or less based on the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer. [Item 13] The composition for a heat transfer fluid according to Item 11, wherein the hexafluoropropylene tetramer contains 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene. [Item 14] The composition for a heat transfer fluid according to Item 1 further contains a conductive substance, and the content of the conductive substance is 100 mass ppm or less. [Item 15] The composition for a heat transfer fluid according to Item 1 further contains a conductive substance, and the content of insoluble matter of 5 μm or more is 10 pieces / mL or less. [Item 16] A heat transfer fluid contains the composition for a heat transfer fluid according to Item 1 or 2. [Item 17] A use of the composition for a heat transfer fluid according to Item 1 or 2 as a heat transfer fluid. [Item 18] A heat transfer device includes a device and a mechanism that contains the composition for a heat transfer fluid according to Item 1 or 2 and is used to transfer heat to or from the device. [Item 19] A heat transfer method includes the steps of preparing a device and using the composition for a heat transfer fluid according to Item 1 or 2 to transfer heat to or from the device. Advantages of the Invention

[0008] The composition disclosed above can provide a composition for a heat transfer fluid as a novel mixture. Embodiments

[0009] In this specification, "comprising" includes the concepts of "comprise", "consist essentially of", and "consist of". Also, in this specification, when a numerical range is expressed as "A to B", it means A or more and B or less.

[0010] (1. Composition for heat transfer fluid) The composition for heat transfer fluid of the present disclosure contains (i) CmF2m and / or CnF(2n - 2) [wherein, m is an integer of 4 or more and 12 or less and other than 9, and n is an integer of 4 or more and 12 or less], (ii) water (wherein, relative to 100 parts by mass of the total amount of the hexafluoropropylene trimer represented by C9F18, the content of the water is 0.0001 to 0.1 parts by mass), and / or (iii) fluoride ions (wherein, relative to 100 parts by mass of the total amount of the hexafluoropropylene trimer represented by C9F18, the content of the fluoride ions is 0.0000001 to 5 parts by mass).

[0011] The hexafluoropropylene trimer can be a conventional one represented by C9F18, and there is no particular limitation.

[0012] Specific examples of the hexafluoropropylene trimer include a trimer containing at least one selected from the group consisting of the compounds represented by the following formulas (I) to (III).

[0013]

[0014] In this specification, when the compound represented by the above formula (I) is not particularly specified, it includes both the E-form and the Z-form of non-mirror isomers.

[0015] The hexafluoropropylene trimer contained in the composition for heat transfer fluid of the present disclosure may contain only one of the compounds represented by the above formulas (I) to (III), or may be a mixture containing two or three of them.

[0016] In the total amount of the HFP trimers (i.e., the total of the compounds represented by formulas (I), (II), and (III)), the blending ratio of the compound represented by the above formula (I) is preferably 1% by mass or more, more preferably 10% by mass or more, still more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more. Also, relative to the total amount of the HFP trimers, the compound represented by formula (I) can be 85% by mass or more. At this time, the viscosity of the HFP trimer mixture becomes lower. Further, relative to the total amount of the HFP trimers, the compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less (or less than), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less. The blending ratio of the compound represented by the above formula (I) relative to the total amount of the HFP trimers can be, for example, 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, preferably 30% by mass or more and 90% by mass or less, more preferably 40% by mass or more and less than 85% by mass, still more preferably 40% by mass or more and 80% by mass or less, even more preferably 45% by mass or more and 70% by mass or less, and particularly preferably 50% by mass or more and 60% by mass or less.

[0017] Similarly, relative to the total amount of the HFP trimers, the blending ratio of the compound represented by formula (II) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more. Also, relative to the total amount of the HFP trimers, the compound represented by formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, still more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0018] Similarly, relative to the total amount of the HFP trimers, the blending ratio of each of the compounds represented by formula (III) is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more. Also, in 100% by mass of the total amount of the HFP trimers, the compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, still more preferably 30% by mass or less, and particularly preferably 20% by mass or less.

[0019] In the composition for a heat transfer fluid of the present disclosure, the mass ratio of the compound represented by formula (II) and the compound represented by formula (III) is not particularly limited, and for example, it may be from 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0020] The compounds represented by the above formulas (I) to (III) can be produced by conventional methods. For example, they can be obtained by the method described in the specification of International Publication No. 2018 / 172919, but of course, it is not limited thereto. Also, they can be obtained by trimerizing HFP as a raw material, but it is not limited thereto, and conventional methods can be adopted.

[0021] The composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropylene trimer other than the compounds represented by formulas (I) to (III).

[0022] The composition for a heat transfer fluid of the present disclosure may also contain a hexafluoropropylene dimer.

[0023] The hexafluoropropylene dimer may contain (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-hexafluoro-2-(trifluoromethyl)-2-pentene.

[0024] In one aspect, the composition for a heat transfer fluid of the present disclosure may also contain a hexafluoropropylene tetramer.

[0025] The hexafluoropropylene tetramer may contain 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0026] In the composition for a heat transfer fluid of the present disclosure, relative to the total of the hexafluoropropylene trimer and the hexafluoropropylene tetramer, the content of the hexafluoropropylene trimer is 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, and for example, it may be 95% by mass or more, 98% by mass or more, 99% by mass or more, 99.9% by mass or more.

[0027] In the composition for a heat transfer fluid of the present disclosure, the content of hexafluoropropylene trimer is preferably 99.999% by mass or less, more preferably 99.99% by mass or less, and may be, for example, 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less, relative to the total of hexafluoropropylene trimer and hexafluoropropylene tetramer.

[0028] In the composition for a heat transfer fluid of the present disclosure, the content of hexafluoropropylene trimer is preferably 80% by mass or more and 99.999% by mass or less, more preferably 85% by mass or more and 99.99% by mass or less, and may be, for example, 90% by mass or more and 99.99% by mass or less, 95% by mass or more and 99.99% by mass or less, or 99% by mass or more and 99.9% by mass or less, relative to the total of hexafluoropropylene trimer and hexafluoropropylene tetramer.

[0029] In the composition for a heat transfer fluid, the total amount of hexafluoropropylene trimer and hexafluoropropylene tetramer is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and even more preferably 95% by mass or more, and may be, for example, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more. In the composition for a heat transfer fluid, the total amount of hexafluoropropylene trimer and hexafluoropropylene tetramer may be substantially 100% by mass. In other words, the composition for a heat transfer fluid of the present disclosure may be a mixture of hexafluoropropylene trimer and hexafluoropropylene tetramer.

[0030] (1-1.CmF2m and / or CnF(2n-2)) In one aspect, the composition for a heat transfer fluid of the present disclosure may contain a hexafluoropropylene (HFP) trimer represented by C9F18, and CmF2m and / or CnF(2n-2) [wherein, m is an integer of 4 or more and 12 or less and other than 9, and n is an integer of 4 or more and 12 or less].

[0031] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Further, m is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9. Further, m is particularly preferably 8.

[0032] n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Further, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Further, n is particularly preferably 9.

[0033] CmF2m can be a chain compound or a cyclic compound with a substituted structure. The chain compound can be a so-called olefin and can be a straight chain or a branched chain.

[0034] CnF(2n - 2) can be a chain compound or a cyclic compound with a substituted structure. The chain compound can be a so-called diene or an alkyne and can be a straight chain or a branched chain.

[0035] The present disclosure unexpectedly found that a composition in which CmF2m and / or CnF(2n - 2) coexists with an HFP trimer can function as a heat transfer fluid, and the present disclosure is based on this finding. Further, the composition for a heat transfer fluid of the present disclosure can improve the stability of the HFP trimer by containing CmF2m and / or CnF(2n - 2).

[0036] Further, relative to the whole composition for a heat transfer fluid of the present disclosure, the content of CmF2m and / or CnF(2n - 2) is preferably 0.0001% by mass or more.

[0037] On the other hand, relative to the whole composition for a heat transfer fluid of the present disclosure, the content of CmF2m and / or CnF(2n - 2) is preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 1% by mass or less.

[0038] In one aspect, in the composition for a heat transfer fluid, relative to 100 parts by mass in total of the HFP trimer, the content of CmF2m and / or CnF(2n - 2) is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and still more preferably 0.1 part by mass or more.

[0039] On the other hand, in the composition for a heat transfer fluid, relative to 100 parts by mass in total of the HFP trimer, the content of CmF2m and / or CnF(2n - 2) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and still more preferably 1 part by mass or less.

[0040] In addition, when a plurality of types of CmF2m and / or CnF(2n - 2) are contained, the above content is the total amount thereof.

[0041] By setting the content of CmF2m and / or CnF(2n - 2) within the above range, decomposition of the HFP trimer represented by C9F18 can be suppressed, and further increase in fluoride ions and increase in acidity can be suppressed.

[0042] (1-2. Water) In one aspect, the composition for a heat transfer fluid of the present disclosure may contain water. In the composition for a heat transfer fluid, the content of water may be 1 mass ppm or more, preferably 5 mass ppm or more. By setting the content of water to a certain level or more, for example, 1 mass ppm or more, the electrification of the composition caused by the decrease in the stability of the composition for a heat transfer fluid can be suppressed. Further, in the composition for a heat transfer fluid, the content of water is 1000 mass ppm or less, preferably 500 mass ppm or less, more preferably 100 mass ppm or less, and even more preferably 20 mass ppm or less. By setting the content of water to a certain level or less, for example, 1000 mass ppm or less, the decomposition of the HFP trimer represented by C9F18 during heating can be suppressed, and further, the excessive increase in fluoride ions and the increase in acidity can be suppressed.

[0043] In one aspect, relative to a total of 100 parts by mass of the compounds represented by C9F18, the content of water is preferably 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and even more preferably 0.001 part by mass or more.

[0044] On the other hand, relative to a total of 100 parts by mass of the compounds represented by C9F18, the content of water is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less.

[0045] The composition for a heat transfer fluid of the present disclosure improves the dielectric strength by containing a specific amount of water. The dielectric strength of the composition for a heat transfer fluid of the present disclosure is preferably 40 kV or more, more preferably 50 kV or more, and even more preferably 60 kV or more.

[0046] (1-3. Fluoride ions) In one aspect, in the composition for a heat transfer fluid of the present disclosure, fluoride ions may be contained in an amount of 0.0000001 mass% or more relative to the whole composition. Relative to the whole composition, the amount of fluoride ions is preferably 0.000001 mass% or more, more preferably 0.0001 mass% or more, and even more preferably 0.001 mass% or more. By setting the fluoride ion concentration to 0.0000001 mass% or more, the stability of the composition for a heat transfer fluid can be maintained, and the electrification of the composition can be suppressed.

[0047] Further, the amount of fluoride ions contained in the composition for a heat transfer fluid of the present disclosure is 5% by mass or less, preferably 1% by mass or less, more preferably 0.1% by mass or less, relative to the whole composition. By setting the fluoride ions to 5% by mass or less, decomposition of the compound represented by C9F18 can be suppressed even during heating.

[0048] In one aspect, relative to 100 parts by mass in total of the compounds represented by C9F18, the amount of fluoride ions is preferably 0.0000001 part by mass or more, more preferably 0.000001 part by mass or more, still more preferably 0.0001 part by mass or more, and particularly preferably 0.001 part by mass or more.

[0049] On the other hand, relative to 100 parts by mass in total of the compounds represented by C9F18, the water content is preferably 5 parts by mass or less, more preferably 1 part by mass or less, still more preferably 0.1 part by mass or less.

[0050] The amount of fluoride ions can be measured, for example, by adding a 1-fold amount (by weight) of distilled water to the sample, shaking and mixing for about 20 seconds to extract the F ions into the aqueous layer. Then, 2.5 to 3.0 mL of the aqueous layer is taken out with a dropper, and the liquid mixed with twice the amount of a TISAB solution (total ion strength adjustment buffer solution) is used as a sample, and the fluoride ions are measured.

[0051] As the fluoride ion source, known fluoride ion sources can be used without particular limitation. Specific examples include ions of hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride. These can contain only one kind or a plurality of kinds. Preferably, the fluoride ion source is hydrogen fluoride.

[0052] (1-4. Other components) The composition for a heat transfer fluid of the present disclosure may contain perfluorotripropylamine in addition to hexafluoropropylene trimer. The composition for a heat transfer fluid containing hexafluoropropylene trimer and perfluorotripropylamine can be an azeotropic-like liquid. Since the composition for a heat transfer fluid is an azeotropic-like liquid, even when the composition for a heat transfer fluid vaporizes, the change in composition is small and it is easier to operate.

[0053] Here, the azeotropic-like liquid means a liquid in which the difference in the mole fraction of each component contained in the azeotropic-like liquid in the gas phase and the liquid phase is within 10%.

[0054] Perfluorotripropylamine is also known as tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and is represented by the general formula: N(CF2CF2CF3)a(CF(CF3)CF3)3-a (where a is an integer from 0 to 3). Perfluorotripropylamine may contain only one of the compounds represented by the above general formula, or may contain plural kinds. Preferably, it is N(CF2CF2CF3)3, but may contain N(CF2CF2CF3)a(CF(CF3)CF3)3-a (where a is an integer from 0 to 2) as an impurity. Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M Company) (FC-3283), etc.

[0055] The composition for a heat transfer fluid of the present disclosure may further contain perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, perfluorotributylamine, etc.

[0056] The perfluoropolyether is preferably one represented by the general formula: RO-Rf1-R'. In the formula, R and R' are the same or different and are a monovalent group represented by -CmF2m+1, where m is an integer from 1 to 8, and Rf1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are as follows: (i) -CFXO- (where X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O-; or, Rf1 is (vi) a divalent group represented by -(CF2)n-CFY-O- (where n is an integer from 0 to 3, Y is a monovalent group represented by the general formula -ORf2Z, here, Rf2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2R'CF2O-, here, each X is the same or different and is F or CF3, and Z is a monovalent C1-5 perfluoroalkyl group).

[0057] Specific examples of the perfluoropolyether include the product names GALDEN (registered trademark) "HT135", GALDEN (registered trademark) "HT110" (both manufactured by Solvay Company), etc.

[0058] The mixture of methoxytridecafluoroheptene isomers specifically contains methyl perfluoroheptyl ether (MPHE) (C7F13OCH3). Specific examples include the product name "Opteon SF10" (manufactured by Chemours Company), etc.

[0059] When the composition for a heat transfer fluid of the present disclosure contains perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, these are similar in properties to the compound represented by C9F18 as a heat transfer fluid. Therefore, regardless of the content ratio thereof, the properties of the composition for a heat transfer fluid as a whole are basically unchanged as a heat transfer fluid. Accordingly, relative to the whole composition for a heat transfer fluid, the composition for a heat transfer fluid of the present disclosure preferably contains 40% by mass to 99.9% by mass of the compound represented by C9F18 at this time, more preferably 60% by mass to 99.9% by mass, and still more preferably 80% by mass to 99.9% by mass.

[0060] (1 - 5. Impurities)

[0061] The composition for a heat transfer fluid of the present disclosure may contain a conductive substance. The content of the conductive substance is 100 mass ppm or less, preferably 75 mass ppm or less, more preferably 50 mass ppm or less, and still more preferably 10 mass ppm or less. In addition, since a conductive substance, especially a metal or metal ion, may intrude from the gap of the device and cause a short circuit in the circuit, the content of the conductive substance in the present disclosure may be considered in view of "at least one of a metal and a metal ion" as required.

[0062] In other aspects, in the composition for a heat transfer fluid of the present disclosure, the content of insoluble matter of 5 μm or more (regardless of conductivity, also including solid components such as resin flakes of the container, dust and dirt mixed in from the air, etc.) is preferably 10 pieces / mL or less, more preferably 5 pieces / mL or less, and still more preferably 3 pieces / mL or less.

[0063] (1 - 6. Method for manufacturing a composition for a heat transfer fluid with reduced impurities) The present disclosure provides a method for manufacturing a composition for a heat transfer fluid with reduced impurities. The method for manufacturing the composition for a heat transfer fluid of the present disclosure includes a step of subjecting a composition containing a heat transfer fluid compound and a conductive substance to a refining treatment to obtain a composition for a heat transfer fluid with the aforementioned conductive substance reduced from the aforementioned composition. (1) The aforementioned heat transfer fluid compound contains at least one selected from the group consisting of the compound represented by C9F18, perfluoroolefin ether, and perfluoropolyether. (2) The above-mentioned purification treatment is a treatment using at least one selected from the group consisting of a filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption. In addition, in the present disclosure, "reduction" in purification means reducing the content ratio of the conductive substance in the aforementioned composition.

[0064] According to the research of the present inventors, the so-called heat transfer fluid conventionally contains conductive substances (such as metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances are not only inevitably mixed during the manufacturing process of the heat transfer fluid, but also include those mixed afterwards during use after manufacturing. When using such a heat transfer fluid for the purpose of transferring heat to or from a device, there is a possibility of causing a short circuit in the circuit due to the intrusion of the conductive substance from the gap of the device. Also, when the heat transfer fluid is reused, there is a possibility of causing blockage of the piping for the circulating heat transfer fluid. From the perspective of the conventional heat transfer fluid containing conductive substances, it can also be described as "a composition containing a heat transfer fluid and a conductive substance". The manufacturing method of the heat transfer fluid composition of the present disclosure is to subject a composition containing a heat transfer fluid and a conductive substance (hereinafter referred to as "pre-purification composition") to a specific purification treatment to obtain a heat transfer fluid composition with a reduced conductive substance.

[0065] (1-6-1) A composition containing a heat transfer fluid compound and a conductive substance (pre-purification composition) The pre-purification composition may contain a heat transfer fluid compound and a conductive substance. Here, the heat transfer fluid compound contains at least one selected from the group consisting of a compound represented by C9F18, a perfluoroolefin ether, and a perfluoropolyether.

[0066] (1-6-2) A compound represented by C9F18 The compound represented by C9F18 is the hexafluoropropylene trimer described above.

[0067] (1-6-3) Perfluoroolefin ether Preferably, the perfluoroolefin ether can widely adopt a conventional one represented by the following formula (V). C7F13OR (V) [However, R is Me or Et]

[0068] Examples of the perfluoroolefin ether represented by the above formula (V) include, for example, at least one unsaturated fluoroether selected from the group consisting of CF3(CF2)xCF═CFCF(OR)(CF2)yCF3, CF3(CF2)xC(OR)═CFCF2(CF2)yCF3, CF3CF═CFCF(OR)(CF2)x(CF2)yCF3, and CF3(CF2)xCF═C(OR)CF2(CF2)yCF3, [wherein, R is Me or Et, x and y are independently 0, 1, 2, or 3, and x + y = 1, 2, or 3].

[0069] Specific examples of the perfluoroolefin ether represented by the above formula (V) include: 5-methoxyperfluoro-3-heptene, 3-methoxyperfluoro-3-heptene, 4-methoxyperfluoro-2-heptene, 3-methoxyperfluoro-2-heptene, 4-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-2-pentene, 3-methoxyperfluoro-2-pentene, 2-methoxyperfluoro-3-pentene, cis- and trans-2-methoxyperfluoro-2-octene, 2-methoxyperfluoro-3-octene, and the like.

[0070] A preferred structure of the perfluoroolefin ether represented by the above formula (V) is methyl perfluoroheptene ether. The methyl perfluoroheptene ether may contain a mixture of two or more structures and / or stereoisomers. Specific examples of the methyl perfluoroheptene ether include a mixture of about 48 to about 52% by mass of 5-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 3-methoxyperfluoro-3-heptene, about 18 to about 22% by mass of 4-methoxyperfluoro-2-heptene, and about 6 to about 10% by mass of 4-methoxyperfluoro-3-heptene.

[0071] The perfluoroolefin ether specifically contains methyl perfluoroheptene ether (MPHE) (C7F13OCH3). Specific examples include the product name "Opteon SF10" (manufactured by Chemours Company), etc.

[0072] (1-6-4) Perfluoropolyether The perfluoropolyether (PFPE) is preferably the one represented by the following formula (IV), RO-Rf1-R’ (IV) In the formula, R and R’ are the same or different and are a monovalent group represented by -CmF2m+1, where m is an integer from 1 to 8, and Rf1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are as follows, (i) -CFXO- (wherein, X is F or CF3); (ii) -CF2CFXO- (where X is F or CF3); (iii) -CFXCF2O- (where X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O-; or, Rf1 is (vi) a divalent group represented by (CF2)n - CFY - O - (where n is an integer from 0 to 3, Y is a monovalent group represented by the general formula -ORf2Z, herein, Rf2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, herein, each X is the same or different and is F or CF3, and Z is a monovalent C1-5 perfluoroalkyl group). Herein, the PFPE represented by the above formula (IV) can be a conventional one.

[0073] A preferred structure of the PFPE represented by the above formula (IV) is that m is an integer from 1 to 3, and Rf is selected from the following: (1) (CF2O)a - (CF2CF2O)b - (CF2 - (CF2)z’ - CF2O)c (where a, b, and c are integers of 100 or less; z’ is an integer of 1 or 2, a 0, b 0, c 0, a + b > 0; under this condition, particularly preferably, a, b, and c are integers of 50 or less, a and b are each > 0, and b / a is between 0.1 and 10); (2) (C3F6O)c’ - (C2F4O)b - (CFXO)t - (where X is independently selected from -F and -CF3 each time it appears; b, c’, and t are integers of 100 or less, c’ > 0, b 0, t 0; under this condition, particularly preferably, b and t > 0, c’ / b is between 0.2 and 5.0, and (c’ + b) / t is between 5 and 50); or (3) (C3F6O)c’ - (CFXO)t - (where X is independently selected from -F and -CF3 each time it appears; c’ and t are integers of 100 or less, c’ > 0, t 0; under this condition, particularly preferably, t > 0, and c’ / t is between 5 and 50).

[0074] Specific examples of perfluoropolyethers include the product names GALDEN (registered trademark) "HT135", GALDEN (registered trademark) "HT110" (both manufactured by Solvay), etc.

[0075] (1-6-5) Heat transfer fluid compounds that can be additionally contained The heat transfer fluid in the present disclosure may also contain additional heat transfer fluid compounds (also referred to as "additional components") different from the aforementioned three components (at least one selected from the group consisting of the compound represented by C9F18, perfluoroolefin ethers, and perfluoropolyethers, collectively referred to as "the three components of the present disclosure"). The additional components can be one or more. Examples of the additional components include: hexafluoropropylene dimer, hexafluoropropylene tetramer, perfluorotripropylamine, perfluorotributylamine, etc.

[0076] The hexafluoropropylene dimer may contain: (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0077] The hexafluoropropylene tetramer may contain: 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0078] Perfluorotripropylamine is also known as tris(heptafluoropropyl)amine, or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and is represented by the general formula: N(CF2CF2CF3)n(CF(CF3)CF3)3-n (n is an integer from 0 to 3). Perfluorotripropylamine may contain only one of the compounds represented by the above general formula, or may contain a plurality of them. Preferably, it is N(CF2CF2CF3)3, but it may contain N(CF2CF2CF3)n(CF(CF3)CF3)3-n (n is an integer from 0 to 2) as impurities. Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283), etc.

[0079] When the composition for a heat transfer fluid in the present disclosure contains the three components of the present disclosure and additional components, with respect to the entire heat transfer fluid, the three components of the present disclosure are preferably contained in an amount of 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and most preferably 95% by mass or more. In the manufacturing method of the present disclosure, since the characteristics of the kinematic viscosity, freezing point, and boiling point of the composition (pre-refined composition) containing the heat transfer fluid compound and the conductive substance are related to a specific refining treatment (treatment using at least one selected from the group consisting of a filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugal separation, and electrostatic adsorption), it will affect the efficiency of removing the conductive substance from the pre-refined composition. Therefore, the heat transfer fluid compound is preferably in a form consisting essentially of only the three components of the present disclosure. When additional components are contained, as described above, with respect to the entire heat transfer fluid, the three components of the present disclosure are preferably contained in an amount of 80% by mass or more.

[0080] In both cases, namely the case of containing additional components in addition to the three components of the present disclosure and the case of not containing them, for example, the composition (pre-refined composition) containing the heat transfer fluid compound and the conductive substance can be the synthetic products or commercially available products of the three components of the present disclosure respectively as described above, and / or those in which conductive substances are subsequently mixed by using these as heat transfer fluids for a certain period of time.

[0081] (1-6-6) Conductive Substance Examples of the conductive substance include at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When the heat transfer fluid containing the conductive substance is used for the purpose of transferring heat to or from a device, there is a possibility of causing a short circuit in the circuit due to the intrusion of the conductive substance from the gap of the device. Also, when the heat transfer fluid is reused, there is a possibility of causing blockage of the piping for the circulating heat transfer fluid. Therefore, it is important to reduce the content of these conductive substances in order to improve the performance of the heat transfer fluid. The shape and size of the conductive substance vary depending on the type of the conductive substance, and generally range from about 0.001 to 10 μm.

[0082] Examples of the metal species in the metals, metal ions, metal oxides, and metal nitrides as the conductive substance include Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, Zn, etc.

[0083] The metal as the conductive substance may be a single element or an alloy. The metal as the conductive substance is typically contained in the form of fine particles.

[0084] The ions as the conductive substance include all ionic forms that each metal species can take. The ions as the conductive substance can exist in a dissolved state as ions with any valence, or exist in the form of ions in a substance, for example, in a coordinated form.

[0085] The metal oxide as the conductive substance can be an oxide of one metal species or an oxide of plural metal species (i.e., a composite oxide).

[0086] The metal nitride as the conductive substance can be a nitride of one metal species or a nitride of plural metal species (i.e., a composite nitride).

[0087] Examples of the carbon as the conductive substance include carbon black.

[0088] Examples of the conductive polymer as the conductive substance include polyacetylene and polythiophene.

[0089] The content of the conductive substance contained in the composition before purification is not limited. For example, as long as it is 150 mass ppm or more (further 500 mass ppm or more), the content of the conductive substance can be effectively reduced in the manufacturing method of the present disclosure. Also, the content of the conductive substance can be measured using an inductively coupled plasma mass spectrometry device (ICP-MS) in the manner described in the examples.

[0090] Also, the composition before purification may contain insoluble substances. The insoluble substances include solid components such as resin flakes of the container, dust and ash mixed in from the air, regardless of whether they are conductive or not. However, for example, if the content of insoluble substances of 5 μm or more is 50 pieces / mL or more (further 100 pieces / mL or more), the content of the insoluble substances can be effectively reduced simultaneously in the purification treatment of the present disclosure for reducing the content of the conductive substance. Also, the number of insoluble substances (fine particles) of the conductive substance contained in the composition can be measured using a liquid particle counter in the manner described in the examples.

[0091] (1-6-7) Physical properties of the composition before purification The pre-refined composition is a composition containing a heat transfer fluid and a conductive substance. In the manufacturing method of the present disclosure, it is supplied to a refining treatment using at least one selected from the group consisting of a filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugal separation, and electrostatic adsorption.

[0092] When the content of the conductive substance in the pre-refined composition is reduced by the above-mentioned refining treatment, from the viewpoint of refining efficiency, it is preferably that the pre-refined composition has a low kinematic viscosity, a low freezing point, and a high boiling point. By using the above three components of the present disclosure as the main components of the heat transfer fluid (preferably 80% by mass or more), the pre-refined composition can easily have the physical properties of low kinematic viscosity, low freezing point, and high boiling point.

[0093] The kinematic viscosity of the pre-refined composition at -40°C is preferably 15 cSt or less, more preferably 10 cSt or less, and still more preferably 7 cSt or less. A relatively low kinematic viscosity of 15 cSt or less can improve the filterability, so the efficiency of the refining treatment using a filter, a metal ion removal filter, etc. can be particularly improved. In addition, the method for measuring the kinematic viscosity at -40°C in the present disclosure is based on the method described in the examples.

[0094] The freezing point of the pre-refined composition is preferably -35°C or less, more preferably -50°C or less, still more preferably -70°C or less, and most preferably -100°C or less. A relatively low freezing point of -35°C or less enables a refining treatment at a low temperature, so the loss of the heat transfer fluid caused by evaporation, etc. can be reduced, and the efficiency of the refining treatment can be improved. In addition, the method for measuring the freezing point in the present disclosure is based on the method described in the examples.

[0095] The boiling point of the pre-refined composition is preferably 90°C or more, more preferably 95°C or more, and still more preferably 105°C or more. Due to the relatively high boiling point of 90°C or more, for the same reason as the relatively low freezing point, the loss of the heat transfer fluid caused by evaporation, etc. can be reduced, and the efficiency of the refining treatment can be improved. In addition, the method for measuring the boiling point in the present disclosure is based on the method described in the examples.

[0096] (1-6-8) Refining treatment of the pre-refined composition In the manufacturing method of the present disclosure, the pre-refined composition is supplied to a refining treatment using at least one selected from the group consisting of a filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugal separation, and electrostatic adsorption.

[0097] These purification means can be applied according to ordinary methods, but in the manufacturing method of the present disclosure, purification treatment using a filter is particularly preferred. When using a filter, the upper and lower limits of the filter pore size are not limited. For example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. Also, for example, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0098] The above ion exchange resin can be either a cation exchange resin or an anion exchange resin. As the anion exchange resin, for example, an ion exchange resin having an amino group and / or a quaternary ammonium group as a functional group can be used. The ion exchange resin is preferably a strongly basic anion exchange resin. The basicity of the anion exchange resin can be variously set according to the type of the polymer backbone and / or the functional group. Commercially available products can be used as the anion exchange resin. For example, "DIAION (registered trademark) SA" series manufactured by Mitsubishi Chemical Corporation, "A200" manufactured by Purolite Company, "Amberlite (registered trademark)" series manufactured by ORGANO CORPORATION, etc. can be used. As the cation exchange resin, for example, an ion exchange resin having a carboxyl group and / or a sulfonic acid group as a functional group can be used. The acidity of the cation exchange resin can be variously set according to the type of the polymer backbone and / or the functional group. Commercially available products can be used as the cation exchange resin. For example, "DIAION (registered trademark) SK" series manufactured by Mitsubishi Chemical Corporation, "C100" manufactured by Purolite Company, "Amberlite (registered trademark)" series manufactured by ORGANO CORPORATION, etc. can be used.

[0099] Examples of the metal ion removers include chelating agents, activated carbon, etc. Examples of the chelating agents that can be used include: CRB03, CRB05, CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, Si-PHI (all manufactured by SiliCycle), Muromac XMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, IRC747UPS (all manufactured by ORGANO CORPORATION), S910 (manufactured by Purolite), MPA (manufactured by Reaxa Quadra Pure), etc. Examples of the activated carbon include "Shirasagi (registered trademark)" manufactured by Osaka Gas Chemical Co., Ltd., "Filtrasorb (registered trademark)CAL", "DIAHOPE (registered trademark)", "DIASORB (registered trademark)", etc. manufactured by Calgon Carbon Japan, and "EBADIA (registered trademark)" series manufactured by Suidai Co., Ltd.

[0100] By undergoing the above purification treatment, a composition for a heat transfer fluid (purified composition) with a reduced content of the conductive substance can be obtained.

[0101] The above manufacturing method has the step of the aforementioned purification treatment, but may also have steps of blending additives such as stabilizers and other steps in the composition for a heat transfer fluid.

[0102] (2. Heat Transfer Fluid) The composition for a heat transfer fluid of the present invention can be used in combination with components other than the composition for a heat transfer fluid (hereinafter, a fluid containing the composition for a heat transfer fluid and components other than the composition for a heat transfer fluid is referred to as a heat transfer fluid). In addition to the compounds represented by the above formulas (I) to (III), and CmF2m and / or CnF(2n - 2), water and / or fluoride ions, the heat transfer fluid of the present disclosure may also contain arbitrary additives other than the composition for a heat transfer fluid within a range that does not hinder its effects and purposes. Examples of the arbitrary additives include stabilizers, etc.

[0103] The stabilizer functions as a so-called acid acceptor or antioxidant by exerting a stabilizing effect. The stabilizing effects mainly include: the effect of preventing the decomposition of the HFP trimer by capturing free radicals generated in the system, the acid acceptor effect of preventing the further decomposition of the HFP trimer caused by acid by capturing the acid generated in the system, etc.

[0104] The stabilizer can be a conventional stabilizer. Among them, in terms of effectively suppressing the generation of metal corrosion caused by the composition, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers.

[0105] The unsaturated alcohol-based stabilizer can be a conventional one. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0106] The nitro-based stabilizer can be a conventional one. Examples of aliphatic nitro compounds include nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. Examples of aromatic nitro compounds that can be used include one or more selected from the group consisting of nitrobenzene, o-, m-, or p-dinitrobenzene, o-, m-, or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m-, or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole.

[0107] The amine-based stabilizer can be a conventional one. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, oline, N-methyl oline, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tripentylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine, and diethylhydroxylamine can be used.

[0108] The phenol-based stabilizer can be a conventional one. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0109] Epoxy stabilizers that are commonly known can be used. For example, one or more selected from the group consisting of epoxybutane, 1,2-epoxypropane, 1,2-epoxybutane, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0110] From the reason that by using stabilizers with different stabilizing effects in combination, the decomposition of HFP trimers caused by various reasons can be more effectively prevented, it is preferably to include one or more selected from the group consisting of the above-mentioned epoxy stabilizers, unsaturated alcohol stabilizers, nitro stabilizers, and phenol stabilizers.

[0111] From the viewpoint of effectively suppressing the acid dissociation from the above-mentioned HFP trimers and suppressing the metal corrosion caused by the liquid composition, the content of the stabilizer is preferably 0.0001% by mass or more, more preferably 0.01% by mass or more, with respect to the entire heat transfer fluid. On the other hand, from the viewpoint of avoiding the deterioration of the physical properties of the liquid composition caused by the excessive addition of the stabilizer, the content of the stabilizer is preferably 10% by mass or less, more preferably 5% by mass or less, with respect to the entire heat transfer fluid.

[0112] (3. Use of the composition for heat transfer fluid or heat transfer fluid) The composition for heat transfer fluid or heat transfer fluid of the present disclosure is used to extract heat from various heat transfer objects or supply heat to the heat transfer objects. The heat transfer objects in the present disclosure are articles, devices, and environments that are cooled, heated, or maintained at a controlled temperature. Such heat transfer objects can include electrical parts, mechanical parts, and optical parts, as well as processed products and assembled products thereof. The specific examples of the heat transfer objects in the present disclosure are not particularly limited, and can include wafers, microprocessors, power control semiconductors, electrical disconnect switches, power transformers, circuit boards, multi-chip modules, mounted and non-mounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile parts, etc. used for manufacturing semiconductor devices.

[0113] The composition for heat transfer fluid or heat transfer fluid of the present disclosure can also be used as a two-phase liquid immersion cooling, refrigerator fluid, or Rankine cycle operating fluid.

[0114] In a machine designed to transfer heat using the composition for heat transfer fluid or heat transfer fluid of the present disclosure, the composition for heat transfer fluid or heat transfer fluid of the present disclosure can be used to replace the heat transfer fluid used in the above machine.

[0115] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be a direct (drop in) replacement, nearly direct (nearly drop in) replacement, or retrofit replacement for the heat transfer fluid in use. Further, "direct replacement" means that the replacement can be carried out without accompanying changes on the machine side. "Nearly direct replacement" means that the replacement can be carried out with almost no accompanying changes on the machine side. "Retrofit replacement" means that the replacement can be carried out with minimal changes on the machine side (without accompanying significant changes). The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably a direct replacement or nearly direct replacement for the above-mentioned heat transfer fluid.

[0116] Whether it can be a direct replacement, nearly direct replacement, or retrofit replacement can be determined by whether all of the following conditions are satisfied. (i) The boiling point of the heat transfer fluid is at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement. (ii) The pour point of the heat transfer fluid is equal to or lower than the pour point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid before replacement. (iv) The heat transfer fluid is miscible with the heat transfer fluid before replacement in any proportion.

[0117] By setting the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, cavitation and leakage from the device can be suppressed. The upper limit of the boiling point of the heat transfer fluid is not particularly limited. For example, it can be at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0118] By setting the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to be equal to or lower than the pour point of the heat transfer fluid before replacement, it can be used even at temperatures below the previous use temperature, and the use temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited. For example, it can be a temperature equal to or lower than 30°C higher than the pour point of the heat transfer fluid before replacement.

[0119] By setting the kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to at least about 200% or less, preferably at least about 150% or less of the kinematic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. The kinematic viscosity is preferably compared based on the kinematic viscosity at the use temperature, but is not limited thereto. For example, it can be compared at any temperature from -20°C to -40°C, specifically, based on the kinematic viscosity at -20°C.

[0120] The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is miscible with the heat transfer fluid before replacement in any proportion, making the replacement operation easier.

[0121] Furthermore, by making the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure satisfy the following conditions, it is more suitable for direct replacement, almost direct replacement, or renewal replacement. (v) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is 120% or less of the dielectric constant of the heat transfer fluid before replacement. (vi) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is 90% or more of the dielectric strength of the heat transfer fluid before replacement. (vii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is 90% or more of the specific heat of the heat transfer fluid before replacement. (viii) The composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is 90% or more of the thermal conductivity of the heat transfer fluid before replacement.

[0122] By setting the dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 120% or less of the dielectric constant of the heat transfer fluid before replacement, it is suitable for use as a replacement composition. The lower limit of the dielectric constant of the heat transfer fluid is not particularly limited. For example, it can be 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0123] By setting the dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the dielectric strength of the heat transfer fluid before replacement, it is suitable for use as a replacement composition. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited. For example, it can be 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0124] By setting the specific heat of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the specific heat of the heat transfer fluid before the exchange, it can be suitably used as a replacement composition. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, and for example, it can be 120% or less of the specific heat of the heat transfer fluid before the exchange.

[0125] By setting the thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure to 90% or more of the thermal conductivity of the heat transfer fluid before the exchange, it can be suitably used as a replacement composition. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, and for example, it can be 120% or less of the thermal conductivity of the heat transfer fluid before the exchange.

[0126] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably 105 °C or higher, more preferably 108 °C or higher. Further, the upper limit of the boiling point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and for example, it can be 150 °C or lower, 130 °C or lower, or 120 °C or lower.

[0127] The pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably -80 °C or lower, more preferably -100 °C or lower, still more preferably -110 °C or lower. Further, the lower limit of the pour point of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and for example, it can be -180 °C or higher, or -160 °C or higher.

[0128] The kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure can be -20 °C, preferably 6.0 cSt or lower, more preferably 5.0 cSt or lower, still more preferably 4.0 cSt or lower, and even more preferably 3.5 cSt or lower. Further, the lower limit of the kinematic viscosity of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and for example, it can be 1.0 cSt or higher.

[0129] The dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably 3.0 or lower, more preferably 2.5 or lower, still more preferably 2.0 or lower. Further, the lower limit of the dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and for example, it can be 1.1 or higher.

[0130] The dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is preferably 40 kV or higher, more preferably 50 kV or higher. Further, the upper limit of the dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid of the present disclosure is not particularly limited, and for example, it can be 150 kV or lower, or 100 kV or lower.

[0131] The specific heat of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and still more preferably 1000 J / kg·K or more at 30°C. Further, the upper limit of the specific heat of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is not particularly limited, and may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0132] The thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is preferably 0.055 W / mK or more, more preferably 0.060 W / mK or more, and still more preferably 0.065 W / mK or more at 30°C. Further, the upper limit of the thermal conductivity of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is not particularly limited, and may be, for example, 0.090 W / mK or less, or 0.080 W / mK or less.

[0133] The boiling point of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised from 25°C at a rate of 5°C per minute using DSC (differential scanning calorimetry).

[0134] The pour point of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is the temperature at which a peak derived from endotherm is observed when the temperature is raised at a rate of 5°C per minute after cooling to a temperature below the freezing point using DSC with liquid nitrogen.

[0135] The dielectric constant of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is the value observed at a frequency of 1 kHz in an environment of a temperature of 25°C and a humidity of 60% using the capacitance method.

[0136] The kinematic viscosity and density of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure are the values measured using a kinematic viscometer SVM3001 manufactured by Anton Paar GmbH.

[0137] The dielectric strength of the composition for a heat transfer fluid or the heat transfer fluid according to the present disclosure is the breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a specific interval and the voltage is increased at a fixed speed. The measurement conditions are as follows. Electrode shape: spherical ( 12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement environment: in air (22°C, 57% RH)

[0138] The specific heat of the composition for the heat transfer fluid or the heat transfer fluid of the present disclosure is the value obtained using DSC under the following conditions. Measuring device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Heating rate: 10 °C / minute Standard sample: Sapphire (-Al2O3) Environment: In a dry nitrogen stream Sample container: Aluminum sealed container

[0139] The thermal conductivity of the composition for the heat transfer fluid or the heat transfer fluid of the present disclosure is a value obtained by the transient hot wire method.

[0140] The compatibility of the composition for the heat transfer fluid or the heat transfer fluid of the present disclosure is determined by whether it is mixed and compatible with the target solvent. Here, compatibility means that when the two are mixed, they become a uniform state, that is, there is no phase separation.

[0141] (4. Heat transfer device) The present disclosure further discloses a heat transfer device, which includes a device and a mechanism. The mechanism contains the above-mentioned composition for the heat transfer fluid and is used to transfer heat to the aforementioned device or transfer heat from the aforementioned device.

[0142] Examples of the device include a computer, a server computer, a server including a blade server; a disk array / storage system; a storage area network; a storage connected to a network; a storage communication system; a workstation; a router; an electrical communication infrastructure / switch; wired, optical, and wireless communication devices; a unit processing device; a printer; a power supply device; a display; an optical device; a measurement system including a handheld system; military electronic equipment, etc.

[0143] The semiconductor element is a heat-generating element mounted on the device. Examples include a CPU, a GPU, an SSD, etc. The semiconductor element is composed of, for example, a single element such as silicon, germanium, a compound semiconductor such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.

[0144] When the device is a server computer, one logic board or a plurality of logic boards are arranged in the internal space. The logic board is equipped with a large number of heat-generating electronic components including at least one processor such as a CPU and a GPU. In addition, for example, a chipset can be used; memory, graphics chips, network chips, RAM, power supply devices, daughter boards; memory hard disks such as solid state hard disks and mechanical hard disks; and other heat-generating components of the computer.

[0145] The heat transfer device is a heat transfer device that uses the above-mentioned heat transfer fluid to transfer heat between objects to be heat transferred, bringing the objects to be heat transferred into thermal contact, thereby receiving (transferring) heat. For example, when taking heat from the object to be heat transferred, it is cooling, and when supplying heat, it is heating. It can be set as different mechanisms according to various situations, but one heat transfer device can also be used for cooling and heating.

[0146] The heat transfer device is not particularly limited, and examples thereof include pumps, valves, fluid closed systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, passive temperature control systems, etc.

[0147] More specifically, examples include a temperature-controlled wafer chuck in a plasma enhanced chemical vapor deposition (PECVD) tool, a temperature-controlled test head for grain performance testing, a temperature-controlled working area in a semiconductor manufacturing machine, a thermal shock test bath solution storage tank, a constant temperature bath, etc.

[0148] The object to be heat transferred that is in thermal contact with the heat transfer device is an item, device, or environment that cools, heats, or maintains its temperature at the temperature to be controlled. Such objects to be heat transferred include electrical components, mechanical components, and optical components, as well as processed products and assembled products thereof. Specific examples of the object to be heat transferred in the present disclosure are, for example, microprocessors, wafers used for manufacturing semiconductor devices, power control semiconductors, electrical disconnect switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile components, etc., and of course are not limited to these.

[0149] (5. Heat Transfer Method) The present disclosure further discloses a heat transfer method, which includes the steps of preparing a device, and using the above-described heat transfer fluid composition to transfer heat to or from the aforementioned device. Here, a heat transfer device is arranged in thermal contact with the device, whereby heat can be transferred. When the heat transfer device is arranged in thermal contact with the device, heat can be removed from the device, or heat can be supplied to the device, or the device can be maintained at a selected temperature or temperature range. The direction of heat flow (flowing out of or into the device) can be determined by the relative temperature difference between the device and the heat transfer device.

[0150] The above describes embodiments of the present invention, but the present invention is not limited to the above examples and can be implemented in various forms without departing from the gist of the present invention. (Example)

[0151] The embodiments of the present invention will be described in more detail below based on examples, but the present invention is not limited thereto.

[0152] (Production Example 1) According to the method described in Chem Bar (1973), Vol. 106, pp2950-2959, HFP trimers were obtained. The obtained HFP trimers were purified by distillation to remove impurities such as the dimer and tetramer of hexafluoropropylene. Further, the purified HFP trimers were distilled to separate the compounds represented by formulas (I), (II), and (III). The separated HFP trimers were dehydrated using silica gel respectively.

[0153] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the proportions of the compounds represented by formulas (I), (II), and (III) were as shown in the following table, to obtain Trimer Mixtures 1 to 4.

[0154] [Table 1]

[0155] (Production Example 2) According to the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp1064-1067, C9F16 was synthesized.

[0156] (Production Example 3) Reagents purchased from Wako Pure Chemical Industries, Ltd. were used as C8F16.

[0157] (Examples 1 to 43) Trimers 1 to 4, C9F16 of Production Example 2 or C8F16 of Production Example 3 as additives were mixed in the proportions shown in the following table to obtain the compositions for heat transfer fluids of Examples 1 to 43.

[0158] (Stability Test) The obtained composition for heat transfer fluid was placed in an autoclave made of SUS and sealed, and heated and maintained under the conditions shown in the following table.

[0159] (Measurement of Fluoride Ion Concentration) An equal amount (by weight) of distilled water was added to the sample, and the mixture was shaken for about 20 seconds to extract the F ions into the aqueous layer. Then, 2.5 to 3.0 mL of the aqueous layer was taken out with a dropper, and the solution mixed with twice the amount of TISAB solution (Total Ion Strength Adjustment Buffer Solution: manufactured by HORIBA Ltd.) was used as the sample, and measured with a fluoride ion meter (manufactured by HORIBA Ltd.). In addition, since it was diluted with TISAB solution, the measured value was multiplied by 3 to obtain the fluoride ion concentration. The results are shown in the following table.

[0160] [Table 2]

[0161] [Table 3]

[0162] From the above results, it was confirmed that Examples 1 to 43 containing C9F16 or C8F16 did not show an increase in fluorine concentration even after long-term storage at high temperature and were relatively stable.

[0163] (Measurement of Boiling Point, Pour Point and Dielectric Constant) The boiling point of the terpolymer mixture was the temperature of the endothermic peak observed when the temperature was raised from 25°C at 5°C / min using DSC (differential scanning calorimetry). The pour point was the temperature of the endothermic peak observed when the temperature was raised at 5°C / min after cooling to below the freezing point with liquid nitrogen using DSC. The dielectric constant was the value at a frequency of 1 kHz measured by the capacitance method in an environment of 25°C and 60% humidity.

[0164] <Measurement of kinematic viscosity and density> The kinematic viscosity and density of the terpolymer mixture were measured using a viscometer SVM3001 manufactured by Anton Paar.

[0165] <Measurement of specific heat> The specific heat of the terpolymer mixture was measured using DSC. The measurement conditions are as follows. Measuring device: Differential scanning calorimeter DSC8500 manufactured by Perkin-Elmer Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Environment: In a dry nitrogen stream Sample container: Aluminum sealed container

[0166] <Measurement of thermal conductivity> The thermal conductivity of the terpolymer mixture was measured by the transient hot wire method.

[0167] <Compatibility> The compatibility of the terpolymer mixture was evaluated by mixing the following 3 solvents with each terpolymer mixture in equal amounts. Galden HT135 (manufactured by Solvay) SF-10 (manufactured by Chemours) FC3283 (manufactured by 3M)

[0168] [Table 4]

[0169] (Examples 44 to 59) The terpolymer mixtures 1 to 4 and water were mixed in the amounts shown in the following table to obtain the compositions of Examples 44 to 59.

[0170] [Table 5]

[0171] (Stability Test) The compositions of Examples 44 to 59 and Comparative Examples 3 to 6 were placed in an autoclave made of SUS and sealed, and heated and maintained under the conditions shown in the following table.

[0172] (Measurement of Dielectric Strength) A liquid sample was immersed between spherical electrodes adjusted to a specific interval, and the dielectric strength was measured as the breakdown voltage when the voltage was increased at a fixed speed. The detailed measurement conditions are as follows. Electrode shape: spherical ( 12.5 mm) Electrode interval: 2.5 mm Voltage increase speed: 2 kV / second Measurement environment: in air (22 °C, 57% RH)

[0173] [Table 6]

[0174] From the above results, it was confirmed that in Examples 44 to 59 containing a specific amount of water, the fluorine concentration did not increase even after long-term storage at high temperature, and they were relatively stable. Also, it was confirmed that the dielectric strength of Examples 44 to 59 was high.

[0175] (Examples 60 to 83) Hydrofluoric anhydride was added to Trimer Mixtures 1 to 4 to prepare a reference solution, which was diluted with each trimer mixture to obtain the compositions of Examples 60 to 83 having the fluoride ion concentrations shown in the following table.

[0176] (Stability Test) The sample was placed in an autoclave made of SUS and sealed, and heated and maintained under the conditions shown in the following table.

[0177] (Measurement of the Purity of Hexafluoropropylene Trimer) The purity of the hexafluoropropylene trimer before and after the stability test was measured by gas chromatography.

[0178] [Table 7]

[0179] [Table 8]

[0180] It can be confirmed from the above results that the purity of hexafluoropropylene trimer can be maintained at a high level even after long-term storage at high temperature for Examples 60 to 83 containing a specific amount of fluoride ions.

[0181] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the proportions of the compounds represented by formulas (I), (II), and (III) became the proportions shown in the following table, to obtain trimer mixtures 5 to 6.

[0182] [Table 9]

[0183] (Production of hexafluoropropylene tetramer) (Production Example 4) The hexafluoropropylene tetramer was obtained according to the method described in Tetrahedron Lett. 1974, 24, 2129-2132.

[0184] By mixing trimer mixture 5 or 6 with the hexafluoropropylene tetramer obtained in Production Example 4, the heat transfer fluid of the present disclosure can be obtained.

[0185] <Evaluation method> (Boiling point) The boiling point is the temperature at which a peak derived from endotherm is observed when the temperature is raised from 25°C at 5°C / minute using DSC.

[0186] (Kinematic viscosity) The kinematic viscosity is the value at 25°C measured using an Ubbelohde viscometer in accordance with JIS K 2283.

[0187] (Dielectric constant) The dielectric constant is the value at a frequency of 1 kHz measured by the capacitance method in an environment of a temperature of 25°C and a humidity of 60%.

[0188] (Examples 84 to 85) Mix in the ratio of weight of trimer mixture 5 : hexafluoropropylene tetramer = 91 : 9 (Example 84), trimer mixture 6 : hexafluoropropylene tetramer = 91 : 9 (Example 85). Measure each physical property, and the results are shown in Table 10.

[0189] [Table 10]

[0190] <Examples 86 to 87> In Examples 86 to 87, prepare a pre-purification composition (Composition 1 containing a heat transfer fluid and a conductive substance; 6FT) to be supplied to the purification step. Specifically, add 750 g of DMF and 7.2 g of cesium fluoride to a SUS autoclave and seal it. After degassing the inside of the autoclave under vacuum, add 2268 g of hexafluoropropylene over 4.5 hours while maintaining the temperature inside the autoclave at 70 to 110°C. Take the lower layer from the resulting reaction solution and wash it with ultrapure water to obtain 2219 g of a composition containing an HFP trimer (Composition 1 belonging to the pre-purification composition). Perform GCFID and GC-MS analyses, and confirm by the area percentage method that the HFP trimer contains 87% by mass in the total amount of the composition of 100% by mass, and the compounds represented by the formulas (I), (II), and (III) described in this specification contain 78% by mass, 9% by mass, and 13% by mass, respectively, in the total amount of the HFP trimer of 100% by mass.

[0191] <Example 88> Perform the same operations as in Examples 86 to 87, isolate the compounds represented by the formulas (I), (II), and (III), and mix them in such a way that the compounds represented by the formulas (I), (II), and (III) become 55% by mass, 15% by mass, and 30% by mass, respectively, to produce 2200 g of a composition.

[0192] <Example 89> Perform the same operations as in Examples 86 to 87, isolate the compounds represented by the formulas (I), (II), and (III), and mix them in such a way that the compounds represented by the formulas (I), (II), and (III) become 3% by mass, 33% by mass, and 64% by mass, respectively, to produce 2200 g of a composition.

[0193] <Example 90> Perform the same operations as in Examples 86 to 87 to isolate the compounds shown in (I), (II), and (III), and mix the compounds shown in formula (I), (II), and (III) in the order of 90% by mass, 5% by mass, and 5% by mass respectively to produce 2200 g of Composition 2200.

[0194] (Measure the content of metals and metal ions in the composition before purification) The content of conductive substances in the composition before purification (in this example, especially focusing on the content of metals and metal ions) was determined using an inductively coupled plasma mass spectrometer (ICP-MS) in the following order (the same applies to the composition after purification). Each measured value is shown in Table 11 below. (1) Inject 2000 g of the composition before purification into a beaker made of polytetrafluoroethylene (PTFE), place the beaker on a hot plate at 250 °C, and allow the volatile components to evaporate. (2) Dilute ultratrace precision analytical nitric acid (manufactured by Wako Pure Chemical Industries, Ltd.) with a concentration of 70% with ultrapure water to obtain nitric acid with a concentration of approximately 4% by mass, and then put about 50 mL of it into a PTFE beaker. (3) Place the PTFE beaker on a hot plate at 150 °C for 1 hour to dissolve the metals remaining in the beaker. (4) Measure the amount of metal ions dissolved in nitric acid using ICP-MS. Calculate the content of metals and metal ions in the solution using the amount of metal ions in nitric acid, the amount of nitric acid, and the amount of the evaporated liquid. (5) All operations related to the above measurements were carried out in a cleanroom of Class 10000, setting up Table KOACH manufactured by Koken Co., Ltd., and the operation environment was equivalent to that of Class 1.

[0195] (Measure the number of insoluble substances (fine particles) in the composition before purification) Use a liquid particle counter ("KL-22" manufactured by RION Co., Ltd.) to measure the number of particles with a particle diameter of 5.0 μm or more, the number of particles with a particle diameter of 1.0 μm or more and less than 5.0 μm, the number of particles with a particle diameter of 0.5 μm or more and less than 1.0 μm, and the number of particles with a particle diameter of 0.3 μm or more and less than 0.5 μm in the composition before purification at a temperature of 23 °C (the same applies to the composition after purification). All operations related to the measurement were carried out in a cleanroom of Class 10000, setting up Table KOACH manufactured by Koken Co., Ltd., and the operation environment was equivalent to that of Class 1.

[0196] (Measure the boiling point, freezing point, and kinematic viscosity of the composition before purification) The boiling point was the temperature of the endothermic peak observed when the temperature was raised from 25°C at 5°C / min using DSC. The freezing point was the temperature of the endothermic peak observed when the temperature was raised at 5°C / min after cooling to below -150°C (the temperature at which solidification was confirmed) using DSC. The kinematic viscosity was measured using an Ubbelohde viscometer in accordance with JIS K 2283. Each measured value is shown in Table 11 below.

[0197] (Purification treatment) A multi-stage filtration device was prepared as the filtration device. In this multi-stage filtration device, a unit in which one filter was placed in one container was prepared for each filter, and the necessary number of these units were connected in series.

[0198] The pre-purification composition was placed in a pressure vessel and cooled to -5°C or below, and under a high-purity argon environment, it was pressure-filtered to 0.02 MPa using the aforementioned filtration device to obtain the post-purification composition. At this time, the filters in each unit of the aforementioned filtration device were used as described in Table 11 below. The results are shown in Table 12. ‧ Filter A ("IonKleen SL" manufactured by Nihon Pall Co., Ltd., filtration area: 0.58 m2); ‧ Filter B ("Ultipleat P-Nylon" manufactured by Nihon Pall Co., Ltd., pore size: 0.15 μm, filtration area: 1.2 m2); and ‧ Filter C ("Ultipleat P-Nylon" manufactured by Nihon Pall Co., Ltd., pore size: 40 nm, filtration area: 1.2 m2).

[0199] From the results in Table 12, it can be seen that by subjecting the pre-purification composition to a specific purification treatment, the content of conductive substances (especially metals and metal ions) can be reduced.

[0200] [Table 11]

[0201] [Table 12]

Claims

1. A composition for a heat transfer fluid, comprising: a hexafluoropropylene trimer as shown in C9F18, and (i) CmF2m and / or CnF(2n-2) [wherein, m is an integer of 4 to 12 and other than 6 and 9, and n is an integer of 4 to 12] (wherein, The content of CmF2m and / or CnF(2n-2) is 0.0001 to 10 parts by mass relative to 100 parts by mass of the hexafluoropropylene trimer shown in C9F18, (ii) water (wherein, relative to 100 parts by mass of the hexafluoropropylene trimer shown in C9F18, the content of water is 0.0001 to 0.1 parts by mass), and / or (iii) fluoride ions (wherein, relative to 100 parts by mass of the hexafluoropropylene trimer shown in C9F18, the content of fluoride ions is 0.0000001 to 5 parts by mass), wherein the hexafluoropropylene trimer contains at least one of the compounds selected from the group consisting of compounds shown in formulas (I) to (III).

2. The composition for heat transfer fluid as described in claim 1, wherein, The compound shown in formula (I) accounts for more than 85% by mass relative to the total amount of hexafluoropropylene trimer.

3. The composition for heat transfer fluid as described in claim 1, wherein, The compound shown in formula (I) is less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

4. The composition for heat transfer fluid as described in claim 1, wherein, The compound shown in formula (I) is more than 50% by mass and less than 85% by mass relative to the total amount of hexafluoropropylene trimer.

5. The heat transfer fluid composition as described in claim 1, comprising hexafluoropropylene trimer as shown in C9F18, and (i) CmF2m and / or CnF(2n-2) [where m is an integer other than 6 and 9 and 4 to 12, and n is an integer other than 4 to 12].

6. The composition for heat transfer fluid as described in claim 1, wherein, m is an integer greater than or equal to 6 and less than or equal to 11, and n is an integer greater than or equal to 6 and less than or equal to 11.

7. The heat transfer fluid composition as described in claim 1, comprising (ii) hexafluoropropylene trimer as shown in C9F18 and water.

8. The heat transfer fluid composition as claimed in claim 1, comprising hexafluoropropylene trimer as shown in C9F18, and (iii) fluoride ions.

9. The heat transfer fluid composition as described in claim 1, further comprising hexafluoropropylene tetramer as shown in C12F24, wherein the content of the hexafluoropropylene trimer is 80% by mass or more relative to the total of the aforementioned hexafluoropropylene trimer and the aforementioned hexafluoropropylene tetramer.

10. A composition for heat transfer fluids as described in claim 9, wherein, Compared to the sum of the aforementioned hexafluoropropylene trimer and the aforementioned hexafluoropropylene tetramer, the content of the aforementioned hexafluoropropylene trimer is 90% by mass or more and 99.99% by mass or less.

11. The composition for heat transfer fluid as described in claim 9, wherein, The aforementioned hexafluoropropylene tetramer contains 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

12. The heat transfer fluid composition as described in claim 1, further comprising a conductive substance, wherein the content of the conductive substance is less than 100 ppm by mass.

13. The heat transfer fluid composition as described in claim 1 further contains insoluble matter, and the content of insoluble matter with a particle size of 5 μm or larger is less than 10 particles / mL.

14. A heat transfer fluid comprising the composition of the heat transfer fluid described in claim 1.

15. Use of a heat transfer fluid composition as claimed in claim 1, wherein the composition is used as a heat transfer fluid.

16. A heat transfer apparatus comprising a device and a mechanism, the mechanism comprising the heat transfer fluid composition described in claim 1, and for transferring heat to or from the aforementioned device.

17. A heat transfer method comprising the steps of preparing an apparatus and using the heat transfer fluid composition described in claim 1 to transfer heat to or from the aforementioned apparatus.