Fast assembly of common-mode filters
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- TAI TECH ADVANCED ELECTRONICS CO LTD
- Filing Date
- 2025-01-16
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TB001903768_001 
Figure TWG2TB001903768_002 
Figure TWG2TB001903768_003
Abstract
Claims
1. A fast-assembly common-mode filter, comprising: a substrate; a plurality of plates, the plurality of plates including a central partition and a plurality of partition plates, the central partition being disposed at the center of the substrate, the plurality of partition plates being spaced apart or adjacent to the central partition, collectively surrounding a first accommodating region and a second accommodating region; wherein the plurality of partition plates includes two first sub-partition plates, the two first sub-partition plates being spaced apart from the central partition, such that there is a distance between the central partition and the two first sub-partition plates respectively; and a plurality of inductors, the plurality of inductors being respectively disposed in the first accommodating region and the second accommodating region.
2. The fast-assembly common-mode filter as described in claim 1, wherein the plurality of separators includes two first sub-separators and two second sub-separators, the two first sub-separators being spaced apart from the middle separator such that the middle separator is respectively a distance from the two first sub-separators, and the two second sub-separators being adjacent to the middle separator such that the two second sub-separators are respectively adjacent to the middle separator.
3. The fast-assembly common-mode filter as described in claim 1, wherein the plurality of separators includes two second sub-separators disposed adjacent to the central separator, such that the two second sub-separators are respectively adjacent to the central separator.
4. The rapid assembly common-mode filter as described in claim 1, wherein the substrate is provided with a housing that covers the plurality of inductors.