Sensing module

Abstract

A sensing module includes a photosensitive circuit board, a light source structure, a dimming plate, and a light-shielding plate. The photosensitive circuit board has multiple photosensitive elements. The light source structure is disposed on one side of the photosensitive surface of each photosensitive element. The dimming plate is disposed between the photosensitive circuit board and the light source structure, and includes a substrate and multiple optical microstructures. These optical microstructures are disposed on the substrate surface facing the light source structure. The light-shielding plate is disposed on the side of the light source structure opposite to the dimming plate. The light-shielding plate is adapted to be subjected to external force and pressed by the light source structure, causing deformation of the multiple optical microstructures.

Description

[Technical Field]

[0001] This invention relates to a sensing technology, and more particularly to a sensing module. [Previous Technology]

[0002] With the advancement of artificial intelligence technology and various sensing technologies, the development of consumer, care, and industrial robots has progressed rapidly in recent years. In terms of robot perception capabilities, tactile sensing is gradually becoming an important sensing capability in addition to vision and hearing. For example, in situations with poor visibility or blind spots, robots can use touch to perceive surrounding objects, thereby quickly stopping their movement or taking responsive actions, making robot operation more precise to avoid collisions that could cause injury to people or objects nearby.

[0003] Generally speaking, tactile perception mostly relies on pressure sensing technology. Among existing pressure sensing technologies, those less susceptible to external environmental factors (such as temperature, magnetic fields, water, dust, electromagnetic waves, vibration, etc.) can be broadly classified into piezoresistive, pneumatic, and optical types. Optical pressure sensing technology, in addition to its potential to achieve large-area sensing with a more streamlined module structure, also offers better reliability. However, research and development on large-area optical multidimensional pressure sensing technology is still limited.

[0004] The "Prior Art" paragraph is only used to help understand the content of this invention. Therefore, the content disclosed in the "Prior Art" paragraph may include some prior art that does not constitute conventional art known to those skilled in the art. The content disclosed in the "Prior Art" paragraph does not mean that the content or the problem to be solved by one or more embodiments of this invention was known or recognized by those skilled in the art prior to this application. [Summary of the Invention]

[0005] The present invention provides a sensing module that has a large area and good stability pressure sensing capability.

[0006] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0007] To achieve one, some, or all of the above-mentioned objectives, or other objectives, one embodiment of the present invention provides a sensing module. The sensing module includes a photosensitive circuit board, a light source structure, a dimming plate, and a light-shielding plate. The photosensitive circuit board is provided with multiple photosensitive elements. The light source structure is disposed on one side of the photosensitive surface of each photosensitive element. The dimming plate is disposed between the photosensitive circuit board and the light source structure, and includes a substrate and multiple optical microstructures. These optical microstructures are disposed on the substrate surface of the substrate facing the light source structure. The light-shielding plate is disposed on the side of the light source structure opposite to the dimming plate. The light-shielding plate is adapted to be subjected to external force and pressed by the light source structure, causing deformation of the multiple optical microstructures.

[0008] In one embodiment of the present invention, the light shield of the above-mentioned sensing module is provided with a reflective layer on the side facing the light source structure.

[0009] In one embodiment of the present invention, the plurality of optical microstructures of the above-described sensing module are arranged at intervals along at least two directions parallel to the substrate surface and intersecting each other.

[0010] In one embodiment of the present invention, the light source structure of the sensing module includes a flexible light guide plate and a light source. The flexible light guide plate has a light incident surface and a first surface and a second surface connected to the light incident surface and facing each other. The first surface faces the dimming plate. A plurality of scattering microstructures are provided on the second surface. The light source is disposed on one side of the light incident surface of the flexible light guide plate.

[0011] In one embodiment of the present invention, a plurality of scattering microstructures of the above-mentioned sensing module are arranged at intervals along at least two intersecting directions on the second surface, and the distance between at least two adjacent scattering microstructures is adapted to be changed by external force.

[0012] In one embodiment of the present invention, the multiple scattering microstructures of the sensing module described above include a matrix and multiple scattering particles or multiple wavelength conversion particles dispersed in the matrix.

[0013] In one embodiment of the present invention, the light source structure of the sensing module described above includes a flexible circuit board and a plurality of light-emitting elements. These light-emitting elements are arranged at intervals along at least two intersecting directions on the side of the flexible circuit board facing the dimming sheet.

[0014] In one embodiment of the present invention, the distance between at least two adjacent light-emitting elements of the above-mentioned sensing module is adapted to be changed by an external force.

[0015] In one embodiment of the present invention, the sensing module further includes a shear force sensing layer disposed between the light-shielding sheet and the light source structure. The shear force sensing layer includes a conductive block and a first conductive polymer pattern and a second conductive polymer pattern connecting the conductive block. The first conductive polymer pattern is disposed on one side of the conductive block along a first direction. The second conductive polymer pattern is disposed on one side of the conductive block along a second direction. The first direction intersects with the second direction.

[0016] In one embodiment of the present invention, the shear force sensing layer of the sensing module further includes a third conductive polymer pattern and a fourth conductive polymer pattern connecting the conductive block. The third conductive polymer pattern is disposed on the other side of the conductive block along the first direction, and the fourth conductive polymer pattern is disposed on the other side of the conductive block along the second direction.

[0017] In one embodiment of the present invention, the first conductive polymer pattern and the second conductive polymer pattern of the above-mentioned sensing module each include an elastic polymer pattern and a plurality of conductive particles dispersed in the elastic polymer pattern.

[0018] In one embodiment of the present invention, the sensing module further includes a filter layer disposed between the photosensitive circuit board and the light source structure.

[0019] Based on the above, in a sensing module according to an embodiment of the present invention, a dimming sheet located between the light source structure and the photosensitive circuit board is provided with multiple optical microstructures, and these optical microstructures are arranged facing the light source structure. An external force applied to the light-shielding sheet can press the dimming sheet through the light source structure, causing deformation of its optical microstructures, thereby changing the light pattern and intensity distribution detected on the photosensitive circuit board. The magnitude of the pressure applied to the sensing module by the degree of light intensity change is obtained, and the direction and magnitude of the lateral force are determined by detecting the peak position of the light pattern. Through the aforementioned stacked structure design of the dimming sheet, light source structure, and photosensitive circuit board, the sensing module can meet the needs of large-area sensing at a lower cost and obtain more reliable sensing results.

[0020] In order to make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below, and detailed descriptions are given in conjunction with the accompanying drawings.

Implementation Method

[0022] The foregoing descriptions and other technical contents, features, and effects of this invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the invention.

[0023] FIG1 is a cross-sectional schematic diagram of the sensing module according to the first embodiment of the present invention. FIG2 is an enlarged schematic diagram of the light source structure of FIG1. ​​FIG3 is a top view of the light source structure of FIG1. ​​FIG4 is a top view of the dimming plate of FIG1. ​​FIG5 is a cross-sectional schematic diagram of the sensing module of FIG1 under external force. FIG6 is a light pattern distribution diagram measured by the photosensitive circuit board of FIG1 when the sensing module is not under external force and under external force.

[0024] Referring to Figure 1, the sensing module 10 includes a photosensitive circuit board 100, a dimming plate 120, and a light source structure 140. The photosensitive circuit board 100 includes a circuit board 101 and a plurality of photosensitive elements 105. The photosensitive elements 105 are, for example, photodiodes, but are not limited thereto. The circuit board 101 may be composed of rigid or flexible substrates. In this embodiment, these photosensitive elements 105 may be arranged in an array on the circuit board 101 and each may be electrically connected to the circuit board 101. For example, these photosensitive elements 105 may be arranged in multiple columns and multiple rows along directions X and Y, respectively, and constitute a plurality of photosensitive pixels of the photosensitive circuit board 100. In this embodiment, direction X may be selectively perpendicular to direction Y, but is not limited thereto.

[0025] The light source structure 140 is disposed on one side of the photosensitive surface 105s of each of the plurality of photosensitive elements 105, and the dimming plate 120 is disposed between the photosensitive circuit board 100 and the light source structure 140. In this embodiment, the light source structure 140 includes a flexible light guide plate 141 and a light source 143. The material of the flexible light guide plate 141 includes, for example, silicone, polydimethylsiloxane (PDMS), polyurethane (PU), or other materials with elasticity and ductility. The flexible light guide plate 141 has a light incident surface 141is and a first surface 141s1 and a second surface 141s2 connected to the light incident surface 141is and opposite to each other. The first surface 141s1 faces the dimming plate 120.

[0026] The light source 143 is disposed on one side of the light incident surface 141is of the flexible light guide plate 141 and is adapted to emit multiple light rays L toward the light incident surface 141is of the flexible light guide plate 141. These light rays L are adapted to be transmitted within the flexible light guide plate 141 and emitted from the first surface 141s1. The light source 143 is, for example, a light strip or light panel provided with multiple light emitting diodes (LEDs), but is not limited thereto. In other embodiments, the light source may be a combination of a laser diode and a light guiding element (e.g., an optical fiber), wherein the light guiding element is used to guide the laser light emitted by the laser diode into the flexible light guide plate 141. To amplify the light, a diffusion lens or diffusion mirror may also be provided on one side of the light emitting surface of the light source, but is not limited thereto.

[0027] Referring to Figures 1, 2, and 3, in this embodiment, a plurality of scattering microstructures 145 are provided on the second surface 141s2 of the flexible light guide plate 141. These scattering microstructures 145 can be arranged at intervals along at least two intersecting directions on the second surface 141s2. For example, these scattering microstructures 145 can be arranged in multiple rows and columns at intervals along directions X and Y. The light L transmitted within the flexible light guide plate 141 can increase its emission angle range on the first surface 141s1 through the scattering effect of the scattering microstructures 145.

[0028] For example, in this embodiment, the scattering microstructure 145 includes a matrix 145m and a plurality of scattering particles SP or a plurality of wavelength conversion particles WCP dispersed within the matrix 145m. The material of the matrix 145m may include silicone or UV adhesive. The material of the scattering particles SP may include titanium dioxide or other materials with scattering or reflecting capabilities. The material of the wavelength conversion particles WCP may include fluorescent materials, phosphorescent materials, or other materials suitable for absorbing short-wavelength light (e.g., blue light or ultraviolet light) and emitting long-wavelength light (e.g., yellow light).

[0029] In this embodiment, the scattering microstructure 145 is, for example, a protrusion protruding from the second surface 141s2, but the present invention is not limited thereto. In other embodiments, the scattering microstructure may be a recessed structure recessed from the second surface 141s2 into the flexible light guide plate 141. It should be noted that, because the flexible light guide plate 141 has elasticity and extensibility, the distance between at least two adjacent scattering microstructures 145 on its second surface 141s2 is suitable to be changed by an external force. Therefore, by detecting the change in the aforementioned distance, the direction and intensity of the external force can be determined.

[0030] Referring to Figures 1 and 4, on the other hand, the dimming strip 120 includes a substrate 121 and a plurality of optical microstructures 125, and these optical microstructures 125 are disposed on the substrate surface 121s of the substrate 121 facing the light source structure 140. For example, these optical microstructures 125 may be arranged at intervals along at least two intersecting directions (e.g., direction X and direction Y) parallel to the substrate surface 121s, but are not limited thereto. The material of the dimming strip 120 may include silicone, polydimethylsiloxane (PDMS), polyurethane (PU), or other materials with elasticity and ductility.

[0031] Multiple light rays L transmitted within the flexible light guide plate 141 are emitted from the first surface 141s1 and transmitted to the dimming plate 120. The optical microstructures 125 of the dimming plate 120 are adapted to guide these light rays L to multiple photosensitive elements 105 on the photosensitive circuit board 100. More specifically, the light pattern distribution (e.g., the light intensity distribution in a plane parallel to the X and Y directions) of the light rays L emitted from the light source structure 140 toward the dimming plate 120 depends on the configuration (e.g., the shape and position) of the multiple optical microstructures 125 on the dimming plate 120.

[0032] In this embodiment, the optical microstructure 125 can be a quadrangular pyramid protruding from the substrate surface 121s. However, the present invention is not limited to this. Depending on the desired light pattern distribution, the structural shape of the optical microstructure 125 can also be changed to other suitable cones, cylinders, or spheres. Since the substrate 121 of the dimming plate 120 and the plurality of optical microstructures 125 are elastic and malleable, an external force applied along the normal direction (e.g., direction Z) of the substrate surface 121s can cause deformation of the optical microstructure 125, thereby changing the light intensity of the light ray L after passing through the compressed optical microstructure 125. That is, by detecting the change in the light pattern peak and light intensity of the light ray L, the magnitude and direction of the external force can be determined.

[0033] To prevent external light from entering the sensing module 10 and affecting the reliability of the sensing results, the sensing module 10 is further provided with a light-shielding plate 160. The light-shielding plate 160 is disposed on the side of the light source structure 140 facing away from the dimming plate 120. The light-shielding plate 160 includes a substrate 161. In this embodiment, in order to increase the light energy utilization rate of the light source structure 140, the light-shielding plate 160 may further provide a reflective layer 165 on the side of the substrate 161 facing the light source structure 140. The material of the substrate 161 may include silicone, polydimethylsiloxane (PDMS), polyurethane (PU), or other materials with elasticity and ductility. In some embodiments, the light-shielding plate may not have a reflective layer 165, and its manufacturing material must also have opaque properties, for example, doping the substrate 161 with light-absorbing particles or reflective particles, but is not limited to this.

[0034] It should be noted that the light-shielding sheet 160 disposed on the side of the light source structure 140 opposite to the dimming sheet 120 can also prevent the scattering microstructure 145 on the flexible light guide plate 141 from being damaged by direct contact with external forces. In other words, the light-shielding sheet 160 also has the function of protecting the light source structure 140.

[0035] Referring to Figures 1 and 5, in this embodiment, the sensing module 10 is adapted to sense the applied pressure and direction of the external force EF, that is, the sensing module 10 can be a pressure sensing module. The pressure sensing principle of the sensing module 10 will be described exemplarily below.

[0036] When the sensing module 10 is not subjected to an external force EF, any two adjacent scattering microstructures 145 of the light source structure 140 arranged along the X or Y direction are spaced apart by a distance d1 (as shown in Figure 1). When the sensing module 10 is subjected to an external force EF as shown in Figure 5, the distance between at least two adjacent scattering microstructures 145 will change due to the external force EF. For example, one scattering microstructure 145 shown in Figure 5 will move closer to another scattering microstructure 145 on its right (i.e., the distance d2 between them will be less than the aforementioned distance d1), and move away from another scattering microstructure 145 on its left (i.e., the distance d3 between them will be greater than the aforementioned distance d1). That is, the scattering microstructure 145 in the middle of Figure 5 will undergo a displacement SFT along the X direction.

[0037] In addition, when an external force EF is applied to the light-shielding plate 160 of the sensing module 10, a downward pressure P (or a positive force) is generated along the normal direction of the first surface 141s1 (e.g., the opposite direction of direction Z). This downward pressure P presses the dimming plate 120 through the light source structure 140, causing the multiple optical microstructures 125 of the dimming plate 120 to deform (as shown in FIG. 5). When the light L passes through the deformed optical microstructures 125, its light path will change, thereby affecting the light pattern and light intensity distribution when the light L is transmitted to the photosensitive circuit board 100. In this embodiment, the deformation of the optical microstructure 125 is generated by the downward pressure P directly pressing the optical microstructure 125 through the first surface 141s1 of the flexible light guide plate 141, but it is not limited to this.

[0038] Referring to Figures 5 and 6, curve C0 shows the brightness distribution of light L detected by the multiple photosensitive pixels (i.e., photosensitive elements 105) arranged along direction X on the photosensitive circuit board 100 when the sensing module 10 is not subjected to external force EF, while curve C1 shows the brightness distribution of light L detected by the photosensitive circuit board 100 along direction X when the sensing module 10 is subjected to external force EF. Comparing curves C0 and C1, it can be seen that when the sensing module 10 is subjected to external force EF, the brightness peak and peak position detected by the photosensitive circuit board 100 are different from those detected when the sensing module 10 is not subjected to external force EF. In other words, the two curves in Figure 6 show the change in the light pattern distribution detected by the photosensitive circuit board 100 when the sensing module 10 is subjected to external force EF.

[0039] Therefore, when the sensing module 10 is subjected to an external force EF, the magnitude of the downward pressure P applied to the sensing module 10 by the external force EF along the normal direction of the first surface 141s1 (e.g., the opposite direction of direction Z) can be obtained by detecting the change in the light pattern distribution detected by the photosensitive circuit board 100. The direction of action of the horizontal shear force (or lateral force) component in the external force EF can be obtained by detecting the position of the light pattern peak and determining the direction of movement of the scattering microstructure 145.

[0040] It should be noted that the stacked structure design of the dimming plate 120, the light source structure 140 and the photosensitive circuit board 100 enables the sensing module 10 to meet the needs of large-area pressure sensing at a lower cost and obtain more reliable sensing results.

[0041] Other embodiments will be listed below to illustrate this disclosure in detail, wherein the same components will be marked with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and they will not be repeated below.

[0042] FIG7 is a cross-sectional schematic diagram of a sensing module according to a second embodiment of the present invention. FIG8 is a cross-sectional schematic diagram of the sensing module of FIG7 under external force. Referring to FIG7, the main difference between the sensing module 20 of this embodiment and the sensing module 10 of FIG1 is that the design of the light source structure is different. On the other hand, the light shield 160 of this embodiment does not have a reflective layer 165 as shown in FIG1 on the side of the substrate 161 facing the light source structure 140A.

[0043] Specifically, in this embodiment, the light source structure 140A of the sensing module 20 may include a flexible circuit board 142 and a plurality of light-emitting elements 144, and these light-emitting elements 144 are arranged at intervals along at least two intersecting directions (e.g., direction X and direction Y) on the side surface 142s of the flexible circuit board 142 facing the dimming sheet 120. That is, in this embodiment, these light-emitting elements 144 may be arranged in an array on the surface 142s of the flexible circuit board 142, and a plurality of optical microstructures 125 on the dimming sheet 120 may be superimposed along the normal direction of the surface 142s.

[0044] In this embodiment, the light-emitting element 144 is, for example, a light-emitting diode with a large light emission angle range, and is used to emit light L directly toward the dimming plate 120. That is, the light L emitted by the light-emitting element 144 in this embodiment is not transmitted through the flexible light guide plate 141 as shown in FIG1 before being guided to the dimming plate 120. It should be noted that, since the flexible circuit board 142 has elasticity and extensibility, the distance between at least two adjacent light-emitting elements 144 on its surface 142s is suitable to be changed by external force. Therefore, by detecting the change in the aforementioned distance, the direction and force of the external force can be determined.

[0045] The pressure sensing principle of the sensing module 20 will be explained exemplarily below. Referring to Figures 7 and 8, when the sensing module 20 is not subjected to an external force EF, any two adjacent light-emitting elements 144 of the light source structure 140A arranged along the X or Y direction are spaced apart by a distance d1” (as shown in Figure 7). When the sensing module 20 is subjected to an external force EF as shown in Figure 8, the distance between at least two adjacent light-emitting elements 144 will change due to the external force EF. For example, one light-emitting element 144 shown in Figure 8 will move closer to another light-emitting element 144 on its right (i.e., the distance d2” between them will be less than the aforementioned distance d1) and away from another light-emitting element 144 not shown on its left (i.e., the distance between them will be greater than the aforementioned distance d1”). That is, the light-emitting element 144 in the middle of Figure 8 will be displaced SFT along the X direction.

[0046] In addition, when an external force EF is applied to the light-shielding sheet 160 of the sensing module 20, a downward pressure P is generated along the normal direction of the surface 142s of the flexible circuit board 142 (e.g., the opposite direction of direction Z). This downward pressure P presses the dimming sheet 120 through the light source structure 140A, causing the multiple optical microstructures 125 of the dimming sheet 120 to deform (as shown in FIG8). When the light L passes through the deformed optical microstructure 125, its light path will change, thereby affecting the light pattern and light intensity distribution when the light L is transmitted to the photosensitive circuit board 100. In this embodiment, the deformation of the optical microstructure 125 is generated by the downward pressure P directly pressing the light-emitting surface 144es of the light-emitting element 144 onto the optical microstructure 125, but it is not limited to this.

[0047] When the sensing module 20 is subjected to an external force EF, the magnitude of the downward pressure P applied to the sensing module 20 along the normal direction of the surface 142s by the change in the light pattern distribution can be obtained, and the direction of action of the horizontal shear force (or lateral force) component in the external force EF can be obtained by detecting the position of the light pattern peak and determining the moving direction of the light-emitting element 144. On the other hand, the stacked structure design of the aforementioned dimming plate 120, light source structure 140A and photosensitive circuit board 100 allows the sensing module 20 to meet the needs of large-area pressure sensing at a lower cost and obtain more reliable sensing results.

[0048] FIG9 is a cross-sectional schematic diagram of a sensing module according to a third embodiment of the present invention. FIG10 is a bottom view of the shear sensing layer of FIG9. FIG11 is a cross-sectional schematic diagram of the shear sensing layer of FIG10. FIG11 corresponds to section line A-A' in FIG10. FIG12 is a bottom view of the shear sensing layer of FIG9 under external force. FIG13 is a cross-sectional schematic diagram of the shear sensing layer of FIG10 under external force. FIG13 corresponds to section line A-A' in FIG12.

[0049] Referring to Figures 9, 10, and 11, in this embodiment, the sensing module 30 replaces the plurality of scattering microstructures 145 in Figure 1 with a shear force sensing layer 150. That is, the light source structure 140B in this embodiment does not have the plurality of scattering microstructures 145 in Figure 1. On the other hand, the light shield 160 in this embodiment does not have a reflective layer 165 as shown in Figure 1 on the side of the substrate 161 facing the light source structure 140B.

[0050] For example, the shear force sensing layer 150 may be disposed between the light-shielding sheet 160 and the light source structure 140B, and includes a matrix 151, a conductive block 153, and a plurality of conductive polymer patterns connecting the conductive block 153. The conductive block 153 and the plurality of conductive polymer patterns are covered by the matrix 151. The material of the matrix 151 may include a non-conductive flexible polymer material. The material of the conductive block 153 may include copper or other suitable highly conductive materials, such as graphite. In this embodiment, conductive polymer patterns 155a (first conductive polymer pattern) and 155c (third conductive polymer pattern) may be respectively provided on opposite sides of the conductive block 153 along direction X (first direction), and conductive polymer patterns 155b (second conductive polymer pattern) and 155d (fourth conductive polymer pattern) may be respectively provided on opposite sides of the conductive block 153 along direction Y (second direction).

[0051] Each of these conductive polymer patterns includes an elastic polymer pattern 152 and a plurality of conductive particles 154 dispersed within the elastic polymer pattern 152. The material of the elastic polymer pattern may include a flexible polymer material, while the material of the conductive particles 154 may include nano-silver, nano-carbon nanotubes, etc. It should be noted that each conductive polymer pattern has a first end connected to the conductive block 153 and a second end connected to the wire WR. By measuring the resistance change between the first end and the second end of the conductive polymer pattern, the shear force (or lateral force) component generated by the external force on the sensing module 30 can be sensed. That is, the conductive polymer pattern in this embodiment is designed to be made of a piezoresistive sensing material. In this embodiment, the conductive block 153, conductive polymer pattern 155a, conductive polymer pattern 155b, conductive polymer pattern 155c, and conductive polymer pattern 155d can constitute a sensing unit of the shear force sensing layer 150, and the shear force sensing layer 150 may be provided with a plurality of the aforementioned sensing units.

[0052] Referring to Figures 9, 12, and 13, for example, when an external force EF is applied to the sensing module 30, the conductive block 153 of the shear force sensing layer 150 will be displaced (SFT) in the X direction due to the horizontal shear force generated by the external force EF in the X direction. Simultaneously, the length of the conductive polymer pattern 155a on one side of the conductive block 153 along the X direction will increase due to the stretching of the conductive block 153, while the length of the conductive polymer pattern 155c on the other side of the conductive block 153 along the X direction will decrease due to the compression of the conductive block 153. Therefore, the resistance between the first and second ends of the conductive polymer pattern 155a will increase due to the decrease in the distribution density of the conductive particles 154, while the resistance between the first and second ends of the conductive polymer pattern 155c will decrease due to the increase in the distribution density of the conductive particles 154.

[0053] In other words, the shear force sensing layer 150 in this embodiment obtains the direction and intensity of the horizontal shear force formed by the external force EF on the sensing module 30 by detecting the resistance change between the first and second ends of the conductive polymer pattern. Since the sensing principle of the conductive polymer patterns 155b and 155d of the shear force sensing layer 150 for the horizontal shear force along the Y direction is similar to that of the conductive polymer patterns 155a and 155c of the shear force sensing layer 150 for the horizontal shear force along the X direction, it will not be described again here. It should be noted that the number and structural shape of the conductive polymer patterns connected to the conductive block 153 can be adjusted according to actual application requirements, and the present invention does not impose any limitations.

[0054] In another embodiment not shown, the aforementioned conductive polymer pattern may also be used to replace the optical microstructure 125 on the dimming sheet 120 to sense the downward pressure P generated by the external force EF as shown in FIG5.

[0055] FIG14 is a cross-sectional schematic diagram of a sensing module according to a fourth embodiment of the present invention. Referring to FIG14, compared with the sensing module 10 of FIG1, the sensing module 10A of this embodiment may further include a filter layer 180 disposed between the photosensitive circuit board 100 and the light source structure 140. More specifically, the filter layer 180 may be disposed between the dimming sheet 120 and the photosensitive circuit board 100, but is not limited thereto. In other embodiments, the filter layer 180 may also be disposed between the light source structure 140 and the dimming sheet 120. By disposing of the filter layer 180, light of non-intended wavelengths can be blocked from entering the photosensitive element 105, thereby improving the signal-to-noise ratio of the photosensitive circuit board 100.

[0056] In summary, in a sensing module according to an embodiment of the present invention, a dimming sheet located between the light source structure and the photosensitive circuit board is provided with multiple optical microstructures, and these optical microstructures are arranged facing the light source structure. An external force applied to the light-shielding sheet can press the dimming sheet through the light source structure, causing deformation of its optical microstructures, thereby changing the light pattern and intensity distribution detected on the photosensitive circuit board. The magnitude of the pressure applied to the sensing module by the degree of light intensity change is obtained, and the direction and magnitude of the lateral force are determined by detecting the peak position of the light pattern. Through the aforementioned stacked structure design of the dimming sheet, light source structure, and photosensitive circuit board, the sensing module can meet the needs of large-area sensing at a lower cost and obtain more reliable sensing results.

[0057] The above description is merely a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. Any simple equivalent changes and modifications made in accordance with the claims and description of the invention are still within the scope of the patent. Furthermore, any embodiment or claim of the present invention does not need to achieve all the objectives, advantages, or features disclosed in the invention. In addition, the abstract and headings are merely for assisting in patent document searches and are not intended to limit the scope of the invention. Furthermore, the terms "first," "second," etc., mentioned in this specification or claims are only used to name elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements. [Simplified Explanation of the Diagram]

[0021] FIG1 is a cross-sectional schematic diagram of a sensing module according to a first embodiment of the present invention. FIG2 is an enlarged schematic diagram of the light source structure of FIG1. ​​FIG3 is a top view of the light source structure of FIG1. ​​FIG4 is a top view of the dimming plate of FIG1. ​​FIG5 is a cross-sectional schematic diagram of the sensing module of FIG1 under external force. FIG6 is a light pattern distribution diagram measured by the photosensitive circuit board of FIG1 when the sensing module is not under external force and under external force. FIG7 is a cross-sectional schematic diagram of a sensing module according to a second embodiment of the present invention. FIG8 is a cross-sectional schematic diagram of the sensing module of FIG7 under external force. FIG9 is a cross-sectional schematic diagram of a sensing module according to a third embodiment of the present invention. FIG10 is a bottom view of the shear sensing layer of FIG9. FIG11 is a cross-sectional schematic diagram of the shear sensing layer of FIG10. FIG12 is a bottom view of the shear sensing layer of FIG9 under external force. FIG13 is a cross-sectional schematic diagram of the shear sensing layer of FIG10 under external force. FIG14 is a cross-sectional schematic diagram of a sensing module according to a fourth embodiment of the present invention.

Claims

1. A sensing module, comprising: A photosensitive circuit board is provided with multiple photosensitive elements; a light source structure is disposed on one side of a photosensitive surface of each of the photosensitive elements; a dimming plate is disposed between the photosensitive circuit board and the light source structure, and includes a substrate and multiple optical microstructures, the optical microstructures being disposed on a substrate surface of the substrate facing the light source structure, and each optical microstructure being a flexible quadrangular pyramid adapted to deform under external force; and a light shield is disposed on the side of the light source structure opposite to the dimming plate, wherein the light shield is adapted to be subjected to an external force and pressed by the light source structure to deform the optical microstructures, wherein the light shield has light-blocking properties to prevent external light from entering the sensing module, and the light shield has a reflective layer on the side facing the light source structure.

2. The sensing module as claimed in claim 1, wherein the optical microstructures are spaced apart along at least two directions parallel to the surface of the substrate and intersecting each other.

3. The sensing module as described in claim 1, wherein the light source structure includes: A flexible light guide plate has a light incident surface and a first surface and a second surface connected to the light incident surface and opposite to each other, wherein the first surface faces the dimming sheet and the second surface is provided with a plurality of scattering microstructures; and a light source is disposed on one side of the light incident surface of the flexible light guide plate.

4. The sensing module as claimed in claim 3, wherein the scattering microstructures are spaced apart along at least two intersecting directions on the second surface, and the distance between at least two adjacent scattering microstructures is adapted to be changed by the external force.

5. The sensing module as claimed in claim 3, wherein the scattering microstructures include a matrix and a plurality of scattering particles or a plurality of wavelength conversion particles dispersed within the matrix.

6. The sensing module as described in claim 1, wherein the light source structure comprises: A flexible circuit board; And multiple light-emitting elements are arranged at intervals along at least two intersecting directions on the side of the flexible circuit board facing the dimming sheet.

7. The sensing module as claimed in claim 6, wherein the distance between at least two adjacent light-emitting elements is adapted to be changed by the external force.

8. The sensing module as described in claim 1 further includes: A filter layer is disposed between the photosensitive circuit board and the light source structure.

9. The sensing module as described in claim 1, further comprising: A shear force sensing layer is disposed between the light shield and the light source structure. The shear force sensing layer includes a conductive block and a first conductive polymer pattern and a second conductive polymer pattern connecting the conductive block. The first conductive polymer pattern is disposed on one side of the conductive block along a first direction, and the second conductive polymer pattern is disposed on one side of the conductive block along a second direction, and the first direction intersects the second direction.

10. The sensing module as claimed in claim 9, wherein the shear force sensing layer further includes a third conductive polymer pattern and a fourth conductive polymer pattern connecting the conductive block, the third conductive polymer pattern being disposed on the other side of the conductive block along the first direction, and the fourth conductive polymer pattern being disposed on the other side of the conductive block along the second direction.

11. The sensing module as claimed in claim 9, wherein the first conductive polymer pattern and the second conductive polymer pattern each include an elastic polymer pattern and a plurality of conductive particles dispersed within the elastic polymer pattern.

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