Method of manufacturing light emitting module, light emitting module, and projector

Abstract

The purpose of this invention is to provide a method for manufacturing a light-emitting module that can effectively accommodate various specifications of output light. Alternatively, it aims to provide a light-emitting module with a preferred form that allows for adjustment of the number of mounted light-emitting elements. The manufacturing method of the light-emitting module of the present invention includes the following steps: preparing a light-emitting device 20 on which a plurality of light-emitting elements are mounted, namely a first light-emitting device 20a and a second light-emitting device 20b on which the number of light-emitting elements differs from each other by one; preparing a first mounting substrate 10a having a mounting surface, the mounting surface being provided with a plurality of identical connection patterns, the connection patterns corresponding to one light-emitting device 20; mounting a plurality of light-emitting devices 20 selected from the first light-emitting device 20a and the second light-emitting device 20b on the plurality of connection patterns provided on the mounting surface of the first mounting substrate 10a; and the manufacturing method can manufacture a light-emitting module 100 on which at least any number of light-emitting elements selected from three consecutive quantities are mounted.

Description

Method for manufacturing light-emitting module, light-emitting module and projector The present disclosure relates to a method for manufacturing a light emitting module, a light emitting module, and a projector. Previously, a light-emitting module has been developed in which a light-emitting device containing multiple light-emitting elements in a single package is mounted on a single mounting substrate. Patent Document 1 discloses an optical unit having a plurality of semiconductor devices containing four semiconductor elements in a single package on a unit substrate. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-227422 [Problem to be Solved by the Invention] The light output of a light-emitting module varies depending on the application and size of the product it is mounted on. Therefore, one method for flexibly meeting these light output requirements is to adjust the number of light-emitting elements mounted on the product. However, there is still room for improvement in effectively meeting the various specifications of light output. Therefore, the object of the embodiments of the present disclosure is to provide a method for manufacturing a light-emitting module that can effectively output light corresponding to various specifications. Alternatively, the problem of the embodiment of the present disclosure is to provide a light-emitting module with a better form for adjusting the number of mounted light-emitting elements. [Technical means for solving the problem] The manufacturing method of the light-emitting module of the embodiment disclosed herein is a manufacturing method for the above-mentioned light-emitting module, which is a light-emitting module installed with one or more light-emitting devices carrying a plurality of light-emitting elements, and includes the following steps: preparing the above-mentioned light-emitting device, that is, a first light-emitting device, that is, a second light-emitting device, the number of light-emitting elements carried by each of which differs by one; preparing a first mounting substrate, which has a mounting surface, and the above-mentioned mounting surface is provided with a plurality of identical connection patterns, and the above-mentioned connection patterns correspond to one of the above-mentioned light-emitting devices; for the plurality of the above-mentioned connection patterns provided on the mounting surface of the above-mentioned first mounting substrate, a plurality of the above-mentioned light-emitting devices selected from the above-mentioned first light-emitting device and the above-mentioned second light-emitting device are installed; and this manufacturing method can manufacture the above-mentioned light-emitting module equipped with any number of light-emitting elements selected from at least three consecutive numbers. The light-emitting module of the embodiment disclosed herein comprises: a first light-emitting device, which is a light-emitting device carrying a plurality of light-emitting elements; a second light-emitting device, which is a light-emitting device carrying one more light-emitting element than the first light-emitting device; and a first mounting substrate, which has a mounting surface, the mounting surface being provided with a plurality of identical connection patterns, each of which corresponds to one of the light-emitting devices; and the light-emitting module is configured to connect one or more of the first light-emitting devices and one or more of the second light-emitting devices to the plurality of connection patterns provided on the mounting surface of the first mounting substrate. The projector according to the embodiment of the present disclosure comprises: the light-emitting module described above; a sealing member disposed on the mounting substrate of the light-emitting module; a sealing member bonded to the mounting substrate via the sealing member to form a sealed space; a light-emitting device mounted on the mounting substrate within the formed sealed space; and an optical unit disposed within the formed sealed space. [Effects of the Invention] The manufacturing method of the light emitting module according to the embodiment of the present disclosure can effectively meet various specifications. In addition, the light emitting module according to the embodiment of the present disclosure can provide a preferred form for adjusting the number of mounted light emitting elements. The following describes the embodiment with reference to the drawings. However, the embodiment shown below is an example of a light-emitting module and a method for manufacturing a light-emitting module for embodying the technical concept of the present embodiment, and is not limited to the following. In addition, the dimensions, materials, shapes, and relative configurations of the components described in the embodiment are not intended to limit the scope of the present invention unless otherwise specified, but are merely examples. In addition, the size or positional relationship of the components shown in the various drawings is sometimes exaggerated for clarity. In addition, components in each embodiment that use the same symbols as those in other embodiments represent the same or corresponding components, and the description is sometimes omitted. <First embodiment> Figure 1A is a perspective view schematically showing an example of the structure of the light-emitting module of the first embodiment. Figure 1B is a top view schematically showing an example of the structure of the light-emitting module of the first embodiment. Figure 1C is a top view schematically showing an example of the structure of the mounting substrate of the first embodiment. Figure 1D is a top view showing a state in which the mounting substrate of Figure 1C is separated into two pieces of the first mounting substrate. Figure 2A is a disassembled perspective view schematically showing the structure of the first light-emitting device. Figure 2B is a top view schematically showing the structure inside the package of the first light-emitting device. Figure 3A is a disassembled perspective view schematically showing the structure of the second light-emitting device. Figure 3B is a top view schematically showing the structure inside the package of the second light-emitting device. Figure 3C is a cross-sectional view taken along line IIIC-IIIC of Figure 3B. Figure 3D is a top view schematically showing the structure of the lower surface of the second light-emitting device. <Light-emitting Module> A light-emitting module 100 is mounted with either a first light-emitting device 20a having three light-emitting elements 22 or a second light-emitting device 20b having one more light-emitting element 22 than the first light-emitting device 20a, that is, four light-emitting elements 22. Furthermore, a first mounting substrate 10a is provided with two connection patterns 15 corresponding to either the first light-emitting device 20a or the second light-emitting device 20b on its mounting surface. Furthermore, the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a are connected to a desired light-emitting device 20 selected from the first light-emitting device 20a and the second light-emitting device 20b. Specifically, any combination of two first light-emitting devices 20a, two second light-emitting devices 20b, or one first light-emitting device 20a and one second light-emitting device 20b is connected. Furthermore, the mounting substrate 10 is formed using one first mounting substrate 10 a or using two first mounting substrates 10 a arranged side by side. Furthermore, when forming two side-by-side mounting substrates 10, one of the two first mounting substrates 10a may have only one light-emitting device selected from the first light-emitting device 20a and the second light-emitting device 20b connected thereto, or both light-emitting devices selected thereto. Furthermore, a light-emitting module 100 can be realized in which the mounting substrate 10 is formed using a single first mounting substrate 10a, and only one light-emitting device selected from the first light-emitting device 20a and the second light-emitting device 20b is connected to the single first mounting substrate 10a. The example of FIG. 1 illustrates a light-emitting module 100 in which two first mounting substrates 10a are formed side-by-side, and one first light-emitting device 20a and one second light-emitting device 20b are bonded to two connection patterns 15 on each first mounting substrate 10a. The components of the light-emitting module 100 are described below. The light-emitting module 100 includes a mounting substrate 10 and a light-emitting device 20. [Mounting Substrate] The mounting substrate 10 is composed of a single first mounting substrate 10a or two first mounting substrates 10a having the same structure. In the example of FIG1C , the mounting substrate 10 is constructed by arranging two first mounting substrates 10a side by side. The first mounting substrate 10a has a lower surface, an upper surface, and side surfaces, and a connection pattern 15 including a metal portion 11 and a first metal film 12, a second metal film 13, and an insulating film 14 are formed on the upper surface. The first mounting substrate 10a has a mounting surface with two identical connection patterns 15 provided on the upper surface. One light-emitting device 20 is mounted on one connection pattern 15, so that the first mounting substrate 10a is formed to be capable of mounting two light-emitting devices 20. When the first mounting substrate 10a is provided with two connection patterns, using the same connection pattern 15 facilitates the formation of the connection pattern in the first mounting substrate 10a. Alternatively, there may be more than two connection patterns 15; for example, three connection patterns 15 may be arranged side by side in a row. Multiple connection patterns 15 are provided on a single first mounting substrate 10a. The connection pattern 15 is composed of a metal portion 11 exposed from an insulating film 14 and a first metal film 12 formed on the insulating film 14. The metal portion 11 and the first metal film 12 serve as mounting surfaces for the light-emitting device. Alternatively, the metal portion 11 may be configured such that a metal film is formed on the top surface. For example, a metal film may be formed on the insulating film 14 and the metal portion 11 may be provided in the same manner as the first metal film 12. The metal portion 11 is a portion on which the light-emitting device 20 is mounted. It is formed into a rectangular shape when viewed from above, and two metal portions 11 are formed side by side in the horizontal direction. The metal portion 11 is formed by directly exposing the substrate without providing the insulating film 14 on the upper surface of the first mounting substrate 10a. Alternatively, the metal portion 11 may be formed by a plurality of metal layers. For example, in order to make the heights of the insulating film 14 or the first metal film 12 provided on the upper surface of the substrate the same, a metal layer may be provided in the region of the metal portion 11 of the substrate, resulting in a form formed by a plurality of metal layers. The insulating film 14 is provided on the upper surface of the first mounting substrate 10a, excluding the metal portion 11. The first metal film 12 and the second metal film 13 are provided on the insulating film 14. The first metal film 12 is formed in pairs, three on each side of the upper and lower sides of the metal portion 11, for each metal portion 11 when viewed from above. Furthermore, a second metal film 13 is provided on one side of the first metal film 12 provided above and below. No second metal film 13 is provided on the other side of the first metal film 12. The second metal film 13 and the first metal film 12 provided on the second metal film 13 side are formed by providing a metal film connected to them on an insulating film 14, and then providing the insulating film 14 in such a manner as to separate them into the first metal film 12 and the second metal film 13. That is, the first metal film 12 and the second metal film 13 cannot be observed from the surface, but are connected and electrically connected. The three first metal films 12 on the side where the second metal film 13 is not provided are connected between two connection patterns 15. Specifically, the metal films connected as one are similarly disposed on the insulating film 14. The insulating film 14 is disposed from above in each connection pattern 15 so as to form three first metal films 12. Consequently, the first metal films 12 on the sides of the two connection patterns 15 where the second metal films 13 are not disposed are connected to each other and electrically connected. The metal portion 11 is not connected to the first metal film 12. The first metal films 12, disposed in pairs above and below with the metal portion 11 sandwiched between them, are bonded to the metal film 37 disposed on the lower surface of the light-emitting device 20, thereby electrically connecting one to the other. Furthermore, by mounting the light-emitting device 20 via the two connection patterns 15, electrical conduction can be achieved from one second metal film 13 to the other second metal film 13 through the two light-emitting devices 20. In this way, the first mounting substrate 10a and the light-emitting device 20 can be electrically connected. Furthermore, in the first mounting substrate 10a, the first metal film 12 is divided into three regions, thereby effectively enabling self-alignment when mounting the light-emitting device 20. Furthermore, when mounting a single light-emitting device 20, electrical connection can be established from the first metal film 12 on the side of the connection pattern 15 not bonded to the light-emitting device, where the second metal film 13 is not provided. Furthermore, by providing the second metal film 13 on one side, the mounting direction can be specified from the position of the second metal film. The two first mounting substrates 10a in the mounting substrate 10 are arranged side by side with the side opposite to the side where the second metal film 13 is formed facing each other. The first mounting substrate 10a has a through hole formed in a position extending through the thickness of the substrate, outside the region where the two connection patterns 15 are arranged side by side, and in a position where the first metal film 12 is provided with the metal portion 11 interposed in a vertical direction. The through holes are provided for retaining positioning pins or fixing threads. [Light-Emitting Device] The light-emitting device 20 includes a first light-emitting device 20a and a second light-emitting device 20b. Each of the first light-emitting device 20a and the second light-emitting device 20b includes a package 21, a semiconductor laser element 22, a submount 23, a light-reflecting member 24, a protective element 25, a lead 26, a cover member 27, a bonding portion 28, and a lens member 29. The first light-emitting device 20a and the second light-emitting device 20b have the same external shape, but differ in the number of semiconductor laser elements 22 mounted within their outer shapes. Specifically, in this embodiment, both the first light-emitting device 20a and the second light-emitting device 20b utilize a package 21 capable of mounting four semiconductor laser elements 22. Therefore, using the same package 21, it is possible to manufacture a first light-emitting device 20a mounting three semiconductor laser elements 22, as shown in Figures 2A and 2B, and a second light-emitting device 20b mounting four semiconductor laser elements 22, as shown in Figures 3A and 3B. By having the same package and external shape, the first light-emitting device 20a and the second light-emitting device 20b do not need to consider the size differences of the light-emitting devices when bonding to a mounting substrate, regardless of whether the light-emitting device is mounted. Consequently, as shown in the first mounting substrate 10a, multiple connection patterns can be prepared in a unified layout. Figures 3C and 3D show a cross-section of the second light-emitting device and its lower surface (back surface), respectively. However, the same applies to the first light-emitting device. Furthermore, the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is not limited to three. For example, it can be two, or four or more. Alternatively, it can be one. The number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is one more than the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a. Alternatively, it can be two more. The three semiconductor laser elements 22 of the first light-emitting device 20a are arranged in the same position as three of the four semiconductor laser elements 22 of the second light-emitting device 20b. This allows both the first light-emitting device 20a and the second light-emitting device 20b to share the same mounting location for the semiconductor laser elements 22 within the package 21. The configuration can be arbitrarily determined to exclude any of the four semiconductor laser elements 22. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged side by side, offset to one side of the package 21. In other words, the configuration can be such that one of the four semiconductor laser elements 22 of the second light-emitting device 20b, located at the end, is excluded. This arrangement can suppress the light from the first light-emitting device 20a to a smaller area. For example, the three semiconductor laser elements 22 of the first light-emitting device 20a can be arranged so that only one of the four semiconductor laser elements 22 arranged in the second light-emitting device 20b is located at each end. This arrangement can reduce the difference in the end-to-end length of the light-emitting area between the first light-emitting device 20a and the second light-emitting device 20b. Furthermore, the arrangement is not limited to this; for example, three semiconductor laser elements 22 can be evenly spaced in the area where the four semiconductor laser elements 22 are located. The package 21 is formed into a rectangle when viewed from above, and has a rectangular recess 30 when viewed from above. In addition, the rectangle here means a roughly rectangular shape including a shape with a corner or a part of a side cut off like the package 21, or a shape with a bent corner like the recess 30. In addition, the package 21 has a step portion 33 formed on a portion of the inner side 32 of the recess 30. Specifically, the step portion 33 is provided on two inner side surfaces 32 of the four inner side surfaces 32 of the recess 30 that are opposite to each other in the short side direction. The package 21 can be formed of ceramic as the main material. In addition, the package 21 is not limited to ceramic and can also be formed of metal. For example, in the case of ceramic, aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide can be used as the main material of the package 21. In the case of metal, copper, aluminum, iron, copper-molybdenum as a composite, copper-diamond composite material, and copper-tungsten can be used as the main material of the package 21. Metal films are provided on the lower surface 34 of the package 21 and the upper surface of the step portion 33. The metal film in the lower surface 34 of the package 21 includes metal films 37 arranged in pairs at both ends of the package 21, and a metal film 38 arranged in the center of the lower surface 34 of the package 21 between the metal films 37 at both ends. Each of the metal films 37 is provided one by one in three locations along each of two opposing sides in a roughly rectangular shape and spaced apart from each other. The metal films 37 are formed opposite to the first metal film 12 of the first mounting substrate 10a. The area of ​​the metal film 38 provided in the center of the lower surface 34 of the package 21 is formed larger than that of any of the metal films 37. The metal films 38 are formed opposite to each other in a manner that allows connection to the metal portion 11 of the first mounting substrate 10a. In the package 21 , the metal film on the upper surface of the step portion 33 and the metal film 37 on the lower surface 34 are electrically connected by penetrating metal wiring inside. Alternatively, package 21 can be formed by forming a frame portion 35, which forms a frame for recess 30, and a bottom portion 36, both of different primary materials, and then joining the frame portion 35 and the bottom portion 36. For example, package 21 can be formed by joining a plate-shaped bottom portion 36, primarily made of metal and having a specific thickness, to a frame portion 35, primarily made of ceramic and having a specific height. In this case, instead of providing metal film 38, the lower surface of bottom portion 36 can be connected to metal portion 11 of first mounting substrate 10a. The semiconductor laser element 22 and the protective element 25 are electrically connected to the metal film, or connection wiring, provided on the upper surface of the step portion 33. A wire 26 is bonded to provide electrical continuity. Figures 2B and 3B illustrate examples of how the wire 26 is bonded when the semiconductor laser elements 22 are connected in series. The connection method is not limited to this. Alternatively, multiple semiconductor laser elements 22 can be connected in parallel. Thus, the semiconductor laser element 22 and the protective element 25 are electrically connected via the metal film 37 provided on the lower surface 34 of the package 21. The stepped portion 33 is not provided on the two inner side surfaces 32 of the package 21 in the longitudinal direction of the opposite sides. By not providing the stepped portion 33 along the entire circumference of the inner side surfaces 32, the package 21 can be miniaturized. Alternatively, the stepped portion 33 can be provided on the inner side surface 32 located away from the light-reflecting member 24. By expanding the area where the stepped portion 33 is provided, more wiring area can be secured. On the other hand, the stepped portion 33 can be omitted on the inner side surface 32 located closer to the light-reflecting member 24. Even if the stepped portion 33 is provided in this area, the semiconductor laser element 22 must be joined to the wiring area to prevent the wire 26 from obstructing the optical path, making it difficult to provide a wiring area for the semiconductor laser element 22. Furthermore, by not providing the stepped portion 33 on the inner side surface 32, the light-reflecting member 24 can be positioned closer to the outer side surface of the package 21. As will be described in detail later, when two light-emitting devices 20 are mounted on the mounting substrate 10, the distance between the light emitted from the two light-emitting devices 20 can be shortened. Furthermore, as shown in Figures 2B and 3B, the inner side surface 32 located near the light-reflecting member 24 can also be referred to as the inner side surface located at the end in the direction of travel of the laser light emitted from the semiconductor laser element. This light-emitting device 20 has a pair of metal films 37 formed on its lower surface 34 bonded to the first metal film 12 of the first mounting substrate 10a. Furthermore, a metal film 38 provided between the pair of metal films 37 is bonded to the metal portion 11 of the first mounting substrate 10a. The light-emitting device 20 can be bonded to the first mounting substrate 10a by soldering. The bonding between the metal films 37 and 38 on the lower surface 34 of the light-emitting device 20 and the first metal film 12 and metal portion 11 of the first mounting substrate 10a facilitates self-alignment when the light-emitting device 20 is secured to the first mounting substrate 10a. The semiconductor laser device 22 has a bottom surface, a top surface, and side surfaces, and emits laser light from one side surface. The laser light emitted from the semiconductor laser device 22 has a width and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a surface parallel to the light emission end face. The semiconductor laser element 22 is mounted on the bottom surface 31 (bottom upper surface) of the recess 30 of the package 21 via a submount 23. The submount 23 is provided for each semiconductor laser element 22. Alternatively, the light-emitting device 20 may mount multiple semiconductor laser elements 22 on the upper surface of a single submount 23. Alternatively, the light-emitting device 20 may mount the semiconductor laser element 22 directly on the bottom surface 31 of the recess 30 of the package 21 without the intermediary of the submount 23. As shown in Figures 2B and 3B, the multiple semiconductor laser elements 22 mounted on the light-emitting device 20 are arranged in a single direction. Specifically, they are arranged along the longitudinal direction of the package 21. Furthermore, the emission end faces of each mounted semiconductor laser element 22 are aligned so that they emit laser light in the same direction. The emission end faces of each mounted semiconductor laser element 22 are designed so that they are arranged on the same plane. However, they do not need to be aligned on the same plane. The plurality of semiconductor laser elements 22 arranged in a direction are electrically connected in series using wires 26. Laser light is emitted from the emission end faces of the plurality of semiconductor laser elements 22 in a direction perpendicular to the direction in which the plurality of semiconductor laser elements 22 are arranged. The semiconductor laser elements 22 mounted on the first light-emitting device 20a and the second light-emitting device 20b are all semiconductor laser elements that emit blue light. Alternatively, they may emit light other than blue, such as red or green. Furthermore, the color emitted by the semiconductor laser element 22 mounted on the first light-emitting device 20a and the color emitted by the semiconductor laser element 22 mounted on the second light-emitting device 20b may be different. For example, semiconductor laser elements 22 emitting blue light may be mounted on the first light-emitting device 20a, while semiconductor laser elements 22 emitting red light may be mounted on the second light-emitting device 20b. Alternatively, two first light-emitting devices 20a or two second light-emitting devices 20b may be mounted on the first mounting substrate 10a by bonding them to two connection patterns 15. In this case, semiconductor laser elements 22 emitting different colors may be mounted between the two mounted light-emitting devices 20. Here, blue light is light with a peak emission wavelength in the range of 420 nm to 494 nm. Red light is light with a peak emission wavelength in the range of 605 nm to 750 nm. Green light is light with a peak emission wavelength in the range of 495 nm to 570 nm. Furthermore, semiconductor laser element 22 is an example of a light-emitting element mounted in the light-emitting module of the present invention. Light-emitting elements are not limited to semiconductor laser element 22. The submount 23 is bonded to the bottom surface 31 of the recess 30 of the package 21 on its lower surface and to the semiconductor laser element 22 on its upper surface. The semiconductor laser element 22 is mounted on the submount 23 such that the emission end face of the semiconductor laser element 22 is aligned with or protrudes from the side surface of the submount 23. This prevents light emitted from the semiconductor laser element 22 from reaching the upper surface of the submount 23. The submount 23 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. Furthermore, a metal film is provided on the upper surface of the submount 23. The light-reflecting member 24 reflects light from the semiconductor laser element 22. The light-reflecting member 24 is mounted on the bottom surface of the recess 30 of the package 21. A light-reflecting member 24 is individually positioned corresponding to each semiconductor laser element 22. Furthermore, for three or four semiconductor laser elements 22, the distance between the emission end face of each semiconductor laser element 22 and the corresponding light-reflecting member 24 is designed to be the same. Alternatively, the distance can be determined based on the semiconductor laser element 22, or it can be different for multiple semiconductor laser elements 22. Furthermore, the light-emitting device 20 can be configured with one light-reflecting member 24 corresponding to multiple semiconductor laser elements 22. The light-reflecting member 24 has a lower surface, an upper surface, side surfaces, and an inclined surface, with the inclined surface serving as the light-reflecting surface. The light-reflecting surface is flat and slopes from the upper surface toward the lower surface. The light-reflecting surface is designed to form a 45-degree angle relative to the lower surface. This angle is not limited to 45 degrees, and the light-reflecting surface may be curved rather than flat. The light reflecting member 24 can be formed into a shape using a main material, and a light reflecting film can be formed on the surface where the light reflecting surface is to be set in the formed shape. The main material is preferably a material with strong heat resistance, such as glass such as quartz stone or BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflecting film is preferably a material with high light reflectivity, such as metal such as Ag, Al, or Ta. 2O 5 / SiO 2. TiO 2 / SiO 2. Nb 2O 5 / SiO 2 dielectric multilayer film, etc. In addition, if the light reflecting member 24 is formed of a material with a high light reflectivity such as metal as the main material, the light reflecting film can be omitted. The majority of the light emitted from the semiconductor laser element 22 is directed to the corresponding light-reflecting surface of the light-reflecting member 24. The light emitted from the semiconductor laser element 22 passes through the light-reflecting member 24, extending the optical path length of the light incident on the lens compared to a case where the light-reflecting member 24 is not interposed. This longer optical path length reduces the effects of misalignment between the light-reflecting member 24 and the semiconductor laser element 22. Alternatively, the light-emitting device 20 may be configured without the light-reflecting member 24, with the emission end face of the semiconductor laser element 22 facing upward. A protective element 25 is mounted on the upper surface of the submount 23. The protective element 25 is, for example, a Zener diode. The conductive wire 26 is a metal wiring. Examples of materials for the conductive wire 26 include metals such as Au, Ag, Cu, Pt, and Al, and alloys thereof. Alternatively, the light-emitting device 20 may be constructed without the protective element 25. The cover member 27 is a member that covers the semiconductor laser element 22 and the light-reflecting member 24. The entire cover member 27 is light-transmissive, but may have a non-light-transmissive area in a portion. The cover member 27 can be formed using sapphire as the main material. Alternatively, a metal film may be provided on a portion of the cover member 27. In addition to sapphire, other materials, such as glass, may also be used as the main material. The cover member 27 is bonded to the upper surface (frame upper surface) of the package 21 on its lower surface. A metal film is provided in the area where the cover member 27 and the package 21 are bonded, and is fixed via Au-Sn or the like. The light-emitting device 20 forms a closed space by bonding the package 21 to the cover member 27. This closed space becomes an airtightly sealed space. By such airtight sealing, the light-emitting device 20 can suppress the collection of organic matter and the like on the light-emitting end face of the semiconductor laser element 22. The adhesive portion 28 is formed in the region of the upper surface of the cover member 27 where the cover member 27 and the lens member 29 are bonded. For example, an ultraviolet curing resin can be used as the adhesive portion 28. Furthermore, the adhesive portion 28 is formed so as not to contact the cover member 27 and the lens member 29. The adhesive portion 28 is provided with a thickness to adjust its position or height, and then the lens member 29 is bonded to the cover member 27. Furthermore, the adhesive portion 28 is formed, for example, at a position opposite to the outer edge of the lens member 29 so as not to be located on the optical path of the light emitted from the semiconductor laser element 22. FIG. 2A and FIG. 3A show an example of the shape of the adhesive portion 28 after curing, but an adhesive portion 28 that is soft during application may be used. The lens member 29 is disposed opposite the upper surface of the cover member 27. The lens member 29 is integrally formed with a lens portion 51 having a lens shape and a rectangular support plate portion 52 that supports the lens portion 51. In the lens member 29, each lens portion 51 is disposed opposite the optical axis of the semiconductor laser element 22. The arrangement and shape of each lens portion 51 are designed so that the reflected light emitted from the corresponding semiconductor laser element 22 and reflected by the light reflecting member 24 is collimated by the lens portion 51. As shown in Figures 2A and 3A, the same lens member 29 is used in both the first light-emitting device 20a and the second light-emitting device 20b, each of which has a different number of semiconductor laser elements 22. That is, the same lens member 29 is used for the first light-emitting device 20a as for the second light-emitting device 20b. In this manner, even if the first light emitting device 20a is configured without any of the four semiconductor laser elements 22 in the second light emitting device 20b, the lens member 29 can be unified. Furthermore, the same lens member 29 design can be used in the first light emitting device 20a and the second light emitting device 20b. Furthermore, the lens member 29 used in the first light-emitting device 20a can be configured such that the number and arrangement of lens portions 51 correspond to the number and arrangement of semiconductor laser elements 22 mounted on the package 21. By aligning the number of lens portions 51 with the number of semiconductor laser elements 22, the lens member 29 can be made lighter than a lens member 29 configured to match the number of semiconductor laser elements 22 in the second light-emitting device 20b. Glass materials such as BK7 and B270 can be used for the lens member 29. In the light-emitting module 100 shown in FIG1A , two first mounting substrates 10a are arranged side by side to form the mounting substrate 10, and two light-emitting devices 20 are mounted on each mounting substrate. This results in a light-emitting module 100 in which four light-emitting devices 20 are mounted in a two-column, two-row arrangement. Furthermore, the light-emitting module 100 of FIG1A has two light-emitting devices 20 mounted on the mounting surface in a one-column, two-row arrangement, oriented 180 degrees apart from each other. Specifically, the light-emitting module 100 has one first light-emitting device 20a and one second light-emitting device 20b mounted adjacent to each other on each first mounting substrate 10a, and light-reflecting members 24 are also mounted adjacent to each other. Specifically, the two light-emitting devices 20 mounted on a single first mounting substrate 10a are mounted so that the distance to the light-reflecting member 24 of one light-emitting device 20 is shorter than the distance between the light-reflecting member 24 of the other light-emitting device 20 and the semiconductor laser element 22. This condition also holds true when replacing one light-emitting device 20 with the other. Furthermore, the light-emitting module 100 mounts the first light-emitting device 20a and the second light-emitting device 20b diagonally to each other. In this manner, four light-emitting devices are mounted adjacent to each other in the row direction on the mounting substrate 10, and the light-reflecting members 24 are adjacent to each other in the row direction. By arranging two light-emitting devices 20 on a single first mounting substrate 10a, the light emitted from the two light-emitting devices 20 can be brought closer together. Furthermore, since the semiconductor laser element 22 is spaced farther apart between the two light-emitting devices 20, heat dissipation is improved. Furthermore, by arranging the two first mounting substrates 10a in this manner, light can be concentrated toward the center of the mounting substrate 10. In the optical unit disclosed in Patent Document 1, which includes a plurality of semiconductor devices with four semiconductor elements mounted on a package, light emitted from the semiconductor elements directly passes through the semiconductor devices. Therefore, there is no need to consider how to best mount the two light-emitting devices 20 based on the arrangement of the semiconductor laser elements mounted on the package and the light-reflecting member, as is the case with light-emitting module 100. On the other hand, the light-emitting device 20 of light-emitting module 100 mounts a plurality of semiconductor laser elements 22 and a light-reflecting member 24 on the package. In this case, by mounting two light-emitting devices 20 in a preferred configuration on the mounting substrate 10, a light-emitting module 100 capable of achieving the aforementioned effects can be realized. Furthermore, when manufacturing a light-emitting module 100 in which two first light-emitting devices 20a each having three semiconductor laser elements 22 arranged in the same configuration are mounted, and two second light-emitting devices 20b are mounted, by arranging the first light-emitting devices 20a diagonally from each other, the semiconductor laser elements 22 in the two first light-emitting devices 20a can be arranged symmetrically about the center of the mounting substrate 10. Furthermore, while the light-emitting devices 20 are mounted here so that the light-reflecting members 24 are adjacent in the row direction on the paper, the light-emitting devices 20 can also be mounted so that the light-reflecting members 24 are adjacent in the column direction on the paper. Furthermore, the light emitting devices 20 may be arranged such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the column direction, or such that the first light emitting devices 20a and the second light emitting devices 20b are adjacent to each other in the row direction. <Method for manufacturing a light-emitting module> Next, an example of a method for manufacturing the light-emitting module 100 of the first embodiment will be described. FIG4 is a flow chart showing the sequence of the method for manufacturing the light-emitting module of the first embodiment. The method for manufacturing a light-emitting module of the first embodiment manufactures a light-emitting module 100 that is mounted with one or more light-emitting devices that carry a plurality of light-emitting elements. Furthermore, the method for manufacturing the light-emitting module 100 includes a step S101 of preparing a light-emitting device, a step S102 of preparing a first mounting substrate, and a step S103 of mounting the light-emitting device, and these steps are performed in sequence. Furthermore, as a light-emitting module 100 manufactured by this manufacturing method, a light-emitting module 100 that is mounted with any number of light-emitting elements 22 selected from at least three consecutive numbers can be manufactured. The following describes each step of the method for manufacturing the light emitting module 100. The materials and configurations of the components are as described above for the light emitting module 100, and thus are omitted here as appropriate. [Light-Emitting Device Preparation Step] Step S101 of light-emitting device preparation involves preparing a first light-emitting device and a second light-emitting device, each having a different number of semiconductor laser elements than the first light-emitting device. In step S101, a plurality of first light-emitting devices 20a each having three semiconductor laser elements 22 and a plurality of second light-emitting devices 20b each having four semiconductor laser elements 22 are prepared. [Step of Preparing the First Mounting Substrate] Step S102 of preparing the first mounting substrate is a step of preparing a first mounting substrate having a mounting surface provided with a plurality of connection patterns 15 corresponding to a single light-emitting device, i.e., identical connection patterns. In step S102, one or more first mounting substrates 10a having a mounting surface provided with two connection patterns 15 corresponding to a single light-emitting device 20, each of which can correspond to either a first light-emitting device 20a or a second light-emitting device 20b, are prepared. [Step of Mounting Light-Emitting Devices] Step S103 of mounting light-emitting devices is a step of mounting a plurality of light-emitting devices selected from the first light-emitting device and the second light-emitting device on the plurality of connection patterns provided on the mounting surface of the first mounting substrate. In step S103, two desired light-emitting devices selected from the first light-emitting device 20a and the second light-emitting device 20b are mounted on the two connection patterns 15 provided on the mounting surface of the first mounting substrate 10a. Furthermore, as light-emitting modules 100 mounted with the two selected light-emitting devices 20, at least a light-emitting module 100 mounted with two first light-emitting devices 20a, a light-emitting module 100 mounted with one first light-emitting device 20a and one second light-emitting device 20b, and a light-emitting module 100 mounted with two second light-emitting devices 20b are manufactured. The number of light-emitting elements mounted on these three types of light-emitting modules 100 increases in sequence. In this way, by manufacturing three types of light-emitting modules 100 equipped with two light-emitting devices 20 in different combinations, it is possible to manufacture a light-emitting module 100 equipped with any number of light-emitting elements 22 selected from three consecutive numbers. Furthermore, the light-emitting module 100 manufactured by the manufacturing method of the first embodiment, which is mounted with one or more light-emitting devices carrying a plurality of light-emitting elements, is not limited to the three types of light-emitting modules 100. A light-emitting module 100 in which one light-emitting device 20 is mounted on one first mounting substrate 10a, a light-emitting module 100 in which a total of three light-emitting devices 20 are mounted on two first mounting substrates 10a, and a light-emitting module 100 in which a total of four light-emitting devices 20 are mounted on two first mounting substrates 10a, can also be manufactured. In the manufacture of the light-emitting module 100 shown in FIG1A, in step S103, two light-emitting devices 20 (a first light-emitting device 20a and a second light-emitting device 20b) arranged in a one-column, two-row configuration are mounted on a mounting surface in orientations 180 degrees apart from each other. Furthermore, in step S103, two first mounting substrates 10a, each mounting two light-emitting devices 20 (a first light-emitting device 20a and a second light-emitting device 20b), are arranged side by side to produce a light-emitting module 100 having four light-emitting devices 20 mounted thereon in two rows and two columns. This arrangement allows the four light-emitting devices 20 to be centrally positioned when viewed as a light-emitting module 100. Furthermore, through-holes for screw fastening, etc., are provided at both ends of one side of the outer periphery of the four light-emitting devices 20, sandwiching the four light-emitting devices 20. A second metal film 13 is provided at both ends of the other side. Providing the second metal film 13 at both ends makes it easier to connect a power source than a configuration where the light-emitting devices 20 are sandwiched. In this manner, a light-emitting module 100 having one to four light-emitting devices mounted thereon can be manufactured using the first mounting substrate 10a, the first light-emitting device 20a, and the second light-emitting device 20b. Furthermore, this light-emitting module 100 can be provided, allowing the number of semiconductor laser elements 22 mounted thereon to be adjusted to any number between 3 and 16 (excluding the case of five), effectively adapting to various specifications. Furthermore, by setting the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a to two and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b to three, a light-emitting module 100 can be provided that can be adjusted to any number between 2 and 12. When the number of semiconductor laser elements 22 mounted on the first light-emitting device 20a is set to 4 and the number of semiconductor laser elements 22 mounted on the second light-emitting device 20b is set to 5, a light-emitting module 100 can be provided that can be adjusted to any number of 4 to 20 (excluding 6, 7, and 11). <Second embodiment> Next, the second embodiment will be described. FIG5A is a perspective view schematically showing an example of the structure of the light-emitting module of the second embodiment. FIG5B is a top view schematically showing an example of the structure of the light-emitting module of the second embodiment. FIG5C is a top view schematically showing an example of the structure of the mounting substrate of the second embodiment. FIG5D is a top view showing a state in which the mounting substrate of FIG5C is separated into a first mounting substrate and a second mounting substrate. The difference of the light-emitting module of the second embodiment is that, in addition to the first mounting substrate used in the light-emitting module of the first embodiment, a second mounting substrate is also used. <Light-emitting module> The light-emitting module 100A shown in FIG5A includes a mounting substrate 10A and a light-emitting device 20. Furthermore, the light-emitting module 100A is a light-emitting module that mounts three light-emitting devices 20. The mounting substrate 10A of the light-emitting module 100A in this case includes a first mounting substrate 10a and a second mounting substrate 10b. The second mounting substrate 10b has the same external shape as the first mounting substrate 10a. The second mounting substrate 10b has a lower surface, an upper surface, and side surfaces, and has a mounting surface on the upper surface on which is provided a connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a. By providing a single connection pattern 15 and making the external shape identical, the external shape can be made the same as in the case of mounting using two first mounting substrates 10a. Furthermore, in this embodiment, the connection pattern 15 of the second mounting substrate 10b is positioned near the center, and on the top surface, the area of ​​the second mounting substrate 10b where the connection pattern 15 is provided partially overlaps with each of the areas of the first mounting substrate 10a where the two connection patterns 15 are provided. Meanwhile, the position of the second metal film 13 or the through-hole remains unchanged from that of the first mounting substrate 10a. By aligning the position of the second metal film 13, the first mounting substrate 10a and the second mounting substrate 10b can share a common connection method when electrically connecting to an external power source. For example, the connection to the second metal film 13 can be achieved through a connector, a flexible substrate, a glass epoxy substrate, a leaf spring terminal, or the like. When using such a connecting member, the first mounting substrate 10a and the second mounting substrate 10b can be connected using the same connecting member. By aligning the position of the through-holes, screw fastening can be performed at the same position as when mounting two first mounting substrates 10a. In addition, in the second mounting substrate 10b, of each of the three first metal films 12 forming a pair with the metal portion 11 interposed therebetween, the three first metal films 12 disposed on the side close to the second metal film 13 are electrically connected to one of the two second metal films 13. Furthermore, the three first metal films 12 disposed on the side away from the second metal film 13 are electrically connected to the other second metal film 13. A light-emitting device 20 is mounted on the second mounting substrate 10b, and in the example of FIG. 5A , a second light-emitting device 20b is mounted. Furthermore, the first mounting substrate 10a and the second mounting substrate 10b are arranged side by side with the side surfaces opposite to the side on which the second metal film 13 is formed facing each other. Other matters are the same as those of the light-emitting module 100 of the first embodiment shown in FIG. 1A . <Method for manufacturing a light-emitting module> Next, an example of a method for manufacturing the light-emitting module 100A of the second embodiment will be described. FIG6 is a flow chart showing the sequence of the method for manufacturing the light-emitting module of the second embodiment. The method for manufacturing the light-emitting module 100A includes a step S201 of preparing a light-emitting device, a step S202 of preparing a first mounting substrate, a step S203 of preparing a second mounting substrate, a step S204 of determining the number of mounting substrates, etc., a step S205 of mounting a light-emitting device, and a step S206 of forming a light-emitting module, and is performed in sequence. In addition, regarding the material or configuration of each component, since it is as described in the description of the light-emitting module 100 above, the description is appropriately omitted here. In addition, since the step S201 of preparing a light-emitting device and the step S202 of preparing a first mounting substrate are the same as the step S101 of preparing a light-emitting device and the step S102 of preparing a first mounting substrate in the method for manufacturing the light-emitting module 100 of the first embodiment, the description is omitted here. [Step of Preparing a Second Mounting Substrate] Step S203 of preparing a second mounting substrate is a step of preparing a second mounting substrate having a mounting surface provided with a connection pattern identical to the connection pattern provided on the first mounting substrate. In step S203, a second mounting substrate 10b having a mounting surface provided with a connection pattern 15 identical to the connection pattern 15 provided on the first mounting substrate 10a is prepared. [Step of Determining the Number of Mounting Substrates, etc.] Step S204 of determining the number of mounting substrates, etc., is a step of determining the number or number and combination of mounting substrates used to manufacture the light-emitting module from a plurality of mounting substrates including at least a first mounting substrate and a second mounting substrate. In this step S204, it is determined whether to use a single mounting substrate to form the mounting substrate 10A of the light-emitting module 100A or to use two mounting substrates to form the mounting substrate 10A of the light-emitting module 100A. Furthermore, if a single mounting substrate is used, it is determined whether to use the first mounting substrate 10a or the second mounting substrate 10b. If two mounting substrates are used, it is determined whether to use a combination of two first mounting substrates 10a or a combination of one first mounting substrate 10a and one second mounting substrate 10b. It is also possible to combine two second mounting substrates 10b to form the mounting substrate 10A. However, if two light-emitting devices 20 are to be mounted, using a single first mounting substrate 10a allows for a more compact light-emitting module 100A. In manufacturing the light emitting module 100A shown in FIG. 5A , it is decided to use a combination of a first mounting substrate 10 a and a second mounting substrate 10 b for two mounting substrates to form the mounting substrate 10A. [Step of installing the light-emitting device] Step S205 of installing the light-emitting device is a step of installing one light-emitting device selected from the first light-emitting device and the second light-emitting device on the connection pattern of the second mounting substrate when the second mounting substrate is used for the light-emitting module. Furthermore, step S205 is a step of installing a plurality of light-emitting devices selected from the first light-emitting device and the second light-emitting device on the plurality of connection patterns provided on the mounting surface of the first mounting substrate when the first mounting substrate is used for the light-emitting module. In the manufacture of the light-emitting module 100A shown in FIG5A, one second light-emitting device 20b is mounted on the second mounting substrate 10b. Furthermore, one first light-emitting device 20a and one second light-emitting device 20b are mounted side by side on the first mounting substrate 10a, and two light-emitting devices 20 having an arrangement structure of one column and two rows are mounted on the mounting surface in directions 180 degrees apart from each other. [Step of Forming a Light-Emitting Module] Step S206 of forming a light-emitting module is a step of forming a light-emitting module by using a predetermined number, or a predetermined number and combination of one or more first mounting substrates and second mounting substrates on which light-emitting devices are mounted. In manufacturing the light-emitting module 100A shown in FIG5A , a first mounting substrate 10a on which one first light-emitting device 20a and one second light-emitting device 20b are mounted, and a second mounting substrate 10b on which one second light-emitting device 20b is mounted are arranged side by side to form the light-emitting module 100A. When mounting a single light-emitting device 20, the use of the second mounting substrate 10b eliminates the generation of unused connection patterns 15, compared to the case of using the first mounting substrate 10a. Furthermore, in order to electrically connect to an external power source, the first mounting substrate 10a requires electrical continuity between the second metal film 13 on the side where the connection pattern 15 of the light-emitting device 20 is bonded and the first metal film 12 on the side where the connection pattern 15 of the light-emitting device 20 is not bonded. However, in the second mounting substrate 10b, electrical continuity can be achieved using two second metal films 13. When mounting two light-emitting devices 20 on a single mounting substrate, the first mounting substrate 10a is used, while when mounting one light-emitting device 20, the second mounting substrate 10b is used. In either case, electrical continuity with an external power source can be easily achieved using two second metal films 13. Furthermore, as described in the manufacturing method of the light-emitting module 100 of the first embodiment, it is clear that the light-emitting module 100A manufactured using the manufacturing method of the second embodiment can provide a light-emitting module having any number of light-emitting devices 20 mounted thereon, from one to four. <Third Embodiment> Next, the third embodiment will be described. FIG7A is a top view schematically showing an example of the configuration of a light-emitting module according to the third embodiment. FIG7B is a top view schematically showing an example of the configuration of a light-emitting module according to the third embodiment. FIG7C is a top view schematically showing an example of the configuration of a light-emitting module according to the third embodiment. In the light-emitting module 100B of the third embodiment shown in FIG7A , the mounting substrate 10B of the light-emitting module 100B is composed of a first mounting substrate 10c having a mounting surface with four identical connection patterns 15 arranged in two rows and two columns. Furthermore, in the light-emitting module 100B, any number of light-emitting devices 20, from one to four, can be mounted on these four connection patterns 15. FIG7A through FIG7C illustrate a light-emitting module 100B mounted with four light-emitting devices 20, a light-emitting module 100C mounted with three light-emitting devices 20, and a light-emitting module 100D mounted with two light-emitting devices 20, respectively. By allowing four light-emitting devices 20 to be mounted on a single mounting substrate, the manufacturing process can be simplified. The first embodiment, the second embodiment, and the third embodiment illustrate the configuration examples and manufacturing methods of the light-emitting module of the present invention. In addition, in these descriptions, as a light-emitting module, a light-emitting module is described, which has: a first light-emitting device, which is a light-emitting device carrying a plurality of light-emitting elements; a second light-emitting device, which is a light-emitting device carrying one more light-emitting element than the first light-emitting device; and a first mounting substrate, which has a mounting surface provided with a plurality of connection patterns corresponding to one light-emitting device, that is, the same connection patterns; and the plurality of connection patterns provided on the mounting surface of the first mounting substrate are connected to one or more first light-emitting devices and one or more second light-emitting devices. The light-emitting module 100E shown in FIG8 shows a specific example of a light-emitting module having a preferred form for adjusting the number of light-emitting elements mounted. By realizing such a light-emitting module, a light-emitting module that can effectively correspond to various specifications with respect to the output light can be provided. <Fourth embodiment> Next, the fourth embodiment will be described. FIG9A is a perspective view schematically showing an example of the structure of the light-emitting module of the fourth embodiment. FIG9B is a top view schematically showing an example of the structure of the light-emitting module of the fourth embodiment. FIG9C is a top view schematically showing the first mounting substrate of the fourth embodiment. FIG9D is a top view schematically showing the light-emitting device and thermistor mounted on the second mounting substrate of the fourth embodiment. FIG9E is a top view schematically showing the second mounting substrate of the fourth embodiment. The light-emitting module of the fourth embodiment differs from the mounting substrates described in the first through third embodiments in that a metal film for mounting a thermistor is further provided on the mounting surface of the mounting substrate. As shown in FIG9C , in addition to the metal portion 11, first metal film 12, second metal film 13, and insulating film 14, third metal film 16 and fourth metal film 17 are further provided on the mounting surface of the first mounting substrate 10d of the fourth embodiment. The connection pattern 15 formed by the metal portion 11 and first metal film 12 is the same as that described in the previous embodiments. In the first mounting substrate 10d, the third metal film 16 is provided, so the distance between the first metal film 12 and the second metal film 13 is larger than in the first mounting substrate 10a. The two third metal films 16 are provided between the first metal film 12 and the second metal film 13, and are positioned at the same distance as the light emitted from the two light-emitting devices 20. Therefore, in the first mounting substrate 10d, the third metal films 16 are provided at the same distance as the two connection patterns 15. That is, the two third metal films 16 are provided so that the distance from one connection pattern 15 to one third metal film 16 is the same as the distance from the other connection pattern 15 to the other third metal film 16. Furthermore, because the fourth metal film 17 is provided between the two second metal films 13, the distance between the two third metal films 13 is larger than in the first mounting substrate 10a. Both fourth metal films 17 are provided so as to be sandwiched between the two second metal films 13. The third metal film 16 and the fourth metal film 17 are formed by disposing a metal film that connects them on the insulating film 14, and then disposing the insulating film 14 so that the insulating film is divided into the third metal film 16 and the fourth metal film 17. In other words, the third metal film 16 and the fourth metal film 17 are connected and electrically connected, but cannot be observed from the surface. One third metal film 16 is connected to one fourth metal film 17, and another third metal film 16 is connected to another fourth metal film 17. In the light-emitting module 100F of the fourth embodiment shown in Figures 9A and 9B , a thermistor 90 is mounted on the third metal film 16. The thermistor 90 is an example of a temperature detection element used to measure the temperature of the light-emitting module 100F during operation. The thermistor 90 is mounted so as to be connected to both of the two third metal films 16. This allows one fourth metal film 17 to be electrically connected to the other fourth metal film 17 via the thermistor 90. In the light-emitting module 100F, the semiconductor laser elements 22 of the two light-emitting devices 20 mounted on the first mounting substrate 10d serve as the primary heat source. Therefore, the thermistor 90 is preferably positioned close to one of the two light-emitting devices 20 and at the same distance from the light emitted from either light-emitting device 20. That is, the design is such that, when viewed from above, the thermistor 90 intersects a midline located at an equal distance from a straight line connecting the vertices of the lens portions 51 of one light-emitting device 20 and a straight line connecting the vertices of the lens portions 51 of the other light-emitting device 20, in a situation where the center of light emitted from the plurality of semiconductor laser elements 22 mounted on the two light-emitting devices 20 passes through the vertices of the lens portions 51. The second mounting substrate 10e of the fourth embodiment shown in Figures 9D and 9E is provided with a third metal film 16 and a fourth metal film 17, similar to the first mounting substrate 10d. Furthermore, a thermistor 90 is mounted on the third metal film 16. Similar to the first mounting substrate 10d, the third metal film 16 is provided between the first metal film 12 and the second metal film 13, and the fourth metal film 17 is provided at a point sandwiched between the two second metal films 13. Meanwhile, the thermistor 90 is provided at a position relatively close to the light emitted from the light-emitting device 20. Therefore, in the second mounting substrate 10e, it is provided near the apex of the lens portion 51 of the lens member 29 of the light-emitting device 20. Specifically, the design is such that when the center of light emitted from the plurality of semiconductor laser elements 22 mounted on the light-emitting device 20 passes through the apex of the lens portion 51, the thermistor 90 intersects the straight line connecting the apexes of the lens portions 51 in a plan view. Thus, in the light-emitting module 100F of the fourth embodiment, a metal film for mounting the thermistor 90 is provided on the mounting substrate 10, thereby enabling the temperature during operation of the light-emitting module 100F to be measured. Consequently, the operation of the semiconductor laser element 22 can be controlled based on the measured temperature. The light-emitting module manufactured in this manner can be used, for example, in various projectors of varying specifications. Specifically, a light-emitting module formed using a predetermined number, or number and combination, of one or more first mounting substrates and second mounting substrates each having a light-emitting device mounted thereon is mounted on a heat sink, thereby forming a component of the projector. Next, an example of installation when the light-emitting module of this embodiment is applied to a projector will be described. In addition, here, an example of a mounting substrate composed of one or more first mounting substrates 10a will be described, but the present invention is not limited to this. The mounting substrate can be composed of the desired first mounting substrate or second mounting substrate described in the first to fourth embodiments. Figure 10A is a stereoscopic diagram schematically showing an example of installation when the light-emitting module of one embodiment is applied to a projector. Figure 10B is a stereoscopic sectional view for illustrating the sealing structure of the light-emitting module of one embodiment. Figure 11A is a stereoscopic diagram schematically showing an example of installation when the light-emitting module of one embodiment is applied to a projector. Figure 11B is a top view schematically showing an example of the structure of the projector of the embodiment of Figure 11A. Figure 11C is a side view schematically showing an example of the structure of the projector of the embodiment of Figure 11A. Figure 12A is a stereoscopic diagram schematically showing an example of installation when the light-emitting module of one embodiment is applied to a projector. FIG12B is a side view schematically showing an example of the structure of the projector according to the embodiment of FIG12A. FIG13 is a perspective cross-sectional view illustrating another sealing structure of the light emitting module according to one embodiment. For convenience, these figures show a portion of the interior of the projector as transparent as appropriate. As shown in FIG10A and FIG10B , the projector 200 includes a sealing member 60. The sealing member 60 is a member for forming a sealed space surrounding the light-emitting device 20 mounted on the mounting substrate 10 in the light-emitting module. In addition, the optical system of the projector is installed inside the sealed space. That is, an optical unit is installed to generate the projection image projected by the projector. The optical unit includes, for example, lenses, mirrors, DMD (Digital Mirror Device), prisms, etc. In addition, an optical unit including a liquid crystal panel, a fluorescent wheel, a rod integrator, etc., or an optical unit using appropriate components from these components can be constructed to design an appropriate optical system. The projection image generated by the optical unit is emitted from the sealing member 60 to the outside and projected onto the screen of the projector. To further reduce the probability of reduced projector output due to light dust accumulation, it is preferable to house all components of the optical unit within the enclosed space formed by the sealing member 60 and the mounting substrate 10. When the sealing member 60 is miniaturized, only a portion of the components of the optical unit can be housed within the enclosed space. In the projector 200, a light-emitting module is manufactured in which two light-emitting devices 20 are mounted on a first mounting substrate 10a and covered with a sealing member 60. In addition, the sealing member 60 is formed in a rectangular parallelepiped here, but the shape of the sealing member 60 is not particularly limited. That is, it can have a shape corresponding to the form of the designed optical unit. On the first mounting substrate 10a, a sealing member 70 is provided, which is arranged around the light-emitting device 20 and surrounds the two light-emitting devices 20. In addition, the sealing member 70 is arranged between the first metal film 12 and the second metal film 13 in a manner that the second metal film 13 is arranged outside the closed space. In this way, the light-emitting device 20 can be easily connected to an external power supply. In addition, the sealing member 70 is arranged inwardly relative to the through holes on both sides in a manner that the through hole of the first mounting substrate 10a is arranged outside the closed space. In this way, there is no need to consider the influence of the through hole when forming the closed space. The sealing member 60 is bonded to the first mounting substrate 10a via the sealing member 70 to form a sealed space, thereby preventing dust, resin degassing, organic components of grease, and other objects that may cause optical dust collection from entering the sealing member 60. As the material of the sealing member 60, metal, glass, sapphire, etc. can be cited. The sealing member 60 only needs to be formed with a transparent member such as glass or sapphire to emit light to the outside. As the material of the sealing member 70, metal, resin, rubber, etc. can be cited. In addition, as the material of the sealing member 70, a member that is easily deformed when pressed, such as sponge or clay, can be used. In addition, when metal is used for the sealing member 70, in order to avoid contact between the sealing member 70 and the first metal film 12 arranged on the side away from the second metal film 13, it is better to leave a sufficient gap. In this way, short circuit can be prevented by the sealing member 70. If an insulating material is used, the sealing member 70 will not be conductive even if it contacts the first metal film 12 or the second metal film 13. The projector 200A shown in Figures 11A, 11B, and 11C has a sealing member 60A. In the projector 200A, a light-emitting module is manufactured in which four light-emitting devices 20 are mounted on two first mounting substrates 10a, and the light-emitting module is covered with a sealing member 60A. In addition, a sealing member 70 is formed to surround two light-emitting devices 20 on each of the first mounting substrates 10a. The sealing member 60A has a first pressing portion 63 that is convex and spans the boundary between the first mounting substrates 10a and the first mounting substrates 10a. The first pressing portion 63 presses the sealing member 70 provided along the boundary of each first mounting substrate 10a and seals the boundary of the two first mounting substrates 10a. In addition, when the two first mounting substrates 10a are joined at the boundary, the first pressing portion 63 can also be omitted. For example, due to component tolerances of each mounting substrate, compared to joining two first mounting substrates 10a to form the mounting substrate 10, it is considered to arrange the first mounting substrates 10a with a width that is not in contact with each other. In addition, if the first mounting substrates 10a are too far apart, the size of the light-emitting module or projector will be enlarged. Therefore, it is better to reduce the width when miniaturization is desired. For example, the width between the two mounting substrates can be set in the range of 0.1 mm to 1.0 mm. Alternatively, it can be said that the distance from one mounting substrate to another mounting substrate can be set to 0.1 mm to 1.0 mm. In the case of such a width installation, by providing the first pressing portion 63, the intrusion of external gas from the boundary can be prevented, and the airtightness can be ensured. In addition, the light-emitting module shown in Figures 10A and 11A is an example, and any light-emitting module manufactured by the above-mentioned manufacturing method can also be applied. That is, a light-emitting module can be used in which the mounting substrate 10 is formed by selecting one or two mounting substrates from the first mounting substrate 10a and the second mounting substrate 10b. Also, a light-emitting module can be used in which any number of the first light-emitting devices 20a and the second light-emitting devices 20b are mounted on the mounting substrate 10. Furthermore, it is not limited to one light-emitting module, and a plurality of light-emitting modules can also be applied. The projector 200B shown in Figures 12A and 12B has a sealing member 60B. In the projector 200B, two light-emitting modules are manufactured, each of which has two light-emitting devices 20 mounted on two first mounting substrates 10a, and two light-emitting modules are arranged. Therefore, a total of eight light-emitting devices 20 are covered by the sealing member 60B. In addition, a sealing member 70 is formed on each of the first mounting substrates 10a. In the projector 200B, two mounting substrates 10 are arranged in a manner such that the through holes are adjacent to each other. In addition to the first pressing portion 63, the sealing member 60B also has a convex second pressing portion 64 that spans the through holes of the two mounting substrates 10. The second pressing portion 64 presses the sealing member 70 provided on the two mounting substrates 10 to form a closed space. Each mounting substrate 10 is fixed to the heat sink by passing a fixing screw 80 through the through hole. By providing the second pressing portion 64, the intrusion of external air from the through hole can be prevented, thereby ensuring airtightness. FIG13 shows another example of a sealing structure between a sealing member and a sealing member. In this example, a sealing member 60C may include a protrusion 65 that engages with a sealing member 70 on its side and bottom surfaces. The protrusion 65 covers the side of the sealing member 70 facing the light emitting device 20. By providing the sealing member 60C with the protrusion 65, the joint portion with the sealing member 70 forms a claw structure. This structure further enhances the close contact between the sealing member 60C and the sealing member 70, improving the sealing performance of the sealing member 60C. 10: Mounting substrate 10A: Mounting substrate 10a: First mounting substrate 10B: Mounting substrate 10b: Second mounting substrate 10C: Mounting substrate 10c: First mounting substrate 10d: First mounting substrate 10e: Second mounting substrate 11: Metal portion 12: First metal film 13: Second metal film 14: Insulating film 15: Connection pattern 16: Third metal film 17: Fourth metal film 20: Light-emitting device 20a: First light-emitting device 20b: Second light-emitting device 21: Package 22: Light-emitting element (semiconductor laser element) 23: Sub-substrate 24: Light-reflecting member 25: Protective element 26: Wire 27: Cover member 28: Adhesive portion 29: Lens member 30: Recess 31: Bottom surface of recess 32: Inner surface of recess 33: Step surface 34: Lower surface 35: Frame 36: Bottom 37: Metal film 38: Metal film 51: Lens portion 52: Support plate portion 60: Sealing member 60A: Sealing member 60B: Sealing member 60C: Sealing member 63: First pressing portion 64: Second pressing portion 65: Protrusion 70: Sealing member 80: Fixing thread 90: Thermistor 100: Light-emitting module 100A to 100F: Light-emitting module 200: Projector 200A: Projector 200B: Projector IIIC-IIIC: Lines S101 to S103: Steps S201 to S206: Steps FIG1A is a perspective view schematically showing an example of the structure of the light-emitting module of the first embodiment. FIG1B is a top view schematically showing an example of the structure of the light-emitting module of the first embodiment. FIG1C is a top view schematically showing an example of the structure of the mounting substrate of the first embodiment. FIG1D is a top view showing a state in which the mounting substrate of FIG1C is separated into two pieces of the first mounting substrate. FIG2A is an exploded perspective view schematically showing the structure of the first light-emitting device. FIG2B is a top view schematically showing the structure inside the package of the first light-emitting device. FIG3A is an exploded perspective view schematically showing the structure of the second light-emitting device. FIG3B is a top view schematically showing the structure inside the package of the second light-emitting device. FIG3C is a cross-sectional view taken along line IIIC-IIIC of FIG3B. FIG3D is a top view schematically showing the structure of the lower surface of the second light-emitting device. FIG4 is a flow chart showing the sequence of the manufacturing method of the light-emitting module of the first embodiment. FIG5A is a perspective view schematically showing an example of the structure of the light-emitting module of the second embodiment. FIG5B is a top view schematically showing an example of the structure of the light-emitting module of the second embodiment. FIG5C is a top view schematically showing an example of the structure of the mounting substrate of the second embodiment. FIG5D is a top view showing a state in which the mounting substrate of FIG5C is separated into a first mounting substrate and a second mounting substrate. FIG6 is a flow chart showing the sequence of the manufacturing method of the light-emitting module of the second embodiment. FIG7A is a top view schematically showing an example of the structure of the light-emitting module of the third embodiment. FIG7B is a top view schematically showing an example of the structure of the light-emitting module of the third embodiment. FIG7C is a top view schematically showing an example of the structure of the light-emitting module of the third embodiment. FIG8 is a top view schematically showing an example of the structure of the light-emitting module of the embodiment. FIG9A is a perspective view schematically showing an example of the structure of the light-emitting module of the fourth embodiment. FIG9B is a top view schematically showing an example of the structure of the light-emitting module of the fourth embodiment. FIG9C is a top view schematically showing the first mounting substrate of the fourth embodiment. FIG9D is a top view schematically showing the light-emitting device and thermistor mounted on the second mounting substrate of the fourth embodiment. FIG9E is a top view schematically showing the second mounting substrate of the fourth embodiment. FIG10A is a perspective view schematically showing an example of the installation of the light-emitting module of one embodiment when applied to a projector. FIG10B is a perspective sectional view schematically showing the sealing structure of the light-emitting module of one embodiment. FIG11A is a perspective view schematically showing an example of the installation of the light-emitting module of one embodiment when applied to a projector. FIG11B is a top view schematically showing an example of the structure of the projector of the embodiment of FIG11A. FIG11C is a side view schematically showing an example of the structure of the projector of the embodiment of FIG11A.FIG12A is a perspective view schematically showing an example of installation of a light emitting module according to an embodiment when applied to a projector. FIG12B is a side view schematically showing an example of the configuration of a projector according to the embodiment of FIG12A. FIG13 is a perspective cross-sectional view for illustrating another sealing structure of a light emitting module according to an embodiment. 10: Install the substrate 10a: 1st mounting substrate 20: Light-emitting device 20a: First light-emitting device 20b: Second light-emitting device 100: Luminous module

Claims

1. A light-emitting module comprising: a first light-emitting device comprising: a first package, a plurality of first semiconductor laser elements, and a first light-reflecting member, wherein the plurality of first semiconductor laser elements are disposed in the first package and include semiconductor laser elements emitting light of a first color, and the first light-reflecting member reflects at least the light emitted by the semiconductor laser elements emitting the first color from the light emitted by the plurality of first semiconductor laser elements; The second light-emitting device includes: a second package with the same shape as the first package, a plurality of second semiconductor laser elements, and a second light-reflecting member. The plurality of second semiconductor laser elements are mounted on the second package and include semiconductor laser elements that emit light of a second color that is different from the light emitted from each of the plurality of first semiconductor laser elements. The second light-reflecting member reflects at least the light emitted from the semiconductor laser elements emitting the second color light. A mounting substrate has a first connection pattern connected to the first light-emitting device and a second connection pattern connected to the second light-emitting device. The distance between the first light-reflecting member and the emitting end face of the first semiconductor laser element and the distance between the second light-reflecting member and the emitting end face of the second semiconductor laser element are determined according to the semiconductor laser elements, and the distances between the plurality of semiconductor laser elements are different.

2. A light-emitting module comprising: a first light-emitting device comprising: a first package and a plurality of first semiconductor laser elements disposed on the first package and comprising semiconductor laser elements emitting light of a first color; a second light-emitting device comprising: a second package having the same shape as the first package and a plurality of second semiconductor laser elements disposed on the second package and comprising semiconductor laser elements emitting light of a second color different from the light emitted from each of the plurality of first semiconductor laser elements; a mounting substrate having a first connection pattern connected to the first light-emitting device and a second connection pattern connected to the second light-emitting device; wherein the plurality of first semiconductor laser elements emit light in a direction in which the second light-emitting device is disposed.

3. The light-emitting module of claim 2, wherein the plurality of second semiconductor laser elements emit light in the direction in which the first light-emitting device is disposed.

4. The light-emitting module of any one of claims 1 to 3, wherein the number of the first semiconductor laser elements included in the first light-emitting device differs from the number of the second semiconductor laser elements included in the second light-emitting device by at least one.

5. A light-emitting module as claimed in any one of claims 1 to 3, wherein the first light-emitting device includes a first lens member having a plurality of first lens portions through which light emitted from each of the plurality of first semiconductor laser elements passes, and the second light-emitting device includes a second lens member having a plurality of second lens portions through which light emitted from each of the plurality of second semiconductor laser elements passes, wherein the first lens member and the second lens member are the same lens member, and the first lens portion and the second lens portion are lens portions with the same curvature.

6. A light-emitting module comprising: a first light-emitting device comprising: a first package, a plurality of first semiconductor laser elements, and a first lens member, wherein the plurality of first semiconductor laser elements are disposed in the first package and include semiconductor laser elements emitting light of a first color, and the first lens member has a plurality of first lens portions through which light emitted from each of the plurality of first semiconductor laser elements passes; and a second light-emitting device comprising: a second package having the same shape as the first package, a plurality of second semiconductor laser elements, and a second lens member, wherein the plurality of second semiconductor laser elements are disposed in the second package and include semiconductor laser elements emitting light of a second color that is different from the color of light emitted from each of the plurality of first semiconductor laser elements, and the second lens member has a plurality of second lens portions through which light emitted from each of the plurality of second semiconductor laser elements passes. The mounting substrate has a first connection pattern connected to the first light-emitting device and a second connection pattern connected to the second light-emitting device; the number of the first semiconductor laser elements included in the first light-emitting device differs from the number of the second semiconductor laser elements included in the second light-emitting device by at least one; the first lens member and the second lens member are lens members with different numbers and arrangements of lens portions.

7. The light-emitting module of any of the requests 1 to 3 and 6, wherein the first color light is blue light and the second color light is red light.

8. The light-emitting module of any one of claims 1 to 3 and 6, wherein the first light-emitting device further comprises a first cover portion joined to the first package, the plurality of first semiconductor laser elements are disposed in a sealed space, and the second light-emitting device further comprises a second cover portion joined to the second package, the plurality of second semiconductor laser elements are disposed in a sealed space.

9. The light-emitting module of any one of claims 1 to 3 and 6, wherein in the first light-emitting device, the plurality of first semiconductor laser elements are arranged side by side along a first direction, and in the second light-emitting device, the plurality of second semiconductor laser elements are arranged side by side along the first direction, and the first light-emitting device and the second light-emitting device are arranged side by side on the mounting substrate along a second direction perpendicular to the first direction.

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