The retaining strip structure on the IC packaging pad
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- BOJIE TECHNOLOGY CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-08-01
Smart Images

Figure 00000000_0000_ABST
Abstract
Claims
1. A latching strip structure on an IC packaging pad, comprising an IC packaging pad and a latching strip body; the IC packaging pad has regularly arranged grooves for placing IC packaging components, and its edge has protruding fins, and a first engagement end is provided on the fins; the latching strip body is generally a U-shaped elongated plastic part, and a barcode is provided on the surface of the latching strip body, the barcode corresponding to the identification code of the IC component, which can be directly identified by a barcode scanner, and a second engagement end is provided on the end face inside the opening of the latching strip body, the second engagement end being snapped into place with the first engagement end of the IC packaging pad.
2. The retaining strip structure on the IC package disk as described in claim 1 above, wherein, The first connecting end of the wing at the edge of the IC package disk is a flange or a continuous segment; the second connecting end of the buckle body is a snap-fit or a continuous segment, which can be snapped into the first connecting end of the IC package disk.