GPU modules and processing equipment

Abstract

This disclosure relates to a GPU module and processing device. The GPU module includes: multiple GPU units, a redistribution layer, a substrate layer, and a PCB. The substrate layer includes multiple substrates and an interlayer dielectric that fixes the multiple substrates together and is located between adjacent substrates. Multiple substrate bumps are provided on the bottom surface of each substrate. The redistribution layer is disposed on the top surface of the substrate layer. Each GPU unit is soldered and fixed above the redistribution layer and to a corresponding substrate position via multiple chip bumps provided on the bottom surface. Each chip bump is connected to a corresponding substrate bump via wires in the redistribution layer and wires in the substrate. The substrate layer is soldered and fixed to the top surface of the PCB using the substrate bumps. Each substrate has at least one GPU unit on top, which significantly increases the number of GPUs that can be deployed in the GPU module and reduces the motherboard space occupied by the GPU module and the power consumption.

Description

Technical Field

[0001] Field of the Invention

[0002] The present disclosure relates to the field of GPU technology, and in particular to a GPU module and a processing device. Prior Art

[0003] Background of the Invention

[0004] Graphics processing unit (GPU), also known as display core, visual processor, display chip, is a microprocessor that performs image and graphics related calculations on personal computers, workstations, game consoles and some mobile devices (such as tablets, smart phones, etc.). Due to the use requirements of some devices, multiple GPUs are usually required. Taking the server as an example, due to the large amount of calculation, it needs as many GPUs as possible, but in the relevant technology, the number of servers installed is limited due to the large space required to install multiple GPU modules on the motherboard, and the power consumption is very high. How to provide a GPU setting method that can reduce power consumption and save space is a technical problem that needs to be solved urgently. Summary of the invention

[0005] SUMMARY OF THE INVENTION

[0006] In view of this, the present disclosure proposes a GPU module and a processing device.

[0007] According to one aspect of the present disclosure, a GPU module is provided, the GPU module comprising: a plurality of GPU units, a redistribution layer, a substrate layer and a PCB, The substrate layer includes a plurality of substrates, an interlayer medium that fixes the plurality of substrates together and is located between adjacent substrates, and a plurality of substrate bumps are provided on the bottom surface of each substrate; The redistribution layer is arranged on the top surface of the substrate layer, and each of the GPU units is fixed to a position matching the corresponding substrate above the redistribution layer by welding a plurality of wafer bumps arranged on the bottom surface, and each of the wafer bumps is connected to a corresponding substrate bump by means of wires in the redistribution layer and wires in the substrate; The substrate layer is fixed to the top surface of the PCB by welding each of the substrate bumps; Wherein, at least one GPU unit is arranged above each of the substrates.

[0008] In a possible implementation, the GPU unit includes a GPU die; or, the GPU unit includes a GPU die and a dynamic random access memory.

[0009] In one possible implementation, The GPU unit includes a GPU die, a high-bandwidth memory, and an interposer, and the bottom surface of the interposer is provided with the plurality of chip bumps; The GPU die is fixed to the top surface of the interposer by welding a plurality of first bumps arranged on the bottom surface, and each of the first bumps is connected to a corresponding wafer bump through a wire in the interposer; The high-bandwidth memory is fixed to the top surface of the intermediary layer by welding using a plurality of second bumps arranged on the bottom surface, and each of the second bumps is connected to a corresponding chip bump through a wire in the intermediary layer.

[0010] In a possible implementation, the GPU unit further includes: a packaging layer for packaging the GPU die and the high-bandwidth memory.

[0011] In a possible implementation manner, one or more gaps are provided on the PCB.

[0012] In a possible implementation, the PCB includes a plurality of PCBs, gaps exist between adjacent PCBs, and the plurality of PCBs are fixedly connected together.

[0013] In a possible implementation, one or more gaps are further provided on some or all of the multiple PCBs.

[0014] In a possible implementation, the top surface and / or the upper surface of the PCB is also provided with at least one input / output connector and at least one power connector. Each of the input and output connectors is used to achieve a communication connection between the GPU module and an external device; Each of the power connectors is used to connect to a power source that supplies power to the GPU module.

[0015] In a possible implementation, the input / output connector and the power connector provided on the PCB are located at the edge area of ​​the PCB, and the PCB module further includes a heat dissipation component. The heat dissipation component includes a shell and a coolant inside the shell, the PCB is fixedly connected to the shell, and the area of ​​the PCB other than the edge area is inside the shell, and the edge area of ​​the PCB is outside the shell, so that the input and output connectors and the power connector are outside the shell, and the PCB and the components installed on the PCB other than the edge area are in contact with the coolant; Wherein, the coolant is an insulating liquid.

[0016] In a possible implementation manner, at least one fixing component is disposed inside the housing, and the PCB is fixedly connected to the housing by means of the at least one fixing component.

[0017] In a possible implementation, one or more voltage regulating modules and / or at least one other chip are disposed on the bottom surface of the PCB. Each of the GPU units is connected to a corresponding voltage regulating module through the PCB, and each of the voltage regulating modules is used to control the voltage input into the connected GPU unit; Each of the other chips is a control chip or a logic chip.

[0018] According to another aspect of the present disclosure, there is provided a processing device, comprising: the above-mentioned GPU module and a mainboard, wherein the GPU module is fixedly mounted on the mainboard.

[0019] The GPU module and processing device provided by the embodiments of the present disclosure can significantly increase the number of GPUs that can be deployed, and the GPU module occupies less motherboard space and consumes less power, and the number of GPUs can be flexibly set according to the GPU usage requirements of the device to be installed.

[0020] Other features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. Simple diagram description

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure. 1 and 2 are schematic cross-sectional views of a GPU module according to an embodiment of the present disclosure. 3 and 4 are top view schematic diagrams of the GPU module in the embodiments of the present disclosure. 5 and 6 are schematic diagrams showing the structure of a GPU unit in an embodiment of the present disclosure. 7-8 respectively show a cross-sectional view and a top view of a GPU module in an embodiment of the present disclosure. 9-10 respectively show a cross-sectional schematic diagram and a top view of a GPU module in an embodiment of the present disclosure. Implementation

[0022] Detailed description of preferred embodiments

[0023] Various exemplary embodiments, features, and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0024] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0025] In addition, in order to better illustrate the present disclosure, many specific details are given in the following specific embodiments. Those skilled in the art should understand that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the main purpose of the present disclosure.

[0026] In order to solve the above technical problems, the present disclosure provides a GPU module and a processing device, the number of GPUs that can be deployed is significantly increased, the GPU module occupies less motherboard space, consumes less power, and the number of GPUs can be flexibly set according to the GPU usage requirements of the device to be installed. As shown in FIG1 , the GPU module 10 includes a plurality of GPU units 100, a redistribution layer 200, a substrate layer 300 and a PCB 500.

[0027] The substrate layer 300 may include a plurality of substrates 301, an interlayer dielectric 302 that fixes the plurality of substrates 301 together and is located between adjacent substrates 301, and a plurality of substrate bumps 400 are disposed on the bottom surface of each substrate 301. The surface of the substrate layer 300 where the bottom surface of the substrate 301 is located is also the bottom surface of the substrate layer 300.

[0028] The rewiring layer 200 is arranged on the top surface of the substrate layer 300 (the side opposite to the bottom surface of the substrate layer 300), and each GPU unit 100 is welded and fixed to a position matching the corresponding substrate 301 above the rewiring layer 200 through a plurality of chip bumps 105 arranged on the bottom surface, and each chip bump 105 is connected to a corresponding substrate bump 400 by means of wires in the rewiring layer 200 and wires in the substrate 301.

[0029] The substrate layer 300 is fixed on the top surface of the PCB 500 by welding using the substrate bumps 400 .

[0030] In this embodiment, during the manufacturing process, multiple substrates 301 can be first fixed on a temporary carrier according to a preset position, and then an interlayer dielectric is filled between the substrates 301 to realize the production of the substrate layer 300. The size of the formed substrate layer 300 can be 150mm×150mm~515mm×515mm, for example, 500mm×500mm. The material of the interlayer dielectric is an insulating material. At least one GPU unit 100 is arranged above each substrate 301. In this way, the substrate layer 300 formed by multiple substrates 301 and interlayer dielectric 302 uses panel-level fan-out to make the strength of the substrate layer 300 meet the mechanical strength requirements of the entire GPU module and reduce the stress of the GPU module (reducing the stress between the substrate layer 300 and the PCB 500). At the same time, due to the setting of the substrate 301, the power supply requirements of the GPU unit can also be met. Those skilled in the art can set the number of substrate layers in the GPU module and the size of each substrate according to actual needs, and the present disclosure does not limit this. In some embodiments, the substrate bumps may be a ball grid array (BGA), so that the structural arrangement of the substrate layer 300 can reduce the BGA stress between the substrate layer 300 and the PCB 500, and further reduce the GPU module stress.

[0031] In this embodiment, the number of wiring layers of the redistribution layer 200 can be set according to the number of CPU units 100 to meet the electrical connection requirements of GPU modules 10 with different numbers of GPU units 100, and the present disclosure does not limit this. In this way, the redistribution layer using panel-level fan-out realizes the P-2-P connection between the GPU unit and the substrate layer, and realizes the connection between different GPU units.

[0032] The interconnection density of the GPU module 10 provided in this embodiment is significantly improved. The ratio of the area S0 of the GPU unit 100 to the effective area S1 occupied by the GPU unit 100 on the PCB 500 is also significantly improved, S0 / S1 can be as high as 90% or even higher, and the chip occupancy ratio per unit area is significantly improved (that is, the number of GPU bare chips that can be set on the same area is significantly increased). Taking the server as an example, in the related art, the GPU is directly installed on the PCIe or OAM (such as SXM) board as a module, and only 8-16 GPU modules can be installed on the server motherboard, and the power consumption between the modules is very high. The interconnection density of the GPU module 10 provided in this embodiment installed in the server is at least 6 times the interconnection density in the existing server (OAM to OAM or PCIe to PCIe). For example, if the effective area of ​​each GPU on the PCB in the related art is 1650 cm2 when the GPU is installed in the PCIe or OAM method (the effective area may be larger in different installation situations), then the effective area of ​​the GPU unit on the PCB 500 can also be reduced from 1650 cm2 in this example to at least 70 cm2 (different GPU unit settings result in different effective areas, which can also be greater than 70 cm2 but still much smaller than 1650 cm2).

[0033] In a possible implementation, as shown in FIG. 1 to FIG. 4, FIG. 1 and FIG. 2 are cross-sectional views formed by cutting out the position of M in FIG. 3 and FIG. 4, and only some components are schematically drawn in FIG. 3 and FIG. 4 for simplicity and clarity. The PCB 500 in the GPU module 10 may be one, and one or more slits 501 are provided on the PCB 500, and each of the slits 501 is located in an area on the PCB 500 that is not connected to the substrate bump 400. In a possible implementation, the PCB 500 in the GPU module 10 may include multiple PCBs, and the multiple PCBs may be fixedly connected together by means of snap connection, bolt connection, etc. In some embodiments, when the PCB 500 includes multiple PCBs, there are gaps between adjacent PCBs. In some embodiments, when the PCB 500 includes multiple PCBs, one or more slits are provided on some or all of the multiple PCBs, and each of the slits is located in an area on the PCB that is not connected to the substrate bump 400.

[0034] In some embodiments, each of the slits 501 may be located in other areas outside the installation area corresponding to the GPU unit 100. In some embodiments, each of the slits 501 may be located in other areas outside the projection area of ​​the substrate 301 on the PCB 500. In some embodiments, the slits may be "open" slits as shown in FIG. 3 and FIG. 4. The slits may also be closed strips, S-shaped or other shaped structures. In this way, the provision of slits may reduce the stress on the substrate layer 300 and the redistribution layer 200, so that the entire GPU module has better reliability and stability in structure.

[0035] Those skilled in the art can set the width, length, structural shape and position of the gap according to the size and thickness of the substrate layer 300 and the redistribution layer 200, the number of substrates 301 and the size of each substrate 301, and the present disclosure does not limit this.

[0036] In a possible implementation, as shown in FIG. 2 , the bottom surface of the PCB 500 (the side not connected to the substrate layer 300) is provided with one or more voltage regulator modules (VRM) 602 and / or at least one other chip 601. Among them. Each voltage regulator module 602 is connected to the corresponding GPU unit 100, other chips 601 and other components that need to be input voltage controlled through the PCB 500, and each voltage regulator module 602 is used to control the voltage input to the connected GPU unit 100, other chips 601 and other components to ensure the stable operation of the GPU module 10. The voltage regulator module 602 can convert the received larger external voltage into a smaller input voltage that can be used by the components in the GPU module. For example, the external voltage can be 40V-60V, and the input voltage to each component in the GPU module is 0.75V, 1V and other smaller input voltages. For example, the external voltage is 54V and the converted input voltage is 0.75V, which is not limited in the present disclosure. Other chips 601 may be logic chips, control chips, and other chips required in the GPU module 10 that are different from the GPU unit, and the present disclosure does not impose any restrictions on this.

[0037] In a possible implementation, as shown in FIG2 , the GPU module 10 may further include at least one IO connector and at least one power connector. Each IO connector may be disposed on the top or bottom surface of the PCB 500, and each IO connector is used to implement a communication connection between the GPU module 10 and an external device; for example, the IO connector may implement a communication connection between the GPU unit 100, other chips 601, and an external device. The power connector is used to connect to a power supply that supplies power to the GPU module 10.

[0038] In this embodiment, the installation positions of the voltage regulating module 602, other chips 601, input / output connectors and power connectors on the PCB 500 can be set according to actual needs, and the present disclosure does not limit this.

[0039] In a possible implementation, as shown in FIG5 , the GPU unit 100 may include a GPU die 101 and a dynamic random access memory (DRAM) 108, and the bumps disposed on the bottom surfaces of the GPU die 101 and the dynamic random access memory 108 are wafer bumps 105. In some embodiments, the GPU unit 100 may also include only the GPU die 101, and the bumps disposed on the bottom surface of the GPU die 101 are wafer bumps 105.

[0040] In a possible implementation, as shown in FIG6 , the GPU unit 100 may include a GPU die 101, an interposer 104, a high bandwidth memory (HBM) 102, and a packaging layer 106. The bottom surface of the interposer 104 (the side corresponding to the top surface of the interposer 104) is provided with the plurality of wafer bumps 105. The GPU die 101 is welded and fixed to the top surface of the interposer 104 using a plurality of first bumps 103 arranged on the bottom surface, and each of the first bumps 103 is connected to a corresponding wafer bump 105 through a wire in the interposer 104. The high bandwidth memory 102 is welded and fixed to the top surface of the interposer 104 using a plurality of second bumps 107 arranged on the bottom surface, and each of the second bumps 107 is connected to a corresponding wafer bump 105 through a wire in the interposer 104. The packaging layer 106 is used to encapsulate the GPU die 101 and the high bandwidth memory 102. By setting the high-bandwidth memory 102 in the GPU unit 100, the GPU die 101 in the GPU unit 100 can directly use the high-bandwidth memory 102, shortening the distance between the GPU die 101 and its corresponding high-bandwidth memory 102, improving the access speed and efficiency of the GPU die 101 to the high-bandwidth memory 102, thereby improving the working efficiency and speed of the GPU die 101 and reducing the power consumption of the GPU die 101.

[0041] In some embodiments, as shown in FIG. 6 , the encapsulation layer 106 only covers a portion of the GPU die 101 and the high-bandwidth memory 102, such as only encapsulating and covering the exposed surfaces of the GPU die 101 and the high-bandwidth memory 102 except the top surface (the side opposite to the bottom surface). In this way, the overall thickness of the GPU unit 100 can be reduced, the size of the entire GPU unit 100 can be reduced, and the size of the entire GPU module 10 can be reduced.

[0042] In some embodiments, the GPU unit 100 may also include a GPU die 101, an intermediate layer 104 and a high-bandwidth memory 102. The only difference from the GPU unit example shown in FIG6 is that no encapsulation layer is provided. For the description of the relevant structure, please refer to the corresponding example in FIG6 , which will not be described in detail to avoid redundancy.

[0043] In a possible implementation, as shown in FIG. 7 to FIG. 10 , the GPU module 10 may further include a heat dissipation component 700. The heat dissipation component 700 may include a housing 701 and a coolant 702 located inside the housing 701. The coolant 702 is sealed inside the housing 701, and the coolant 702 may be an insulating liquid. The input / output connector and the power connector provided on the PCB 500 may be located at the edge area of ​​the PCB 500. The PCB 500 is fixedly connected to the housing 701, and the area of ​​the PCB 500 other than the edge area is located inside the housing 701, and the edge area of ​​the PCB 500 is located outside the housing 701, so that the input / output connector and the power connector are located outside the housing 701, and the PCB 500 and the components installed on the area of ​​the PCB 500 other than the edge area are in contact with the coolant 702. In this way, placing the input / output connector and the power connector outside the housing 701 can ensure that the GPU module 10 is normally connected to external devices, while achieving heat dissipation and cooling of other components (GPU unit, other chips, voltage regulation module, etc.) on the PCB 500 with the help of the coolant 702 that can flow inside the housing 701. In addition, since most of the components of the GPU module 10 are inside the housing 701, the heat dissipation component 700 also achieves the encapsulation of the GPU module 10, providing better protection for the reliability and stability of the GPU module 10.

[0044] The coolant 702 directly contacts the components in the GPU module 10, which can reduce the temperature of each component to achieve heat dissipation and reduce the temperature difference between components (such as the temperature difference between the substrate 301 and the PCB 500). In some embodiments, the material of the coolant can be an oil-based fluorinated liquid, etc.

[0045] In this embodiment, the edge area of ​​the PCB 500 outside the housing 701 can be set according to actual needs, and the edge area of ​​the housing 701 exposed can be any one or more edge areas of the four sides of the PCB 500. For example, as shown in Figures 7 and 8, only the edge area of ​​a certain side of the PCB 500 can be exposed to the housing 701. As shown in Figures 9 and 10, the edge areas of two opposite sides of the PCB 500 can also be exposed to the housing 701, and the present disclosure is not limited to this.

[0046] In a possible implementation, as shown in FIGS. 7 to 10 , at least one fixing component K may be further provided on the housing 701 of the heat dissipation component 700, so that the PCB 500 in the GPU module 10 can be fixed inside the housing 701 by means of the fixing component. The implementation of fixing inside the housing 701 by means of the fixing component includes: clamping, bolting, rivet connection, direct bonding, etc., which are not limited in the present disclosure.

[0047] For example, a hole or a groove may be provided at a position corresponding to the fixing component K on the PCB 500, so that the hole or the groove on the PCB 500 can be snapped together with the corresponding fixing component K to achieve a fixed connection, ensuring that the PCB 500 is fixed inside the housing 701 and does not shake due to the coolant 702 of the housing 701. Alternatively, a limiting hole may be provided at a position corresponding to the fixing component K on the PCB 500, so that the limiting hole on the PCB 500 can be fixedly connected with the corresponding fixing component K by bolts or rivets, ensuring that the PCB 500 is fixed inside the housing 701 and does not shake due to the coolant 702 of the housing 701.

[0048] The present disclosure also provides a processing device, comprising a mainboard and the above-mentioned GPU module 10, wherein the GPU module 10 is fixedly mounted on the mainboard.

[0049] It should be noted that although the GPU module and the processing device are introduced as examples in the above embodiments, those skilled in the art will understand that the present disclosure should not be limited thereto. In fact, users can flexibly set each part according to personal preferences and / or actual application scenarios, as long as they comply with the technical solutions of the present disclosure.

[0050] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other ordinary skill in the art to understand the embodiments disclosed herein.

[0051] 10: GPU module 100: GPU unit 101:PU bare chip 102: High bandwidth memory 103: first bump 104: Intermediary layer 105: Wafer bump 106: Encapsulation layer 107: Second bump 108: Memory 200: Rewiring layer 300: substrate layer 301: base plate; upper base plate 302: Interlayer dielectric 400:Substrate bump 500:PCB 501: Gap 601: Chip 602: voltage regulation module 700: Heat dissipation components 701: Shell 702: Coolant K: Fixed parts M: Location

Claims

1. A GPU module, characterized in that the GPU module comprises: The system comprises multiple GPU units, a redistribution layer, a substrate layer, and a PCB. The substrate layer includes multiple substrates and an interlayer dielectric that fixes the multiple substrates together and is located between adjacent substrates. Each substrate has multiple substrate bumps on its bottom surface. The redistribution layer is disposed on the top surface of the substrate layer. Each GPU unit is soldered and fixed above the redistribution layer and to a position matching the corresponding substrate through multiple chip bumps disposed on its bottom surface. Each chip bump is connected to a corresponding substrate bump via wires in the redistribution layer and wires in the substrate. The substrate layer is fixed to the top surface of the PCB by welding the substrate bumps. The top and / or bottom surface of the PCB is also provided with at least one input / output connector and at least one power connector. The input / output connector is used to realize the communication connection between the GPU module and external devices, and the power connector is used to connect to the power supply that powers the GPU module. At least one GPU unit is arranged on the top of each substrate.

2. The GPU module as claimed in claim 1, wherein the GPU unit comprises a GPU die; or, the GPU unit comprises a GPU die and dynamic random access memory.

3. The GPU module as claimed in claim 1, characterized in that the GPU unit includes a GPU die, a high-bandwidth memory, and an interposer layer, wherein the bottom surface of the interposer layer is provided with the plurality of chip bumps; the GPU die is soldered to the top surface of the interposer layer using the plurality of first bumps provided on the bottom surface, and each first bump is connected to a corresponding chip bump through a wire in the interposer layer; the high-bandwidth memory is soldered to the top surface of the interposer layer using the plurality of second bumps provided on the bottom surface, and each second bump is connected to a corresponding chip bump through a wire in the interposer layer.

4. The GPU module as described in claim 3, wherein the GPU unit further comprises: The encapsulation layer is used to encapsulate the GPU die and the high-bandwidth memory.

5. The GPU module as claimed in claim 1, characterized in that one or more gaps are provided on the PCB.

6. The GPU module as claimed in claim 1, wherein the PCB comprises a plurality of PCBs, there are gaps between adjacent PCBs, and the plurality of PCBs are fixedly connected together.

7. The GPU module as claimed in claim 6, characterized in that one or more gaps are provided on some or all of the PCBs.

8. The GPU module as claimed in claim 1, characterized in that the input / output connector and power connector disposed on the PCB are located in the edge region of the PCB, the PCB module further includes a heat dissipation component, the heat dissipation component includes a housing and a coolant inside the housing, the PCB is fixedly connected to the housing and the area of ​​the PCB other than the edge region is inside the housing, the edge region of the PCB is outside the housing, such that the input / output connector and power connector are outside the housing, and the PCB and the components mounted on the PCB except for the edge region are in contact with the coolant; wherein, The coolant is an insulating liquid.

9. The GPU module as claimed in claim 8, characterized in that at least one fixing component is provided inside the housing, and the PCB is fixedly connected to the housing by means of the at least one fixing component.

10. The GPU module as claimed in claim 1, characterized in that one or more voltage regulation modules and / or at least one other chip are disposed on the bottom surface of the PCB, each GPU unit is connected to a corresponding voltage regulation module through the PCB, and each voltage regulation module is used to control the voltage input to the connected GPU unit; each other chip is a control chip or a logic chip.

11. A processing apparatus, characterized in that it comprises: A GPU module and a motherboard, wherein the GPU module is fixedly mounted on the motherboard, and the GPU module is any one of the GPU modules described in requests 1-10.

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