Heterogeneous integration structure and heterogeneous integration wafer

Abstract

A heterogeneous integration structure includes a photonic integrated circuit and a light guiding device. The photonic integrated circuit includes a substrate, a light source, and an optical coupling element. The light source provides first light to the optical coupling element. The light guiding device is heterogeneously integrated with the photonic integrated circuit and includes a first lens and a first reflector. The first lens is disposed on the substrate and aligned with the optical coupling element. The first light from the optical coupling element sequentially passes through the first lens, is reflected by the first reflector, and is transmitted to a fiber optic connector. The second light from the fiber optic connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element. A heterogeneous integrated wafer is also proposed.

Description

Technical Field

[0001] This invention relates to a heterogeneous integration structure and a heterogeneous integration wafer. Prior Technology

[0002] In typical semiconductor manufacturing processes, wafer acceptance testing (WAT) is a crucial in-line inspection used to determine process quality and die quality. However, measuring the optical input and output of photonic integrated circuits is more complex than circuit testing. Therefore, finding a simple architecture for wafer acceptance testing of photonic integrated circuits is a pressing issue. Summary of the Invention

[0003] This invention provides a heterogeneous integration structure and a heterogeneous integration wafer, which utilizes a simple architecture to achieve optical coupling, significantly improving the packaging and testing efficiency of photonic integrated circuits.

[0004] According to an embodiment of the present invention, a heterogeneous integrated structure is provided, including a photonic integrated circuit and a light guiding device. The photonic integrated circuit includes a substrate, at least one light source, and at least one optical coupling element, wherein the light source and the optical coupling element are disposed on the substrate, the light source is used to generate first light, and the optical coupling element is disposed in the path of the first light. The light guiding device is heterogeneously integrated with the photonic integrated circuit and includes at least one first lens and a first reflector. The first lens is disposed on the substrate and aligned with the optical coupling element. The first reflector is disposed on the substrate. The first light from the optical coupling element sequentially passes through the first lens, is reflected by the first reflector, and is transmitted to a fiber optic connector, or the second light from the fiber optic connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element.

[0005] According to an embodiment of the present invention, a heterogeneous integrated wafer is provided, comprising a plurality of photonic integrated circuits arranged in an array and a plurality of light guiding devices heterogeneously integrated with the photonic integrated circuits. Each photonic integrated circuit includes a substrate, at least one light source, and at least one optical coupling element, wherein the light source and the optical coupling element are disposed on the substrate, the light source is used to generate first light, and the optical coupling element is disposed in the path of the first light. Each light guiding device includes at least one first lens and a first reflector. The first lens is disposed on the substrate and aligned with the corresponding optical coupling element. The first reflector is disposed on the substrate. First light from the optical coupling element sequentially passes through the first lens, is reflected by the first reflector, and is transmitted to a fiber optic connector, or second light from the fiber optic connector is sequentially reflected by the first reflector, passes through the first lens, and is transmitted to the optical coupling element.

[0006] Based on the above, the heterogeneous integrated wafer provided in this embodiment of the invention includes multiple heterogeneous integrated structures. The performance of each photonic integrated circuit can be tested using the detachable optical guiding devices of each heterogeneous integrated structure. In particular, each optical guiding device can be mounted on the substrate of each photonic integrated circuit, eliminating the need for substrate dicing. Therefore, the substrate dicing process can be omitted, and the structural strength of each heterogeneous integrated structure and the heterogeneous integrated wafer is high.

[0007] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described below in conjunction with the accompanying drawings for detailed explanation. Simple Explanation of the Diagram

[0008] Figure 1A shows a schematic diagram of a heterogeneous integration structure according to an embodiment of the present invention. Figure 1B shows a cross-sectional view of part of the structure in Figure 1A on the XZ plane. Figure 2 shows a schematic diagram of a heterogeneous integrated wafer according to an embodiment of the present invention. Implementation

[0009] Referring to Figures 1A and 1B, Figure 1A shows a schematic diagram of a heterogeneous integrated structure according to an embodiment of the present invention, and Figure 1B shows a cross-sectional schematic diagram of a portion of the structure of Figure 1A in the XZ plane.

[0010] The heterogeneous integration structure 1 can be implemented as a heterogeneous integrated chip 1, and includes a photonic integrated circuit 100 and a light guiding device 200.

[0011] The photonic integrated circuit 100 includes a substrate SB, a plurality of light sources 101, and a plurality of optical coupling elements 102. The light sources 101 and the optical coupling elements 102 are disposed on the top surface ST of the substrate SB. The substrate SB may include silicon, group III-V semiconductors, silicon nitride, lithium niobate, polymers, and the like. Each light source 101 may include a laser diode for emitting laser light LA, but is not limited thereto; each light source 101 may also include a light-emitting diode (LED) or a micro LED. Each optical coupling element 102 is disposed in the path of the laser light LA ​​and may be, for example, a spot adjustment element. The spot adjustment element may include a microlens to adjust the spot size and spot shape of the laser light LA, but is not limited thereto.

[0012] In some embodiments, the photonic integrated circuit 100 may further include a plurality of optical modulators 103 and a plurality of waveguides 104, but is not limited thereto. In these embodiments, laser light LA ​​from each light source 101 may be sequentially transmitted to the corresponding optical modulator 103, waveguide 104 and optical coupling element 102.

[0013] The optical guiding device 200 and the photonic integrated circuit 100 form a heterogeneous integration and include a detachable module 201. The detachable module 201 includes a first component 201A, a second component 201B, and a third component 201C, wherein the third component 201C can be implemented as a fiber optic connector, and multiple discrete optical fibers 206 are disposed therein. The aforementioned heterogeneous integration refers to assembling and packaging multiple separately manufactured components onto a single chip to improve functionality. Specifically, the first component 201A and the second component 201B can be attached and detached from each other along the Z direction, and the second component 201B and the third component 201C can be attached and detached from each other along the X direction. The first component 201A is fixed to the top surface ST of the substrate SB, thereby achieving heterogeneous integration between the optical guiding device 200 and the photonic integrated circuit 100. By fixing the first component 201A to the top surface ST of the substrate SB and making the components detachable, the performance of the photonic integrated circuit 100 can be easily tested.

[0014] However, the present invention is not limited thereto. In some embodiments, the first component 201A and the substrate SB are detachable.

[0015] It should be noted that in a comparative example, the substrate SB is cut along the dashed line CC' in FIG. 1A, where the dashed line CC' corresponds to the light exit of each optical coupling element 102. That is, the light exit of each optical coupling element 102 is located above the side surface formed after cutting the substrate SB, and the first component 201A of the light guiding device 200 is disposed on this side surface of the substrate SB to guide the light from each optical coupling element 102. In contrast, in the embodiment of the present invention, it is not necessary to cut the substrate SB, and the first component 201A can be disposed on the top surface ST of the substrate SB, which can omit the process of cutting the substrate SB and improve the structural strength of the heterogeneous integration structure 1.

[0016] The optical guiding device 200 of this embodiment further includes a plurality of lenses 202 and a first reflector 203 disposed on a first component 201A, and a plurality of lenses 204 and a second reflector 205 disposed on a second component 201B, wherein the lenses 202 and the lenses 204 are respectively aligned with the optical coupling elements 102. The first reflector 203 and the second reflector 205 may include a highly reflective coating layer and are inclined at 45 degrees relative to the top surface ST of the substrate SB. When the first component 201A and the second component 201B are fixed to each other, the first component 201A, the second component 201B, the lenses 202, the first reflector 203, the lenses 204 and the second reflector 205 are all on the top surface ST of the substrate SB.

[0017] In some embodiments, laser light LA ​​(first light) can be provided by the light sources 101 to perform performance testing of the photonic integrated circuit 100. The laser light LA ​​is transmitted to each optical coupling element 102. The laser light LA ​​from each optical coupling element 102 sequentially passes through the corresponding lens 202, is reflected by the first reflector 203, passes through the corresponding lens 204, is reflected by the second reflector 205, and is transmitted to the corresponding optical fiber 206 in the third component 201C (optical fiber connector). The laser light LA ​​from the optical coupling element 102 has a beam width BS, which can be, for example, less than or equal to 10 micrometers. Furthermore, by configuring the lenses 202 and 204, the efficiency of coupling the laser light LA ​​into the optical fiber 206 can be significantly improved.

[0018] In some embodiments, additional laser light (second light) can be provided by other laser sources (not shown). The laser light is transmitted to each optical fiber 206 in the third component 201C. The laser light from each optical fiber 206 is sequentially reflected by the second reflector 205, passes through the corresponding lens 204, is reflected by the first reflector 203, passes through the corresponding lens 202, and is transmitted to the corresponding optical coupling element 102. By configuring these lenses 202 and 204, the efficiency of laser light coupling into the optical coupling element 102 can be significantly improved.

[0019] In some embodiments, the lenses 202 and 204 may be microlenses, and optical films may be deposited on the object-side and image-side surfaces of the microlenses, but the present invention is not limited thereto. In some embodiments, at least some of the lenses 202 and 204 may be metalenses. By optimizing the size and arrangement of the multiple nanostructures in the metalenses, the efficiency of laser light LA ​​coupling fiber 206 or coupling optical coupling element 102 can be significantly improved.

[0020] It should be noted that the optical guiding device 200 provided in the embodiments of the present invention is not limited to the structure described above. In some embodiments, the detachable module 201 includes a first component 201A and a third component 201C, but does not include a second component 201B. In these embodiments, each optical fiber 206 in the third component 201C is configured parallel to the Z direction, and the first component 201A and the third component 201C can be fixed and detached from each other along the Z direction. In some embodiments, laser light LA ​​from each optical coupling element 102 sequentially passes through the corresponding lens 202, is reflected by the first reflector 203, and is transmitted to the corresponding optical fiber 206 in the third component 201C. In some embodiments, laser light can be provided by other laser sources (not shown), and the laser light is transmitted to each optical fiber 206 in the third component 201C. The laser light from each optical fiber 206 is sequentially reflected by the first reflector 203, passes through the corresponding lens 202, and is transmitted to the corresponding optical coupling element 102.

[0021] Referring to FIG2, a schematic diagram of a heterogeneous integrated wafer according to an embodiment of the present invention is shown.

[0022] The heterogeneous integrated wafer 10 includes a plurality of photonic integrated circuits 300 arranged in an array and a plurality of photoguide devices 400 heterogeneously integrated with the photonic integrated circuits 300. The photonic integrated circuits 300 constitute a wafer, and the heterogeneous integrated wafer 10 can be considered as being formed by setting a plurality of photoguide devices 400 on the wafer.

[0023] Each photonic integrated circuit 300 can be implemented by any of the photonic integrated circuits 100 described in all the above embodiments. Furthermore, the substrates SB of these photonic integrated circuits 300 are integrally formed, wherein the top surfaces ST of each substrate SB are coplanar.

[0024] Each optical guiding device 400 includes a detachable module 401. The detachable module 401 includes a first component 401A, a second component 401B, and a third component 401C. The first component 401A may have the same or similar structure as the aforementioned first component 201A, the second component 401B may have the same or similar structure as the aforementioned second component 201B, and the third component 401C may have the same or similar structure as the aforementioned third component 201C. It should be noted that, for ease of understanding, FIG2 only shows a portion of the third component 401C of the detachable module 401. Specifically, each optical guiding device 400 can be implemented by any of the optical guiding devices 200 described in all the above embodiments, and the heterogeneous integrated wafer 10 can be considered as being composed of a plurality of heterogeneous integrated wafers 1 arranged in an array.

[0025] It should be noted that each first component 401A of the heterogeneous integrated wafer 10 is fixed to the top surface ST of the substrate SB of the corresponding photonic integrated circuit 300. Each first component 401A is detachable from its corresponding second component 401B, and each second component 401B is detachable from its corresponding third component 401C. Accordingly, the performance of any photonic integrated circuit 300 can be conveniently tested.

[0026] In summary, the heterogeneous integrated wafer provided according to embodiments of the present invention includes multiple heterogeneous integrated chips. The performance of each photonic integrated circuit can be tested using the detachable optical guiding device of each heterogeneous integrated chip. In particular, the first component of each optical guiding device can be disposed on the top surface of the substrate of each photonic integrated circuit, eliminating the need for substrate dicing. Therefore, the substrate dicing process can be omitted, and the heterogeneous integrated chips and the heterogeneous integrated wafer exhibit high structural strength.

[0027] 1: Heterogeneous integration structure, heterogeneous integrated chip 10: Heterogeneous integrated wafer 100, 300: Photonic integrated circuit 101: Light Source 102: Optical coupling element 103: Optical modulator 104: Waveguide 200, 400: Optical guiding device 201, 401: Detachable modules 201A, 401A: First component 201B, 401B: Second Component 201C, 401C: Third Component 202, 204: Lenses 203: First Reflector 205: Second reflector 206: Fiber Optic BS: Beam width LA: Laser light SB:Substrate ST: Top surface

Claims

1. A heterogeneous integrated structure, comprising: A photonic integrated circuit includes a substrate, at least one light source, and at least one optical coupling element, wherein the at least one light source and the at least one optical coupling element are disposed on the substrate, the at least one light source is used to generate a first light, and the at least one optical coupling element is disposed in the path of the first light. The light guiding device is heterogeneously integrated with the photonic integrated circuit and includes: at least one first lens disposed on the substrate and aligned to the at least one optical coupling element; a first reflector disposed on the substrate; a second reflector; and a detachable module, wherein first light from the at least one optical coupling element sequentially passes through the at least one first lens, is reflected by the first reflector, and is transmitted to a fiber optic connector, or second light from the fiber optic connector is sequentially reflected by the first reflector, passes through the at least one first lens, and is transmitted to the at least one optical coupling element, wherein the detachable module includes a first component and a second component, the first reflector and the at least one first lens being disposed on the first component, and the second reflector being disposed on the second component.

2. The heterogeneous integration structure as claimed in claim 1, wherein the substrate has a top surface, and the at least one first lens and the first reflector are disposed on the top surface.

3. The heterogeneous integration structure as claimed in claim 1, wherein the photonic integrated circuit further includes at least one optical modulator and at least one waveguide, wherein the at least one optical modulator, the at least one waveguide and the at least one optical coupling element are sequentially arranged on the path of the first light.

4. The heterogeneous integrated structure as claimed in claim 1, wherein the light guiding device further includes at least one second lens disposed on the second component and located between the first reflector and the second reflector.

5. The heterogeneous integration structure as claimed in claim 4, wherein at least one of the at least one first lens and at least one second lens comprises a meta-lens.

6. The heterogeneous integration structure as claimed in claim 1, wherein the substrate has a top surface, and the first component and the second component are disposed on the top surface.

7. The heterogeneous integration structure as claimed in claim 6, wherein the first component is fixed to the top surface of the substrate.

8. The heterogeneous integration structure as claimed in claim 1, wherein the at least one optical coupling element includes a spot adjustment element.

9. The heterogeneous integration structure as claimed in claim 8, wherein the first light from the at least one optical coupling element has a beam width, and the beam width is less than or equal to 10 micrometers.

10. The heterogeneous integration structure as claimed in claim 1, wherein the heterogeneous integration structure is formed as a heterogeneous integrated wafer.

11. A heterogeneous integrated wafer, comprising a plurality of photonic integrated circuits arranged in an array and a plurality of light guiding devices heterogeneously integrated with the plurality of photonic integrated circuits, wherein each of the photonic integrated circuits includes a substrate, at least one light source, and at least one optical coupling element, wherein the at least one light source and the at least one optical coupling element are disposed on the substrate, the at least one light source is used to generate a first light, and the at least one optical coupling element is disposed in the path of the first light, and each of the light guiding devices includes: At least one first lens is disposed on the substrate and aligned with the corresponding at least one optical coupling element; A first reflector is disposed on the substrate; Second reflector; And a detachable module, wherein the first light from the at least one optical coupling element sequentially passes through the at least one first lens, is reflected by the first reflector and transmitted to a fiber optic connector, or the second light from the fiber optic connector is sequentially reflected by the first reflector, passes through the at least one first lens and transmitted to the at least one optical coupling element, wherein the detachable module includes a first component and a second component, the first reflector and the at least one first lens being disposed on the first component, and the second reflector being disposed on the second component.

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