Nozzle
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- YINYI RUBBER CO LTD
- Filing Date
- 2024-10-21
- Publication Date
- 2026-08-01
AI Technical Summary
Modern suction nozzles deform when engaged with vacuum devices, leading to failure in adhering to wafers and affecting die pick-up during wafer fabrication processes.
A suction nozzle design featuring grooves and protrusions that distribute deformation energy, allowing the nozzle to conform to the wafer surface and maintain vacuum adherence.
Reduces the risk of vacuum failure during die pick-up by confining deformation energy within the groove structure, ensuring effective wafer adhesion and successful die transfer.
Smart Images

Figure TWG2TB001903654_001 
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Abstract
Description
Technical Field
[0001] This work is about a wafer pick-up tool, and more particularly about a nozzle using a vacuum device. Prior Technology
[0002] In wafer fabrication, whether it's die sorting after wafer probing or die pick-up and bonding in the packaging process, nozzles are required as consumables for picking up dies. When using die sorting, the nozzle is placed on a vacuum device so that the wafer can be vacuumed through the nozzle and then picked up and moved by the nozzle.
[0003] Modern suction nozzles are mostly made of flexible materials and have a groove at the end opposite to the contact wafer, into which the vacuum device can engage. To maintain a tight seal between the nozzle and the vacuum device, the groove of the nozzle is slightly smaller than that of the vacuum device. Therefore, when the vacuum device engages in the groove, it slightly expands the groove of the nozzle.
[0004] However, because the size of the nozzle groove does not match the size of the vacuum device, the nozzle will deform when the vacuum device is locked in the groove. If the deformation occurs on the side that contacts the wafer, the nozzle may not be able to adhere to the wafer, resulting in failure to successfully evacuate the vacuum and affecting the pick-up of the die.
[0005] In view of this, proposing a better improvement plan is an urgent problem that the industry needs to solve. Summary of the Invention
[0006] The main purpose of this invention is to propose a suction nozzle that solves the problem that when the suction nozzle is engaged with the vacuum device, it will deform, causing the nozzle to fail to adhere to the wafer and affecting the pick-up of the wafer.
[0007] To achieve the above objectives, the present invention proposes a suction nozzle for connecting to a vacuum device, and it has the following features: An adsorption element having: A first surface and a second surface, which are two opposite surfaces of the adsorption element; At least one perforation extends from the first surface through the absorbent to the second surface; At least one set of grooves is uniformly distributed on the first surface of the adsorption member, and each set of grooves has: A joint groove, the opening of which is located on the first surface; At least one groove, the opening of which is located on the first surface, and the at least one groove is located around the engagement groove; A connector that connects the adsorption element and the vacuum device, and has: A through hole that passes through the connector and connects to each of the at least one through hole; At least one protrusion, the number of which corresponds to the at least one set of grooves, and each of the at least one protrusion can engage with the engagement groove of one of the at least one set of grooves.
[0008] As described above, each of the at least one perforation is located in one of the engagement grooves and extends from the bottom of the engagement groove to the second surface.
[0009] As described above, the nozzle further includes a ventilation channel through which the through hole connects to each of the at least one perforation.
[0010] As described above, the suction nozzle further includes a protrusion that protrudes from the second surface of the suction nozzle.
[0011] As described above, the nozzle has a rectangular cross-section.
[0012] As described above, the suction nozzle, wherein each of the at least one groove group has: A first direction, which is parallel to one side of the protrusion; Two grooves are located in the first direction and on both sides of the joint groove, respectively.
[0013] As described above, the suction nozzle, wherein each of the at least one groove group has: A first direction, which is parallel to one side of the protrusion; A second direction, which is perpendicular to the first direction; The four grooves are arranged in a first direction, with two grooves located on either side of the joint groove; and the other two grooves are located in a second direction, on either side of the joint groove.
[0014] As described above, the suction nozzle, The cross-section of the joint groove is square; The cross-section of the at least one groove is rectangular, and the length of the long side of the at least one groove is the same as the side length of the joint groove, and the short side of the at least one groove is aligned with one side of the joint groove.
[0015] As described above, the suction nozzle has at least one inclined surface located at the other end of the suction nozzle opposite the engagement groove.
[0016] The advantage of this invention lies in the presence of at least one groove around the bonding groove of the adsorption component. When the protrusion engages with the bonding groove, the deformation energy generated by the bonding groove is confined by the groove, allowing the protrusion of the nozzle to conform to the surface of the wafer. This reduces the risk of failure to achieve proper vacuuming, which could affect die pick-up. Simple Explanation of the Diagram
[0017] Figure 1 is an exploded view of the first embodiment of this invention; Figure 2 is a three-dimensional schematic diagram of an adsorption element according to the first embodiment of this invention; Figure 3 is a three-dimensional schematic diagram of the adsorption element according to the first embodiment of this invention; Figure 4 is a bottom view of the adsorption component according to the first embodiment of this invention; Figure 5 is a top view of the adsorption element according to the first embodiment of this invention; Figure 6 is a side view of the adsorption element according to the first embodiment of this invention; Figure 7 is a three-dimensional schematic diagram of the second embodiment of this invention; Figure 8 is an exploded view of the second embodiment of this invention; Figure 9 is a top view of an adsorption element according to the second embodiment of this invention; Figure 10 is a bottom view of the adsorption element according to the second embodiment of this invention. Implementation
[0018] Please refer to Figures 1 and 7. This invention proposes a suction nozzle for connecting to a vacuum device, and has an suction element 10 and a connector 20.
[0019] Please refer to Figures 2 to 4. The adsorption member 10 has a first surface 11, a second surface 12, at least one through hole 13, a protrusion 14, at least one set of grooves 15, and at least one inclined surface 16. The first surface 11 and the second surface 12 are two opposite surfaces of the adsorption member 10. The first surface 11 is the surface closer to the vacuum assembly. Each through hole 13 extends from the first surface 11 through the adsorption member 10 to the second surface 12. In a first embodiment, the adsorption member 10 has one through hole 13; in a second embodiment, the adsorption member 10A has five through holes 13. The protrusion 14 protrudes from the second surface 12 of the adsorption member 10 and can conform to the wafer surface. In the first embodiment, the cross-section of the protrusion 14 is rectangular; in other embodiments, the shape of the protrusion 14 is not limited to this.
[0020] Please refer to Figures 5 and 9. At least one groove group 15 is evenly distributed on the first surface 11 of the adsorption member 10. In the first embodiment, the adsorption member 10 has one groove group 15; in the second embodiment, the adsorption member 10A has four groove groups 15. In other embodiments, the number of groove groups 15 is not limited thereto. Each groove group 15 has a mating groove 151, at least one groove body 152, a first direction, and a second direction.
[0021] Taking the first embodiment as an example, the openings of both the joint groove 151 and the groove body 152 are located on the first surface 11, and the through hole 13 can penetrate from the bottom of the joint groove 151 to the second surface 12. The groove body 152 is located around the joint groove 151. In the first and second embodiments, the cross-section of the joint groove 151 is square; in other embodiments, the cross-sectional shape of the joint groove 151 is not limited to this. The first direction is parallel to one side of the protrusion 14, and the first direction and the second direction are perpendicular to each other. In the first and second embodiments, the first direction and the second direction are respectively parallel to one side of the joint groove 151; in other embodiments, the first direction and the second direction may not be parallel to the joint groove 151.
[0022] In the first and second embodiments, each groove group 15 has four grooves 152, two of which are located in the first direction and are respectively located on both sides of the joining groove 151; the other two grooves 152 are located in the second direction and are respectively located on both sides of the joining groove 151. In other words, the grooves 152 are arranged around the groove group 15. In other embodiments, the positional relationship between each groove 152 and the joining groove 151 is not limited to this, as long as they are evenly arranged around the joining groove 151. In the first and second embodiments, the cross-section of each groove 152 is rectangular, and the length of the long side of the groove 152 is the same as the side length of the joining groove 151, and the short side of the groove 152 is aligned with one side of the joining groove 151. In other embodiments, the shape of the groove 152 is not limited to this, and it can also be a ring groove surrounding the joining groove 151.
[0023] Please refer to Figure 6. The inclined surface 16 is located on the other end of the adsorption member 10 opposite to the bonding groove 151. In this way, when the protrusion 14 is attached to the wafer, the other structures of the adsorption member 10 will not come into contact with other non-target components on the wafer.
[0024] Please refer to Figures 1, 8, and 10. The connector 20 connects the adsorption member 10 and the vacuum device, and has a through hole 21 and at least one protrusion 22, and may selectively have a ventilation channel 23. The through hole 21 passes through the connector 20 and connects to each through hole 13 and the vacuum device. The number of protrusions 22 corresponds to the number of grooves 15, and the size of each protrusion 22 is slightly larger than the engagement groove 151 of the groove group 15. Thus, each protrusion 22 can engage with the engagement groove 151 of one of the groove groups 15.
[0025] In the first embodiment (as shown in FIG1), the connector 20 does not have a ventilation channel 23, and the through hole 21 can directly communicate with each of the perforations 13. In the second embodiment (as shown in FIG8 and FIG10), the connector 20A has a ventilation channel 23, which can connect the through hole 21 and each of the perforations 13. Therefore, when the vacuum device is evacuating, air will sequentially enter the vacuum device through each of the perforations 13, the ventilation channel 23, and the through hole 21. In the second embodiment, the ventilation channel 23 is a groove-shaped structure. In other embodiments, the shape of the ventilation channel 23 is not limited to this; the ventilation channel 23 can also be a tubular channel provided in the connector 20A, as long as it can connect each of the perforations 13 and the through hole 21.
[0026] When using the suction nozzle for suction, first engage each of the protrusions 22 of the connector 20 with the engagement groove 151 of one of the groove groups 15. Since the size of each protrusion 22 is slightly larger than the engagement groove 151 of the groove group 15, the protrusions 22 will spread the sidewall of the engagement groove 151 toward the groove 152 surrounding the engagement groove 151. In this way, the deformation caused by the engagement of the protrusions 22 and the engagement groove 151 can be confined within the groove 152, without affecting the flatness of the protrusion 14 of the suction nozzle in contact with the wafer. Then, place the suction nozzle against the wafer to be suctioned, and then turn on the vacuum device. At this time, air will enter the vacuum device through the perforations 13 and through holes 21 of the suction member 10 to achieve the purpose of evacuation, and then be sucked up and moved by the suction nozzle.
[0027] The advantage of this invention lies in the fact that at least one groove 152 is provided around the joint groove 151 of the adsorption component 10. When the protrusion 22 engages with the joint groove 151, the deformation energy generated by the joint groove 151 is limited by the groove 152, allowing the protrusion 14 of the suction nozzle to fit against the surface of the wafer. This reduces the risk of failure to successfully evacuate the vacuum, which could affect the pick-up of the die.
[0028] 10,10A: Adsorption element 11: First Page 12: Second page 13: Perforation 14: Protrusion 15: Groove assembly 151: Joint groove 152: Tank 16: Incline 20, 20A: Connectors 21: Through hole 22: Bump 23: Ventilation Channel
Claims
1. A suction nozzle for connecting to a vacuum device, comprising: an adsorption member having: a first surface and a second surface, which are two opposing surfaces of the adsorption member; at least one through-hole extending from the first surface through the adsorption member to the second surface; at least one set of grooves evenly distributed on the first surface of the adsorption member, each set of grooves having: a connecting groove with an opening on the first surface; at least one groove body with an opening on the first surface and surrounding the connecting groove; a connector connecting the adsorption member and the vacuum device, comprising: a through-hole extending through the connector and communicating with each of the at least one through-hole; at least one protrusion corresponding in number to the at least one set of grooves, each of the at least one protrusion capable of engaging with the connecting groove of one of the at least one set of grooves; wherein, The cross-section of the joint groove is square; the cross-section of the at least one groove body is rectangular, and the length of the long side of the at least one groove body is the same as the side length of the joint groove, and the short side of the at least one groove body is aligned with one side of the joint groove; the adsorption member further has a plurality of inclined surfaces and a protrusion, the inclined surfaces being located on the adsorption member at the other end opposite to the joint groove and surrounding the second surface; the protrusion protrudes from the second surface of the adsorption member and the inclined surfaces and surrounds the second surface.
2. The suction nozzle as described in claim 1, wherein, Each of the at least one perforation is located in one of the joint grooves and extends from the bottom of the joint groove to the second surface.
3. The suction nozzle as described in claim 1, wherein, The connector further has a venting channel through which the venting hole connects to each of the at least one perforation.
4. The suction nozzle as described in claim 1, wherein, The cross-section of the protrusion is rectangular.
5. The suction nozzle as described in claim 4, wherein, Each of the at least one groove group has: a first direction parallel to one side of the protrusion; and two grooves located in the first direction and respectively on both sides of the engagement groove.
6. The suction nozzle as described in claim 4, wherein, Each of the at least one groove group has: a first direction parallel to one side of the protrusion; a second direction perpendicular to the first direction; and four grooves, wherein two grooves are located in the first direction and are respectively located on both sides of the engagement groove; and the other two grooves are located in the second direction and are respectively located on both sides of the engagement groove.
7. The suction nozzle as described in any one of claims 1 to 6, wherein, The adsorption element has at least one inclined surface located at the other end of the adsorption element relative to the engagement groove.