Optical packaging structure

TWI934598BActive Publication Date: 2026-08-01ENNOSTAR CORP

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Patent Information

Authority / Receiving Office: TW · TW
Patent Type: Patents
Current Assignee / Owner: ENNOSTAR CORP
Filing Date: 2025-05-09
Publication Date: 2026-08-01

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Abstract

This disclosure provides an optical packaging structure including a light-emitting element, a wavelength conversion layer, and an adhesive layer. The wavelength conversion layer is disposed on the light-emitting element. The adhesive layer is disposed between the light-emitting element and the wavelength conversion layer, and the adhesive layer is in contact with both the light-emitting element and the wavelength conversion layer. The thickness of the wavelength conversion layer is greater than the thickness of the light-emitting element.

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Claims

1. An optical packaging structure, comprising: A light-emitting element; A wavelength conversion layer is disposed on the light-emitting element; An adhesive layer is disposed between the light-emitting element and the wavelength conversion layer, and contacts the light-emitting element and the wavelength conversion layer; and a dimming structure surrounds the light-emitting element, the wavelength conversion layer and the adhesive layer, and contacts the wavelength conversion layer and the adhesive layer, wherein the thickness of the wavelength conversion layer is greater than the thickness of the light-emitting element.

2. The optical packaging structure as described in claim 1, wherein the thickness of the light-emitting element is between 3 micrometers and 20 micrometers.

3. The optical packaging structure as claimed in claim 1, wherein the light-emitting element has a first surface and a second surface opposite to the first surface, and the light-emitting element further includes an electrode disposed on the first surface, and one end of the dimming structure is not flush with the first surface of the light-emitting element.

4. The optical packaging structure as described in claim 3, wherein the end of the dimming structure protrudes from the first surface of the light-emitting element.

5. The optical packaging structure as described in claim 3, further comprising: A passivation layer covers the side surface of the light-emitting element and the first surface.

6. The optical packaging structure as described in claim 5, wherein the side surfaces of the wavelength conversion layer, the adhesive layer, and the passivation layer are flush.

7. The optical packaging structure as described in claim 6, wherein one end of the passivation layer is not flush with the first surface of the light-emitting element.

8. The optical packaging structure as described in claim 7, wherein the end of the passivation layer protrudes from the first surface of the light-emitting element.

9. The optical packaging structure as described in claim 1, wherein there is no substrate structure between the light-emitting element and the wavelength conversion layer.