Processing equipment

Abstract

[Problem] To provide a novel processing apparatus that prevents a decrease in processing accuracy due to temperature changes by adjusting the temperature inside the processing chamber, thereby achieving higher precision processing. [Solution] A processing apparatus comprising: a processing chamber 4 for accommodating a holding table 12 and a processing unit (cutting unit 10), the holding table 12 holding a workpiece 2, and the processing unit for processing the workpiece 2 held on the holding table 12; and an air inlet chamber 8 for supplying air from a constant temperature air supply source 91, wherein the processing apparatus supplies air from the air inlet chamber 8 to the processing chamber 4, forming a downward flow from the upper side to the lower side inside the processing chamber 4, thereby adjusting the temperature of the processing chamber 4.

Description

[Technical Field]

[0001] The present invention relates to a processing apparatus for processing workpieces such as semiconductor wafers, and more specifically, to the management of the indoor temperature of the processing chamber. [Previous Technology]

[0002] For example, as disclosed in Patent Document 1, there has always been a lathe cutting device that uses a lathe tool to cut the upper surface of a workpiece held by a so-called chuck table.

[0003] In this type of lathe tool cutting device, if a foreign object is trapped between the worktable and the workpiece, the height of the upper surface of the workpiece will deviate, and the thickness of the cut workpiece will become uneven. Therefore, as in Patent Document 1, a pin chuck stage that holds the workpiece with the front ends of multiple support pins is used as a holding stage.

[0004] Furthermore, before machining the workpiece, a so-called setup operation is performed, which involves detecting the height position of the cutting tool tip relative to the holding surface of the holding table. During the setup operation, the cutting depth of the cutting tool relative to the workpiece is adjusted based on the detected height position.

[0005] More specifically, a touch sensor of known thickness is disposed on the holding surface of the holding stage. When the cutting tool is lowered, the cutting edge at the lower end of the tool, made of a single-crystal diamond or similar material, contacts the touch sensor, thereby detecting the height position of the cutting tool relative to the holding surface. [Contemporary Art Documents] [Patent Documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2019-204916 [Summary of the Invention]

[0007] [Problem to be Solved by the Invention] However, after preparation work is performed, the height of the holding surface of the holding table may sometimes change, for example, due to movement of the holding table or heat generated during processing. Even if the change is only 1 μm, it can still lead to problems in workpieces requiring high-precision machining, preventing the achievement of the desired machining accuracy.

[0008] Moreover, the problem of machining accuracy is not limited to lathe cutting devices. It also becomes a problem in various processing devices such as cutting devices that use cutting blades to process cutting grooves on workpieces and grinding devices that use grinding stones to thin workpieces.

[0009] In view of the above problems, the present invention provides a novel processing apparatus that prevents the reduction in processing accuracy associated with temperature changes by adjusting the temperature inside the processing chamber, thereby achieving higher precision processing.

[0010] [Technical means for solving the problem] The problem to be solved by the present invention is as described above, and the means for solving this problem will be described below.

[0011] According to one aspect of the present invention, a processing apparatus includes: a processing chamber for accommodating a holding table and a processing unit, the holding table holding a workpiece, the processing unit for processing the workpiece held on the holding table; and an air inlet chamber for supplying air from a constant temperature air supply source, wherein the processing apparatus supplies air from the air inlet chamber to the processing chamber to form a downward flow from the upper side to the lower side of the processing chamber, thereby adjusting the temperature of the processing chamber.

[0012] Furthermore, according to one aspect of the present invention, the processing chamber is provided with an exhaust port connected to an exhaust source.

[0013] Furthermore, according to one aspect of the present invention, a temperature measuring device for measuring the temperature of the processing chamber is provided in the processing chamber, and at least one of the temperature of the air supplied by the constant temperature air supply source, the flow rate of the air supplied by the constant temperature air supply source, and the flow rate of the exhaust air discharged from the exhaust port is adjusted according to the temperature detected by the temperature measuring device.

[0014] Furthermore, according to one aspect of the present invention, a cooling unit is provided, which sprays cooling fluid onto the holding table that moves along a movement path between the transfer-out and transfer-in areas and the processing area, wherein the transfer-out and transfer-in areas transfer workpieces out and into the holding table, and the processing area processes the workpieces using the processing unit.

[0015] Furthermore, according to one aspect of the present invention, the processing unit is a lathe tool cutting unit equipped with a lathe tool, which cuts a workpiece held by the holding table.

[0016] [Effect of the Invention] According to the present invention, the relative distance between the processing unit and the workpiece can be managed with good precision by adjusting the temperature inside the processing chamber, thereby improving the processing accuracy.

[0017] Furthermore, according to one aspect of the present invention, the temperature inside the processing chamber can be adjusted by discharging air from the processing chamber through an exhaust port.

[0018] Furthermore, according to one aspect of the present invention, the temperature of the holding table and the temperature around the moving path of the holding table can be adjusted and kept fixed, thereby improving the processing accuracy.

[0019] Furthermore, in one aspect of the present invention, namely the lathe tool cutting device, the change in the cutting depth caused by the lathe tool cutting unit can be prevented and fixed, thereby obtaining the desired machining accuracy.

Implementation Method

[0021] FIG1 is a diagram showing an example of the processing apparatus of the present invention, namely the configuration of the lathe tool cutting apparatus 1. In addition, the present invention can be widely applied to processing apparatuses with processing chambers. In addition to the lathe tool cutting apparatus 1, it can also be applied to various processing apparatuses such as cutting apparatuses that process cutting grooves on workpieces by means of cutting blades, and grinding apparatuses that thin workpieces by means of grinding stones.

[0022] As shown in Figure 1, the lathe tool cutting device 1 has a base 7 that is longer in the Y-axis direction. The space above the base 7 forms a machining chamber 4 and a transfer chamber 6. The machining chamber 4 is used to process the workpiece 2, and the transfer chamber 6 is used to transfer the workpiece 2 in and out of the machining chamber 4. The machining chamber 4 and the transfer chamber 6 are divided by a partition 5 and configured such that the workpiece 2 can move between the machining chamber 4 and the transfer chamber 6 through an opening (not shown) provided in the partition 5. Furthermore, in Figure 2, the machining chamber 4 is the area to the right of the partition 5, indicated by a chain line at two points.

[0023] Two cutting units 10 and 20 are provided in the machining chamber 4 as machining units. The exposed surface of the workpiece 2 is cut by means of the cutting tools 11a and 21a installed in each cutting unit 10 and 20. Alternatively, it can be configured to have only one cutting unit.

[0024] The lathe tools 11a and 21a have cutting edges made of single-crystal diamond and cut ductile materials such as resin or metal, or composite materials thereof. The workpiece 2 is, for example, a generally circular wafer made of materials such as silicon, SiC (silicon carbide) or other semiconductors, or materials such as sapphire, glass, or quartz. Components such as ICs (integrated circuits) and LSIs (large scale integrations) are formed on the wafer, and multiple protruding electrodes called bumps are formed on the front side. Because the height of the protruding electrodes is not necessarily uniform, even if it is desired to directly engage the protruding electrodes with the electrodes of the mounting object, there may be situations where engagement cannot be performed in the same way. In the lathe cutting apparatus 1 of this embodiment, the heads of the protruding electrodes are cut by the cutting edges of the lathe tools 11a and 21a, thereby aligning the heights of each protruding electrode uniformly. In addition to bumps, other materials such as resin substrates (e.g., packaging substrates), adhesive films bonded to wafers, sealing resins covering wafers, and base adhesives filling the spaces between bumps are also cut.

[0025] As shown in Figure 1, each cutting unit 10, 20 is mounted on the rear side of the base 7 and is arranged adjacent to each other with intervals in the X-axis direction. Each cutting unit 10, 20 includes: spindles 14, 24; and cutting tool wheels 11, 21 mounted on the front end of spindles 14, 24. Cutting tool wheels 11, 21 include: wheel bases 11k, 21k; cutting tools 11a, 21a, etc., mounted on wheel bases 11k, 21k; motors 15, 25, etc., for rotating spindles 14, 24; and Z-axis moving plates 18, 28, etc., for supporting each component.

[0026] Each cutting unit 10, 20 is raised and lowered by the machining feed units 16, 26 to feed the front ends of the cutting tools 11a, 21a. The machining feed units 16, 26 include: motors 16a, 26a; ball screws 16b, 26b, which are driven by the motors 16a, 26a; and a pair of guide rails 16c, 26c, which respectively guide the Z-axis moving plates 18, 28 of the cutting units 10, 20. The machining feed units 16, 26 raise and lower the Z-axis moving plates 18, 28 by the rotation of the ball screws 16b, 26b, thereby raising and lowering the cutting units 10, 20 as a whole.

[0027] Furthermore, the same type of cutting tool is installed in each cutting unit 10 and 20. For example, after rough cutting is performed by one of the cutting units 10 under predetermined machining conditions, fine cutting is performed by changing the rotation speed of the cutting wheel, the machining feed speed (Y-axis direction movement speed) of the holding table, and the depth of cut of the cutting tool in another cutting unit 20. In addition, the workpiece 2 can also be cut by each cutting unit 10 and 20 under the same machining conditions.

[0028] In the processing chamber 4, holding tables 12 and 22 are provided on the upper surface side of the base 7 at positions offset in the X-axis direction. Each holding table 12 and 22 moves in the Y-axis direction between the processing area A1 and the workpiece loading / unloading area A2, which is located below the cutting units 10 and 20, by a drive mechanism (not shown) provided in the base 7.

[0029] The holding surfaces formed on the upper surfaces of each holding table 12, 22 are connected to an attraction source (not shown) and attract and hold the workpiece 2 placed on the holding surface. Each holding table 12, 22 is formed by a pin chuck table, which forms the holding surface by the front ends of a plurality of support pins.

[0030] A telescopic snake belly 13, 23 is connected to both sides of each holding platform 12, 22 in the Y-axis direction. A drive mechanism for moving each holding platform 12, 22 in the Y-axis direction and a drainage mechanism for receiving and draining cutting water are provided below the snake belly 13, 23.

[0031] In the base 7, on the side opposite to the processing chamber 4, there are cassette holding parts 9a and 9b for holding cassettes 51 and 52, which hold workpieces 2. A first conveying unit 61 is provided in the transfer chamber 6, and the workpieces 2 in the cassettes 51 are conveyed to the temporary storage area 62 by means of the first conveying unit 61.

[0032] After the workpiece 2 is positioned to a predetermined position by the positioning mechanism 63 provided in the temporary area 62, it is held by the second conveying unit 64 with an adsorption pad and then transferred to the holding table 12.

[0033] The third conveying unit 65 is arranged adjacent to the second conveying unit 64. The third conveying unit 65 has an adsorption pad and conveys the finished workpiece 2 located on the holding table 12 to another holding table 22, or conveys the finished workpiece 2 located on the holding table 22 to the cleaning unit 66.

[0034] The cleaning unit 66 is configured as a rotary cleaning device with a spinner table, and the surface of the workpiece 2 is cleaned by cleaning water. After cleaning, the workpiece 2 is dried by dry air while being rotated at high speed, and the workpiece 2 is moved to the cassette 52 by the first conveying unit 61.

[0035] In the lathe tool cutting apparatus 1 configured as described above, the workpiece 2 is cut. For example, in the cutting process using the cutting unit 10, the workpiece 2 is placed and held on the holding surface of the holding table 12, and the cutting unit 10 is lowered to a predetermined height, while the lathe tool is positioned at the predetermined height. Then, the holding table 12 is moved toward the processing area A1 at a predetermined speed, and the lathe tool wheel 11 is rotated at a predetermined speed, thereby cutting the surface of the workpiece 2 by the lathe tool. As detailed later, cutting fluid is supplied to the surface of the workpiece 2 during this cutting process.

[0036] Next, the air inlet chamber 8 shown in Figures 1 and 2 will be described. The air inlet chamber 8 is disposed on the upper side of the processing chamber 4 and is configured to have an inlet 81 and an outlet 84. The inlet 81 is for air supplied by the constant temperature air supply source 91 to flow into, and the outlet 84 is for air to flow out of the processing chamber 4. Through this air inlet chamber 8, an airflow generated by the downward flow from the upper side of the processing chamber 4 to the lower side is formed.

[0037] As shown in Figures 1 and 2, in this embodiment, the air inlet chamber 8 is disposed on the upper side of the partition wall 4a of the ceiling constituting the machining chamber 4, and is configured to span not only the machining chamber 4 but also the upper side of the loading / unloading chamber 6, and is configured such that the lathe tool cutting device 1 is integrally formed as a cuboid. With this configuration, it can be added to an existing lathe tool cutting device as an add-on. In addition, the air inlet chamber 8 may be disposed only on the upper side of the machining chamber 4, or the unit constituting the air inlet chamber 8 may be accommodated in the upper part of the inner space of the machining chamber 4.

[0038] As shown in Figure 2, air, which has been controlled to a predetermined temperature, is supplied from a constant-temperature air supply source 91 and through a control valve 92. An inlet 81 is formed on the rear wall 83a of the air inlet chamber 8, which allows air supplied by the constant-temperature air supply source 91 to flow into the air inlet chamber 8. Air is introduced horizontally from the inlet 81 towards the upper part of the front wall 83b of the air inlet chamber 8. By introducing air from the inlet 81 towards the more distant wall 83b, the temperature inside the air inlet chamber 8 becomes more uniform.

[0039] As shown in Figure 2, the air that returns after contacting the upper part of the wall 83b flows into the transport chamber 6 and the processing chamber 4 respectively through the outlet 86 opening toward the transport chamber 6 and the outlet 84 opening toward the processing chamber 4. In addition, in order to facilitate the smooth flow of air from the inlet 81 to the outlets 84 and 86, guide plates or the like for rectifying the air can also be provided.

[0040] Each outlet 84, 86 is equipped with an air filter (not shown) to remove debris, dust, etc. contained in the air when it flows into the transfer chamber 6 or the processing chamber 4. The air filter can be, for example, a HEPA filter (High Efficiency Particulate Air Filter).

[0041] As shown in Figure 2, the air entering the processing chamber 4 through the outlet 84 becomes a downward flow and flows downward within the processing chamber 4. It is then exhausted to the outside through the return port 43 and the exhaust port 42 located at the rear of the processing chamber 4. In this way, as will be described later, the temperature inside the processing chamber 4 can be adjusted by exhausting the air inside the processing chamber 4 through the exhaust port 42.

[0042] As shown in Figure 1, the outlet 84 is provided at two locations corresponding to the two cutting units 10 and 20 and the two holding stages 12 and 22. Preferably, the outlet 84 is provided at a position corresponding to the position above the movement path of each holding stage 12 and 22 in the Y-axis direction.

[0043] As shown in FIG2, the recovery port 43 is formed, for example, by forming an opening in the side facing the holding table 12 in an elongated box that is longer in the Y direction. The opening of the recovery port 43 is formed across the movement range of the holding table 12 in the Y-axis direction and is disposed on the side of the holding surface of the holding table 12. The interior of the recovery port 43 is connected to the exhaust source 46 through the exhaust port 42 and the control valve 45. In addition, as shown in FIG1, the recovery port 44 is provided in a manner that corresponds to another holding table 22, and two recovery ports 43 and 44 are arranged adjacent to each other in the X-axis direction. Furthermore, the opening of the recovery port 43 may be formed extensively across the entire range of the movement path 17 (FIG. 3) of the holding table 12, or it may be provided only in a local area, for example, it may be formed in the area facing the processing area A1 (FIG. 3).

[0044] With the above configuration, in the processing chamber 4, an airflow is formed from the upper outlet 84 toward the lower recovery port 43, and the gas environment temperature in the processing chamber 4 can be adjusted by the airflow.

[0045] As shown in Figure 2, temperature adjustment is performed, for example, by measuring the temperature using multiple temperature measuring devices 41 located in the processing chamber 4, and the controller 100 controlling the opening and closing of the control valve 92 according to the temperature, thereby adjusting the amount of air flowing into the processing chamber 4 from the inlet 81 and through the outlet 84.

[0046] In addition to adjusting the air flow rate and temperature by controlling the opening and closing of the control valve 92, the temperature of the air supplied by the constant temperature air supply source 91 can also be changed to adjust the temperature, and the air flow rate of the exhaust air controlled by the opening and closing of the control valve 45 of the exhaust port 42 can also be adjusted to adjust the temperature. Furthermore, these can be combined.

[0047] Furthermore, the location of the temperature measuring device 41 installed in the processing chamber 5 is not particularly limited. For example, it can also be installed in the outer shell of the base component supporting the holding table 12, the space below the caliper 13 (e.g., the guide rail of the holding table 12), the guide rails 16c and 26c of the processing feed units 16 and 26 (Fig. 1), etc.

[0048] By performing feedback control as described above, the temperature inside the processing chamber 4 becomes constant, thereby suppressing the temperature rise of the holding table 12 that accompanies the movement of the holding table 12 or the processing, and suppressing the change in the height position of the holding surface 12a of the holding table 12.

[0049] Then, by keeping the height position of the holding surface 12a of the holding table 12 fixed, the relative distance between the machining unit 10 and the workpiece 2 can be managed with good precision, thereby improving machining accuracy. In this embodiment, if it is a lathe tool cutting device 1, the change in the cutting depth caused by the lathe tool cutting unit 10 can be prevented, and the desired machining accuracy can be obtained.

[0050] Similarly to the processing chamber 4, the gas environment temperature in the transfer-in / exit chamber 6 can be adjusted by supplying air from the outlet 86. A temperature measuring device 48 can also be installed in the transfer-in / exit chamber 6 to feed back the temperature inside the chamber to the controller 100, thereby appropriately controlling the opening and closing of the control valve 92. In this way, not only the temperature of the processing chamber 4 can be adjusted, but also the temperature of the transfer-in / exit chamber 6, thus allowing for overall temperature adjustment of the lathe tool cutting device 1.

[0051] In addition to adjusting the indoor temperature of the processing chamber 4 or the transfer chamber 6, the indoor pressure of the processing chamber 4 or the transfer chamber 6 is also controlled to be a more positive pressure than that outside the processing device. This prevents the entry of dust or other particles from outside the processing device into the processing device and contaminating the inside of the processing device or the workpiece.

[0052] Next, as shown in Figures 1 and 3, the cooling unit 30 that sprays cooling fluid onto the holding platforms 12 and 22 will be described.

[0053] As shown in Figure 3, the cooling unit 30 is composed of a fluid injection unit 32 and a fluid supply source (air source 34, coolant source 36). Multiple fluid injection units 32 are arranged in a way that they move along the Y-axis direction of the holding platforms 12 and 22. The fluid supply source (air source 34, coolant source 36) is used to supply fluid 38 to the fluid injection unit 32.

[0054] As shown in Figure 3, the moving paths 17 and 27 of the holding tables 12 and 22 are located below the cutting units 10 and 20, that is, between the processing area A1 and the workpiece transfer area A2. Multiple fluid jetting units 32 are arranged at predetermined intervals along the sides of the moving paths 17 and 27 of each holding table 12 and 22. In this embodiment, the seven fluid jetting units 32 are arranged along the Y-axis direction, outside the X-axis direction of the lathe tool grinding device.

[0055] On the opposite side of the fluid jetting unit 32 in each of the moving paths 17 and 27, that is, in the central part of the X-axis direction of the lathe tool grinding device, recovery ports 43 and 44 are respectively provided along each of the moving paths 17 and 27.

[0056] Openings are formed at the recovery ports 43 and 44 facing the moving paths 17 and 27 respectively, absorbing and recovering the fluid 38 ejected by each fluid injection unit 32. The recovery ports 43 and 44 are connected to the exhaust source 46 through the exhaust port 42, and the fluid 38 is attracted and recovered by utilizing the negative pressure generated by the exhaust source 46. The fluid 38 becomes a mist, which is appropriately separated into liquid and gas inside the recovery ports 43 and 44 and discharged to the outside. By recovering the mist-like fluid 38 through the recovery ports 43 and 44, it is possible to prevent moisture from adhering to the movable parts of the device and causing rust or other defects. In addition, the vertical dimension of the openings of the recovery ports 43 and 44 is designed to sufficiently attract the suspended mist-like fluid 38. The vertical dimension of the opening 43a of the recovery port 43 facing the holding platform 12 shown in Figure 4 is an example, and it can also be narrower. Furthermore, the opening of the recovery port 43 may be formed extensively across the entire range of the moving path 17 (Fig. 3) of the holding table 12, or it may be formed only in a local area, for example, in the area facing the processing area A1 (Fig. 3).

[0057] Each fluid injection unit 32 is connected to an air source 34 and a coolant source 36. Each fluid injection unit 32 has a nozzle that injects fluid toward the movement paths 17 and 27, and injects a dual-fluid mixture of supplied air and coolant. Alternatively, it may inject only coolant instead of a dual-fluid mixture.

[0058] Alternatively, a cooling pipe such as a vortex tube can be installed between each fluid injection unit 32 and the air source 34 to lower the air temperature. Furthermore, the coolant can be cooled to a predetermined temperature in the coolant source 36 (e.g., a constant-temperature water heater outside the cutting tool device). The temperature of the dual fluids injected by each fluid injection unit 32 is, for example, set to 10°C or below.

[0059] By means of the cooling unit 30 configured as described above, fluid 38 is continuously supplied to the moving paths 17 and 27 of the holding tables 12 and 22, thereby adjusting and maintaining the temperature of the holding tables 12 and 22 and the temperature around the moving paths 17 and 27, thus improving machining accuracy. In addition, by directly lowering the fluid 38 to the holding tables 12 and 22, the temperature rise of the holding tables 12 and 22 can be effectively suppressed.

[0060] Alternatively, the controller 100 can be used to control the control valves 35 and 37 and adjust the supply of air or coolant from the fluid supply sources (air source 34, coolant source 36) based on the temperature measured by the temperature measuring device 41 installed in the processing chamber 4. Furthermore, the controller 100 can be configured to adjust the temperature of the air or coolant supplied by the fluid supply sources (air source 34, coolant source 36).

[0061] In addition, it is preferable to supply fluid 38 to the holding surfaces of the holding tables 12 and 22 throughout the entire area of ​​the moving paths 17 and 27 by adjusting the pressure or flow rate of the air supplied to each fluid injection unit 32.

[0062] Furthermore, as shown in FIG4, when the holding table 12 is located in the machining area A1 (FIG. 3), fluid 38 supplied by the fluid jet unit 32 disposed on the side of the machining area A1 is supplied toward the surface 2a of the workpiece 2. Moreover, during the cutting process performed by the cutting tool 11a by the rotation of the cutting wheel 11, fluid 38 is continuously supplied to the surface 2a of the workpiece 2 and the cut is rinsed. Also, the holding table 12 is cooled at this time.

[0063] Thus, the fluid 38 can also function as a coolant (processing fluid) for cooling the processing point. In particular, the angle of the spray nozzle is adjusted so that the fluid 38 can reach the processing point (the position of the cutting tool 11a) efficiently. Furthermore, Figure 4 shows the situation where the workpiece 2 is a semiconductor wafer and the bump 2d (protruding electrode) formed on the surface 2a is cut and planarized.

[0064] Furthermore, as shown in Figure 3, when the holding table 12 is located in the transfer-out and transfer-in area A2, the supply of fluid 38 to the holding table 12 can also be stopped, and the fluid 38 can be supplied to a partial area (e.g., half of the area) of the holding surface of the holding table 12.

[0065] Furthermore, as shown in Figures 1 and 3, the supply of fluid 38 by the cooling unit 30 can be continuous after the device is started. Also, when the holding table 12 is positioned in the transfer-in / exit area A2 and the workpiece 2 is being transferred in or out, the supply of fluid 38 to the holding table 12 located in the transfer-in / exit area A2 can be stopped, while the supply of fluid 38 to other areas continues. In addition, when the workpiece 2 is not held by the holding table 12, the holding table 12 performs an idling motion reciprocating along the movement path; at this time, the supply of fluid 38 by the cooling unit 30 continues, thereby maintaining a constant temperature within the processing chamber 4. [Simplified Explanation of the Diagram]

[0020] Figure 1 is a diagram showing an example of the processing apparatus of the present invention, namely, the configuration of the lathe tool cutting apparatus. Figure 2 is a schematic diagram showing the internal structure of the air inlet chamber and the processing chamber. Figure 3 is a diagram illustrating the cooling unit that sprays cooling fluid onto the holding table. Figure 4 is a diagram illustrating the state of the holding table being cooled.

Claims

1. A processing apparatus comprising: a processing chamber for housing a holding table and a processing unit, the holding table holding a workpiece, the processing unit for processing the workpiece held on the holding table; and an air inlet chamber for supplying air from a constant-temperature air supply source, the processing apparatus supplying air from the air inlet chamber to the processing chamber to form a downward flow from the upper side to the lower side of the processing chamber, thereby adjusting the temperature of the processing chamber, wherein... The air inlet chamber is located above the ceiling of the processing room, and air is introduced from the inlet on the rear side of the air inlet chamber toward the wall on the front side.

2. The processing apparatus as described in claim 1, wherein, The processing room is equipped with an exhaust port connected to the exhaust source.

3. The processing apparatus as described in claim 2, wherein, The processing chamber is equipped with a temperature measuring device to measure the temperature of the processing chamber. Based on the temperature detected by the temperature measuring device, at least one of the temperature of the air supplied by the constant temperature air supply source, the flow rate of the air supplied by the constant temperature air supply source, and the flow rate of the exhaust air discharged from the exhaust port is adjusted.

4. The processing apparatus according to any one of claims 1 to 3, comprising: a cooling unit that sprays cooling fluid onto the holding table that moves along a movement path between a transfer-in area and a processing area, the transfer-in area transferring the workpiece into and out of the holding table, and the processing area processing the workpiece using the processing unit.

5. The processing apparatus as described in any of claims 1 to 3, wherein, The machining unit is a lathe tool cutting unit equipped with a lathe tool, which cuts the workpiece held by the holding table.

6. The processing apparatus of claim 4, comprising: a cooling unit including a plurality of fluid injection units, capable of cooling the holding table in any of the following situations: when the holding table is located in the transfer-in area, when the holding table moves along the movement path, and when the holding table is located in the processing area.

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