Liquid source vaporization system

Abstract

This application provides a liquid vaporization system for use in semiconductor manufacturing equipment, comprising: a vaporization device, a liquid source pipeline, a purge pipeline, a first control unit, an output pipeline, an exhaust gas treatment pipeline, and a second control unit; the first control unit is used to selectively control the purge pipeline or the liquid source pipeline to be connected to the vaporization device; the second control unit is used to selectively control the exhaust gas treatment pipeline or the output pipeline to be connected to the vaporization device.

Description

Liquid Source Vaporization System This application relates to the field of semiconductor manufacturing, and specifically, to a liquid source vaporization system. In the process of integrated circuit manufacturing, in order to enable the silicon wafer to meet certain process characteristics, such as forming different insulating layers, dielectric layers, etc. on the surface of the silicon wafer, the silicon wafer needs to be placed in a process chamber with a certain temperature, pressure, and process gas atmosphere. In some advanced process manufacturing, some special process media need to be introduced. These process media are usually stored in a liquid state, and during the process, these liquid process media need to be converted into a gaseous form and transported into the process chamber. In the prior art, in the transportation process with relatively high accuracy and stability in fluid flow control, there are usually two different ways to convert the liquid state of the above-mentioned process media into a gaseous state, namely, the vapor pressure difference control method and the liquid phase direct control method. The vapor pressure difference control method, also known as the baking method, is a method that uses the pressure difference between the vapor pressure of the liquid material and the process chamber pressure and a gas mass flow meter to control the conversion of the liquid state of the process media into a gaseous state. However, since the vapor pressure difference control method vaporizes the liquid in the container by heating it to the saturated vapor pressure, and the pressure after vaporization is low, it is required that the process chamber be in a vacuum environment to meet the transmission requirements. Moreover, the amount of gas after vaporization is relatively small, and it cannot meet the large demand flow of the process gas. In addition, since the gas mass flow meter is installed on the outlet pipeline, the measured gas temperature is relatively high. Due to the limited temperature resistance of the gas mass flow meter, when the baking temperature is too high, it cannot meet the measurement requirements, so the applicable liquid range is limited. In addition, the container volume and mass of the baking device for baking the liquid medium are relatively large, generally placed at the bottom position of the equipment. The distance from the baking device to the process chamber is relatively long, and temperature management is required for the pipelines and devices during transmission. In case of cold spots, the vaporized gas will re-liquefy into a liquid. The liquid phase direct control method, also known as the direct vaporization method, is a method that uses a liquid mass flow meter and a vaporizer to vaporize the process media to convert the liquid state of the process media into a gaseous state. It mainly uses a vaporizer. By introducing a carrier gas into the vaporizer, the liquid process media is atomized by the carrier gas and then sprayed into the vaporization chamber. The outside of the vaporization chamber is heated as a whole, and the atomized process media is vaporized through the heat radiation emitted by the heating of the vaporization chamber. The liquid spray that has not been completely vaporized is completely vaporized through the heat conduction generated by contacting the inner wall of the vaporization chamber and then output. Although the above methods can solve many problems of the vapor pressure difference control method, however, new problems will still exist. Since a carrier gas is required to atomize the liquid process media, and there will be residual liquid process media in the pipeline after each use, which affects the next use. Therefore, how to clean the residual process media in the pipeline is an urgent problem to be solved in this field. This application aims to solve at least one of the technical problems existing in the prior art, and provides a liquid source vaporization system, which can solve the problem that there is residual liquid process medium in the pipeline after each use in the prior art. To achieve the purpose of this application, a liquid source vaporization system is provided, which is applied to semiconductor process equipment and includes: A vaporization device for vaporizing a liquid process medium into a gaseous process medium; A liquid source pipeline for supplying the liquid process medium to the vaporization device; A purge pipeline for supplying purge gas to the vaporization device; A first control unit for selectively controlling the connection of the purge pipeline or the liquid source pipeline to the vaporization device; An output pipeline for delivering the vaporized gaseous process medium to the process chamber of the semiconductor process equipment; An exhaust gas treatment pipeline for delivering the pollutants blown out of the vaporization device by the purge gas to an exhaust gas treatment device; A second control unit for selectively controlling the connection of the exhaust gas treatment pipeline or the output pipeline to the vaporization device. In some embodiments, the liquid source vaporization system has a working state and a first cleaning state; In the working state, the first control unit controls the connection of the liquid source pipeline to the vaporization device, and the second control unit controls the connection of the output pipeline to the vaporization device; In the first cleaning state, the first control unit controls the connection of the purge pipeline to the vaporization device, and the second control unit controls the connection of the exhaust gas treatment pipeline to the vaporization device. In some embodiments, the vaporization device includes: A vaporizer having a vaporization chamber for vaporizing the liquid process medium; An inlet liquid pipeline, the outlet end of which is connected to the vaporization chamber, and the inlet end of which is respectively connected to the outlet end of the liquid source pipeline and the outlet end of the purge pipeline; An outlet gas pipeline, the inlet end of which is connected to the vaporization chamber, and the outlet end of which is respectively connected to the inlet end of the output pipeline and the inlet end of the exhaust gas treatment pipeline. In some embodiments, the liquid source vaporization system has a working state and a first cleaning state; In the working state, the first control unit controls the connection of the liquid source pipeline to the inlet liquid pipeline, and the second control unit controls the connection of the output pipeline to the outlet gas pipeline; In the first cleaning state, the first control unit controls the connection of the purge pipeline to the inlet liquid pipeline, and the second control unit controls the connection of the exhaust gas treatment pipeline to the outlet gas pipeline. In some embodiments, the first control unit includes: A first control valve, which is arranged on the liquid source pipeline and is used to control the on-off of the liquid source pipeline; A second control valve, which is arranged on the purge pipeline and is used to control the on-off of the purge pipeline; and The second control unit includes: A third control valve, which is arranged on the output pipeline and is used to control the on-off of the output pipeline; A fourth control valve, which is arranged on the tail gas treatment pipeline and is used to control the on-off of the tail gas treatment pipeline. In some embodiments, the vaporization device further includes: A carrier gas pipeline, the inlet end of which is used to communicate with a carrier gas source, and the outlet end of which communicates with the vaporization chamber; A carrier gas control valve, which is arranged on the carrier gas pipeline and is used to control the on-off of the carrier gas pipeline. In some embodiments, in the working state, the carrier gas control valve is opened; In the first cleaning state, the carrier gas control valve is closed. In some embodiments, the liquid source vaporization system further has a second cleaning state; In the second cleaning state, the first control unit controls the purge pipeline to communicate with the liquid inlet pipeline, the second control unit controls the gas outlet pipeline to communicate with the tail gas treatment pipeline, and the carrier gas control valve is opened. In some embodiments, the liquid source vaporization system further includes: A first flow meter, which is arranged on the liquid inlet pipeline and is used to control the flow rate of the liquid process medium; A first bypass pipeline, the inlet end of which communicates with the liquid inlet pipeline, the inlet end of which is located between the first flow meter and the vaporizer, and the outlet end of which communicates with the tail gas treatment pipeline; A bypass control unit, which is used to selectively control the connection between the first flow meter and the vaporization chamber or the connection between the first flow meter and the first bypass pipeline. In some embodiments, the liquid source vaporization system has a working state and a third cleaning state; In the working state, the first control unit controls the liquid source pipeline to communicate with the liquid inlet pipeline, the bypass control unit controls the first flow meter to communicate with the vaporization chamber, and the second control unit controls the output pipeline to communicate with the gas outlet pipeline; In this third cleaning state, the first control unit controls the purging pipeline to communicate with the liquid inlet pipeline, and the bypass control unit controls the first flow meter to communicate with the first bypass pipeline. In some embodiments, the bypass control unit includes a first bypass valve and a second bypass valve. The first bypass valve is disposed on the first bypass pipeline and is used to control the on / off of the first bypass pipeline; the second bypass valve is disposed on the liquid inlet pipeline and is located between the inlet end of the first bypass pipeline and the vaporizer, and is used to control the on / off of the liquid inlet pipeline. In some embodiments, the liquid source vaporization system further includes: A first flow meter, which is disposed on the liquid inlet pipeline, and the first flow meter is used to control the flow rate of the liquid process medium; A second bypass pipeline, the inlet end of the second bypass pipeline communicates with the purging gas source, the outlet end of the second bypass pipeline communicates with the liquid inlet pipeline, and the outlet end of the second bypass pipeline is located between the first flow meter and the vaporization chamber; A fifth control valve, which is disposed on the second bypass pipeline and is used to control the on / off of the second bypass pipeline. In some embodiments, in this working state, the carrier gas control valve is opened and the fifth control valve is closed; The liquid source vaporization system further has a fourth cleaning state; In this fourth cleaning state, the first control unit controls the liquid source pipeline and the purging pipeline to be disconnected from the liquid inlet pipeline, the carrier gas control valve and the fifth control valve are opened, and the second control unit controls the exhaust gas treatment pipeline to communicate with the outlet pipeline. In some embodiments, the liquid source vaporization system further includes: A residual liquid collector, which is used to recover the remaining liquid process medium; A residual liquid recovery pipeline, the outlet end of the residual liquid recovery pipeline communicates with the residual liquid collector, and the inlet end of the residual liquid recovery pipeline communicates with the liquid inlet pipeline; A sixth control valve, which is disposed on the residual liquid recovery pipeline and is used to control the on / off of the residual liquid recovery pipeline; The vaporization device further includes: A seventh control valve, which is disposed on the liquid inlet pipeline, and the seventh control valve is located between the inlet end of the residual liquid recovery pipeline and the vaporizer, and is used to control the on / off between the vaporizer and the liquid inlet pipeline. In some embodiments, the liquid source vaporization system further includes: An exhaust pipeline, the residual liquid collector has an exhaust port, and the exhaust port communicates with the exhaust gas treatment pipeline through the exhaust pipeline; An eighth control valve, which is disposed on the exhaust pipeline and is used to control the on / off of the exhaust pipeline. In some embodiments, in this working state, the seventh control valve is open and the sixth control valve is closed; The liquid source vaporization system further has a first residual liquid recovery state. In this first residual liquid recovery state, the first control unit controls the purge pipeline to be connected to the liquid inlet pipeline, the seventh control valve is closed, and the sixth control valve and the eighth control valve are open. In some embodiments, the liquid source vaporization system further includes: A ninth control valve, which is arranged on the residual liquid recovery pipeline and is located between the sixth control valve and the outlet end of the residual liquid recovery pipeline; A purge branch, the inlet end of the purge branch is connected to a purge gas source, the outlet end of the purge branch is connected to the residual liquid recovery pipeline, and the outlet end of the purge branch is located between the ninth control valve and the sixth control valve; A tenth control valve, which is arranged on the purge branch and is used to control the on-off of the purge branch. In some embodiments, in this working state, the sixth control valve and the tenth control valve are closed, and the seventh control valve is open; The liquid source vaporization system further has a second residual liquid recovery state. In this second residual liquid recovery state, the first control unit controls the liquid source pipeline and the purge pipeline to be disconnected from the liquid inlet pipeline, the sixth control valve is closed, and the tenth control valve, the ninth control valve, and the eighth control valve are open. In some embodiments, the liquid source vaporization system further includes: An exhaust gas discharge pipeline, the inlet end of the exhaust gas discharge pipeline is connected to the residual liquid recovery pipeline, the inlet end of the exhaust gas discharge pipeline is located between the sixth control valve and the ninth control valve, and the outlet end of the exhaust gas discharge pipeline is connected to the tail gas treatment pipeline; An exhaust gas control valve, which is arranged on the exhaust gas discharge pipeline and is used to control the on-off of the exhaust gas discharge pipeline. In some embodiments, the liquid source vaporization system further has a pipeline exhaust gas discharge state; In this pipeline exhaust gas discharge state, the first control unit controls the purge pipeline to be connected to the liquid inlet pipeline, the tenth control valve, the ninth control valve, and the seventh control valve are closed; the sixth control valve and the exhaust gas control valve are open. In some embodiments, the vaporization device further includes: A carrier gas pipeline, the inlet end of the carrier gas pipeline is used to be connected to a carrier gas source, and the outlet end of the carrier gas pipeline is connected to the vaporization chamber; A carrier gas control valve, which is arranged on the carrier gas pipeline and is used to control the on-off of the carrier gas pipeline; A first flow meter, which is arranged on the liquid inlet pipeline and is used to calculate the flow rate of the liquid process medium; A second bypass pipeline, the inlet end of which is communicated with the purging gas source, the outlet end of which is communicated with the liquid inlet pipeline, and the outlet end of which is located between the first flow meter and the vaporization chamber; A fifth control valve, which is arranged on the second bypass pipeline and is used to control the on-off of the second bypass pipeline. In some embodiments, in the working state, the carrier gas control valve is opened and the fifth control valve is closed; or In the first cleaning state, the seventh control valve is opened, and the carrier gas control valve, the fifth control valve, the sixth control valve and the tenth control valve are closed; or The liquid source vaporization system further has a second cleaning state; In the second cleaning state, the first control unit controls the purging pipeline to be communicated with the liquid inlet pipeline, the fifth control valve, the sixth control valve and the tenth control valve are closed, and the seventh control valve is opened; or The liquid source vaporization system further has a fourth cleaning state; In the fourth cleaning state, the first control unit controls the liquid source pipeline and the purging pipeline to be disconnected from the liquid inlet pipeline, the tenth control valve and the sixth control valve are closed, the carrier gas control valve and the fifth control valve are opened, and the second control unit controls the tail gas treatment pipeline to be communicated with the outlet pipeline; or The liquid source vaporization system further has a first residual liquid recovery state; In the first residual liquid recovery state, the fifth control valve and the tenth control valve are closed; or In the second residual liquid recovery state, the fifth control valve and the residual gas control valve are closed; or The liquid source vaporization system further has a pipeline residual gas discharge state; In the pipeline residual gas discharge state, the first control unit controls the purging pipeline to be communicated with the liquid inlet pipeline, the fifth control valve, the tenth control valve, the ninth control valve and the seventh control valve are closed; the sixth control valve and the residual gas control valve are opened. The present application has the following beneficial effects: The liquid source vaporization system of the present application is provided with a purge pipeline, a first control unit, an exhaust gas treatment pipeline, and a second control unit. It can not only vaporize the liquid process medium through the vaporization device, but also control the connection of the purge pipeline and the exhaust gas treatment pipeline to the vaporization device respectively through the first control unit and the second control unit, introduce the purge gas into the vaporization device, clean the inside of the vaporization device through the purge gas, and blow out the residual process medium in the corresponding pipeline through which the purge gas flows, reducing the residual process medium in the pipeline and avoiding affecting the next use. In addition, due to the provision of the exhaust gas treatment pipeline, the pollutants blown out from the vaporization device by the purge gas can be transported to the exhaust gas treatment device through the exhaust gas treatment pipeline for treatment, avoiding environmental pollution by the pollutants. The following disclosure provides many different embodiments or examples for implementing different components of the present disclosure. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in one embodiment described below, a first component formed above or on a second component may include an embodiment in which the first component and the second component are formed in direct contact, and may also include an embodiment in which additional components may be formed between the first component and the second component such that the first component and the second component are not in direct contact. Additionally, the present disclosure may repeat reference numerals and / or letters in various examples. This repetition is for the purpose of simplicity and clarity and does not itself indicate a relationship between the various embodiments and / or configurations discussed. In addition, for ease of description, spatial relative terms such as "below", "beneath", "under", "above", "on", and the like may be used herein to describe the relationship of one element or component to another (other) element or component, as illustrated in the figures. The spatial relative terms are intended to encompass different orientations of the device in use or operation other than the orientation depicted in the figures. The device may be oriented in other ways (rotated 90 degrees or in other orientations) and thus the spatial relative descriptors used herein may be interpreted accordingly. Although the numerical ranges and parameters setting forth the broad scope of this disclosure are approximations, the numerical values set forth in specific examples are reported as precisely as possible. However, any numerical value inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Moreover, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean as considered by a person of ordinary skill in the art. Except in the operating / working examples, or unless otherwise expressly specified, all numerical ranges, amounts, values, and percentages such as those for the amounts of materials, duration of times, temperatures, operating conditions, ratios of amounts, and the like disclosed herein should be understood to be modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the specification and claims of this disclosure are approximations that may vary as desired. At the very least, each numerical parameter should be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one endpoint to another endpoint or between two endpoints. All ranges disclosed herein include the endpoints, unless otherwise specified. To enable those skilled in the art to better understand the technical solution of this application, the liquid source vaporization system provided by this application will be described in detail below with reference to the accompanying drawings. As shown in the first embodiment of FIG. 1, a liquid source vaporization system is disclosed, which is applied to semiconductor processing equipment. The liquid source vaporization system includes: a liquid source pipeline 10, a vaporization device 20, an output pipeline 30, a purge pipeline 40, a first control unit 50, an exhaust gas treatment unit 60, and a second control unit 70. The liquid source pipeline 10, the vaporization device 20, and the output pipeline 30 are connected in sequence. That is to say, the inlet end of the liquid source pipeline 10 is connected to the liquid source, and the outlet end of the liquid source pipeline 10 is connected to the vaporization device 20, so that the liquid source pipeline 10 can supply the liquid process medium to the vaporization device 20. After the liquid process medium enters the vaporization device 20, the vaporization device 20 vaporizes the liquid process medium into a gaseous process medium, and then, the output pipeline 30 transports the vaporized gaseous process medium to the process chamber of the semiconductor processing equipment, so as to perform the corresponding semiconductor process. In this embodiment, the inlet end of the purge pipeline 40 is connected to a purge gas source, and the outlet end of the purge pipeline 40 is connected to the vaporization device 20. The purge pipeline 40 is used to supply purge gas to the vaporization device 20; the first control unit 50 is used to selectively control the connection between the purge pipeline 40 and the vaporization device 20 or the connection between the liquid source pipeline 10 and the vaporization device 20. It is easy to understand that when the purge pipeline 40 is connected to the vaporization device 20, the purge gas provided by the purge gas source can be transported to the vaporization device 20 through the purge pipeline 40; when the liquid source pipeline 10 is connected to the vaporization device 20, the liquid process medium provided by the liquid source can be transported to the vaporization device 20 through the liquid source pipeline 10. The first control unit 50 is used to realize the switching between supplying purge gas to the vaporization device 20 and supplying liquid process medium to the vaporization device 20. The exhaust gas treatment unit 60 includes an exhaust gas treatment pipeline 62. The inlet end of the exhaust gas treatment pipeline 62 is connected to the vaporization device 20, and the outlet end of the exhaust gas treatment pipeline 62 is used to be connected to the exhaust gas treatment device 61. The exhaust gas treatment pipeline 62 is used to transport the pollutants blown out of the vaporization device 20 by the purge gas to the exhaust gas treatment device 61 to treat the pollutants through the exhaust gas treatment device 61; the second control unit 70 is used to selectively control the connection between the exhaust gas treatment pipeline 62 and the vaporization device 20 or the connection between the output pipeline 30 and the vaporization device 20. It is easy to understand that when the exhaust gas treatment pipeline 62 is connected to the vaporization device 20, the pollutants blown out of the vaporization device 20 by the purge gas can be transported to the exhaust gas treatment device 61 through the exhaust gas treatment pipeline 62; when the output pipeline 30 is connected to the vaporization device 20, the gaseous process medium vaporized by the vaporization device 20 can be transported to the process chamber through the output pipeline 30. The second control unit 70 is used to realize the switching between transporting pollutants to the exhaust gas treatment device 61 and transporting gaseous process medium to the process chamber. The liquid source vaporization system provided by the embodiment of the present application, by setting the purge pipeline 40, the first control unit 50, the exhaust gas treatment pipeline 62 and the second control unit 70, can not only vaporize the liquid process medium through the vaporization device 20, but also control the first control unit 50 and the second control unit 70 respectively to control the connection between the purge pipeline 40 and the exhaust gas treatment pipeline 62 and the vaporization device 20, introduce the purge gas into the vaporization device 20, clean the inside of the vaporization device 20 through the purge gas, and blow out the residual process medium in the corresponding pipeline through which the purge gas flows, reduce the residual process medium in the pipeline, and avoid affecting the next use. In addition, due to the setting of the exhaust gas treatment pipeline 62, the pollutants blown out of the vaporization device 20 by the purge gas can be transported to the exhaust gas treatment device 61 through the exhaust gas treatment pipeline 62 for treatment, avoiding environmental pollution by the pollutants. As shown in FIGS. 2 to 3, during use, the liquid source vaporization system has a working state and a first cleaning state. The liquid source vaporization system realizes the switching between the working state and the first cleaning state through the first control unit 50 and the second control unit 70. As shown in FIG. 2, in the working state, the first control unit 50 controls the liquid source pipeline 10 to communicate with the vaporization device 20, and the second control unit 70 controls the output pipeline 30 to communicate with the vaporization device 20. The liquid process medium enters the vaporization device 20 through the liquid source pipeline 10. The vaporization device 20 vaporizes the liquid process medium, and then transports the vaporized gaseous process medium to the process chamber of the semiconductor process equipment through the output pipeline 30, thereby performing the corresponding semiconductor process. As shown in FIG. 3, in the first cleaning state, the first control unit 50 controls the purge pipeline 40 to communicate with the vaporization device 20, and the second control unit 70 controls the exhaust gas treatment pipeline 62 to communicate with the vaporization device 20. The purge gas sequentially passes through the purge pipeline 40, the vaporization device 20, the exhaust gas treatment pipeline 62 and the exhaust gas treatment device 61. The purge gas blows out the air, moisture, particles, etc. in the pipelines it flows through. At the same time, the pollutants blown out from the vaporization device 20 by the purge gas can be transported to the exhaust gas treatment device 61 through the exhaust gas treatment pipeline 62 for treatment, avoiding environmental pollution by pollutants. It should be noted that the first cleaning state can not only clean the vaporization device 20 after the liquid source vaporization system vaporizes the liquid process medium, but also clean it before the liquid source vaporization system vaporizes the process medium, blowing out the air, moisture, particles, etc. in the pipeline or the vaporization device 20 to prepare for the process. Furthermore, in this embodiment, the vaporization device 20 includes a vaporizer 21, a liquid inlet pipeline 22, a gas outlet pipeline 23, a carrier gas pipeline 24 and a carrier gas control valve 25. The vaporizer 21 has a vaporization chamber for vaporizing the liquid process medium; the outlet end of the liquid inlet pipeline 22 is communicated with the vaporization chamber, and the inlet end of the liquid inlet pipeline 22 is respectively communicated with the outlet end of the liquid source pipeline 10 and the outlet end of the purge pipeline 40; the inlet end of the gas outlet pipeline 23 is communicated with the vaporization chamber, and the outlet end of the gas outlet pipeline 23 is respectively communicated with the inlet end of the output pipeline 30 and the inlet end of the exhaust gas treatment pipeline 62. The inlet end of the carrier gas pipeline 24 is used to communicate with the carrier gas source, and the outlet end of the carrier gas pipeline 24 is communicated with the vaporization chamber; the carrier gas control valve 25 is arranged on the carrier gas pipeline 24, and the carrier gas control valve 25 is used to control the on-off of the carrier gas pipeline 24. The exhaust gas treatment unit 60 further includes a vacuum pump. The inlet end of the exhaust gas treatment pipeline 62 is communicated with the outlet end of the gas outlet pipeline 23, the outlet end of the exhaust gas treatment pipeline 62 is communicated with the exhaust gas treatment device 61, and the vacuum pump is arranged on the exhaust gas treatment pipeline 62. The first control unit 50 includes a first control valve 51 and a second control valve 52. The first control valve 51 is arranged on the liquid source pipeline 10 and is used to control the on / off of the liquid source pipeline 10. The second control valve 52 is arranged on the purge pipeline 40 and is used to control the on / off of the purge pipeline 40. The second control unit 70 includes a third control valve 71 and a fourth control valve 72. The third control valve 71 is arranged on the output pipeline 30 and is used to control the on / off of the output pipeline 30. The fourth control valve 72 is arranged on the tail gas treatment pipeline 62 and is used to control the on / off of the tail gas treatment pipeline 62. A vacuum pump is located between the fourth control valve 72 and the tail gas treatment device 61 and is used to provide power for the gas in the tail gas treatment pipeline 62 to flow towards the tail gas treatment device 61. The liquid source vaporization system has a working state, a first cleaning state, and a second cleaning state. As shown in FIG. 2, in the working state, the first control valve 51 is open, the second control valve 52 is closed, the third control valve 71 is open, the fourth control valve 72 is closed, and the carrier gas control valve 25 is open. The liquid source pipeline 10, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium sequentially passes through the liquid source pipeline 10 and the liquid inlet pipeline 22 and enters the vaporizer 21. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then sequentially passes through the gas outlet pipeline 23 and the output pipeline 30 and enters the process chamber of the semiconductor process equipment, thereby performing the corresponding semiconductor process. As shown in FIG. 3, in the first cleaning state, the second control valve 52 is open, the first control valve 51 is closed, the fourth control valve 72 is open, the third control valve 71 is closed, and the carrier gas control valve 25 is closed. The purge gas sequentially passes through the purge pipeline 40, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the tail gas treatment pipeline 62, thereby purging the residual liquid, air, moisture, particles, etc. in the pipeline and the vaporizer 21. At the same time, the pollutants blown out from the vaporization device 20 by the purge gas enter the tail gas treatment device 61 through the tail gas treatment pipeline 62, so that the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution by the pollutants. As shown in Figure 4, in the second cleaning state, the second control valve 52 is opened, the first control valve 51 is closed, the fourth control valve 72 is opened, the third control valve 71 is closed, and the carrier gas control valve 25 is opened. The second cleaning state is mainly to drain the residual liquid and gas in the pipeline and the vaporizer 21 after the process. The purging gas sequentially passes through the purging pipeline 40, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the tail gas treatment pipeline 62. At the same time, since the carrier gas control valve 25 is opened, under the action of the carrier gas, the liquid inside the vaporizer 21 is vaporized into gas and then blown out together with the purging gas, so as to purge the residual liquid and gas in the pipeline and the vaporizer 21. At the same time, the pollutants blown out from the vaporization device 20 by the purging gas enter the tail gas treatment device 61 through the tail gas treatment pipeline 62, and the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution by the pollutants. It should be noted that, in the first embodiment above, the liquid source vaporization system further includes a first flow meter 80. The first flow meter 80 is arranged on the liquid inlet pipeline 22, and the first flow meter 80 is used to control the flow rate of the liquid process medium. It should also be noted that, in the first embodiment above, the first control unit 50 includes the first control valve 51 and the second control valve 52, but this is not restrictive. For example, in some other embodiments not shown in the figure, the first control unit 50 can also be a three-way valve. The first end of the three-way valve is connected to the liquid inlet pipeline 22, the second end of the three-way valve is connected to the liquid source pipeline 10, and the third end of the three-way valve is connected to the purging pipeline 40, so as to selectively connect the purging pipeline 40 with the liquid inlet pipeline 22 or the liquid source pipeline 10 with the liquid inlet pipeline 22 through the three-way valve. That is to say, on the premise of not violating the working principle of the present application, as long as the structure can switch between connecting the purging pipeline 40 with the liquid inlet pipeline 22 and connecting the liquid source pipeline 10 with the liquid inlet pipeline 22, it is within the protection scope of the present application. Similarly, in the first embodiment above, the second control unit 70 can also be a three-way valve, which will not be elaborated here. As shown in Figure 5 of the second embodiment of the present application, a liquid source vaporization system is also disclosed. It is basically the same as the first embodiment, except that, in this embodiment, the liquid source vaporization system further includes: a first bypass pipeline 90 and a bypass control unit 100. The inlet end of the first bypass pipeline 90 is connected to the liquid inlet pipeline 22. The inlet end of the first bypass pipeline 90 is located between the first flow meter 80 and the vaporizer 21. The outlet end of the first bypass pipeline 90 is connected to the tail gas treatment pipeline 62. Specifically, the outlet end of the first bypass pipeline 90 is connected to the tail gas treatment pipeline 62 and is located between the fourth control valve 72 and the vacuum pump. The bypass control unit 100 is used to selectively control the connection between the first flow meter 80 and the vaporization chamber or the connection between the first flow meter 80 and the first bypass pipeline 90. Among them, the bypass control unit 100 includes a first bypass valve 101 and a second bypass valve 102. The first bypass valve 101 is arranged on the first bypass pipeline 90 and is used to control the on-off of the first bypass pipeline 90. The second bypass valve 102 is arranged on the liquid inlet pipeline 22 and is located between the inlet end of the first bypass pipeline 90 and the vaporizer 21, and is used to control the on-off of the liquid inlet pipeline 22. The liquid source vaporization system has a working state and a third cleaning state. In the working state, the first control unit 50 controls the liquid source pipeline 10 to be connected to the liquid inlet pipeline 22, the bypass control unit 100 controls the first flow meter 80 to be connected to the vaporization chamber, and the second control unit 70 controls the output pipeline 30 to be connected to the gas outlet pipeline 23. Specifically, the first control valve 51 is opened, the second control valve 52 is closed; the third control valve 71 is opened, the fourth control valve 72 is closed, the second bypass valve 102 is opened, the first bypass valve 101 is closed, and the carrier gas control valve 25 is opened. In the working state, the liquid source pipeline 10, the first flow meter 80, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium passes through the liquid source pipeline 10, the first flow meter 80, and the liquid inlet pipeline 22 in sequence and enters the vaporizer 21. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then passes through the gas outlet pipeline 23 and the output pipeline 30 in sequence and enters the process chamber of the semiconductor process equipment, so as to perform the corresponding semiconductor process. As shown in FIG. 5, in the third cleaning state, the first control unit 50 controls the purge pipeline 40 to be connected to the liquid inlet pipeline 22, and the bypass control unit 100 controls the first flow meter 80 to be connected to the first bypass pipeline 90. Specifically, the second control valve 52 is opened, the first control valve 51 is closed; the first bypass valve 101 is opened, the second bypass valve 102 is closed, and the carrier gas control valve 25 is closed. Thereby, the purge pipeline 40, the first flow meter 80, the liquid inlet pipeline 22, the first bypass pipeline 90, the exhaust gas treatment pipeline 62, the vacuum pump, and the exhaust gas treatment device 61 are connected in sequence. Since the commonly used liquid process medium may have dangerous characteristics such as self-ignition, corrosion, and toxicity. When the first flow meter 80 needs to be maintained and replaced, in order to ensure the safety of personnel, sufficient purging must be carried out to prevent residues in the devices and pipelines. When the liquid source vaporization system is in the third cleaning state, the purge gas passes through the purge pipeline 40, the first flow meter 80, the liquid inlet pipeline 22, the first bypass pipeline 90, the exhaust gas treatment pipeline 62, the vacuum pump, and the exhaust gas treatment device 61 in sequence, and blows the pollutants and residual liquid therein to the exhaust gas treatment device 61, thereby ensuring the safety of the operator during the maintenance and replacement of the first flow meter 80. It should be noted that in the second embodiment above, the bypass control unit 100 includes a first bypass valve 101 and a second bypass valve 102, but this is not restrictive. For example, in some other embodiments not shown in the figure, the first control unit 50 may also be a three-way valve. The first end of the three-way valve is connected to the liquid inlet pipeline 22, the second end of the three-way valve is connected to the first bypass pipeline 90, and the third end of the three-way valve is connected to the vaporizer 21, so as to realize the connection between the liquid inlet pipeline 22 and the first bypass pipeline 90 or the connection between the liquid inlet pipeline 22 and the vaporizer 21 through the three-way valve. That is to say, on the premise of not violating the working principle of this application, as long as the structure can realize the switching between the vaporizer 21 and the first bypass pipeline 90, it is within the protection scope of this application. Embodiment 3 of the present application as shown in FIG. 6 also discloses a liquid source vaporization system, which is basically the same as Embodiment 1, except that in this embodiment, the liquid source vaporization system further includes: a second bypass pipeline 110 and a fifth control valve 120. The inlet end of the second bypass pipeline 110 is connected to the purging gas source, the outlet end of the second bypass pipeline 110 is connected to the liquid inlet pipeline 22, and the outlet end of the second bypass pipeline 110 is located between the first flow meter 80 and the vaporization chamber; the fifth control valve 120 is arranged on the second bypass pipeline 110 for controlling the on-off of the second bypass pipeline 110. The liquid source vaporization system has a working state and a fourth cleaning state. In the working state, the first control valve 51 is opened, the second control valve 52 is closed, the fifth control valve 120 is closed, the third control valve 71 is opened, the fourth control valve 72 is closed, and the carrier gas control valve 25 is opened. The liquid source pipeline 10, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium sequentially enters the vaporizer 21 through the liquid source pipeline 10 and the liquid inlet pipeline 22. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then enters the process chamber of the semiconductor process equipment through the gas outlet pipeline 23 and the output pipeline 30 in sequence, so as to perform the corresponding semiconductor process. As shown in FIG. 6, in the fourth cleaning state, the fifth control valve 120 is opened, the first control valve 51 is closed, the second control valve 52 is closed, the carrier gas control valve 25 is opened, the fourth control valve 72 is opened, and the third control valve 71 is closed. The fourth cleaning state is mainly used when the first flow meter 80 fails and cannot pass liquid. When the liquid source vaporization system is in the fourth cleaning state, the purging gas source, the second bypass pipeline 110, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, the tail gas treatment pipeline 62, the vacuum pump, and the tail gas treatment device 61 are connected in sequence. The purging gas bypasses the first flow meter 80 through the second bypass pipeline 110, and then enters the vaporizer 21 through the liquid inlet pipeline 22 in sequence. At the same time, with the assistance of the carrier gas, the vaporizer 21 vaporizes the residual liquid inside. Then, under the action of the purging gas, the residual liquid, air, moisture, particles, etc. in the pipeline and the vaporizer 21 are purged clean, and the vaporized gas and pollutants are discharged into the tail gas treatment device 61 through the gas outlet pipeline 23 and the tail gas treatment pipeline 62. Finally, the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution caused by the pollutants. By setting the second bypass pipeline 110, when the first flow meter 80 fails and cannot pass liquid, the residual liquid in the pipeline behind the first flow meter 80 can be drained first, thereby ensuring overall safety. In the prior art, if the vaporizer 21 has a heating failure and cannot continue to vaporize the liquid process medium, it becomes difficult to discharge the residual liquid process medium in the pipeline. To solve this problem, as shown in FIG. 7, Embodiment 4 of the present application also discloses a liquid source vaporization system, which is basically the same as Embodiment 1, except that in this embodiment, the liquid source vaporization system further includes: a residual liquid recovery device 130, and the residual liquid recovery device 130 is connected to the liquid inlet pipeline 22, and the residual liquid recovery device 130 is used to recover the residual process medium. The liquid source vaporization system of Embodiment 4 of the present application adds a residual liquid recovery device 130 on the basis of Embodiment 1, which can recover the residual liquid in the pipeline, thereby reducing the loss of the liquid process medium and lowering the material cost. Specifically, in this Embodiment 4, as shown in FIG. 7, the residual liquid recovery device 130 includes: a residual liquid collector 131, a residual liquid recovery pipeline 132, and a sixth control valve 133. The residual liquid collector 131 is used to recover the residual liquid process medium; the outlet end of the residual liquid recovery pipeline 132 is connected to the residual liquid collector 131, and the inlet end of the residual liquid recovery pipeline 132 is connected to the liquid inlet pipeline 22; the sixth control valve 133 is arranged on the residual liquid recovery pipeline 132 and is used to control the on-off of the residual liquid recovery pipeline 132. To cooperate with the residual liquid recovery device 130 to recover the residual liquid, the vaporization device 20 further includes: a seventh control valve 26, and the seventh control valve 26 is arranged on the liquid inlet pipeline 22. The seventh control valve 26 is located between the inlet end of the residual liquid recovery pipeline 132 and the vaporizer 21 and is used to control the on-off between the vaporization chamber of the vaporizer 21 and the liquid inlet pipeline 22. Further, the residual liquid recovery device 130 further includes an exhaust pipeline 134 and an eighth control valve 135. The residual liquid collector 131 has an exhaust port, and the exhaust port is communicated with the tail gas treatment pipeline 62 through the exhaust pipeline 134. The eighth control valve 135 is disposed on the exhaust pipeline 134 and is used to control the on / off of the exhaust pipeline 134. By providing the exhaust pipeline 134, the excess gas and pressure in the container of the residual liquid collector 131 can be discharged into the tail gas treatment pipeline 62, thereby making it more convenient to collect the residual liquid. In this embodiment, the liquid source vaporization system has a working state and a first residual liquid recovery state. In the working state, the first control valve 51 is opened, the second control valve 52 is closed; the third control valve 71 is opened, the fourth control valve 72 is closed, the seventh control valve 26 is opened, the sixth control valve 133 is closed, and the carrier gas control valve 25 is opened. In the working state, the liquid source pipeline 10, the first flow meter 80, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium sequentially passes through the liquid source pipeline 10, the first flow meter 80, and the liquid inlet pipeline 22 and enters the vaporizer 21. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then sequentially passes through the gas outlet pipeline 23 and the output pipeline 30 and enters the process chamber of the semiconductor process equipment, thereby performing the corresponding semiconductor process. As shown in FIG. 7, in the first residual liquid recovery state, the second control valve 52 is opened, the first control valve 51 is closed, the sixth control valve 133 is opened, the seventh control valve 26 is closed, and the eighth control valve 135 is opened, and the carrier gas control valve 25 is closed. The first residual liquid recovery state is mainly used when the vaporizer 21 fails to perform the vaporization work, so that the residual liquid in the pipeline enters the residual liquid collector 131 along with the purging gas for recovery. When the liquid source vaporization system is in the first residual liquid recovery state, the purging gas source, the purging pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132, and the residual liquid collector 131 are connected in sequence, and the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, the tail gas treatment pipeline 62, and the tail gas treatment device 61 are connected in sequence. The purging gas sequentially passes through the purging pipeline 40, the liquid inlet pipeline 22, and the residual liquid recovery pipeline 132 and enters the residual liquid collector 131, and then enters the tail gas treatment device 61 through the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, and the tail gas treatment pipeline 62. During this process, the residual liquid in the pipeline enters the residual liquid collector 131 along with the purging gas for recovery, and the gaseous process medium or other waste gases in the pipeline can enter the tail gas treatment device 61 along with the purging gas for treatment, thereby ensuring the collection of the residual liquid while avoiding environmental pollution. In the liquid source vaporization system according to the fourth embodiment of the present application, by providing a residual liquid collector 131, a residual liquid recovery pipeline 132, and a sixth control valve 133, and arranging a seventh control valve 26 on the liquid inlet pipeline 22 between the inlet end of the residual liquid recovery pipeline 132 and the vaporizer 21, the connection between the liquid inlet pipeline 22 and the residual liquid recovery pipeline 132 or the connection between the liquid inlet pipeline 22 and the vaporizer 21 can be selectively controlled through the sixth control valve 133 and the seventh control valve 26. Thus, when the liquid inlet pipeline 22 is connected to the residual liquid recovery pipeline 132, the residual liquid in the pipeline can be recovered, thereby reducing the loss of the liquid process medium and lowering the material cost. Additionally, by providing an exhaust pipeline 134, the excess gas and pressure in the container of the residual liquid collector 131 can be discharged into the tail gas treatment pipeline 62, and the gaseous process medium or other waste gas in the pipeline can enter the tail gas treatment device 61 along with the purging gas for treatment. Thus, while facilitating the collection of the residual liquid, environmental pollution can also be avoided, which is a typical case of multi-usage of one device. Embodiment 5 of the present application as shown in FIG. 8 also discloses a liquid source vaporization system, which is basically the same as Embodiment 4, except that in this embodiment, the liquid source vaporization system further includes: a ninth control valve 136, the ninth control valve 136 is arranged on the residual liquid recovery pipeline 132, and the ninth control valve 136 is located between the sixth control valve 133 and the outlet end of the residual liquid recovery pipeline 132. The liquid source vaporization system further includes: a purging branch 140 and a tenth control valve 150. The inlet end of the purging branch 140 is connected to a purging gas source, the outlet end of the purging branch 140 is connected to the residual liquid recovery pipeline 132, and the outlet end of the purging branch 140 is located between the ninth control valve 136 and the sixth control valve 133; the tenth control valve 150 is arranged on the purging branch 140 for controlling the on-off of the purging branch 140. In this embodiment, the liquid source vaporization system has a working state and a second residual liquid recovery state. In the working state, the first control valve 51 is opened, the second control valve 52 is closed, and the tenth control valve 150 is closed; the third control valve 71 is opened, the fourth control valve 72 is closed, the seventh control valve 26 is opened, the sixth control valve 133 is closed, and the carrier gas control valve 25 is opened. In the working state, the liquid source pipeline 10, the first flow meter 80, the liquid inlet pipeline 22, the vaporizer 21, the outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium sequentially passes through the liquid source pipeline 10, the first flow meter 80, and the liquid inlet pipeline 22 and enters the vaporizer 21. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then sequentially passes through the outlet pipeline 23 and the output pipeline 30 and enters the process chamber of the semiconductor process equipment, thereby performing the corresponding semiconductor process. As shown in FIG. 8, in the second residual liquid recovery state, the tenth control valve 150 is opened, the first control valve 51 is closed, the second control valve 52 is closed, the ninth control valve 136 is opened, the sixth control valve 133 is closed, the seventh control valve 26 is closed, the eighth control valve 135 is opened, and the carrier gas control valve 25 is closed. The second residual liquid recovery state is mainly used to purge the pipeline after the residual liquid collection is completed, so as to discharge impurities such as air and moisture inside the pipeline and the residual liquid collector 131. When the liquid source vaporization system is in the second residual liquid recovery state, the purge gas source, the purge branch 140, the residual liquid recovery pipeline 132, and the residual liquid collector 131 are connected in sequence, and the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, the tail gas treatment pipeline 62, and the tail gas treatment device 61 are connected in sequence. The purge gas passes through the purge branch 140 and the residual liquid recovery pipeline 132 into the residual liquid collector 131 in sequence, and then enters the tail gas treatment device 61 through the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, and the tail gas treatment pipeline 62. During this process, impurities such as air and water vapor in the pipeline and the residual liquid collector 131 are discharged from the residual liquid collector 131 along with the purge gas and enter the tail gas treatment device 61 for treatment together with the purge gas, so as to ensure that the collected residual liquid will not react with gas impurities and is in a relatively stable state; at the same time, it can also avoid environmental pollution of the exhausted waste gas. Embodiment six of the present application as shown in FIG. 9 also discloses a liquid source vaporization system, which is basically the same as Embodiment five, except that in this embodiment, the residual liquid recovery device 130 further includes: a residual gas discharge pipeline 137 and a residual gas control valve 138. The inlet end of the residual gas discharge pipeline 137 is connected to the residual liquid recovery pipeline 132. The inlet end of the residual gas discharge pipeline 137 is located between the sixth control valve 133 and the ninth control valve 136. The outlet end of the residual gas discharge pipeline 137 is connected to the tail gas treatment pipeline 62. The outlet end of the residual gas discharge pipeline 137 is located between the fourth control valve 72 and the vacuum pump; the residual gas control valve 138 is arranged on the residual gas discharge pipeline 137 and is used to control the on-off of the residual gas discharge pipeline 137. In this embodiment, the liquid source vaporization system has a working state and a pipeline residual gas discharge state. In the working state, the first control valve 51 is open, the second control valve 52 is closed, and the tenth control valve 150 is closed; the third control valve 71 is open, the fourth control valve 72 is closed, the seventh control valve 26 is open, the sixth control valve 133 is closed, and the carrier gas control valve 25 is open. In the working state, the liquid source pipeline 10, the first flow meter 80, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium passes through the liquid source pipeline 10, the first flow meter 80, and the liquid inlet pipeline 22 into the vaporizer 21 in sequence. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then passes through the gas outlet pipeline 23 and the output pipeline 30 into the process chamber of the semiconductor process equipment in sequence, so as to perform the corresponding semiconductor process. As shown in FIG. 9, in the state of discharging the residual gas in the pipeline, the second control valve 52 is open, the first control valve 51 is closed, and the tenth control valve 150 is closed. The sixth control valve 133 is open, the residual gas control valve 138 is open, the seventh control valve 26 is closed, the ninth control valve 136 is closed, and the carrier gas control valve 25 is closed. The state of discharging the residual gas in the pipeline is mainly used for blowing the pipeline with the blowing gas when the residual liquid collector 131 needs to be removed after the residual liquid collection is completed, so as to discharge the residual gaseous process medium, air, moisture and other impurities inside the pipeline. When the liquid source vaporization system is in the state of discharging the residual gas in the pipeline, the blowing gas source, the blowing pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132, the residual gas discharge pipeline 137, the tail gas treatment pipeline 62, and the tail gas treatment device 61 are connected in sequence. The blowing gas passes through the blowing pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132, the residual gas discharge pipeline 137, and the tail gas treatment pipeline 62 into the tail gas treatment device 61 in sequence. During this process, the blowing gas carries the gaseous process medium, air, moisture and other impurities in the pipeline into the tail gas treatment device 61 for treatment, so as to remove the gaseous process medium, air, moisture and other impurities in the pipeline, ensuring the safety of the process of removing the residual liquid collector 131. At the same time, it can also avoid environmental pollution caused by the discharged waste gas. Embodiment VII of the present application shown in FIGS. 10 to 16 also discloses a liquid source vaporization system, which is basically the same as Embodiment VI, except that in this embodiment, the liquid source vaporization system further includes: a second bypass pipeline 110 and a fifth control valve 120. The inlet end of the second bypass pipeline 110 is connected to the blowing gas source, the outlet end of the second bypass pipeline 110 is connected to the liquid inlet pipeline 22, and the outlet end of the second bypass pipeline 110 is located between the first flow meter 80 and the vaporization chamber; the fifth control valve 120 is arranged on the second bypass pipeline 110 for controlling the on-off of the second bypass pipeline 110. In this embodiment, the liquid source vaporization system has a working state, a first cleaning state, a second cleaning state, a fourth cleaning state, a first residual liquid recovery state, a second residual liquid recovery state, and a pipeline residual gas discharge state. As shown in FIG. 10, in the working state, the first control valve 51 is opened, the second control valve 52 is closed, the fifth control valve 120 is closed, the tenth control valve 150 is closed, the seventh control valve 26 is opened, the sixth control valve 133 is closed, the carrier gas control valve 25 is opened, the third control valve 71 is opened, and the fourth control valve 72 is closed. In the working state, the liquid source pipeline 10, the first flow meter 80, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, and the output pipeline 30 are connected in sequence. The liquid process medium sequentially passes through the liquid source pipeline 10, the first flow meter 80, and the liquid inlet pipeline 22 and enters the vaporizer 21. The vaporizer 21 vaporizes the liquid process medium, and the vaporized gaseous process medium then sequentially passes through the gas outlet pipeline 23 and the output pipeline 30 and enters the process chamber of the semiconductor process equipment, thereby performing the corresponding semiconductor process. As shown in FIG. 11, in the first cleaning state, the second control valve 52 is opened, the first control valve 51 is closed, the fifth control valve 120 is closed, the tenth control valve 150 is closed, the seventh control valve 26 is opened, the sixth control valve 133 is closed, the carrier gas control valve 25 is closed, the fourth control valve 72 is opened, and the third control valve 71 is closed. The purging gas sequentially passes through the purging pipeline 40, the liquid inlet pipeline 22, the vaporizer 21, and the gas outlet pipeline 23, thereby purging the residual liquid, air, moisture, particles, etc. in the pipeline and the vaporizer 21. At the same time, the pollutants blown out from the vaporization device 20 by the purging gas enter the tail gas treatment device 61 through the tail gas treatment pipeline 62, so that the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution by the pollutants. As shown in FIG. 12, in the second cleaning state, the second control valve 52 is opened, the first control valve 51 is closed, the fifth control valve 120 is closed, the tenth control valve 150 is closed, the seventh control valve 26 is opened, the sixth control valve 133 is closed, the carrier gas control valve 25 is opened, the fourth control valve 72 is opened, and the third control valve 71 is closed. The second cleaning state is mainly to discharge the residual liquid and gas in the pipeline and the vaporizer 21 after the process. The purging gas sequentially passes through the purging pipeline 40, the liquid inlet pipeline 22, the vaporizer 21, and the gas outlet pipeline 23. At the same time, since the carrier gas control valve 25 is opened, under the action of the carrier gas, the vaporizer 21 vaporizes the internal liquid into gas, and then is blown out together with the purging gas, thereby purging the residual liquid and gas in the pipeline and the vaporizer 21. At the same time, the pollutants blown out from the vaporization device 20 by the purging gas enter the tail gas treatment device 61 through the tail gas treatment pipeline 62, so that the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution by the pollutants. As shown in FIG. 13, in the fourth cleaning state, the fifth control valve 120 is open, the first control valve 51 is closed, the second control valve 52 is closed, the tenth control valve 150 is closed, the seventh control valve 26 is open, the sixth control valve 133 is closed, the carrier gas control valve 25 is open, the fourth control valve 72 is open, and the third control valve 71 is closed. The fourth cleaning state is mainly used for the situation where the first flow meter 80 fails and cannot pass liquid. When the liquid source vaporization system is in the fourth cleaning state, the purge gas source, the second bypass pipeline 110, the liquid inlet pipeline 22, the vaporizer 21, the gas outlet pipeline 23, the tail gas treatment pipeline 62, the vacuum pump, and the tail gas treatment device 61 are connected in sequence. The purge gas bypasses the first flow meter 80 through the second bypass pipeline 110, and then enters the vaporizer 21 through the liquid inlet pipeline 22 in sequence. At the same time, with the assistance of the carrier gas, the vaporizer 21 vaporizes the residual liquid inside, and then, under the action of the purge gas, the residual liquid, air, moisture, particles, etc. in the pipeline and the vaporizer 21 are purged clean, and the vaporized gas and pollutants are discharged into the tail gas treatment device 61 through the gas outlet pipeline 23 and the tail gas treatment pipeline 62. Finally, the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution by the pollutants. By setting the second bypass pipeline 110, when the first flow meter 80 fails and cannot pass liquid, the residual liquid in the pipeline behind the first flow meter 80 can be drained first, so as to ensure the overall safety. As shown in FIG. 14, in the first residual liquid recovery state, the second control valve 52 is open, the first control valve 51 is closed, the fifth control valve 120 is closed, the tenth control valve 150 is closed, the sixth control valve 133 is open, the ninth control valve 136 is open, the seventh control valve 26 is closed, the excess gas control valve 138 is closed, the eighth control valve 135 is open, the carrier gas control valve 25 is closed, the third control valve 71 is closed, and the fourth control valve 72 is closed. The first residual liquid recovery state is mainly used when the vaporizer 21 fails to perform the vaporization work, so that the residual liquid in the pipeline enters the residual liquid collector 131 with the purge gas for recovery. When the liquid source vaporization system is in the first residual liquid recovery state, the purge gas source, the purge pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132 and the residual liquid collector 131 are connected in sequence, and the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, the tail gas treatment pipeline 62 and the tail gas treatment device 61 are connected in sequence. The purge gas sequentially passes through the purge pipeline 40, the liquid inlet pipeline 22, and the residual liquid recovery pipeline 132 and enters the residual liquid collector 131, and then enters the tail gas treatment device 61 through the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, and the tail gas treatment pipeline 62. During this process, the residual liquid in the pipeline enters the residual liquid collector 131 with the purge gas for recovery, and the gaseous process medium or other waste gases in the pipeline can enter the tail gas treatment device 61 with the purge gas for treatment, so as to ensure the collection of the residual liquid while avoiding environmental pollution. In the liquid source vaporization system according to the seventh embodiment of the present application, by providing a residual liquid collector 131, a residual liquid recovery pipeline 132 and a sixth control valve 133, and providing a seventh control valve 26 on the liquid inlet pipeline 22 between the inlet end of the residual liquid recovery pipeline 132 and the vaporizer 21, the connection between the liquid inlet pipeline 22 and the residual liquid recovery pipeline 132 or the connection between the liquid inlet pipeline 22 and the vaporizer 21 can be selectively controlled through the sixth control valve 133 and the seventh control valve 26. Thus, when the liquid inlet pipeline 22 is connected to the residual liquid recovery pipeline 132, the residual liquid in the pipeline can be recovered, thereby reducing the loss of the liquid process medium and lowering the material cost. In addition, by providing the exhaust pipeline 134, the excess gas and pressure in the container of the residual liquid collector 131 can be discharged into the tail gas treatment pipeline 62, and the gaseous process medium or other waste gases in the pipeline can enter the tail gas treatment device 61 with the purge gas for treatment, so as to facilitate the collection of the residual liquid while avoiding environmental pollution, which is a typical case of multi-purpose use of one object. As shown in FIG. 15, in the second residual liquid recovery state, the tenth control valve 150 is opened, the first control valve 51 is closed, the second control valve 52 is closed, the fifth control valve 120 is closed, the ninth control valve 136 is opened, the sixth control valve 133 is closed, the seventh control valve 26 is closed, the excess gas control valve 138 is closed, the eighth control valve 135 is opened, the carrier gas control valve 25 is closed, the third control valve 71 is closed, and the fourth control valve 72 is closed. The second residual liquid recovery state is mainly used to purge the pipeline after the residual liquid collection is completed, so as to discharge impurities such as air and moisture inside the pipeline and the residual liquid collector 131. When the liquid source vaporization system is in the second residual liquid recovery state, the purging gas source, the purging branch 140, the residual liquid recovery pipeline 132, and the residual liquid collector 131 are connected in sequence, and the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, the tail gas treatment pipeline 62, and the tail gas treatment device 61 are connected in sequence. The purging gas passes through the purging branch 140 and the residual liquid recovery pipeline 132 into the residual liquid collector 131 in sequence, and then enters the tail gas treatment device 61 through the exhaust port of the residual liquid collector 131, the exhaust pipeline 134, and the tail gas treatment pipeline 62. During this process, impurities such as air and water vapor in the pipeline and the residual liquid collector 131 are discharged from the residual liquid collector 131 along with the purging gas and enter the tail gas treatment device 61 for treatment together with the purging gas, so as to ensure that the collected residual liquid does not react with gas impurities and is in a relatively stable state; at the same time, it can also avoid environmental pollution caused by the discharged waste gas. As shown in Figure 16, in the pipeline residual gas discharge state, the second control valve 52 is opened, the first control valve 51 is closed, the fifth control valve 120 is closed, the tenth control valve 150 is closed, the sixth control valve 133 is opened, the residual gas control valve 138 is opened, the seventh control valve 26 is closed, the ninth control valve 136 is closed, the eighth control valve 135, and the carrier gas control valve 25 is closed, the third control valve 71 is closed, and the fourth control valve 72 is closed. The pipeline residual gas discharge state is mainly used to purge the pipeline with purging gas when the residual liquid collector 131 needs to be removed after the residual liquid collection is completed, so as to discharge the remaining gaseous process medium and impurities such as air and moisture inside the pipeline. When the liquid source vaporization system is in the pipeline residual gas discharge state, the purging gas source, the purging pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132, the residual gas discharge pipeline 137, the tail gas treatment pipeline 62, and the tail gas treatment device 61 are connected in sequence. The purging gas passes through the purging pipeline 40, the liquid inlet pipeline 22, the residual liquid recovery pipeline 132, the residual gas discharge pipeline 137, and the tail gas treatment pipeline 62 into the tail gas treatment device 61 in sequence. During this process, the purging gas carries the gaseous process medium and impurities such as air and moisture in the pipeline into the tail gas treatment device 61 for treatment together, so as to remove the gaseous process medium and impurities such as air and moisture in the pipeline and ensure the safety of the process of removing the residual liquid collector 131. At the same time, it can also avoid environmental pollution caused by the discharged waste gas. It should be noted that in this embodiment, the function of the third cleaning state in the second embodiment can also be achieved in the state of discharging the remaining gas in the pipeline. That is to say, when the first flow meter 80 needs to be maintained and replaced, to ensure the safety of personnel, the liquid source vaporization system of this embodiment can be adjusted to the state of discharging the remaining gas in the pipeline, and the pollutants and residual liquid therein are blown into the tail gas treatment system for treatment, so as to ensure the safety of the operator during the maintenance and replacement of the first flow meter 80, which belongs to the typical multi - use of one object. In the prior art, both the atomizer and the flow meter in the vaporizer 21 have small - aperture structures. When the liquid source is viscous, it is easy to cause blockage. Therefore, the vaporizer 21 and the flow meter need to be replaced and maintained. To solve the above problems, the liquid source vaporization system of this embodiment also has a first flushing state, which is basically the same as the first residual liquid recovery state. The difference is that in the first flushing state, the first control valve 51 is opened and the second control valve 52 is closed. Moreover, the liquid introduced into the liquid source is no longer the process medium, but is changed to an organic solvent, such as n - octane, etc. The pipeline and components are flushed with the organic solvent, and the residual liquid and organic solvent after the pipeline flushing pass through the purge pipeline 40, the liquid inlet pipeline 22, and the residual liquid recovery pipeline 132 in sequence and enter the residual liquid collector 131 to collect the waste liquid after flushing, thus completing the flushing of the pipeline. After that, it can enter the first residual liquid recovery state, and the residual liquid in the pipeline is recovered by the purge gas to complete the cleaning work of the pipeline. In addition, the liquid source vaporization system of this embodiment also has a second flushing state, which is basically the same as the second cleaning state. The difference is that in the second flushing state, the first control valve 51 is opened and the second control valve 52 is closed. Moreover, the liquid introduced into the liquid source is also no longer the process medium, but is changed to an organic solvent, such as n - octane, etc. The organic solvent passes through the purge pipeline 40, the liquid inlet pipeline 22, the vaporizer 21, and the gas outlet pipeline 23 in sequence. At the same time, since the carrier gas control valve 25 is opened, under the action of the carrier gas, the vaporizer 21 vaporizes the internal liquid organic solvent into gas, and at the same time dissolves the residual process medium in the vaporizer 21, and then blows them out together, so as to flush the residual process medium in the pipeline and the vaporizer 21 clean, and enter the tail gas treatment device 61 through the tail gas treatment pipeline 62, so that the pollutants are treated by the tail gas treatment device 61 to avoid environmental pollution caused by pollutants. After that, it can enter the second cleaning state, and the residual liquid in the pipeline is recovered by the purge gas to complete the cleaning work of the pipeline. The difference between the first flushing state and the second flushing state is that the first flushing state is for flushing the pipeline before the vaporizer 21, while the second flushing state can achieve the flushing inside the vaporizer 21. Embodiment 8 of the present application shown in FIG. 17 also discloses a liquid source vaporization system, which is basically the same as Embodiment 7, except that in this embodiment, the exhaust pipeline 134 is not connected to the vacuum pump, but is directly connected to the tail gas treatment device 61. With this structure, mainly after the machine is installed, the liquid source vaporization system can be directly adjusted to the second residual liquid recovery state. Since it is the first purge of the residual liquid collector 131 and there is no special gas or liquid in the pipeline, it can be directly purged into the tail gas treatment system without passing through the vacuum pump. It should be noted that in the above embodiment, in order to prevent the carrier gas from causing fluctuations in the original temperature after entering the vaporizer 21, the vaporization device 20 further includes a heat exchanger. The heat exchanger is arranged on the carrier gas pipeline 24 and is used to heat the carrier gas so as to raise the temperature of the carrier gas to the required temperature in a relatively short time, thereby improving the vaporization effect. In the above embodiment, the first flow meter 80 is a mass flow meter, which can accurately control the flow rate of the liquid. In addition, in order to accurately control the flow rate of the carrier gas, a gas flow meter is arranged on the carrier gas pipeline 24. The gas flow meter is a mass flow meter, which can accurately control the flow rate of the gas. However, this is not restrictive. As long as it does not violate the inventive concept of the present application, any device that can accurately measure the flow rate of liquid or gas is within the protection scope of the application. It should also be noted that in order to monitor the state of the liquid or gas in the pipeline, a pressure detection device can be arranged on the pipeline to confirm the overall transmission performance and safety. Taking Embodiment 7 as an example: A first pressure detection device can be arranged on the liquid inlet pipeline 22. The first pressure detection device is located between the inlet end of the residual liquid recovery pipeline 132 and the first flow meter 80. It is used to detect the fluid pressure entering the vaporizer 21 to confirm the stability of the liquid source supply pressure. A second pressure detection device can also be arranged on the gas outlet pipeline 23 to detect the gas outlet pressure at the rear end of the vaporizer 21. If the outlet pressure is too low, the carrier gas pressure and the carrier gas volume can be appropriately increased to increase the outlet pressure, ensure the forward transmission of the fluid, and at the same time confirm the tightness of the pipeline. A third pressure detection device can also be arranged on the residual gas discharge pipeline 137. The third pressure detection device is located between the inlet end of the third pressure detection device and the residual gas control valve 138, and can confirm the tightness of the pipeline. A fourth pressure detection device can also be arranged at the inlet position of the vacuum pump to confirm whether the vacuum pump is operating normally and whether the pipeline is in a vacuum state. It should also be noted that in the above embodiment, a vacuum pump is used to use negative pressure to pump the gas in the pipeline and discharge it to the tail gas treatment device. However, this is not restrictive. It can also be a gas pump, a fan and other devices. As long as it can generate air flow and discharge the air flow to the tail gas treatment device, it is within the protection scope of the present application. The foregoing has outlined features of several embodiments so that those skilled in the art may better understand aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for the same purposes and / or achieving the same advantages as those introduced herein. Those skilled in the art should also understand that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and alterations may be made therein without departing from the spirit and scope of the present disclosure. 10: Liquid source pipeline 20: Vaporization device 21: Vaporizer 22: Liquid inlet pipeline 23: Gas outlet pipeline 24: Carrier gas pipeline 25: Carrier gas control valve 26: Seventh control valve 30: Output pipeline 40: Purge pipeline 50: First control unit 51: First control valve 52: Second control valve 60: Exhaust gas treatment unit 61: Exhaust gas treatment device 62: Exhaust gas treatment pipeline 70: Second control unit 71: Third control valve 72: Fourth control valve 80: First flow meter 90: First bypass pipeline 100: Bypass control unit 101: First bypass valve 102: Second bypass valve 110: Second bypass pipeline 120: Fifth control valve 130: Residual liquid recovery device 131: Residual liquid collector 132: Residual liquid recovery pipeline 133: Sixth control valve 134: Exhaust pipeline 135: Eighth control valve 136: Ninth control valve 137: Excess gas discharge pipeline 138: Excess gas control valve 140: Purge branch 150: Tenth control valve As will be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with standard practice in the industry, various components are not drawn to scale. In fact, for clarity of discussion, the dimensions of various components can be arbitrarily increased or decreased. FIG. 1 is a schematic structural diagram of a liquid source vaporization system according to Embodiment 1 of the present application; FIG. 2 is a schematic diagram of the working state of the liquid source vaporization system according to Embodiment 1 of the present application; FIG. 3 is a schematic diagram of the first cleaning state of the liquid source vaporization system according to Embodiment 1 of the present application; FIG. 4 is a schematic diagram of the second cleaning state of the liquid source vaporization system according to Embodiment 1 of the present application; FIG. 5 is a schematic diagram of the third cleaning state of the liquid source vaporization system according to Embodiment 2 of the present application; FIG. 6 is a schematic diagram of the fourth cleaning state of the liquid source vaporization system according to Embodiment 3 of the present application; FIG. 7 is a schematic diagram of the first residual liquid recovery state of the liquid source vaporization system according to Embodiment 4 of the present application; FIG. 8 is a schematic diagram of the second residual liquid recovery state of the liquid source vaporization system according to Embodiment 5 of the present application; FIG. 9 is a schematic diagram of the pipeline residual gas discharge state of the liquid source vaporization system according to Embodiment 6 of the present application; FIG. 10 is a schematic diagram of the working state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 11 is a schematic diagram of the first cleaning state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 12 is a schematic diagram of the second cleaning state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 13 is a schematic diagram of the third cleaning state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 14 is a schematic diagram of the first residual liquid recovery state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 15 is a schematic diagram of the second residual liquid recovery state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 16 is a schematic diagram of the pipeline residual gas discharge state of the liquid source vaporization system according to Embodiment 7 of the present application; FIG. 17 is a schematic diagram of the pipeline residual gas discharge state of the liquid source vaporization system according to Embodiment 8 of the present application 10: Liquid source pipeline 20: Vaporization device 21: Vaporizer 22: Liquid inlet pipeline 23: Gas outlet pipeline 24: Carrier gas pipeline 25: Carrier gas control valve 30: Output pipeline 40: Flushing pipeline 50: First control unit 51: First control valve 52: Second control valve 60: Tail gas treatment unit 61: Tail gas treatment device 62: Tail gas treatment pipeline 70: Second control unit 71: Third control valve 72: Fourth control valve 80: First flow meter

Claims

1. A liquid vaporization system, applied to a semiconductor manufacturing process equipment, comprising: A vaporization device (20) for vaporizing a liquid process medium into a gaseous process medium includes: a carrier gas line (24), the inlet end of which is connected to a carrier gas source; a carrier gas control valve (25), which is disposed on the carrier gas line (24) and is used to control the opening and closing of the carrier gas line (24), wherein the liquid source vaporization system has a working state and a first clean state; in the working state, the carrier gas control valve (25) is open; in the first clean state, the carrier gas control valve (25) is closed; a liquid source line (10) for supplying the liquid process medium to the vaporization device (20); and a purge line (40) for supplying a purge gas to the vaporization device (20). A first control unit (50) is used to selectively control the connection between the purge line (40) or the liquid source line (10) and the vaporization device (20); an output line (30) is used to transport the vaporized gaseous process medium to the process chamber of the semiconductor process equipment; a tail gas treatment line (62) is used to transport the contaminants blown out from the vaporization device (20) by the purge gas to a tail gas treatment device (61); a second control unit (70) is used to selectively control the connection between the tail gas treatment line (62) or the output line (30) and the vaporization device (20).

2. The liquid source vaporization system as described in claim 1, wherein: In this working state, the first control unit (50) controls the liquid source pipeline (10) to connect with the vaporization device (20), and the second control unit (70) controls the output pipeline (30) to connect with the vaporization device (20); In the first cleaning state, the first control unit (50) controls the purging pipeline (40) to connect with the vaporization device (20), and the second control unit (70) controls the exhaust gas treatment pipeline (62) to connect with the vaporization device (20).

3. The liquid source vaporization system as claimed in claim 1, wherein the vaporization device (20) comprises: A vaporizer (21) having a vaporization chamber for vaporizing the liquid process medium; A liquid inlet pipe (22) is connected to the vaporization chamber at its outlet end and to the outlet end of the liquid source pipe (10) and the purge pipe (40) at its inlet end. A gas outlet pipe (23) is connected to the vaporization chamber at its inlet end and to the outlet end of the output pipe (30) and the exhaust gas treatment pipe (62) at its outlet end.

4. The liquid source vaporization system as described in claim 3, wherein: In this working state, the first control unit (50) controls the liquid source pipeline (10) to connect with the liquid inlet pipeline (22), and the second control unit (70) controls the output pipeline (30) to connect with the gas outlet pipeline (23); In the first cleaning state, the first control unit (50) controls the purging pipeline (40) to connect with the liquid inlet pipeline (22), and the second control unit (70) controls the exhaust gas treatment pipeline (62) to connect with the gas outlet pipeline (23).

5. The liquid vaporization system as claimed in claim 3, wherein the first control unit (50) comprises: A first control valve (51) is provided on the liquid source pipeline (10) for controlling the opening and closing of the liquid source pipeline (10); a second control valve (52) is provided on the purge pipeline (40) for controlling the opening and closing of the purge pipeline (40); and the second control unit (70) includes: a third control valve (71) is provided on the output pipeline (30) for controlling the opening and closing of the output pipeline (30); and a fourth control valve (72) is provided on the exhaust gas treatment pipeline (62) for controlling the opening and closing of the exhaust gas treatment pipeline (62).

6. The liquid vaporization system as claimed in claim 4, wherein the outlet end of the carrier gas line (24) is connected to the vaporization chamber.

7. The liquid source vaporization system as claimed in claim 1, wherein the vaporization device (20) comprises: A vaporizer (21) having a vaporization chamber for vaporizing the liquid process medium; A liquid inlet pipe (22) is connected to the vaporization chamber at its outlet end, and the inlet end of the liquid inlet pipe (22) is connected to the outlet end of the liquid source pipe (10) and the outlet end of the purging pipe (40) respectively; an outlet pipe (23) is connected to the vaporization chamber at its inlet end, and the outlet end of the outlet pipe (23) is connected to the inlet end of the output pipe (30) and the inlet end of the exhaust gas treatment pipe (62) respectively; the outlet end of the carrier gas pipe (24) is connected to the vaporization chamber; the liquid source vaporization system also has a second clean state; in this working state, the first control unit (50) controls the liquid source pipe (10) to connect with the liquid inlet pipe (22), and the second control unit (70) controls the output pipe (30) to connect with the outlet pipe (23); In the second cleaning state, the first control unit (50) controls the purge line (40) to connect with the liquid inlet line (22), the second control unit (70) controls the outlet line (23) to connect with the exhaust gas treatment line (62), and the carrier gas control valve (25) is opened.

8. The liquid source vaporization system as claimed in claim 1, wherein the vaporization device (20) comprises: A vaporizer (21) having a vaporization chamber for vaporizing the liquid process medium; A liquid inlet pipe (22) is provided, the outlet end of which is connected to the vaporization chamber, and the inlet end of which is connected to the outlet end of the liquid source pipe (10) and the outlet end of the purging pipe (40); an outlet pipe (23) is provided, the inlet end of which is connected to the vaporization chamber, and the outlet end of which is connected to the inlet end of the output pipe (30) and the inlet end of the tail gas treatment pipe (62); the liquid source vaporization system further includes: a first flow meter (80) which is provided on the liquid inlet pipe (22) and is used to control the flow rate of the liquid process medium; A first bypass line (90), the inlet end of which is connected to the liquid inlet line (22), the inlet end of which is located between the first flow meter (80) and the vaporizer (21), and the outlet end of which is connected to the exhaust gas treatment line (62); A bypass control unit (100), which is used to selectively control the first flow meter (80) to be connected to the vaporization chamber or the first flow meter (80) to be connected to the first bypass line (90).

9. The liquid source vaporization system as claimed in claim 8, wherein the liquid source vaporization system further comprises a third clean state; in this working state, the first control unit (50) controls the liquid source pipeline (10) to be connected to the liquid inlet pipeline (22), the bypass control unit (100) controls the first flow meter (80) to be connected to the vaporization chamber, and the second control unit (70) controls the output pipeline (30) to be connected to the gas outlet pipeline (23); in the third clean state, the first control unit (50) controls the purge pipeline (40) to be connected to the liquid inlet pipeline (22), and the bypass control unit (100) controls the first flow meter (80) to be connected to the first bypass pipeline (90).

10. The liquid vaporization system as claimed in claim 8, wherein the bypass control unit (100) includes a first bypass valve (101) and a second bypass valve (102), the first bypass valve (101) being disposed on the first bypass line (90) for controlling the opening and closing of the first bypass line (90); the second bypass valve (102) being disposed on the liquid inlet line (22) and located between the inlet end of the first bypass line (90) and the vaporizer (21) for controlling the opening and closing of the liquid inlet line (22).

11. The liquid source vaporization system as claimed in claim 1, wherein the vaporization device (20) comprises: A vaporizer (21) having a vaporization chamber for vaporizing the liquid process medium; A liquid inlet pipe (22) is provided, the outlet end of which is connected to the vaporization chamber, and the inlet end of which is connected to the outlet end of the liquid source pipe (10) and the outlet end of the purging pipe (40); an outlet pipe (23) is provided, the inlet end of which is connected to the vaporization chamber, and the outlet end of which is connected to the inlet end of the output pipe (30) and the inlet end of the tail gas treatment pipe (62); the liquid source vaporization system further includes: a first flow meter (80) which is provided on the liquid inlet pipe (22) and is used to control the flow rate of the liquid process medium; A second bypass pipeline (110) is provided, the inlet end of which is connected to a purge gas source and the outlet end of which is connected to the liquid inlet pipeline (22). The outlet end of the second bypass pipeline (110) is located between the first flow meter (80) and the vaporization chamber. A fifth control valve (120) is provided on the second bypass pipeline (110) and is used to control the opening and closing of the second bypass pipeline (110).

12. The liquid vaporization system as claimed in claim 11, wherein in the operating state, the carrier gas control valve (25) is open and the fifth control valve (120) is closed; the liquid vaporization system also has a fourth clean state; in the fourth clean state, the first control unit (50) controls the liquid source line (10) and the purge line (40) to disconnect from the liquid inlet line (22), the carrier gas control valve (25) and the fifth control valve (120) are open, and the second control unit (70) controls the exhaust gas treatment line (62) to connect with the exhaust gas line (23).

13. The liquid source vaporization system as claimed in claim 1, wherein the vaporization device (20) comprises: A vaporizer (21) having a vaporization chamber for vaporizing the liquid process medium; A liquid inlet pipe (22) is provided, the outlet of which is connected to the vaporization chamber, and the inlet of which is connected to the outlet of the liquid source pipe (10) and the outlet of the purging pipe (40); an outlet pipe (23) is provided, the inlet of which is connected to the vaporization chamber, and the outlet of which is connected to the inlet of the output pipe (30) and the inlet of the tail gas treatment pipe (62); the liquid source vaporization system further includes: a residual liquid collector (131) for recovering residual liquid process media; a residual liquid recovery pipe (132) is provided, the outlet of which is connected to the residual liquid collector (131), and the inlet of which is connected to the liquid inlet pipe (22); A sixth control valve (133) is provided on the residual liquid recovery pipeline (132) for controlling the opening and closing of the residual liquid recovery pipeline (132); The vaporization device (20) further includes: a seventh control valve (26) is provided on the liquid inlet pipeline (22) and is located between the inlet end of the residual liquid recovery pipeline (132) and the vaporizer (21) for controlling the opening and closing of the vaporizer (21) and the liquid inlet pipeline (22).

14. The liquid source vaporization system as claimed in claim 13, wherein the liquid source vaporization system further comprises: An exhaust pipe (134) is provided, and the residual liquid collector (131) has an exhaust port, which is connected to the exhaust gas treatment pipe (62) through the exhaust pipe (134); An eighth control valve (135) is located on the exhaust pipe (134) and is used to control the opening and closing of the exhaust pipe (134).

15. The liquid vaporization system as claimed in claim 14, wherein in the operating state, the seventh control valve (26) is open and the sixth control valve (133) is closed; the liquid vaporization system also has a first residual liquid recovery state, in which the first control unit (50) controls the purge line (40) to connect with the liquid inlet line (22), the seventh control valve (26) is closed, and the sixth control valve (133) and the eighth control valve (135) are open.

16. The liquid source vaporization system as claimed in claim 14, wherein the liquid source vaporization system further comprises: A ninth control valve (136) is installed on the residual liquid recovery pipeline (132) and is located between the sixth control valve (133) and the outlet end of the residual liquid recovery pipeline (132); a purge branch (140) is connected to a purge gas source at its inlet end and to the residual liquid recovery pipeline (132) at its outlet end and is located between the ninth control valve (136) and the sixth control valve (133); a tenth control valve (150) is installed on the purge branch (140) and is used to control the on / off state of the purge branch (140).

17. The liquid vaporization system as claimed in claim 16, wherein in the operating state, the sixth control valve (133) and the tenth control valve (150) are closed, and the seventh control valve (26) is open; the liquid vaporization system also has a second residual liquid recovery state, in which the first control unit (50) controls the liquid source line (10) and the purge line (40) to disconnect from the liquid inlet line (22), the sixth control valve (133) is closed, and the tenth control valve (150), the ninth control valve (136), and the eighth control valve (135) are open.

18. The liquid source vaporization system as claimed in claim 17, wherein the liquid source vaporization system further comprises: A residual gas discharge pipeline (137) is provided, the inlet end of which is connected to the residual liquid recovery pipeline (132). The inlet end of the residual gas discharge pipeline (137) is located between the sixth control valve (133) and the ninth control valve (136). The outlet end of the residual gas discharge pipeline (137) is connected to the tail gas treatment pipeline (62). A residual gas control valve (138) is provided on the residual gas discharge pipeline (137) and is used to control the opening and closing of the residual gas discharge pipeline (137).

19. The liquid vaporization system as claimed in claim 18, wherein the liquid vaporization system further comprises a pipeline residual gas discharge state; in the pipeline residual gas discharge state, the first control unit (50) controls the purge pipeline (40) to connect with the liquid inlet pipeline (22), the tenth control valve (150), the ninth control valve (136), and the seventh control valve (26) are closed; the sixth control valve (133) and the residual gas control valve (138) are open.

20. The liquid vaporization system as claimed in claim 18, wherein the outlet end of the carrier gas line (24) is connected to the vaporization chamber; the vaporization device (20) further includes: A first flow meter (80) is installed on the liquid inlet pipe (22) and is used to calculate the flow rate of the liquid process medium; a second bypass pipe (110) is connected to the purge gas source at its inlet end and to the liquid inlet pipe (22) at its outlet end, and is located between the first flow meter (80) and the vaporization chamber; a fifth control valve (120) is installed on the second bypass pipe (110) and is used to control the opening and closing of the second bypass pipe (110).

21. The liquid vaporization system as claimed in claim 20, wherein in the operating state, the carrier gas control valve (25) is open and the fifth control valve (120) is closed; or in the first clean state, the seventh control valve (26) is open and the carrier gas control valve (25), the fifth control valve (120), the sixth control valve (133), and the tenth control valve (150) are closed; or the liquid vaporization system further has a second clean state; in the second clean state, the first control unit (50) controls the purge line (40) to connect with the liquid inlet line (22), the fifth control valve (120), the sixth control valve (133), and the tenth control valve (150) are closed, and the seventh control valve (26) is open; or the liquid vaporization system further has a fourth clean state; In the fourth cleaning state, the first control unit (50) controls the liquid source pipeline (10) and the purge pipeline (40) to disconnect from the liquid inlet pipeline (22), the tenth control valve (150) and the sixth control valve (133) are closed, the carrier gas control valve (25) and the fifth control valve (120) are opened, and the second control unit (70) controls the tail gas treatment pipeline (62) to connect with the gas outlet pipeline (23); or the liquid source vaporization system also has a first residual liquid recovery state; in the first residual liquid recovery state, the fifth control valve (120) and the tenth control valve (150) are closed; or in the second residual liquid recovery state, the fifth control valve (120) and the residual gas control valve (138) are closed; or the liquid source vaporization system also has a pipeline residual gas discharge state; When the pipeline is in the residual gas discharge state, the first control unit (50) controls the purge pipeline (40) to connect with the liquid inlet pipeline (22), and the fifth control valve (120), the tenth control valve (150), the ninth control valve (136), and the seventh control valve (26) are closed; the sixth control valve (133) and the residual gas control valve (138) are opened.

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