Pressure curing oven for manufacturing of electronic device

Abstract

This invention relates to a pressure curing oven for manufacturing electronic devices, such as semiconductor packages, and more specifically, to a pressure curing oven for manufacturing electronic devices that cures adhesives applied to a workpiece while maintaining the interior of the chamber at high temperature and pressure, thereby suppressing bubble formation at the bonding sites. The pressure curing oven of this invention improves the quality of the curing process by reducing the concentration of fumes generated during the curing process.

Claims

1. A pressure curing oven for manufacturing electronic devices, comprising: a pressure curing oven for manufacturing electronic devices that cures objects coated with adhesive in a high-temperature, high-pressure atmosphere; and a pressure curing oven for manufacturing electronic devices comprising: A chamber having a closed working space capable of arranging the object product for curing; A gas supply unit is connected to the chamber to increase the pressure in the chamber and supply compressed gas to the work space; A gas exhaust unit is connected to the chamber and exhausts the compressed gas inside the working space to the outside; a heater heats either the compressed gas supplied by the gas supply unit or the compressed gas inside the working space of the chamber. The system includes a control unit that controls the operation of the gas supply unit, the gas exhaust unit, and the heater. The control unit performs an exhaust process that continuously and maintains the following actions during at least a portion of the curing process: supplying compressed gas to the working space of the chamber via the gas supply unit while maintaining the pressure inside the working space; and exhausting the compressed gas inside the working space of the chamber via the gas exhaust unit, thereby reducing the density of the fumes generated from the product when the working space of the chamber is sealed. The gas supply unit includes a pressurization unit that increases the pressure of the working space to a pressure suitable for curing after the working space of the chamber is sealed. The system includes an exhaust unit that operates during the exhaust process and supplies compressed gas to the workspace. The control unit continuously utilizes the exhaust unit to supply compressed gas to the workspace for at least a portion of the time during the curing process.

2. The pressure curing oven for manufacturing electronic devices as claimed in claim 1, wherein the maximum gas supply flow rate of the exhaust unit of the gas supply unit is less than the maximum gas supply flow rate of the pressure unit.

3. The pressure curing oven for manufacturing electronic devices as claimed in claim 2, wherein the chamber further includes a chamber pressure sensor for sensing internal pressure in the work space, and the control unit receives the measured value from the chamber pressure sensor and actuates the exhaust unit and the gas discharge unit to maintain the pressure in the work space.

4. The pressure curing oven for manufacturing electronic devices as claimed in claim 3, wherein the exhaust unit of the gas supply unit includes an exhaust flow meter for measuring the gas supply flow rate, the gas discharge unit includes a discharge flow meter for measuring the gas discharge flow rate, and the control unit controls the operation of the exhaust unit and the gas discharge unit using the measured values ​​of the exhaust flow meter and the discharge flow meter.

5. The pressure curing oven for manufacturing electronic devices as described in claim 3, further comprising: A flue gas sensing sensor is installed in either the chamber or the gas exhaust unit to measure the concentration of flue gas contained in the gas inside the working space or in the gas exhaust unit during the curing process. The control unit uses the measurement value of the flue gas sensing sensor to control the operation of the exhaust unit and the operation of the gas exhaust unit.

6. A pressure curing oven for manufacturing electronic devices as claimed in any one of claims 1 to 5, wherein the control unit continuously performs and executes the venting process during the curing process while maintaining the pressure and temperature of the working space for a period of time.

7. A pressure curing oven for manufacturing electronic devices as claimed in any one of claims 1 to 5, wherein the gas exhaust unit further includes a cooling module for cooling and exhausting compressed gas discharged from the work space.

8. The pressure curing oven for manufacturing electronic devices as claimed in claim 7, wherein the cooling module of the gas exhaust unit comprises: The cooling housing has a cooling flow path through which the discharged compressed gas passes; And a refrigerant flow path, provided in the cooling housing to contact the compressed gas passing through the cooling housing and to allow refrigerant to flow.

9. The pressure curing oven for manufacturing electronic devices as claimed in claim 8, wherein the cooling module of the gas exhaust unit further comprises: The lower chamber is located at the bottom of the cooling housing so that the condensed flue gas formed during the cooling process of the compressed gas can flow downward and accumulate.

10. The pressure curing oven for manufacturing electronic devices as claimed in claim 9, wherein the lower barrel of the cooling module of the gas exhaust unit is configured to be switchable relative to the cooling housing.

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