Resin composition and article manufactured using the same

Abstract

This invention provides a resin composition comprising: 70 parts by weight of a vinyl-containing resin; 3 to 45 parts by weight of polymer A; and 5 to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, wherein the vinyl-containing resin comprises a vinyl-containing polyphenylene ether resin, a maleimide resin, a vinyl-containing polyolefin, or a combination thereof, and the polymer A comprises a compound having the structure shown in formula (1), a compound having the structure shown in formula (2), a compound having the structure shown in formula (3), a compound having the structure shown in formula (4), a compound having the structure shown in formula (5), a compound having the structure shown in formula (6), or a combination thereof. The compounds having the structures shown in formulas (1) to (6) are each as described in the specification.

Claims

1. A resin composition comprising: 70 parts by weight of a vinyl-containing resin; 3 to 45 parts by weight of polymer A; 5 to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer; and 15 to 38 parts by weight of a hydrogenated polyolefin; wherein, The vinyl-containing resin includes vinyl-containing polyphenylene ether resin, maleimide resin, vinyl-containing polyolefin, or a combination thereof. The polymer A includes a compound having the structure shown in formula (1) and selectively includes a compound having the structure shown in formula (2), a compound having the structure shown in formula (3), a compound having the structure shown in formula (4), a compound having the structure shown in formula (5), a compound having the structure shown in formula (6), or a combination thereof. The average molecular weight of the divinylbenzene-styrene-ethylene terpolymer is between 5,000 and 15,000. The divinylbenzene-styrene-ethylene terpolymer is polymerized from a mixture comprising 39.99 mol% to 80 mol% of ethylene monomer, 19.99 mol% to 60 mol% of styrene monomer, and 0.01 mol% to 10 mol% of divinylbenzene monomer, and the total amount of ethylene monomer, styrene monomer, and divinylbenzene monomer is 100 mol%.

1. Among them, n1 to n6 are each the weight average number of repeating units (based on weight average molecular weight), where n1 is a value from 1 to 10, n2 is a value from 1 to 10, n3 is a value from 1 to 10, n4 is a value from 1 to 10, n5 is a value from 1 to 10, and n6 is a value from 1 to 10. R1 to R5 are each independently hydrogen or C1 alkyl.

2. The resin composition as described in claim 1, wherein, The compounds having the structure shown in formula (1) include compounds having the structure shown in formula (1-1), compounds having the structure shown in formula (1-2), or combinations thereof:

3. The resin composition as described in claim 2, wherein, The compounds having the structure shown in formula (1-1) include compounds having the structure shown in formula (1-1-1), compounds having the structure shown in formula (1-1-2), compounds having the structure shown in formula (1-1-3), or combinations thereof:

4. The resin composition as described in claim 2, wherein, The compounds having the structure shown in formula (1-2) include compounds having the structure shown in formula (1-2-1), compounds having the structure shown in formula (1-2-2), compounds having the structure shown in formula (1-2-3), or combinations thereof:

5. The resin composition as claimed in claim 1, wherein, The weight average molecular weight of the compounds having the structure shown in formula (1) to the compounds having the structure shown in formula (6) is between 1,000 and 5,000.

6. The resin composition as claimed in claim 1, wherein, The vinyl-containing polyphenylene ether resin includes vinyl-containing polyphenylene ether resin, (meth)acrylate-containing polyphenylene ether resin, or a combination thereof.

7. The resin composition as claimed in claim 1 further comprises acrylate, triallyl isocyanate, melamine, styrene-maleic anhydride copolymer resin, phenolic resin, benzo[a] resin, cyanate ester resin, polysiloxane resin, polyester resin, epoxy resin, polyamide resin, polyimide resin, or a combination thereof.

8. The resin composition as claimed in claim 1 further comprises an inorganic filler, an initiator, an inhibitor, a flame retardant, a colorant, a toughening agent, a core-shell rubber, a silane coupling agent, a solvent, or a combination thereof.

9. An article made of a resin composition as described in any one of claims 1 to 8, wherein, The item includes prepreg, resin film, laminate, or printed circuit board.

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