Calibration adjustment mechanism, pressing jig comprising the same, and semiconductor component bonding machine comprising the same

Abstract

This invention provides a calibration and adjustment mechanism, a pressing fixture including the same, and a semiconductor element pressing machine. The calibration and adjustment mechanism is applicable to the pressing fixture of the pressing machine, which includes a platform and multiple adjustment bases. Multiple grooves are formed on the platform, and the adjustment bases are respectively installed in corresponding grooves. Each adjustment base is connected to a pressing unit. Each pressing unit includes a shaft movable within an adjustment base and a pressure block fixed to one end of the shaft and located below the platform. The calibration and adjustment mechanism is disposed between the adjustment bases and the grooves to adjust the position of each adjustment base within the grooves, thereby changing the parallelism and centering of each pressing unit.

Claims

1. A calibration and adjustment mechanism, applicable to a pressing fixture of a pressing machine, wherein the pressing fixture comprises: A platform on which multiple grooves are formed; The system includes multiple adjustment bases, each disposed in the groove. Each adjustment base is connected to a pressing unit, which includes a shaft and a pressing block. The shaft is movably disposed in the adjustment base, and one end of the shaft is fixed to the pressing block, which is located below the platform. The calibration and adjustment mechanism is disposed between the adjustment base and the corresponding groove, and is used to adjust the position of each adjustment base in the groove, thereby adjusting the parallelism and centering of each pressing unit.

2. The calibration and adjustment mechanism as described in claim 1, comprising: A screw is screwed into the screw hole of the adjusting base, and its bottom end has an arc surface; a washer is disposed between the bottom end of the screw and the groove, the surface of the washer facing the screw abuts against the arc surface and forms a surface contact with the bottom end of the screw; and a fastener passes through the screw and the washer and is fixed in the groove.

3. The calibration and adjustment mechanism as described in claim 2 further includes a fixing mechanism, said fixing mechanism comprising: A slot is provided on the adjustment base and connected to the screw hole; And a clamping member, passing through the slot and configured to reduce the width of the slot, causing deformation of the structure around the screw hole, thereby clamping the screw.

4. The calibration and adjustment mechanism as claimed in claim 1, wherein each of the grooves has a stepped portion inside; each adjustment base includes a columnar portion and a flange, the columnar portion being inserted into the corresponding groove, the flange being located at the top of the columnar portion and supported on the stepped portion of the groove; and the calibration and adjustment mechanism of each adjustment base is disposed on the flange.

5. The calibration and adjustment mechanism as described in claim 4, comprising: A screw is screwed into a screw hole in the flange of the adjusting base, and its bottom end has an arc surface; a washer is disposed between the bottom end of the screw and the stepped portion of the groove, the surface of the washer facing the screw abuts against the arc surface and forms a surface contact with the bottom end of the screw; and a fastener passes through the screw and the washer and is fixed to the stepped portion of the groove.

6. The calibration and adjustment mechanism as described in claim 5 further includes a fixing mechanism, said fixing mechanism comprising: A slot is provided on the flange of the adjustment base and connected to the screw hole; And a clamping member, passing through the slot and configured to reduce the width of the slot, causing deformation of the structure around the screw hole, thereby clamping the screw.

7. A type of press-fitting jig, including: A platform on which multiple grooves are formed; Multiple adjustment bases are correspondingly disposed in the grooves, each adjustment base is connected to a pressing unit, the pressing unit includes a shaft and a pressing block, the shaft is movably disposed in the adjustment base and one end of which is fixed to the pressing block, the pressing block is located below the platform; and multiple correction and adjustment mechanisms as described in any one of claims 1 to 6 are respectively disposed at different positions on each adjustment base.

8. The pressing fixture as claimed in claim 7, wherein a bushing is provided in the internal opening of each adjusting base, and the shaft is movably inserted through the bushing.

9. The pressing fixture as claimed in claim 8 further includes a limiting member configured to limit the bushing within an internal opening of the adjusting base.

10. A semiconductor device laminating machine, comprising: The pressing upper fixture as described in any one of claims 7 to 9; a lower fixture disposed at a corresponding position of the pressing upper fixture for carrying at least one workpiece to be pressed; and a lifting device disposed below the lower fixture and configured to drive the lower fixture to move relative to the pressing upper fixture, thereby causing the pressing upper fixture and the lower fixture to jointly press the workpiece to be pressed.

11. The semiconductor device laminator as claimed in claim 10, further comprising a force-applying mechanism, the force-applying mechanism comprising: Multiple pressure bars, each pressure bar being correspondingly disposed on the pressing unit; And multiple counterweights, detachably mounted on the other end of the pressure rod, apply a pressing force to the pressing unit by gravity.

12. A semiconductor device laminating machine, comprising: A pressing fixture includes multiple adjusting bases and multiple correction and adjustment mechanisms, with each adjusting base connected to a pressing unit; Multiple calibration and adjustment mechanisms are respectively set at different positions of each adjustment base to adjust the position of the pressing unit in the corresponding groove, so as to adjust the parallelism and centerness of each pressing unit; a lower fixture is correspondingly set below the upper pressing fixture to support at least one part to be pressed; and a lifting device is configured to drive the lower fixture to move relative to the upper fixture, so that the upper pressing fixture and the lower fixture jointly press the part to be pressed.

13. The semiconductor device pressing machine as claimed in claim 12, wherein the pressing fixture includes a platform having a plurality of grooves formed thereon, the plurality of adjusting bases being respectively disposed in the grooves; each adjusting mechanism includes: A screw, one end of which is screwed into a screw hole in an adjusting base, and the bottom end of which has an arc surface; a washer, disposed between the bottom end of the screw and the groove, the surface of the washer facing the screw abutting against the arc surface and forming a surface contact with the screw; and a fixing member, passing through the screw and the washer, and fixed in the groove.

14. The semiconductor element laminator as claimed in claim 13, wherein each calibration and adjustment mechanism further includes a fixing mechanism, the fixing mechanism comprising: A slot is provided on the adjustment base and connected to the screw hole; And a clamping member, passing through the slot and configured to reduce the width of the slot, causing deformation of the structure around the screw hole to clamp the screw.

15. The semiconductor device laminator according to any one of claims 12 to 14, further comprising a force-applying mechanism, which includes: Multiple pressure bars, each pressure bar being correspondingly disposed on the pressing unit; And multiple counterweights are set at the other end of the pressure rod to apply a pressing force to the pressing unit by means of gravity.

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