Information acquisition system, computing device, and information acquisition method of substrate processing apparatus

Abstract

[Topic] A substrate processing apparatus for liquid treatment of a substrate, which prevents undesirable processing conditions caused by improper positioning of the nozzle or cup relative to the substrate. [Solution] An information acquisition system that acquires information about a substrate processing apparatus having a substrate holding part that holds the substrate to rotate, a nozzle that supplies processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding part. The system includes: an information acquisition body that holds the substrate by the substrate holding part instead of the substrate; a camera unit of the information acquisition body for capturing an image of the cup and acquiring image data; and an acquisition unit that acquires information about the height of the cup based on the image data.

Description

[Technical Field]

[0001] This disclosure relates to an information acquisition system, a computing device, and a method for acquiring information in a substrate processing apparatus. [Previous Technology]

[0002] In the manufacturing process of a semiconductor device, a semiconductor wafer (hereinafter referred to as a wafer) is transported to a substrate processing apparatus in a state of being housed in a carrier for processing. This processing includes, for example, liquid processing such as coating film formation and imaging caused by the supply of coating liquid. During this liquid processing, processing liquid is supplied to the wafer housed in a cup from a nozzle. Patent Document 1 describes an imaging apparatus having a cup having annular protrusions facing the underside of the wafer. [Prior Art Documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2020-13932 [Summary of the Invention]

[0004] [The problem the invention aims to solve]

[0005] The purpose of this disclosure is to provide a substrate processing apparatus for liquid processing of a substrate, preventing undesirable processing conditions caused by improper positioning of the nozzle or cup relative to the substrate. [Means of the Problem]

[0006] The information acquisition system of the substrate processing apparatus disclosed herein acquires information about a substrate processing apparatus having a substrate holding part that holds the substrate to rotate, a nozzle that supplies processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding part. The system includes: an information acquisition body that holds the substrate by the substrate holding part instead of the substrate; an imaging unit of the information acquisition body for capturing images of the cup and acquiring image data; and an acquisition unit that acquires information about the height of the cup based on the image data.

[0007] The information acquisition system of another substrate processing apparatus disclosed herein acquires information about a substrate processing apparatus comprising a substrate holding section for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding section. The system comprises: an information acquisition body that holds the substrate by the substrate holding section instead of the substrate; an imaging unit provided in the information acquisition body for capturing an image of the nozzle and acquiring image data; and an acquisition unit that acquires a second distance between the substrate and the nozzle based on the number of pixels between the nozzle and a preset reference height in the image data. [Effects of the Invention]

[0008] This disclosure relates to a substrate processing apparatus for liquid treatment of a substrate, which can prevent the occurrence of undesirable processing conditions caused by the nozzle or cup being improperly positioned relative to the substrate.

Implementation Method

[0010] [First Implementation Form]

[0011] Figure 1 shows an information acquisition system 1 according to one embodiment of the present disclosure. The information acquisition system 1 includes a substrate processing apparatus 2, an inspection wafer 6, and a computing device 8. First, an overview of the components constituting the information acquisition system 1 will be described. The substrate processing apparatus 2 transports a circular substrate, i.e., a wafer W, between processing modules for processing via a transport mechanism. This processing includes supplying photoresist to the wafer W housed in a cup to form the photoresist film in a photoresist film forming processing module.

[0012] The inspection wafer 6 is transported to the substrate processing apparatus 2 via the aforementioned transport mechanism, replacing the wafer W. Next, images are captured of the annular protrusions and nozzles constituting the aforementioned cup to obtain image data. The nozzle is an EBR (Edge Bead Removal) nozzle. EBR is a process that removes solvent from the periphery of the wafer W by expelling solvent from the nozzle and forming a film (in this embodiment, a photoresist film) over the entire surface of the wafer W.

[0013] The computing device 8 obtains information about the distance between the wafer W and the annular protrusion and the distance between the wafer W and the nozzle used for EBR when the wafer W is mounted in the processing module, using the aforementioned image data and pre-acquired data. By obtaining this distance information before the processing of the wafer W by the substrate processing device 2, abnormalities are prevented during the formation of the photoresist film on the wafer W.

[0014] Hereinafter, the substrate processing apparatus 2 will be described in detail. The substrate processing apparatus 2 includes a carrier block D1 and a processing block D2. The carrier block D1 and the processing block D2 are arranged side by side and connected to each other. The wafer W, in a state where it is housed in a transfer container, i.e., a carrier C, is transferred to the carrier block D1 by a transfer mechanism for the carrier C (not shown). The carrier block D1 includes a stage 21 for placing the carrier C. A switch 22 and a transfer mechanism 23 are also provided in the carrier block D1. The switch 22 switches on and off a transfer port formed on the side wall of the carrier block D1. The transfer mechanism 23 transfers the carrier C on the stage 21 to the wafer W through the aforementioned transfer port.

[0015] Processing block D2 includes a transport path 24 for a wafer W extending in a left-right direction and a transport mechanism 25 provided on the transport path 24. The wafer W is transported between the carrier C and each processing module provided in processing block D2 via the transport mechanism 25 and the aforementioned transport mechanism 23. Multiple processing modules are arranged on the left and right sides of the transport path 24, one at the front and one at the rear. The rear processing module is a heating module 26, which performs a heating process to remove solvent from the photoresist film. The front processing module is a photoresist film forming module 3. Furthermore, a receiving and receiving module TRS for temporarily holding the wafer W is provided on the transport path 24 near the carrier block D1. The wafer W is received and received between the carrier block D1 and processing block D2 via the receiving and receiving module TRS.

[0016] Next, the photoresist film forming module 3 will be described with reference to the longitudinal sectional side view of FIG2 and the plan view of FIG3. The photoresist film forming module 3 has a substrate holding portion, namely a turntable 31, which holds the inner center of the wafer W horizontally. The turntable 31 is connected to a rotation mechanism 33 via a vertically extending shaft 32, and the wafer W held on the turntable 31 is rotated about the vertical axis by the rotation mechanism 33. Furthermore, a surrounding plate 34 is provided around the shaft 32, and three lifting pins 35 extending in the vertical direction are provided through the surrounding plate 34 (only two are shown in FIG2). The lifting pins 35 are raised and lowered by a lifting mechanism 36 to receive and transfer the wafer W between the turntable 31 and the previously described transport mechanism 25.

[0017] A circular cup 4 is provided from the lower side to the side of the periphery of the wafer W held on the turntable 31, surrounding the wafer W. The cup 4 has a cup body 41 and a guide portion 42. The cup body 41 has an outer cylindrical portion 41A, an inclined portion 41B, a bottom body 41C, and an inner cylindrical portion 41D. The outer cylindrical portion 41A is a member that stands upright and is disposed on the outside of the wafer W. The upper edge of the outer cylindrical portion 41A extends obliquely upward toward the center side of the cup 4 to form the inclined portion 41B. The inclined portion 41B surrounds the side periphery of the wafer W.

[0018] The lower end of the outer cylindrical portion 41A faces the center of the cup 4 to form a bottom body 41C, and the inner periphery of the bottom body 41C faces upward to form an inner cylindrical portion 41D. The inner cylindrical portion 41D is located on the outer side of the cup 4, relative to the periphery of the aforementioned surrounding plate 34. The outer cylindrical portion 41A, the bottom body 41C, and the inner cylindrical portion 41D thus formed form an annular recess along the periphery of the wafer W, which can receive the processing liquid falling or splashing from the wafer W. An exhaust pipe 43A for venting the contents of the cup 4 is provided in the bottom body 41C, and an exhaust port 43B that opens from the aforementioned recess for discharging the processing liquid.

[0019] Next, the lower side member, namely the guide portion 42, will be described. This guide portion 42 is formed in such a way that it expands from the periphery of the previously described enclosure 34 toward the outer cylindrical portion 41A. It is a member that forms an annulus in plan view and is located below the wafer W held on the turntable 31. A lower annular protrusion 40 is provided below the guide portion 42 to contact the inner peripheral surface of the inner cylindrical portion 41D. No gap is formed between the inner cylindrical portion 41D and the guide portion 42, so that the processing liquid will not leak outside the cup 4.

[0020] Next, the upper surface of the guide portion 42 is formed as inclined surfaces 44 and 45, with inclined surface 44 located on the side closer to the center of the cup 4 than inclined surface 45. Inclined surface 44 rises outward toward the cup 4, and inclined surface 45 descends outward toward the cup 4, forming a mountain shape in the longitudinal section of the guide portion 42. The periphery of the guide portion 42 is located away from the inner peripheral surface of the outer cylindrical portion 41A and protrudes downward, forming a vertical portion 46. This vertical portion 46 and the aforementioned inclined surface 45 serve to guide the processing liquid (photoresist and solvent) that falls or scatters and adheres from the wafer W toward the bottom body 41C.

[0021] Regarding the peripheral end of the inclined surface 44 near the outer side of the cup 4 and the peripheral end of the inclined surface 45 near the center side of the cup 4, the gradient becomes abrupt, forming an annular protrusion 47. That is, the annular protrusion 47 protrudes upward, along the periphery of the wafer W placed on the turntable 31, and close to the peripheral edge of the wafer W. This annular protrusion 47 prevents the processing liquid supplied to the surface of the wafer W from flowing back to the inside of the wafer W and adhering to the center of the wafer W, and prevents the spray of processing liquid from adhering to the center of the inside of the wafer W. For example, as shown in FIG4, the height of the mounting guide 42 is adjustable relative to the cup body 41. Therefore, the height of the annular protrusion 47 relative to the wafer W and the turntable 31 supporting the wafer W is adjustable. The distance between the inside of the wafer W and the upper end of the annular protrusion 47 is set as the cup separation distance H0, as shown in FIG4.

[0022] Next, the photoresist supply mechanism 5A and EBR processing mechanism 5B provided in the photoresist film forming module 3 will be described. The photoresist supply mechanism 5A includes a photoresist supply nozzle 51A, a photoresist supply section 52A, an arm 53A, a moving mechanism 54A, and a standby section 55A. The photoresist supply nozzle 51A ejects photoresist pressed from the photoresist supply section 52A vertically downward. The arm 53A supports the photoresist supply nozzle 51A and is configured to move freely up and down and horizontally via the moving mechanism 54A. The standby section 55A with an upper opening is provided on the outside of the cup 4, and the photoresist supply nozzle 51A moves between the opening of the standby section 55A and the cup 4 via the moving mechanism 54A. The photoresist supply nozzle 51A, moving within the cup 4, ejects photoresist onto the center of the rotating wafer W, forming a photoresist film on the entire surface of the wafer W through spin coating.

[0023] The EBR processing unit 5B includes a solvent supply nozzle 51B, a solvent supply section 52B, an arm 53B, a moving mechanism 54B, and a standby section 55B. The solvent supply nozzle 51B is a nozzle for EBR, which ejects solvent from the solvent supply section 52B from the center side of the wafer W towards the peripheral side in an inclined downward direction. That is, the solvent is ejected in an inclined direction relative to the vertical direction. The arm 53B supports the solvent supply nozzle 51B and is configured to move freely up and down and horizontally by means of the moving mechanism 54B. The standby section 55B with an upper opening is provided on the outside of the cup 4. The solvent supply nozzle 51B moves between the opening of the standby section 55B and the processing position above the wafer W in the cup 4 by means of the moving mechanism 54B. Furthermore, Figure 3 shows the solvent supply nozzle 51B in the state of moving to the processing position with solid lines. The EBR described above is performed relative to the rotating wafer W by ejecting solvent from the solvent supply nozzle 51B at the processing position.

[0024] For example, the solvent supply nozzle 51B is installed in a manner that allows for flexible adjustment of its height relative to the arm 53B. Therefore, the distance (denoted as the nozzle separation distance) H1 between the solvent supply nozzle 51B and the surface of the wafer W at the processing position shown in FIG. 4 is adjustable. Depending on the change in this nozzle separation distance H1, the position of the solvent ejected from the solvent supply nozzle 51B on the wafer W will change. Furthermore, although only shown in FIG. 3, an illumination unit 48 is provided near the cup 4 to irradiate light toward the cup 4. During the imaging of the solvent supply nozzle 51B, as described later, light is irradiated onto the solvent supply nozzle 51B by this illumination unit 48.

[0025] The substrate processing apparatus 2 includes a control unit 20 composed of a computer (refer to FIG. 1), which installs a program stored on a memory medium such as an optical disc, hard disk, memory card, or DVD. Commands (each step) are incorporated into the program by outputting control signals to each part of the substrate processing apparatus 2 using the installed program. Then, the wafer W is transported by the transport mechanisms 23 and 25, and the wafer W is processed by each processing module using these control signals.

[0026] Furthermore, due to errors in the assembly or adjustment of the photoresist film forming module 3 caused by the operator, the first distance, namely the cup separation distance H0, and / or the second distance, namely the nozzle separation distance H1, may deviate from the appropriate range. If the wafer W is processed when the cup separation distance H0 is inappropriate, the annular protrusion 47 will contact the wafer W, causing damage to the inside of the wafer W, or the annular protrusion 47 will be too far away from the wafer W, thus failing to fully exert its effect. Also, if the wafer W is processed when the nozzle separation distance H1 is inappropriate, the width of the area where the photoresist film is removed will become abnormal. In order to prevent such adverse conditions from occurring, as described above, image data of the annular protrusion 47 and the solvent supply nozzle 51B are acquired in the information acquisition system 1, and information on the cup separation distance H0 and the nozzle separation distance H1 as distances is obtained from the image data.

[0027] Hereinafter, the structure of the information acquisition unit used to acquire image data, namely the inspection wafer 6, will be described with reference to the side view of FIG5 and the plan view of FIG6. The inspection wafer 6 includes a body 60, a first camera 61, a second camera 62, a reflector 64, an illumination unit 65, a machine mounting substrate 71, and a battery 72. The body 60 is a circular substrate of the same size as the wafer W in plan view. The first camera 61, the second camera 62, the reflector 64, the illumination unit 65, the machine mounting substrate 71, and the battery 72 are provided on the body 60. The body 60 is also transported by the transport mechanisms 23, 25 and the module lifting pin 35, just like the wafer W. The central part of the body is held by the turntable 31, and its bottom surface is flat, just like the bottom surface of the wafer W. FIG5 and FIG6 show the inspection wafer 6 held in this state on the turntable 31.

[0028] Through holes 66A and 66B are formed in the peripheral portion of the main body 60 at a position away from the main body 60 in the circumferential direction. At a central position within the through holes 66A and 66B, upright substrates 67A and 67B are mounted on the peripheral surfaces where the through holes 66A and 66B are formed. The substrates 67A and 67B protrude above the through holes 66A and 66B, respectively. On these substrates 67A and 67B, a first camera 61 and a second camera 62 are respectively provided so as to capture images of the main body 60. The fields of view of the cameras, namely the first camera 61 and the second camera 62, face the peripheral edge of the main body 60.

[0029] A reflector 64 is disposed on the optical axis of the first camera 61, and the reflector 64 reflects the lower part of the main body 60 through the through hole 66A. Therefore, the first camera 61 can capture an image of the lower part of the main body 60 through the through hole 66A and the reflector 64. When the inspection wafer 6 is held on the turntable 31, the reflector 64 is located above the annular protrusion 47, and the first camera 61 can capture an image of the upper part of a portion of the annular protrusion 47 in the circumferential direction. Figure 7 schematically shows an example of image data obtained by the camera, with a pixel represented by a box surrounded by a dashed line in the figure.

[0030] Furthermore, two illumination units 65 are embedded in the main body 60. Each illumination unit 65 is located at a position that surrounds the through hole 66A in the circumferential direction of the main body 60, and illuminates light downwards. When the first camera 61 is taking pictures, light is illuminated to the subject below from each illumination unit 65. In addition, the first camera 61, the second camera 62, and the reflector 64 are positioned closer to the center of the main body 60 than the solvent supply nozzle 51B, so as not to interfere with the solvent supply nozzle 51B when the inspection wafer 6 rotates to the imaging processing position, as described later.

[0031] A machine mounting board 71 is provided at the center of the main body 60. The aforementioned boards 67A and 67B are connected to the machine mounting board 71 via cables not shown in the figure. Image data acquired by the first camera 61 and the second camera 62 is transmitted to the machine mounting board 71 via these boards 67A and 67B and the cables. Although the machine mounting board 71 is formed of multiple boards, such as those including a DSP (digital signal processor) board, it is conveniently represented as a single board and is used to mount various machines. These machines include those that wirelessly receive signals from the computing device 8 to capture images with the first camera 61 and the second camera 62, those that switch the illumination of the lighting unit 68 on and off, and those that wirelessly transmit the acquired image data to the computing device 8 (transmission unit). Furthermore, a battery 72 is provided at the center of the main body 60 to supply power to each of the machines included in the first camera 61, the second camera 62, the machine mounting board 71, and the lighting unit 68.

[0032] Next, the computing device 8 will be described with reference to FIG5. The computing device 8 is a computer and includes a bus 81. Next, a program storage unit 82, a wireless transceiver unit 83, a memory 84, a display unit 85, and an operation unit 86 are connected to the bus 81. In the program storage unit 82, a program 80 stored on a memory medium such as an optical disc, hard disk, memory card, or DVD is installed.

[0033] The wireless transceiver unit 83 is a machine that wirelessly transmits a trigger signal to the inspection wafer 6 to acquire image data, and wirelessly receives the acquired image data. The first and second memory units, i.e., memory 84, store the acquired image data and the preparation data detailed later. The display unit 85 is a display that shows the acquired cup separation distance H0 and nozzle separation distance H1. The operation unit 86 includes a mouse and keyboard, etc., allowing the user of the information acquisition system 1 to instruct the execution of processes that can be performed by the program 80, such as the transmission of the aforementioned trigger signal, via the operation unit 86.

[0034] Furthermore, for example, the computing device 8 is connected to the control unit 20 of the substrate processing device 2, and performs necessary data and signal transmission and reception in order to obtain the cup separation distance H0 and the nozzle separation distance H1. For example, if the inspection wafer 6 is placed on the turntable 31, a signal indicating that image data can be obtained is sent from the control unit 20 to the computing device 8.

[0035] Further explanation regarding the above-mentioned program 80 of the calculation device 8. This program 80 is composed of steps to perform the aforementioned transmission and reception of various data and signals, storage of image data in memory 84, acquisition of cup separation distance H0 and nozzle separation distance H1 based on image data and pre-prepared data, and display of the acquired cup separation distance H0 and nozzle separation distance H1 on display unit 85. Therefore, program 80 constitutes an acquisition unit to acquire the distance (height) between the wafer W and the subject captured by the camera. The determination of predetermined pixels in the image data used to acquire the cup separation distance H0 and nozzle separation distance H1 described later, the detection of the number of pixels in predetermined areas, and various calculations are also performed by program 80.

[0036] Next, as described above, the prior preparation data stored in the memory 84 of the computing device 8 will be explained, and the method for obtaining the cup separation distance H0 and the nozzle separation distance H1 from the prior preparation data will be explained. The prior preparation data includes data for obtaining the cup separation distance H0 and data for obtaining the nozzle separation distance H1. First, the data for obtaining the cup separation distance H0 will be explained with reference to FIG8.

[0037] Outside the substrate processing apparatus 2, in the area below the inspection wafer 6 where the first camera 61 can take pictures, a fixture 91 is disposed. There are no restrictions on the shape of the fixture 91, but it can be, for example, an elongated member extending in the transverse direction (the surface-inward direction of the paper in FIG8), similar to the annular protrusion 47. The width L1 of the upper end face of the fixture 91 is known, for example, 1 mm. The separation distance between the fixture 91 and the lower part of the body 60 of the inspection wafer 6 is set to H2 (unit: mm). The camera fixture 91 acquires image data whenever this separation distance H2 changes. That is, multiple image data about the fixture 91 are acquired.

[0038] Next, the pixel count of the width of the upper surface of the fixture 91 in each image data is obtained, and the correspondence between the pixel count and the separation distance H2 is calculated from the obtained result, as shown in the graph of Figure 9. The graph shows the pixel count of the upper surface of the fixture 91 set on the X-axis and the separation distance H2 set on the Y-axis; each point in the graph represents the obtained result. Then, from each point, for example, an approximate linear function is derived, namely Y = AX + B (A and B are constants). This approximate function represents the change in the pixel count of the upper surface of the fixture 91 relative to the separation distance H2, and is represented by the straight line 92 in the figure. Furthermore, the width L2 of the upper end of the annular protrusion 47 is obtained beforehand (see Figure 4). The aforementioned approximate function Y = AX + B and the width L2 are preliminary data used to obtain the cup separation distance H0.

[0039] The order of obtaining the cup separation distance H0 from the aforementioned pre-prepared data is explained. As shown in Figures 5 and 6, with the inspection wafer 6 held on the turntable 31, after acquiring image data of the annular protrusion 47 shown in Figure 7 by the first camera 61, the pixels at one end and the other end of the width L3 of the annular protrusion 47 in the image data are specified. Next, the number of pixels from one end to the other end is detected. That is, the number of pixels with respect to the width L3 of the annular protrusion 47 in the image data is detected (step S1). In the example of the image shown in Figure 7, the number of pixels is 14. Next, in the previously described approximation Y=AX+B, the value of Y in the approximation is calculated using the number of pixels of the width L3 as the value of X (step S2).

[0040] As described above, since this approximation is obtained using a fixture 91 with a width L1 of 1 mm, the calculated value of Y corresponds to the separation distance H2 between the annular protrusion 47 and the inspection wafer 6 when the width L2 of the annular protrusion 47 is 1 mm. Furthermore, the bottom surface of the wafer W and the bottom surface of the body portion 60 of the inspection wafer 6 are both flat, and when held in the turntable 31, the heights of the bottom surface of the body portion 60 and the bottom surface of the wafer W are the same. Therefore, the value of Y is also the distance between the annular protrusion 47 and the bottom surface of the wafer W when the width L2 is 1 mm (= cup separation distance H0). Therefore, by multiplying Y by the width L2 of the annular protrusion 47 to correct for the actual width L2 of the annular protrusion 47, this multiplied value (=Y×L2) is used as the cup separation distance H0 (step S3). The cup separation distance H0 calculated in this way is displayed on the display unit 85 of the calculation device 8 (step S4). Steps S1 to S4 above are performed using the aforementioned program 80. Furthermore, the aforementioned approximate formula Y=AX+B represents the prime number representing the width of the annular protrusion 47 when its width is 1 mm, and related data concerning the distance between the wafer W and the annular protrusion 47. Next, as described above, L2 multiplied by Y is used to correct this related data.

[0041] Next, the preparation data for obtaining the nozzle separation distance H1 will be explained with reference to Figures 10 and 11. Furthermore, the image obtained by the second camera 62 will be a VGA image (i.e., 640 pixels horizontally and 480 pixels vertically). As shown in Figure 10, the fixture 93 is positioned close to the side of the inspection wafer 6, and image data is obtained by capturing the fixture 93 with the second camera 62. The shape of the fixture 93 is not limited, but it can be, for example, a rod-shaped member extending in the vertical direction. The relative height between the fixture 93 and the inspection wafer 6 is changed so that the upper end of the fixture 93 is located at the center of the image in the vertical direction, i.e., at the reference height H3, i.e., at the 240th pixel from the bottom of the image. That is, the upper end of the fixture 93 is aligned with the reference height. Figure 11 schematically shows the image obtained by the second camera 62 when the relative height is changed in this way. Furthermore, in the example shown in Figure 10, when the fixture 93 is raised relative to the inspection wafer 6 and the fixture 93 is located at the position indicated by the chain line at a point in Figure 10, it is represented by the upper end of the fixture 93 at the reference height H3 in the image, as shown in the lower section of Figure 11.

[0042] After the upper end of the fixture 93 is positioned at the reference height H3, the height H4 between the upper end of the fixture 93 and the bottom surface of the inspection wafer 6 is obtained. While the method for obtaining this fourth distance, i.e., height H4, is arbitrary, it is possible to measure, for example, the distance between the upper end of the fixture 93 and the bottom surface of the inspection wafer 6 within the fixture 93 at the same height using a tool such as calipers. Furthermore, although the upper end of the fixture 93 is positioned at the reference height H3 in the above example, it is also possible to attach a mark to the side of the fixture 93, align this mark with the reference height H3, and measure the distance between the mark and the bottom surface of the inspection wafer 6 as height H4. Thus, by aligning any position within the fixture 93 with the reference height H3, height H4 can be obtained.

[0043] As described above, the height H5 is obtained by subtracting the thickness of the wafer W from the height H4. As previously stated, the height below the wafer W placed on the turntable 31 is the same as the height below the inspection wafer 6 placed on the turntable 31. Therefore, this height H5 is the height difference between the surface of the wafer W placed on the turntable 31 and the actual height position corresponding to the reference height H3 in the image obtained by the second camera 62 placed on the inspection wafer 6 on the turntable 31 (refer to FIG. 10). This third distance, i.e., H5, is set as the wafer reference height. Furthermore, the width L4 of the solvent supply nozzle 51B is obtained in advance (refer to FIG. 4). This width L4 is conversion information used to convert the pixel count of the image data into the actual distance, as described later. These wafer reference heights H5 and the width L4 of the solvent supply nozzle 51B are preparation data for obtaining the nozzle separation distance H1.

[0044] The order of obtaining the nozzle separation distance H1 from the aforementioned pre-preparation data is explained. As shown in Figures 5 and 6, with the inspection wafer 6 held on the turntable 31, image data of the side of the solvent supply nozzle 51B is obtained by the second camera 62 as shown in Figure 12. In this image data, the lower end of the solvent supply nozzle 51B is identified. In the image data, the number of pixels corresponding to the width L4 of the solvent supply nozzle 51B is detected (step T1). The detection of the number of pixels corresponding to the width L4 is described in detail. Pixels at one end (as the first pixel) and the other end (as the second pixel) of the solvent supply nozzle 51B in the width direction are identified, and the number of pixels between these first and second pixels is detected. Specifically, for the first and second pixels, for example, if the deviation is 3 pixels in the vertical direction and 4 pixels in the horizontal direction, the number of pixels corresponding to the width L4 is (32+42)¹ / ²=5 pixels.

[0045] Next, in the image data, the number of pixels at the height H6 between the lower end of the solvent supply nozzle 51B specified in step T1 and the reference height H3 (i.e., the number of pixels at a pre-set height in the image data) is detected (step T2). This H6 is set as the nozzle reference height. Next, the width L4 of the solvent supply nozzle 51B obtained in step T1 is calculated as the distance in one pixel (step T3). Then, the number of pixels at the nozzle reference height H6 obtained in step T2 is multiplied by the distance in one pixel obtained in step T3. That is, the number of pixels in the image data, i.e., the nozzle reference height H6, is converted to the actual height (distance) (step T4).

[0046] Next, when the lower end of the solvent supply nozzle 51B in the image data is below the reference height H3, the pre-prepared data, i.e., wafer reference height H5, is subtracted from the actual nozzle reference height H6 obtained in step T4. Next, as shown in FIG12, when the lower end of the solvent supply nozzle 51B in the image data is above the reference height H3, the pre-prepared data, i.e., wafer reference height H5, is added to the actual nozzle reference height H6 obtained in step T4. The calculated value obtained by subtracting or adding H6 to H5 is used to determine the nozzle separation distance H1 (step T5), and is displayed on the display unit 85 of the calculation device 8 (step T6). Steps T1 to T6 are performed by the above-described program 80.

[0047] As described above, the height between the surface of the wafer W and the reference height H3 of the image is taken as H5 and obtained as preliminary data. Next, the height between the lower end of the imaging solvent supply nozzle 51B and the reference height H3 of the image is taken as H6, and H6 is added to or subtracted from H5. That is, the nozzle separation distance H1 between the surface of the wafer W and the lower end of the solvent supply nozzle 51B is calculated in stages based on the reference height H3. The nozzle separation distance H1 is calculated in this way because the field of view of the second camera 62 is limited.

[0048] Hereinafter, the reasons for calculating the nozzle separation distance H1 will be explained in detail as above. Assume that the second camera 62 can capture images of the solvent supply nozzle 51B and the position directly below the solvent supply nozzle 51B in the body portion 60 of the inspection wafer 6. Then, by calculating the height between the body portion 60 and the solvent supply nozzle 51B from the number of pixels between this directly below position and the solvent supply nozzle 51B, and the distance of 1 pixel obtained in step T3 above, the nozzle separation distance H1 can be calculated by adding the difference in thickness between the wafer W and the body portion 60.

[0049] However, regarding the inspection wafer 6, since it is transported by the transport mechanisms 23 and 25, the second camera 62 is mounted on the body 60 of the inspection wafer 6 as described above. Due to the limitation of this mounting, the field of view of the second camera 62 is limited, and there is a situation where it cannot capture the position directly below the solvent supply nozzle 51B in the body 60. Therefore, as described above, the nozzle separation distance H1 is calculated by dividing the reference height H3 into height stages H5 and H6. Therefore, according to this method, the inspection wafer 6 can be transported by the transport mechanisms 23 and 25, and the nozzle separation distance H1 can be calculated with high accuracy. Furthermore, although the center of the vertical direction of the image is set as the reference height H3, it is not limited to the center and any height can be set as the reference height. For example, 1 / 4 of the height of the entire image (i.e., 120 pixels from the bottom) can be set as the reference height. Furthermore, although the number of pixels with respect to the width L4 of the solvent supply nozzle is obtained in step T1, this number of pixels is not limited to being obtained whenever the nozzle separation distance H1 is calculated; for example, it can be stored as a fixed value in the memory 84 of the calculation device 8.

[0050] The application sequence of the information acquisition system 1 described above is explained. First, as a preparatory process, images are taken of the fixtures 91 and 93 as shown in Figures 8 and 10 to obtain the approximate formula and wafer reference height H5 as shown in Figure 9. These approximate formulas and wafer reference height H5 are then added, and the width L2 of the annular protrusion 47 and the width L4 of the solvent supply nozzle 51B are stored in the memory 84 of the computing device 8 as pre-prepared data.

[0051] After the above preparation process is completed, the carrier C for storing the inspection wafer 6 is transferred to the stage 21 of the substrate processing apparatus 2. The inspection wafer 6 is transferred in the order of transfer mechanism 23 → receiving module TRS → transfer mechanism 25 → photoresist film forming module 3, and is placed on the turntable 31 via the lifting pin 35 and held by adsorption. Then, the solvent supply nozzle 51B moves from the standby section 55B to the processing position.

[0052] After the user gives a predetermined instruction from the computing device 8, the turntable 31 rotates intermittently at intervals, for example, at predetermined angles. When the rotation stops, the second camera 62 captures image data. The acquired image data is wirelessly transmitted to the computing device 8 in sequence. After acquiring image data of the entire circumference of the inspection wafer 6, the intermittent rotation and the second camera 62 stop, and the solvent supply nozzle 51B returns to the standby unit 55B. Then, the image data shown in FIG7 is wirelessly transmitted to the computing device 8 through the top of the annular protrusion 47 captured by the first camera 61.

[0053] For the image data acquired by the first camera 61, the above steps S1 to S4 are performed to calculate the cup separation distance H0, and the image is displayed on the display unit 85 of the calculation device 8. Furthermore, among the multiple image data acquired by the second camera 62, for example, the solvent supply nozzle 51B is selected by the program 80 of the calculation device 8 as shown in FIG. 12. Next, the above steps T1 to T6 are performed on the selected image data to calculate the nozzle separation distance H1, and the image is displayed on the display unit 85 of the calculation device 8.

[0054] The inspection wafer 6, after the imaging is completed, is received by the transport mechanism 25 via the lifting pin 35 and transported into other photoresist film forming modules 3. Imaging is performed in the same manner as when transporting the previous photoresist film forming module 3. In this process, the cup separation distance H0 and nozzle separation distance H1 are calculated for each photoresist film forming module 3 and displayed on the screen. After obtaining the cup separation distance H0 and nozzle separation distance H1 for all photoresist film forming modules 3, the inspection wafer 6 is sequentially transported back to the carrier C via the transport mechanism 25, the receiving module TRS, and the transport mechanism 23. The operator observes the cup separation distance H0 and nozzle separation distance H1 displayed on the screen for each photoresist film forming module 3 and adjusts the height of the guide portion 42 of the cup 4 provided by the annular protrusion 47 in the photoresist film forming module 3 or the solvent supply nozzle 51B, which is determined to require adjustment.

[0055] Subsequently, the carrier C holding the wafer W is transferred to the stage 21 of the substrate processing apparatus 2. The wafer W is transferred in the following sequence: transfer mechanism 23 → receiving module TRS → transfer mechanism 25 → photoresist film forming module 3 → transfer mechanism 25 → heating module 26 → transfer mechanism 25 → receiving module TRS, and returns to the carrier C via the transfer mechanism 23. In the photoresist film forming module 3, photoresist is ejected from the photoresist supply nozzle 51A at the center of the surface of the wafer W rotating by the turntable 31, and the photoresist extends toward the periphery of the wafer W, forming a photoresist film on the entire surface of the wafer W. Afterwards, the solvent supply nozzle 51B moves from the standby unit 55B to the processing position and supplies solvent to the periphery of the rotating wafer W to remove the photoresist film from that periphery.

[0056] Thus, based on the information acquisition system 1, the cup separation distance H0 and the nozzle separation distance H1 are obtained, allowing the operator to adjust the photoresist film formation module 3. Therefore, defects in the processing of the wafer W by the photoresist film formation module 3 are prevented. As a result, a decrease in the yield of semiconductor products manufactured from the wafer W can be prevented. Furthermore, in the above system's application sequence, preparatory work is performed before image data acquisition to obtain preparatory data, but preparatory work can also be performed after image data acquisition.

[0057] Figure 13 shows another structural example of the cup 4. The cup 4 has a guide portion 42 with an annular protrusion 47 connected to the upper end of a support column 38 at its lower part. The lower end of the support column 38 passes through the bottom body 41C of the cup body 41 and is connected to a first lifting mechanism, namely a lifting mechanism 39, by which the guide portion 42 can be raised and lowered. Furthermore, even if the guide portion 42 is raised and lowered, the lower annular protrusion 40 of the guide portion 42 will not form a gap between the inner cylindrical portion 41D of the cup body 41 and the guide portion 42, and the processing liquid and its spray inside the cup 4 will not leak to the outside of the cup 4.

[0058] When the obtained cup separation distance H0 exceeds the allowable range, for example, the control unit 20 outputs a control signal to adjust the height of the guide unit 42 by the lifting mechanism 39 in a way that brings it within the allowable range. That is, the relative height between the turntable 31 and the annular protrusion 47 is changed according to the cup separation distance H0.

[0059] Furthermore, when the obtained nozzle separation distance H1 exceeds the allowable range, for example, the control unit 20 outputs a control signal to adjust the height of the solvent supply nozzle 51B at the processing position via the moving mechanism 54B in a manner that brings it within the allowable range (see FIG13). That is, the moving mechanism 54B is a second lifting mechanism that changes the relative height between the solvent supply nozzle 51B and the turntable 31 according to the nozzle separation distance H1. In addition, in order to bring both the cup separation distance H0 and the nozzle separation distance H1 within the allowable range, the lifting mechanism 39 and the moving mechanism 54B are configured such that the heights of the guide unit 42 and the solvent supply nozzle 51B can be changed in multiple stages.

[0060] This structure, which automatically adjusts the cup separation distance H0 and the nozzle separation distance H1 respectively, eliminates the labor and time required for the operator to adjust the height of the guide section 42 and the solvent supply nozzle 51B. Furthermore, since this height adjustment prevents interruption of wafer W processing in the substrate processing apparatus 2, the productivity of the substrate processing apparatus 2 can be improved. In addition, in this case of automatic adjustment of the cup separation distance H0 and the nozzle separation distance H1, the cup separation distance H0 and the nozzle separation distance H1 may not be displayed on the display section 85. Therefore, a system structure without a display section 85 is also possible. Furthermore, a structure where the rotation mechanism 33 connected to the turntable 31 is connected to a lifting mechanism, and the turntable 31 and the rotation mechanism 33 are raised and lowered relative to the cup 4 and the solvent supply nozzle 51B to adjust the cup separation distance H0 and the nozzle separation distance H1, is also possible.

[0061] For ease of explanation, the cup 4 of one photoresist film forming module 3 in the substrate processing apparatus 2 is designated as 4A, and the cup 4 of other photoresist film forming modules 3 is designated as 4B. The cups 4A and 4B are configured with different widths L2 on the upper surface of the annular protrusion 47. In this case, the widths L2 of cup 4A and 4B are stored in the memory 84 of the calculation device 8 as pre-preparation data, and calculations are performed using the L2 of the cup 4 corresponding to the cup separation distance H0 obtained. In other words, the pre-preparation data, i.e., the width L2, is stored in each cup 4, and the calculation described above can be performed by selecting the cup 4 corresponding to the cup separation distance H0 obtained.

[0062] The selection of the correction data, i.e., the width L2, used for this calculation can be performed by an operator from the calculation device 8. Alternatively, for example, the correspondence between the photoresist film forming module 3 and the width L2 in that module can be pre-stored in the memory 84 of the calculation device 8. Then, after checking that the wafer 6 has been transferred to one of the plurality of photoresist film forming modules 3, information about that photoresist film forming module 3 is sent from the control unit 20 of the substrate processing device 2 to the calculation device 8. The program 80 of the calculation device 8 selects the width L2 corresponding to the photoresist film forming module 3 according to the information and calculates the cup separation distance H0. That is, the width L2 of the cup 4 of the photoresist film forming module 3 can be automatically selected according to the transfer and inspection of the photoresist film forming module 3.

[0063] In the previously described example, the cup separation distance H0 was calculated for each position of the annular protrusion 47 in the circumferential direction. However, it is also possible to obtain the cup separation distance H0 from each image data by using multiple positions of the first camera 61 in the circumferential direction. By obtaining the cup separation distance H0 at multiple positions in this way, it is possible to detect abnormalities such as the guide part 42 being installed at an angle. That is, in cases where the circumferential direction of the annular protrusion 47 is within the allowable range of a certain position, but the position of another part is not within the allowable range, it is possible to detect abnormalities. When performing multiple imaging operations with the first camera 61, for example, imaging with the second camera 62 can be performed simultaneously. That is, the inspection wafer 6 is rotated intermittently, and when the rotation stops, imaging with the second camera 62 is performed, and imaging with the first camera 61 is also performed.

[0064] In the information acquisition system 1 described above, although the control unit 20 and the computing device 8 are set up separately, the control unit 20 may also serve the function of the computing device 8. Furthermore, regarding the wireless transmission of image data to the computing device 8 in the described example, it is also possible to store the image data in a removable memory mounted on the main body of the inspection wafer 6. In this case, the operator can remove the memory from the inspection wafer 6, which has returned to the carrier C after the camera recording ends, and transfer the image data to the computing device 8 to obtain the cup separation distance H0 and the nozzle separation distance H1. Therefore, it is also possible for the inspection wafer 6 not to wirelessly transmit the image data. Alternatively, the inspection wafer 6 and the computing device 8 can be connected by a wired connection to transmit the image data to the computing device 8. However, the interconnected cables or other components may obstruct the movement of the inspection wafer 6; therefore, a structure such as wireless transmission of image data or storage in a memory mounted on the inspection wafer 6, as described above, is more advantageous.

[0065] Furthermore, only one of the first camera 61 and the second camera 62 can be mounted on the main body 60, and only one of the annular protrusion 47 and the solvent supply nozzle 51B can be used as the subject to acquire image data. Only one of the cup separation distance H0 and the nozzle separation distance H1 can be acquired. Additionally, the object of the first camera 61 is not limited to the annular protrusion 47. For example, the top surface of the guide portion 42 is a flat surface, and a nozzle is provided as an upward protrusion on this flat surface. This nozzle ejects cleaning fluid to the peripheral area of ​​the underside of the wafer W. By using the first camera 61 to image the nozzle, the separation distance between the nozzle and the underside of the wafer W can be obtained using the previously described method. Furthermore, the processing fluid supplied from the nozzle to the peripheral area of ​​the wafer W is not limited to a solvent; for example, a coating liquid for coating film formation can be used. The height of the nozzle relative to the surface of the wafer W can be calculated using the previously described method.

[0066] Supplementary explanation regarding the configuration of the second camera 62 for the inspection wafer 6. Generally, images acquired by a camera exhibit distortion aberrations, with greater distortion at the periphery than at the center. Therefore, in the image acquired by the second camera 62, if the lower end of the solvent supply nozzle 51B is located at the upper or lower end of the image, the calculated nozzle separation distance H1 may be inaccurate compared to the actual distance. To suppress this error, the second camera 62 is positioned on the body 60 of the inspection wafer 6 such that the lower end of the solvent supply nozzle 51B is located at the center of the image height when the solvent supply nozzle 51B is moved to a pre-set processing position. Therefore, in the image illustrated in FIG12, if the solvent supply nozzle 51B is at a normal height position, the upper end of arrow H6 will be located at the center of the image height. The height center of the image, when the height of the acquired image is X pixels, is, for example, a height that is X / 10 pixels above the height center of the image, or a height that is X / 10 pixels below the center of the image.

[0067] In order to project the solvent supply nozzle 51B into the image, the second camera 62 can be configured, as shown in FIG. 5, to have its lower part enter the through hole 66B formed in the body portion 60, or it can be mounted on a platform on the body portion 60. That is, like the through hole and platform, a height-shifting part can be provided to change the height between the surface (top) of the body portion 60 and the lower end of the second camera 62. Furthermore, to easily adjust the height of the solvent supply nozzle 51B in the image, the height of the second camera 62 in the body portion 60 can be configured to be freely adjustable. As a specific example, in the previously described example, the second camera 62 is mounted on the substrate 67B in the longitudinal direction, but a rod-shaped screw protrudes from the body portion 60 and a nut is screwed in, and the substrate 67B is horizontally mounted on this nut. The second camera 62 is positioned on this substrate 67B, and the operator rotates the nut to change its height, thus changing the height of the second camera 62 together with the substrate 67B.

[0068] Alternatively, the substrate 67B can be connected to the body portion 60 via a sliding rail extending in the longitudinal direction, allowing the operator to adjust the height of the body portion 60 relative to the substrate 67B. Like the rod-shaped screws, nuts, and sliding rails, a height adjustment unit can be provided to change the height of the second camera 62 relative to the body portion 60. Furthermore, regarding the image acquired by the second camera 62, if the lower end of the solvent supply nozzle 51B is not located at the height center of the image as previously described, the nozzle separation distance H1 can be determined to be abnormal, without obtaining the nozzle separation distance H1.

[0069] Furthermore, while the second camera 62 is configured with an imaging solvent supply nozzle 51B, it is also possible to obtain the distance between the photoresist supply nozzle 51A and the surface of the wafer W by imaging the photoresist supply nozzle 51A. Also, the liquid processing module provided in the substrate processing apparatus 2 is not limited to the photoresist film formation module 3. A module that supplies a coating film forming liquid other than photoresist films such as anti-reflective films and insulating films from the nozzle to the surface of the wafer W for film formation is also possible; a module that supplies a cleaning solution, developer, or adhesive for bonding multiple wafers W together from the nozzle to the surface of the wafer W is also possible. Thus, the distance between the nozzle supplying processing liquid other than photoresist and the surface of the wafer W can also be obtained using this technology. Furthermore, the inspection wafer 6 is not limited to being transported to the substrate processing apparatus 2 from the outside via a carrier C. For example, a module for storing the inspection wafer 6 can be provided within the substrate processing apparatus 2, and the wafer can be transported between this module and the photoresist film formation module 3.

[0070] [Second Embodiment] Next, while describing an inspection example using the inspection wafer 6, the structure of the cup 4 of the photoresist film forming module 3 will be explained in more detail first with reference to the longitudinal sectional side view of FIG14. The cup 4 includes a central guide portion 101 and an upper guide portion 111. Furthermore, in FIG2, the central guide portion 101 is simplified as an inclined portion 41B, and the upper guide portion 111 is omitted.

[0071] The intermediate guide portion 101 includes a vertical wall 102 mounted on the inner circumferential surface of the outer cylindrical portion 41A constituting the cup 4, and an inclined wall 103 extending obliquely upward from the upper end of the vertical wall 102 toward the center of the cup 4. The inclined wall 103 is annular in plan view. Furthermore, the inclined wall 103 has a through hole 104 in the longitudinal direction for fluid discharge.

[0072] The upper guide portion 111 includes an upper vertical wall 112 mounted on the inner circumferential surface of the outer cylindrical portion 41A, an upper wall 113 extending slightly horizontally from the upper end of the upper vertical wall 112 toward the center of the cup 4, and a cylindrical opening wall 114 extending vertically upward from the front end of the upper wall 113. The upper vertical wall 112 is located above the vertical wall 102 of the intermediate guide portion 101, and the upper wall 113 is located above the inclined wall 103 of the intermediate guide portion 101.

[0073] As described above, the cylindrical portion 41A outside the sidewall of the cup 4, the vertical wall 102 of the intermediate guide portion 101, and the upper vertical wall 112 are formed. Next, the inclined wall 103 protrudes from a position lower than the upper end of the sidewall, and the upper wall 113 protrudes from the upper end of the sidewall toward the center of the cup 4. The inclined wall 103 and the upper wall 113 form an annular protrusion protruding from the sidewall, which is coaxial with the central axis of the turntable 31 in plan view, forming an annulus around the wafer W placed on the turntable 31.

[0074] Regarding the upper annular body, i.e., the upper guide portion 111, and the middle annular body, i.e., the middle guide portion 101, there are cases where the cup 4 is installed at an abnormal height due to errors in the assembly and adjustment process, resulting in an abnormal height on the outer cylindrical portion 41A of the cup 4. This abnormal height occurs because the cup body 41 is installed at an angle, and also includes cases where only a portion of the height in the circumferential direction is abnormal. In such cases of abnormal height, the desired exhaust performance cannot be obtained in the various parts inside the cup 4, resulting in poor processing of the wafer W, and the spray of processing fluid may scatter outside the cup 4. Furthermore, if the height of the upper guide portion 44 is abnormal, it may also interfere with the passage of the nozzles on the cup 4.

[0075] In the second embodiment, image data acquired by a second camera 62 of the inspection wafer 6 is used to obtain information on the heights of the solvent supply nozzle 51B, the intermediate guide section 101, and the upper guide section 111. More specifically, the second camera 62 is configured not only to capture images of the side of the solvent supply nozzle 51B, but also to capture images of the inner peripheral end of the intermediate guide section 101 (i.e., the inner peripheral end of the inclined wall 103) and the inner peripheral end of the upper guide section 111 (i.e., the inner peripheral end of the opening wall 114). Then, based on the height information, a determination is made as to whether there are any abnormalities in the solvent supply nozzle 51B, the intermediate guide section 101, and the upper guide section 111. This prevents the wafer W from being processed under abnormal conditions, thus preventing a decrease in yield. Furthermore, in the figures shown in the second embodiment, among the components mounted on the body portion 60 of the inspection wafer 6, the previously described components other than the second camera 62 are omitted.

[0076] The preparations used for the above-mentioned inspection (abnormality determination) will be explained using Figures 15 to 17. As a calibration operation, this preparation involves setting the reference height in the image acquired by the second camera 62 and obtaining the pixel pitch in the longitudinal direction of the image for each of the abnormality detection targets: the solvent supply nozzle 51B, the intermediate guide section 101, and the upper guide section 111. Furthermore, the pixel pitch is the correspondence between the number of pixels and the actual distance, more specifically, the actual distance per pixel. In this preparation, for example, a scale 94 is used as a tool. Regarding this scale 94, the straight edge on the side where the scale is set is indicated as 95.

[0077] As described above, it is checked that the diameter of the body portion 60 of the wafer 6 is the same size as the diameter of the wafer W. An arbitrary position at the periphery of the body portion 60 is used as a reference position A0. This reference position A0, as will be described later, is the possible position for imaging when the scale 94 is deviated from the radial direction of the body portion 60 relative to this reference position A0, for example, at a point that overlaps with the optical axis of the second camera 62 in planar view.

[0078] Figure 15 shows the preparation for inspecting the solvent supply nozzle 51B. When describing the solvent supply nozzle 51B at the processing position with its lower end positioned A1 mm away from the center of the wafer W along the radial direction from the reference position A0, the operator first places the body 60 of the inspection wafer 6 on any horizontal plane 105. Next, a scale 94 is vertically positioned along the radial direction of the body 60 at a position A1 mm away from the reference position A0 on the surface of the body 60. Further details are provided on the scale 94, with its graduations arranged vertically and its edge 95 extending vertically from the reference position A1 mm away from the radial direction of the body 60. A second camera 62 captures image data of the scale 94 configured in this manner.

[0079] The operator determines the height of a pixel represented by a specific scale mark on the scale 94 in the image data as a reference height pixel B1. This specific scale mark represents the height of the lower end of the solvent supply nozzle 51B when it is positioned in the normal processing position, and is used as the reference height C1. Furthermore, in the scale 94 in the image data, the pixel pitch (as pixel pitch 1) is obtained from the number of pixels between adjacent scale marks.

[0080] The preparations for inspecting the intermediate guide section 101 and the upper guide section 111 are the same as those for the solvent supply nozzle 51B, except for the different configuration of the scale 94. The preparations for the intermediate guide section 101 will be detailed with reference to FIG16, focusing on the differences between the preparations for the intermediate guide section 101 and the solvent supply nozzle 51B. When the cup 4 is being assembled normally, the upper end of the intermediate guide section 101 is positioned at a distance of A2 mm from the reference position A0 along the radial direction of the wafer W. At this time, the operator positions the scale 94 at this position, extending vertically from the reference position A0 with its edge 95. Then, the operator acquires image data of the scale 94 using the second camera 62. The scale indicating the height (reference height C2) of the upper end of the middle guide section 101 when the cup 4 in the image data is assembled normally is detected, and the pixel reflecting the height of this scale is determined as the reference height pixel B2. Furthermore, the pixel pitch (as pixel pitch 2) is obtained from the scale 94 in the image data.

[0081] Regarding the upper guide portion 111, during normal assembly of the cup 4, the lower end of the opening wall 114 is positioned at a distance of A3 mm from the reference position A0 outward along the radial direction of the wafer W. At this time, as shown in FIG17, the operator positions a scale 94 at a distance of A3 mm from the reference position A0, with its edge 95 extending vertically. Next, the operator acquires image data of the scale 94 using the second camera 62. The scale indicating the height of the lower end of the opening wall 114 (as reference height C3) when the cup 4 is assembled normally in the image data is detected, and the pixel reflecting this height is determined as reference height pixel B3. Furthermore, the pixel pitch (as pixel pitch 3) is obtained from the scale 94 in the image data.

[0082] The reference height pixels B1 to B3 and pixel pitches 1 to 3 obtained as described above are stored in the memory 84 of the calculation device 8 by the operator. Furthermore, the memory 84 corresponds to the first memory unit, pixel pitches 1 and 2 correspond to cup-changing information, and pixel pitch 3 corresponds to nozzle-changing information. Also, if multiple inspection wafers 6 are used, considering the difference in operational and assembly accuracy between the inspection wafers 6, it is preferable that the reference height pixels B1 to B3 and pixel pitches 1 to 3 are obtained for each inspection wafer 6 and stored in the memory 84.

[0083] Furthermore, regarding pixel pitches 1 to 3, although the method of determining them is based on the number of pixels between adjacent scales of the scale 94 in the image, it is not limited to this. As another example, there is a method that utilizes the structure of the cup 4 in the image, because using the actual position of the object being inspected as a reference has the effect of improving the accuracy of the measurement results. Specifically describing the method for obtaining pixel pitch 2, the control unit 20 controls the lifting mechanism 36 to raise the lifting pin 35 by 1 mm while the inspection wafer 6 is mounted on the lifting pin 35, and controls the second camera 62 to capture the upper end 106 of the intermediate guide 101 before and after the lifting action. Then, in the two images obtained before and after the lifting action, if the position of the upper end 106 is determined by which pixel fraction changes, the pixel pitch 2 can be determined. Although the method for obtaining pixel pitch 2 is described as an example, the same applies to other pixel pitches, which can be obtained from images obtained by changing the height of the inspection wafer 6 relative to the object being inspected.

[0084] The explanation will focus on the differences between the inspection performed after the pre-preparation process described above and the inspection described in the first embodiment. First, the inspection shows that the wafer 6 is transported to the photoresist film forming module 3 and adsorbed onto the turntable 31. Next, the solvent supply nozzle 51B moves to the processing position, and the turntable 31 is rotated intermittently, and the second camera 62 captures images when the rotation stops.

[0085] The following explanation will use the schematic diagram in FIG18. FIG18 is a schematic diagram showing one of the acquired image data, with additional dots indicating the intermediate guide section 101 in the image. Components other than the intermediate guide section 101 are omitted. First, the upper end 106 of the intermediate guide section 101 in the image data is detected, and the number of pixels projected from the upper end 106 and between it and the reference height pixel B2 (denoted as H10 in the figure) is detected.

[0086] Next, the detected number of pixels is multiplied by the pixel pitch 2 to calculate the height difference between the upper end 106 and the reference height C2. This height difference (the distance between the upper end 106 and the reference height C2) is calculated from each of the acquired image data, and it is determined whether each difference falls within a preset allowable range. Then, for example, if it is determined that all height differences are within the allowable range, the height of the intermediate guide section 101 is set to normal; if none of the height differences fall within the allowable range, the height of the intermediate guide section 101 is set to abnormal.

[0087] Furthermore, the lower end of the opening wall 114 of the upper guide section 111 in each image data is detected, and the number of pixels between the lower end and the reference height pixel B3 is detected. This number of pixels is multiplied by the pixel pitch 3, and the height difference between the lower end of the opening wall 113 and the reference height C3 is calculated. Thus, if the height differences of the upper guide section 111 obtained from each image data are all within the acceptable range, the height of the upper guide section 111 is set to normal; if none of the height differences are within the acceptable range, the height of the upper guide section 111 is set to abnormal.

[0088] Next, the image showing the solvent supply nozzle 51B is selected from the acquired image data. The number of pixels between the lower end of the solvent supply nozzle 51B and the reference height pixel B1 in the selected image data is multiplied by the pixel pitch 1 to calculate the height difference between the lower end of the solvent supply nozzle 51B and the reference height C1. If this height difference is not within the allowable range, the height of the solvent supply nozzle 51B is set to abnormal.

[0089] Thus, according to the second embodiment, the reference height and pixel pitch are obtained in advance as pre-preparation data for each inspection object. Then, based on this pre-preparation data and the image data obtained by transporting the inspection wafer 6 to the photoresist film forming module 3, an inspection is performed, and height anomalies of the solvent supply nozzle 51B, the intermediate guide section 101, and the upper guide section 111 of the inspection object can be determined with high precision.

[0090] Furthermore, in the above-described inspection example, the upper end of the inner periphery of the inclined wall 103 is used as the detection target in the image for the intermediate guide section 101, and the lower end of the inner periphery of the opening wall 114 is used as the detection target in the image for the upper guide section 111, which is compared with a reference height for these detection targets. However, the detection target can be any part that is easier to detect in the acquired image. Therefore, it is not limited to using the previously described parts as the detection target. For example, for the upper guide section 111, the upper end of the inner periphery of the opening wall 114 can be used as the detection part, and anomaly determination can be made by comparing it with a reference height corresponding to the upper end.

[0091] Furthermore, the plan view of FIG19 shows another structural example of the inspection wafer 6 used in the second embodiment. In the plan view of FIG19, an example of three second cameras 62 are shown in the body portion 60 of the inspection wafer 6. For ease of explanation, cameras 62A, 62B, and 62C are distinguished from each other. The focal lengths of cameras 62A to 62C are the same. Then, the radial positions of cameras 62A to 62C in the body portion 60 are different. In plan view, cameras 62A, 62B, and 62C approach each other in the order of center P1 of the body portion 60 of the inspection wafer 6.

[0092] Based on image data from cameras 62A, 62B, and 62C, anomalies in the heights of the solvent supply nozzle 51B, the intermediate guide section 101, and the upper guide section 111 are determined. That is, cameras 62A, 62B, and 62C are configured to obtain an appropriate depth of field of view according to the position of the object being inspected, namely the solvent supply nozzle 51B, the intermediate guide section 101, and the opening wall 114 of the upper guide section 111. Such a configuration can also be used for each object being inspected. Furthermore, in Figure 19, for ease of understanding, a point is added to the inclined wall 103 of the intermediate guide section 101, and a shaded line is added to the opening wall 114 of the upper guide section 111.

[0093] Furthermore, regarding each of the cameras 62A to 62C, as described in the construction description of the second camera 62 as in the first embodiment, when the object being photographed is at a normal height, a height adjustment unit can be provided to appropriately adjust the height relative to the main body 60 so that the object being photographed is located at the center of the image height. Next, as explained in Figures 16 and 18, when comparing the height of the upper end of the intermediate guide section 101 with the reference height pixel B2, for example, the camera 62B can be positioned at a height where the reference height pixel B2 is located at the center of the image height. Also, as explained in Figure 17, when comparing the height of the lower end of the opening wall 114 of the upper guide section 111 with the reference height pixel B3, for example, the camera 62C can be positioned at a height where the reference height pixel B3 is located at the center of the image height.

[0094] It should be considered that the embodiments disclosed herein are illustrative in all respects and not intended to be limiting. The above embodiments may be omitted, substituted, modified and combined in various forms without departing from the scope and spirit of the patent application. [Simplified Explanation of the Diagram]

[0009] [Fig. 1] Plan view of the substrate processing apparatus of the formation information acquisition system of the present embodiment. [Fig. 2] Longitudinal sectional front view of the photoresist film formation module included in the aforementioned substrate processing apparatus. [Fig. 3] Plan view of the aforementioned photoresist film formation module. [Fig. 4] Side view showing the cup and diluent supply nozzle constituting the aforementioned photoresist film formation module. [Fig. 5] Explanatory diagram showing the inspection wafer and calculation device constituting the aforementioned information acquisition system. [Fig. 6] Plan view of the aforementioned inspection wafer. [Fig. 7] Explanatory diagram showing the image provided on the annular protrusion of the aforementioned cup. [Fig. 8] Explanatory diagram for explaining the preparation process used for inspection. [Fig. 9] Graph of data obtained in the aforementioned preparation process. [Fig. 10] Explanatory diagram for explaining the preparation process used for inspection. [Fig. 11] Explanatory diagram showing the image obtained in the preparation process. [Fig. 12] Explanatory diagram showing the image on the side of the nozzle provided in the aforementioned photoresist film formation module. [Fig. 13] A longitudinal sectional side view showing another example of the aforementioned cup structure. [Fig. 14] A longitudinal sectional side view showing another example of the aforementioned photoresist film forming module structure. [Fig. 15] An explanatory diagram illustrating the preparation process for inspection. [Fig. 16] An explanatory diagram illustrating the preparation process for inspection. [Fig. 17] An explanatory diagram illustrating the preparation process for inspection. [Fig. 18] An explanatory diagram illustrating the detection of the height of the intermediate guide portion constituting the aforementioned photoresist film forming module. [Fig. 19] A plan view showing another example of the aforementioned inspection wafer and the aforementioned cup.

Claims

1. An information acquisition system for a substrate processing apparatus, which acquires information about the substrate processing apparatus having a substrate holding section for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding section, comprising: an information acquisition body that holds the substrate by the substrate holding section instead of the substrate; an imaging unit provided by the information acquisition body for capturing an image of the cup and acquiring image data; and an acquisition unit for acquiring information about the height of the cup based on the image data.

2. The information acquisition system of the substrate processing apparatus as described in claim 1, wherein, The aforementioned cup has a sidewall and an annular protrusion extending from the sidewall toward the center of the cup; the aforementioned camera captures an image of the inner peripheral end of the aforementioned annular protrusion; as information about the height of the aforementioned cup, information about the height of the aforementioned annular protrusion is obtained.

3. The information acquisition system of the substrate processing apparatus as described in claim 2, wherein, A first memory unit is provided to store conversion information for converting the pixel count between a preset reference height in the image data acquired by the information acquisition unit held in the aforementioned substrate holding unit and the inner peripheral end of the aforementioned annular protrusion into a distance; the aforementioned acquisition unit acquires information about the height of the aforementioned annular protrusion based on the aforementioned conversion information for the aforementioned cup.

4. The information acquisition system of the substrate processing apparatus as described in claim 3, wherein, The aforementioned annular protrusion has an intermediate annular part that protrudes from the aforementioned sidewall at a height lower than the upper end; information regarding the height of the aforementioned annular protrusion includes information regarding the height of the aforementioned intermediate annular part.

5. The information acquisition system of the substrate processing apparatus as described in claim 1, wherein, The aforementioned cup has a lower side member disposed below the aforementioned substrate held by the aforementioned substrate holding portion, and a protrusion protruding upward from the lower side member; the aforementioned camera portion captures an image of the upper surface of the aforementioned protrusion; the aforementioned acquisition portion acquires a first distance between the aforementioned substrate and the aforementioned protrusion as information about the height of the aforementioned cup.

6. An information acquisition system for a substrate processing apparatus, which acquires information about a substrate processing apparatus comprising a substrate holding section for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding section, comprising: an information acquisition body held by the substrate holding section instead of the substrate; an imaging unit provided in the information acquisition body for capturing an image of the nozzle and acquiring image data; and an acquisition unit for acquiring a second distance between the substrate and the nozzle based on the number of pixels between the nozzle and a preset reference height in the image data.

7. The information acquisition system of the substrate processing apparatus as described in claim 6, wherein, A second memory unit is provided to store a third distance, which is the height difference between the surface of the substrate held in the substrate holding unit and the reference height of the image data obtained by the information acquisition body held in the substrate holding unit, and nozzle conversion information for converting the number of pixels between the nozzle in the image data and the reference height into a distance; wherein, the acquisition unit acquires the second distance based on the second distance and the nozzle conversion information.

8. The information acquisition system of the substrate processing apparatus as described in claim 6, wherein, A second lifting mechanism is provided to change the relative height between the substrate holding part and the nozzle in response to the aforementioned second distance.

9. The information acquisition system of the substrate processing apparatus as described in claim 6, wherein, The aforementioned nozzle is a nozzle that supplies the aforementioned processing liquid to the periphery of the aforementioned substrate by discharging it at an angle relative to the vertical direction.

10. The information acquisition system of the substrate processing apparatus as described in claim 2, wherein, The inner peripheral end of the aforementioned annular protrusion, which is positioned for capturing images by the aforementioned camera unit, is provided on the aforementioned information acquisition body in such a way that the camera unit is located at the height center of the image obtained by the aforementioned camera unit.

11. The information acquisition system of the substrate processing apparatus as described in claim 1, wherein, The aforementioned camera unit is configured to have an adjustable height within the aforementioned information acquisition unit.

12. A computing apparatus for acquiring information about a substrate processing apparatus comprising a substrate holding portion for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding portion, comprising: a memory portion for storing image data acquired by an image acquisition unit provided with an image acquisition body that replaces the substrate in holding the cup by the substrate holding portion for image acquisition; and an acquisition portion for acquiring information about the height of the cup based on the image data.

13. A computing apparatus for acquiring information about a substrate processing apparatus comprising a substrate holding portion for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding portion, comprising: a memory portion for storing image data acquired by an image acquisition body having an imaging portion for capturing images of at least one of the nozzle and the cup as an image subject instead of holding the substrate in the substrate holding portion; and an acquisition portion for acquiring a second distance between the substrate and the nozzle based on the number of pixels between the nozzle and a preset reference height in the image data.

14. An information acquisition method for a substrate processing apparatus, comprising: acquiring information about a substrate processing apparatus having a substrate holding section for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding section; comprising: a holding process for holding an information acquisition body by means of the substrate holding section instead of the substrate; a process for capturing an image of the cup and acquiring image data by means of an imaging section provided with the information acquisition body; and a process for acquiring information about the height of the cup based on the image data by means of an acquisition section.

15. The information acquisition method of the substrate processing apparatus as described in claim 14, wherein, The aforementioned bra cup has a sidewall and an annular protrusion extending from the sidewall toward the center of the aforementioned bra cup; the process of acquiring the aforementioned image data includes the process of capturing an image of the inner peripheral end of the aforementioned annular protrusion; the process of acquiring information about the height of the aforementioned bra cup is the process of acquiring information about the height of the aforementioned annular protrusion.

16. The information acquisition method of the substrate processing apparatus as described in claim 15, wherein, The process for obtaining information about the height of the aforementioned bra cup includes: a process for obtaining the aforementioned image data; a process for obtaining the distance using bra cup conversion information that converts the pixel number between the reference height in the image data and the inner peripheral end of the aforementioned annular protrusion into a distance; and a process for obtaining the aforementioned bra cup conversion information using the image data from a front-facing camera that captures the inner peripheral end of the aforementioned annular protrusion.

17. The information acquisition method of the substrate processing apparatus as described in claim 16, wherein, The aforementioned bra cup includes a lower side member disposed below the aforementioned substrate held by the aforementioned substrate holding portion, and a protrusion protruding upward from the lower side member; the process of acquiring the aforementioned image data includes the process of photographing the upper part of the aforementioned protrusion; the process of acquiring information about the height of the aforementioned bra cup includes the process of acquiring a first distance between the aforementioned substrate and the protrusion.

18. An information acquisition method for a substrate processing apparatus, which acquires information about a substrate processing apparatus having a substrate holding section for holding a substrate to rotate, a nozzle for supplying processing liquid to the surface of the rotating substrate, and a cup surrounding the substrate held in the substrate holding section, comprising: a holding process for holding an information acquisition body by means of the substrate holding section instead of the substrate; a process for capturing an image of the nozzle and acquiring image data by means of an imaging section provided with the information acquisition body; and a process for acquiring a second distance between the substrate and the nozzle by means of the acquisition section based on the number of pixels between the nozzle and a preset reference height in the image data.

19. The information acquisition method of the substrate processing apparatus as described in claim 18, comprising: a process of acquiring a third distance, which is the difference between the surface of the substrate held in the substrate holding portion and the height of the reference height corresponding to the image data acquired by the information acquisition body held in the substrate holding portion; a process of acquiring the second distance, and a process of acquiring the second distance based on the third distance and transformation information for converting the number of pixels between the nozzle and the reference height in the image data of the nozzle into a distance.

20. The information acquisition method of the substrate processing apparatus as described in claim 19, wherein the process of acquiring the aforementioned third distance includes: acquiring image data by means of the aforementioned camera unit's imaging fixture; changing the relative height between the fixture and the aforementioned information acquisition body in such a way that the fixture is positioned at the aforementioned reference height in the image data; and acquiring the fourth distance, which is the difference between the height of the bottom of the aforementioned information acquisition body and the height corresponding to the aforementioned reference height, using the aligned fixture.

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