Light-emitting device
Separating LEDs and IC control elements in different accommodating spaces with distinct heat dissipation electrodes addresses interference issues, enhancing stability and efficiency in light-emitting devices.
TWI934536BActive Publication Date: 2026-08-01ENNOSTAR CORP
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Patent Information
- Application Number
- TW114111923
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2025-03-28
- Publication Date
- 2026-08-01
- Estimated Expiration
- 2045-03-27
AI Technical Summary
Technical Problem
Existing light-emitting devices face issues of light pattern asymmetry and reduced efficiency due to the IC control element absorbing light from LEDs and being affected by unstable thermal environments, which can damage the IC control element.
Method used
The light-emitting device is configured with the LED and IC control element in separate accommodating spaces, each on distinct heat dissipation electrodes, with an electrical testing section in between, reducing interference and improving stability and efficiency.
Benefits of technology
This configuration minimizes light absorption by the IC, stabilizes the thermal environment, and enhances overall performance by reducing light pattern asymmetry and improving luminous efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
This disclosure provides a light-emitting device, comprising a substrate, a frame, a light-emitting element, a control element, an electrical testing section, and a plurality of conductive elements. The substrate includes opposing first and second surfaces. The frame is disposed on the first surface of the substrate and has a separated first and second accommodating space. The light-emitting element is disposed in the first accommodating space. The control element is disposed in the second accommodating space. The electrical testing section is disposed in the substrate and exposed via the first and second surfaces. The electrical testing section is disposed between and electrically connected to the light-emitting element and the control element. The plurality of conductive elements are disposed on the side surfaces of the substrate and electrically connected to the control element.
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