System and method of providing pressure on semiconductor device

Abstract

The present invention discloses a system (101) and method for applying pressure to at least one semiconductor device (103), comprising at least one pressure block (105) configured to accommodate at least one pressure head (107); at least one actuator (109) adapted to apply force to at least one sputtering target unit (115) placed on an inelastic platform (111), wherein the pressure head (107) is capable of applying a linear force on its respective semiconductor device (103), and the pressure head (107) is capable of applying a preset force on the semiconductor device (103) without providing further pressure on the inelastic platform (111).

Description

[Technical Field]

[0001] The present invention provides a system and method for applying pressure to at least one semiconductor device. The system includes at least one pressure block configured to accommodate at least one pressure head and at least one actuator, adapted to apply force to at least one sputtering target unit placed on an inelastic platform, wherein each pressure head can apply a linear force to a corresponding semiconductor device on the sputtering target unit, and the pressure head can apply a preset force to the semiconductor device without applying further pressure to the inelastic platform. [Previous Technology]

[0002] Sputtering deposition is a physical vapor deposition (PVD) process used to form a thin film on a specific surface, in some cases the surface of silicon wafers, semiconductor devices, etc. In the case of sputtering semiconductor devices, the sputtering process is typically performed using a sputtering machine, in which several semiconductor devices are placed on an adhesive tape on a sputtering frame, the adhesive tape is placed on a platform, and then the semiconductor devices are pressed or squeezed by the equipment to adhere the semiconductor devices to the adhesive tape before the sputtering process.

[0003] Problems arise when several semiconductor devices placed on the adhesive tape have different thicknesses. In this case, some semiconductor devices cannot be pressed by the pressing device because the pressing device consists of a single large pressing block, which cannot press other thinner semiconductor devices when it comes into contact with the thickest semiconductor device. When the semiconductor device cannot be fully adhered to the adhesive tape, material backflow will occur during sputtering, and the sputtered material will seep into the gap between the semiconductor device and the adhesive tape.

[0004] In some solutions, the platform is made of an elastic material, so the pressing device can apply further pressure to the semiconductor device. Due to the elastic nature of the platform, the semiconductor device can be pushed further towards the platform, thus ensuring that all semiconductor devices receive pressure from the pressing device. This solution is less effective because it is an open-loop solution; the user cannot know the magnitude of the force applied to each semiconductor device, and if excessive force is applied to a particular semiconductor device, the device may be damaged.

[0005] Another problem arises when the number of semiconductor devices on the adhesive tape changes. If more semiconductor devices are pressed down by the same force generated by the actuator, the effective force on each semiconductor device will decrease, thereby affecting the adhesion quality of the semiconductor devices on the adhesive tape.

[0006] Chinese Patent CN218730820U discloses a heating fixture for QFN packaging of power supply products, which relates to the technical field of QFN packaging and heating of power supply products. In this fixture, a downward pressure resistance heating plate is provided on the vertically upward position of the power supply QFN chip frame. The resistance heating plate is a single plate used to provide downward pressure.

[0007] Therefore, it is advantageous to mitigate the above-mentioned disadvantages by having a system that provides pressure on at least one semiconductor device, and that the system is capable of providing sufficient force to each pressure head for its respective semiconductor device, even if the platform is inelastic. [Summary of the Invention]

[0008] Based on this, the main objective of the present invention is to provide a system and method for applying pressure to at least one semiconductor device such that each indenter is able to provide sufficient force to its corresponding semiconductor device, even if the semiconductor devices on the same adhesive tape have different thicknesses, the sufficient force meaning that no backflow is observed during and after sputtering.

[0009] Another object of the present invention is to provide a system and method for applying pressure to at least one semiconductor device, the system being usable with an inelastic platform that houses a sputtering target unit, since no force is observed on the side of the semiconductor device connected to the platform.

[0010] Another object of the present invention is to provide a system and method for applying pressure to at least one semiconductor device, the system allowing each pressure head to apply a preset control force on each individual and corresponding semiconductor device.

[0011] Another object of the present invention is to provide a system and method for applying pressure to at least one semiconductor device, the system allowing measurement of the force applied by each pressure head to its respective semiconductor device.

[0012] Other objects of the invention will become clear from understanding the following detailed description of the invention or from using the invention in practice.

[0013] According to a preferred embodiment of the present invention, the following is provided:

[0014] A system for supplying pressure to at least one semiconductor device includes:

[0015] At least one pressure block configured to accommodate at least one pressure head;

[0016] At least one actuator is configured to connect to the pressure block and provide a linear force to the pressure block for linear movement toward at least one platform;

[0017] The platform is characterized in that: it is configured to accommodate at least one sputtering target unit; wherein the sputtering target unit includes at least one adhesive tape having an adhesive surface facing the pressure block; the sputtering target unit further includes at least one retaining mechanism disposed around the adhesive tape, configured to retain the adhesive tape in a planar position; the sputtering target unit further includes at least one semiconductor device disposed on the adhesive surface of the adhesive tape;

[0018] The sputtering target unit is disposed between the platform and the pressure block;

[0019] Each of the pressure heads includes at least one compressor; each pressure head is configured to be aligned with the semiconductor device; wherein each pressure head is configured to provide a preset force on its respective semiconductor device when the pressure block is driven by the actuator;

[0020] The surface of the platform accommodating the sputtering target unit is inelastic;

[0021] The system further includes at least one data processing device configured to instruct the actuator to push the pressure block to provide the linear force;

[0022] The system further includes at least one force measuring mechanism configured to measure the force applied to each compressor when the compressor is pushed by the pressure head at least one compression distance against the force measuring mechanism; and to feed back to the data processing device to calculate and determine the preset force to be applied to the semiconductor device.

[0023] In another embodiment of the present invention, the following is provided:

[0024] A method for applying pressure to at least one semiconductor device includes the following steps:

[0025] (i) When at least one compressor connected to the pressure head is pushed by the pressure head for at least one compression distance against at least one force measuring mechanism, at least one applied force of the compressor is measured using the at least one force measuring mechanism to determine the correlation between the compression distance of the compressor and the applied force provided by the compressor; wherein the pressure head is within the pressure block; wherein the actuator is configured to move the pressure block toward the force measuring mechanism, causing the compressor to be compressed when the pressure head abuts against the force measuring mechanism;

[0026] (ii) Determine the preset applied force applied by each pressure head to at least one corresponding semiconductor device;

[0027] (iii) Based on the preset applied force in step (ii) and the correlation between the applied force of the compressor and the compression distance in step (i), calculate the total distance that each pressure head needs to move to achieve the preset applied force in step (ii); wherein, the total distance is the sum of the initial distance between the pressure head and its corresponding semiconductor device and the compression distance of the compressor;

[0028] (iv) Calculate the average total distance of all compressors in the same briquette;

[0029] (v) The pressure block is linearly moved toward at least one platform; wherein the platform is configured to accommodate at least one sputtering target unit; wherein the sputtering target unit includes at least one adhesive tape having an adhesive surface toward the pressure block; the sputtering target unit also includes at least one tape holding mechanism disposed around the periphery of the adhesive tape, configured to hold the adhesive tape in a planar position; the sputtering target unit also includes at least one semiconductor device disposed on the adhesive surface of the adhesive tape; wherein the sputtering target unit is disposed between the platform and the pressure block; wherein each pressure head is configured to be aligned with the semiconductor device.

Implementation Method

[0031] Numerous specific details are set forth in the following detailed description in order to provide a thorough understanding of the invention. However, it will be understood by those skilled in the art that the invention can be practiced without these specific details. In other instances, well-known methods, steps, and / or elements have not been described in detail so as not to obscure the invention.

[0032] The invention will be more clearly understood from the following description of its embodiments, which are given by way of example only and with reference to the accompanying drawings, which are not drawn to scale.

[0033] This embodiment provides a system (101) for applying pressure to at least one semiconductor device (103), including at least one pressure block (105) configured to accommodate at least one pressure head (107), and at least one actuator (109) configured to connect to the pressure block (105) and provide a linear force to the pressure block (105) for linear movement toward at least one platform (111). The actuator (109) may be a pressure motor.

[0034] The platform (111) is configured to accommodate at least one sputtering target unit (115); wherein the sputtering target unit (115) includes at least one adhesive tape (117) having an adhesive surface (117A) facing the pressure block (105); the sputtering target unit (115) further includes at least one retaining mechanism (119) disposed around the adhesive tape (117), configured to retain the adhesive tape (117) in a planar position; the sputtering target unit (115) further includes at least one semiconductor device (103) disposed on the adhesive surface (117A) of the adhesive tape (117). A plurality of the semiconductor devices (103) are equidistantly arranged. The sputtering target unit (115) is disposed on the platform (111) and located between the platform (111) and the pressure block (105). The surface of the platform (111) that houses the sputtering target unit (115) is non-elastic. The semiconductor device (103) may be a QFN device. The tape holding mechanism (119) may be a fixing device, a clamp, or a sputtering frame.

[0035] Each of the pressure heads (107) includes at least one compressor (113); each pressure head (107) is configured to align with the semiconductor device (103); wherein each pressure head (107) is configured to provide a preset force on its respective corresponding semiconductor device (103) when the pressure block (105) is driven by the actuator (109). The preset force provided by each pressure head (107) is inversely proportional to the thickness of its corresponding semiconductor device (103).

[0036] The system (101) further includes at least one data processing device configured to instruct the pressure block (105) to provide the linear force, and to instruct the pressure head (107) to provide the preset force or a combination thereof. The preset force applied by each pressure head (107) to its corresponding semiconductor device (103) can be controlled by the data processing device. Given that the preset force applied by the pressure head (107) to its corresponding semiconductor device (103) and the platform (111) are inelastic, the sides of the semiconductor device (103) in contact with the adhesive tape (117) are not subjected to force.

[0037] The system (101) also includes at least one force measuring mechanism (501), such as a weighing sensor, which is configured to measure the force applied to each compressor (113) when the compressor (113) is pushed by the pressure head (107) at least one compression distance against the force measuring mechanism (501), and feed it back to the data processing device to calculate and determine a preset force to be applied to the semiconductor device (103).

[0038] The present invention is also a method for applying pressure to at least one semiconductor device (103), as shown in FIG4, comprising the following steps. Prior to step (i), as shown in FIG5A and FIG7A, at least one pressure block (105) is driven to align at least one pressure head (107) and its corresponding compressor (113) with at least one force measuring mechanism (501).

[0039] In step (i), as shown in Figures 5B and 7B, when at least one compressor (113) connected to the pressure head (107) is pushed by the pressure head (107) against at least one force measuring mechanism (501) with at least one compression distance, at least one applied force of the compressor (113) is measured using the at least one force measuring mechanism (501). This operation is to determine the correlation between the compression distance of the compressor (113) and the applied force provided by the compressor (113). The pressure head (107) is located within the pressure block (105). Step (i) is crucial because the compression characteristics of each compressor (113) in the pressure block may differ. At least one actuator (109) is configured to move the pressure block (105) toward the force measuring mechanism (501), compressing the compressor (113) when the pressure head (107) abuts against the force measuring mechanism (501). As shown in Figures 6A to 6D, in one application example, the first compressor (113A) is overcompressed multiple times at different compression distances (e.g., 100 micrometers (X1), 200 micrometers (X2), 300 micrometers (X3), 400 micrometers, and 500 micrometers), while simultaneously measuring and collecting the corresponding applied forces (e.g., 100 grams, 150 grams, 200 grams, 250 grams, and 300 grams). Then, as shown in Figures 8A to 8D, the second compressor (113B) is overcompressed multiple times at different compression distances (e.g., 100 micrometers (Y1), 200 micrometers (Y2), 300 micrometers (Y3), 400 micrometers, and 500 micrometers), while simultaneously measuring and collecting the corresponding applied forces (e.g., 100 grams, 200 grams, 300 grams, 400 grams, and 500 grams).

[0040] In step (ii), a preset applied force is determined by each pressure head (107) to its corresponding at least one semiconductor device (103). For example, the user may want to set an overcompression force of 100 grams to be applied to all semiconductor devices (103) placed on at least one adhesive tape (117), such that the 100-gram overcompression force applied to these semiconductor devices (103) can ensure sufficient adhesion between the semiconductor devices (103) and the adhesive tape (117) to avoid backflow during sputtering, while not damaging the semiconductor devices (103).

[0041] In step (iii), based on the preset applied force in step (ii) and the correlation between the applied force of the compressor (113) and the compression distance in step (i), the total distance that each pressure head (107) needs to move to achieve the preset applied force in step (ii) is calculated. The total distance is the sum of the initial distance between the pressure head (107) and its corresponding semiconductor device (103) and the compression distance of the compressor (113). For example, if the initial distance between the first pressure head (107A) and the first semiconductor device is 100 micrometers and a preset applied force of 300 grams is required, and according to step (i), an overcompression distance of 500 micrometers is required to provide an applied force of 300 grams, then the total distance required by the first pressure head is the sum of 100 micrometers and 500 micrometers, i.e., 600 micrometers. For the second pressure head (107B), if the initial distance between the first pressure head (107A) and the first semiconductor device is 200 micrometers, and a preset applied force of 300 grams is required, and according to step (i), an overcompression distance of 300 micrometers is required to provide the applied force of 300 grams, then the total distance required for the first pressure head is the sum of 200 micrometers and 300 micrometers, i.e., 500 micrometers. The total distance of each pressure head (107) in the pressure block (105) is determined in this way.

[0042] In step (iv), the pressure block (105) is linearly moved toward at least one platform (111); wherein the platform (111) is configured to accommodate at least one sputtering target unit (115). The sputtering target unit (115) includes at least one adhesive tape (117) with its adhesive surface (117A) facing the pressure block (105). The sputtering target unit (115) also includes at least one tape holding mechanism (119) disposed around the adhesive tape (117), the mechanism being configured to hold the adhesive tape (117) in a planar position. The sputtering target unit (115) also includes at least one of the aforementioned semiconductor devices (103) placed on the adhesive surface (117A) of the adhesive tape (117). The sputtering target unit (115) is placed between the platform (111) and the pressure block (105); wherein each pressure head (107) is configured to be aligned with the semiconductor device (103).

[0043] The method of applying pressure to at least one semiconductor device (103) further includes a step between steps (iii) and (iv) to calculate an average total distance of all pressure heads (107) in the same pressure block (105). The total distance is averaged because all pressure heads are controlled by the same pressure block, therefore the actuator (109) can only provide one total distance for all pressure heads (107) in the same pressure block (105). This averaging step could be omitted if each pressure head (107) were driven by its own actuator (109). Continuing with the example above, if the total distance of the first pressure head is 600 micrometers, the total distance of the second pressure head is 500 micrometers, and assuming there are only two pressure heads in the same pressure block (105), then the average total distance is 550 micrometers.

[0044] Although the invention has been shown and described herein with reference to its preferred embodiments, illustrating the results and advantages obtained by the invention relative to the prior art, the invention is not limited to these specific embodiments. Therefore, the inventive forms shown and described herein are merely illustrative examples, and other embodiments may be chosen without departing from the scope of the invention, as described in the appended claims. [Simplified Explanation of the Diagram]

[0030] Other aspects and advantages of the present invention will become apparent upon examination of the specific embodiments in conjunction with the accompanying drawings, in which: Figure 1 is a side view of the present invention before the actuator applies force to the pressure block; Figure 2 is a side view of the present invention after the actuator applies force to the pressure block, up to the point where any one of the pressure heads contacts the thickest semiconductor device on the adhesive tape; Figure 3 is a side view of the present invention after the actuator applies further force to the pressure block, with all pressure heads in contact with their respective semiconductor devices; Figure 4 is a flowchart of the method of the present invention; Figure 5A shows a side view of the system of the present invention performing step (i) of the method of the present invention, wherein the first pressure head is aligned with the force measuring mechanism, and Figure 5B shows a side view of the system of the present invention performing step (i) of the method of the present invention, wherein the actuator pushes the pressure block to overcompress the first compressor on the first pressure head, such that the applied force of the first compressor can be measured by the force measuring device. Figures 6A, 6B, 6C, and 6D are side close-up views showing the first indenter aligned with the force measuring device. Figure 6A shows the first indenter in contact with the force measuring device, Figure 6B shows the first compressor on the first indenter overcompressed by a distance X1, Figure 6C shows the first compressor on the first indenter overcompressed by a distance X2, and Figure 6D shows the first compressor on the first indenter overcompressed by a distance X3. Figure 7A shows a side view of the system of the present invention performing step (i) of the method of the present invention, wherein the second indenter is aligned with the force measuring mechanism, and Figure 7B shows a side view of the system of the present invention performing step (i) of the method of the present invention, wherein the actuator pushes the pressure block to overcompress the second compressor on the second indenter, such that the applied force of the second compressor can be measured by the force measuring device. Figures 8A, 8B, 8C, and 8D are side close-up views showing the second indenter aligned with the force measuring device. Figure 8A shows the second indenter in contact with the force measuring device, Figure 8B shows the second compressor on the second indenter over-compressed by a distance Y1, Figure 8C shows the second compressor on the second indenter over-compressed by a distance Y2, and Figure 8D shows the second compressor on the second indenter over-compressed by a distance Y3.

Claims

1. A system (101) for supplying pressure to at least one semiconductor device (103), comprising: At least one pressure block (105) configured to receive at least one pressure head (107); at least one actuator (109) configured to connect to the pressure block (105) and provide a linear force to the pressure block (105) for linear movement toward at least one platform (111); characterized in that: the platform (111) is configured to receive at least one sputtering target unit (115); wherein the sputtering target unit (115) includes at least one adhesive tape (117) having an adhesive surface (117A) facing the pressure block (105); the sputtering target unit (115) further includes at least one retaining mechanism (119) disposed around the adhesive tape (117) and configured to retain the adhesive tape (117) in a planar position; the sputtering target unit (115) further includes at least one semiconductor device (103) disposed on the adhesive surface (117A) of the adhesive tape (117). The sputtering target unit (115) is disposed between the platform (111) and the pressure block (105); each of the pressure heads (107) includes at least one compressor (113); each pressure head (107) is configured to align with the semiconductor device (103); wherein each pressure head (107) is configured to provide a preset force on its respective semiconductor device (103) when the pressure block (105) is driven by the actuator (109); the surface of the platform (111) housing the sputtering target unit (115) is inelastic; wherein the system (101) further includes at least one data processing device configured to instruct the actuator (109) to push the pressure block (105) to provide the linear force; The system (101) further includes at least one force measuring mechanism (501) configured to measure the force applied to each compressor (113) when the compressor (113) is pushed by the pressure head (107) at least one compression distance against the force measuring mechanism (501); and to feed the force back to the data processing device to calculate and determine the preset force to be applied to the semiconductor device (103).

2. The system (101) for supplying pressure to at least one semiconductor device (103) according to claim 1, wherein, The actuator (109) is a pressure motor.

3. The system (101) for supplying pressure to at least one semiconductor device (103) according to claim 1, wherein, The plurality of semiconductor devices (103) are arranged at equal intervals.

4. The system (101) for supplying pressure to at least one semiconductor device (103) according to claim 1, wherein, The preset force provided by each pressure head (107) is inversely proportional to the thickness of its corresponding semiconductor device (103).

5. The system (101) for supplying pressure to at least one semiconductor device (103) according to claim 1, wherein, The adhesive tape (117) is a polyester film tape or a PU tape.

6. The system (101) for supplying pressure to at least one semiconductor device (103) according to claim 1, wherein, The force measuring mechanism is a weighing sensor.

7. A method for applying pressure to at least one semiconductor device (103), comprising the steps of: (i) when at least one compressor (113) is pushed by its corresponding pressure head (107) against at least one force measuring mechanism (501) by said force measuring mechanism (501) at least one applied force of said compressor (113); to determine the correlation between the compression distance of said compressor (113) and the applied force provided; wherein, The pressure head (107) is located within the pressure block (105); wherein the actuator (109) is configured to drive the pressure block (105) toward the force measuring mechanism (501), and when the pressure head (107) abuts against the force measuring mechanism (501), the compressor (113) is compressed; (ii) a preset applied force is determined by each pressure head (107) to its corresponding at least one semiconductor device (103); (iii) based on the preset applied force in step (ii) and the correlation between the applied force of the compressor (113) and the compression distance in step (i), the total distance that each pressure head (107) needs to move to achieve the preset applied force in step (ii) is calculated; wherein the total distance is the sum of the initial distance between the pressure head (107) and its corresponding semiconductor device (103) and the compression distance of the compressor (113); (iv) Drive the pressure block (105) to move linearly toward at least one platform (111); wherein the platform (111) is configured to accommodate at least one sputtering target unit (115); the sputtering target unit (115) includes at least one adhesive tape (117) having an adhesive surface (117A) facing the pressure block (105); the sputtering target unit (115) also includes at least one holding mechanism (119) disposed around the adhesive tape (117) and configured to hold the adhesive tape (117) in a planar position; the sputtering target unit (115) also includes at least one semiconductor device (103) disposed on the adhesive surface (117A) of the adhesive tape (117); the sputtering target unit (115) is disposed between the platform (111) and the pressure block (105); each pressure head (107) is configured to be aligned with the semiconductor device (103).

8. The method for applying pressure to at least one semiconductor device (103) according to claim 7, wherein, Between steps (iii) and (iv) is a step of calculating the total average distance of all pressure heads (107) in the same pressure block (105).

9. The method for applying pressure to at least one semiconductor device (103) according to claim 7, wherein, Before step (i), the pressure block (105) is driven so that at least one pressure head (107) and its corresponding compressor (113) are aligned with the force measuring mechanism (501).

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