Detection circuit substrate for detecting driver backplane of micro-led display
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Patents
- Current Assignee / Owner
- AU OPTRONICS CORP
- Filing Date
- 2025-12-31
- Publication Date
- 2026-08-01
Smart Images

Figure TWG2TB001904215_001 
Figure TWG2TB001904215_002 
Figure TWG2TB001904215_003
Abstract
Claims
1. A detection circuit board for detecting a micro light-emitting diode display driving backplane, comprising: One substrate; Multiple detection pads are disposed on the substrate; A conductive line is disposed on the substrate and electrically connected to the detection pads; A conductive bump is disposed on the substrate and electrically connected to the conductive line. The detection circuit board is used to align and bond with the micro-LED display driver backplane so that the detection pads are electrically connected to multiple pad pairs of the micro-LED display driver backplane, and the conductive bump is electrically connected to a first test pad of the micro-LED display driver backplane. The detection pads, the pad pairs, the conductive line, the conductive bump, and the first test pad form a detection circuit. Each detection pad is electrically connected to a first pad and a second pad of each pad pair to conduct the first pad and the second pad. A test signal from a second test pad of the micro-LED display driver backplane is received through one of the first pad and the second pad. The test signal is measured at the first test pad through the detection circuit to obtain a feedback signal. Whether the feedback signal meets a preset value is used to determine whether the micro-LED display driver backplane has a defect.
2. The detection circuit board for detecting the backplane of a micro light-emitting diode display driver as described in claim 1, further comprising: A detection alignment mark is disposed on the substrate for alignment with an existing alignment mark on the micro LED display driver backplate, so that the detection circuit board is aligned and bonded to the micro LED display driver backplate.
3. The detection circuit substrate for detecting a micro light-emitting diode display driving backplane as described in claim 1, wherein the substrate has one or more openings.
4. The detection circuit board for detecting the backplane of a micro light-emitting diode display driver as described in claim 1, further comprising: An insulating layer is disposed on the substrate and located between the conductive line and the detection pads, and has a plurality of through holes, wherein the detection pads are electrically connected to the conductive line through the through holes.
5. The detection circuit board for detecting a micro-light-emitting diode display driving backplane as described in claim 4, wherein when the detection circuit board is aligned and bonded to the micro-light-emitting diode display driving backplane, the perforations and the pads overlap in a normal direction of the substrate.
6. The detection circuit board for detecting a micro-light-emitting diode display driving backplane as described in claim 4, wherein when the detection circuit board is aligned and bonded to the micro-light-emitting diode display driving backplane, the perforations and pads do not overlap in a normal direction of the substrate.
7. The detection circuit board for detecting a micro light-emitting diode display driving backplane as described in claim 6, wherein each of the detection pads comprises: A pad connection portion is used to connect the first pad and the second pad of each pad pair; And a line connection portion for connecting the conductive line, wherein the line connection portion and the pad connection portion are separate from each other.
8. The detection circuit board for detecting a micro light-emitting diode display driving backplane as described in claim 1, wherein the detection pads, the conductive lines and the conductive bumps are formed from the same conductive layer in the same process.