Electromagnetic wave absorbing device

Abstract

An absorbing device is disposed outside the antenna clearance area inside an electronic device, and the absorbing device includes an absorbing pattern section, an absorbing circuit, and a grounding section. The length of the absorbing pattern corresponds to the resonant length of the absorbed wave frequency. The absorbing circuit includes at least an attenuator. The grounding section connects the absorbing pattern section and the absorbing circuit. Here, the absorbing pattern section absorbs electromagnetic wave frequencies that may cause antenna interference, and the absorbing circuit converts them into heat energy, thereby achieving an improved signal-to-noise ratio.

Description

Technical Field

[0001] This invention relates to the field of electronics, and in particular to a wave-absorbing device. Prior Technology

[0002] As electronic devices become thinner and lighter, their internal space shrinks. However, the increased processing frequency of internal components, such as chips and memory, leads to increased noise within the electronic products. Modern electronic products rely heavily on signal transmission and reception, making antennas an indispensable component. The increased intensity of this noise interference can significantly reduce the signal-to-noise ratio, thereby affecting the quality of wireless communication.

[0003] Currently, the common approach is to attach conductive foam (gasket) or electromagnetic absorber. However, this only passively absorbs electromagnetic waves and is relatively thick, limiting the design margin of electronic devices. In addition, electronic devices have numerous components, and the sources of noise are diverse and difficult to identify. Different electromagnetic absorbers are required for different frequency bands and must be arranged in specific positions, thus increasing the difficulty of design layout. Summary of the Invention

[0004] To address the aforementioned problems, an absorbing device is provided. The absorbing device is disposed outside the antenna clearance area within an electronic device, and includes an absorbing pattern portion, an absorbing circuit, and a grounding portion. The length of the absorbing pattern corresponds to the resonant length of the absorbed wave frequency. The absorbing circuit includes at least an attenuator. The grounding portion connects the absorbing pattern portion and the absorbing circuit.

[0005] In some embodiments, the absorbing circuit further includes a transmission line that connects the absorbing pattern portion and the attenuator.

[0006] Furthermore, in some embodiments, the absorbing circuit further includes a load impedance connected to an attenuator.

[0007] In some embodiments, the absorbing circuit further includes a load impedance connected to an attenuator.

[0008] In some embodiments, the attenuator is a Pi-type attenuator.

[0009] In some embodiments, the attenuator is a T-type attenuator.

[0010] In some embodiments, the absorbing pattern is selected from the group consisting of an inverted-F antenna pattern, a dipole antenna pattern, a monopole antenna pattern, a slot antenna pattern, a chip antenna pattern, a loop antenna, and a patch antenna.

[0011] Furthermore, in some embodiments, the absorbing pattern section includes a first absorbing pattern and a second absorbing pattern. The first absorbing pattern is connected to an attenuator, and the second absorbing pattern is connected to a grounding portion. The lengths of the first and second absorbing patterns correspond to the resonant lengths of different absorption frequencies.

[0012] More specifically, in some embodiments, there is a coupling gap between the first absorbing pattern and the second absorbing pattern.

[0013] More specifically, in some embodiments, the first absorbing pattern is connected to the transmission line.

[0014] In some embodiments, the absorbing device further includes a substrate, and the absorbing pattern portion and the absorbing circuit are disposed on the substrate.

[0015] Furthermore, in some embodiments, the substrate is a printed circuit board, a flexible printed circuit board, a glass substrate, a ceramic substrate, or a liquid crystal polymer.

[0016] In some embodiments, the absorbing device further includes a second absorbing circuit and a switching element. The second absorbing circuit includes at least a second attenuator, and the absorbing circuit and the second absorbing circuit are connected to a ground portion via the switching element.

[0017] Furthermore, the second absorbing circuit further includes a second load impedance and a second transmission line. The second transmission line is connected to the absorbing pattern section, the second attenuator is connected to the second transmission line and the second load impedance, and the second load impedance and the load impedance are connected to the ground section via a switching element.

[0018] As described in the foregoing embodiments, an absorbing device with an antenna-like pattern can receive electromagnetic waves through the absorbing pattern, and then attenuate and convert the electromagnetic waves into heat energy through the absorbing circuit. The absorbing device can be placed outside the antenna clearance area inside the electronic device, providing greater design margin for layout design, while improving the signal-to-noise ratio of the antenna. Simple Explanation of the Diagram

[0019] Figure 1 is a perspective view of the first embodiment of the microwave absorbing device. Figure 2 is a partially enlarged view of the first embodiment of the microwave absorbing device. Figure 3 is a partially enlarged view of the second embodiment of the microwave absorbing device. Figure 4 is a partially enlarged view of the third embodiment of the microwave absorbing device. Figure 5 is a circuit diagram of the fifth embodiment of the microwave absorbing device. Implementation

[0020] Figure 1 is a perspective view of a first embodiment of the absorbing device. Figure 2 is a partially enlarged view of the first embodiment of the absorbing device. As shown in Figures 1 and 2, the absorbing device 1 is disposed outside the antenna clearance area inside an electronic device (not shown). The electronic device can be a mobile phone, the host of a laptop computer, a tablet computer, etc. The absorbing device 1 includes an absorbing pattern section 20, an absorbing circuit 30, and a grounding section 40. The length of the absorbing pattern section 20 corresponds to the resonant length of the absorbed wave frequency. Here, the absorbing pattern section 20 basically uses an antenna pattern, but without a feed section, only receiving signals, and its length can be designed for detecting common noise wave frequencies. The absorbing pattern section 20 can use the shape of existing antennas, such as an inverted F antenna pattern, a dipole antenna pattern, a monopole antenna pattern, a slot antenna pattern, a chip antenna pattern, a loop antenna, and a patch antenna, etc. The above are merely examples and are not intended to limit the scope.

[0021] The absorbing circuit 30 includes a load impedance 31, an attenuator 33, and a transmission line 35. The transmission line 35 is connected to the absorbing pattern section 20 and receives electromagnetic wave signals from the absorbing pattern section 20. The attenuator 33 is connected to the transmission line 35 and the load impedance 31. The attenuator 33 and the load impedance 31 are used to attenuate the electromagnetic wave signal and convert it into heat energy. The grounding section 40 is connected to the load impedance 31 to conduct residual energy. The grounding section 40 is connected to the absorbing pattern section 20 and the absorbing circuit 30.

[0022] Furthermore, a load impedance 31 can be set between the absorbing pattern portion 20 and the grounding portion 40.

[0023] As shown in Figures 1 and 2, the attenuator 33 used here is a T-type attenuator. Furthermore, in some embodiments, the attenuator 33 is coupled to the ground portion 40 to discharge residual energy.

[0024] Furthermore, the absorbing device 1 may also include a substrate 10, with an absorbing pattern portion 20 and an absorbing circuit 30 disposed on the substrate 10. In other words, the absorbing pattern portion 20 and the absorbing circuit 30 may also be independent copper foils. Additionally, for different product forms, the substrate 10 may be a printed circuit board, a flexible printed circuit board, a glass substrate, a ceramic substrate, a liquid crystal polymer, etc. The grounding portion 40 may be disposed on the substrate 10 or may be an independent copper foil. Referring again to Figures 1 and 2, the absorbing pattern portion 20 includes a first absorbing pattern 21 and a second absorbing pattern 23. The first absorbing pattern 21 is connected to the attenuator 33, and the second absorbing pattern 23 is connected to the grounding portion 40. The lengths of the first absorbing pattern 21 and the second absorbing pattern 23 correspond to the resonant lengths of different absorption frequencies. However, this is only an example and not intended to limit the scope. In practice, there may be only a single absorbing pattern, or there may be multiple absorbing patterns.

[0025] More specifically, referring again to Figures 1 and 2, there is a coupling gap G between the first absorbing pattern 21 and the second absorbing pattern 23. The first absorbing pattern 21 is connected to the transmission line 35, which is only an example and not intended to be limiting.

[0026] Figure 3 is a partially enlarged view of the second embodiment of the absorbing device. As shown in Figure 3, and referring to Figure 2, the difference between the second embodiment and the first embodiment is that the attenuator 33 is a Pi-type attenuator. In addition, the absorbing pattern section 20 is designed as an inverted F-shaped antenna structure. The second absorbing pattern 23 is more directly connected to the grounding section 40.

[0027] Figure 4 is a partial enlarged view of the third embodiment of the absorbing device. As shown in Figure 4, and referring to Figure 3, the difference is that the absorbing pattern part 20 is designed in a T-shape, and the load impedance 31 is omitted. In addition, the absorbing pattern part 20 is not directly connected to the ground part 40, but is indirectly connected to the ground part 40 through the absorbing circuit 30.

[0028] Figure 5 is a circuit diagram of a fifth embodiment of the microwave absorbing device. As shown in Figure 5, in some embodiments, the microwave absorbing device 1 further includes a second microwave absorbing circuit 50 and a switching element 60. The second microwave absorbing circuit 50 basically includes a second attenuator 53 and a second load impedance 51, which can be configured the same as the microwave absorbing circuit 30 but have different impedances. It is only shown in the circuit diagram here, and the pattern configuration of the entire second microwave absorbing circuit 50 can be of various shapes. The second microwave absorbing circuit 50 includes a second load impedance 51, a second attenuator 53, and a second transmission line 55. The second transmission line 55 is connected to the microwave absorbing pattern portion 20, the second attenuator 53 is connected to the second transmission line 55 and the second load impedance 51, and the second load impedance 51 and the load impedance 51 are connected to the ground portion 40 via the switching element 60. In this way, the path for attenuation of the absorbed electromagnetic waves can be selected by switching the voltage.

[0029] In summary, by using the antenna-pattern-like absorbing device 1, electromagnetic waves can be received through the absorbing pattern section 20, and then attenuated and converted into heat energy through the absorbing circuit 30. The absorbing device 1 can be placed outside the antenna clearance area inside the electronic device, providing greater design margin for layout design, while improving the signal-to-noise ratio of the antenna.

[0030] Although the technical content of the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any modifications and refinements made by those skilled in the art without departing from the spirit of the present invention should be included within the scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

[0031] 1: Wave Absorption Device 10:Substrate 20: Wave-absorbing pattern section 21: First wave-absorbing pattern 23: Second absorbing pattern 30: Absorbing circuit 31: Load impedance 33: Attenuator 35: Transmission line 40: Grounding part 50: Second Absorbing Circuit 51: Second load impedance 53: Second Attenuator 55: Second transmission line 60: Switching element G: Coupling gap

Claims

1. An absorbing device disposed outside an antenna clearance area within an electronic device, comprising: an absorbing pattern portion, wherein the length of the absorbing pattern portion corresponds to a resonant length for an absorption frequency, the absorbing pattern portion including a first absorbing pattern and a second absorbing pattern; an absorbing circuit, including at least an attenuator and a transmission line, the transmission line connecting the absorbing pattern portion and the attenuator; and a ground portion connecting the absorbing pattern portion and the absorbing circuit; wherein the first absorbing pattern is connected to the attenuator, the second absorbing pattern is connected to the ground portion, and the lengths of the first absorbing pattern and the second absorbing pattern respectively correspond to the resonant length for different absorption frequencies.

2. The absorbing device as claimed in claim 1, wherein the absorbing circuit further includes a load impedance connected to the attenuator.

3. The absorbing device as described in claim 1, wherein the attenuator is coupled to the grounding portion.

4. The absorbing device as described in claim 1, wherein the attenuator is a Pi-type attenuator.

5. The absorbing device as described in claim 1, wherein the attenuator is a T-type attenuator.

6. The absorbing device as claimed in claim 1, wherein the absorbing pattern is selected from the group consisting of an inverted F antenna pattern, a dipole antenna pattern, a monopole antenna pattern, a slot antenna pattern, a chip antenna pattern, a loop antenna, and a patch antenna.

7. The absorbing device as claimed in claim 1, wherein there is a coupling gap between the first absorbing pattern and the second absorbing pattern.

8. The absorbing device as claimed in claim 1, wherein the first absorbing pattern is connected to the transmission line.

9. The microwave absorbing device as claimed in claim 1 further includes a substrate, on which the microwave absorbing pattern portion and the microwave absorbing circuit are disposed.

10. The absorbing device as claimed in claim 9, wherein the substrate is a printed circuit board, a flexible printed circuit board, a glass substrate, a ceramic substrate, or a liquid crystal polymer.

11. The absorbing device as claimed in claim 1 further includes a second absorbing circuit and a switching element, the second absorbing circuit including at least a second attenuator, the absorbing circuit and the second absorbing circuit being connected to the grounding portion via the switching element.

12. The absorbing device as claimed in claim 11, wherein the second absorbing circuit further includes a second load impedance and a second transmission line, wherein the second transmission line is connected to the absorbing pattern portion, the second attenuator is connected to the second transmission line and the second load impedance, and the second load impedance and the load impedance are connected to the ground portion via the switching element.

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