Electronic device

Abstract

An electronic device includes a chassis, a motherboard, an electronic module, a heatsink module, and a bridge module. The chassis includes a bottom wall and two side walls. The side walls are respectively connected to two opposite sides of the bottom wall. The motherboard is disposed on the bottom wall and located between the side walls. The electronic module is disposed on the motherboard. The heatsink module is attached to the electronic module and used to dissipate heat from the electronic module. The bridge module includes a crossbeam structure mounted on the heatsink module and two support structures extending from opposite sides of the crossbeam structure towards the bottom wall. The support structures are respectively mounted on the side walls to fix the bridge module to the side walls and to position the heatsink module within the chassis via the bridge module, thereby effectively improving the problem of the heatsink module occupying motherboard wiring space.

Claims

1. An electronic device comprising: a chassis including a bottom wall and two side walls extending from opposite sides of the bottom wall in a direction away from the bottom wall; a motherboard disposed on the bottom wall and located between the side walls; an electronic module disposed on the motherboard; a heat sink module abutting the electronic module and used for heat dissipation of the electronic module; and a bridge module including a beam structure connecting the heat sink module and two support structures extending from opposite sides of the beam structure in a direction close to the bottom wall, the support structures being respectively mounted on the side walls to fix the bridge module to the side walls and to position the heat sink module in the chassis via the bridge module, the heat sink module including a heat sink having a heat sink body abutting the electronic module and an outwardly expanding fin extending from the heat sink body in a direction towards the bridge module, the outwardly expanding fin being detachably fixed to the beam structure of the bridge module.

2. The electronic device as claimed in claim 1, wherein, The heat sink module includes multiple heat sinks arranged along the extension direction of the crossbeam structure. Each heat sink has a heat sink body that abuts against the electronic module and an outwardly expanding fin extending from the heat sink body toward the bridge module. The outwardly expanding fin is detachably fixed to the crossbeam structure of the bridge module.

3. The electronic device as claimed in claim 2, wherein, Each heat sink's external fin has a positioning part; the crossbeam structure of the bridge module has a crossbeam body and multiple fasteners, the fasteners passing through the crossbeam body and locked to the positioning part of the heat sink, so that the crossbeam structure is detachably connected to the external fin of the heat sink.

4. The electronic device as claimed in claim 3, wherein, Each of the radiator’s external fins has a positioning portion with multiple screw holes; the beam body of the beam structure has multiple first through holes corresponding to the screw holes of the positioning portion, and the fasteners pass through the first through holes and are locked to the screw holes of the positioning portion of the radiator, thereby locking the beam structure to the external fins of the radiator.

5. The electronic device as claimed in claim 2, wherein, The crossbeam structure of the bridging module is connected to the side of the radiator module away from the bottom wall and spans the radiator module. The crossbeam structure and the support structure together define a channel space into which the radiator module's radiator module's radiator fins extend.

6. The electronic device as claimed in claim 1, wherein, The chassis also includes two positioning protrusions respectively disposed on the side wall and extending toward each other; each support structure of the bridging module has a positioning groove, the positioning groove of the support structure corresponds to the positioning protrusion and is detachably mounted on the positioning protrusion so that the bridging module is positioned inside the chassis.

7. The electronic device as claimed in claim 6, wherein, Each positioning protrusion of the chassis has a positioning rod disposed on the corresponding side wall and extending from the corresponding side wall to the other side wall, and a stop disposed on the positioning rod. The positioning groove of each support structure is recessed and extends from the side edge of the corresponding support structure away from the crossbeam structure toward the crossbeam structure. The positioning grooves of the support structures are respectively detachably hung on the positioning rods of the positioning protrusions to position the bridge module in the chassis, and the stops of the positioning protrusions respectively block the support structures.

8. The electronic device as claimed in claim 1, wherein, Each sidewall of the chassis has a fixing hole; each support structure of the bridge module has a plate near the corresponding sidewall and a hand screw, each plate has a second through hole, the second through hole of the plate corresponds to the fixing hole of the sidewall, the hand screw of the support structure passes through the second through hole and is locked to the fixing hole so that the support structure is installed on the sidewall and the bridge module is fixed to the sidewall.

9. The electronic device as claimed in claim 8, wherein, The length of the beam structure is the same as the spacing between the sidewalls in the extension direction of the beam structure. Each support structure also has a guide member, which extends from one side edge of the plate away from the beam structure in a direction away from the beam structure, and the guide members extend in a direction closer to each other.

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