Process control method, host computer, controller, and system of semiconductor equipment

Abstract

This disclosure provides a process control method, host computer, controller, and system for semiconductor equipment. The process control method for semiconductor equipment includes: acquiring a process file required to control the semiconductor equipment to complete a preset process flow; wherein the process file is generated based on received process configuration parameters, and the process file includes multiple process instructions corresponding to all process actions to complete the preset process flow, each process instruction corresponding to one process action; when the process starts, the process file is sent to the controller, so that the controller parses the process instructions one by one, and controls the corresponding semiconductor equipment to execute the corresponding process action based on the process parameters in the process instructions.

Description

Technical Field

[0001] The present disclosure relates to, but is not limited to, the field of semiconductor technology, and in particular to a process control method, host computer, controller, and system for semiconductor equipment. Prior Art

[0002] Semiconductor manufacturing processes typically require a high level of automation within semiconductor equipment control systems due to their complex, challenging, and time-consuming processes. These control systems typically utilize a slave computer as the core of process control. For example, a commonly used semiconductor equipment control system primarily consists of a master computer, a slave computer, and a programmable logic controller (PLC). The master computer serves as the human-machine interface, enabling process editing and status monitoring. The slave computer, as the core of the entire control system, controls process operations. The PLC provides interfaces for sensors and actuators within the system, collecting sensor signals and sending control commands to the actuators.

[0003] However, when the lower computer is used as the core of the control process operation, since the lower computer is usually an industrial control computer, the operation stability is poor and it is prone to occasional crashes, causing the process to stop and the product to be scrapped, which reduces the reliability of the process operation control. In addition, the lower computer needs to interact with the upper computer and the programmable logic controller for data, and the system architecture is complex, which reduces the efficiency of information transmission and leads to a high failure rate. The use of the lower computer will also increase the equipment cost and reduce the stability of the control process operation. Summary of the Invention

[0004] In view of this, the purpose of the present disclosure is to provide a process control method, host computer, controller and system for semiconductor equipment, which controls the host computer to send the process files required to complete the preset process flow directly to the controller, so that the controller can control the semiconductor equipment to execute the corresponding process actions to complete the preset process flow, and realizes that the controller is the core of controlling the process operation, which can avoid the situation where the process is stopped and the product is scrapped due to the poor stability of the lower computer, improves the reliability of process operation control, improves the efficiency of information transmission, saves equipment costs, and improves the stability of controlling process operation.

[0005] In order to achieve the above objectives, the technical solutions adopted in the embodiments of the present disclosure are as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a process control method for a semiconductor device, which is applied to a host computer. The process control method for the semiconductor device comprises: obtaining a process file required for controlling the semiconductor device to complete a preset process flow; wherein the process file is generated based on received process configuration parameters, and the process file includes multiple process instructions corresponding to all process actions for completing the preset process flow, each process instruction corresponding to one process action; when the process starts, the process file is sent to a controller so that the controller parses the process instructions one by one, and controls the corresponding semiconductor device to perform the corresponding process action based on the process parameters in the process instructions.

[0007] Furthermore, the embodiment of the present disclosure provides a first possible implementation of the first aspect, wherein the step of generating the process file includes: receiving process configuration parameters; wherein the process configuration parameters include an instruction name and process parameters corresponding to the instruction name; generating multiple process instructions corresponding to all process actions of completing the preset process flow based on the instruction name, the process parameters corresponding to the instruction name, and a preset instruction format, to obtain the process file; wherein the process instruction includes an instruction sequence number, an instruction ID, and multiple process parameters.

[0008] Furthermore, the embodiment of the present disclosure provides a second possible implementation of the first aspect, wherein the step of generating the process file includes: receiving input values ​​of editable parameters of each process packaging module; wherein some process parameters in the process packaging module are editable parameters; generating multiple process instructions corresponding to all process actions of completing the preset process flow based on the input values ​​of the editable parameters and the fixed parameter information in the process packaging module, to obtain the process file; wherein the process packaging module includes multiple process instructions corresponding to all process actions of completing a target process step, the process instructions include all process parameters required to complete the process action, and the target process step is a process step in the preset process flow.

[0009] Furthermore, the embodiment of the present disclosure provides a third possible implementation of the first aspect, wherein the process instructions in the process encapsulation module are sorted according to the process action sequence of the target process step; and the information included in the process encapsulation module is stored in an encrypted document under a designated storage path of the host computer.

[0010] Furthermore, the embodiment of the present disclosure provides a fourth possible implementation of the first aspect, wherein the step of generating the process file further includes: when a process editing instruction is received, calling the encrypted document, and displaying a process editing page based on the encrypted document; wherein the process editing page includes the name of each of the process packaging modules; when module selection information is received, displaying the module name and editable parameter name of the target process packaging module corresponding to the module selection information based on the encrypted document, to wait for receiving the input value of the editable parameter corresponding to each of the editable parameter names.

[0011] In a second aspect, an embodiment of the present disclosure further provides a process control method for a semiconductor device, which is applied to a controller, the process control method for the semiconductor device comprising: receiving a process file sent by a host computer for controlling the semiconductor device to complete a preset process flow; wherein the process file is generated by the host computer based on received process configuration parameters, and the process file includes multiple process instructions corresponding to all process actions for completing the preset process flow, each process instruction corresponding to one process action; when a start operation instruction sent by the host computer is received, parsing the process instructions one by one, and controlling the corresponding semiconductor device to perform the corresponding process action based on the process parameters in the process instructions.

[0012] Furthermore, the embodiments of the present disclosure provide a first possible implementation of the second aspect, wherein the process instruction includes an instruction sequence number, an instruction ID, and multiple process parameters; the process file includes a matrix or array consisting of the multiple process instructions, and each row of the matrix or array corresponds to a process instruction.

[0013] Furthermore, the embodiment of the present disclosure provides a second possible implementation of the second aspect, wherein the step of parsing the process instructions one by one and controlling the corresponding semiconductor equipment to perform the corresponding process action based on the process parameters in the process instructions includes: determining the instruction name corresponding to the instruction ID of each line of process instructions in the process file one by one; determining, based on the instruction name of each process instruction, the process control instruction corresponding to the process parameter in the process instruction and the target equipment component in the semiconductor process equipment that executes the process control instruction; and sequentially issuing the process control instruction corresponding to each process instruction to the corresponding target equipment component to control the corresponding semiconductor equipment to perform the corresponding process action, until all process instructions in the process file are executed.

[0014] Furthermore, the embodiment of the present disclosure provides a third possible implementation of the second aspect, wherein the process control method of the semiconductor device further includes: in the process of parsing the process instructions in the process file, feeding back the instruction sequence number of the process instruction being parsed or the process action being executed to the host computer, so that the host computer displays the execution progress of the process file.

[0015] In a third aspect, an embodiment of the present disclosure further provides a host computer comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, the process control method for a semiconductor device as described in any one of the first aspects is implemented.

[0016] In a fourth aspect, an embodiment of the present disclosure further provides a controller comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when the computer program is executed by the processor, the process control method for a semiconductor device as described in any one of the second aspects is implemented.

[0017] In a fifth aspect, an embodiment of the present disclosure further provides a process control system for semiconductor equipment, which includes: the host computer described in the third aspect and the controller described in the fourth aspect.

[0018] The present disclosure sends a generated process file directly to a controller via a host computer, and enables the controller to parse the process instructions in the process file one by one, and control the corresponding semiconductor equipment to execute corresponding process actions based on the process parameters in the process instructions. This can control the semiconductor equipment to complete the entire preset process flow, and realizes that the controller is the core of controlling the process operation, avoiding the situation where the process is stopped and the product is scrapped due to poor stability of the lower computer, and improving the reliability of process operation control; by deleting the lower computer equipment, the system architecture of the semiconductor equipment control system is simplified, and the host computer can directly exchange information with the controller, thereby improving the information transmission efficiency of the system, reducing the failure rate, saving equipment costs, and improving the stability of the control process operation.

[0019] Other features and advantages of the embodiments of the present disclosure will be described in the subsequent description, or some features and advantages can be inferred or determined without doubt from the description, or can be learned by implementing the above-mentioned technologies of the embodiments of the present disclosure.

[0020] In order to make the above-mentioned objectives, features and advantages of the present disclosure more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the accompanying drawings. Simple diagram description

[0021] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for the embodiments or the description of the prior art. Obviously, the drawings described below are only embodiments of the present disclosure. Those skilled in the art can also derive other drawings based on the provided drawings without inventive effort. In the drawings: Figure 1 shows a schematic structural diagram of a process control system related to semiconductor equipment; Figure 2 shows a schematic diagram of the relevant process editing page; Figure 3 shows a flowchart of a process control method for a semiconductor device according to an embodiment of the present disclosure; Figure 4 shows a schematic diagram of a process editing page in a host computer provided in an embodiment of the present disclosure; Figure 5 shows a flowchart of another process control method for a semiconductor device provided in an embodiment of the present disclosure; Figure 6 shows a flowchart of a controller parsing process instruction provided in an embodiment of the present disclosure; Figure 7 shows a semiconductor device process editing and control flow chart provided in an embodiment of the present disclosure; FIG8 shows a schematic structural diagram of a process control system for a semiconductor device provided by an embodiment of the present disclosure. Implementation Method

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the present disclosure will be described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments.

[0023] Current semiconductor manufacturing processes are typically complex, challenging, and time-consuming, requiring a high degree of automation in semiconductor equipment and a stable, reliable, and easy-to-use and maintain process control system. Process control system architectures for semiconductor equipment vary widely, including host computers, slave computers, and boards; host computers, slave computers, and programmable logic controllers (PLCs); and both. Different control system architectures have different control principles and core components, resulting in different process editing and execution methods, and varying stability and ease of use.

[0024] Referring to the structural diagram of the process control system of the relevant semiconductor equipment as shown in Figure 1, the currently commonly used process control system architecture of semiconductor equipment includes a host computer, a slave computer and a PLC. The host computer serves as a human-computer interaction interface and is responsible for process compilation and sending the compiled process instructions to the slave computer, and monitoring the process status during the process flow; the slave computer serves as the core of the entire control system and is responsible for receiving and processing the process instructions from the host computer and the various sensor signals transmitted from the PLC, controlling the operation of the entire process, transmitting the process status information back to the host computer, and transmitting the control instructions to the PLC; the PLC is responsible for receiving and simply processing the various sensor signals and transmitting them to the slave computer, and sending the control instructions from the slave computer to the actuator after simple processing; the sensors and actuators are responsible for collecting various signals from the equipment and transmitting them to the PLC, and executing the control instructions from the PLC.

[0025] To edit and run a process within the entire system architecture, the user first edits the process on the host computer's process page. This page uses a simple graphical representation of each device's actuators, allowing the user to click on the corresponding actuator to operate it. As shown in Figure 2, the process editing page includes an icon for each semiconductor device actuator. Below the actuator icons are dialog boxes for editing the actuator's associated parameters. For example, if actuator 1 is a flowmeter, the dialog box allows you to set the flow rate value. If actuator 2 is a pneumatic valve, the dialog box allows you to set the valve's open or closed state. For example, if process step 1 requires setting the flow meter's flow rate to 1000 and the pneumatic valve to open, the user can enter "1000" under the actuator 1 icon and "Open" under the actuator 2 icon. This completes editing of process step 1. To edit the next process step, a new process editing page is inserted, using the same editing method as above. If a process requires 10 process steps, 10 process editing pages need to be inserted, and the process editing is performed on the page of each process step.

[0026] In the host computer software, the format of process instruction data is typically as follows: each process action instruction is structured as a structure. For example, a temperature control instruction would define the device's temperature range lengths, the set temperature for each temperature range, and other data. Each process action corresponds to a structure. The data for each process step is composed of all the structure data. After the process is edited, the host computer integrates all the process step data into a complete process file and sends it to the slave computer. The slave computer software then parses this process file and executes the process step by step, completing the process.

[0027] Process files are typically organized into steps, with each step containing structured data for all process actions. This makes the entire process file extremely large, requiring significant memory space. Furthermore, even if a process step only performs a single action, the lower computer must parse and execute all structured data. This process requires repetitive execution and unnecessary data parsing, reducing parsing efficiency and creating a significant amount of redundant operations.

[0028] Based on the above, it can be seen that the process control system of related semiconductor equipment still has the following shortcomings:

[0029] Disadvantage 1: The core of controlling the process operation is the lower computer, which is generally an industrial control computer. Its operation stability is lower than that of PLC, and occasional crashes may occur, causing the process to stop and the product to be scrapped, resulting in economic losses to customers.

[0030] Disadvantage 2: Using a lower computer as the control core requires data interaction with the upper computer and with the PLC, which increases the complexity of the system, reduces the efficiency of information flow transmission, and increases the failure rate. In addition, using a lower computer will increase the cost of the system.

[0031] Disadvantage 3: The graphical process editing page has many redundant elements. When a process step only requires operation on one or two actuators, the process editing page will still display all the actuators, which requires a high level of user proficiency. When the number of semiconductor equipment actuators is large, the screen size is limited, resulting in dense and messy icon arrangement, which can easily lead to misoperation.

[0032] To improve the above-mentioned problems, the embodiments of the present disclosure provide a process control method, host computer, controller, and system for semiconductor equipment. The embodiments of the present disclosure are described in detail below.

[0033] This embodiment provides a process control method for semiconductor equipment, which can be applied to a host computer. Referring to the process control method flow chart of semiconductor equipment shown in FIG3 , the method mainly includes the following steps S302 to S304:

[0034] Step S302: Obtain the process file required to control the semiconductor device to complete the preset process flow.

[0035] The process file is generated based on the received process configuration parameters, and includes multiple process instructions corresponding to all process actions for completing a preset process flow, with each process instruction corresponding to one process action.

[0036] The process file may be generated based on the process configuration parameters currently input by the user, or it may be a process file pre-generated based on received process configuration parameters and stored in the host computer. When the host computer receives the process configuration parameters input by the user, it generates the process file required to control the semiconductor device to complete the preset process flow based on the process configuration parameters.

[0037] The host computer includes a process editing page, where a user enters process configuration parameters for process editing. In one embodiment, the process configuration parameters may be all process parameters controlling the process action or a portion of editable process parameters. Based on the user-entered process configuration parameters and a pre-set process instruction data format, all process instructions required to control the semiconductor device to complete a preset process flow are generated. A process file is generated based on the combination of all process instructions and stored in the host computer.

[0038] In step S304, when the process starts, the process file is sent to the controller so that the controller parses the process instructions one by one and controls the corresponding semiconductor equipment to perform corresponding process actions based on the process parameters in the process instructions.

[0039] When the control software in the host computer is activated, it sends the currently generated or pre-saved process file to the controller. The controller, which can be a programmable logic controller (PLC), sends control signals to the semiconductor device to control the device's process operations.

[0040] The controller receives and saves the process file. When it receives the process start instruction sent by the host computer, the controller parses the process instructions in the process file one by one to control the semiconductor equipment to complete the process actions corresponding to each process instruction in sequence.

[0041] This embodiment uses a single process instruction as the smallest unit in the process file, which greatly reduces the amount of data in the process file and the memory occupied by the process file compared to related process files that use steps as units. By corresponding each process instruction in the process file to a process action, there are no duplicate instructions between process instructions. The controller can parse and control the semiconductor equipment to execute process actions one by one, thereby improving the convenience of instruction parsing and execution and at the same time improving process control efficiency.

[0042] The process control method for the semiconductor device provided in this embodiment can control the semiconductor device to complete the entire preset process flow by directly sending the process file generated by the upper computer to the controller, and allowing the controller to parse the process instructions in the process file one by one, and control the corresponding semiconductor device to perform the corresponding process actions based on the process parameters in the process instructions. This realizes that the controller is the core of controlling the process operation, avoids the situation where the process is stopped and the product is scrapped due to the poor stability of the lower computer, and improves the reliability of the process operation control; by deleting the lower computer device, the system architecture of the semiconductor device control system is simplified, and the upper computer can directly exchange information with the controller, thereby improving the information transmission efficiency of the system, reducing the failure rate, saving equipment costs, and improving the stability of the control process operation.

[0043] In one embodiment, in order to improve the convenience of editing process files, this embodiment provides two methods for generating process files, which can be specifically implemented with reference to the following implementation methods 1 and 2:

[0044] Implementation method one:

[0045] The process file generation steps provided in this embodiment mainly include the following steps (1) to (2):

[0046] Step (1): Receive process configuration parameters.

[0047] The process configuration parameters include the instruction name and the corresponding process parameters. The host computer may include a process editing page, where the user can enter the process parameters corresponding to each instruction name. For example, the user can sequentially enter the switch status of each valve in a valve control instruction, or sequentially enter the robot arm's movement direction, movement distance, and rotation angle in a robot arm control instruction.

[0048] In order to avoid the situation where there are a large number of executable icons in the relevant process editing page, the number of editable process parameters (i.e., setting parameters) corresponding to each instruction name in the process editing page provided in this embodiment can be set by the user. The user can delete the process parameters that do not usually need to be edited in the process editing page, and retain the process parameters that need to be set in each process editing. The user enters the process parameter setting value corresponding to each instruction name in the dialog box, and the host computer can obtain the process configuration parameters entered by the user.

[0049] Step (2): Based on the instruction name, the process parameters corresponding to the instruction name and the preset instruction format, multiple process instructions corresponding to all process actions that complete the preset process flow are generated to obtain a process file.

[0050] After receiving the process parameters corresponding to each instruction name input by the user, a process instruction is generated for each instruction name and its corresponding process parameter. Each instruction name corresponds to a process action. The process instructions are sorted in the order of their process actions to obtain a process file that enables the semiconductor equipment to complete all process actions of the preset process flow in sequence.

[0051] The process instructions described above include an instruction number, an instruction ID, and multiple process parameters. In one embodiment, each instruction name corresponds to an instruction ID, and a table of correspondences between instruction names and instruction IDs is stored in the host computer and controller. Upon receiving process configuration parameters input by the user, the instruction name is converted into an instruction ID to facilitate recognition of the instruction ID by the controller. Specifically, the instruction name (and the corresponding process parameters) is converted into a process instruction in a pre-set instruction format: [instruction number, instruction ID, multiple process parameters].

[0052] By converting the instruction name input by the user and the process parameters corresponding to the instruction name into a process instruction in a preset instruction format, the instruction name and the process parameters can be distributed regularly, so that the controller can quickly parse each process instruction in the process file, thereby improving the accuracy and efficiency of the process file parsing.

[0053] In a specific embodiment, the parameters of each process instruction can be presented in the form of a matrix or array (such as a DINT array). To facilitate the controller to parse the process file, the process instruction can be presented in the form of: [parameter 1, parameter 2, parameter 3, ... parameter N]. If a process flow consists of M process instructions, the process file that completes the process flow is an array or matrix with M rows and N columns.

[0054] Among them, parameter 1 is the instruction number, which is the instruction sequence number of this process instruction in the entire process file.

[0055] Parameter 2 is the instruction ID, which indicates the meaning of the process instruction. Different instruction IDs have different meanings. For example, 1 indicates a valve-open instruction, while 2 indicates a valve-close instruction. The host computer and controller (e.g., a PLC) may store a table of instruction ID meanings, which includes the meanings corresponding to each instruction ID.

[0056] Parameters 3 through N are the process parameters corresponding to the process action. Parameters 3 through N are the process-related parameter values ​​for this instruction. The number of parameters depends on the number of parameters used in the instruction. For example, in a servo motor control instruction, Parameter 3 is the target position, and Parameter 4 is the speed. In a valve control instruction, Parameter 3 is the name of the first valve, Parameter 4 is the switch status of the first valve, Parameter 5 is the name of the second valve, and Parameter 6 is the switch status of the second valve. Because each process action may use a different number of process parameters, to simplify the format of all process instructions, the length of each instruction is set to N, and unused parameters are set to 0.

[0057] In a specific embodiment, in order to facilitate users to edit process files, the format of each process instruction statement in the process editing page of the host computer can be: instruction name (parameter 3, parameter 4,... parameter N), the instruction name indicates the meaning of the instruction statement, such as it can be expressed in English letters or numbers, the instruction name and the parameter 2 in the above-mentioned preset instruction format have a one-to-one mapping relationship, the user can enter the setting parameters corresponding to different instruction names by changing the instruction name, and parameters M3 to MN correspond one-to-one to parameters 3 to N in the above-mentioned preset instruction format.

[0058] The process file format displayed on the process editing page above is: Instruction name 1 (parameter 13, parameter 14, ... parameter 1N) Instruction name 2 (parameter 23, parameter 24, ... parameter 2N) … Instruction name M (parameter M3, parameter M4, ... parameter MN)

[0059] After the user enters the parameter setting value corresponding to each instruction name on the process editing page, the host computer converts the parameter setting value corresponding to each instruction name into multiple process instructions in a preset instruction format. During the conversion process, parameter 1 and parameter 2 (i.e., the first two parameters of each process instruction) will be automatically filled in. These multiple process instructions constitute the process file required to complete all process actions of the preset process flow. The process file generated by the host computer based on the multiple process instructions in the preset instruction format is a matrix or array with M rows and N columns.

[0060] Implementation Method 2: Considering that the manufacturing process of semiconductor equipment is often relatively fixed, for example, the manufacturing process of a certain device can be roughly divided into five major process steps: loading, aeration, heating, cooling, and unloading. Each process step may include several or even dozens of basic process instructions. Generally, the names and order of these process instructions are relatively fixed, and the user usually needs to set process parameters such as temperature, flow rate, and pressure. To facilitate user editing of process files, the host computer provided in this embodiment includes multiple process packaging modules. The steps for generating process files provided in this embodiment can be performed by referring to the following steps 1) to 2):

[0061] Step 1): Receive input values ​​of editable parameters of each process packaging module.

[0062] Some of the process parameters in the above process packaging module are editable parameters.

[0063] The process packaging module includes multiple process instructions. For example, when the process packaging module includes Y process instructions, the Y process instructions include a total of Y×(N-2) process parameters. However, the process flow of semiconductor equipment is relatively fixed, and only L process parameters may need to be modified frequently. The remaining Y×(N-2)-L process parameters are fixed (can be called fixed parameters). Users do not need to set the parameter values ​​of these fixed parameters. The L parameters in the Y process instructions can be mapped to the L editable parameters of the process packaging module. Users only need to edit and modify the L editable parameters in the process module in the process editing page to complete the process editing. Modifying L process parameters is equivalent to completing Y lines of process instructions, a total of Y×(N-2) process parameters editing, which greatly improves the process editing efficiency and convenience.

[0064] For example, Y process instructions are encapsulated into a process encapsulation module. When L process parameters such as parameter 13, parameter 24,... and parameter YN in the process encapsulation module need to be modified, they are mapped to the L editable parameters of the process module to obtain the encapsulated process encapsulation module.

[0065] The editable parameters (also called interface parameters) of the encapsulated process encapsulation module can be: module name (parameter 13, parameter 24, ... parameter YN).

[0066] Step 2): Based on the input values ​​of the editable parameters and the fixed parameter information in the process packaging module, multiple process instructions corresponding to all process actions of the preset process flow are generated to obtain a process file.

[0067] The process package module includes multiple process instructions corresponding to all process actions required to complete a target process step. The process instructions include all process parameters required to complete the process actions. The target process step is a process step in a preset process flow. The fixed parameter information includes fixed parameter names and corresponding parameter values. The process package module also includes fixed parameter information that does not require user editing.

[0068] The parameter values ​​of the other Y×(N-2)-L fixed parameters in the process packaging module are pre-set, and the editable parameters are used as interface parameters for users to set freely. Users only need to set the editable parameters of each process packaging module to complete process editing.

[0069] By encapsulating a series of fixed process instructions within each process step into a module, users no longer need to add the process instructions corresponding to each process action in each process step when editing the process file. Instead, they simply set the process parameters to be modified within the process module. Compared to the related art of setting parameters for each actuator, this greatly simplifies process editing, improving both efficiency and convenience.

[0070] In one embodiment, to ensure the smooth execution of the process flow, the process instructions in the process encapsulation module provided in this embodiment are sorted according to the process action sequence of the target process step. Since the process actions in a process are typically performed in a fixed order, the process instructions corresponding to the instruction names in the process encapsulation module need to be sorted according to the execution order of the process actions.

[0071] For example, the preset process flow of a certain device can be roughly divided into five major process steps: loading, inflation, heating, cooling, and unloading. Each process step may contain several or dozens of process instructions. If each process step is encapsulated into a process packaging module, then the preset process flow includes five process packaging modules. The several or dozens of process instructions in each process packaging module need to be sorted according to the process action sequence in the process step to ensure the accuracy of the process flow sequence and avoid errors in the process action sequence execution of semiconductor equipment due to disordered process instruction sequence.

[0072] In one embodiment, in order to improve the security of process control, the information included in the process packaging module provided in this embodiment is stored in an encrypted file under a designated storage path of the host computer.

[0073] To facilitate information storage, the encrypted file can be in .txt format. The host computer can access the encrypted file containing the process package module from the process editing page. By storing all encapsulated process package modules in an encrypted file, users cannot directly view or modify process instructions, thus protecting the process instructions and improving the security of semiconductor equipment process control.

[0074] In one embodiment, in order to facilitate the calling of each process packaging module, the encrypted document provided in this embodiment includes the module start flag, module name, editable parameter name, process instruction statement start flag, process instruction, process instruction statement end flag and module end flag corresponding to each process packaging module.

[0075] Assume that an encrypted document contains a total of Z process modules, and parameters 1 to L are editable parameters. The contents of the encrypted document may include: Module start flag module name 1 (parameter 1, parameter 2, ... parameter L) Process instruction statement start flag Instruction name 1 (parameter 13, parameter 14, ... parameter 1N) Instruction name 2 (parameter 23, parameter 24, ... parameter 2N) … Instruction name M (parameter M3, parameter M4, ... parameter MN) Process instruction statement end flag Module end flag … Module start flag module name Z (parameter 1, parameter 2, ... parameter L) Process instruction statement start flag Instruction name (parameter name 1, parameter 4, ... parameter N) Instruction name (parameter 3, parameter name 2, ... parameter N) … Instruction name (parameter 3, parameter 4, ... parameter name X) Process instruction statement end flag Module end flag

[0076] This file can store all the process encapsulation modules required to execute the preset process flow. Each process encapsulation module has a module start flag at its head, marking the beginning of the module. Following the module start flag are the module name and editable parameter names. These editable parameter names can be represented using predefined characters (such as English letters) to facilitate user identification of their functional meanings when loading the host software. The corresponding editable parameter positions in the process instruction statements can also be represented using these predefined characters. The process instruction statements also have corresponding start and stop flags at their beginning and end (i.e., the process instruction statement start flag and the process instruction statement end flag), marking the start and end of the process instruction statements within the process module. A module end flag is set at the end of the process encapsulation module, marking the end of the process encapsulation module. Different process encapsulation modules are distinguished by the start and end flags.

[0077] By encapsulating multiple process instructions of a certain process step into a process packaging module and combining it with the process editing page, the convenience and reliability of the process editing operation are improved. Moreover, since the process packaging module only opens a few editable parameters to the user, the meaning of each parameter is clear, and the user's operating proficiency requirements are low, avoiding the problem of too many execution icons and easy misoperation in related technologies.

[0078] In one embodiment, in order to facilitate the user to perform process editing operations, the process file generation step provided in this embodiment also includes the following steps a and b:

[0079] Step a: When a process editing instruction is received, the encrypted document is called and a process editing page is displayed based on the encrypted document; wherein the process editing page includes the name of each process packaging module.

[0080] When the user opens the process editing page of the host computer, the host computer confirms that it has received the process editing instruction input by the user, calls the encrypted document under the specified storage path, and displays the process editing page. The process editing page can retrieve the module name of each process packaging module in the encrypted document and the editable parameter name corresponding to each process packaging module.

[0081] Step b: When module selection information is received, the module name and editable parameter name of the target process package module corresponding to the module selection information are displayed based on the encrypted document, so as to wait for receiving input values ​​of the editable parameters corresponding to the editable parameter names.

[0082] Refer to the schematic diagram of the process editing page in the upper computer as shown in Figure 4. The process editing page may include a module editing bar and an operation bar. The operation bar can operate the process module. For example, after the user clicks "New", the module editing bar on the left displays the module row. The module row consists of a module name column and a parameter value column. The module name column is equipped with a drop-down menu. The user can select the process packaging module as needed. The optional module name in the drop-down menu is obtained by the upper computer calling the encrypted document. The process packaging modules saved in the encrypted document can be selected in the drop-down menu.

[0083] When the user selects a process packaging module in the drop-down menu, the module selection information entered by the user is confirmed to have been received, and the process packaging module selected by the user is used as the target process packaging module. The module name column displays the module name of the target process packaging module, and the parameter value column displays the editable parameter name corresponding to the target process packaging module. By displaying each process packaging module and its corresponding editable parameters on the process editing page, the user can edit each editable parameter on the process editing page, making the process editing process simpler and more convenient, improving the operational convenience of process editing, and improving process editing efficiency.

[0084] As shown in Figure 4, users can modify the values ​​of each editable parameter by clicking on the parameter value column. The user-entered editable parameter setting value is used as the process configuration parameter. When the user completes the editing and clicks Save, multiple process instructions are generated based on the process configuration parameters entered by the user in each target process package module, and the corresponding process file is generated.

[0085] Users can click the Insert button in the operation bar to add a new process package module. If you have a reused process package module, you can also select the process package module row and click Copy, insert a new module row, and click Paste. After completing the process editing, the user clicks Save As. The host computer software will save the edited process file to the specified path. To modify an edited process file, the user can click the Open button to open the saved process file in the specified path and make modifications in the module editing bar. To start the process, the user loads the process file in the specified path and runs it.

[0086] The process control method for the semiconductor device provided in this embodiment makes the process editing process simpler and more convenient by setting the process instruction format and editing method, and can encapsulate different process instructions into process modules, making process editing convenient and more flexible. By storing the process modules in encrypted documents, the confidentiality of the basic process instruction statements can be achieved, which is beneficial to protecting the company's intellectual property rights.

[0087] Corresponding to the process control method for semiconductor devices provided in the above embodiment, this embodiment provides another process control method for semiconductor devices, which is applied to a controller. Referring to the flow chart of another process control method for semiconductor devices shown in FIG5 , the method mainly includes the following steps S502 to S504:

[0088] Step S502: Receive the process file sent by the host computer for controlling the semiconductor device to complete the preset process flow.

[0089] The above process file is generated by the host computer based on the received process configuration parameters. The process file includes multiple process instructions corresponding to all process actions to complete the preset process flow, and each process instruction corresponds to a process action.

[0090] The controller is used to control the semiconductor equipment to execute all process actions of the preset process flow based on the process file. The controller can be a programmable logic controller (PLC). The controller receives and stores the process file sent by the host computer.

[0091] Step S504: When the start operation instruction sent by the host computer is received, the process instructions are parsed one by one, and the corresponding semiconductor equipment is controlled to perform corresponding process actions based on the process parameters in the process instructions.

[0092] When the controller receives the start-up instruction sent by the host computer, it starts to control the semiconductor equipment to perform process actions based on the process file, and parses each process instruction in the process file one by one. The process parameters in the process instruction include the execution component and the corresponding control instruction. The controller sends the control instruction to the corresponding execution component to control the corresponding semiconductor equipment to perform the corresponding process action.

[0093] The process control method for the semiconductor device provided in this embodiment uses a controller to parse process instructions in a process file and controls the semiconductor device to execute corresponding process actions, thereby realizing a controller-based process operation control core, avoiding situations where the process is stopped and the product is scrapped due to poor stability of a lower computer, and improving the reliability of process operation control. Eliminating the need for a lower computer simplifies the system architecture of the semiconductor device control system, and the upper computer can directly exchange information with the controller, thereby improving the information transmission efficiency of the semiconductor device process control system, reducing the occurrence of failures, saving equipment costs, and improving the stability of the process control system.

[0094] In one embodiment, the process instructions include an instruction sequence number, an instruction ID, and multiple process parameters; the process file includes a matrix or array of multiple process instructions, with each row of the matrix or array corresponding to a process instruction. By structuring the process instructions in the process file in a matrix or array format, the amount of data in the process file can be reduced, preventing the process file from occupying too much memory and affecting the normal operation of the controller. It also prevents data from being misordered when the host computer transmits the process file to the controller, which could affect the process flow. The neat arrangement of data in the matrix or array format also facilitates the controller's parsing of the process file.

[0095] In one embodiment, the process file may be a matrix or array consisting of multiple process instructions, where each row of the matrix or array corresponds to a process instruction. The process file is a matrix with M rows and N columns:

[0096]

[0097] Alternatively, the recipe file is an array of M rows and N columns: [parameter 11, parameter 12, parameter 13, ... parameter 1N] [Parameter 21, Parameter 22, Parameter 23, ... Parameter 2N] … … [parameter M1, parameter M2, parameter M3, ... parameter MN]

[0098] Parameter 11 to parameter M1 are the instruction numbers, parameter 12 to parameter M2 are the instruction IDs, and the other parameters are process parameters.

[0099] In one embodiment, to improve the reliability of process flow control, this embodiment provides an implementation method for parsing process instructions one by one and controlling the corresponding semiconductor equipment to perform corresponding process actions based on the process parameters in the process instructions. Specifically, the implementation can refer to the following steps 1 to 3:

[0100] Step 1: determine the instruction name corresponding to the instruction ID of each line of process instruction in the process file one by one.

[0101] The controller stores a correspondence table between instruction names and instruction IDs, and determines the instruction type of each process instruction one by one. For example, a CASE statement can be used to determine the instruction type corresponding to the instruction ID.

[0102] Step 2: Based on the instruction name of each process instruction, determine the process control instruction corresponding to the process parameter in the process instruction and the target equipment component in the semiconductor process equipment that executes the process control instruction.

[0103] The process parameters (the third through Nth process parameters) in the aforementioned process instructions are typically arranged in the format of first actuator, first control instruction, second actuator, second control instruction, and so on. Each actuator name is followed by the corresponding process control instruction. The actuator types and order associated with each instruction name vary, but the actuator names and order within each instruction name are fixed. For example, the third through Nth process parameters for a valve instruction are arranged as follows: first valve, first valve open / close state, second valve, second valve open / close state, and so on. Based on the third through Nth process parameters, the controller determines the target equipment components and corresponding process control instructions included in each process instruction.

[0104] Step three: Send the process control instructions corresponding to each process instruction to the corresponding target device components in turn to control the corresponding semiconductor device to perform the corresponding process action until all process instructions in the process file are executed.

[0105] The controller sequentially obtains the process control instructions corresponding to each process instruction, and sends the process control instructions to the corresponding target equipment components in sequence according to the order of the process control instructions in each process instruction, thereby controlling the semiconductor equipment to execute the process actions corresponding to the preset process flow until all process instructions in the process file are executed.

[0106] In one embodiment, referring to the flowchart of the controller parsing process instructions as shown in FIG6 , when the process starts running, the controller starts parsing from the first line of process instructions in the process file, obtains the second parameter (parameter X2, i.e., instruction ID) in the process instruction on line X, and uses a CASE statement to determine the instruction type of the process instruction on line X.

[0107] The controller calls the 3rd to Nth process parameters in the process instruction on line X, starts executing the process action corresponding to the process instruction, and waits for the process action to be completed.

[0108] Determine whether the process instruction on line X has been executed. If so, set X = X + 1 and return to the step of obtaining the second parameter in the process instruction on line X to start parsing and executing the next process instruction. This continues until the second parameter (i.e., instruction ID) of the process instruction on line X is 0. This indicates that all process instructions in the process file have been executed and the process is terminated.

[0109] In one embodiment, in order to facilitate the monitoring of process progress, the method provided in this embodiment also includes: during the process of parsing the process instructions in the process file, the instruction sequence number of the process instruction being parsed or the process action being executed is fed back to the host computer, so that the host computer can display the execution progress of the process file.

[0110] After the process starts running, the controller immediately parses the process instructions in the process file and sends the instruction serial number of the process instruction being parsed or the name of the process action being executed to the host computer. The host computer immediately displays the instruction serial number of the process instruction being parsed by the controller or the process action being executed by the semiconductor equipment. The user can observe the current process progress through the host computer so that the user can obtain the process progress in real time, which improves the user experience.

[0111] The process control method for the semiconductor device provided in this embodiment uses a controller as the process control core, thereby improving the stability of the control system, avoiding system crashes, and saving equipment costs compared to related industrial computers based on Windows or Linux operating systems. Furthermore, by feeding back the instruction sequence number to the host computer during process operation, it is convenient for users to observe the current process progress.

[0112] Based on the above embodiment, this embodiment provides an example of applying the above semiconductor device process control method to edit and control the process of a semiconductor device. Referring to the semiconductor device process editing and control flow chart shown in FIG7 , the specific steps can be performed as follows:

[0113] Step 1: Formulate a preset instruction format for the process instruction based on the process requirements and the functions of the semiconductor equipment.

[0114] Step 2: Encapsulate the process instructions in the preset instruction format into a process encapsulation module according to the preset process flow, and save the process encapsulation module data in an encrypted document under the specified storage path of the host computer.

[0115] Step 3: When the user edits the process on the process editing page, the process editing page of the host computer calls the process packaging module encapsulated in the encrypted document to edit the process. After the process editing is completed, the process file is saved in the host computer.

[0116] Step 4: When the process file saved in the host computer is opened, confirm that the process starts running.

[0117] Step 5: The host computer sends the process file to the PLC and sends a start-up instruction to the PLC.

[0118] Step 6: When the PLC receives the process file and the start-up instruction, it begins to parse the process instructions in the process file one by one, and controls the corresponding semiconductor equipment to perform corresponding process actions based on the process parameters in the process instructions, until all process instructions in the process file are executed and the process ends.

[0119] Corresponding to the process control method for semiconductor devices provided in the above-mentioned embodiments, this embodiment provides a host computer comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor; when the computer program is executed by the processor, the process control method for semiconductor devices provided in the above-mentioned embodiments is implemented.

[0120] Corresponding to the process control method for another semiconductor device provided in the above embodiment, this embodiment provides a controller comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor; when the computer program is executed by the processor, the process control method for another semiconductor device provided in the above embodiment is implemented.

[0121] Corresponding to the host computer and controller provided in the above embodiments, an embodiment of the present disclosure provides a process control system for a semiconductor device, which includes: the host computer and controller provided in the above embodiments.

[0122] Referring to the structural diagram of the process control system of the semiconductor equipment shown in Figure 8, the process control system of the above-mentioned semiconductor equipment includes a host computer and a controller. The host computer serves as a human-computer interaction interface, is responsible for process compilation and sending the compiled process instructions to the controller, and monitoring the process status during the process flow; the controller is the core of the entire control system, responsible for receiving and processing the process instructions and various sensor signals from the host computer, controlling the operation of the entire process, transmitting the execution status information back to the host computer, and sending the control instructions to the actuators of each semiconductor device; the sensors and actuators are responsible for collecting various signals from the equipment and transmitting them to the controller, and executing the control instructions from the controller.

[0123] The system provided in this embodiment has the same implementation principle and technical effects as those of the aforementioned embodiments. For the sake of brief description, for matters not mentioned in the system embodiment, reference can be made to the corresponding content in the aforementioned method embodiment.

[0124] An embodiment of the present disclosure provides a computer-readable medium, wherein the computer-readable medium stores computer-executable instructions. When the computer-executable instructions are called and executed by a processor, the computer-executable instructions cause the processor to implement the method described in the above embodiment.

[0125] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working process of the system described above can refer to the corresponding process in the aforementioned embodiment and will not be repeated here.

[0126] The semiconductor device process control method, host computer, controller, and system computer program product provided in the embodiments of the present disclosure include a computer-readable storage medium storing program code. The program code includes instructions that can be used to execute the methods described in the previous method embodiments. The specific implementation can be found in the method embodiments and will not be described in detail here.

[0127] Furthermore, in the description of the embodiments of the present disclosure, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in the present disclosure based on the specific circumstances.

[0128] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present disclosure, or the portion that contributes to the existing technology, or the portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions for causing a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present disclosure. The aforementioned storage medium includes: USB flash drives, mobile hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0129] In the description of this disclosure, it should be noted that terms such as "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" indicate positions or locations based on those shown in the accompanying drawings. These terms are intended solely to facilitate and simplify the description of this disclosure and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific manner. Therefore, they should not be construed as limitations on this disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0130] Finally, it should be noted that the above-described embodiments are merely specific implementations of the present disclosure, intended to illustrate the technical solutions of the present disclosure, rather than to limit them. The scope of protection of the present disclosure is not limited thereto. Although the present disclosure has been described in detail with reference to the above-described embodiments, those skilled in the art should understand that any person skilled in the art can, within the technical scope of the present disclosure, modify or readily conceive of variations to the technical solutions described in the above-described embodiments, or substitute equivalent features for some of the technical features. Such modifications, variations, or substitutions do not deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure and are therefore encompassed by the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure shall be based on the scope of protection of the claims.

Claims

1. A process control method for a semiconductor device, wherein, A process control method for a semiconductor device, applied to a host computer, includes: acquiring a process file required to control the semiconductor device to complete a preset process flow; wherein the process file generation step includes: receiving an input value of an editable parameter of each process packaging module, wherein some process parameters in the process packaging module are editable parameters; the information included in the process packaging module is stored in an encrypted document under a specified storage path of the host computer; and generating multiple process instructions corresponding to all process actions to complete the preset process flow based on the input value of the editable parameter and a fixed parameter information in the process packaging module, thereby obtaining the process file; wherein the process file is pre-generated based on a received process configuration parameter, and the process file includes multiple process instructions corresponding to all process actions to complete the preset process flow, each process instruction corresponding to a process action; and when the process starts, sending the process file to a controller, so that the controller parses the process instructions one by one, and controls the corresponding semiconductor device to execute a corresponding process action based on a process parameter in the process instruction.

2. The method as described in request item 1, wherein, The process file generation steps include: receiving a process configuration parameter; wherein the process configuration parameter includes an instruction name and a process parameter corresponding to the instruction name; generating multiple process instructions corresponding to all process actions of the preset process flow based on the instruction name, the process parameter corresponding to the instruction name and the preset instruction format, thereby obtaining the process file; wherein the process instruction includes an instruction sequence number, an instruction ID and multiple process parameters.

3. The method as described in request item 1, wherein, The process packaging module includes multiple process instructions corresponding to all process actions to complete the target process step. The process instructions include all process parameters required to complete the process action. The target process step is the process step in the preset process flow.

4. The method as described in request item 3, wherein, In this process packaging module, each process instruction is ordered according to the process action sequence of the target process step.

5. The method as described in claim 4, wherein, The process document generation step further includes: when a process editing instruction is received, calling the encrypted document and displaying a process editing page based on the encrypted document; wherein the process editing page includes the name of each process packaging module; when a module selection information is received, displaying a module name and an editable parameter name of the target process packaging module corresponding to the module selection information based on the encrypted document, in order to wait for receiving an input value of the editable parameter corresponding to each editable parameter name.

6. A process control method for a semiconductor device, wherein, A process control method for a semiconductor device, applied to a controller, includes: receiving a process file sent by a host computer, which is required for the semiconductor device to complete a preset process flow; wherein the process file is generated by the host computer based on an input value of an editable parameter received from each process packaging module and a process configuration parameter in the process packaging module, the process file includes multiple process instructions corresponding to all process actions to complete the preset process flow, each process instruction corresponding to a process action; when a start-run instruction is received from the host computer, the process instructions are parsed one by one, and the corresponding semiconductor device is controlled to execute a corresponding process action based on a process parameter in the process instruction; and during the parsing of the process instructions in the process file, the instruction sequence number of the process instruction being parsed or the process action being executed is fed back to the host computer so that the host computer can display the execution progress of the process file.

7. The method as described in claim 6, wherein, The process instruction includes an instruction sequence number, an instruction ID, and multiple process parameters; the process file includes a matrix or array composed of the multiple process instructions, and each row of the matrix or array corresponds to one process instruction.

8. The method as described in request item 7, wherein, The steps of parsing the process instructions line by line and controlling the corresponding semiconductor device to perform a corresponding process action based on a process parameter in the process instructions include: determining the instruction name corresponding to the instruction ID of each process instruction in the process file; determining the process control instruction corresponding to the process parameter in the process instruction and the target device component in the semiconductor process equipment that executes the process control instruction based on the instruction name of each process instruction; and sequentially sending the process control instruction corresponding to each process instruction to the corresponding target device component to control the corresponding semiconductor device to perform the corresponding process action, until all process instructions in the process file have been executed.

9. A host computer, wherein, include: A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when executed by the processor, the computer program implements a process control method for a semiconductor device as described in any one of claims 1 to 5.

10. A controller, wherein, include: A processor, a memory, and a computer program stored in the memory and executable on the processor, wherein when executed by the processor, the computer program implements the process control method for a semiconductor device as described in any one of claims 6 to 8.

11. A process control system for a semiconductor device, wherein, include: The host computer described in request item 9 and the controller described in request item 10.

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