Heat dissipation assembly

Abstract

The present invention provides a heat dissipation assembly comprising: a housing having a first accommodating space; a circuit board disposed within the first accommodating space, further comprising: at least one elastic element, one end of which is disposed on the upper surface of the circuit board; a heating element disposed on the upper surface of the circuit board; a heat sink disposed on the heating element and having at least one first adsorption member; and a radiator having a second accommodating space and having at least one second adsorption member. The radiator is detachably mounted to the outer surface of the housing.

Claims

1. A heat dissipation assembly, comprising: a housing having a first accommodating space; a circuit board disposed within the first accommodating space, further comprising; and at least one elastic element, one end of the elastic element being disposed on the upper surface of the circuit board; a heating element disposed on the upper surface of the circuit board; a heat sink disposed on the heating element and having at least one first adsorption member; and a heat sink having a second accommodating space and having at least one second adsorption member; wherein, The radiator is detachably mounted on the outer surface of the housing.

2. A heat dissipation assembly as claimed in claim 1, wherein the first adsorption members of the heat dissipation plate have an adsorption effect with the second adsorption members of the heat sink, causing the heat dissipation plate to move toward one side of the housing mounted on the heat sink and adhere to the inner surface of the housing.

3. A heat dissipation assembly as described in claim 1, wherein there is no adsorption between the first adsorption members of the heat dissipation plate and the second adsorption members of the heat sink, and the elastic element pushes the circuit board toward the lower surface of the circuit board, so that a certain distance is formed between the heat dissipation plate and the inner surface of the housing.

4. A heat dissipation assembly as described in any one of claims 2 to 3, wherein the first adsorption element and the second adsorption element are magnets.

5. A heat dissipation assembly as claimed in claim 4, wherein the magnets of the first adsorption elements and the magnets of the second adsorption elements are magnetically dissimilar.

6. A heat dissipation assembly as claimed in claim 1, wherein the elastic elements further include a retainer connected to the elastic elements and disposed on the inner surface of the housing.

7. A heat dissipation assembly as claimed in claim 6, wherein the fixing member further includes a limiting member that passes through and connects the fixing member and the elastic elements, and is disposed on the upper surface of the circuit board.

8. A heat dissipation assembly as claimed in claim 7, wherein the limiting member extends toward the lower surface of the circuit board and has a protrusion.

9. A heat dissipation assembly as claimed in claim 1, wherein the outer surface of the housing is covered with at least one positioning surface.

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