Substrate
The use of glass or ceramic substrates with insulating elements in through-holes addresses leakage risks in TSVs, improving reliability and reducing costs by enabling independent traces and reducing via manufacturing risks.
TWI934521BActive Publication Date: 2026-08-01VESTA MICROSYSTEM CO LTD
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Patent Information
- Application Number
- TW114110895
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-03-23
AI Technical Summary
Technical Problem
Current through-silicon vias (TSVs) in silicon substrates pose leakage risks, reducing product reliability and increasing manufacturing costs due to the need for insulation treatments.
Method used
A substrate using glass or ceramic materials with insulating elements to separate conductive elements within through-holes, allowing for independent traces and reducing the number of vias, thereby improving reliability and reducing costs.
Benefits of technology
The substrate achieves improved product reliability and reduced manufacturing costs by using insulating materials and designing independent traces within vias, enhancing wiring density and structural strength.
✦ Generated by Eureka AI based on patent content.
Abstract
A substrate includes a base layer and through-holes. The base layer is made of glass or ceramic. Each through-hole includes a first conductive element, a second conductive element, and an insulating element. The insulating element spaces the first conductive element and the second conductive element apart, such that the first conductive element and the second conductive element are electrically independent of each other within the through-hole.
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