Hybrid showerhead with separate faceplate for high temperature process

Abstract

A spray head for a treatment chamber includes: a metal plate attached to the treatment chamber; a ceramic panel attached to the metal plate and including a plurality of gas outlets on a surface facing a substrate; and a metal ring surrounding the ceramic panel and attached to the treatment chamber.

Description

Technical Field

[0001] [Cross-reference to related applications] This application claims priority to U.S. Provisional Application No. 63 / 079,530, filed September 17, 2020. The entire contents of the above application are incorporated herein by reference.

[0002] This disclosure is generally related to substrate processing systems, and more specifically to hybrid spray heads with independent panels used in high-temperature processes. Prior Technology

[0003] The prior art description provided herein is for the purpose of generally presenting the background of this disclosure. Within the scope described in this prior art section, the works of the inventors currently listed, as well as illustrative embodiments that may not qualify as prior art at the time of application, are not expressly or implicitly acknowledged as prior art against this disclosure.

[0004] Atomic layer deposition (ALD) is a thin film deposition method that sequentially performs gas chemical processes to deposit a thin film on the surface of a material, such as the surface of a substrate like a semiconductor wafer. Most ALD reactions use two chemicals called precursors (reactants), which react with the surface of the material one precursor at a time in a sequential, self-limiting manner. By repeatedly exposing the material to different precursors, a thin film is gradually deposited on the material surface.

[0005] Thermal ALD (T-ALD) is performed in a heated processing chamber. The processing chamber is maintained at sub-atmospheric pressure using a vacuum pump and a controlled flow of inert gas. The substrate system to be coated with the ALD film is placed in the processing chamber and allowed to equilibrate with the temperature of the processing chamber before the ALD process begins. Summary of the Invention

[0006] A spray head for a treatment chamber includes: a metal plate attached to the treatment chamber; a ceramic panel attached to the metal plate and including a plurality of gas outlets on a surface facing a substrate; and a metal ring surrounding the ceramic panel and attached to the treatment chamber.

[0007] Another feature is that the ceramic panel has a smaller diameter than the metal plate.

[0008] In another feature, the outer diameter of the metal ring is the same as the diameter of the metal plate.

[0009] Another feature is that the ceramic panel has a smaller diameter compared to the diameter of the metal plate and the outer diameter of the metal ring.

[0010] In another feature, the inner edge of the metal ring contacts the outer edge of the ceramic panel.

[0011] Among other features, the ceramic panel includes a first flange extending radially outward from a base portion of the ceramic panel. The metal ring includes a second flange extending radially inward from its inner edge. The second flange is disposed on the metal ring.

[0012] In another feature, the metal ring is attached to the metal plate.

[0013] In another feature, the metal ring system is integrated with the metal plate.

[0014] Among other features, the metal ring contacts the metal plate. The metal ring includes a recess in the surface of the metal plate it contacts.

[0015] In another feature, the metal plate includes a recess that contacts the ceramic panel, adjacent to one of the outer edges of the ceramic panel.

[0016] Among other features, the metal ring is attached to the metal plate and includes a first recess on an upper surface of the metal plate. The metal plate includes a second recess on a lower surface of the ceramic panel, adjacent to one outer edge of the ceramic panel.

[0017] In another feature, the metal plate includes a manifold that is in fluid communication with the processing chamber via one of the outer edges of the ceramic panel and one of the inner edges of the metal ring.

[0018] Among other features, the metal plate includes a manifold. An interface between the metal ring and the ceramic panel controls the flow of exhaust gas from the treatment chamber to the manifold.

[0019] Among other features, the metal plate includes: a manifold in fluid communication with the processing chamber; and an outlet in fluid communication with the manifold for discharging gas from the processing chamber.

[0020] Among other features, the metal plate includes a manifold. The manifold includes a plurality of through holes in fluid communication with the processing chamber.

[0021] In another feature, the manifold receives an inert gas. The inert gas flows into the processing chamber through the plurality of through-holes.

[0022] In another feature, the manifold receives exhaust gas from the treatment chamber via the plurality of through holes.

[0023] Among other features, the metal plate includes a manifold. A first portion of the manifold discharges a first gas from the processing chamber. A second portion of the manifold supplies a second gas to the processing chamber.

[0024] Among other features, the metal plate includes a manifold, an outlet connected to a first portion of the manifold, and an inlet connected to a second portion of the manifold separated from the first portion. A first set of orifices in the first portion of the manifold is used to discharge a first gas via the outlet, the first gas system being received from the processing chamber via an interface between the ceramic panel and the metal ring. A second set of orifices in the second portion of the manifold is used to supply a second gas received from the inlet to the processing chamber.

[0025] In another feature, the metal ring includes a plurality of through holes that are in fluid communication with the second set of holes in the second portion of the manifold and with the processing chamber.

[0026] Among other features, the ceramic panel includes: a base portion including a plurality of concentric channels arranged around walls extending vertically from the base portion; the ceramic panel including an upper portion disposed on the base portion, the upper portion contacting the walls, and including one or more inlets for receiving gas; and a gas outlet in the ceramic panel dispersing the gas into the processing chamber.

[0027] Among other features, the spray head further includes: a gas inlet connected to the metal plate; and a fitting attached to the gas inlet and one or more inlets of the ceramic panel.

[0028] Among other features, the metal plate includes a slot. The connector is disposed in the slot and includes more than one section respectively coupled to one or more inlets of the ceramic panel.

[0029] Among other features, the slot is located at the center of the metal plate. One or more sections of the mating member extend radially outward from the center.

[0030] Among other features, the spray head further includes: a gas inlet connected to a center of the metal plate, the metal having a slot at the center in fluid communication with the gas inlet. The spray head further includes: a fitting disposed in the slot, and including one or more sections in fluid communication with the gas inlet, the one or more sections extending radially outward from the center and respectively coupled to one or more inlets of the ceramic panel.

[0031] Among other features, the spray head further includes: a first plate containing a heater and disposed on the metal plate; and a second plate containing a cooling channel and disposed on the first plate.

[0032] Another feature is that the metal ring is plated with a corrosion-resistant material.

[0033] Another feature is that the metal plate and the metal ring system are plated with a corrosion-resistant material.

[0034] Another feature is that the walls are coated with a corrosion-resistant material.

[0035] Among other features, a system includes: the spray head and a base, with the metal ring contacting the base.

[0036] In another feature, the metal ring isolates the ceramic panel from the base.

[0037] Among other features, the system further includes: a gas source for supplying a gas to the spray head, and the gas system being dispersed into the treatment chamber via the plurality of gas outlets of the ceramic panel of the spray head.

[0038] In another feature, the system further includes: a fluid delivery system for supplying a coolant to at least one of the spray head and the base.

[0039] In another feature, at least one of the spray head and the base includes one or more heaters.

[0040] In another feature, the system further includes a vacuum pump connected to the processing chamber.

[0041] In another feature, the system further includes a gas source connected to the processing chamber to supply an inert gas to the processing chamber.

[0042] Further applications of this disclosure will become apparent from the description of the embodiments, the scope of the claims, and the drawings. The embodiments and specific examples described herein are for illustrative purposes only and are not intended to limit the scope of this disclosure. Simple Explanation of the Diagram

[0043] This disclosure will be more fully understood through the section on implementation methods and the accompanying drawings, wherein:

[0044] Figure 1 shows an example of a substrate processing system, which includes a processing chamber containing a spray head designed according to this disclosure;

[0045] Figure 2A shows a cross-section of a portion of a spray head, which includes a ceramic panel whose dimensions are the same as those of a backplate to which the ceramic panel is attached;

[0046] Figure 2B shows the temperature gradient in the spray head of Figure 2A;

[0047] Figure 2C shows the temperature gradient in the ceramic panel of the spray head in Figure 2A;

[0048] Figure 2D shows an example of stress concentration near the fracture origin in the spray head of Figure 2A caused by the temperature gradient shown in Figure 2C;

[0049] Figure 3A shows a cross-section of a portion of the spray head according to the present disclosure, the spray head comprising a ceramic panel smaller than the back plate, and the ceramic panel being surrounded by a metal ring;

[0050] Figure 3B shows the temperature gradient in the spray head of Figure 3A;

[0051] Figure 3C shows the stress concentration in the ceramic panel of the spray head in Figure 3A, which does not cause defects in the ceramic panel;

[0052] Figure 4 shows a cross-section of an example of a sprinkler head designed according to this disclosure;

[0053] Figure 5 shows a cross-section of an example of the base together with the spray head of Figure 4 according to this disclosure;

[0054] Figure 6A shows a cross-section of a portion of the first spray head according to this disclosure;

[0055] Figure 6B shows a cross-section of a portion of the second spray head (identical to that in Figures 3A-5) according to this disclosure;

[0056] Figure 6C shows a cross-section of a portion of the third spray head according to this disclosure;

[0057] Figure 7 shows a cross-section of the first spray head in more detail;

[0058] Figures 8A and 8B show cross-sections of portions of the second and third spray heads in more detail, respectively;

[0059] Figures 9A and 9B show different cross-sectional views of the third spray head in more detail;

[0060] Figure 9C shows the inlet in the back panel for supplying inert gas into the processing chamber;

[0061] Figure 10 shows an example of a cooling plate used with the spray head disclosed herein;

[0062] Figures 11A-11C show examples of metal rings used with the spray head disclosed herein in more detail;

[0063] Figure 12 shows an example of a backplate used with the spray head disclosed herein; and

[0064] Figures 13A-13C show cross-sections of the ceramic panel of the spray head disclosed herein.

[0065] In these diagrams, reference numerals may be reused to indicate similar and / or identical elements. Implementation

[0066] Most spray heads are made of metal, such as aluminum. Some spray heads may include a ceramic panel mounted on a backplate made of metal (e.g., aluminum) for thermal control. The ceramic panel typically has the same dimensions (diameter) as the backplate. Therefore, the ceramic panel is in direct contact with the top plate of the process module. The top plate is metallic and relatively cool, and its coefficient of thermal expansion (CTE) differs significantly from that of the ceramic panel. Furthermore, the bottom of the ceramic panel, near its outer diameter (OD), is spatially close to the base in the processing chamber and bears the thermal load of the base during substrate processing. Consequently, a portion of the ceramic panel near its outer diameter experiences a relatively high temperature gradient, which can lead to fracture near the outer diameter of the ceramic panel, as explained in further detail below.

[0067] This disclosure provides a spray head design with a reduced diameter ceramic panel and the addition of a metal (e.g., aluminum) ring around the ceramic panel. The metal ring decouples the ceramic panel from the top plate and from the thermal load of the base. The metal ring provides a thermal interruption between the ceramic panel and the top plate. Instead of the ceramic panel, the metal ring bears the thermal load of the base. The thermal interruption introduced at the outer diameter of the ceramic panel thermally isolates the ceramic panel from the cooling effect of the top plate near the edge of the ceramic panel.

[0068] Due to the smaller diameter of the ceramic panel and the decoupling and thermal interruption provided by the metal ring, the ceramic panel exhibits a smaller and more uniform temperature gradient compared to ceramic panels with the same diameter as the backplate. Because the metal ring replaces the ceramic panel in contact with the top plate and bears the thermal load of the base, the ceramic panel will not crack (or develop defects) at temperatures exceeding 590°C to 650°C.

[0069] In one design, the metal ring is integrated into the backplate. In another design, the contact gap between the smaller ceramic panel and the backplate is designed to alter the temperature distribution at the edge of the ceramic panel, thus preventing breakage due to thermal shock and localized stress during processes requiring relatively high temperatures. The spray head design also enhances axial cooling (i.e., cooling along a vertical axis perpendicular to the diameter) of the smaller ceramic panel due to contact conduction between the ceramic panel and the backplate. Furthermore, cooling spirals can be integrated into the backplate to increase cooling capacity.

[0070] In the spray head design disclosed herein, a metal ring and a back plate interfacing with the ceramic panel form the main vacuum seal of the treatment chamber. These spray head designs facilitate easy interchangeability of the ceramic panel (e.g., for improved uniformity, reduced micro-volume, and material selection) and allow for easy access (e.g., removable) by simply lifting the cover (top plate) of the treatment chamber without disassembling the back plate. Furthermore, as explained below, integrating a flow choke into the thermal break section (i.e., the location where the metal ring contacts the ceramic panel) facilitates the pumping of micro-volume exhaust gas via a manifold in the back plate. The flow choke provides uniformity control for the pumping of micro-volume exhaust gas via the manifold in the back plate.

[0071] Due to these properties, cracking of the ceramic panel is eliminated, and thermal stress is reduced to a safe level due to the smaller temperature gradient and linear expansion of the ceramic panel. Furthermore, in some designs, other features of the spray head (such as a metal ring surrounding the ceramic panel) are integrated into the backplate via a diffusion bonding process. The material continuity and cooling capacity of the backplate allow for effective cooling of these gas channels. Therefore, the surfaces of these features can be plated with corrosion-resistant materials (e.g., using electroless nickel plating) to resist corrosion from process byproducts. The metal ring can also be plated with corrosion-resistant materials (e.g., using electroless nickel plating). These and other features of the spray head disclosed herein are described in detail below.

[0072] The contents of this disclosure are organized as follows. FIG1 shows and describes an example of a treatment chamber that can use a sprinkler head designed according to this disclosure. FIG2A-2C show and describe the problems solved by the sprinkler head design of this disclosure. FIG3A-3C show and describe the solutions to the problems. FIG4 shows and describes an example of a sprinkler head design according to this disclosure. FIG5 shows and describes an example of a base and sprinkler head designed according to this disclosure.

[0073] Subsequently, three different spray head designs according to this disclosure are shown and described with reference to Figures 6A-6C. Each spray head design is shown and described in more detail with reference to Figures 7-9C. An example of a cooling plate used with the spray head of this disclosure is shown and described with reference to Figure 10. The metal ring of the spray head of this disclosure is shown and described in further detail with reference to Figures 11A-11C. The back plate of the spray head of this disclosure is shown and described in more detail with reference to Figure 12. The ceramic panel of the spray head of this disclosure is shown and described in more detail with reference to Figures 13A-13C.

[0074] Figure 1 shows an example of a substrate processing system 100, which includes a processing chamber 102 configured to process a substrate using thermal atomic layer deposition (T-ALD). The processing chamber 102 surrounds other components of the substrate processing system 100. The processing chamber 102 includes a substrate support (e.g., a base) 104. During processing, a substrate 106 is disposed on the base 104.

[0075] One or more heaters 108 (e.g., heater arrays) may be disposed in ceramic plates arranged on the metal base plate of the base 104 to heat the substrate 106 during processing. One or more additional heaters, referred to as zone heaters or main heaters (not shown), may be disposed in the ceramic plates above or below the heaters 108. Furthermore, although not shown, a cooling system including cooling channels through which coolant can flow to cool the base 104 may be disposed in the base plate of the base 104; and one or more temperature sensors may be disposed in the base 104 to sense the temperature of the base 104.

[0076] Processing chamber 102 includes a gas distribution device 110, such as a spray head, for introducing and distributing process gases into processing chamber 102. The gas distribution device (hereinafter referred to as the spray head) 110 may include a rod portion 112, which includes one end connected to the top surface of processing chamber 102. The base portion 114 of the spray head 110 is generally cylindrical and extends radially outward from the opposite end of the rod portion 112 at a location spaced apart from the top surface of processing chamber 102.

[0077] The substrate-facing surface of the base portion 114 of the spray head 110 includes a ceramic panel (shown in the accompanying illustrations). The ceramic panel includes a plurality of outlets or features (e.g., slots or through holes) through which the precursor flows into the processing chamber 102. The ceramic panel of the spray head 110, shown and described in detail with reference to FIG13A-13C, is closer to the base 104 than shown.

[0078] The ceramic panel is surrounded by a metal ring designed according to this disclosure (see accompanying figures for display and description). The spray head 110 also includes a heating plate and a cooling plate (see accompanying figures for display and description). The heating plate includes one or more heaters. The cooling plate includes cooling channels (see Figure 10), through which coolant can circulate, as described below. Furthermore, although not shown, one or more temperature sensors may be disposed in the spray head 110 to sense the temperature of the spray head 110.

[0079] The gas delivery system 130 includes one or more gas sources 132-1, 132-2, ..., and 132-N (collectively referred to as gas sources 132), where N is a positive integer. Gas sources 132 are connected to manifold 139 via valves 134-1, 134-2, ..., and 134-N (collectively referred to as valves 134) and mass flow controllers 136-1, 136-2, ..., and 136-N (collectively referred to as mass flow controllers 136). The output of manifold 139 is fed to processing chamber 102. Gas sources 132 can supply process gases, cleaning gases, purge gases, inert gases, and the like to processing chamber 102.

[0080] The fluid delivery system 140 supplies coolant to the cooling system in the base 104 and the cooling channels in the spray head 110. A temperature controller 150 can be connected to the heater 108, the zone heater, and the temperature sensor in the base 104, as well as to the heating plate and temperature sensor in the spray head 110. The temperature controller 150 can control the power supplied to the heater 108 and the zone heater, and control the coolant flow through the cooling system in the base 104, to control the temperature of the base 104 and the substrate 106. The temperature controller 150 can also control the power supplied to the heater in the heating plate of the spray head 110, and control the coolant flow through the cooling channels in the cooling plate of the spray head 110, to control the temperature of the spray head 110.

[0081] During substrate processing, vacuum pump 158 maintains sub-atmospheric pressure within processing chamber 102. Valve 155 is connected to an outlet in spray head 110 (shown in the accompanying illustration), from which exhaust gas exits spray head 110. Valve 156 is connected to an exhaust port of processing chamber 102. Valves 156, 157, and vacuum pump 158 are used to control the pressure within processing chamber 102 and to discharge exhaust gas from spray head 110 via valve 155 and reactants from processing chamber 102 via valve 156. Isolation valve 157 may be arranged between valves 155, 156, and vacuum pump 158, as shown. System controller 160 controls the components of substrate processing system 100, including valves 155, 156, 157, and vacuum pump 158.

[0082] Figures 2A-2C show examples of spray heads where the size of the ceramic panel is the same as the size of the back plate to which the ceramic panel is attached. Figures 2B and 2C show the temperature gradient and resulting stress in the spray head. Figure 2D shows the origin of fracture caused by the temperature gradient and resulting stress in the ceramic panel of the spray head. Subsequently, Figures 3A-3C show examples of spray heads designed according to this disclosure, where the ceramic panel is smaller than the back plate and a metal ring is arranged around the ceramic panel. Figures 3B and 3C show the temperature gradient and resulting stress in this spray head, which differs from the spray head shown in Figures 2A-2C due to the smaller ceramic panel and the arrangement of the metal ring around the ceramic panel, as explained in detail below.

[0083] Figure 2A shows a cross-section of a portion of the spray head 200. The spray head 200 includes a ceramic panel 202 attached to a back plate 204. The ceramic panel 202 has the same dimensions (diameter) as the back plate 204. A manifold 206 is disposed between the ceramic panel 202 and the back plate 204. A small volume of exhaust gas from the treatment chamber is discharged via the manifold 206 through an outlet in the back plate 204, as explained below with reference to Figure 4. The ceramic panel 202 includes gas passages and through-holes (shown and described below with reference to Figures 13A-13C) for dispersing the gas into the treatment chamber.

[0084] Figure 2B shows a cross-section of a spray head 200 with a heating plate 208 and a cooling plate 210 added. The heating plate 208 is disposed on a back plate 204. The cooling plate 210 is disposed on the heating plate 208. The heating plate includes one or more heaters 209. The cooling plate 210 includes a cooling channel 320 (shown in detail in Figure 10). The wavy line 211 shows the area of ​​the spray head 200 with varying temperature (i.e., temperature zone), which results in a temperature gradient throughout the spray head 200.

[0085] For example, when the base temperature is set at approximately 590 degrees Celsius during the process, and the temperature of the cooling plate 210 is approximately 20-25 degrees Celsius, the temperature from the center of the ceramic panel 202 to line 211a is approximately 290-295 degrees Celsius; the temperature from line 211a to line 211b is approximately 250 degrees Celsius; the temperature from line 211b to line 211c is approximately 225 degrees Celsius; and so on. The temperature at the periphery or OD of the ceramic panel 202 of the spray head 200 is approximately 200 degrees Celsius. Therefore, the temperature varies radially and axially (i.e., along the vertical axis of the spray head 200) across the entire spray head 200, between approximately 290-295 degrees Celsius at the center of the ceramic panel 202 and approximately 200 degrees Celsius at the periphery or OD of the ceramic panel 202, resulting in a relatively high temperature gradient across the entire spray head 200.

[0086] Figure 2C shows the ceramic panel 202 of the spray head 200. Regions of the ceramic panel 202 exhibiting varying stresses (in klbs or ksi) caused by temperature gradients on the ceramic panel 202 are indicated by wavy lines 213. For example, when the base temperature setpoint during the process is approximately 590 degrees Celsius and the temperature of the cooling plate 210 is approximately 20-25 degrees Celsius, the stress from the center of the ceramic panel 202 to line 213a is approximately 1.6 ksi; the stress from line 213a to line 213b is approximately 2.9 ksi; the stress from line 213b to line 213c is approximately 6.7 ksi; the stress from line 213b to line 213c is approximately 7.9 ksi; and the stress at the periphery or OD of the ceramic panel 202 of the spray head 200 is approximately 9.2 ksi. Therefore, the stress increases radially on the ceramic panel 202.

[0087] At the OD point of the ceramic panel 202, the bottom of the ceramic panel 202 is very close to the base of the processing chamber. Therefore, the edge of the ceramic panel 202 is subjected to thermal load from the base during substrate processing. As a result, the temperature at the OD point of the ceramic panel 202 is relatively high at 212°C.

[0088] Furthermore, since the ceramic panel 202 has the same dimensions (diameter) as the back plate 204, the OD of the ceramic panel 202 directly contacts the top plate (or sidewall) of the treatment chamber surrounding the spray head 200. The top plate is relatively cold and has a very different CTE from the ceramic panel 202. Therefore, due to the heat load from the base and the direct contact with the cold top plate having a different CTE than the ceramic panel 202, the radial temperature gradient across the ceramic panel 202 is relatively high.

[0089] Figure 2D illustrates the stress caused by the radial temperature gradient in the peripheral region (i.e., near OD) of the ceramic panel 202. Following the example of the base setpoint temperature described above, the stress gradually increases from 213a to 213g and reaches its maximum value (e.g., greater than 10 ksi) at 212. Therefore, the relatively high radial temperature gradient on the ceramic panel 202 and the relatively high stress at OD of the ceramic panel 202 lead to fracture at OD of the ceramic panel 202, as shown at 212. The relatively high base setpoint temperature required by certain processes (e.g., above 650 degrees Celsius) exacerbates this problem.

[0090] Figure 3A shows a cross-section of a portion of the spray head 300 according to this disclosure. The spray head 300 includes a ceramic panel 302 with a diameter smaller than that of the spray head 200. Specifically, the diameter of the ceramic panel 302 is smaller than that of the back plate 204. As shown, a metal ring 304 (e.g., made of aluminum) is arranged around the ceramic panel 302. The ceramic panel 302 and the metal ring 304 are attached to the manifold 206. Thus, instead of the ceramic panel 302, the metal ring 304 directly contacts the top plate (or sidewall) of the treatment chamber.

[0091] A metal ring 304 decouples the ceramic panel 302 from the top plate (or sidewall) of the processing chamber surrounding the spray head 300 (both physically and thermally). Furthermore, replacing the OD of the ceramic panel 302, the metal ring 304 is located at a spatial distance very close to the base of the processing chamber (see Figure 5). As a result, replacing the OD of the ceramic panel 302, the metal ring 304 bears the thermal load from the base during substrate processing. The ceramic panel 302 includes gas channels and through-holes, shown and described below with reference to Figures 13A-13C, for dispersing gas into the processing chamber.

[0092] In the spray head 300, in addition to facilitating the pumping of exhaust gas via the outlet (shown in FIG. 5) in the back plate 204, the outer portion of the manifold 206 is used to inject inert gas (e.g., argon) through a plurality of holes 308 in the metal ring 304 into the processing chamber (e.g., processing chamber 102 shown in FIG. 1). The holes 308 are shown in detail in FIG. 11A-12. By injecting inert gas through the holes 308 into the processing chamber, an inert gas curtain is formed around the reaction zone (i.e., the deposition zone or the area surrounding the substrate) in the processing chamber to isolate the substrate (e.g., substrate 106 shown in FIG. 1) from the backflow of contaminants / byproducts in the chamber volume. The holes 308 in the metal ring 304 are aligned with corresponding holes in the outer portion of the manifold 206, as shown in FIG. 11A-12. The inlet for supplying inert gas to the holes 308 is configured to pass through the back plate 204, as shown and described below with reference to FIG. 9C.

[0093] Fastener 309 is used to secure manifold 206 to ceramic panel 302. Manifold 206 includes holes for fastener 309 (shown in FIG. 12). A similar fastener (shown in FIG. 4) is used to secure manifold 206 to metal ring 304. Metal ring 304 includes holes for fasteners (shown in FIG. 11A-11C). Fitting 330 splits the airflow from the gas inlet in rod 312 to feed the gas received from the gas inlet in rod 312 to a plurality of gas inlets in ceramic panel 302, as described in more detail below with reference to FIG. 12. Other structures shown will be described later with reference to FIG. 4. First, the temperature gradient on spray head 300 and the stress caused by the temperature gradient on ceramic panel 302 will be explained below.

[0094] Figure 3B shows a cross-section of the spray head 300 with the heating plate 208 added. The cooling plate 210 is located above the heating plate 208 and is shown in Figure 4. The areas of the spray head 300 with varying temperatures (i.e., temperature zones), which create temperature gradients on the spray head 300, are shown by the wavy line 215.

[0095] For example, when the base temperature is set at approximately 590 degrees Celsius and the temperature of the cooling plate 210 is approximately 20-25 degrees Celsius during the process, the temperature in the area of ​​the ceramic panel 302 below line 215a is approximately 270-290 degrees Celsius; the temperature in the area of ​​the ceramic panel 302 from line 215a to line 215b is approximately 250-270 degrees Celsius; the temperature in the area of ​​the ceramic panel 302 from line 215b to line 215c is approximately 250-225 degrees Celsius; the temperature in the area of ​​the ceramic panel 302 from line 215c to line 215d (including the temperature of the metal ring 304) is approximately 225-200 degrees Celsius; and the temperature in the area of ​​the ceramic panel 302 beyond line 215d is approximately 200-185 degrees Celsius. Therefore, the temperature gradient on the spray head 300 (especially on the ceramic panel 302 of the spray head 300) is lower and more uniform than the temperature gradient on the spray head 200 and on the ceramic panel 202 of the spray head 200.

[0096] Figure 3C shows the stress concentration in the ceramic panel 302 of the spray head 300. Regions of the ceramic panel 302 with varying stress caused by temperature gradients on the ceramic panel 302 are indicated by wavy lines 217. For example, when the base temperature setpoint during the process is approximately 590 degrees Celsius and the temperature of the cooling plate 210 is approximately 20-25 degrees Celsius, the maximum stress on the ceramic panel 202 shown by line 217m is approximately 6.4 ksi, which is approximately 40% less than the maximum stress on the ceramic panel 202 of the spray head 200.

[0097] As described above, the metal ring 304 decouples the ceramic panel 302 from the top plate. Furthermore, instead of the OD of the ceramic panel 302, the metal ring 304 bears the thermal load from the base. Therefore, the ceramic panel 302 has a relatively smaller and more uniform temperature gradient than the ceramic panel 202 of the spray head 200. As a result, the OD of the ceramic panel 302 will not crack or deform (or become defective) at the relatively high setpoint temperature of the base (e.g., greater than 590 degrees Celsius to 650 degrees Celsius).

[0098] Figure 4 shows a cross-section of the entire spray head 300. The spray head 300 includes a valve 310 connected to a rod 312, which can be attached to the top plate of a treatment chamber (e.g., treatment chamber 102 shown in Figure 1). The spray head 300 includes a gas inlet in the rod 312 for supplying one or more gases (e.g., supplied by the gas delivery system 130 shown in Figure 1) into the treatment chamber via through-holes in the ceramic panel 302 (shown in Figure 13C). A metal ring 304 provides thermal interruption for the ceramic panel 302 at the OD of the ceramic panel 302, as shown in 314. Fasteners 309 and 311 are used to secure the manifold 206 to the ceramic panel 302 and the metal ring 304, respectively.

[0099] The spray head 300 includes an exhaust port 316 in the manifold 206 (see also Figure 12). A small volume of exhaust gas from the treatment chamber exits the spray head 300 through the exhaust port 316 via an outlet in the backplate 204 (shown in Figure 5). In addition to providing thermal interruption, a throttle (also shown at 314) is provided at the interface between the ID of the metal ring 304 and the OD of the ceramic panel 302 (i.e., between the inner edge of the metal ring 304 and the outer edge of the ceramic panel 302). The throttle provides uniformity control for the pumping of the small volume of exhaust gas through the manifold 206.

[0100] Figure 5 shows a cross-section of the spray head 300 and the base 350. The substrate is placed on the base 350 at 352. A metal ring 304 contacts the periphery or outer edge of the base 350, as shown at 354. The ceramic panel 302 does not contact the base 350. A small volume of exhaust gas exits the spray head 300 via an outlet 356 connected to the manifold 206 through the backplate 204.

[0101] Figures 6A-6C show partial cross-sections of different spray heads disclosed herein. Figure 6A shows a partial cross-section of spray head 300-1 according to this disclosure. Spray head 300-1 is similar to spray head 300, except that gaps 301-1 and 301-2 (collectively referred to as gap 301) are respectively provided between the bottom of manifold 206 and the top of metal ring 304, and between the bottom of manifold 206 and the top of ceramic panel 302 near the OD of ceramic panel 302. For example, gap 301 may be approximately 0.020 inches.

[0102] Specifically, gap 301 is created by providing a recess between the metal ring 304 and the manifold 206, as shown below. As shown in 301-1, the top surface of the metal ring 304 is recessed at the OD (and optionally at the ID, although not shown). Most of the bottom surface of the manifold 206 above the top surface of the metal ring 304 (i.e., at the OD of the back panel 204) is not recessed. As shown in 301-2, the bottom surface of the manifold 206 is recessed from above the ID of the metal ring 304 to above the OD of the ceramic panel 302.

[0103] The gap 301 restricts the heat flow from the edge (OD) of the ceramic panel 302. The thermal contact between the ceramic panel 302 and the manifold 206 increases the heat flow from the central region of the ceramic panel 302 (as shown in Figure 7), creating a relatively cool area in the central region of the ceramic panel 302.

[0104] O-rings 305-1 and 305-2 (collectively referred to as O-rings 305) are located between the non-recessed portion of the top surface of the metal ring 304 and the non-recessed portion of the bottom surface of the manifold 206. O-rings 305 are also present in the spray head 300 shown in Figure 6B, but not in the spray head 300-2 shown in Figure 6C, as explained below.

[0105] Figure 6B shows a partial cross-section of the spray head 300. Unlike the spray head 300-1 shown in Figure 6A, there are no gaps between the bottom surface of the manifold 206 and the top surface of the metal ring 304, or between the bottom surface of the manifold 206 and the top surface of the ceramic panel 302 in the spray head 300.

[0106] Alternatively, the top surface of the metal ring 304 and the top surface of the ceramic panel 302 are flush with (i.e. in direct contact with) the bottom surface of the manifold 206, as shown at 303. The O-ring 305 is located between the unrecessed portion of the top surface of the metal ring 304 and the unrecessed portion of the bottom surface of the manifold 206.

[0107] Figure 6C shows a partial cross-section of the spray head 300-2. The spray head 300-2 is similar to the spray head 300, except that not only are the top surfaces of the metal ring 304 and the ceramic panel 302 flush with the bottom surface of the manifold 206 (i.e., in direct contact), but the metal ring 304 is integrated with the manifold 206 using a diffusion bonding process, and the ceramic panel 302 is fixed (e.g., bolted) to the manifold 206 (see Figures 12-13C, showing through holes for fasteners).

[0108] Since the metal ring 304 is integrated with the manifold 206, unlike the spray heads 300 and 300-1, the O-ring 305 is unnecessary and therefore not present in the spray head 300-2. The diffusion bonding allows for surface nickel plating at relatively low temperatures (e.g., the surfaces of the gas channels and the metal ring 304 in the ceramic panel 302 shown in Figures 13A-13C).

[0109] Figure 7 shows a cross-section of the spray head 300-1 spanning its entire diameter. The gap 301 between the metal ring 304 and the manifold 206, and between the ceramic panel 302 and the manifold 206, can be considered annular. The thermal contact between the central regions of the ceramic panel 302 and the manifold 206 is shown at 360°.

[0110] Figures 8A and 8B show additional details regarding the presence and absence of ineffective volumes caused by the grooves in the O-rings, and the resulting blockage of the vent holes in spray heads 300 and 300-2, respectively. Figure 8A shows at 370 the ineffective volumes caused by the O-ring grooves 372-1 and 372-2 (collectively referred to as groove 372) and the resulting blockage of the vent hole 316 in spray head 300, at 374.

[0111] Figure 8B shows that due to the integration of the metal ring 304 with the manifold 206 and the absence of the O-ring 305 and groove 372, the ineffective volume shown at 370 in Figure 8A does not exist at 371, and the vent 316 shown at 375 in Figure 8B is less clogged (i.e., more open) compared to the vent 316 shown at 374 in Figure 8A. Specifically, in the spray head 300-2, the integration of the metal ring 304 with the manifold 206 eliminates the need for the O-ring 305 shown in Figures 6A and 6B and the groove 372 shown in Figure 8A. This removes the ineffective volume present in the spray head 300, and also reduces the clogging of the vent 316 in the spray head 300-2 compared to the clogging in the spray head 300.

[0112] Figures 9A and 9B show a cross-section of the spray head 300-2 spanning its entire diameter. In Figure 9A, similar to the spray head 300 shown in Figure 4, the spray head 300-2 includes a rod portion 312 that can be attached to a top plate of a treatment chamber (e.g., treatment chamber 102 shown in Figure 1). The spray head 300-2 includes a gas inlet in the rod portion 312 for supplying more than one gas to the treatment chamber (e.g., supplied by the gas delivery system 130 shown in Figure 1) via through holes in the ceramic panel 302, as shown in Figure 9B (see also Figure 13C). A small volume of exhaust gas from the treatment chamber exits the spray head 300-2 via an outlet 356 in the back plate 204 and a manifold 206.

[0113] Metal ring 304 is integrated with manifold 206, as described above with reference to FIG6C. As shown at 314, metal ring 304 provides thermal interruption for ceramic panel 302 at OD. Furthermore, a throttle (also shown at 314) is provided at the interface between ID of metal ring 304 and OD of ceramic panel 302 (i.e., between the inner edge of metal ring 304 and the outer edge of ceramic panel 302). The throttle provides uniformity control for the pumping of small volumes of exhaust gas through manifold 206 in backplate 204.

[0114] The metal ring 304 includes a hole 308 as described with reference to FIG3A for injecting an inert gas into the processing chamber to form an air curtain surrounding the substrate in the processing chamber during processing, as explained above with reference to FIG3A. The manifold 206 includes a corresponding hole aligned with the hole 308 in the metal ring 304, as shown in FIG11A-12.

[0115] Figure 9C shows an inlet 313 for supplying inert gas into the processing chamber via an orifice 308. The inlet 313 is disposed in a manifold 206 through a backplate 204. One end of the inlet 313 is connected to the orifice 308 via the outer portion of the manifold 206. The other end of the inlet 313 is connected to a gas supply element (e.g., element 130 shown in Figure 1). For example, a gas line (not shown) from the gas supply element can be connected to (inserted into) the inlet 313 to feed inert gas into the inlet 313.

[0116] Therefore, manifold 206 serves a dual purpose. The interior of manifold 206, including the exhaust port 316, is used to discharge a small volume of exhaust gas from the treatment chamber via outlet 356 in the backplate 204. Furthermore, the outer portion of manifold 206 (separate from the inner portion) is connected to a hole 308 extending from the metal ring 304 into the manifold 206, and is used to supply inert gas to the treatment chamber via the hole 308 in the metal ring 304.

[0117] Figure 10 shows a cross-section AA of the cooling plate 210 referenced in Figure 9B. The cooling plate 210 includes cooling channels 320. Figure 10 only shows an example of the cooling channel 320. The cooling channel 320 can have any other shape and size. For example, although the cooling channel 320 is shown as double-lined, it can also be spiral-shaped. Other shapes are also considered. The fluid delivery system 140 shown in Figure 1 supplies coolant circulating through the cooling channel 320. The cooling plate 210 including the cooling channel 320 can be used with any of the spray heads 300, 300-1, and 300-2 designed according to this disclosure.

[0118] Figures 11A-11C show different views of the metal ring 304 in more detail. Figure 11A shows a top view of the metal ring 304. Figure 11B shows a bottom view of the metal ring 304. Figure 11C shows a side view of the metal ring 304.

[0119] The metal ring 304 includes a flange 400 on its inner edge (i.e., along ID). The flange 400 extends radially inward from the inner edge (i.e., ID) of the metal ring 304 toward the center of the metal ring 304. The flange 400 overhangs the flange at the bottom of the ceramic panel 302 (see element 454 shown in FIG. 13B), as shown by 314 in FIG. 4-9B and as described below with reference to FIG. 13A-13C.

[0120] The metal ring 304 includes a groove 402 for an O-ring, on which the manifold 206 sits when arranged. The metal ring 304 includes a hole 308 as described with reference to FIG. 3A for injecting inert gas into the processing chamber to form an air curtain surrounding the substrate in the processing chamber during processing, as explained above with reference to FIG. 3A.

[0121] The metal ring 304 includes a hole 404. A fastener (similar to fastener 309 shown in Figure 3A) for securing the manifold 206 to the metal ring 304 passes through the hole 404. The metal ring 304 can be used as a separate element independent of the manifold 206 in spray heads 300 and 300-1. Alternatively, the metal ring 304 can be integrated with the manifold 206 in spray head 300-2. The metal ring 304 can be nickel-plated to resist corrosion from process gases.

[0122] Figure 12 shows a more detailed bottom view of manifold 206. Manifold 206 includes an O-ring groove 420 and an O-ring spline 422. Manifold 206 includes a cut (or slot) 430 at its center. Slot 430 includes a plurality of radially extending sections (or channels) to supply gas from a gas inlet in rod 312 (see Figure 4) to a gas inlet in ceramic panel 302 (see Figures 13A-13C).

[0123] While spray heads 300, 300-1, and 300-2 include a single gas inlet in the rod portion 312, the ceramic panel 302 includes a plurality of gas inlets (see Figures 13A-13C). The gas inlets of the ceramic panel 302 are arranged circumferentially. A fitting 330 (shown from Figure 3A onwards) is arranged in a slot 430 and attached to the ceramic panel 302 and the manifold 206 adjacent to the slot 430, wherein the gas inlets in the rod portion 312 are attached to the manifold 206 via a backplate 204. The fitting 330 includes a plurality of radially extending feed lines (or segments / channels) that mate with segments of the slot 430 and feed to the plurality of gas inlets of the ceramic panel 302, respectively. The fitting 330 divides the airflow from the single gas inlet in the rod portion 312 into the plurality of gas inlets of the ceramic panel 302.

[0124] Manifold 206 includes holes 406 and 408, which mate with holes 404 in metal ring 304 and 409 in ceramic panel 302, respectively. A fastener 309 (as shown in Figure 3A) for securing manifold 206 to metal ring 304 passes through hole 406. A fastener (similar to fastener 309 shown in Figure 3A) for securing manifold 206 to ceramic panel 302 passes through hole 408. Manifold 206 includes hole 431 (which mates with hole 433 in ceramic panel 302 shown in Figures 13A-13C) for fasteners (e.g., bolts) for securing ceramic panel 302 to manifold 206.

[0125] Figures 13A-13C show the ceramic panel 302 in more detail. Figures 13A and 13B show cross-sections of the ceramic panel 302. Figure 13C shows the BB section of the ceramic panel 302 referenced in Figure 13A. The ceramic panel 302 includes a base portion 450 and an upper portion 452 with a diameter smaller than that of the base portion 450. The upper portion 452 extends vertically from the base portion 450, forming a flange 454. The flange 400 of the metal ring 304 hangs above the flange 454 of the ceramic panel 302.

[0126] The upper portion 452 of the ceramic panel 302 includes a plurality of inlets 500-1, 500-2, 500-3, 500-4, and so on (collectively referred to as inlets 500). Gas from the gas inlet in the rod portion 312 (shown from FIG. 4) flows through these inlets 500, which are received by slots 430 at the bottom of the manifold 206, into various gas channels in the base portion 450 of the ceramic panel 302 (shown in FIG. 13C). The inlets 500 are arranged in a circular pattern and are equally spaced, but other arrangements and patterns can be used alternatively. Six inlets are shown as an example only, but any other number of inlets can be used instead. Specifically, gas flows through the inlets 500 via various spoke-shaped structures (grooves) 512 (shown in FIG. 13C) in the base portion 450 into the inner and outer segments of the perforation pattern 510 in the base portion 450.

[0127] The upper portion 452 of the ceramic panel 302 includes a hole 433 that mates with a hole 431 in the manifold 206 shown in FIG. 12 for fasteners to secure the ceramic panel 302 to the manifold 206. The upper portion 452 of the ceramic panel 302 also includes a hole 409 that mates with a hole 408 in the manifold 206. Fasteners (similar to fastener 309 shown in FIG. 3A) are used to secure the manifold 206 to the ceramic panel 302 through the hole 409. The upper portion 452 of the ceramic panel 302 also includes one or more holes 433 for a temperature sensor (e.g., a thermocouple).

[0128] In Figure 13C, the perforation pattern 510 is formed by distributing perforations around the walls 514 of concentric channels in the base portion 450 of the ceramic panel 302. Gas from the inlet 500 is dispersed into the processing chamber (e.g., processing chamber 102 shown in Figure 1) via the perforation pattern 510. Heat is transferred from the base portion 450 of the ceramic panel 302 to the upper portion 452 of the ceramic panel 302 via the walls 514.

[0129] The foregoing description is illustrative in nature and is in no way intended to limit this disclosure, its application, or its uses. The broad teachings of this disclosure can be implemented in various forms. Therefore, although this disclosure contains specific examples, its true scope should not be so limited, as other modifications will become apparent after examining the drawings, patent specification, and accompanying claims.

[0130] It should be understood that one or more steps within a method may be performed in different orders (or simultaneously) without altering the principles of this disclosure. Furthermore, although each embodiment has been described above as having certain features, any one or more of these features described with respect to any embodiment of this disclosure may be implemented in or combined with features of any other embodiment, even if such combination is not explicitly described. In other words, the embodiments are not mutually exclusive, and substitution of one or more embodiments for each other remains within the scope of this disclosure.

[0131] Various terms are used to describe the spatial and functional relationships between components (e.g., between modules, circuit elements, semiconductor layers, etc.), including "connection," "joint," "coupled," "adjacent," "close to," "above," "on top of," "below," and "configuration." Unless explicitly described as "direct," the relationship between the first and second components described in the above disclosure can be a direct relationship in which no other intermediate components exist between the first and second components, or an indirect relationship in which one or more intermediate components exist between the first and second components (spatially or functionally). As used herein, the expression of at least one of A, B, and C should be understood as intending to use a logic of non-exclusive OR (A or B or C), and should not be understood as meaning "at least one of A, at least one of B, and at least one of C."

[0132] In several embodiments, the controller is part of the system, which may be part of one of the examples described above. Such systems may include semiconductor processing equipment comprising: a processing tool or a plurality of processing tools; a chamber or a plurality of chambers; a processing platform or a plurality of processing platforms; and / or specific processing components (base, airflow system, etc.). Such systems may be combined with electronic equipment to control their operation before, during, and after processing steps on a semiconductor wafer or substrate. Such electronic equipment may refer to a "controller" that controls numerous components or sub-components of the system or plurality of systems.

[0133] Depending on the processing requirements and / or system type, the controller can be programmed to control any of the processes disclosed herein, including process gas delivery, temperature settings (such as heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and operation settings, wafer transfer into and out of tools connected to or interfacing with a particular system and other transfer tools and / or load locks.

[0134] In a broad sense, the controller may be defined as an electronic device having various integrated circuits, logic devices, memory, and / or software that receives instructions, issues instructions, controls operations, initiates cleaning operations, initiates endpoint measurements, and the like. These integrated circuits may include chips in the form of firmware that stores program instructions, digital signal processors (DSPs), chips defined as application-specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software).

[0135] Program instructions may be transmitted to the controller in the form of various independent settings (or program files), defining operating parameters for performing specific processes on or on the semiconductor wafer or system. In some embodiments, these operating parameters may be part of a formula defined by a process engineer to complete one or more processing steps during the fabrication of a layer, material, metal, oxide, silicon, silicon dioxide, surface, circuit, and / or die of the wafer.

[0136] In several implementations, the controller may be coupled to or part of a computer, which may be integrated with, coupled to, or otherwise networked to the system, or a combination thereof. For example, the controller may be in the cloud or be all or part of a wafer fab mainframe computer system, allowing remote access to wafer processing. The computer may enable remote access to the system to monitor the current progress of manufacturing operations, view historical records of past manufacturing operations, view trends or performance indicators from multiple manufacturing operations, change parameters of the current process, set processing steps after the current process, or start a new process.

[0137] In several examples, a remote computer (e.g., a server) may provide process recipes to the system via a network, which may include a local area network or the Internet. The remote computer may include a user interface that allows input or programming of parameters and / or settings, which are then transferred from the remote computer to the system. In several examples, the controller receives instructions in the form of data specifying parameters for each processing step to be performed during one or more operations. It should be understood that these parameters may be specific to the type of process to be performed and the type of tool the controller is configured to interface with or control.

[0138] Therefore, as described above, the controller may be distributed, for example, through more than one discrete controller that is networked together and operates toward a common purpose (e.g., the process and control described herein). An example of a distributed controller for such a purpose is more than one integrated circuit on a chamber that communicates with more than one integrated circuit located remotely (e.g., at a platform level or as part of a remote computer), which combine to control the process on the chamber.

[0139] Not limited to this, the illustrated system may include plasma etching chambers or modules, deposition chambers or modules, spin-wash chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, orbital chambers or modules, and any other semiconductor processing systems that may be associated with or used in the manufacture and / or production of semiconductor wafers.

[0140] As shown above, depending on the more than one processing step to be performed by the tool, the controller may communicate with one or more of the following: other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout the plant, a host computer, another controller, or tools used for material transfer to carry wafer containers to and from tool locations and / or load ports within the semiconductor manufacturing plant.

[0141] 100: Substrate Processing System 102: Processing Room 104: Substrate support (base) 106:Substrate 108: Heater 110: Gas distribution device (spray head) 112: Pole section 114: Base portion 130: Gas delivery system (component) 132-1, 132-2, 132-N: Gas Source 134-1, 134-2, 134-N: Valves 136-1, 136-2, 136-N: Mass flow controller 139: manifold 140: Fluid transport system 150: Temperature Controller 155~157: Valve 158: Vacuum Pump 160: System Controller 200: Spray head 202: Ceramic Panel 204: Backplate 206: manifold 208: Heating plate 209: Heater 210: Cooling plate 300, 300-1, 300-2: Spray heads 301-1, 301-2: Clearance 302: Ceramic panel 304: Metal Ring 305-1, 305-2: O-rings 308: Hole 309, 311: Fasteners 310: Valve 312: Pole section 313: Entrance 316: Exhaust port 320: Cooling Channel 330: Adapter 350: Base 356: Exports 372-1, 372-2: Trench 374: Blockage 400: Flange 402: Trench 404: Hole 406: Hole 408: Hole 409: Hole 420: O-ring groove 422: Bolt groove 430: Cut (groove) 431: Hole 433: Hole 450: Base portion 452: Upper Part 454: Flange 500-1, 500-2, 500-3, 500-4: Entry 510: Hole Pattern 512: Spoke-like structure (grooves) 514: wall

Claims

1. A spray head for a treatment chamber, comprising: a metal plate attached to the treatment chamber; a ceramic panel attached to the metal plate and having a plurality of gas outlets on a substrate-facing surface; and a metal ring surrounding the ceramic panel and attached to the metal plate.

2. The spray head for the treatment chamber as claimed in claim 1, wherein the ceramic panel has a smaller diameter than the metal plate.

3. The spray head for the treatment chamber as claimed in claim 1, wherein the outer diameter of the metal ring is the same as the diameter of the metal plate.

4. As in request item 1, the spray head for the treatment room, wherein, The ceramic panel has a smaller diameter compared to the diameter of the metal plate and the outer diameter of the metal ring.

5. The spray head for the treatment chamber as claimed in claim 1, wherein the inner edge of the metal ring contacts the outer edge of the ceramic panel.

6. As in request item 1, the spray head for the treatment room, wherein: The ceramic panel includes a first flange extending radially outward from a base portion of the ceramic panel; the metal ring includes a second flange extending radially inward from an inner edge of the metal ring; and the second flange overhangs the first flange.

7. The spray head for the treatment chamber as claimed in claim 1, wherein the metal ring system is integrated with the metal plate.

8. As in request item 1, the spray head for the treatment room, wherein: The metal ring includes a recess located on a surface that contacts the metal plate.

9. The spray head for a treatment chamber as claimed in claim 1, wherein the metal plate includes a recess located on a surface adjacent to one outer edge of the ceramic panel and in contact with the ceramic panel.

10. As in request item 1, the spray head for the treatment room, wherein: The metal ring includes a first recess on an upper surface that contacts the metal plate; and the metal plate includes a second recess on a lower surface that is adjacent to one outer edge of the ceramic panel and contacts the ceramic panel.

11. The spray head for a treatment chamber as claimed in claim 1, wherein the metal plate includes a manifold that is in fluid communication with the treatment chamber via an outer edge of the ceramic panel and an inner edge of the metal ring.

12. As in request item 1, the spray head for the treatment room, wherein: The metal plate includes a manifold; and an interface between the metal ring and the ceramic panel controls the flow of exhaust gas from the treatment chamber to the manifold.

13. The spray head for a treatment chamber as claimed in claim 1, wherein the metal plate comprises: a manifold in fluid communication with the treatment chamber; and an outlet in fluid communication with the manifold for discharging gas from the treatment chamber.

14. As in request item 1, the spray head for the treatment room, wherein: The metal plate includes a manifold; and the manifold includes a plurality of through holes in fluid communication with the processing chamber.

15. As in request item 14, a sprinkler head for a treatment room, wherein: The manifold receives an inert gas; and the inert gas flows into the processing chamber through the plurality of through holes.

16. The spray head for a treatment chamber as claimed in claim 14, wherein the manifold receives exhaust gas from the treatment chamber via the plurality of through holes.

17. As in request item 1, the spray head for the treatment room, wherein: The metal plate includes a manifold; a first portion of the manifold discharges a first gas from the processing chamber; and a second portion of the manifold supplies a second gas to the processing chamber.

18. As in request item 1, the sprinkler head for the treatment room, wherein: The metal plate includes a manifold, an outlet connected to a first portion of the manifold, and an inlet connected to a second portion of the manifold separated from the first portion; a first set of orifices in the first portion of the manifold for discharging a first gas through the outlet, the first gas system being received from the processing chamber via an interface between the ceramic panel and the metal ring; and a second set of orifices in the second portion of the manifold for supplying a second gas received from the inlet to the processing chamber.

19. The spray head for a treatment chamber as claimed in claim 18, wherein the metal ring includes a plurality of through holes in fluid communication with the second set of holes in the second portion of the manifold and in fluid communication with the treatment chamber.

20. A spray head for a treatment chamber as claimed in claim 1, wherein the ceramic panel comprises: a base portion including gas outlets disposed around a plurality of concentric channels formed by walls extending vertically from the base portion; and an upper portion disposed above the base portion, the upper portion contacting the walls, and including one or more inlets for receiving gas, wherein, The gas outlets in the ceramic panel disperse the gas into the processing chamber.

21. The spray head for the treatment chamber as claimed in claim 20 further comprises: a gas inlet connected to the metal plate; and a fitting attached to the gas inlet and the more than one inlet of the ceramic panel.

22. As in claim 21, a sprinkler head for a treatment chamber, wherein: The metal plate includes a slot; and the fitting is disposed in the slot and includes one or more segments respectively coupled to one or more inlets of the ceramic panel.

23. As in claim 22, a sprinkler head for a treatment room, wherein: The slot is located at the center of one of the metal plates; and the one or more segments of the mating member extend radially outward from the center.

24. The spray head for a treatment chamber as claimed in claim 20 further comprises: a gas inlet connected to a center of the metal plate, the metal plate having a slot at the center in fluid communication with the gas inlet; a fitting disposed in the slot and comprising one or more segments in fluid communication with the gas inlet, the one or more segments extending radially outward from the center and respectively coupled to the one or more inlets of the ceramic panel.

25. The spray head for a treatment chamber as claimed in claim 1 further comprises: a first plate including a heater and disposed on the metal plate; and a second plate including a cooling channel and disposed on the first plate.

26. The spray head for the treatment chamber as claimed in claim 1, wherein the metal ring is plated with a corrosion-resistant material.

27. The spray head for the treatment chamber as claimed in claim 1, wherein the metal plate and the metal ring system are plated with an anti-corrosion material.

28. The spray head for the treatment chamber as claimed in claim 20, wherein the walls are coated with an anti-corrosion material.

29. A substrate processing system comprising: the spray head as claimed in claim 1; and a base, wherein the metal ring contacts the base.

30. The substrate processing system of claim 29, wherein the metal ring isolates the ceramic panel from the base.

31. The substrate processing system of claim 29 further includes: a gas source for supplying a gas to the spray head, wherein the gas system is dispersed into the processing chamber via the plurality of gas outlets of the ceramic panel of the spray head.

32. The substrate processing system of claim 29 further includes a fluid delivery system for supplying a coolant to at least one of the spray head and the base.

33. The substrate processing system of claim 29, wherein at least one of the spray head and the base includes one or more heaters.

34. The substrate processing system of claim 29 further includes a vacuum pump connected to the processing chamber.

35. The substrate processing system of claim 29 further includes a gas source connected to the processing chamber to supply an inert gas to the processing chamber.

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