A stamp comprising cooling layer and an electronic element transfer device and method including the same

Abstract

This invention relates to a mold having a cooling layer and an electronic component transfer apparatus and method comprising the same. The mold includes a first substrate, a cooling layer, and a buffer layer. The cooling layer is disposed on one side of the first substrate and includes a plurality of openings. The buffer layer is disposed on one side of the first substrate such that the first substrate is sandwiched between the cooling layer and the buffer layer, or the cooling layer is sandwiched between the first substrate and the buffer layer. The buffer layer includes a plurality of columnar structures, wherein the vertical projections of the plurality of columnar structures onto the cooling layer are misaligned with the plurality of openings.

Claims

1. An impression, comprising: First substrate; A cooling layer is disposed on one side of the first substrate and includes a plurality of openings; and a buffer layer is disposed on one side of the first substrate, such that the first substrate is sandwiched between the cooling layer and the buffer layer or the cooling layer is sandwiched between the first substrate and the buffer layer, the buffer layer including a plurality of columnar structures, wherein the vertical projection of the plurality of columnar structures on the cooling layer corresponds to and is misaligned with the plurality of openings.

2. The mold as described in claim 1, wherein the cooling layer includes a heat dissipation area and a plurality of cooling structures, wherein the heat dissipation area surrounds the plurality of openings and the plurality of cooling structures, and the plurality of cooling structures and the plurality of openings are correspondingly offset and disposed above the vertical projection of the plurality of columnar structures.

3. The impression as described in claim 2, wherein each adjacent opening of the plurality of openings is separated from each adjacent column of the plurality of columnar structures by a distance.

4. The mold as described in claim 3, wherein each adjacent cooling structure in the plurality of cooling structures is separated by the spacing.

5. The mold as claimed in claim 1 further includes a second substrate disposed on one side of the first substrate, such that the second substrate is sandwiched between the cooling layer and the buffer layer, and the cooling layer is sandwiched between the first substrate and the buffer layer.

6. An electronic component transfer apparatus, comprising: A transfer head assembly configured to move on a target substrate, comprising an impression configuration for picking up one or more electronic components; The mold includes a first substrate; a cooling layer disposed on one side of the first substrate and including a plurality of openings; and a buffer layer disposed on one side of the first substrate, such that the first substrate is sandwiched between the cooling layer and the buffer layer or the cooling layer is sandwiched between the first substrate and the buffer layer, the buffer layer including a plurality of columnar structures, wherein the vertical projection of the plurality of columnar structures on the cooling layer corresponds to and is misaligned with the plurality of openings, and the plurality of columnar structures are configured to be connected to one or more electronic components; and a laser light source configured to emit a laser beam toward the target substrate, the laser beam passing through the plurality of openings from the laser light source and generating heat energy, causing the one or more electronic components to separate from the plurality of columnar structures and be fixed to the target substrate, and the heat energy is transferred through the cooling layer.

7. The electronic component transfer device as claimed in claim 6, wherein the cooling layer includes a heat dissipation area and a plurality of cooling structures, wherein the heat dissipation area surrounds the plurality of openings and the plurality of cooling structures, and the plurality of cooling structures and the plurality of openings are correspondingly offset and disposed above the vertical projection of the plurality of columnar structures.

8. The electronic component transfer device as claimed in claim 7, wherein each adjacent opening of the plurality of openings is separated from each adjacent column of the plurality of columnar structures by a distance.

9. The electronic component transfer apparatus as described in claim 8, wherein each of the plurality of cooling structures is arranged apart from each other at the specified spacing.

10. The electronic component transfer apparatus as claimed in claim 6 further includes a second substrate disposed on one side of the first substrate, such that the second substrate is sandwiched between the cooling layer and the buffer layer, and the cooling layer is sandwiched between the first substrate and the buffer layer.

11. A method for transferring electronic components, comprising: A source substrate is provided, wherein one or more electronic components are disposed on the source substrate; A target substrate is provided, configured to transfer one or more electronic components onto the target substrate; a transfer head assembly is provided, configured to move on the target substrate, and includes a mold comprising: a first substrate; A cooling layer is disposed on one side of the first substrate and includes a plurality of openings; and a buffer layer is disposed on one side of the first substrate, such that the first substrate is sandwiched between the cooling layer and the buffer layer or the cooling layer is sandwiched between the first substrate and the buffer layer, the buffer layer including a plurality of columnar structures, wherein the vertical projection of the plurality of columnar structures on the cooling layer corresponds to and is misaligned with the plurality of openings; picking up one or more electronic components such that the one or more electronic components are correspondingly connected to the plurality of columnar structures of the mold; moving the transfer head assembly on the target substrate and pressing the mold onto the target substrate, such that the one or more electronic components contact the target substrate; The transfer of one or more electronic components to the target substrate includes emitting a laser beam generated by a laser light source onto the target substrate. The laser beam passes through the plurality of openings from the laser light source and generates heat energy, causing the one or more electronic components to separate from the plurality of columnar structures and be fixed to the target substrate. The heat energy is then transferred via the cooling layer.

12. The electronic component transfer method as described in claim 11, wherein the cooling layer includes a heat dissipation area and a plurality of cooling structures, wherein the heat dissipation area surrounds the plurality of openings and the plurality of cooling structures, and the plurality of cooling structures and the plurality of openings are correspondingly offset and disposed above the vertical projection of the plurality of columnar structures.

13. The electronic component transfer method as described in claim 12, wherein each adjacent opening of the plurality of openings and each adjacent column of the plurality of columnar structures are separated by a distance.

14. The electronic component transfer method as described in claim 13, wherein each adjacent cooling structure in the plurality of cooling structures is separated by the spacing.

15. The electronic component transfer method as described in claim 11 further includes a second substrate disposed on one side of the first substrate, such that the second substrate is sandwiched between the cooling layer and the buffer layer, and the cooling layer is sandwiched between the first substrate and the buffer layer.

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