Electronic device

Abstract

An electronic device includes a main functional module and a chip bonding assembly. The main functional module includes a first pad located in its peripheral region. The chip bonding assembly is electrically connected to the main functional module and includes a substrate, a second pad, and a chip. The substrate has a first region, a second region opposite to the first region, a third region located between the first and second regions, and a fourth region located between the first and third regions. The second pad is located in the first region of the substrate and is electrically connected to the first pad. The chip is disposed in the third region of the substrate. The side length of a first side of the substrate located in the first region is greater than the side length of a second side of the substrate located in the second region, and the rigidity of the fourth region of the substrate is less than the rigidity of the first, second, and third regions.

Claims

1. An electronic device comprising: The main functional module includes a first pad located in its peripheral area; The assembly includes a wafer bonding component electrically connected to a main functional module, and comprises: a substrate having a first region, a second region opposite to the first region, a third region located between the first region and the second region, and a fourth region located between the first region and the third region; a second pad located in the first region of the substrate and electrically connected to the first pad; and a wafer disposed in the third region of the substrate, wherein the side length of the first side of the substrate located in the first region is greater than the side length of the second side of the substrate located in the second region, and the rigidity of the fourth region of the substrate is less than the rigidity of the first region, the second region, and the third region.

2. The electronic device as claimed in claim 1, wherein the Young's modulus of the fourth region is less than that of the first region, the second region and the third region.

3. The electronic device as claimed in claim 1, wherein the substrate comprises: A first dielectric layer extends continuously from the first region to the second region; And at least one second dielectric layer, located on one side of the first dielectric layer, and located in the first region, the second region and the third region, but not in the fourth region, wherein the Young's modulus of the first dielectric layer is less than the Young's modulus of the second dielectric layer.

4. The electronic device of claim 3, wherein the first dielectric layer comprises thermoplastic polyurethane or rubber, and the second dielectric layer comprises polyimide.

5. The electronic device as claimed in claim 1, wherein the cross-section of the fourth region has a wavy undulation in the direction from the second region to the first region.

6. The electronic device of claim 5, wherein the edges of two adjacent troughs of the wave-like undulation are separated from each other, and the edges of two adjacent crests are separated from each other.

7. The electronic device as claimed in claim 5, wherein the crests and troughs of the wave-like undulations overlap in the undulation direction.

8. The electronic device of claim 1, wherein the substrate further has a fifth region located between the second region and the third region, and the rigidity and Young's modulus of the fifth region are less than those of the first region, the second region or the third region.

9. The electronic device as claimed in claim 8, wherein the side lengths of the first to fifth regions parallel to the first side decrease in the order of the first region, the fourth region, the third region, the fifth region, and the second region.

10. The electronic device as claimed in claim 8, wherein the area of ​​the fifth region is smaller than the area of ​​the fourth region.

11. The electronic device of claim 8, wherein in the direction from the second region to the first region, the widths of the fourth region and the fifth region are greater than the width of the second region, the width of the second region is greater than the width of the first region, and the width of the first region is greater than the width of the third region.

12. The electronic device as claimed in claim 8, wherein, in the direction from the second region to the first region, the sum of the widths of the fourth region and the fifth region is 50% to 80% of the sum of the widths of the first region to the fifth region.

13. The electronic device as claimed in claim 8, wherein, In the direction from the second region to the first region, the cross-section of the fourth region has a first wavy undulation, the cross-section of the fifth region has a second wavy undulation, and when the first wavy undulation and the second wavy undulation have the same amplitude, the wavelength of the first wavy undulation is smaller than the wavelength of the second wavy undulation.

14. The electronic device of claim 1, wherein the wafer bonding assembly further includes a third pad located in the second region of the substrate, and the length of the third pad is greater than the length of the second pad.

15. The electronic device of claim 14 further includes a flexible circuit board electrically connected to the third pad, and the flexible circuit board overlapping the second region of the substrate.

16. The electronic device of claim 14, wherein the substrate further comprises a fifth region located between the second region and the third region, the fifth region having less rigidity than the first region, the second region and the third region, and the distance between the third pad and the fifth region being greater than the distance between the second pad and the fourth region.

17. The electronic device of claim 16, wherein the distance between the second pad and the fourth region is greater than the distance between the wafer and the fourth region or the fifth region.

18. The electronic device of claim 1, wherein the substrate has a trapezoidal profile.

19. The electronic device of claim 1, wherein the main functional module is flexible and the first region of the substrate overlaps the peripheral region of the main functional module.

20. The electronic device of claim 1, wherein the main functional module includes a self-emissive element, a non-self-emissive element, or a sensing element.

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