Electronic device and heat dissipation module

Abstract

An electronic device includes a first electronic component and a heat dissipation module. The heat dissipation module includes a bracket, a first swing arm, and a first heat sink. The first swing arm is pivotally connected to the bracket. The first heat sink is pivotally connected to the first swing arm and thermally connected to the first electronic component. The first swing arm is rotatable relative to the bracket, and the first heat sink is rotatable relative to the first swing arm, such that the first heat sink is thermally connected to or separated from the first electronic component.

Claims

1. An electronic device comprising: a first electronic component; a second electronic component; and a heat dissipation module comprising: a bracket; a first swing arm pivotally connected to the bracket; a first heat sink pivotally connected to the first swing arm and thermally connected to the first electronic component; a second swing arm pivotally connected to the bracket, the first swing arm and the second swing arm being arranged at a distance along the longitudinal direction of the bracket; and a second heat sink pivotally connected to the second swing arm and thermally connected to the second electronic component, the first electronic component being sandwiched between the first heat sink and the second heat sink; wherein, The first swing arm is rotatable relative to the bracket, and the first heat sink is rotatable relative to the first swing arm, so that the first heat sink is thermally connected to or separated from the first electronic component; after the first heat sink is separated from the first electronic component and the first electronic component is removed, the second swing arm is rotatable relative to the bracket, and the second heat sink is rotatable relative to the second swing arm, so that the second heat sink is thermally connected to or separated from the second electronic component.

2. The electronic device as claimed in claim 1, wherein the bracket is a manifold, the first swing arm is a tube body, and the first heat sink is a cold plate.

3. The electronic device as claimed in claim 1, wherein the bracket is a manifold, the first swing arm is a tube, the first heat sink includes a heat spreader and a heat exchange channel connected to one side of the heat spreader and pivotally connected to the first swing arm.

4. The electronic device as claimed in claim 1, wherein the heat dissipation module further includes an elastic member connected to the first heat dissipation member, the elastic member being used to reset the first heat dissipation member toward the first electronic component.

5. The electronic device as claimed in claim 1, wherein the heat dissipation module further includes a torsion spring and a leaf spring, the torsion spring being disposed at the pivot point between the bracket and the first swing arm, the leaf spring being disposed opposite to the first heat sink, and the leaf spring restricting the rotation of the first heat sink; when the first heat sink disengages from the leaf spring, the torsion spring drives the first swing arm to rotate the first heat sink in a direction away from the first electronic component.

6. The electronic device as claimed in claim 1, further comprising: a first thermal interface material disposed relative to the first electronic component; and a second thermal interface material disposed relative to the second electronic component, the first thermal interface material and the second thermal interface material being offset along the longitudinal direction of the support.

7. The electronic device as claimed in claim 1, wherein the heat dissipation module further includes a third heat dissipation element, and the second electronic component is sandwiched between the second heat dissipation element and the third heat dissipation element.

8. The electronic device as claimed in claim 1, wherein the first electronic element and the second electronic element are dual in-line memory modules.

9. A heat dissipation module, comprising: a bracket; a first swing arm pivotally connected to the bracket; a first heat dissipation component pivotally connected to the first swing arm; a second swing arm pivotally connected to the bracket, the first swing arm and the second swing arm being arranged at intervals along the longitudinal direction of the bracket; and a second heat dissipation component pivotally connected to the second swing arm.

10. The heat dissipation module as described in claim 9, wherein the bracket is a manifold, the first swing arm is a tube body, and the first heat dissipation component is a cold plate.

11. The heat dissipation module as claimed in claim 9, wherein the bracket is a manifold, the first swing arm is a tube body, the first heat dissipation component includes a heat spreader and a heat exchange channel, the heat exchange channel being connected to one side of the heat spreader and pivotally connected to the first swing arm.

12. The heat dissipation module as described in claim 9 further includes an elastic member connected to the first heat dissipation component, the elastic member being used to reset the first heat dissipation component.

13. The heat dissipation module as described in claim 9 further includes a torsion spring and a leaf spring, the torsion spring being disposed at the pivot point between the bracket and the first swing arm, the leaf spring being disposed opposite to the first heat dissipation component, and the leaf spring restricting the rotation of the first heat dissipation component; when the first heat dissipation component disengages from the leaf spring, the torsion spring drives the first swing arm to rotate the first heat dissipation component.

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