Lower electrode system, semiconductor process equipment, and control methods

The lower electrode system synchronizes charge accumulation between the electrode and wafer by disconnecting ground before plasma generation and grounding after the process, addressing wafer displacement and arcing issues in semiconductor etching equipment.

TWI934387BActive Publication Date: 2026-08-01BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
TW113150406
Authority / Receiving Office
TW · TW
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-01-04
Filing Date
2024-12-24
Publication Date
2026-08-01
Estimated Expiration
2044-12-23

AI Technical Summary

Technical Problem

In advanced semiconductor edge etching equipment, the accumulation of charge on the lower electrode and wafer leads to potential differences causing electrostatic attraction, resulting in wafer displacement during the needle lifting process, which affects the AWC results.

Method used

A lower electrode system with a grounding device and control method that disconnects the lower electrode from ground before plasma generation, synchronizing charge accumulation between the electrode and wafer to prevent electrostatic adsorption, and grounds the electrode after the process to discharge accumulated charge.

Benefits of technology

Prevents wafer shifting due to electrostatic attraction, ensuring accurate AWC results and preventing arcing by synchronizing charge potential between the lower electrode and wafer, thus improving wafer repeatability and safety.

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Abstract

A lower electrode system, semiconductor process equipment, and control method are disclosed. The system includes a carrier device and a ejector device. The ejector device is used to lift or place a wafer on the carrier device. The system also includes a grounding device, which comprises a grounding circuit, a grounding switch, and a control unit. The grounding circuit is electrically connected to the lower electrode in the carrier device via the grounding switch, and is used to ground the lower electrode when the grounding switch is closed. The control unit is used to control the grounding switch to open in response to the start of the semiconductor process and to control the grounding switch to close in response to the end of the semiconductor process. The end of the semiconductor process includes the end of the plasma generation stage and the ejector device lifting the wafer on the carrier device.
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