Curved-adaptive test module for integrated circuit warpage

Abstract

A surface-adaptive integrated circuit test module is provided, suitable for testing integrated circuits. The integrated circuit includes a warped surface. The test module includes a test head and a test socket. The test head includes a contact surface. The test socket corresponds to the test head. In response to the integrated circuit being housed in the test socket, the contact surface of the test head can selectively contact the warped surface of the integrated circuit.

Claims

1. A surface-adaptive integrated circuit test module, suitable for testing an integrated circuit including a warped surface, the surface-adaptive integrated circuit test module comprising: A test head includes a contact surface; and a test socket corresponding to the test head; wherein, in response to the integrated circuit being placed in the test socket, the contact surface of the test head can selectively contact the warped surface of the integrated circuit.

2. The surface-adaptive integrated circuit test module as described in claim 1, wherein, The maximum warpage of the contact surface is less than or equal to the maximum warpage of the warped surface.

3. The surface-adaptive integrated circuit test module as described in claim 2, wherein, The maximum warpage of the contact surface is less than or equal to 0.3 mm.

4. The surface-adaptive integrated circuit test module as described in claim 1, wherein, The warped surface has a first radius of curvature, and the contact surface has a second radius of curvature; the second radius of curvature is greater than or equal to the first radius of curvature.

5. The surface-adaptive integrated circuit test module as described in claim 4, wherein, The first radius of curvature of the warped surface is obtained by the following formula: R=(L2+W2) / (8kω); where R is the first radius of curvature, L is the length of the warped surface, W is the width of the warped surface, k is a surface shape adjustment factor, and ω is the maximum warping of the warped surface.

6. The surface-adaptive integrated circuit test module as described in claim 5, wherein, The surface shape adjustment factor is between 0.8 and 1.2; the more concentrated the warp distribution of the warped surface, the closer the surface shape adjustment factor is to 0.8; the more uniform the warp distribution of the warped surface, the closer the surface shape adjustment factor is to 1.

2.

7. The surface-adaptive integrated circuit test module as described in claim 1, wherein, In response to the warped surface of the integrated circuit being a convex surface, the contact surface of the test head is a concave surface; in response to the warped surface of the integrated circuit being a concave surface, the contact surface of the test head is a convex surface.

8. The surface-adaptive integrated circuit test module as described in claim 1, further comprising a thermal interface material disposed on the contact surface of the test head.

9. The surface-adaptive integrated circuit test module as described in claim 1, wherein, The test head further includes a two-phase temperature equalization conductor and a temperature control device; the contact surface is the lower surface of one of the two-phase temperature equalization conductors, and the temperature control device is connected to the upper surface of one of the two-phase temperature equalization conductors.

10. The surface-adaptive integrated circuit test module as described in claim 9, wherein, The two-phase temperature-equalizing conductor includes a vacuum chamber, a plurality of thermally conductive support columns, a capillary structure, and a working fluid. The thermally conductive support columns and the working fluid are located within the vacuum chamber. Each thermally conductive support column extends from the lower surface to the upper surface along an extension direction, and each thermally conductive support column has two ends connected to two corresponding sides within the vacuum chamber. The capillary structure is disposed on one inner surface of the vacuum chamber and one outer surface of the thermally conductive support columns.

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