Package module and manufacturing method thereof

Abstract

A packaging module and its manufacturing method are disclosed. The main process involves forming a circuit structure on a carrier board and setting a plurality of electronic components on the circuit structure, electrically connecting the plurality of electronic components to the circuit structure, attaching a reinforcing member to the plurality of electronic components, removing the carrier board, placing the reinforcing member on a temporary carrier, and cutting the components to improve the strength of the packaging module and prevent warping problems.

Claims

1. A packaging module comprising a plurality of packaging units disposed on a temporary carrier, wherein, Each of the packaging units includes: a reinforcing member disposed on one side of the temporary carrier; a plurality of electronic components disposed on the reinforcing member on the side opposite to the temporary carrier; and a circuit structure formed on the plurality of electronic components, wherein the plurality of electronic components are electrically connected to the circuit structure.

2. The packaging module as described in claim 1 further includes a plurality of conductive posts disposed on the circuit structure, and the plurality of conductive posts are electrically connected to the circuit structure.

3. The packaging module as described in claim 2 further includes a bridging chip disposed on the circuit structure, and the bridging chip is electrically connected to the circuit structure.

4. The packaging module as described in claim 3 further includes a covering layer disposed on the circuit structure, and the covering layer covers the bridging chip and the plurality of conductive pillars.

5. The packaging module as described in claim 4 further includes a circuit portion disposed on the cover layer, and the circuit portion is electrically connected to the plurality of conductive posts.

6. The packaging module as described in claim 5 further includes a plurality of conductive elements disposed on the circuit section, and the plurality of conductive elements are electrically connected to the circuit section.

7. The packaging module as described in claim 1 further includes a plurality of conductive elements disposed on the circuit structure, and the plurality of conductive elements are electrically connected to the circuit structure.

8. The packaging module as described in claim 1 further includes a packaging layer formed on the circuit structure, and the packaging layer covers the plurality of electronic components.

9. The packaging module as described in claim 1, wherein, The package unit is a fan-out embedded bridge structure or a fan-out multi-chip structure.

10. A method for manufacturing a packaging module, the packaging module comprising a plurality of packaging regions, wherein, The manufacturing method includes: forming a circuit structure on a carrier plate; disposing a plurality of electronic components on the circuit structure and electrically connecting the plurality of electronic components to the circuit structure; attaching a reinforcing member to the plurality of electronic components; removing the carrier plate; placing the reinforcing member on a temporary carrier and positioning the temporary carrier and the plurality of electronic components on two opposite sides of the reinforcing member; and cutting along each of the packaging areas to form a plurality of packaging units.

11. The method of manufacturing the packaging module as described in claim 10 further includes forming a plurality of conductive posts between the carrier board and the circuit structure.

12. The method of manufacturing the packaging module as described in claim 11 further includes providing a bridging chip between the carrier board and the circuit structure.

13. The method of manufacturing the packaging module as described in claim 12 further includes forming a covering layer between the carrier board and the circuit structure to cover the bridging chip and the plurality of conductive pillars, and electrically connecting the circuit structure to the bridging chip and the plurality of conductive pillars.

14. A method for manufacturing a packaging module as described in claim 13, wherein, After the carrier plate is removed, a circuit section is formed on the covering layer, and the circuit section is electrically connected to the plurality of conductive posts.

15. The method of manufacturing the packaging module as described in claim 14 further includes providing a plurality of conductive elements on the circuit section and electrically connecting the plurality of conductive elements to the circuit section.

16. A method for manufacturing a packaging module as described in claim 10, wherein, After the carrier plate is removed, a plurality of conductive elements are provided on the circuit structure, and the plurality of conductive elements are electrically connected to the circuit structure.

17. The method of manufacturing the packaging module as described in claim 10 further includes forming a packaging layer covering the plurality of electronic components on the circuit structure.

18. A method for manufacturing a packaging module as described in claim 10, wherein, The package unit is a fan-out embedded bridge structure or a fan-out multi-chip structure.

19. A method for manufacturing the packaging module as described in claim 10, wherein, The reinforcing member provided on the packaging unit is removed after the packaging unit is attached to an external device.

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