Heat dissipation module, electronic device, and electronic apparatus

Abstract

This disclosure provides a heat dissipation module, an electronic device including the same, and an electronic device. The heat dissipation module can be used to cool a memory module. The heat dissipation module includes a heat dissipation element and a pair of brackets. The brackets are respectively connected to opposite sides of the heat dissipation element to fix the heat dissipation element to the memory module.

Claims

1. A heat dissipation module for cooling a memory module, comprising: A heat dissipation element includes a shielding portion that shiels one or more electronic components on the memory module, wherein the shielding portion is formed in a central region of the heat dissipation element; and a pair of brackets that are respectively connected to opposite sides of the heat dissipation element to fix the heat dissipation element to the memory module.

2. The heat dissipation module as claimed in claim 1, wherein the evacuation portion overlaps with at least one of the one or more electronic components on the memory module in a vertical direction.

3. The heat dissipation module as described in claim 1, wherein the evacuation portion includes an opening.

4. The heat dissipation module as described in claim 1, wherein the evading part includes a protrusion.

5. The heat dissipation module as described in claim 1, wherein the heat dissipation element further includes a support portion that directly contacts the memory module.

6. The heat dissipation module as claimed in claim 1, wherein the heat dissipation element includes an extension extending perpendicularly from one edge of the heat dissipation element.

7. The heat dissipation module as claimed in claim 6, wherein one dimension of the extension in a vertical direction is between 2.6 mm and 4.6 mm.

8. The heat dissipation module as claimed in claim 6, wherein the heat dissipation element further includes a recess, and the extension and the recess are located at opposite edges of the heat dissipation element.

9. The heat dissipation module as claimed in claim 8, wherein the heat dissipation element further includes a first heat dissipation element hole and a second heat dissipation element hole, the first heat dissipation element hole being formed in the extension and the second heat dissipation element hole being formed in the recess.

10. The heat dissipation module as claimed in claim 9, wherein each of the pair of brackets includes a connector that passes through the first hole of the heat dissipation element.

11. The heat dissipation module as claimed in claim 9 further includes a fixing element, wherein the memory module includes a memory module hole, each of the pair of brackets includes a bracket hole, wherein the fixing element passes through the second hole of the heat dissipation element, the memory module hole, and the bracket hole.

12. An electronic device comprising: A memory module includes: a circuit board; and a first set of electronic components disposed on the circuit board; and a heat dissipation module including: a heat dissipation element that at least partially covers the first set of electronic components, wherein the heat dissipation element includes a support portion that protrudes toward the memory module, and one dimension of the support portion in a vertical direction is greater than or equal to the height of one of the first set of electronic components; and a pair of brackets that are respectively connected to opposite sides of the heat dissipation element to fix the heat dissipation element to the memory module.

13. The electronic device as claimed in claim 12, wherein the support portion directly contacts the circuit board of the memory module.

14. The electronic device as claimed in claim 12, wherein the memory module further comprises: A second group of electronic components is disposed on the circuit board; A third set of electronic components is disposed on the circuit board, wherein at least one of the second set of electronic components and the third set of electronic components has a height greater than that of the first set of electronic components, wherein the heat dissipation element includes a shimming portion that overlaps with at least one of the second set of electronic components and the third set of electronic components in the vertical direction.

15. The electronic device as claimed in claim 14, wherein the dodging portion includes an opening that exposes part or all of the second set of electronic components in the vertical direction.

16. The electronic device as claimed in claim 14, wherein the dodging portion includes a protrusion that overlaps with the third set of electronic components in the vertical direction.

17. The electronic device as claimed in claim 14 further includes a thermally conductive element disposed between the heat dissipation element and the circuit board, and in direct contact with the first group of electronic components, the second group of electronic components, and the third group of electronic components.

18. The electronic device as claimed in claim 17, wherein the thermally conductive element is a thermally conductive adhesive, a thermally conductive gel, or a thermally conductive silicone sheet.

19. An electronic device comprising: One motherboard; The device includes a first electronic device disposed parallel to the motherboard, wherein the first electronic device includes: a first memory module; and a first heat dissipation module for dissipating heat generated by the first memory module, wherein the first heat dissipation module includes: a first heat dissipation element; and a pair of brackets respectively connected to opposite sides of the heat dissipation element to fix the heat dissipation element to the first memory module.

20. The electronic device as claimed in claim 19 further includes a second electronic device disposed parallel to the motherboard, wherein the second electronic device includes a second memory module, the motherboard has a normal direction, and the second memory module and the first memory module at least partially overlap in the normal direction.

21. The electronic device as claimed in claim 20, wherein the second electronic device further includes a second heat dissipation module for dissipating heat generated by the second memory module, the second heat dissipation module including a second heat dissipation element, wherein the first heat dissipation element is disposed between the first memory module and the second memory module in the normal direction, and the second memory module is disposed between the first heat dissipation element and the second heat dissipation element in the normal direction.

22. The electronic device as claimed in claim 20, wherein the first heat dissipation element is in direct contact with the first memory module and the second memory module.

23. The electronic device as claimed in claim 20 further includes a first thermally conductive element and a second thermally conductive element, wherein the first thermally conductive element is disposed between the motherboard and the first memory module, and the second thermally conductive element is disposed between the first heat dissipation element and the second memory module.

Images