Substrate transfer apparatus and substrate processing apparatus

Abstract

The objective of this invention is to provide a substrate transport apparatus that can grasp the shape of a substrate without causing adverse conditions due to the shape of the substrate. In addition to the substrate-lifting hand 11a, the substrate transport apparatus of this invention includes a sensor holding member 21 equipped with a first sensor 41 and a second sensor 42. When the first substrate in the carrier is to be transported, according to this invention, firstly, the sensor holding member 21 is inserted between the first substrate and the second substrate. Then, the distance between the first substrate and the second substrate is measured. When the lifting hand 11a is to be inserted between the first substrate and the second substrate, the insertion height of the lifting hand 11a is adjusted such that the gap between the lifting hand 11a and the first substrate and the gap between the lifting hand 11a and the second substrate are both above a predetermined value.

Description

Technical Field

[0001] The present invention relates to a substrate conveying device and a substrate processing device for conveying various substrates such as semiconductor substrates, FPD (Flat Panel Display) substrates for liquid crystal display or organic EL (Electroluminescence) display devices, glass substrates for masks, substrates for optical disks, etc. Prior Art

[0002] The substrate processing device described in Patent Document 1 includes: a loading table on which a carrier capable of stacking and storing substrates with a gap is placed; and a substrate transfer device that transfers the substrate from the carrier. The substrate processing device of Patent Document 1 includes a positioning sensor that detects how the substrates are stacked in the carrier. The positioning sensor generates positioning data for reference when the substrate is transferred from the carrier. [Prior Technical Literature] [Patent Document]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2016-72384 Summary of the invention

[0004] [Problems to be solved by the invention]

[0005] The previous substrate transport device can only know the distribution of substrates in the carrier, that is, which part of the carrier the substrate enters, but cannot know the width of the gap between the upper and lower substrates caused by the shape of the substrate, specifically the thickness or warping of the substrate. If the substrate is transported without considering the shape of the substrate, the substrate transport hand will contact the substrate.

[0006] The present invention is completed in view of this situation, and the purpose of the present invention is to provide a substrate conveying device that can grasp the shape of the substrate without causing any adverse conditions caused by the shape of the substrate. [Technical means to solve the problem]

[0007] The present invention adopts the following structure to solve the above-mentioned problems. That is, the substrate transfer device of the present invention is characterized in that it comprises: a hand, which receives a plurality of substrates in a horizontal position at predetermined intervals in a vertical direction and has an opening for taking out and storing the substrates on one side, and enters between upper and lower adjacent substrates to hold and transfer the substrates one by one; A sensor holding member, which is a member inserted between upper and lower adjacent substrates and includes a first sensor for measuring the distance from the upper substrate and a second sensor for measuring the distance from the lower substrate; and A control unit controls the hand and the sensor holding member to move forward and backward from the opening of the carrier toward the upper and lower adjacent substrates; and The aforementioned control unit The sensor holding member is placed between a first substrate to be conveyed and a second substrate located below the first substrate, and the minimum distance between the substrates is measured based on the sum of a first minimum distance between the substrates at a first measurement position where the first sensor is closest to the first substrate and a second minimum distance between the substrates at a second measurement position where the second sensor is closest to the second substrate. When the hand is to enter between the first substrate and the second substrate, the entry height of the hand is adjusted according to the minimum distance between the substrates in such a way that the distance from the hand to the first substrate and the distance from the hand to the second substrate are both greater than a specified value.

[0008] [Function and Effect] The above-mentioned substrate transport device includes, in addition to the hand for transporting the substrate, a sensor holding member having a first sensor and a second sensor. When the first substrate in the carrier is to be transported, according to the present invention, first, the sensor holding member enters between the first substrate and the second substrate. Then, the distance between the first substrate and the second substrate is measured. Since the placement position of the substrate in the carrier is fixed, the distance between the first substrate and the second substrate should be constant. However, in reality, the first substrate and the second substrate are not necessarily flat. Therefore, when the distance between the first substrate and the second substrate is actually measured, the minimum distance between the substrates may be greater or less than the assumed value. In addition, the middle position between the substrates may be higher or lower than assumed.

[0009] According to the present invention, when the hand is to enter between the first substrate and the second substrate, the entry height of the hand is adjusted so that the gap between the hand and the first substrate and the gap between the hand and the second substrate are both greater than a predetermined value. With such a configuration, since the hand is too close to the first substrate, the hand does not contact anything other than the edge of the first substrate. Similarly, since the hand is too close to the second substrate, the hand does not contact anything other than the edge of the second substrate.

[0010] As the substrate transport device mentioned above, preferably The front end of the hand includes a guide member for the end of the substrate to abut against; and The front end portion of the sensor holding member includes the first sensor and the second sensor; The thickness of the front end portion of the sensor holding member in the height direction is smaller than the thickness of the front end portion of the hand in the height direction.

[0011] [Function and Effect] In the above structure, the thickness of the front end of the sensor holding member composed of the first sensor and the second sensor is smaller than the thickness of the front end of the hand composed of the guide member. If it is constructed in this way, the sensor holding member can also enter between substrates that the hand cannot enter, and the minimum distance between the substrates can be accurately measured.

[0012] As the substrate transport device mentioned above, preferably The first sensor measures the distance while moving from the end of the first substrate located at the opening of the carrier toward the depth of the carrier; and The second sensor moves from the end of the second substrate located in front of the opening of the carrier toward the depth of the carrier while measuring the distance; The control unit adjusts the entry height of the hand at the first measuring position where the first substrate is closest to the first sensor and at the second measuring position where the second substrate is closest to the second sensor, in such a way that the distance from the hand to the first substrate and the distance from the hand to the second substrate are both greater than a specified value.

[0013] [Function and Effect] In the above structure, at the position where the first substrate and the second substrate are closest, the hand's entry height is adjusted in such a way that the gap between the hand and the first substrate and the gap between the hand and the second substrate are both greater than the specified value. If it is constructed in this way, the hand does not contact the substrate at the position where the first substrate and the second substrate are closest.

[0014] As the substrate transport device mentioned above, preferably The control unit adjusts the entry height of the hand in such a manner that the distance from the hand to the first substrate at the first measuring position and the distance from the hand to the second substrate at the second measuring position are the same.

[0015] [Function and Effect] In the above structure, the height of the hand is adjusted in such a way that the gap between the hand and the first substrate and the gap between the hand and the second substrate are the same. If it is structured in this way, a sufficient distance can be ensured not only between the hand and the first substrate but also between the hand and the second substrate, so that the substrate can be transported, so the hand can transport the substrate more reliably.

[0016] As the substrate transport device mentioned above, preferably The sensor holding member does not transport the substrate.

[0017] [Function and Effect] In the above-mentioned structure, the sensor holding member does not transport the substrate. If it is structured in this way, it is not necessary to set a guide member for holding the substrate on the sensor holding member, and it is easy to enter between the substrates.

[0018] As the substrate transport device mentioned above, preferably In the case where the distance between the first substrate and the second substrate is short and the distance from the hand to the first substrate at the first measuring position and the distance from the hand to the second substrate at the second measuring position cannot be simultaneously set to be greater than the specified value, the hand is not allowed to enter between the first substrate and the second substrate.

[0019] [Function and Effect] In the above-mentioned structure, when the distance between the first substrate and the second substrate is short and the gap between the hand and the first substrate and the gap between the hand and the second substrate cannot be set to be greater than the specified value at the same time, it is determined that the first substrate cannot be conveyed, and the hand is not allowed to enter between the first substrate and the second substrate. With such a structure, it is possible to more reliably suppress contact between the hand and the substrate other than the edge.

[0020] As the substrate transport device mentioned above, preferably The upper surface of the sensor holding member is located above the lower end of the first sensor; and The lower surface of the sensor holding member is located below the upper end of the second sensor.

[0021] [Function and Effect] In the above-mentioned structure, the protrusion amount of the first sensor and the second sensor can be reduced by the thickness of the sensor holding member. Therefore, the height of the sensor holding member can be suppressed as much as possible, so the possibility that the sensor holding member cannot enter between the substrates is reduced.

[0022] As the substrate transport device mentioned above, preferably The hand comprises: a first holding body for holding one end of the substrate, and a second holding body for holding the other end of the substrate; and The sensor holding member comprises at least two sensor groups consisting of the first sensor and the second sensor; The first sensor group measures the distance between the first substrate and the second substrate at the entry position of the first holding body. The second sensor group measures the distance between the first substrate and the second substrate at the entry position of the second holding body.

[0023] [Function and Effect] In the above-mentioned structure, the first sensor group for measuring the minimum distance between substrates at the position of the first holding body of the hand is provided on the sensor holding member, and the second sensor group for measuring the minimum distance between substrates at the position of the second holding body of the hand is provided on the sensor holding member. This can more reliably prevent the hand from contacting any part other than the edge of the substrate.

[0024] As the substrate transport device mentioned above, preferably The sensor holding member includes: a first protrusion extending corresponding to the first holding body, and a second protrusion extending corresponding to the second holding body.

[0025] [Function and Effect] In the above-mentioned structure, the sensor holding member includes: a first protrusion extending along the first direction corresponding to the first holding body, and a second protrusion extending along the first direction corresponding to the second holding body. By making the shape of the sensor holding member imitate the hand in this way, information on the distance required for conveying can be obtained more accurately.

[0026] As the substrate transport device mentioned above, preferably The sensor holding member includes the sensor group at the front end of the first protrusion and includes the sensor group at the front end of the second protrusion.

[0027] [Function and Effect] In the above-mentioned structure, the sensor holding member includes a sensor group at the front end of the first protrusion and a sensor group at the front end of the second protrusion. If it is constructed in this way, the minimum distance between substrates in the deep part of the carrier can be measured by slightly moving the sensor holding member.

[0028] As the substrate transport device mentioned above, preferably The sensor holding member The first sensor and the second sensor are included at the same position of the first protrusion. The first sensor and the second sensor are included at the same position of the second protrusion.

[0029] [Function and Effect] In the above-mentioned structure, the sensor holding member includes the first sensor and the second sensor at the same position in the first direction of the first protrusion. In addition, the sensor holding member includes the first sensor and the second sensor at the same position in the second protrusion. With such a structure, the substrate (first substrate) on the upper side of the sensor holding member and the substrate (second substrate) on the lower side of the sensor holding member can be measured under the same conditions, so the minimum distance between the substrates can be calculated more accurately.

[0030] As the substrate transport device mentioned above, preferably The control unit prevents the hand from entering between the first substrate and the second substrate when the distance between the first substrate and the second substrate is short and the sensor holding member cannot enter between the first substrate and the second substrate.

[0031] [Function and Effect] In the above-mentioned structure, when the distance between the first substrate and the second substrate is short and the sensor holding member cannot enter between the first substrate and the second substrate, it is determined that the first substrate cannot be transported, and the hand is not allowed to enter between the first substrate and the second substrate. With such a structure, it is possible to more reliably prevent the hand from contacting parts other than the edge of the substrate.

[0032] As the substrate transport device mentioned above, preferably After the second substrate is transported from the carrier, if the first substrate is left on the carrier, the control unit causes the hand to transport the first substrate.

[0033] [Function and Effect] In the above structure, after the second substrate is transported from the carrier, if the first substrate previously determined to be untransportable is left on the carrier, the hand transports the first substrate. With such a structure, the first substrate will not be left on the carrier in the end.

[0034] As the substrate transport device mentioned above, preferably The aforementioned control unit causing the sensor holding member to enter between the first substrate and the second substrate at a first speed, The hand is caused to enter between the first substrate and the second substrate at a second speed which is faster than the first speed.

[0035] [Function and Effect] In the above-mentioned structure, since the sensor holding member enters between the substrates at a faster speed than the hand, the substrate transfer process is accelerated.

[0036] As the substrate transport device mentioned above, preferably The sensor holding component is located at the same position as the hand before entering between the substrates.

[0037] [Function and Effect] In the above-mentioned structure, the sensor holding member is located at the same position as the hand before entering between the substrates. If it is constructed in this way, the present invention can be realized by using a single robot to distinguish between the hand and the sensor holding member.

[0038] As the substrate transport device mentioned above, preferably The hand also serves as the sensor holding member; and The first sensor and the second sensor are installed on the hand.

[0039] [Function and Effect] In the above structure, the sensor group is arranged at the front end of the hand body closer to the guide member. If it is constructed in this way, the sensor holding member can be omitted to provide a substrate conveying device with a simple structure.

[0040] In addition to the inventions described above, this specification also discloses the following inventions.

[0041] That is, the substrate transport device of the present invention is characterized by comprising: A first hand for high-speed transport, which transports substrates one by one from a carrier that stores a plurality of substrates in a horizontal position at predetermined intervals in a vertical direction; A second hand for low-speed transport, which transports substrates one by one from a carrier that stores a plurality of substrates in a horizontal position at predetermined intervals in a vertical direction; and The control unit controls the first hand or the second hand to move forward and backward relative to the substrate along the first direction.

[0042] [Function and Effect] The substrate transport device described above has two types of hands, a first hand for high-speed transport and a second hand for low-speed transport, and includes a control unit that distinguishes between the first hand and the second hand for transporting substrates. By configuring in this way, when the shape of the substrate is close to flat, the first hand can be used to transport at high speed, and when the substrate is greatly warped, the second hand can be used to transport at low speed. That is, according to the substrate transport device of the present invention, the substrate can be transported using a method that is more based on the actual situation of the substrate stored in the carrier.

[0043] As the substrate transport device mentioned above, preferably The front end of the first hand includes a first guide member for abutting the end of the substrate; and The front end portion of the second hand includes a second guide member that abuts the end portion of the substrate; The thickness of the front end portion of the second hand in the height direction is smaller than the thickness of the front end portion of the first hand in the height direction.

[0044] [Function and Effect] According to the above structure, the thickness of the front end of the second hand in the height direction is smaller than the thickness of the front end of the first hand in the height direction. With such a structure, even if the warping of the substrate is large and the minimum distance between the substrates is short, the substrate to be transported can be transported more reliably by using the second hand.

[0045] As the substrate transport device mentioned above, preferably The first hand comprises: a first holding body extending along a first direction for holding one end of the substrate, and a second holding body extending along the first direction for holding the other end of the substrate; and The second hand comprises: a first blade extending along the first direction for holding one end of the substrate, and a second blade extending along the first direction for holding the other end of the substrate; The space between the first retaining body and the second retaining body is smaller than the space between the first blade and the second blade.

[0046] [Function and Effect] According to the above structure, the space between the first holding body and the second holding body of the first hand is smaller than the space between the first blade and the second blade of the second hand. With such a structure, the first hand can hold the substrate more securely, so the substrate can be transported at a high speed. On the other hand, the second hand can securely hold the warped substrate between the first blade and the second blade.

[0047] As the substrate transport device mentioned above, preferably The first hand has a push rod for holding the substrate; and The second hand does not have the putter.

[0048] [Function and Effect] According to the above structure, the first hand has a push rod for holding the substrate. Thus, the first hand can hold the substrate securely and transport it at high speed. In addition, the second hand does not have a push rod. Thus, the device structure can be simplified and the thickness of the second hand in the height direction can be reduced. [Effects of the Invention]

[0049] The substrate transporting device of the present invention does not cause any adverse conditions due to the shape of the substrate. Simple diagram description

[0050] FIG. 1 is a top view illustrating the overall structure of a substrate processing apparatus according to Embodiment 1. FIG. FIG. 2 is a front view illustrating the structure of the carrier of Example 1. FIG. FIG. 3 is a schematic diagram illustrating the structure of the carrier robot of Example 1. FIG. FIG. 4( a ) is a schematic diagram illustrating the sensor holding member and the hand of Example 1. FIG. FIG. 4( b ) is a schematic diagram illustrating the sensor holding member and the hand of Example 1. FIG. FIG. 5 is a top view illustrating the obtaining hand and the returning hand of Example 1. FIG. FIG. 6 is a top view illustrating the sensor holding member of Embodiment 1. FIG. FIG. 7A is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 7B is a schematic diagram illustrating the action of the carrier robot of Example 1. FIG. FIG. 7C is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 8A is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 8B is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 8C is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 9A is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 9B is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 10A is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 10B is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 10C is a schematic diagram illustrating the action of the carrier robot of Example 1. FIG. FIG. 11A is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 11B is a schematic diagram illustrating the movement of the carrier robot of Example 1. FIG. FIG. 12 is a flow chart illustrating the operation of the substrate processing apparatus of the first embodiment. FIG. 13 is a top view illustrating the operation of the substrate processing apparatus of the first embodiment. FIG. 14 is a schematic diagram illustrating the structure of the carrier robot of the second embodiment. FIG. 15( a ) is a schematic diagram illustrating the sensor holding member and the hand of the second embodiment. FIG. 15( b ) is a schematic diagram illustrating the sensor holding member and the hand of the second embodiment. FIG. 16 is a top view illustrating the first obtaining hand and the first returning hand of the second embodiment. FIG. 17 is a top view illustrating the second acquisition hand and the second return hand of the second embodiment. FIG. 18 is a flow chart illustrating the operation of the substrate processing apparatus of the second embodiment. FIG. 19 is a schematic diagram illustrating the structure of a variation 1 of the present invention. FIG. 20 is a schematic diagram illustrating the structure of a variation 1 of the present invention. FIG. 21 is a schematic diagram illustrating the structure of a variation 1 of the present invention. FIG. 22 is a schematic diagram illustrating the structure of a variation 1 of the present invention. Implementation

[0051] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The following embodiment is a substrate processing device equipped with a substrate transfer device of the present invention. The substrate transfer device of the present invention is equivalent to a carrier block of the substrate processing device of the embodiment. The carrier block has a carrier robot, which has a hand for transferring substrates and a sensor holding member for measuring the distance between substrates. [Example 1]

[0052] 1. Overall composition As shown in Fig. 1, the substrate processing apparatus 1 of this embodiment has a wafer handling machine 10, a carrier block 3, and a processing block 5. The substrate processing apparatus 1 of this embodiment is configured as follows: in single-wafer substrate processing, horizontal substrates W are taken from a carrier C one by one, and after the substrate processing is performed, the substrates W are returned to the carrier one by one.

[0053] In this specification, for convenience, the direction in which the carrier block 3 and the processing block 5 of the substrate processing device 1 are arranged is called the "front-rear direction X". The front-rear direction X extends horizontally. The direction from the processing block 5 of the substrate processing device 1 to the carrier block 3 in the front-rear direction X is called the "front". The direction on the opposite side of the front is called the "rear". The direction extending horizontally orthogonal to the front-rear direction X is called the "width direction Y". One direction of the "width direction Y" is conveniently called the "right", and the other direction is conveniently called the "left". The direction (height direction) orthogonal to the front-rear direction X and the width direction Y is conveniently called the "vertical direction Z". In each figure, the front, rear, right, left, top, and bottom are appropriately displayed for reference.

[0054] The wafer handling machine 10 is a carrier mounting frame for mounting the carriers C. A plurality of wafer handling machines 10 are arranged in a row along the width direction Y, and can mount the carriers C one by one.

[0055] The carrier C stores a plurality of substrates W in a horizontal posture at a predetermined interval along the vertical direction Z. In addition, an opening for taking out and storing substrates is provided on one side of the carrier C. A plurality of substrates W (for example, 25) are stored in a horizontal posture in a stacked manner at a predetermined interval in one carrier C. FIG. 2 is a cross-sectional view illustrating the structure of the carrier C. In the carrier C, a comb-shaped member 7 having a plurality of protrusions for mounting substrates W is provided at both ends of the carrier shell. The protrusions of the comb-shaped member 7 are formed to mount the end of the substrate W. The protrusions extend in the front-to-back direction X. The protrusions are arranged at intervals of 1 cm. As the carrier C, for example, there is a closed FOUP (Front Opening Unify Pod). In the present invention, an open container can be used as the carrier C.

[0056] The carrier block 3 is equivalent to the substrate transport device of the present invention. The carrier block 3 is a rectangular shape extending in the width direction Y. The carrier block 3 is provided with a carrier robot IR. The carrier robot IR can move horizontally in the width direction Y. The carrier robot IR has a hand that can hold and transport the substrate W. The hand is a multi-joint arm that can perform rotational movement, lifting movement, and forward and backward movement. The carrier robot IR can access the carrier C on the wafer handling machine 10 and the path 24 set in front of the processing block 5. The carrier robot IR can perform two actions: an action of obtaining substrates W in a horizontal posture from the carrier C piece by piece and placing them on the path 24, and an action of obtaining substrates W in a horizontal posture placed on the path 24 piece by piece and returning them to the carrier C. The unprocessed substrates W held on the carrier C are transported to the path 24 by the carrier robot IR. Then, the processed substrates W are placed on the path 24 and returned to the carrier C by the carrier robot IR.

[0057] The processing block 5 is equivalent to the processing unit of the present invention. The processing block 5 is a structure for performing a predetermined process on the substrate W. The processing block 5 has a plurality of single-wafer processing chambers 5a arranged. That is, three single-wafer processing chambers 5a are arranged in each of the middle layer area, the upper layer area, and the lower layer area to form a stacked body. Two stacked bodies are arranged front and back on the right side of the processing block 5. Similarly, two stacked bodies are arranged front and back on the left side of the processing block 5. Therefore, 12 single-wafer processing chambers 5a are mounted on the processing block 5. In the central part of the processing block 5, a substrate conveying area extending in the front-to-back direction X is provided. The central robot CR can reciprocate in the substrate conveying area, and can obtain the substrates W in a horizontal posture from the path 24 one by one and convey them to any one of the single-wafer processing chambers 5a. Then, the central robot CR can obtain the substrates W in a horizontal posture maintained by the single-wafer processing chamber 5a one by one and return to the path 24. In this way, the central robot CR can access each of the single-wafer processing chambers 5 a and the path 24 .

[0058] The substrate processing performed in the single-wafer processing chamber 5a includes, for example, substrate cleaning processing. The substrate processing apparatus 1 of this example can be configured to perform various substrate processing using chemical solutions in addition to substrate cleaning processing.

[0059] 2. Composition of the carrier robot FIG3 schematically shows the front end portion of the carrier robot IR related to substrate holding. The carrier robot IR includes a receiving hand 11a, a returning hand 11b, and a sensor holding member 21. The returning hand 11b, the receiving hand 11a, and the sensor holding member 21 are held by the arm 12 in a stacked state along the vertical direction Z. The arm 12 can move the returning hand 11b, the receiving hand 11a, and the sensor holding member 21 forward and backward in the front-back direction X individually. Before entering between the substrates W, the sensor holding member 21 is set at the same height position as the receiving hand 11a and the returning hand 11b in the front-back direction X. In the configuration of FIG3, the returning hand 11b, the receiving hand 11a, and the sensor holding member 21 are arranged in order from top to bottom, but the order of arrangement of each member can be appropriately changed.

[0060] The acquisition hand 11a is equivalent to the hand of the present invention. The acquisition hand 11a holds unprocessed substrates W from the carrier C one by one and transports them to the path 24 by entering between the upper and lower adjacent substrates W. The acquisition hand 11a has a hand body 31 and a guide member 32. The hand body 31 is formed in a flat shape so that it can enter between the substrates. The guide member 32 is located at the front end of the acquisition hand 11a and is a structure for making the end of the substrate W abut. That is, the guide member 32 is a protruding piece provided at the front end of the hand body 31 and is a member that contacts the substrate W. The guide member 32 is provided on the upper surface of the hand body 31. Therefore, the guide member 32 is a structure for holding the upper substrate W from the lower side. The guide member 32 has a thick wall portion and a thin wall portion. Therefore, the thickness of the guide member 32 in the height direction is partially different. The wall portion of the thick wall portion of the guide member 32 facing the base end of the acquisition hand 11a can be contacted by the end (inclined portion) of the substrate W. The flat portion of the thin wall portion of the guide member 32 facing upward can be contacted by the peripheral portion of the lower surface of the substrate. The guide member is also provided at the base end of the hand body 31 (omitted from illustration in FIG. 3 ). The guide member forms a contact portion with the substrate W in the acquisition hand 11a.

[0061] The returning hand 11b is constructed in the same manner as the acquiring hand 11a described above. That is, the returning hand 11b has a hand body 31 and a guide member 32. The structure in which the guide member 32 is provided at the front end and the base of the hand body 31 in the returning hand 11b, and the structure in which the guide member 32 has a thick wall portion and a thin wall portion, are the same as the structure in the acquiring hand 11a. The returning hand 11b of this example is provided for conveying the cleaned substrate W after the cleaning process. By distinguishing between the use of the hand in the forward path and the return path of the reciprocating motion of the substrate W, it is not necessary to use the hand that holds the substrate W before the cleaning process to hold the substrate W after the cleaning process. Therefore, by providing the returning hand 11b, the cleanliness of the substrate W after the cleaning process is maintained.

[0062] The sensor holding member 21 in FIG. 3 is a member that enters between upper and lower adjacent substrates W. The sensor holding member 21 holds: a first sensor 41 for measuring the distance between the substrate W on the upper side, and a second sensor 42 for measuring the distance between the substrate W on the lower side. The sensor holding member 21 has a sensor group 43 composed of a first sensor 41 and a second sensor 42. The sensor holding member 21 is formed in a flat shape so as to be able to enter between substrates. The first sensor 41 and the second sensor 42 are located at the front end of the sensor holding member 21. The sensor holding member 21 does not transport the substrate W. The sensor holding member 21 and the first sensor 41 and the second sensor 42 do not contact the substrate W. The holding member body 23 is a member that supports the first sensor 41 and the second sensor 42. The length of the first sensor 41 protruding relative to the holding member body 23 is equal to the length of the second sensor 42 protruding relative to the holding member body 23.

[0063] The second sensor 42 is provided below the first sensor 41. Therefore, the first sensor 41 and the second sensor 42 are stacked in the vertical direction Z to form a sensor group 43. The upper surface of the sensor holding member 21 is located above the lower end of the first sensor 41. That is, a portion of the first sensor 41 is buried in the sensor holding member 21. Similarly, the lower surface of the sensor holding member 21 is located below the upper end of the second sensor 42. That is, a portion of the second sensor 42 is buried in the sensor holding member 21. The sensor holding member 21 is provided with a through hole for inserting the sensor group 43, and the sensor group 43 is held by the sensor holding member 21 via the through hole. By configuring in this way, the protrusion amount of the first sensor 41 and the second sensor 42 relative to the sensor holding member 21 can be minimized.

[0064] Specifically, the first sensor 41 and the second sensor 42 can be ultrasonic distance sensors (distance measuring sensors). The first sensor 41 emits ultrasonic waves upward from the sensor holding member 21, and the second sensor 42 emits ultrasonic waves downward from the sensor holding member 21. The first sensor 41 receives the ultrasonic waves reflected by the upper substrate W and returned to the first sensor 41, and measures the distance from the sensor holding member 21 to the upper substrate W. The second sensor 42 receives the ultrasonic waves reflected by the lower substrate W and returned to the second sensor 42, and measures the distance from the sensor holding member 21 to the lower substrate W. Therefore, based on the outputs of the first sensor 41 and the second sensor 42, the distance from the substrate W above the sensor holding member 21 to the substrate W below the sensor holding member 21 can be detected.

[0065] FIG. 4(a) shows the front end of the acquisition hand 11a and the return hand 11b, and FIG. 4(b) shows the front end of the sensor holding member 21. The thickness A1 of the front end of the acquisition hand 11a and the return hand 11b in the vertical direction Z is the distance from the upper end of the thick wall portion of the guide member 32 to the lower end of the hand body 31. On the other hand, the thickness A2 of the front end of the sensor holding member 21 in the vertical direction Z is the distance from the upper end of the first sensor 41 to the lower end of the second sensor 42. Thus, the thickness of the front end of the sensor holding member 21 in the height direction is smaller than the thickness of the front end of the acquisition hand 11a and the return hand 11b in the height direction. The sensor holding member 21 is provided for the purpose of determining whether the acquisition hand 11a and the return hand 11b can enter between the substrates. Therefore, the sensor holding member 21 may sometimes enter the gap between the substrates W that the acquisition hand 11a and the return hand 11b cannot enter. By reducing the thickness of the sensor holding member 21, the sensor holding member 21 can also enter a smaller gap. On the other hand, the thickness of the acquisition hand 11a is sufficiently increased. Therefore, the acquisition hand 11a and the return hand 11b can reliably transport the substrate W.

[0066] FIG5 is a top view for explaining the acquisition hand 11a and the return hand 11b. The acquisition hand 11a and the return hand 11b include a base 36, and a first holding body 33a and a second holding body 33b formed by branching the base 36. The first holding body 33a is a member extending along the front-back direction X for holding one end of the substrate W, and the second holding body 33b is a member extending along the front-back direction X for holding the other end of the substrate W. The guide member 32 is provided at the front end of the first holding body 33a and the second holding body 33b.

[0067] The guide members 34 are provided at the bases of the first holding body 33a and the second holding body 33b, respectively. The guide members 34, like the guide members 32 described above, have a thick wall portion constituting a wall portion that can be contacted by the end portion (inclined portion) of the substrate W, and a thin wall portion constituting a flat portion that can be contacted by the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide member 34 is the same as the thickness of the thick wall portion of the guide member 32. The thickness of the thin wall portion of the guide member 34 is the same as the thickness of the thin wall portion of the guide member 32. The wall portions of the guide members 32 and 34 are arranged to belong to an imaginary circle that is slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W constituted by the thin wall portions of the guide members 32 and 34.

[0068] The push rod 35 is provided at the front end of the base 36, and can push the substrate W held by the guide members 32 and 34 in the forward direction. The push rod 35 can be moved in the rearward direction to be in the open state, and can be moved in the forward direction to be in the closed state. In order to hold the substrate W by the first holding body 33a and the second holding body 33b, first, the push rod 35 is set to the open state, and the substrate W is held by the guide members 32 and 34. Then, the push rod 35 is set to the closed state, and the substrate W is sandwiched by the guide members 32 and the push rod 35. In this way, the substrate W is held.

[0069] FIG6 is a top view for explaining the sensor holding member 21. The sensor holding member 21 includes a first protrusion 25a and a second protrusion 25b formed by branching a base 26. The first protrusion 25a and the second protrusion 25b are members extending in the front-back direction X. The sensor holding member 21 includes at least two sensor groups 43 consisting of a first sensor 41 and a second sensor 42. That is, the first sensor group 43a is provided at the front end of the first protrusion 25a. And, the second sensor group 43b is provided at the front end of the second protrusion 25b.

[0070] As can be seen from FIG. 5 and FIG. 6 , the sensor holding member 21 is configured to have the same structure as the acquisition hand 11a and the return hand 11b. That is, the sensor holding member 21 includes: a first protrusion 25a extending in the front-rear direction X corresponding to the first holding body 33a, and a second protrusion 25b extending in the front-rear direction corresponding to the second holding body 33b. Therefore, the position of the first protrusion 25a of the sensor holding member 21 is located at the same position in the width direction as the position of the first holding body 33a of the acquisition hand 11a and the return hand 11b. The first sensor group 43a of the first protrusion 25a measures the distance between the substrate W of the conveyance target at the entry position of the first holding body 33a and the substrate W below. Similarly, the position of the second protrusion 25b of the sensor holding member 21 is located at the same position in the width direction as the position of the second holding body 33b of the acquisition hand 11a and the return hand 11b. The second sensor group 43b of the second protruding portion 25b measures the distance between the substrate W to be transferred at the entry position of the second holding body 33b and the substrate W below.

[0071] 3, 4 (a), and 4 (b), it can be seen that in this example, the first sensor 41 and the second sensor 42 are provided at the same position in the front-rear direction X of the first protrusion 25a, and the first sensor 41 and the second sensor 42 are provided at the same position in the front-rear direction X of the second protrusion 25b. With such a configuration, the distance from the substrate W to be transported to the sensor holding member 21 and the distance from the lower substrate W to the sensor holding member 21 can be measured at the same position in the front-rear direction X, so the minimum distance between the substrates can be accurately measured.

[0072] 3. Movement of the carrier robot The operation of the carrier robot IR is described. To transport the substrate W, first, as shown in FIG. 7A , the carrier robot IR moves the arm 12 in the width direction Y, and first, makes the position of the sensor holding member 21 in the width direction Y coincide with the position of the substrate W. If the acquisition hand 11a is moved forward in the direction X in this state, the acquisition hand 11a can approach the substrate W in the carrier C. In this example, the following configuration is used, that is, before the acquisition hand 11a is moved forward in the direction X, the sensor holding member 21 is moved between the substrates to measure the minimum distance between the substrates.

[0073] Then, as shown in FIG. 7B , the carrier robot IR moves the arm 12 in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The middle height position is a preset height position for each substrate W and is memorized in the memory unit of the control unit 100 attached to the device. The first substrate W1 and the second substrate W2 in FIG. 7B are not warped but flat. Therefore, the minimum distance between the substrates is the same regardless of the position in the front-back direction X. The distance D1 is the ideal distance between the substrates determined by the comb-shaped member 7 of the carrier C. Specifically, the distance is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped member 7. The distance between the protrusions of the comb-shaped member 7 is consistent with the distance from the lower surface of the first substrate W1 to the lower surface of the second substrate W2. The distance required for conveying the first substrate W1 using the hand 11a is the distance from the lower surface of the first substrate W1 to the upper surface of the second substrate W2. Therefore, the minimum distance between the substrates is shorter than the distance between the protrusions of the comb-shaped member 7 by the thickness of the second substrate W2. The position of the sensor holding member 21 in FIG. 7B is located at a position higher than the second substrate W2 by a distance d1 which is half of the distance D1. Therefore, the sensor holding member 21 is located at a position lower than the first substrate W1 by a distance d1.

[0074] The specific position of the sensor holding member 21 in the vertical direction Z is described. The sensor holding member 21 determines a reference position in the vertical direction Z. The reference position is set at a position corresponding to the midpoint between the upper end of the first sensor 41 described later and the lower end of the second sensor 42 described later. Therefore, the distance from the upper end of the first sensor 41 to the reference position is equal to the distance from the reference position to the lower end of the second sensor 42.

[0075] After that, the carrier robot IR moves the sensor holding member 21 forward in the direction X and starts measuring the minimum distance between substrates. That is, the sensor holding member 21 enters between the first substrate W1 to be transported and the second substrate W2 located below the first substrate W1. Then, the minimum distance between substrates can be measured based on the sum of the first minimum distance Umim of the substrate W at the first measurement position s1 where the first sensor 41 is closest to the first substrate W1 and the second minimum distance Lmin of the substrate W at the second measurement position s2 where the second sensor 42 is closest to the second substrate W2. Specifically, the sensor holding member 21 enters from the rear end to the front end of the first substrate W1 shown in FIG. 7C while continuously measuring the minimum distance between substrates at each position on the line extending along the front-back direction X. More specifically, the first sensor 41 confirms that the distance from the first sensor 41 to the first substrate W1 is d2 by emitting a measurement wave from the upper surface of the first sensor 41. Similarly, the second sensor 42 measures the distance from the second sensor to the second substrate W2 by emitting a measuring wave from the lower surface of the second sensor 42. In FIG. 7C, since the first substrate W1 and the second substrate W2 are flat, the distance between the first sensor 41 and the first substrate W1 measured by the first sensor 41 is constant and is d2 regardless of the position in the front-back direction X. In addition, since the sensor holding member 21 enters between the first substrate W1 and the second substrate W2, the distance from the first substrate W1 to the first sensor 41 and the distance from the second substrate W2 to the second sensor 42 are equal. Therefore, the second sensor 42 confirms that the distance from the second sensor 42 to the second substrate W2 is d2. The distance between the second sensor 42 and the second substrate W2 measured by the second sensor 42 is constant and is d2 regardless of the position in the front-back direction X.

[0076] The minimum distance between substrates can be calculated based on the data output by the first sensor 41 and the data output by the second sensor 42. That is, the minimum distance between substrates is a value obtained by adding the first minimum distance Umin, i.e., d2, from the first sensor 41 to the first substrate W1, the second minimum distance Lmin, i.e., d2, from the second sensor 42 to the second substrate W2, and the thickness of the sensor group 43. In FIG. 7C , the minimum distance between substrates is calculated as the distance D1.

[0077] FIG. 8A is a top view of the sensor holding member 21 showing the state of FIG. 7C. According to the figure, the sensor group 43 measures the minimum distance between substrates at the rear end of the substrate W. FIG. 8B shows the state after the minimum distance between substrates at the front end of the substrate W is measured. At this time, the sensor group 43 is located at a position protruding from the front end of the substrate W. FIG. 8C is a top view of the sensor holding member 21 showing the state of FIG. 8B. According to the figure, the sensor holding member 21 seems to overlap with the substrate W. After that, the sensor holding member 21 retreats, and this time the hand 11a is used to enter between the first substrate W1 and the second substrate W2. Specifically, the carrier robot IR moves the arm 12 in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 at the lower part.

[0078] At this time, the amount of movement of the arm 12 in the vertical direction Z is determined based on the minimum distance between the substrates measured by the sensor holding member 21. That is, when the acquisition hand 11a enters between the first substrate W1 and the second substrate W2, the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 are both greater than a predetermined value, and the entry height of the acquisition hand 11a is adjusted according to the minimum distance between the substrates. Specifically, the entry height of the acquisition hand 11a is adjusted so that the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 are the same.

[0079] FIG. 9A shows a state in which the height of the acquisition hand 11a is adjusted based on the minimum distance between the substrates measured. The minimum distance between the substrates measured is the distance D1. The arm 12 adjusts the height of the acquisition hand 11a in such a manner that the distance from the lower surface of the acquisition hand 11a to the upper surface of the second substrate W2 is the same as the distance from the upper surface of the thick wall portion of the guide member 32 of the acquisition hand 11a to the lower surface of the first substrate W1. When the minimum distance between the substrates is D1 as shown in FIG. 9A, the reference position of the acquisition hand 11a only needs to be located at half of the minimum distance D1 between the second substrate W2 and the upper substrate, that is, d1. The height of the protrusion of the comb-shaped member 7 of the carrier C is consistent with the lower end of the second substrate W2. Moreover, the thickness of the second substrate W2 can be measured by referring to the distance measured by the second sensor 42. Therefore, the reference position of the acquisition hand 11a coincides with the position d1 which is half of the distance D1 measured above the position of the thickness of the second substrate W2 above the upper end of the protrusion supporting the second substrate W2. The reference position of the acquisition hand 11a in the vertical direction Z is the middle position of the acquisition hand 11a having a predetermined thickness. The length from the reference position to the upper end of the thick wall portion of the guide member 32 is equal to the length from the reference position to the lower end of the hand body 31. Therefore, the reference position corresponds to the midpoint between the upper end of the thick wall portion of the guide member 32 and the lower end of the hand body 31.

[0080] The acquisition hand 11a positioned in the vertical direction Z moves forward by the arm 12 and enters the middle position of the gap between the substrates. At this time, the distance from the first substrate W1 to the thick wall portion of the guide member 32 of the acquisition hand 11a is d3. Moreover, the distance from the second substrate W2 to the lower end of the hand body 31 of the acquisition hand 11a is the same d3. In this example, the reference position of the acquisition hand 11a is determined based on the thick wall portion of the guide member 32. This portion is the thickest portion in the acquisition hand 11a. According to this example, the guide member 32 located at the front end of the acquisition hand 11a is particularly set not to collide with the substrate W. The guide member 32 is the member that is most likely to collide with the substrate W in the acquisition hand 11a. According to this example, the guide member 32 is optimized not to collide with the substrate W.

[0081] When the front end of the acquisition hand 11a moves to the front end of the first substrate W1, the acquisition hand 11a rises a predetermined amount, and the first substrate W1 is moved onto the comb-shaped member 7. At this time, the end (inclined portion) of the first substrate W1 faces the wall portion of the thick wall portion of the guide member 32 and the guide member 34. Then, the push rod 35 in the open state becomes the closed state, and the first substrate W1 is held by the acquisition hand 11a. If the acquisition hand 11a moves backward in this state, the first substrate W1 is pulled out from the carrier C. In this way, the first substrate W1 is transported.

[0082] 4. Movement of the carrier robot (when the substrate is warped) FIG. 9B shows a situation in which the first substrate W1 and the second substrate W2 to be transported are warped, which is different from FIG. 7B. In this example, the first substrate W1 can also be transported appropriately. In order to transport the first substrate W1, as in FIG. 7B, first, the carrier robot IR moves the arm 12 in the vertical direction Z as shown in FIG. 9B, so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is the ideal minimum distance between substrates determined by the comb-shaped member 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined by the specification from the distance between the protrusions of the comb-shaped member 7. The position of the sensor holding member 21 in FIG. 9B is located at a position d1 which is half the distance D1 higher than the second substrate W2. Therefore, the sensor holding member 21 is located at a position d1 lower than the first substrate W1.

[0083] In this way, the position of the sensor holding member 21 is determined based on the ideal minimum distance between substrates. Therefore, if the sensor holding member 21 continuously measures the minimum distance between substrates, the result may not necessarily be the ideal value, i.e., the distance D1. Nevertheless, it can be considered that the minimum distance between substrates at the end of the substrate is the distance D1. This is because the peripheral portion of the substrate W is held by the comb-shaped member 7 of the carrier C. As an example of the warping method of the first substrate W1 at this time, it is a spherical warping method in which the center of the substrate W is concave. In addition, as an example of the warping method of the second substrate W2 at this time, it is a spherical warping method similar to the first substrate W1. Since the first substrate W1 and the second substrate W2 are rotating bodies by this warping method, the height of the left and right ends of the substrate W held by the comb-shaped member 7 is the same height as the front and rear ends of the substrate W not held by the comb-shaped member 7. Therefore, FIG. 9B shows that the distance between substrates at the end of the substrate is the distance D1.

[0084] However, since the first substrate W1 is warped, the distance U from the first sensor 41 to the first substrate W1 varies depending on the position of the first substrate W1. FIG. 10A shows a state when the front end of the sensor holding member 21 moves to the center of the first substrate W1. At this time, the first sensor 41 is closest to the first substrate W1. That is, the distance between the first sensor 41 and the first substrate W1 is the first minimum distance Umin. The position of the first substrate W1 where the distance between the first sensor 41 and the first substrate W1 is the first minimum distance Umin is referred to as the first measurement position s1.

[0085] Similarly, since the second substrate W2 is warped, the distance L from the second sensor 42 to the second substrate W2 varies depending on the position of the second substrate W2. FIG. 9B shows a state when the front end of the sensor holding member 21 is located at the front end of the first substrate W1. At this time, the second sensor 42 is closest to the second substrate W2. That is, the distance between the second sensor 42 and the second substrate W2 is the second minimum distance Lmin. The position of the second substrate W2 where the distance between the second sensor 42 and the second substrate W2 is the second minimum distance Umin is referred to as the second measurement position s2.

[0086] The first sensor 41 of the sensor holding member 21 of this example measures the distance while moving from the end of the first substrate W1 located at the opening of the carrier C toward the depth of the carrier C. Similarly, the second sensor 42 measures the distance while moving from the end of the second substrate W2 located at the opening of the carrier C toward the depth of the carrier C. However, the first sensor 41 of this example measures the distance while moving from the rear end to the front end of the first substrate W1. Similarly, the second sensor 42 measures the distance while moving from the rear end to the front end of the second substrate W2. Then, the first sensor 41 and the second sensor 42 measure the minimum distance between the substrates based on the distance between the substrates at the first measurement position s1 and the distance between the substrates at the second measurement position s2.

[0087] Here, the minimum distance D2 between the first substrate W1 and the second substrate W2 is the minimum distance in the height direction between the two substrates W1 and W2 when the sensor holding member 21 enters between the substrates (that is, from the rear end to the front end in the X direction). The distance in the height direction between the two substrates W1 and W2 is the distance between the lower end portion of the upper substrate W1 (the portion located at the lowest position: the first measurement position s1) and the upper end portion of the lower substrate W2 (the portion located at the highest position: the second measurement position s2). For example, in the case where the upper and lower substrates W1 and W2 are warped as shown in FIG10A, the portion detected as the minimum distance d4 between the first sensor 41 and the first substrate W1 is the lower end portion of the upper substrate W1. In FIG10A, the center portion of the substrate W1 is the lower end portion of the substrate W1. On the other hand, the position detected as the minimum distance d2 between the second sensor 42 and the second substrate W2 is the upper end of the lower substrate W2. In FIG. 10A, the rear end of the substrate W2 in the X direction is the upper end of the substrate W2. Moreover, the sum of the minimum distance d4 and the minimum distance d2 is the minimum distance D2 between the two substrates W1 and W2.

[0088] When the measurement between substrates is finished, the sensor holding member 21 moves backward, and the acquiring hand 11a enters between the substrates. At this time, the height of the acquiring hand 11a is adjusted so that the distance from the acquiring hand 11a to the first substrate W1 and the distance from the acquiring hand 11a to the second substrate W2 are the same. In order to calculate the height of the acquiring hand 11a, the minimum distance D2 between the substrates is used as a reference.

[0089] When the acquisition hand 11a is made to enter between the first substrate W1 and the second substrate W2, the acquisition hand 11a is most likely to collide with the first substrate W1 at the first measurement position s1. Furthermore, when the acquisition hand 11a is made to enter between the first substrate W1 and the second substrate W2, the acquisition hand 11a is most likely to collide with the second substrate W2 at the second measurement position s2. The substrate transfer device of this embodiment adjusts the entry height of the acquisition hand 11a in such a manner that the substrate W is unlikely to collide with the acquisition hand 11a at either the first measurement position s1 or the second measurement position s2.

[0090] FIG. 10B shows a state in which the height of the acquisition hand 11a is adjusted based on the minimum distance between the substrates measured. The minimum distance between the substrates measured is D2. The arm 12 adjusts the height of the acquisition hand 11a in such a way that the distance from the lower surface of the acquisition hand 11a to the upper surface of the second substrate W2 (generally, the upper end of the second substrate W2) and the distance from the upper surface of the thick wall portion of the guide member 32 of the acquisition hand 11a to the lower surface of the first substrate W1 (generally, the lower end of the first substrate W1) are the same. The arm 12 adjusts the height of the acquisition hand 11a in such a way that the distance between the first substrate W1 and the acquisition hand 11a is d5 at the first measurement position s1 where the first substrate W1 and the acquisition hand 11a are closest. Then, the arm 12 adjusts the height of the acquisition hand 11a in such a manner that the distance between the second substrate W2 and the acquisition hand 11a is d5 at the second measurement position s2 where the second substrate W2 and the acquisition hand 11a are closest. That is, in the case where the minimum distance between the substrates is D2 as shown in FIG. 10B , the reference position of the acquisition hand 11a only needs to be located at a position d5 which is approximately half of the minimum distance D2 between the second substrate W2 and the upper substrate. The height of the protrusion of the comb-shaped member 7 of the carrier C is consistent with the lower end of the second substrate W2. Moreover, the thickness of the second substrate W2 can be measured by referring to the distance measured by the second sensor 42. Therefore, the reference position of the acquisition hand 11a is consistent with the position d5 which is approximately half of the minimum distance D2 actually measured above the upper end of the protrusion supporting the second substrate W2. Thus, in this example, the entry height of the acquiring hand 11a is adjusted so that the distance from the acquiring hand 11a to the lower end of the first substrate W1 becomes greater than a predetermined value at the first measuring position s1 where the lower end of the first substrate W1 is closest to the first sensor 41. Similarly, the entry height of the acquiring hand 11a is adjusted so that the distance from the acquiring hand 11a to the upper end of the second substrate W2 becomes greater than a predetermined value at the second measuring position s2 where the upper end of the second substrate W2 is closest to the second sensor 42.

[0091] The acquisition hand 11a positioned in the vertical direction Z moves forward by the arm 12 and enters the middle position of the gap between the substrates. At this time, the distance from the first substrate W1 to the thick wall portion of the guide member 32 of the acquisition hand 11a is d6. Moreover, the distance from the second substrate W2 to the lower end of the hand body 31 of the acquisition hand 11a is d7 which is shorter than d6. As the front end of the acquisition hand 11a continues to enter between the substrates, the first substrate W1 gradually approaches the front end of the acquisition hand 11a. Specifically, the distance from the front end of the acquisition hand 11a to the first substrate W1 is d6 as the initial value and decreases to d7. This is because the first substrate W1 is in a shape that is warped toward the second substrate W2. On the other hand, even if the front end of the acquisition hand 11a enters between the substrates, the second substrate W2 does not approach the front end of the acquisition hand 11a. Therefore, the distance from the front end of the acquisition hand 11a to the second substrate W2 is not less than d7. FIG10C depicts the state when the first substrate W1 is closest to the front end of the acquisition hand 11a. That is, the distance from the lower end of the first substrate W1 to the upper end of the thick wall portion of the guide member 32 is d7, and the distance from the lower end of the hand body 31 to the upper end of the second substrate W2 is longer than d7. Since d7 is greater than the distance required for substrate transport, the acquisition hand 11a does not collide with the first substrate W1 or the second substrate W2 when entering the substrate space.

[0092] As the acquisition hand 11a further extends from the state of FIG. 10C and reaches the front end of the first substrate W1, the distance from the first substrate W1 to the front end of the acquisition hand 11a increases from d7. Therefore, in this action, the acquisition hand 11a does not collide with the first substrate W1 or the second substrate W2.

[0093] 5. Movement of the carrier robot (obtaining situations where access is not possible with hands) In this example, the following configuration is adopted, namely: when measuring the minimum distance between substrates, the distance between the first substrate W1 and the second substrate W2 is short, and the distance from the acquiring hand 11a to the first substrate W1 at the first measuring position s1 and the distance from the acquiring hand to the second substrate W2 at the second measuring position s2 cannot be simultaneously set to values ​​greater than the specified values, and the acquiring hand 11a is prevented from entering between the first substrate W1 and the second substrate W2.

[0094] FIG11A illustrates a case where the minimum distance between substrates is D3. The minimum value D3 is shorter than the minimum distance D2, and accordingly, the first substrate W1 is warped more significantly than in FIG9B. Next, the operation of the carrier robot IR in this case will be described.

[0095] First, the carrier robot IR moves the arm 12 in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is the ideal distance between substrates determined by the comb-shaped member 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined according to the specifications from the distance between the protrusions of the comb-shaped member 7. The position of the sensor holding member 21 is located at a position d1 which is half the distance D1 higher than the second substrate W2. Therefore, the sensor holding member 21 is located at a position d8 lower than the first substrate W1.

[0096] Since the first substrate W1 is warped, the minimum distance between the substrates varies depending on the position of the substrate W. FIG. 11A shows the state when the front end of the sensor holding member 21 moves to the center of the first substrate W1. At this time, the first sensor 41 is closest to the first substrate W1. That is, the distance between the first sensor 41 and the first substrate W1 is d8. On the other hand, since the second substrate W2 is flat, the distance between the second sensor 42 and the second substrate W2 is d2. The sensor holding member 21 measures the minimum value D3 of the distance between the first substrate W1 and the second substrate W2 based on d8 and d2. That is, the minimum value D3 is the value obtained by adding the thickness of the sensor group 43 in the vertical direction Z to d8 and d2. The portion where the substrates are close to each other at the minimum value D3 is most likely to collide with the acquisition hand 11a when the substrates are transported.

[0097] The minimum value D3 is smaller than the length obtained by adding the thickness of the acquisition hand 11a to twice the specified value, and the distance from the acquisition hand 11a to the first substrate W1 and the distance from the acquisition hand 11a to the second substrate W2 cannot be set to be greater than the specified value at the same time. At this time, the carrier robot IR of this example does not allow the acquisition hand 11a to enter between the first substrate W1 and the second substrate W2. In this way, the collision between the first substrate W1 and the acquisition hand 11a during the transfer of the first substrate W1 can be prevented.

[0098] 6. Movement of the carrier robot (when the sensor holding component is inaccessible) In this example, the result of measuring the minimum distance between the substrates is that the distance between the first substrate W1 and the second substrate W2 is short, and the sensor holding member 21 cannot be inserted between the first substrate W1 and the second substrate W2, so the obtaining hand 11a is not allowed to enter between the first substrate W1 and the second substrate W2.

[0099] FIG11B illustrates a case where the minimum distance between substrates is D4. The minimum value D4 is shorter than the minimum value D3 described above, and accordingly, the first substrate W1 is warped more significantly than in FIG11A. The operation of the carrier robot IR in this case will be described below.

[0100] First, the carrier robot IR moves the arm 12 in the vertical direction Z so that the sensor holding member 21 is located at a height between the first substrate W1 to be transported and the second substrate W2 below. The distance D1 is the ideal minimum distance between substrates determined by the comb-shaped member 7 of the carrier C. Specifically, it is the length obtained by subtracting the thickness of the substrate W determined by the specifications from the distance between the protrusions of the comb-shaped member 7. The position of the sensor holding member 21 is located at a position higher than the second substrate W2 by a distance d1 that is half of the distance D1. Therefore, the sensor holding member 21 is located at a position lower than the first substrate W1 by a distance d1.

[0101] Since the first substrate W1 is warped, the minimum distance between the substrates varies depending on the position of the substrate W. FIG. 11B shows the state when the front end of the sensor holding member 21 moves to the center of the first substrate W1. At this time, before the first sensor 41 is closest to the first substrate W1, the distance between the first sensor 41 and the first substrate W1 is d9. On the other hand, since the second substrate W2 is flat, the distance between the second sensor 42 and the second substrate W2 is d2. The substrate conveying device of this example is configured as follows: when the distance between the first sensor 41 and the first substrate W1 is d9, the measurement of the minimum distance between the substrates is stopped, and the sensor holding member 21 is retreated. Similarly, the substrate conveying device of this example is configured as follows: when the distance between the second sensor 42 and the second substrate W2 is d9, the measurement of the minimum distance between the substrates is stopped, and the sensor holding member 21 is retreated. By configuring in this way, the sensor holding member 21 does not collide with the substrate W.

[0102] 11B shows an example in which the sensor holding member 21 is stopped from entering due to the first substrate W1 approaching the first sensor 41. When the distance between the second substrate W2 and the second sensor 42 is d9 due to the warping of the second substrate W2, the sensor holding member 21 is also stopped from entering.

[0103] In the case where the sensor holding member 21 cannot be inserted between the first substrate W1 and the second substrate W2 due to the return of the sensor holding member 21, the acquisition hand 11a is not allowed to enter between the first substrate W1 and the second substrate W2. That is, when the distance d9 is detected by the first sensor 41 or the second sensor, it is determined that the acquisition hand 11a does not transport the first substrate W1. In this way, the collision between the first substrate W1 and the acquisition hand 11a during the transport of the first substrate W1 can be prevented.

[0104] 7. Other components As can be seen from FIG. 1 , the substrate transport device of this example includes a control unit 100. The control unit 100 is composed of, for example, a CPU (Central Processing Unit). The specific composition of the control unit 100 is not limited, for example, the control unit 100 may be composed of a single processor or may be composed of separate processors.

[0105] As control related to the control unit 100, there is control related to the carrier robot IR, for example. That is, the control unit 100 controls the forward and backward movement of the sensor holding member 21, the forward and backward movement of the acquisition hand 11a and the return hand 11b, the opening and closing movement of the push rod 35, the movement of the arm 12 in the vertical direction Z, the positioning sensor described later, and the moving mechanism of the positioning sensor. In particular, the control unit 100 is configured to move the acquisition hand 11a, the return hand 11b and the sensor holding member 21 forward and backward relative to the substrate W in the front-back direction.

[0106] Although not shown in FIG. 1 , the substrate transport device of this example has a memory unit that can be accessed by the control unit 100. The memory unit stores control-related programs and parameters. Furthermore, the memory unit stores the minimum distance between each substrate measured by the sensor member 21. The memory unit can be composed of a single device or can be composed of individual devices corresponding to each control unit. In addition, the substrate transport device of this example is not particularly limited to the composition of the device that realizes the memory unit.

[0107] 8. Substrate transport process FIG. 12 is a flow chart for explaining the operation of the substrate transport device of the present invention. Hereinafter, the operation of the substrate transport device in the case of performing a substrate cleaning process by the substrate processing device 1 of the present invention will be described. FIG. 13 shows the state of transporting a substrate W in the substrate processing device 1. In the following description, FIG. 13 is also appropriately referred to.

[0108] Step S1: When the carrier C to be processed is placed on the wafer handling machine 10, the substrate transport device starts the positioning operation of the substrate W. The substrate transport device is equipped with: a positioning sensor for performing the operation, and a moving mechanism for the positioning sensor. The moving mechanism can move the positioning sensor along the vertical direction Z. The positioning sensor is a non-contact sensor that can sense the presence or absence of the substrate W. Specifically, the positioning operation is performed by moving the positioning sensor relative to the carrier C along the vertical direction Z. In this way, it can be known which part of the comb-shaped member 7 of the carrier C carries the substrate W. The positioning operation is an operation to obtain the distribution of the substrates W in the carrier C.

[0109] Step S2: The carrier robot IR is moved to the rear of the carrier C, and the sensor holding member 21 enters the carrier C. When the substrates W are spaced 1 cm apart and supported by the comb-shaped member 7, the sensor holding member 21 enters between the substrates W. 1 cm is the arrangement pitch of the protrusions of the comb-shaped member 7. When 25 substrates W are arranged on the carrier C at intervals of 1 cm, the sensor holding member 21 sequentially enters each of the 24 gaps between the substrates. The minimum distance between the substrates obtained by the sensor holding member 21 is memorized in the memory unit. When the substrates W are supported at intervals of more than 2 cm in the carrier C, it can be said that the minimum distance between the substrates is sufficient for conveyance even without measurement, so the entry action of the sensor holding member 21 can be omitted. How the substrates W are arranged on the carrier C can be known by referring to the result of the positioning action.

[0110] Step S3: Based on the measurement result between the substrates by the sensor holding member 21, the height of the reference position of the acquisition hand 11a is determined. Then, the parameters related to the control of the acquisition hand 11a are changed in such a way that the reference position of the acquisition hand 11a becomes the determined height. Specifically, this action is realized by overwriting the hand height offset value that determines the height of the acquisition hand 11a.

[0111] Step S4: The arm 12 of the carrier robot IR moves in the vertical direction so that the acquisition hand 11a is located at the height of the substrate W to be transported. The height of the acquisition hand 11a at this time is suitable for transporting the substrate W to be transported. The acquisition hand 11a holds the substrate W to be transported and transfers it to the path 24 (refer to arrow a in FIG. 13).

[0112] Step S5: The unprocessed substrate W held in the path 24 is transported by the central robot CR to the single-wafer processing chamber 5a (see arrow b in FIG. 13). The single-wafer processing chamber 5a performs a cleaning process on the substrate W. The processed substrate W is transported by the central robot CR to the path 24 (see arrow c in FIG. 13).

[0113] Step S6: The cleaned substrate W after the cleaning process is transported by the return hand 11b. First, the height of the reference position of the return hand 11b is determined based on the measurement result of the sensor holding member 21 between the substrates. That is, the parameters related to the control of the return hand 11b are changed in such a way that the reference position of the return hand 11b becomes the determined height. Specifically, this action is achieved by overwriting the hand height offset value that determines the height of the return hand 11b.

[0114] The hand height offset value associated with the acquisition hand 11a can be repeatedly used to overwrite the hand height offset value associated with the return hand 11b. After the substrates W held by the carrier C are processed, each is returned to the carrier C while maintaining the order of arrangement. Therefore, the height of the return hand 11b when returning the substrate W to the carrier C is the same as the height of the acquisition hand 11a when the substrate W is acquired from the carrier C. The height of the acquisition hand 11a is a unique value for each substrate W held by the carrier C. When returning the substrate W to the carrier C, the action of the acquisition hand 11a is reproduced by the return hand 11b based on these unique values. Thereby, when the substrate W is returned, the front end of the return hand 11b does not collide with the substrate W.

[0115] Step S7: The returning hand 11b obtains the substrate W to be transported from the path 24. The arm 12 of the carrier robot IR moves in the vertical direction so that the returning hand 11b is located at the height determined in step S6. The height of the returning hand 11b when the substrate W is placed on the carrier C and returned to the substrate transport device is the same as that of the obtaining hand 11a when the substrate W is obtained from the carrier C. This is due to the acquisition hand 11a and the return hand 11b actions based on the common hand height offset value. The returning hand 11b transports the substrate W to be transported from the path 24 to the carrier C (refer to the arrow d in Figure 13). The substrate W held by a certain protrusion of the comb-shaped member 7 of the carrier C returns to the same protrusion through the substrate obtaining action and the substrate returning action.

[0116] Step S8: When the substrate W is returned to the carrier C, the substrate W is positioned again in the same manner as in step S1. Thus, the operation of the substrate transport device of this example is completed.

[0117] In addition, the above-mentioned description of the operation of step S1 to step S8 is focused on one substrate W. Therefore, when a plurality of substrates W are transported from the carrier C and the substrates W are cleaned, step S3 and step S4 may be repeated before proceeding to step S5. Similarly, step S6 and step S7 may be repeated before proceeding to step S9.

[0118] 9. Effects of Example 1 As described above, the substrate transport device includes a sensor holding member 21 having a first sensor 41 and a second sensor 42 in addition to the receiving hand 11a and the returning hand 11b for transporting the substrate W. When the first substrate W1 in the carrier C is intended to be transported, according to the present invention, first, the sensor holding member 21 enters between the first substrate W1 and the second substrate W2. Then, the distance between the first substrate W1 and the second substrate W2 is measured. Since the placement position of the substrate W is determined in the carrier C, the distance between the first substrate W1 and the second substrate W2 should be constant. However, in reality, the first substrate W1 and the second substrate W2 are not necessarily flat. Therefore, when the distance between the first substrate W1 and the second substrate W2 is actually measured, the minimum distance between the substrates is larger or smaller than expected. At the same time, the middle position between the substrates is higher or lower than expected.

[0119] According to the present invention, when the acquisition hand 11a and the return hand 11b enter between the first substrate W1 and the second substrate W2, the clearance between the acquisition hand 11a and the return hand 11b and the first substrate W1 and the clearance between the acquisition hand 11a and the return hand 11b and the second substrate W2 are both greater than a predetermined value, the entry height of the acquisition hand 11a and the return hand 11b is adjusted. If so configured, since the acquisition hand 11a and the return hand 11b are too close to the first substrate W1, the acquisition hand 11a and the return hand 11b do not contact other than the edge of the first substrate W1. Similarly, since the acquisition hand 11a and the return hand 11b are too close to the second substrate W2, the acquisition hand 11a and the return hand 11b do not contact other than the edge of the second substrate W2.

[0120] In the above-mentioned structure, the thickness of the front end of the sensor holding member 21 composed of the first sensor 41 and the second sensor 42 is smaller than the thickness of the front end of the acquisition hand 11a and the return hand 11b composed of the guide member 32. With such a structure, the sensor holding member 21 can also enter between the substrates that the acquisition hand 11a and the return hand 11b cannot enter, and the minimum distance between the substrates can be accurately measured.

[0121] In the above-mentioned structure, the entry height of the acquisition hand 11a and the return hand 11b is adjusted so that the gap between the acquisition hand 11a and the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a and the return hand 11b and the second substrate W2 are both greater than a predetermined value at the position where the first substrate W1 and the second substrate W2 are closest. With such a structure, the acquisition hand 11a and the return hand 11b do not contact the substrate W at the position where the first substrate W1 and the second substrate W2 are closest.

[0122] In the above-mentioned structure, the height of the access of the acquisition hand 11a and the return hand 11b is adjusted so that the gap between the acquisition hand 11a and the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a and the return hand 11b and the second substrate W2 are the same. With such a structure, sufficient distance is ensured not only between the acquisition hand 11a and the return hand 11b and the first substrate W1, but also between the acquisition hand 11a and the return hand 11b and the second substrate W2, so that the substrate W can be transported, and thus the hand can transport the substrate W more reliably.

[0123] In the above-mentioned structure, the sensor holding member 21 does not transport the substrate W. With such a structure, it is not necessary to provide the guide member 32 for holding the substrate W on the sensor holding member 21, and it is easy to enter between the substrates.

[0124] In the above configuration, when the distance between the first substrate W1 and the second substrate W2 is short and the gap between the acquisition hand 11a, the return hand 11b and the first substrate W1 and the gap between the acquisition hand 11a, the return hand 11b and the second substrate W2 cannot be set to a predetermined value or more at the same time, it is determined that the first substrate W1 cannot be conveyed, and the acquisition hand 11a, the return hand 11b is not inserted between the first substrate W1 and the second substrate W2. With such a configuration, it is possible to more reliably prevent the acquisition hand 11a, the return hand 11b from contacting the substrate W1 except for the edge.

[0125] In the above-mentioned structure, the protrusion amount of the first sensor 41 and the second sensor 42 can be reduced by the thickness of the sensor holding member 21. Therefore, the height of the sensor holding member 21 can be suppressed as much as possible, so the possibility that the sensor holding member 21 cannot enter between the substrates is reduced.

[0126] In the above configuration, the first sensor group 43 for measuring the minimum distance between substrates at the position of the first holding body 33a of the acquisition hand 11a and the return hand 11b is provided on the sensor holding member 21, and the second sensor group 43 for measuring the minimum distance between substrates at the position of the second holding body 33b of the acquisition hand 11a and the return hand 11b is provided on the sensor holding member 21. Thus, it is possible to more reliably prevent the acquisition hand 11a and the return hand 11b from contacting the substrate W except for the edge.

[0127] In the above-mentioned structure, the sensor holding member 21 includes: a first protrusion 25a corresponding to the first holding body 33a and extending in the front-rear direction X, and a second protrusion 25b corresponding to the second holding body 33b and extending in the front-rear direction X. By making the shape of the sensor holding member 21 imitate the acquisition hand 11a and the return hand 11b in this way, information on the distance required for conveying can be obtained more accurately.

[0128] In the above configuration, the sensor holding member 21 includes a sensor group 43 at the front end of the first protrusion 25a and a sensor group 43 at the front end of the second protrusion 25b. With this configuration, the minimum distance between substrates in the deep part of the carrier C can be measured by slightly moving the sensor holding member 21.

[0129] In the above-mentioned structure, the sensor holding member 21 includes the first sensor 41 and the second sensor 42 at the same position of the first protrusion 25a in the front-rear direction X. In addition, the sensor holding member 21 includes the first sensor 41 and the second sensor 42 at the same position of the second protrusion 25b in the front-rear direction X. With such a structure, the substrate (first substrate W1) on the upper side of the sensor holding member 21 and the substrate (second substrate W2) on the lower side of the sensor holding member 21 can be measured under the same conditions, so the minimum distance between the substrates can be calculated more accurately.

[0130] In the above configuration, when the distance between the first substrate W1 and the second substrate W2 is short and the sensor holding member 21 cannot be inserted between the first substrate W1 and the second substrate W2, it is determined that the first substrate W1 cannot be transported, and the acquisition hand 11a and the return hand 11b are not inserted between the first substrate W1 and the second substrate W2. With such a configuration, it is possible to more reliably prevent the acquisition hand 11a and the return hand 11b from contacting the substrate W other than the edge.

[0131] In the above-mentioned structure, the sensor holding member 21 is located at the same position as the acquisition hand 11a and the return hand 11b in the front-rear direction X before entering between the substrates W. With such a structure, the acquisition hand 11a, the return hand 11b and the sensor holding member 21 can be used separately by a single robot to realize the present invention. [Example 2]

[0132] 10. Summary of Example 2 Embodiment 2 is about a substrate transfer device. As in Embodiment 1, the substrate processing device 1 incorporating the substrate transfer device is described by way of example. The substrate processing device 1 of Embodiment 2 has a wafer handling machine 10, a carrier block 3, and a processing block 5 as described using FIG. 1. The structure of the carrier robot IR in the carrier block 3 of the substrate transfer device of this embodiment is different from that of Embodiment 1.

[0133] 11. Composition of the carrier robot FIG. 14 schematically shows the front end portion of the carrier robot IR that is related to substrate holding. The carrier robot IR includes: a first acquisition hand 51a, a first return hand 51b, a second acquisition hand 61a, and a second return hand 61b. The first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b are held by the arm 13 in a stacked state along the vertical direction Z. The arm 13 can move the first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b forward and backward in the front-back direction X respectively. In the configuration of FIG. 14, the second return hand 61b, the second acquisition hand 61a, the first return hand 51b, and the first acquisition hand 51a are arranged in order from top to bottom, but the order of arrangement of each component can be appropriately changed.

[0134] The first acquisition hand 51a is equivalent to the first hand of the present invention, and is equivalent to the acquisition hand 11a of the first embodiment. Therefore, the first acquisition hand 51a holds unprocessed substrates W one by one from the carrier C and transports them to the path 24. The first acquisition hand 51a has a hand body 53 and a first guide member 52. The first guide member 52 for the end of the substrate W to abut is provided at the front end of the first acquisition hand 51a. The hand body 53 is configured in the same manner as the hand body 31 of the first embodiment. The first guide member 52 is configured in the same manner as the guide member 32 of the first embodiment. Therefore, the first guide member 52 has a thick wall portion and a thin wall portion. The thickness of the first guide member 52 in the height direction is partially different. The first acquisition hand 51a is a hand for high-speed transport that transports substrates W one by one from the carrier C that stores a plurality of substrates W in a horizontal posture at predetermined intervals in the vertical direction Z.

[0135] The first return hand 51b is equivalent to the return hand 11b of the first embodiment, and has the same structure as the first acquisition hand 51a. The first acquisition hand 51a is a hand for acquiring an unprocessed substrate W from the carrier C, and the first return hand 51b is a hand for returning the cleaned substrate W to the carrier C after the cleaning process.

[0136] The second acquisition hand 61a is equivalent to the second hand of the present invention. The second acquisition hand 61a holds the unprocessed substrates W from the carrier C one by one and transports them to the path 24. The first acquisition hand 51a and the second acquisition hand 61a have the same function, but the shapes of the hands are different (refer to Figures 16 and 17). The second acquisition hand 61a has a hand body 63 and a second guide member 62. The hand body 63 is formed in a flat shape so that it can enter between the substrates. The front end of the second acquisition hand 61a is provided with a second guide member 62 for the end of the substrate W to abut. The second guide member 62 is a protruding piece provided at the front end of the hand body 63, and is a member that contacts the substrate W. The second guide member 62 is provided on the upper surface of the hand body 63. The second guide member 62 has a thick wall portion and a thin wall portion in the same manner as the first guide member 52 described above. Therefore, the thickness of the second guide member 62 in the height direction is partially different. The wall portion of the thick wall portion of the second guide member 62 that faces the base end portion of the second acquisition hand 61a can be contacted by the end portion (inclined portion) of the substrate W. The flat portion of the thin wall portion of the second guide member 62 that faces upward can be contacted by the peripheral portion of the lower surface of the substrate. The guide member is also provided at the base end portion of the hand body 63 (omitted from the illustration in FIG. 14 ). The guide member forms a contact portion in the second acquisition hand 61a that contacts the substrate W. The second acquisition hand 61a is a hand for low-speed transport that transports substrates W one by one from a carrier C that stores a plurality of substrates W in a horizontal posture at predetermined intervals along the vertical direction Z.

[0137] The second return hand 61b is of the same structure as the second acquisition hand 61a described above. That is, the second return hand 61b has a hand body 63 and a second guide member 62. The second guide member 62 is provided at the front end and the base of the hand body 63 in the second return hand 61b, and the second guide member 62 has a thick wall portion and a thin wall portion, which are the same as the structure of the second acquisition hand 61a. The second return hand 61b of this example is provided to transport the cleaned substrate W after the cleaning process. By distinguishing the use of the hand in the forward path and the backward path of the reciprocating motion of the substrate W, it is not necessary to use the hand that holds the substrate W before the cleaning process to hold the substrate W after the cleaning process. By providing the second return hand 61b, the cleanliness of the substrate W after the cleaning process can be maintained.

[0138] FIG. 15(a) shows the front end of the first acquisition hand 51a and the first return hand 51b, and FIG. 15(b) shows the front end of the second acquisition hand 61a and the second return hand 61b. The thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the vertical direction Z is the distance from the upper end of the thick wall portion of the first guide member 52 to the lower end of the hand body 53. Similarly, the thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the vertical direction Z is the distance from the upper end of the thick wall portion of the second guide member 62 to the lower end of the hand body 63. The thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the height direction is smaller than the thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the height direction. Therefore, the second acquisition hand 61a and the second return hand 61b can also enter a narrower gap than the first acquisition hand 51a and the first return hand 51b. This configuration is conducive to the warping of the substrate W to be transported so that the substrates are close to each other. On the other hand, the first acquisition hand 51a and the first return hand 51b can transport the substrate at a higher speed than the second acquisition hand 61a and the second return hand 61b. This point will be described later.

[0139] FIG. 16 is a top view for explaining the first acquisition hand 51a and the first return hand 51b. The first acquisition hand 51a and the first return hand 51b are constructed in the same manner as the acquisition hand 11a and the return hand 11b of the first embodiment. That is, the first acquisition hand 51a and the first return hand 51b include a base 56, and a first holding body 53a and a second holding body 53b formed by branching the base 56. The first acquisition hand 51a and the first return hand 51b include: a first holding body 53a extending along the front-back direction X for holding one end of the substrate W, and a second holding body 53b extending along the front-back direction X for holding the other end of the substrate W. The first guide member 52 is provided at the front end of the first holding body 53a and the second holding body 53b.

[0140] The guide members 54 are provided at the bases of the first holding body 53a and the second holding body 53b, respectively. The guide members 54, like the first guide members 52 described above, have a thick wall portion constituting a wall portion that can be contacted by the end portion (inclined portion) of the substrate W, and a thin wall portion constituting a flat portion that can be contacted by the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide member 54 is the same as the thickness of the thick wall portion of the first guide member 52. The thickness of the thin wall portion of the guide member 54 is the same as the thickness of the thin wall portion of the first guide member 52. The wall portions of the first guide members 52 and the guide members 54 are arranged to belong to an imaginary circle that is slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W constituted by the thin wall portions of the first guide members 52 and the guide members 54.

[0141] The first acquisition hand 51a and the first return hand 51b have a push rod 55. The push rod 55 is provided at the front end of the base 56 and can push the substrate W held by the first guide member 52 and the guide member 54 in the forward direction. The push rod 55 can be moved in the rearward direction to be in an open state, and can be moved in the forward direction to be in a closed state. In order to hold the substrate W by the first holding body 53a and the second holding body 53b, first, the push rod 55 is set to the open state, and the substrate W is held by the first guide member 52 and the guide member 54. Then, the push rod 55 is set to the closed state, and the substrate W is sandwiched between the first guide member 52 and the push rod 55. In this way, the substrate W is held. On the other hand, the second acquisition hand 61a and the second return hand 61b do not have a push rod. Therefore, there is a gap between the substrates W held by the second guide member 62 of the second acquisition hand 61a and the guide member 64 described later. The second acquisition hand 61a transfers the substrate W while maintaining the gap. This also applies to the second return hand 61b.

[0142] FIG17 is a top view for explaining the second acquisition hand 61a and the second return hand 61b. The second acquisition hand 61a and the second return hand 61b include a base 66, and a first blade 63a and a second blade 63b formed by branching the base 66. The second acquisition hand 61a and the second return hand 61b include: a first blade 63a extending along the front-back direction X for holding one end of the substrate W, and a second blade 63b extending along the front-back direction X for holding the other end of the substrate W. The second guide member 62 is provided at the front end of the first blade 63a and the second blade 63b.

[0143] The guide members 64 are provided at the bases of the first blade 63a and the second blade 63b, respectively. The guide member 64, like the guide member 54 described above, has a thick wall portion constituting a wall portion that can be contacted by the end portion (inclined portion) of the substrate W, and a thin wall portion constituting a flat portion that can be contacted by the peripheral portion of the lower portion of the substrate. The thickness of the thick wall portion of the guide member 64 is the same as the thickness of the thick wall portion of the second guide member 62. The thickness of the thin wall portion of the guide member 64 is the same as the thickness of the thin wall portion of the second guide member 62. The wall portions of the second guide member 62 and the guide member 64 are arranged to belong to an imaginary circle that is slightly larger than the substrate W. Thus, the substrate W can fall into the receiving area of ​​the substrate W formed by the thin wall portions of the second guide member 62 and the guide member 64.

[0144] The shapes of the first acquisition hand 51a and the second acquisition hand 61a are different from each other. That is, as shown in FIG. 16 , the first holding body 53a and the second holding body 53b of the first acquisition hand 51a are tapered in a thickness in the width direction Y that increases from the front end to the base. With this configuration, the rigidity of the first acquisition hand 51a is increased, and a higher speed of substrate transport can be achieved. The same effect is also achieved in the first return hand 51b.

[0145] On the other hand, as can be seen from FIG. 17 , the thickness of the first blade 63a and the second blade 63b of the second acquisition hand 61a in the width direction Y from the front end to the base is constant. By setting such a structure, the space R2 between the first blade 63a and the second blade 63b can be expanded. In the first acquisition hand 51a shown in FIG. 16 , there is also a space R1 between the first retaining body 53a and the second retaining body 53b, which is smaller than the space R2 because the first retaining body 53a and the second retaining body 53b are tapered. The space between the first retaining body 53a and the second retaining body 53b is smaller than the space between the first blade 63a and the second blade 63b.

[0146] As can be seen from FIG. 17 , the separation distance A22 between the first blade 63a and the second blade 63b in the second acquisition hand 61a is larger than the separation distance A21 between the first holding body 53a and the second holding body 53b in the first acquisition hand 51a (see FIG. 17 and FIG. 16 ). Thus, the space R2 can be made larger than the space R1. Moreover, the second acquisition hand 61a can reliably transport a substrate W that is difficult to transport compared to the first acquisition hand 51a by providing a wide space R2. Specifically, the substrate W that is difficult to transport is a warped substrate W. The warped substrate W is sometimes deformed into a shape that is concave toward the center of the substrate W, and accordingly, it is easy to contact the hand during transportation. In this regard, the second acquisition hand 61a is not configured to provide the first blade 63a and the second blade 63b at the portion where the warped substrate is expected to contact the hand. Therefore, the second acquisition hand 61a of this example can also reliably transport a substrate W that is more difficult to transport. The same effect is achieved with the second return hand 61b.

[0147] In addition, the separation distance A21 is the distance from the first guide member 52 provided on the first holding body 53a to the first guide member 52 provided on the second holding body 53b. The separation distance A22 is the distance from the second guide member 62 provided on the first blade 63a to the second guide member 62 provided on the second blade 63b.

[0148] When the carrier robot IR transfers the substrate W from the carrier C to the path 24, the first acquisition hand 51a or the second acquisition hand 61a is used. The first acquisition hand 51a or the second acquisition hand 61a enters between the first substrate W1 held by the carrier C and the second substrate W2 located below it, and then ascends to acquire the first substrate W1. The acquired first substrate W1 is transferred to the path 24.

[0149] When the carrier robot IR transfers the substrate W from the path 24 to the carrier C, the first return hand 51b or the second return hand 61b is used. The first return hand 51b or the second return hand 61b takes the substrate W held in the path 24 and enters the carrier C. Then, the first return hand 51b or the second return hand 61b lowers to place the substrate W on the carrier C. The first return hand 51b or the second return hand 61b moves back between the transferred substrate W and the substrate W located below it, thereby leaving the carrier C.

[0150] 12. Other components As control related to the control unit 100 shown in FIG. 1, there is control related to the carrier robot IR, for example. That is, the control unit 100 controls the forward and backward movement of the first acquisition hand 51a, the first return hand 51b, the second acquisition hand 61a, and the second return hand 61b, the opening and closing movement of the push rod 55, the movement of the arm 13 in the vertical direction Z, the positioning sensor described later, and the moving mechanism of the positioning sensor. In addition, the control unit 100 selects which of the four hands is used for conveying. As for the memory unit, the structure is the same as that of the first embodiment.

[0151] 13. Substrate transport process FIG. 18 is a flow chart for explaining the operation of the substrate transport device of the present invention. Hereinafter, the operation of the substrate transport device in the case of performing a substrate cleaning process by the substrate processing device 1 of the present invention will be described. FIG. 13 shows the state of transporting a substrate W in the substrate processing device 1. In the following description, FIG. 13 is also appropriately referred to.

[0152] Step S11: When the carrier C to be processed is placed on the wafer handling machine 10, the substrate transfer device starts the positioning operation of the substrate W. This step is the same as step S1 of the first embodiment, so the detailed description is omitted.

[0153] Through this step, it can be known how the comb-shaped member 7 of the carrier C holds the substrate W. 25 protrusions are provided on the comb-shaped member 7, each of which can hold the substrate W. For the sake of convenience, the carrier C holds fewer than 25 substrates W. The distance between a certain substrate W among the substrates W held by the carrier C and the substrate W located below it is 1 cm. 1 cm is the arrangement pitch of the protrusions of the comb-shaped member 7. Moreover, the distance between another substrate W among the substrates W held by the carrier C and the substrate W located below it is 2 cm. Therefore, there are empty protrusions on the comb-shaped member 7 that do not hold substrates W, and one substrate W is held by another protrusion at a position 1 cm above the empty protrusion, and another substrate W is held by another protrusion at a position 1 cm below the empty protrusion. By the positioning action, it is possible to identify which part of the carrier C the distance between the substrates is 1 cm, and to identify which part of the carrier C the distance between the substrates is 2 cm.

[0154] In the operation description of FIG. 18 , when the hand enters between the substrates, the distance between the substrates is 2 cm and there is room for it, and the first acquisition hand 51a and the first return hand 51b for high-speed transport are used for transport. On the other hand, when the hand enters between the substrates, the distance between the substrates is 1 cm and there is room for it, and the second acquisition hand 61a and the second return hand 61b for low-speed transport are used for transport.

[0155] Step S12: Move the carrier robot IR to the rear of the carrier C. Then, the arm 13 of the carrier robot IR moves in the vertical direction. When there is a height of 2 cm between the substrate W of the transport object and the substrate W below, the first acquisition hand 51a is positioned at the height of the substrate W of the transport object. The first acquisition hand 51a holds the substrate W of the transport object and transfers it to the path 24 (refer to the arrow a in Figure 13). The transport of the substrate W at this time is high-speed transport. On the other hand, when there is a height of 1 cm between the substrate W of the transport object and the substrate W below, the second acquisition hand 61a is positioned at the height of the substrate W of the transport object. The second acquisition hand 61a holds the substrate W of the transport object and transfers it to the path 24. The transport of the substrate W at this time is low-speed transport.

[0156] Step S13: The unprocessed substrate W held in the path 24 is transferred by the central robot CR to the single-wafer processing chamber 5a (see arrow b in FIG. 13). The single-wafer processing chamber 5a performs a cleaning process on the substrate W. The processed substrate W is transferred by the central robot CR to the path 24 (see arrow c in FIG. 13).

[0157] Step S14: The cleaned substrate W after the cleaning process is transported by either the first return hand 51b or the second return hand 61b. The substrate W transported to the path 24 by the first acquisition hand 51a in step S12 is returned from the path 24 to the carrier C by the first return hand 51b. The transportation of the substrate W at this time is high-speed transportation. In addition, the substrate W transported to the path 24 by the second acquisition hand 61a in step S12 is returned from the path 24 to the carrier C by the second return hand 61b (refer to the arrow d in Figure 13). The transportation of the substrate W at this time is low-speed transportation. The substrate W held by a certain protrusion of the comb-shaped member 7 of the carrier C returns to the same protrusion through the substrate acquisition action and the substrate return action.

[0158] Step S15: When the substrate W is returned to the carrier C, the substrate W is positioned again in the same manner as in step S11. Thus, the operation of the substrate transport device of this example is completed.

[0159] In addition, the operation description from step S1 to step S15 described above focuses on one substrate W. Therefore, when a plurality of substrates W are transported from the carrier C and the substrates W are cleaned, step S12 may be repeated before proceeding to step S13. Similarly, step S14 may be repeated before proceeding to step S15.

[0160] Furthermore, in the case where the position of the substrate W with a large warpage is determined in advance in the carrier C, the first acquisition hand 51a and the second acquisition hand 61a can be used separately according to the user's instruction. That is, in the case where all the substrates W in the carrier C are warped, for example, the arm 13 is controlled in such a manner that all the substrates W are transported by the second acquisition hand 61a. On the other hand, in the case where all the substrates W in the carrier C are flat, for example, the arm 13 is controlled in such a manner that all the substrates W are transported by the first acquisition hand 51a. If the user inputs information related to the shape of the substrate W at each position in the carrier C into the substrate transport device, the first acquisition hand 51a and the second acquisition hand 61a can be used separately in a single carrier C to perform operations. The shape of the substrate W in this case means the warpage of the substrate W.

[0161] 14. Effects of Example 2 The substrate transport device of this example has two types of hands, namely, the first acquisition hand 51a and the first return hand 51b for high-speed transport, and the second acquisition hand 61a and the second return hand 61b for low-speed transport, and is provided with a control unit 100 for distinguishing between the first acquisition hand 51a and the first return hand 51b and the second acquisition hand 61a and the second return hand 61b for transporting the substrate W. By configuring in this way, when the shape of the substrate W is close to flat, the first acquisition hand 51a and the first return hand 51b can be used to transport at high speed, and when the warpage of the substrate W is large, the second acquisition hand 61a and the second return hand 61b can be used to transport at low speed. That is, according to the substrate transport device of the present invention, the substrate W can be transported by a method more in accordance with the actual situation of the substrate W stored in the carrier C.

[0162] Furthermore, according to this example, the thickness A12 of the front end of the second acquisition hand 61a and the second return hand 61b in the height direction is smaller than the thickness A11 of the front end of the first acquisition hand 51a and the first return hand 51b in the height direction. With such a configuration, even when the warpage of the substrate W is large and the minimum distance between the substrates is short, the substrate W to be transported can be transported more reliably by using the second acquisition hand 61a and the second return hand 61b.

[0163] According to this example, the space R1 between the first holding body 53a and the second holding body 53b of the first acquisition hand 51a and the first return hand 51b is smaller than the space R2 between the first blade 63a and the second blade 63b of the second acquisition hand 61a and the second return hand 61b. By configuring in this way, the first acquisition hand 51a and the first return hand 51b can more reliably hold the substrate W, so that the substrate W can be transported at a high speed. On the other hand, the second acquisition hand 61a and the second return hand 61b can reliably hold the warped substrate W between the first blade 63a and the second blade 63b.

[0164] According to this embodiment, the first acquisition hand 51a and the first return hand 51b have a push rod 55 for holding the substrate W. Thus, the first acquisition hand 51a and the first return hand 51b can reliably hold the substrate W and transport it at high speed. In addition, the second acquisition hand 61a and the second return hand 61b do not have a push rod. Thus, the device structure can be simplified and the thickness of the second acquisition hand 61a and the second return hand 61b in the height direction can be reduced.

[0165] 15. Variations of the present invention The present invention is not limited to the above-mentioned structure, and can be implemented in the following modified manner.

[0166] <Variation 1> In the first embodiment, a configuration is described in which the first substrate W1 which is judged to be untransportable is left on the carrier C, but the present invention is not limited to this configuration, and the first substrate W1 can be transported. In this variation, after the second substrate W2 is transported from the carrier C, if the first substrate W1 is left on the carrier C, the first substrate W1 is transported by the acquisition hand 11a. FIG. 19 shows a state in which the first substrate W1 warped downward and the second substrate W2 below it are placed on the comb-shaped member 7 of the carrier C. The third substrate W3 is located below the second substrate W2 on the comb-shaped member 7. The distance between the first substrate W1 and the second substrate W2 is set to D5 by actual measurement based on the sensor holding member 21. The distance D5 is small to the extent that the acquisition hand 11a and the return hand 11b cannot enter between the first substrate W1 and the second substrate W2. Therefore, as long as the second substrate W2 is located on the carrier C, the first substrate W1 cannot be transferred from the carrier C.

[0167] On the other hand, the distance between the second substrate W2 and the third substrate W3 is set to D1 by actual measurement based on the sensor holding member 21. The distance D1 is large enough that the acquisition hand 11a and the return hand 11b can enter between the second substrate W2 and the third substrate W3. Therefore, the second substrate W2 can be transported from the carrier C regardless of the presence of the third substrate W3.

[0168] FIG. 20 shows the state of the carrier C after the second substrate W2 is transported from the carrier C. After the second substrate W2 is transported, the first substrate W1 and the third substrate W3 remain on the carrier C. Between the first substrate W1 and the third substrate W3, there is a hollow protrusion of the comb-shaped member 7. Therefore, the distance D6 between the first substrate W1 and the third substrate W3 is at least greater than the distance D1. That is, the acquisition hand 11a and the return hand 11b can enter between the first substrate W1 and the third substrate W3. Therefore, even if the carrier C is in the state shown in FIG. 19, as long as the second substrate W2 and the first substrate W1 are transported in the order, the first substrate W1 that is temporarily set to be untransportable can be transported from the carrier C. In addition, when returning the substrate W to the carrier C, it is sufficient to transport it in the order of the first substrate W1 and the second substrate W2.

[0169] In the above configuration, after the second substrate W2 is transported from the carrier C, if the first substrate W1 previously determined to be untransportable is left on the carrier C, the first substrate W1 is transported by the receiving hand 11a and the returning hand 11b. With this configuration, the first substrate W1 will not be left on the carrier C in the end.

[0170] <Variation 2> In the above-mentioned first embodiment, the relationship between the speed at which the sensor holding member 21 enters between the substrates and the speed at which the acquisition hand 11a and the return hand 11b enter between the substrates is not mentioned. In this regard, the entry speeds of the acquisition hand 11a and the return hand 11b can be made faster than the entry speed of the sensor holding member 21. According to this variation, the sensor holding member 21 is made to enter between the first substrate W and the second substrate W2 at the first speed, and the acquisition hand 11a is made to enter between the first substrate W1 and the second substrate W2 at a speed higher than the first speed. In the configuration of this variation, since the acquisition hand 11a and the return hand 11b enter between the substrates at a faster speed than the sensor holding member 21, the effect of faster substrate transfer processing is obtained. Furthermore, by slowing down the entry speed of the sensor holding member 21, even if the sensor holding member 21 enters a narrow space between substrates as described in FIG. 11B , the sensor holding member 21 does not contact the substrate W. On the other hand, the acquisition hand 11a and the return hand 11b will not enter a space between substrates that is close to being unable to be transported, so the entry speed can be set to a high speed.

[0171] <Variation 3> In the above-mentioned embodiment 2, it is also possible to further provide the sensor holding member 21 of embodiment 1. The sensor holding member 71 in FIG. 21 is a member that enters between adjacent substrates W. The sensor holding member 71 holds the first sensor 81 for measuring the distance between the upper substrate W and the second sensor 82 for measuring the distance between the lower substrate W. By inserting the sensor holding member 71 between the substrates, the minimum distance between the substrates can be measured. It is also possible to determine which hand to use for conveying the first substrate W1 based on the measured distance. That is, when the first substrate W1 is greatly warped and it is preferred not to convey the substrate at a low speed, the second acquisition hand 61a is used to convey the first substrate W1. In addition, when the first substrate W1 is slightly warped and there is no problem with conveying the substrate at a high speed, the first acquisition hand 51a is used to convey the first substrate W1. Since the distance between the first substrate W1 and the second substrate W2 is short if the first substrate W1 is greatly warped, it is preferable to carry out substrate transportation at a low speed. Furthermore, since the first substrate W1 is easily in contact with the hand if the first substrate W1 is greatly warped, it is preferable to use the second blade 63a and the second blade 63b to carry the first substrate W1 using the hand 61a. On the other hand, when the first substrate W1 is flat, it is preferable to carry out substrate transportation at a high speed. In this way, the processing capacity of the substrate transportation device can be improved.

[0172] <Variation 4> In the above-mentioned first embodiment, as shown in FIG. 22, the acquisition hand 11a can be configured to also serve as the sensor holding member 21. That is, the acquisition hand 11a is provided with the first sensor 41 and the second sensor 42. According to this configuration, the sensor group 43 is provided at the front end of the hand body 31 closer to the guide member 32. With such a configuration, the sensor holding member 21 can be omitted, and a substrate transport device of a simple configuration can be provided.

[0173] 1: Substrate processing equipment 3: Carrier Block 5: Processing Blocks 5a: Single-wafer processing chamber 7: Comb-shaped component 10: Wafer Loader and Unloader 11a: Get with your hands 11b: Return with hands 12,13: Arm 21,71: Sensor holding member 23: Maintaining the component body 24: Path 25a: 1st protrusion 25b: Second protrusion 26,36,56,66: base 31,53,63: Hand body 32,34,54,64: guide member 33a, 53a: First holding body 33b, 53b: Second holding body 35,55:Putter 41: 1st sensor 42: Second sensor 43: Sensor Group 43a: 1st sensor group 43b: Second sensor group 51a: First acquisition with hands 51b: 1st return with hand 52: First guide member 61a: Second acquisition with hands 61b: Second return with hands 62: Second guide member 63a: 1st leaf 63b: 2nd leaf 81: 1st sensor 82: Second sensor 100: Control Department A1, A2, A11, A12: Thickness A21, A22: Separation distance a,b,c,d:arrows C:Carrier CR: Center Robot D1,d1,d3,D5,d5,D6,d6,d7,d8,d9,U: distance D2,d2: minimum distance D3: Lowest value D4: Lowest value IR:Transmitter Robot Lmin: The second minimum distance R1: Space R2: Space S1~S8,S11~S15: Steps s1: 1st measurement position s2: Second measurement position Umin: 1st minimum distance W: substrate W1: 1st substrate / substrate W2: 2nd substrate / substrate W3: 3rd substrate X: front and rear direction / front direction / Y: Width direction Z: vertical direction

Claims

1. A substrate conveying device, characterized in that it comprises: a hand, which holds a plurality of substrates horizontally at predetermined intervals along a vertical direction and has an opening on one side for taking out and holding the substrates, thereby holding and conveying the substrates one by one by entering between adjacent substrates. The sensor holding member is a member that enters between adjacent upper and lower substrates, and includes a first sensor for measuring the distance between the upper substrate and a second sensor for measuring the distance between the lower substrate; and a control unit that controls the aforementioned hand and the aforementioned sensor holding member to move forward and backward between the upper and lower adjacent substrates through the opening of the aforementioned carrier; and the aforementioned control unit determines the minimum distance between the substrates by causing the aforementioned sensor holding member to enter between the first substrate of the transport object and the second substrate located below the aforementioned first substrate, based on the sum of the first minimum distance between the substrate at the first measurement position closest to the aforementioned first substrate of the aforementioned first sensor and the second minimum distance between the substrate at the second measurement position closest to the aforementioned second substrate of the aforementioned second sensor, the aforementioned first minimum distance is obtained by continuously measuring the vertical distance between the aforementioned first sensor and each position of the aforementioned first substrate along a line extending in the front-back direction while the aforementioned first sensor moves from the rear end to the front end of the aforementioned first substrate; The aforementioned second minimum distance is the minimum distance obtained by continuously measuring the vertical distance between the aforementioned second sensor and various positions of the aforementioned second substrate along a line extending in the front-rear direction while the aforementioned second sensor moves from the rear end to the front end of the aforementioned second substrate. When the aforementioned hand is to enter between the aforementioned first substrate and the aforementioned second substrate, the entry height of the aforementioned hand is adjusted according to the minimum distance between the aforementioned substrates in such a way that the distance from the aforementioned hand to the aforementioned first substrate and the distance from the aforementioned hand to the aforementioned second substrate are both above a predetermined value.

2. The substrate conveying device of claim 1, wherein the front end of the aforementioned hand includes a guide member for the end of the substrate to abut; and the front end of the aforementioned sensor holding member includes the aforementioned first sensor and the aforementioned second sensor; the thickness of the front end of the aforementioned sensor holding member in the height direction is less than the thickness of the front end of the aforementioned hand in the height direction.

3. The substrate conveying device of claim 1, wherein the first sensor measures a distance while moving from the end of the first substrate located before the opening of the carrier toward the depth of the carrier; the second sensor measures a distance while moving from the end of the second substrate located before the opening of the carrier toward the depth of the carrier; and the control unit adjusts the entry height of the hand at a first measurement position where the first substrate is closest to the first sensor and at a second measurement position where the second substrate is closest to the second sensor, such that the distance from the hand to the first substrate and the distance from the hand to the second substrate are both above a predetermined value.

4. The substrate conveying device as claimed in claim 3, wherein the control unit adjusts the entry height of the hand in such a manner that the distance from the hand to the first substrate at the first measurement position and the distance from the hand to the second substrate at the second measurement position are the same.

5. The substrate conveying apparatus of claim 1, wherein the aforementioned sensor holding member does not convey the substrate.

6. The substrate conveying device of claim 3, wherein the control unit prevents the hand from entering between the first substrate and the second substrate when the distance between the first substrate and the second substrate is too short to simultaneously set the distance from the hand to the first substrate at the first measurement position and the distance from the hand to the second substrate at the second measurement position to a predetermined value or higher.

7. The substrate conveying apparatus of claim 1, wherein the upper surface of the aforementioned sensor holding member is located above the lower end of the aforementioned first sensor; and the lower surface of the aforementioned sensor holding member is located below the upper end of the aforementioned second sensor.

8. The substrate conveying device of claim 1, wherein the aforementioned hand comprises: a first holding body for holding one end of the substrate and a second holding body for holding the other end of the substrate; and the aforementioned sensor holding member has at least two sensor groups consisting of the aforementioned first sensor and the aforementioned second sensor; the first sensor group measures the distance between the aforementioned first substrate and the aforementioned second substrate at the entry position of the aforementioned first holding body, and the second sensor group measures the distance between the aforementioned first substrate and the aforementioned second substrate at the entry position of the aforementioned second holding body.

9. The substrate conveying apparatus of claim 8, wherein the aforementioned sensor holding member comprises: a first protrusion extending corresponding to the aforementioned first holding body, and a second protrusion extending corresponding to the aforementioned second holding body.

10. The substrate conveying apparatus of claim 9, wherein the aforementioned sensor holding member includes the aforementioned sensor group at the front end of the aforementioned first protrusion and at the front end of the aforementioned second protrusion.

11. The substrate conveying apparatus of claim 9, wherein the aforementioned sensor holding member includes the aforementioned first sensor and the aforementioned second sensor at the same position of the aforementioned first protrusion, and includes the aforementioned first sensor and the aforementioned second sensor at the same position of the aforementioned second protrusion.

12. The substrate conveying apparatus of claim 1, wherein the control unit prevents the hand from entering between the first substrate and the second substrate when the distance between the first substrate and the second substrate is too short to allow the sensor holding member to enter between the first substrate and the second substrate.

13. The substrate conveying apparatus of claim 1, wherein after the control unit has conveyed the second substrate from the carrier, if the first substrate remains on the carrier, the control unit causes the hand to convey the first substrate.

14. The substrate conveying apparatus of claim 1, wherein the aforementioned control unit causes the aforementioned sensor holding member to enter between the aforementioned first substrate and the aforementioned second substrate at a first speed, and causes the aforementioned hand to enter between the aforementioned first substrate and the aforementioned second substrate at a second speed that is faster than the aforementioned first speed.

15. The substrate conveying apparatus of claim 1, wherein the aforementioned sensor holding member is located in the same position as the aforementioned hand before entering between substrates.

16. The substrate conveying apparatus of claim 1, wherein the aforementioned hand also serves as the aforementioned sensor holding member; and the aforementioned first sensor and the aforementioned second sensor are mounted on the aforementioned hand.

17. A substrate processing apparatus, characterized in that it comprises: a substrate conveying device as claimed in claim 1; and a processing unit that performs a prescribed processing on a substrate conveyed by the aforementioned substrate conveying device.

Images