Joining system and joining method

Abstract

[Problem] To provide a bonding system and bonding method with high processing efficiency. [Solution] The bonding system includes: a loading module for loading a component carrier holding a plurality of components and a substrate for bonding the plurality of components; a relay module for loading the component carrier and substrate received from the loading module; a conveying module for conveying the component carrier and substrate already loaded in the relay module along a first direction; a surface treatment module for performing surface treatment on the plurality of components held on the component carrier and on the substrate; and a bonding device for bonding the surface-treated plurality of components one by one to the surface-treated substrate. The conveying module conveys the component carrier and substrate between the surface treatment module and the bonding device.

Description

Technical Field

[0001] The present disclosure relates to a bonding system and a bonding method for bonding a plurality of components held on a component carrier to a substrate one by one. Prior Art

[0002] Conventionally, as semiconductor devices become increasingly multilayered, technologies for three-dimensionally stacking semiconductor devices have been proposed. For example, a bonding system for bonding semiconductor wafers has been proposed (see Patent Document 1). Prior Art Literature Patent Literature

[0003] Patent Document 1: Japanese Patent No. 7012798 Summary of the Invention

[0004] Problems that the invention aims to solve Beyond bonding semiconductor wafers, as described in Patent Document 1, a system could be considered for individually bonding multiple components held on a component carrier (e.g., a tape frame) to a semiconductor wafer substrate. In this case, for example, automated transport of two different objects, such as a component carrier and a substrate, would require a design that prevents interference between transport devices, potentially leading to reduced processing efficiency.

[0005] The present disclosure aims to provide a bonding system and bonding method with high processing efficiency.

[0006] Means used to solve problems The bonding system disclosed herein comprises: a carry-in module for carrying in a part carrier holding a plurality of parts and a substrate for combining the plurality of parts; a relay module for carrying the part carrier and the substrate received from the carry-in module; a conveying module for conveying the part carrier and the substrate loaded on the relay module along a first direction; a surface treatment module for performing surface treatment on the plurality of parts held on the part carrier and the substrate; and a bonding device for combining the plurality of parts that have been surface treated one by one with the substrate that has been surface treated, and the conveying module is for conveying the part carrier and the substrate between the surface treatment module and the bonding device.

[0007] The bonding method disclosed herein includes the following steps: using a loading module to load a part carrier holding a plurality of parts and a substrate for combining the plurality of parts; using a relay module to carry the part carrier and the substrate received from the loading module; using a conveying module to convey the part carrier and the substrate loaded on the relay module along a first direction; using a surface treatment module to perform surface treatment on the plurality of parts held on the part carrier and the substrate; and using a bonding device to combine the plurality of parts that have been surface treated one by one to the substrate that has been surface treated, and using an object to transport the part carrier and the substrate between the surface treatment module and the bonding device as the conveying module.

[0008] Effects of the Invention According to the present disclosure, a bonding system and a bonding method with high processing efficiency can be provided. Simple diagram description

[0009] FIG1A is a schematic plan view of a joining system according to one embodiment. FIG. 1B is an enlarged view of the bonding apparatus of FIG. 1A . FIG2 is a schematic plan view of a carry-in module in one embodiment. FIG3 is a schematic plan view of the carry-in module in one embodiment (a state in which the hand holding the substrate has advanced). FIG. 4 is a schematic plan view of the carry-in module in one embodiment (a state in which the hand holding the component carrier has advanced). FIG5 is a schematic plan view of a transport module in one embodiment. FIG6 is a schematic perspective view of a relay module in one embodiment. FIG7 is a schematic front view of the first temporary stage in one embodiment. FIG8 is a schematic front view of the second temporary stage in one embodiment. FIG. 9 is a schematic plan view for explaining transfer of a substrate by the first temporary stage in one embodiment. FIG. 10 is a schematic plan view for explaining the transfer of the component carrier by the second temporary placement stage in one embodiment. FIG11 is a schematic perspective view of the first positioning stage in one embodiment. FIG. 12 is a schematic perspective view for explaining a method of using the first positioning stage in one embodiment. FIG13 is a schematic perspective view of the second positioning stage in one embodiment. FIG. 14 is a schematic perspective view for explaining a method of using the second positioning stage in one embodiment. FIG. 15 is a schematic plan view showing transfer of a substrate by the first positioning stage in one embodiment. FIG. 16 is a schematic plan view showing the transfer of a component carrier by the second positioning stage in one embodiment. FIG. 17 is a schematic perspective view of a carrier holding table in one embodiment. FIG. 18 is a longitudinal sectional view schematically showing a method for holding a parts carrier by a carrier holding workbench in one embodiment. FIG. 19 is a longitudinal sectional view schematically showing a method for holding a parts carrier by a carrier holding workbench in one embodiment. FIG. 20 is a longitudinal sectional view schematically showing a method for holding a parts carrier by a carrier holding workbench in one embodiment. FIG. 21 is a longitudinal sectional view schematically showing a method for holding a parts carrier by a carrier holding workbench in one embodiment. FIG. 22 is a longitudinal sectional view schematically showing a state where a substrate is held by a substrate holding table in one embodiment. FIG. 23 is a longitudinal sectional view schematically showing a method of bonding a component held on a component carrier according to one embodiment to a substrate. FIG. 24 is a longitudinal sectional view schematically showing a method of bonding a component held on a component carrier according to one embodiment to a substrate. FIG. 25 is a plan view of a bonding system schematically showing an example of a processing flow of a substrate in one embodiment. FIG. 26 is a plan view of a bonding system schematically showing an example of a processing flow of a substrate in one embodiment. FIG. 27 is a plan view of a bonding system schematically showing an example of a processing flow of a substrate in one embodiment. Figure 28 is a plan view of a joining system that schematically shows an example of a processing flow of a parts carrier in one embodiment. Figure 29 is a plan view of a joining system that schematically shows an example of a processing flow of a parts carrier in one embodiment. Implementation Method

[0010] Mode for carrying out the invention (Regarding the aspects of this disclosure) According to the first aspect of the present disclosure, a joining system is provided, comprising: a plurality of surface treatment modules for performing surface treatment on a plurality of parts held on a part carrier and a surface treatment on a substrate for joining the plurality of parts; a joining device for joining the plurality of surface-treated parts one by one to the substrate after the surface treatment; and a conveying module for conveying the part carrier and the substrate between the surface treatment module and the joining device, the conveying module comprising: a conveying robot having a first hand for holding the substrate and a second hand for holding the part carrier; and a robot moving workbench for moving the conveying robot along a first direction.

[0011] According to the second aspect of the present disclosure, a bonding system according to the first aspect is provided, wherein at least one of the surface treatment modules and the bonding device is arranged on opposite sides of each other so as to sandwich the moving path of the transfer robot along the first direction.

[0012] According to a third aspect of the present disclosure, a bonding system according to the first or second aspect is provided, wherein the surface treatment module uses any one of ultraviolet rays, plasma, and liquid to perform surface treatment.

[0013] According to the fourth aspect of the present disclosure, a joining system according to any one of the first to third aspects is provided, wherein the component carrier is a tape frame having a UV-curable adhesive sheet, and at least one of the surface treatment modules has an ultraviolet irradiation device for irradiating ultraviolet rays.

[0014] According to the fifth aspect of the present disclosure, a joining system according to any one of the first to fourth aspects is provided, wherein the joining device comprises: a first joining module for carrying in the substrate; and a second joining module for carrying the part carrier, wherein the first joining module and the second joining module are arranged in the first direction.

[0015] According to the sixth aspect of the present disclosure, a joining system according to any one of the first to fifth aspects is provided, which further comprises a partition wall, wherein the partition wall separates the conveying module and the joining device from each other, and an opening is provided in the partition wall, wherein the opening is used to transfer the part carrier and the substrate held by the conveying module to the joining device.

[0016] According to the seventh aspect of the present disclosure, a joining system according to the sixth aspect is provided, wherein the opening comprises: a first opening for allowing the substrate to pass through; and a second opening for allowing the component carrier to pass through.

[0017] According to the eighth aspect of the present disclosure, a joining system according to any one of the first to seventh aspects is provided, wherein the first hand and the second hand are arranged to be staggered with respect to each other in an upper and lower direction and are each movable forward and backward.

[0018] According to the ninth aspect of the present disclosure, a joining system according to the eighth aspect is provided, wherein the first hand is arranged above the second hand.

[0019] According to the tenth aspect of the present disclosure, a bonding system according to any one of the first to ninth aspects is provided, wherein the substrate is a wafer and the component carrier is a tape frame.

[0020] According to the 11th aspect of the present disclosure, a bonding method is provided, comprising the following steps: performing surface treatment on a plurality of parts held on a part carrier; performing surface treatment on a substrate used to bond the plurality of parts; transporting the surface-treated substrate toward a bonding device with a first hand; transporting the surface-treated part carrier toward the bonding device with a second hand; bonding the surface-treated plurality of parts one by one to the surface-treated substrate using the bonding device; removing the substrate to which the plurality of parts have been bonded from the bonding device with the first hand; and removing the part carrier from which the plurality of parts have been removed from the bonding device with the second hand.

[0021] (Regarding other aspects of this disclosure) According to the first aspect of the present disclosure, a joining system is provided, comprising: a carry-in module for carrying in a part carrier holding a plurality of parts and a substrate for combining the plurality of parts; a relay module for carrying the part carrier and the substrate received from the carry-in module; a conveying module for conveying the part carrier and the substrate loaded on the relay module along a first direction; a surface treatment module for performing surface treatment on the plurality of parts held on the part carrier and the substrate; and a joining device for combining the plurality of parts that have been surface treated one by one with the substrate that has been surface treated, wherein the conveying module conveys the part carrier and the substrate between the surface treatment module and the joining device.

[0022] According to the second aspect of the present disclosure, a joining system according to the first aspect is provided, wherein the relay module comprises: a first temporary carrier for mounting the substrate; and a second temporary carrier for mounting the component carrier.

[0023] According to the third aspect of the present disclosure, a joining system according to the second aspect is provided, wherein the first temporary carrier comprises: a first shelf for carrying the substrate received from the aforementioned loading module before use; and a second shelf for carrying the substrate after use after being combined with the aforementioned plurality of parts; the second temporary carrier comprises: a third shelf for carrying the part carrier received from the aforementioned loading module before use; and a fourth shelf for carrying the part carrier after use after the aforementioned plurality of parts have been taken out.

[0024] According to a fourth aspect of the present disclosure, a joining system according to the third aspect is provided, wherein the first shelf is located below the second shelf, and the third shelf is located below the fourth shelf.

[0025] According to the fifth aspect of the present disclosure, a joining system according to any one of the second to fourth aspects is provided, wherein the first temporary carrier is configured to transfer the substrate to the conveying module in a first transfer direction in a planar perspective, and the second temporary carrier is configured to transfer the part carrier to the conveying module in a second transfer direction in a planar perspective.

[0026] According to the sixth aspect of the present disclosure, a joining system according to the fifth aspect is provided, wherein the first temporary carrier and the second temporary carrier are arranged in a second direction intersecting with the first direction in a planar perspective, and the first transfer direction and the second transfer direction each intersect with respect to the first direction.

[0027] According to the seventh aspect of the present disclosure, a joining system according to any one of the second to sixth aspects is provided, wherein the relay module further comprises a positioning platform, which is used to receive the part carrier and the substrate from the conveying module and position them in a predetermined transfer direction.

[0028] According to the eighth aspect of the present disclosure, a joining system according to the seventh aspect is provided, wherein the positioning platform comprises: a first positioning platform for positioning the substrate; and a second positioning platform for positioning the part carrier.

[0029] According to the ninth aspect of the present disclosure, a joining system according to the seventh or eighth aspect is provided, wherein the positioning platform is located below the first temporary platform and the second temporary platform.

[0030] According to the 10th aspect of the present disclosure, a joining system according to any one of the 1st to 9th aspects is provided, wherein the aforementioned loading module comprises: a first conveying robot having a first hand for holding the aforementioned substrate and a second hand for holding the aforementioned part carrier; and a first robot moving workbench for moving the aforementioned first conveying robot in a second direction intersecting with the aforementioned first direction in a planar perspective.

[0031] According to the 11th aspect of the present disclosure, a joining system recorded in any one of the 1st to 10th aspects is provided, wherein the aforementioned transport module comprises: a second transport robot having a third hand for holding the aforementioned substrate and a fourth hand for holding the aforementioned part carrier; and a second robot moving workbench to move the aforementioned second transport robot in the aforementioned first direction.

[0032] According to the 12th aspect of the present disclosure, a bonding system according to the 11th aspect is provided, wherein at least one of the surface treatment modules and the bonding device are arranged on opposite sides of each other relative to the moving path of the conveying module along the first direction.

[0033] According to the 13th aspect of the present disclosure, a bonding system according to any one of the 1st to 12th aspects is provided, wherein the substrate is a wafer and the component carrier is a tape frame.

[0034] According to the 14th aspect of the present disclosure, a bonding method is provided, comprising the following steps: using a carry-in module to carry in a part carrier holding a plurality of parts and a substrate for combining the aforementioned plurality of parts; using a relay module to carry the aforementioned part carrier and the aforementioned substrate received from the aforementioned carry-in module; using a conveying module to convey the aforementioned part carrier and the aforementioned substrate already loaded on the aforementioned relay module along a first direction; using a surface treatment module to perform surface treatment on the aforementioned plurality of parts held on the aforementioned part carrier and surface treatment on the aforementioned substrate; and using a bonding device to combine the aforementioned plurality of parts that have been surface treated one by one to the aforementioned substrate that has been surface treated, and using an object as the aforementioned conveying module to convey the aforementioned part carrier and the aforementioned substrate between the aforementioned surface treatment module and the aforementioned bonding device.

[0035] (Implementation form) The following describes exemplary embodiments of the bonding system and bonding method disclosed herein with reference to the accompanying drawings. This disclosure is not limited to the specific configurations of the following embodiments; configurations based on the same technical concepts are also encompassed by this disclosure.

[0036] First, a joining system 2 and a joining method according to an embodiment of the present disclosure will be described with reference to Fig. 1A. Fig. 1A is a schematic plan view showing a simplified joining system 2.

[0037] The bonding system 2 shown in FIG1A is used to bond multiple components (not shown) held on a component carrier C to a substrate W one by one. In this embodiment, the components are wafer components, the component carrier C is a tape frame having an adhesive sheet that adheres and holds the multiple components, and the substrate W is a semiconductor wafer. The tape frame may also be called a dicing frame or a wafer ring, for example.

[0038] The bonding system 2 includes a loading port 3, a loading module 4, a relay module 6, a transport module 8, a plurality of surface treatment modules 10, 12, 14, and 16, a bonding device 18, and a control unit 19. In FIG1A , mutually orthogonal horizontal directions are designated as the X-axis and the Y-axis, and a vertical direction orthogonal to both the X-axis and the Y-axis is designated as the Z-axis.

[0039] The bonding system 2 shown in FIG. 1A is installed in a clean room, and downflow flows inside the bonding system 2 .

[0040] The load port 3 is used to supply substrates W and component carriers C to the carry-in module 4. The load port 3 carries a sealed container 20 containing a plurality of substrates W and a sealed container 22 containing a plurality of component carriers C. FIG1A illustrates a state where sealed container 20 contains substrates W and sealed container 22 contains component carriers C. In the example shown in FIG1A , sealed containers 20 and 22 are arranged in the Y-axis direction and connected to the carry-in module 4 in the X-axis direction.

[0041] The loading module 4 is used to load substrates W and component carriers C supplied from the load port 3 into the bonding system 2. The loading module 4 removes substrates W from the sealed container 20 loaded on the load port 3 and removes component carriers C from the sealed container 22. The loading module 4 is also called an EFEM (Equipment Front End Module).

[0042] The loading module 4 includes a transfer robot 24 and a robot moving table 26 .

[0043] The transfer robot 24 is a robot for transferring the substrate W and the component carrier C supplied from the load port 3 . The transfer robot 24 has arms for holding the substrate W and the component carrier C, respectively, and is moved by a robot moving stage 26 .

[0044] The robot moving stage 26 is a drive stage for moving the transfer robot 24. The robot moving stage 26 of this embodiment has the following functions: linearly moving the transfer robot 24 in the Y direction (see arrow Y1), horizontally rotating the transfer robot 24 (see arrow R1), and raising and lowering the transfer robot 24 in the Z-axis direction. Furthermore, the horizontal rotation and raising and lowering functions of the transfer robot 24 can also be performed using a rotation mechanism or an elevation mechanism provided on the transfer robot 24.

[0045] The transfer robot 24 moves in the Y-axis direction so as to be able to enter and exit each of the sealed container 20 and the sealed container 22 arranged in the Y-axis direction, take out the substrate W from the sealed container 20, and take out the component carrier C from the sealed container 22.

[0046] Next, the detailed structure of the loading module 4 will be described using FIG. 2 to FIG. 4 .

[0047] 2 to 4 are schematic plan views showing different states of the transfer robot 24 carried into the module 4 .

[0048] 2 , the hand 28 of the transfer robot 24 is shown in a state where it holds neither the substrate W nor the part carrier C. FIG3 , the hand 28 holding the substrate W is shown in a state where it has moved forward. FIG4 , the hand 32 holding the part carrier C is shown in a state where it has moved forward.

[0049] As shown in FIG. 2 to FIG. 4 , the transfer robot 24 includes a hand 28 and an arm 30 for holding and transferring the substrate W, and a hand 32 and an arm 34 for holding and transferring the component carrier C.

[0050] As shown in FIG2 , the hand 28 is a hand that can support the substrate W from below and has a bifurcated shape. A plurality of anti-slip portions (not shown) are provided on the upper surface of the hand 28 to prevent the position of the substrate W from shifting. Alternatively, the hand 28 may be a device that clamps the substrate W from above (including a non-contact method). The hand 28 is mounted on the front end portion of the plurality of arm portions 30. The plurality of arm portions 30 are pivotally supported so as to be rotatable relative to each other, and their base end portions are pivotally supported on the base portion 36. As shown in FIG3 , by driving the plurality of arm portions 30 so as to change the connection angle between each other, the hand 28 moves linearly in the front-back direction (see arrow A1).

[0051] As shown in Figure 2, the hand 32 supports the component carrier C from below and has a bifurcated shape. The upper surface of the hand 32 is provided with a plurality of anti-slip portions (not shown) to prevent the component carrier C from shifting. The hand 32 is attached to the front end of a plurality of arm portions 34. The plurality of arm portions 34 are pivotally supported so as to be rotatable relative to each other, with their base ends pivotally supported on the base portion 36. As shown in Figure 4, by driving the plurality of arm portions 34 to change the connection angle between them, the hand 32 moves linearly in the forward and backward directions (see arrow A2).

[0052] The hand 28 and arm 30 used to transport substrates W are vertically staggered from the hand 32 and arm 34 used to transport parts carriers C to prevent interference. In this embodiment, the substrate hand 28 is positioned above the parts carrier hand 32. Because the part carrier C has a higher particle adhesion rate than the substrate W, positioning the parts carrier hand 32 below can prevent particle contamination.

[0053] The hand 32, located below the hand 28, is positioned at a height that allows for the vertical clearance between the arm 30 connected to the hand 28. This allows the substrate hand 28 and arm 30 and the component carrier hand 32 and arm 34 to move independently without interfering with each other.

[0054] Returning to Figure 2 , the robot moving table 26 moves the base 36 along the Y-axis, thereby moving the transfer robot 24 integrally in the Y-axis direction (arrow Y1). The robot moving table 26 rotates the base 36 about a rotation axis extending in the Z-axis direction, thereby integrally rotating the transfer robot 24 horizontally (arrow R1). The robot moving table 26 raises and lowers the base 36 along the Z-axis, thereby integrally raising and lowering the transfer robot 24.

[0055] The transfer robot 24 of this embodiment does not have the ability to move in a horizontal direction (e.g., the X-axis direction) other than the Y-axis direction. In other words, the transfer robot 24's linear horizontal movement is limited to the Y-axis direction. This allows the X-axis dimension of the loaded module 4 to be reduced.

[0056] 1A , the relay module 6 is connected to the downstream side of the loading module 4 , and the transport module 8 is connected to the downstream side of the relay module 6 .

[0057] Like the loading module 4 , the transport module 8 includes a transport robot 60 and a robot moving table 62 . The transport robot 60 has the same configuration as the transport robot 24 , and the robot moving table 62 has the same configuration as the robot moving table 26 .

[0058] The detailed configuration of the transfer robot 60 and the robot moving table 62 will be described with reference to FIG. 5 .

[0059] FIG5 is a schematic plan view of the transport module 8. FIG5 is a schematic plan view of the transport module 8.

[0060] As shown in FIG. 5 , the transfer robot 60 of the transfer module 8 includes a hand 64 and an arm 66 for holding and transferring the substrate W, and a hand 68 and an arm 70 for holding and transferring the component carrier C.

[0061] As shown in Figure 5, the hand 64 supports the substrate W from below and is attached to the front end of the plurality of arms 66. Alternatively, the hand 68 can be used to grip the substrate W from above (including in a non-contact manner). The base ends of the plurality of arms 66 are pivotally supported on the base 72. By driving the plurality of arms 66 to change the angle at which they are connected, the hand 64 moves linearly in the forward and backward directions (see arrow A3).

[0062] The hand 68 supports the component carrier C from below and is attached to the front end of the plurality of arm portions 70. The base ends of the plurality of arm portions 70 are pivotally supported on the base portion 72. By driving the plurality of arm portions 70 to change the angle at which they are connected, the hand 68 moves linearly in the forward and backward directions (see arrow A4).

[0063] The hand 64 and arm 66 for transporting the substrate W and the hand 68 and arm 70 for transporting the component carrier C are arranged vertically staggered to avoid interference with each other. In this embodiment, the substrate hand 64 is arranged above the component carrier hand 68.

[0064] The robot moving table 62 moves the base 72 along the X-axis, thereby moving the transfer robot 60 integrally in the X-axis direction (arrow X1). The robot moving table 62 rotates the base 72 about a rotation axis extending in the Z-axis direction, thereby integrally rotating the transfer robot 60 horizontally (arrow R2). The robot moving table 62 raises and lowers the base 72 along the Z-axis, thereby integrally raising and lowering the transfer robot 60. Alternatively, the function of horizontally rotating or raising and lowering the transfer robot 60 may be performed by a revolving mechanism or a lifting mechanism provided on the transfer robot 60.

[0065] The transport robot 60 of this embodiment does not have the function of moving in a horizontal direction (such as the Y-axis direction) different from the X-axis direction, and the horizontal linear movement is only in the X-axis direction. This can reduce the size of the transport module 8 in the Y-axis direction.

[0066] Returning to FIG. 1A , the relay module 6 is a module for temporarily placing the substrate W and component carrier C that have been carried into the carry-in module 4 and transferring them to the transport module 8 .

[0067] FIG. 6 is a perspective view schematically showing the relay module 6 .

[0068] As shown in FIG. 6 , the relay module 6 includes a first temporary stage 38 and a second temporary stage 40 .

[0069] The first temporary stage 38 is used to place substrates W, which have been loaded from the loading module 4, before use. The transfer robot 24 of the loading module 4 places the substrates W, held by the hand 28, on the first temporary stage 38, temporarily placing the substrates W on the first temporary stage 38. The temporarily placed substrates W are then received and transferred by the transfer robot 60 (not shown) of the transfer module 8.

[0070] The second temporary stage 40 is used to place the unused part carrier C that has been loaded from the loading module 4. The transfer robot 24 of the loading module 4 places the part carrier C held by the hand 32 on the second temporary stage 40, temporarily placing the unused part carrier C on the second temporary stage 40. The temporarily placed part carrier C is then received and transported by the transfer robot 60 (not shown) of the transfer module 8.

[0071] FIG. 7 is a schematic front view of the first temporary stage 38 , and FIG. 8 is a schematic front view of the second temporary stage 40 .

[0072] The first temporary stage 38 shown in FIG. 7 includes two shelves 46 and 48 as shelves for arranging substrates W.

[0073] The first rack 46 at the lower level is a rack for temporarily storing substrates W1 before use that have been loaded from the loading module 4. The second rack 48 at the upper level is a rack for temporarily storing substrates W2 after use that have been bonded with components by the bonding device 18 described later.

[0074] By providing the second shelf 48 in addition to the first shelf 46 , the substrate W2 used for component bonding can be returned to the loading module 4 through the relay module 6 and discharged to the outside of the bonding system 2 .

[0075] By arranging the first shelf 46 and the second shelf 48 vertically, the horizontal size of the relay module 6 can be reduced. By arranging the unused substrates W1, which have a higher particle retention rate than the used substrates W2, on the lower first shelf 46, the intrusion of particles can be suppressed.

[0076] The second temporary stage 40 shown in FIG. 8 has two shelves 50 and 52 as shelves for arranging the component carriers C.

[0077] The third rack 50 on the lower level is used to temporarily store the unused component carriers C1 that have been loaded into the loading module 4. The fourth rack 52 on the upper level is used to temporarily store the used component carriers C2 that have been unloaded from the bonding device 18 described later.

[0078] By providing the fourth shelf 52 in addition to the third shelf 50 , the used part carrier C2 that has been used for part bonding can be returned to the loading module 4 through the relay module 6 and discharged to the outside of the bonding system 2 .

[0079] By arranging the third shelf 50 and the fourth shelf 52 one above the other, the horizontal dimensions of the relay module 6 can be reduced. By arranging the unused component carriers C1, which have a relatively higher particle retention rate than the used component carriers C2, on the lower third shelf 50, the intrusion of particles can be suppressed.

[0080] Returning to Figure 6, the temporary stages 38 and 40 of this embodiment are arranged obliquely to intersect both the X-axis direction and the Y-axis direction in a planar perspective. Here, the arrangement of the temporary stages 38 and 40 will be described using Figures 9 and 10.

[0081] 9 and 10 are schematic plan views each showing the periphery of the relay module 6 including the first temporary stage 38 and the second temporary stage 40 .

[0082] FIG. 9 shows a state where the substrate W placed on the first temporary stage 38 is being transported, and FIG. 10 shows states before and after the component carrier C placed on the second temporary stage 40 is being transported.

[0083] As shown in Figures 9 and 10, the first temporary stage 38 and the second temporary stage 40 are arranged in the Y-axis direction and are arranged at opposite sides relative to the central axis 63 of the moving path of the downstream transfer robot 60 along the X-axis direction.

[0084] As shown in Figure 9, the first temporary stage 38 is configured to transfer substrates W to the upstream transfer robot 24 along a transfer direction A3, which is tilted in plan view, and to transfer substrates W to the downstream transfer robot 60 along a transfer direction A4, which is tilted in plan view. In this embodiment, transfer directions A3 and A4 intersect both the X-axis and Y-axis directions in plan view and are parallel to each other. In particular, transfer direction A4 for the downstream transfer robot 60 is tilted toward the center axis 63 of the transfer robot 60's travel path.

[0085] As shown in Figure 10, the second temporary stage 40 is configured to transfer the component carrier C to the upstream transfer robot 24 along a transfer direction A5, which is tilted in plan view, and to transfer the component carrier C to the downstream transfer robot 60 along a transfer direction A6, which is tilted in plan view. In this embodiment, transfer directions A5 and A6 intersect both the X-axis and the Y-axis in plan view and are parallel to each other. In particular, transfer direction A6 for the downstream transfer robot 60 is tilted toward the center axis 63 of the transfer robot 60's travel path.

[0086] By setting these transfer directions A4 and A6, even if the downstream transfer robot 60 is capable of horizontal movement only in the X-axis direction and lacks Y-axis movement, the transfer robot 60 can still rotate horizontally to receive substrates W from the first temporary stage 38 and parts carriers C from the second temporary stage 40. This simplifies the structure of the transfer module 8 and improves processing efficiency. Furthermore, this configuration allows the transfer robot 60 to adopt a more cost-effective three-axis type, rather than a four-axis type with greater freedom of movement for the hand 64, contributing to cost reduction.

[0087] The inclination angles of the transfer directions A3 , A4 , A5 , and A6 with respect to the central axis 63 may be appropriately set according to the specifications of the bonding system 2 .

[0088] By moving the upstream transfer robot 24 in the Y-axis direction, the transfer robot 24 can be moved to a position where the substrate W can be transferred between the first temporary stage 38 and the second temporary stage 40, respectively.

[0089] Returning to FIG. 6 , the relay module 6 further includes a first positioning platform 42 and a second positioning platform 44 .

[0090] The first positioning stage 42 is used to align substrates W being transported by the transfer robot 60 of the transfer module 8 in a predetermined orientation. The transfer robot 60 places the substrate W, held by its hand 64, on the first positioning stage 42, temporarily placing the substrate W before bonding. The substrate W placed on the first positioning stage 42 is positioned in a predetermined orientation and, after being transferred to the transfer robot 60, is transported into the bonding apparatus 18.

[0091] The second positioning stage 44 is used to align the component carrier C being transported by the transfer robot 60 of the transfer module 8 in a predetermined orientation. The transfer robot 60 places the component carrier C, held by its hand 68, on the second positioning stage 44, temporarily placing the component carrier C before joining. The component carrier C placed on the second positioning stage 44 is positioned in a predetermined orientation and, after being transferred to the transfer robot 60, is transported into the joining apparatus 18.

[0092] By providing the temporary stages 42 and 44 , the substrate W and the component carrier C can be aligned in a predetermined direction before being carried into the bonding device 18 , which is related to improving the bonding processing accuracy performed in the bonding device 18 .

[0093] 11 and 12 are perspective views each for explaining a method of using the first positioning stage 42 .

[0094] As shown in FIG. 11 and FIG. 12 , the first positioning stage 42 includes a rotating plate 73 ( FIG. 11 ), a rotation position detecting unit 74 , and a driving box 76 .

[0095] The rotating plate 73 is a member for rotating the substrate W. The rotating plate 73 is rotatable about a rotation axis Ax1 extending in the Z-axis direction (arrow R3), and as shown in FIG12 , when the substrate W is placed thereon, the rotating plate 73 rotates the substrate W (arrow R4).

[0096] The rotational position detector 74 is a component for detecting the rotational position of the substrate W. In this embodiment, the rotational position detector 74 irradiates light toward the outer periphery of the substrate W and detects the light that passes through a position corresponding to the notch N provided in the substrate W, thereby detecting the rotational position of the substrate W. This detection method is not limited to this one; any detection method can be used as long as it can detect the rotational position of the substrate W.

[0097] The drive box 76 is a box-shaped member that houses the drive components for the rotating plate 73 and the rotational position detector 74. The drive box 76 is connected to the control unit 19 shown in FIG1A . The control unit 19 determines the rotational position of the substrate W based on the detection results of the rotational position detector 74 and adjusts the rotation amount of the rotating plate 73 to achieve a predetermined rotational position. This positions the substrate W in a predetermined orientation.

[0098] 13 and 14 are perspective views for explaining how to use the second positioning stage 44. FIG.

[0099] As shown in FIG. 13 and FIG. 14 , the second positioning stage 44 includes a pair of aligners 78 and a drive box 80 .

[0100] The pair of aligners 78 is used to position the component carrier C. The pair of aligners 78 can move toward and away from each other (arrow A7), and when moving toward each other, they sandwich the component carrier C and position it in a predetermined direction.

[0101] The drive box 80 is a box-shaped member that incorporates a drive member of the aligner 78. The drive box 80 is connected to the control unit 19 shown in Fig. 1A.

[0102] As shown in Figure 14, with the pair of aligners 78 open, the transfer robot 60 places the part carrier C, held by the hand 68, between the pair of aligners 78. The pair of aligners 78 then moves toward closing (arrow A8), and the linear portions S engaging the part carrier C sandwich the part carrier C, thereby positioning the part carrier C in a predetermined orientation.

[0103] 15 and 16 are schematic plan views each showing the periphery of the relay module 6 including the first positioning stage 42 and the second positioning stage 44 .

[0104] FIG. 15 shows a state where the substrate W is transferred to the first positioning stage 42 , and FIG. 16 shows a state where the component carrier C is transferred to the second positioning stage 44 .

[0105] Similar to the temporary stages 38 and 40 shown in Figures 9 and 10 , the first positioning stage 42 and the second positioning stage 44 are arranged diagonally in a plan view. As shown in Figures 15 and 16 , the positioning stages 42 and 44 are arranged on opposite sides of each other with respect to the central axis 63 of the movement path of the downstream transfer robot 60 along the X-axis direction.

[0106] 15 , the first positioning stage 42 is configured to transfer the substrate W to the transfer robot 60 along a transfer direction A9 that is oblique in plan view. The transfer direction A9 of the first positioning stage 42 is parallel to the transfer direction A4 of the first temporary stage 38 ( FIG. 9 ).

[0107] As shown in FIG16 , the second positioning stage 44 is configured to transfer the component carrier C to the transfer robot 60 along a transfer direction A10 that is oblique in plan view. The transfer direction A10 of the second positioning stage 44 is parallel to the transfer direction A6 ( FIG10 ) of the second temporary stage 40 .

[0108] Returning to Figure 6, temporary stages 38 and 40 are arranged on the upper layer, and positioning stages 42 and 44 are arranged on the lower layer. A support plate 41 is provided in the relay module 6 to support the temporary stages 38 and 40. The support plate 41 vertically separates the temporary stages 38 and 40 from the positioning stages 42 and 44. This vertical arrangement reduces the floor area of the relay module 6 and prevents the intrusion of particles. Furthermore, since the positioning stages 42 and 44 have movable parts inside, the generation of particles due to friction from these movable parts is a concern. However, by arranging the positioning stages 42 and 44 below the support plate 41 that divides the space vertically, the possibility of particles adhering to the substrates W or parts carriers C on the temporary stages 38 and 40 can be reduced.

[0109] 1A , the control unit 19 is a component that controls the various components of the joint system 2. The control unit 19 is composed of, for example, a microcomputer having a processor and a memory, and the memory stores a computer program executed by the processor.

[0110] The surface treatment modules 10 , 12 , 14 , and 16 are modules for performing surface treatment on substrates W and component carriers C. After the surface treatment of the substrates W and component carriers C is performed in the surface treatment modules 10 , 12 , 14 , and 16 , a bonding process is performed in the bonding device 18 .

[0111] In this embodiment, three surface treatment modules 10, 12, and 14 are arranged on one side (+Y axis direction) of the moving path of the transfer robot 60, and one surface treatment module 16 is arranged on the other side (-Y axis direction).

[0112] In this embodiment, the surface treatment modules 10 and 12 include cleaning devices for cleaning, the surface treatment module 14 includes a plasma treatment device for surface modification, and the surface treatment module 16 includes a UV irradiation device for curing the adhesive sheet of the component carrier C.

[0113] The cleaning device of the surface treatment module 10 cleans the surfaces of the substrate W and the component carrier C using a predetermined liquid (eg, pure water, alkaline solution, neutral surfactant).

[0114] The cleaning device of the surface treatment module 12 cleans (washes) the surfaces of the substrate W and the component carrier C using a predetermined liquid (for example, pure water).

[0115] The plasma processing device of the surface treatment module 14 activates the surfaces of the substrate W and the component carrier C by irradiating plasma.

[0116] The UV irradiation device of the surface treatment module 16 irradiates the part carrier C with ultraviolet rays to harden the surface of the adhesive sheet of the part holding the part carrier C and weaken the adhesive force.

[0117] By arranging the surface treatment modules 10, 12, 14, and 16 adjacent to the transport path of the transport robot 60, the transport robot 60 can move in and out of each module in the X-axis direction to carry the substrate W and the component carrier C in and out.

[0118] Each of the surface treatment modules 10, 12, 14, and 16 is equipped with a partition wall, an opening, and a shutter. The partition wall separates the modules, the opening is located in the partition wall, facing the transport path of the transport robot 60, and the shutter door opens and closes the opening. The opening of each module is closed except when loading or unloading substrates W or component carriers C. Only when loading or unloading substrates W or component carriers C does the shutter door operate to open the opening.

[0119] A joining device 18 is further provided at a position adjacent to the transport path of the transport robot 60 .

[0120] The bonding apparatus 18 is an apparatus for bonding a plurality of components held by the component carrier C one by one to the substrate W. The bonding apparatus 18 of this embodiment includes a first bonding module 82 and a second bonding module 84 .

[0121] The first bonding module 82 is a module that receives the substrate W from the transfer robot 60 . The second bonding module 84 is a module that receives the component carrier C from the transfer robot 60 .

[0122] As shown in the enlarged view of FIG1B , a partition wall 81 is provided between the transport module 8 and the bonding device 18. Each of the bonding modules 82 and 84 is provided with openings 82g and 84g and a shutter (not shown). The openings 82g and 84g are provided in the partition wall 81 at positions facing the transport path of the transport robot 60, and the shutter is used to open and close the openings 82g and 84g. The bonding module 82 is provided with a first opening 82g for loading and unloading substrates W, and the bonding module 84 is provided with a second opening 84g for loading and unloading component carriers C.

[0123] The joining modules 82 and 84 are arranged adjacent to each other in the X-axis direction, which is the moving direction of the transfer robot 60 , and their internal spaces are connected to each other.

[0124] The first bonding module 82 includes a substrate temporary placement portion 86 , a substrate transfer device 87 , a substrate holding stage 88 , a stage moving device 89 , and a bonding head 94 .

[0125] The substrate temporary storage section 86 is used to place and temporarily store substrates W received from the transfer robot 60. The substrate transfer device 87 is used to transfer the substrates W placed on the substrate temporary storage section 86 and transfer the substrates W to the substrate holding table 88. The substrate transfer device 87 shown in Figure 1B includes a first substrate transfer device 87a and a second substrate transfer device 87b. The first substrate transfer device 87a transfers the substrates S placed on the substrate temporary storage section 26 and transfers the substrates S to the second substrate transfer device 87b. The second substrate transfer device 87b transfers the substrates S received from the first substrate transfer device 87a to the substrate holding table 88.

[0126] The substrate holding table 88 holds the substrate W received from the substrate transport device 87 and holds the substrate W while the bonding head 94 is bonding components. The stage moving device 89 moves the substrate holding table 88. The bonding head 94 receives components from the pickup head 96, described later, and bonds the received components to the substrate W. The bonding head 94 of this embodiment is movable along the X-axis direction, which is the direction in which the bonding modules 82 and 84 are arranged.

[0127] The second bonding module 84 includes a carrier temporary placement portion 90 , a carrier transfer device 91 , a carrier holding stage 92 , a stage moving device 93 , and a pickup head 96 .

[0128] The carrier temporary placement unit 90 is used to place and temporarily place the part carrier C received from the transfer robot 60. The carrier transfer device 91 is used to transfer the part carrier C placed on the carrier temporary placement unit 90 and transfer the part carrier C to the carrier holding table 92. The carrier holding table 92 is a table that holds the part carrier C received from the carrier transfer device 91 and holds the part carrier C while the pickup head 96 picks up the part. The stage moving device 93 is a device that moves the carrier holding table 92. The pickup head 96 is used to receive the part from the part carrier C held on the carrier holding table 92 and transfer the received part to the aforementioned bonding head 94.

[0129] Here, the detailed structure and operation of the carrier holding workbench 92 will be described using Figures 17 to 21.

[0130] FIG. 17 is a perspective view schematically showing the carrier holding table 92 .

[0131] As shown in FIG. 17 , the carrier holding stage 92 includes a carrier frame guide 100 , a carrier frame pressing member 102 , a plurality of support columns 104 , a drive box 106 , a sheet expansion ring 108 , and an ejector 110 .

[0132] The carrier frame guide 100 is a member that supports the carrier frame 112 of the part carrier C. The part carrier C has an outer carrier frame 112 and an inner adhesive sheet 114, and the adhesive sheet 114 holds a plurality of parts P. A conveying device (not shown) (the carrier conveying device 91 shown in FIG. 1B ) conveys the part carrier C to the carrier frame guide 100 (arrow A11), and the carrier frame guide 100 supports the carrier frame 112 of the part carrier C.

[0133] The carrier frame pressing member 102 is a member for pressing the carrier frame 112 of the component carrier C from above. The carrier frame pressing member 102 has a ring shape with an opening in the center, and the size of the opening is larger than the size of the adhesive sheet 114.

[0134] The support columns 104 support the carrier frame pressing member 102 from below, and are provided in plurality. The support columns 104 are configured to be raised and lowered by a drive box 106. When the drive box 106 raises and lowers the support columns 104, the carrier frame guide 100, the carrier frame pressing member 102, and the support columns 104 are raised and lowered in unison (arrow Z1). The carrier frame guide 100, the carrier frame pressing member 102, and the support columns 104 constitute the lifting unit 101.

[0135] The drive box 106 is a box that houses a drive unit for moving the lift unit 101 up and down.

[0136] The sheet expansion ring 108 supports the adhesive sheet 114 inside the component carrier C from below and expands it outward. When the component carrier C, supported by the carrier frame guide 100, descends, the adhesive sheet 114 of the component carrier C contacts and is supported by the sheet expansion ring 108. The sheet expansion ring 108 has a cylindrical shape extending in the Z-axis direction, with the ring portion at the top supporting the adhesive sheet 114.

[0137] The ejector 110 is a component that abuts against the adhesive sheet 114 supported by the sheet expansion ring 108 from below, thereby pushing the parts to a predetermined position, thereby assisting the pickup head 96 in picking up the parts. The ejector 110 is independent of the elevator 101 and is raised and lowered by the drive box 106.

[0138] The method of holding the component carrier C by the carrier holding table 92 having the above-described structure will be described using Figures 18 to 21. Figures 18 to 21 are each a longitudinal sectional view schematically showing the method of holding the component carrier C by the carrier holding table 92.

[0139] As shown in FIG. 18 , a conveying device (not shown) (the carrier conveying device 91 shown in FIG. 1B ) conveys the component carrier C, and causes the carrier frame guide 100 to support the carrier frame 112 of the component carrier C.

[0140] As shown in Figure 19, the lifting unit 101 is lowered (arrow Z2). This causes the component carrier C, supported by the carrier frame guide 100, to descend integrally with the lifting unit 101, with the adhesive sheet 114 of the component carrier C contacting the upper end of the sheet expansion ring 108. Further lowering the lifting unit 101 from this state causes the carrier frame 112 of the component carrier C to separate from the carrier frame guide 100, and the lowered carrier frame pressing member 102 contacts the carrier frame 112.

[0141] As shown in FIG20 , the carrier frame pressing member 102 presses the carrier frame 112 downward (arrow Z3 ). This causes the adhesive sheet 114 to expand radially outward, widening the spacing between the plurality of parts P held on the adhesive sheet 114 .

[0142] As shown in Figure 21, the ejector 110 then rises (arrow Z4), pushing up the lower surface of the adhesive sheet 114, thereby pushing the part P1 to the predetermined position. By pushing the part P1, the pickup head 96 can perform the picking operation of the part P1 with high precision.

[0143] The joining operation of joining a plurality of parts P held on the part carrier C to the substrate W one by one using the carrier holding table 92 and the substrate holding table 90 will be described with reference to FIG. 22 to FIG. 24 .

[0144] Fig. 22 is a longitudinal sectional view schematically showing a state where a substrate W is held on the substrate holding table 88. Figs. 23 and 24 are longitudinal sectional views schematically showing a method of bonding a component P held on a component carrier C to a substrate W.

[0145] As shown in FIG22 , the substrate transport device 87 shown in FIG1A transports a substrate W and places it on the holding surface 89 of the substrate holding table 88. The XY coordinate position of the substrate holding table 88 is adjusted so that the substrate W is located at a predetermined bonding operation position XY1. The bonding head 94 is positioned at a component transfer position XY2 for transferring components P to and from the pickup head 96.

[0146] As shown in Figure 23, with the ejector 110 pushing part P1 from the predetermined position on the part carrier C held on the carrier holding table 92, the pickup head 96 descends (arrow A12) to pick up part P1. At this point, the XY coordinate position of the carrier holding table 92 is adjusted so that part P1 is at the predetermined pickup position XY3.

[0147] The pickup head 96 that has picked up the part P1 moves horizontally from the pickup operation position XY3 toward the part transfer position XY2 (arrow A13), and reverses during the process (arrow R5). As a result, the part P1 is facing upward.

[0148] Next, the bonding head 94, located above the pickup head 96 at the part transfer position XY2, descends (arrow A14), sucking and holding the part P1 held by the pickup head 96. This transfers the part P1 from the pickup head 96 to the bonding head 94. Having received the part P1, the bonding head 94 moves from the part transfer position XY2 to the bonding operation position XY1 (arrow A15).

[0149] As shown in FIG24 , the bonding head 94, which has moved to the bonding operation position XY1, descends toward the substrate W held on the substrate holding table 88 (arrow A16), bonding the component P1 to the substrate W at the position corresponding to the bonding operation position XY1. This completes the bonding process for the component P1.

[0150] While the bonding head 94 is attaching part P1 to the substrate W, the pickup head 96 picks up the next part P2. To align the next part P2 at pickup position XY3, the elevator 101 supporting the part carrier C moves in the XY direction. The ejector 110 does not have XY movement and is positioned at pickup position XY3, independently of the elevator 101.

[0151] By repeatedly performing the actions shown in Figures 23 and 24, a plurality of parts P held on the part carrier C can be combined one by one with a single substrate W.

[0152] In the bonding system 2 of this embodiment, hybrid bonding is performed when bonding a component P to a substrate W, directly bonding electrodes together without using auxiliary bonding materials such as solder. To ensure high-precision hybrid bonding, the substrate W and component P undergo surface treatment before being loaded into the bonding apparatus 18.

[0153] In this embodiment, a plurality of surface treatment modules 10, 12, 14, and 16 are provided as shown in FIG1A , and a transfer robot 60 is provided in the transfer module 8 corresponding to both substrates W and component carriers C. The transfer robot 60 transfers the substrates W and component carriers C to each module for surface treatment, and then transfers them to the bonding apparatus 18.

[0154] (Substrate Processing Flow) An example of a processing flow of a substrate W performed by the bonding system 2 of this embodiment will be described using Figures 25 to 27. Figures 25 to 27 are plan views of the bonding system 2 schematically showing an example of a processing flow of a substrate W.

[0155] In FIG. 25 to FIG. 27 , the movement order of the substrate W is shown by dotted arrows.

[0156] FIG. 25 shows a movement sequence of the substrate W from being supplied by the load port 3 to being carried into the first bonding module 82 of the bonding apparatus 18 .

[0157] <Mounting and temporary placement steps of the joint system> As shown in FIG25 , the transfer robot 24 of the loading module 4 enters and exits the sealed container 20 loaded on the load port 3 and uses its hand 28 (FIGS. 2-4) to remove a substrate W from the sealed container 20. After removing the substrate W, the transfer robot 24 rotates horizontally and then, in a planar view, transfers the substrate W to the first shelf 46 (FIG. 7) below the first temporary stage 38 of the relay module 6 at an angle.

[0158] <First Cleaning Step (First Surface Treatment Step)> The transfer robot 60 of the transfer module 8 then enters and exits the first temporary stage 38, receiving the substrate W at an angle from a planar perspective. After receiving the substrate W, the transfer robot 60 rotates horizontally and then moves horizontally in the +X-axis direction to enter and exit the surface treatment module 10, transferring the substrate W to the surface treatment module 10. In the surface treatment module 10, the substrate W is cleaned using a liquid such as pure water or a chemical solution.

[0159] <Surface Modification Step (Second Surface Treatment Step)> The cleaned substrate W is unloaded from the surface treatment module 10 and received by the transfer robot 60. The transfer robot 60, having received the substrate W, moves horizontally in the +X direction to enter and exit the surface treatment module 14, transferring the substrate W to the surface treatment module 14. In the surface treatment module 14, the surface of the substrate W is modified using plasma.

[0160] <Second Cleaning Step (Third Surface Treatment Step)> The substrate W that has undergone surface modification is unloaded from the surface treatment module 14 and received by the transfer robot 60. The transfer robot 60, having received the substrate W, moves horizontally in the -X direction to enter and exit the surface treatment module 12, transferring the substrate W to the surface treatment module 12. In the surface treatment module 12, the substrate W is cleaned using pure water.

[0161] <Positioning steps> The cleaned substrate W is unloaded from the surface treatment module 12 and received by the transfer robot 60. Having received the substrate W, the transfer robot 60 moves horizontally in the -X direction, entering and exiting the third temporary stage 42 of the relay module 6. From a planar perspective, the substrate W is transferred obliquely to the third temporary stage 42. On the third temporary stage 42, the substrate W is positioned so that it is aligned in a predetermined direction.

[0162] <Steps for loading the bonding device> The transfer robot 60 receives the substrate W, which is positioned in a predetermined direction on the third temporary stage 42, at an oblique angle in a planar view. After receiving the substrate W, the transfer robot 60 moves horizontally in the +X-axis direction to enter and exit the first bonding module 82 of the bonding apparatus 18, and then carries the substrate W into the first bonding module 82.

[0163] According to the above process, after the substrate W is cleaned and surface-modified, it is aligned in a predetermined direction on the third temporary stage 42 and then carried into the first bonding module 82 .

[0164] <Combination Steps> The substrate W loaded into the first bonding module 82 is bonded to the plurality of components P loaded into the component carrier C loaded into the second bonding module 84. In this embodiment, when bonding the plurality of components P to the substrate W, the components P may be stacked in multiple layers. In this case, after the bonding process for the components P on the nth layer is completed, the substrate W is cleaned before the bonding process for the components P on the (n+1)th layer is performed.

[0165] Figure 26 shows the movement sequence of the substrate W after it is moved into the first bonding module 82 and combined with a predetermined number of parts P (for example, parts P of the nth layer), and before being combined with parts P of the next layer (for example, parts P of the n+1th layer), the substrate W is moved out of the first bonding module 82 and subjected to various surface treatments until it returns to the first bonding module 82.

[0166] As shown in FIG26 , the transfer robot 60 receives the substrate W unloaded from the first bonding module 82 and rotates horizontally to enter and exit the surface treatment module 10. Similar to the process flow of FIG25 , the transfer robot 60 transports the substrate W to sequentially perform a cleaning process (a first cleaning step) in the surface treatment module 10, a surface modification process (a surface modification step) in the surface treatment module 14, a cleaning process (a second cleaning step) in the surface treatment module 12, a positioning process (a positioning step) on the third temporary stage 42, and a supply process to the first bonding module 82 (a loading process into the bonding apparatus).

[0167] Whenever the components P of each layer are bonded, the process flow shown in FIG. 26 is executed, thereby enabling the process of bonding the components P of multiple layers to the substrate W to be performed with good precision.

[0168] FIG. 27 shows the movement sequence of the substrate W from the time the substrate W is unloaded from the first bonding module 82 to the time the substrate W returns to the loading port 3 after all the parts P to be bonded to the substrate W are bonded.

[0169] <Removal and temporary placement steps from the bonding device> As shown in FIG27 , the transfer robot 60 receives the substrate W unloaded from the first bonding module 82 and moves horizontally in the −X-axis direction to enter and exit the first temporary stage 38. The transfer robot 60 transfers the substrate W obliquely to the second shelf 48 ( FIG7 ) above the first temporary stage 38 in a planar view.

[0170] <Self-joining system removal steps> The transfer robot 24 of the loading module 4 enters and exits the first temporary stage 38 and receives the substrate W obliquely from a planar perspective. The transfer robot 24 that receives the substrate W rotates horizontally and transfers the substrate W to the loading port 3 .

[0171] According to the processing flow shown in FIG. 27 , the substrate W after the bonding process of the part P is completed can be returned to the loading port 3 and discharged to the outside of the bonding system 2 .

[0172] (Processing flow of parts carrier) An example of the processing flow of the component carrier C performed by the bonding system 2 of this embodiment will be described using Figures 28 and 29. Figures 28 and 29 are each a plan view of the bonding system 2 schematically showing an example of the processing flow of the component carrier C.

[0173] In Figures 28 and 29, the movement sequence of the part carrier C is shown by dotted arrows.

[0174] FIG. 28 shows a movement sequence of the component carrier C from being supplied by the loading port 3 to being carried into the second bonding module 84 of the bonding device 18 .

[0175] <Mounting and temporary placement steps of the joint system> As shown in Figure 28, the transfer robot 24 of the loading module 4 enters and exits the sealed container 22 loaded on the loading port 3, and uses its hand 32 (Figures 2-4) to remove a part carrier C from the sealed container 22. After removing the part carrier C, the transfer robot 24 rotates horizontally and then, in a planar view, transfers the part carrier C diagonally to the third shelf 50 (Figure 8) below the second temporary stage 40 of the relay module 6.

[0176] <First Cleaning Step (First Surface Treatment Step)> The transfer robot 60 of the transfer module 8 enters and exits the second temporary stage 40, receiving the part carrier C at an angle in a planar view. After receiving the part carrier C, the transfer robot 60 rotates horizontally and then moves horizontally in the +X-axis direction to enter and exit the surface treatment module 10, transferring the part carrier C to the surface treatment module 10. In the surface treatment module 10, the part carrier C is cleaned using a liquid such as pure water or a chemical solution.

[0177] <Surface Modification Step (Second Surface Treatment Step)> The cleaned part carrier C is unloaded from the surface treatment module 10 and received by the transfer robot 60. The transfer robot 60, having received the part carrier C, moves horizontally in the +X direction to enter and exit the surface treatment module 14, transferring the part carrier C to the surface treatment module 14. In the surface treatment module 14, the surface of the part carrier C is modified using plasma.

[0178] <Second Cleaning Step (Third Surface Treatment Step)> The part carrier C, which has undergone surface modification, is unloaded from the surface treatment module 14 and received by the transfer robot 60. The transfer robot 60, having received the part carrier C, moves horizontally in the -X direction to enter and exit the surface treatment module 12, transferring the part carrier C to the surface treatment module 12. In the surface treatment module 12, the part carrier C is cleaned using pure water.

[0179] <Ultraviolet irradiation step (fourth surface treatment step)> The cleaned part carrier C is unloaded from the surface treatment module 12 and received by the transfer robot 60. The transfer robot 60, having received the part carrier C, moves horizontally in the +X direction, entering and exiting the surface treatment module 16, and transfers the part carrier C to the surface treatment module 16. In the surface treatment module 16, the part carrier C is irradiated with ultraviolet light. This hardens the adhesive sheet 114 of the part carrier C, weakening the adhesion of the part P.

[0180] <Positioning steps> After the ultraviolet irradiation treatment, the part carrier C is unloaded from the surface treatment module 16 and received by the transfer robot 60. The transfer robot 60, having received the part carrier C, moves horizontally in the -X-axis direction to enter and exit the fourth temporary stage 44 of the relay module 6. From a planar perspective, the part carrier C is transferred diagonally to the fourth temporary stage 44. On the fourth temporary stage 44, the part carrier C is positioned so that it is aligned in a predetermined direction.

[0181] <Steps for loading the bonding device> The transfer robot 60 receives the part carrier C, which is positioned in a predetermined direction on the fourth temporary stage 44, at an oblique angle in a planar view. After receiving the part carrier C, the transfer robot 60 moves horizontally in the +X-axis direction to enter and exit the second bonding module 84 of the bonding apparatus 18, and then transfers the part carrier C into the second bonding module 84.

[0182] According to the above process, after the part carrier C is cleaned, surface-modified and irradiated with ultraviolet light, it is aligned in a predetermined direction on the fourth temporary carrier 44 and then supplied to the second bonding module 84.

[0183] <Parts removal steps, joining steps> In the second bonding module 84, the pickup head 96 sequentially removes the plurality of parts P held on the part carrier C, transfers them to the bonding head 94, and then bonds them to the substrate W. After all the parts P have been removed from the used part carrier C, it is unloaded from the second bonding module 84 and discharged from the bonding system 2 to the outside.

[0184] FIG. 29 shows the movement sequence of the part carrier C from the second joining module 84 to the return to the loading port 3 after the part carrier C is moved out from the second joining module 84 after all the parts P to be taken out are taken out.

[0185] <Removal and temporary placement steps from the bonding device> As shown in FIG29 , the transfer robot 60 receives the component carrier C removed from the second bonding module 84 and moves horizontally in the −X-axis direction to enter and exit the second temporary stage 40. The transfer robot 60 transfers the component carrier C diagonally to the fourth shelf 52 ( FIG8 ) above the second temporary stage 40 in a planar view.

[0186] <Self-joining system removal steps> The transfer robot 24 of the loading module 4 enters and exits the second temporary stage 40 and receives the part carrier C obliquely from a planar perspective. The transfer robot 24 that receives the part carrier C rotates horizontally and transfers the part carrier C to the loading port 3.

[0187] According to the processing flow shown in Figure 29, the used part carrier C from which the part P has been taken out can be returned to the loading port 3 and discharged to the outside of the bonding system 2.

[0188] According to the above structure and method, as a hybrid bonding system that can directly bond the electrodes of the part P and the substrate W, in particular, a bonding system 2 with high processing efficiency that can automatically transport both the part carrier C and the substrate W can be constructed.

[0189] By using the transfer robots 24 and 60 corresponding to two types of transfer objects, namely, the parts P and the substrates W, the parts P and the substrates W can be efficiently transferred respectively, thereby realizing a bonding system 2 with high processing efficiency.

[0190] Furthermore, by providing the temporary module 6, substrates W and component carriers C can be efficiently transferred between the loading module 4 and the transfer module 8. Furthermore, by adding a positioning function for the component carriers C and substrates W to the relay module 6, the accuracy of the component bonding process performed in the bonding apparatus 18 can be improved.

[0191] The number of component carriers C required for a single substrate W varies. For example, five component carriers C may be required for a single substrate W. The processing flows for substrates W shown in Figures 25 to 27 and the processing flows for component carriers C shown in Figures 28 and 29 can be executed at appropriate times based on the number of component carriers C required for a single substrate W, and can also be executed in parallel.

[0192] (Action, Effect 1) The bonding system 2 of this embodiment comprises: a plurality of surface treatment modules 10, 12, 14, 16 for performing surface treatment on a plurality of parts P held on a part carrier C and a surface treatment on a substrate W for bonding the plurality of parts P; a bonding device 18 for bonding the plurality of surface-treated parts P to the surface-treated substrate W one by one; and a conveying module 8 for conveying the part carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18. The conveying module 8 comprises: a conveying robot 60 having a hand 64 (first hand) for holding the substrate W and a hand 68 (second hand) for holding the part carrier C; and a robot moving workbench 62 for moving the conveying robot 60 along the X-axis direction (first direction).

[0193] With this configuration, the transfer robot 60 can transport both the substrate W and the parts carrier C, allowing both to move between the surface treatment modules 10, 12, 14, and 16 and the bonding apparatus 18, thereby realizing a bonding system 2 with high processing efficiency. Furthermore, the system is not limited to the surface treatment modules 10, 12, 14, and 16. Any surface treatment module having at least one surface treatment module capable of processing the substrate W and at least one surface treatment module capable of processing the parts carrier C, and thereby performing surface treatment on the plurality of parts P held on the parts carrier C and the substrate W used to bond the plurality of parts P, may be sufficient.

[0194] Furthermore, in the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 14 and the bonding apparatus 18 are positioned on opposite sides of the transport robot 60's movement path along the X-axis (first direction). This configuration allows the transport robot 60 to move in the X-axis direction and rotate horizontally, making it easy to transfer the part carrier C and part P to each of the surface treatment modules 10, 12, and 14 and the bonding apparatus 18 positioned on opposite sides of the transport robot 60's movement path. Furthermore, the system is not limited to three surface treatment modules 10, 12, and 14; it suffices that at least one surface treatment module and the bonding apparatus 18 be positioned on opposite sides of the transport robot 60's movement path along the X-axis.

[0195] In the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 1416 perform surface treatment using any of ultraviolet light, plasma, and liquid. This configuration enables multiple types of surface treatment to be performed on the substrate W or the component carrier C.

[0196] Furthermore, in the bonding system 2 of this embodiment, the component carrier C is a tape frame having a UV-curable adhesive sheet 114, and the surface treatment module 16 includes an ultraviolet irradiation device for irradiating the adhesive sheet 114 of the tape frame with ultraviolet light. With this configuration, the surface treatment module 16 irradiates the adhesive sheet 114 of the tape frame with ultraviolet light, weakening the adhesion of the component P to the adhesive sheet 114, making it easier to pick up the component P from the tape frame. Furthermore, it is sufficient that at least one surface treatment module, not just the surface treatment module 16, includes an ultraviolet irradiation device for irradiating the adhesive sheet 114.

[0197] Furthermore, in the bonding system 2 of this embodiment, the bonding apparatus 18 includes a first bonding module 82 for loading substrates W and a second bonding module 84 for transporting component carriers C. The first bonding module 82 and the second bonding module 84 are arranged in the X-axis direction (first direction). With this configuration, by arranging the two bonding modules in the X-axis direction, the transport robot 60 can easily enter and exit each bonding module 82 and 84 simply by moving in the X-axis direction (first direction).

[0198] The bonding system 2 of this embodiment further includes a partition wall 81 that separates the transport module 8 from the bonding apparatus 18. The partition wall 81 is provided with openings 82g and 84g. The openings 82g and 84g are used to transfer the component carrier C and substrate W held by the transport module 8 to the bonding apparatus 18. With this configuration, the partition wall 81 separates the area other than the openings 82g and 84g, thereby suppressing the intrusion of particles.

[0199] Furthermore, in the bonding system 2 of this embodiment, the openings 82g and 84g provided in the partition wall 81 include a first opening 82g for passing the substrate W and a second opening 84g for passing the component carrier C. With this configuration, the first opening 82g for passing the substrate W and the second opening 84g for passing the component carrier C are separated, thereby further suppressing the incorporation of particles.

[0200] Furthermore, in the bonding system 2 of this embodiment, hand 64 (first hand) and hand 68 (second hand) are arranged vertically offset from each other and are independently movable forward and backward. This configuration prevents interference between hand 64 and hand 68 while simultaneously maintaining separate support for the component carrier C and substrate W.

[0201] Furthermore, in the bonding system 2 of this embodiment, the hand 64 (first hand) is positioned above the hand 68 (second hand). This configuration allows the component carrier C, which has a higher particle adhesion rate than the substrate W, to be positioned below, thereby suppressing the intrusion of particles from the component carrier C.

[0202] In the bonding system 2 of this embodiment, the substrate W is a wafer and the component carrier C is a tape frame. With this configuration, a bonding process can be performed in which the component P held on the tape frame is bonded to the wafer.

[0203] In addition, the bonding method of this embodiment includes the following steps: performing surface treatment on a plurality of parts P held on a part carrier C; performing surface treatment on a substrate W used to bond the plurality of parts P; transporting the surface-treated substrate W toward the bonding device 18 by a hand 64 (first hand); transporting the surface-treated part carrier C toward the bonding device 18 by a hand 68 (second hand); bonding the surface-treated plurality of parts P one by one to the surface-treated substrate W using the bonding device 18; removing the substrate W to which the plurality of parts P have been bonded from the bonding device 18 by the hand 64; and removing the part carrier C from which the plurality of parts P have been removed from the bonding device 18 by the hand 68.

[0204] According to this method, the substrate W and the component carrier C can be transported by the transport robot 60 so that both can be moved in and out of the bonding device 18, thereby realizing a bonding system 2 with high processing efficiency.

[0205] (Action, Effect 2) The bonding system 2 of this embodiment includes: a load-in module 4, which carries in a part carrier C holding a plurality of parts P and a substrate W for bonding the plurality of parts P; a relay module 6, which carries the part carrier C and substrate W received from the load-in module 4; a conveying module 8, which conveys the part carrier C and substrate W loaded on the relay module 6 along the X-axis direction (first direction); surface treatment modules 10, 12, 14, 16, which perform surface treatment on the plurality of parts P held on the part carrier C and the substrate W; and a bonding device 18, which bonds the plurality of surface-treated parts P to the surface-treated substrate W one by one, and the conveying module 8 conveys the part carrier C and substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18.

[0206] With this configuration, the transport module 8 can transport both the substrate W and the component carrier C, allowing both to move between the surface treatment modules 10, 12, 14, and 16 and the bonding apparatus 18, thereby realizing a bonding system 2 with high processing efficiency. Furthermore, the system is not limited to the surface treatment modules 10, 12, 14, and 16; any surface treatment module may be provided, wherein at least one surface treatment module can process the substrate W and at least one surface treatment module can process the component carrier C, thereby performing surface treatment on the plurality of components P held on the component carrier C and on the substrate W used to bond the plurality of components P.

[0207] Furthermore, in the bonding system 2 of this embodiment, the relay module 6 includes a first temporary stage 38 for placing the substrate W and a second temporary stage 40 for placing the component carrier C. With this configuration, the substrate W and the component carrier C can be placed in different locations.

[0208] Furthermore, in the bonding system 2 of this embodiment, the first temporary stage 38 includes a first shelf 46 for placing a substrate W received from the carry-in module 4 before use, and a second shelf 48 for placing a substrate W after use, to which a plurality of parts P have been bonded. The second temporary stage 40 includes a third shelf 50 for placing a component carrier C received from the carry-in module 4 before use, and a fourth shelf 52 for placing a component carrier C after a plurality of parts P have been removed. With this configuration, substrates W before use and substrates W after use can be separately placed on the first temporary stage 38, and component carriers C before use and component carriers C after use can be separately placed on the second temporary stage 40.

[0209] Furthermore, in the bonding system 2 of this embodiment, the first shelf 46 is located below the second shelf 48, and the third shelf 50 is located below the fourth shelf 52. With this configuration, since substrates W and component carriers C are more likely to contain particles before use than after use, placing the substrates W and component carriers C before use at the bottom can suppress the intrusion of particles into the substrates W and component carriers C after use.

[0210] Furthermore, in the bonding system 2 of this embodiment, the first temporary stage 38 is configured to transfer the substrate W to the transport module 8 in a first transfer direction A4 in a planar view, and the second temporary stage 40 is configured to transfer the component carrier C to the transport module 8 in a second transfer direction A6 in a planar view. With this configuration, the temporary stages 38 and 40 can each transfer the substrate W and component carrier C to the transport module 8 in a desired direction.

[0211] Furthermore, in the bonding system 2 of this embodiment, the first temporary stage 38 and the second temporary stage 40 are arranged in the Y-axis direction (second direction) intersecting the X-axis direction (first direction) in a planar view, and the first transfer direction A4 and the second transfer direction A6 each intersect with the X-axis direction. This configuration allows the temporary stages 38 and 40 to be positioned facing the transfer module 8, allowing for smooth transfer of the component carrier C and substrate W.

[0212] Furthermore, in the bonding system 2 of this embodiment, the relay module 6 further includes positioning stages 42 and 44 for receiving the component carrier C and substrate W from the transport module 8 and positioning them in predetermined transfer directions A9 and A10. This configuration facilitates maintaining a constant orientation of the component carrier C and substrate W within the bonding apparatus 18 by positioning them in the predetermined transfer directions A9 and A10 before loading them into the bonding apparatus 18, thereby improving bonding accuracy.

[0213] Furthermore, in the bonding system 2 of this embodiment, the positioning stages 42 and 44 include a first positioning stage 42 for positioning the substrate W and a second positioning stage 44 for positioning the component carrier C. With this configuration, the substrate W and the component carrier C can be positioned separately on the different stages 42 and 44.

[0214] Furthermore, in the bonding system 2 of this embodiment, the positioning stages 42 and 44 are located below the first temporary stage 38 and the second temporary stage 40. According to this configuration, the incorporation of particles can be suppressed.

[0215] Furthermore, in the bonding system 2 of this embodiment, the loading module 4 includes a transfer robot 24 (first transfer robot) having a hand 28 (first hand) for holding a substrate W and a hand 32 (second hand) for holding a component carrier C; and a robot moving stage 26 (first robot moving stage) for moving the transfer robot 24 in the Y-axis direction (second direction) intersecting the X-axis direction (first direction) in a two-dimensional view. This configuration enables the transfer robot 24 to transport both the substrate W and the component carrier C.

[0216] Furthermore, in the bonding system 2 of this embodiment, the transport module 8 includes a transport robot 60 (second transport robot) having a hand 64 (third hand) that holds the substrate W and a hand 68 (fourth hand) that holds the component carrier C; and a robot moving stage 62 (second robot moving stage) that moves the transport robot 60 in the X-axis direction (first direction). This configuration enables the transport robot 60 to transport both the substrate W and the component carrier C.

[0217] Furthermore, in the bonding system 2 of this embodiment, the surface treatment modules 10, 12, and 14 and the bonding apparatus 18 are positioned on opposite sides of the transport module 8's movement path along the X-axis (first direction). This configuration allows the transport robot 60 to both move in the X-axis direction and rotate horizontally, making it easy to transfer the part carrier C and the part P to each of the surface treatment modules 10, 12, and 14 and the bonding apparatus 18 positioned on opposite sides of the transport module 8's movement path. Furthermore, the system is not limited to three surface treatment modules 10, 12, and 14; it suffices that at least one surface treatment module and the bonding apparatus 18 be positioned on opposite sides of the transport module 8's movement path along the X-axis.

[0218] In the bonding system 2 of this embodiment, the substrate W is a wafer and the component carrier C is a tape frame. With this configuration, a bonding process can be performed in which the component P held on the tape frame is bonded to the wafer.

[0219] In addition, the bonding method of this embodiment includes the following steps: using the load-in module 4 to load the part carrier C holding multiple parts P and the substrate W used to combine the multiple parts P; using the relay module 6 to load the part carrier C and substrate W received from the load-in module 4; using the conveying module 8 to convey the part carrier C and substrate W loaded on the relay module 6 along the X-axis direction (first direction); using the surface treatment modules 10, 12, 14, 16 to perform surface treatment on the multiple parts P held on the part carrier C and the surface treatment on the substrate W; and using the bonding device 18 to combine the multiple parts P that have been surface treated one by one with the substrate W that has been surface treated, and using the conveying module 8 to transport the part carrier C and the substrate W between the surface treatment modules 10, 12, 14, 16 and the bonding device 18.

[0220] According to this method, the substrate W and the component carrier C can be transported by the transport module 8 so that both can be moved between the surface treatment modules 10, 12, 14, 16 and the bonding device 18, thereby realizing a bonding system 2 with high processing efficiency.

[0221] (Modifications, etc.) In the above embodiment, although the substrate W is a wafer and the part carrier C is a tape frame, the present invention is not limited to this case. The substrate W can also be a substrate of a different type from the wafer, and the part carrier C can also be a part carrier of a different type from the tape frame.

[0222] Furthermore, in the above embodiment, although the case of providing three surface treatment modules 10, 12, and 14 as the first surface treatment module has been described, the number of first surface treatment modules is not limited to three and may be any number. Similarly, although the case of providing one surface treatment module 16 as the second surface treatment module has been described, the number of second surface treatment modules is not limited to one and may be any number.

[0223] Furthermore, the specific surface treatment methods (cleaning, surface modification, ultraviolet irradiation) in the surface treatment modules 10, 12, 14, and 16 can be appropriately modified according to the specifications of the substrate W or the component P. The surface treatment modules 10, 12, 14, and 16 are not limited to those capable of treating both the substrate W and the component carrier C; they may be dedicated substrate surface treatment modules or dedicated component carrier surface treatment modules.

[0224] In addition, in the above embodiment, although the layout of each module shown in Figure 1A is applied, the present invention is not limited to this case. For example, the layout can be appropriately changed by changing the arrangement of the surface treatment modules 10, 12, 14, and 16.

[0225] While this disclosure has been fully described with reference to the accompanying drawings and with reference to the preferred embodiments, various variations and modifications will readily occur to those skilled in the art. Such variations and modifications should be understood to be encompassed within the scope of this disclosure as defined by the appended claims. Furthermore, variations in the combination or order of elements in each embodiment are possible without departing from the scope and spirit of this disclosure.

[0226] In addition, the above-mentioned various modifications can be appropriately combined to achieve the effects of each.

[0227] Industrial applicability The present disclosure is applicable to a bonding system and a bonding method for bonding a plurality of components held on a component carrier to a substrate one by one.

[0228] 2:Joint system 3: Loading port 4:Move in the module 6: Relay module 8:Transportation module 10,12,14,16: Surface treatment module 10g, 12g, 14g, 16g: components 18:Joint device 19: Control Department 20,22: Sealed container 24,60: Transport robot 26,62:Robot mobile workbench 28,32,64,68: Hands 30,34,66,70: Arm 36,72: base 38: 1st temporary stage 40: Second temporary stage 41: Support plate 42: 1st positioning platform 44: Second positioning platform 46: 1st shelf 48: 2nd shelf 50: 3rd shelf 52: 4th shelf 63:Central axis 73: Rotating plate 74: Rotational position detection unit 76,80,106: drive box 78: Aligner 81: Partition wall 82: 1st joint module 82g: 1st opening 84: Second joint module 84g: 2nd opening 86: Substrate temporary placement 87:Substrate transfer device 87a: First substrate conveying device 87b: Second substrate conveying device 88: Substrate holding table 89: stage moving device 90: Carrier temporary placement 91: Carrier transport device 92:Carrier holding workbench 93: stage moving device 94:Joint head 96: Pickup head 100:Carrier frame guide 101: Lifting Department 102: Carrier frame pressing piece 104: Pillar 108: Sheet expansion ring 110: Ejector 112:Carrier frame 114: Adhesive sheet A1,A2,A3,A4,A7,A8,A11,A12,A13,A14,A15,A16,R1,R2,R3,R4,R5,X1,Y1,Z1,Z2,Z3,Z4: Arrows A3,A4,A5,A6,A9,A10: Transfer direction Ax1: Rotation axis C: Parts carrier C1: Parts carrier before use C2: Parts carrier after use N: Notch P, P1, P2: Parts S: Straight line W: substrate W1: Substrate before use W2: Substrate after use X, Y, Z: direction XY1: Joining operation position XY2: Part transfer position XY3: Pick up work position

Claims

1. A bonding system comprising: an infeed module for infeeding a component carrier holding a plurality of components and a substrate for bonding the plurality of components; a relay module for holding the component carrier and the substrate received from the infeed module; a conveying module for conveying the component carrier and the substrate, which have been placed in the relay module, along a first direction; a surface treatment module for performing surface treatment on the plurality of components held on the component carrier and on the substrate; and a bonding device for bonding the surface-treated plurality of components one by one to the surface-treated substrate, wherein the conveying module conveys the component carrier and the substrate between the surface treatment module and the bonding device, the infeed module comprising: a first conveying robot having a first hand holding the substrate and a second hand holding the component carrier, the first hand and the second hand being vertically offset from each other. The aforementioned conveying module includes: a second conveying robot, having a third hand for holding the aforementioned substrate and a fourth hand for holding the aforementioned component carrier, wherein the aforementioned third hand and the aforementioned fourth hand are arranged vertically offset from each other.

2. The bonding system of claim 1, wherein the aforementioned relay module has: a first temporary stage for holding the aforementioned substrate; and a second temporary stage for holding the aforementioned component carrier.

3. The bonding system of claim 2, wherein the first temporary stage has: a first shelf for holding the aforementioned substrate before use received from the aforementioned loading module; and a second shelf for holding the aforementioned substrate after use, having been bonded with the aforementioned plurality of parts; the second temporary stage has: a third shelf for holding the aforementioned part carrier before use received from the aforementioned loading module; and a fourth shelf for holding the aforementioned part carrier after use, having had the aforementioned plurality of parts removed.

4. The joining system of claim 3, wherein the first shelf is located below the second shelf and the third shelf is located below the fourth shelf.

5. The joining system of claim 2, wherein the first temporary stage is configured to transfer the substrate to the transfer module in a first transfer direction from a planar perspective, and the second temporary stage is configured to transfer the component carrier to the transfer module in a second transfer direction from a planar perspective.

6. The joining system of claim 5, wherein the first temporary platform and the second temporary platform are arranged in a second direction that intersects the first direction in a planar view, and the first transfer direction and the second transfer direction intersect the first direction.

7. The joining system of claim 2, wherein the aforementioned relay module further comprises a positioning platform for receiving the aforementioned part carrier and the aforementioned substrate from the aforementioned transfer module and positioning them in a predetermined transfer direction.

8. The bonding system of claim 7, wherein the aforementioned positioning stage has: a first positioning stage for positioning the aforementioned substrate; and a second positioning stage for positioning the aforementioned component carrier.

9. The engagement system of claim 7, wherein the aforementioned positioning platform is located below the aforementioned first temporary platform and the aforementioned second temporary platform.

10. The joining system of claim 1, wherein the aforementioned loading module has: a first robot moving table that moves the aforementioned first transport robot in a second direction that intersects the aforementioned first direction in a planar view.

11. The joining system of claim 1, wherein the aforementioned conveying module comprises: a second robot moving worktable, which moves the aforementioned second conveying robot in the aforementioned first direction.

12. The joining system of claim 11, wherein at least one of the aforementioned surface treatment modules and the aforementioned joining device are arranged on opposite sides of each other relative to the moving path of the aforementioned conveying module along the aforementioned first direction.

13. The bonding system of claim 1, wherein the aforementioned substrate is a wafer and the aforementioned component carrier is a tape frame.

14. A joining method comprising the steps of: using an infeed module to infeed a component carrier holding a plurality of components and a substrate for joining the plurality of components; using a relay module to place the component carrier and the substrate received from the infeed module; using a transport module to transport the component carrier and the substrate placed in the relay module along a first direction; using a surface treatment module to perform surface treatment on the plurality of components held on the component carrier and surface treatment on the substrate; and using a joining device to join the surface-treated plurality of components one by one to the surface-treated substrate, wherein the transport module is used to transport the component carrier and the substrate between the surface treatment module and the joining device, the infeed module comprising: a first transport robot having a first hand holding the substrate and a second hand holding the component carrier, the first hand and the second hand being vertically offset from each other. The aforementioned conveying module includes: a second conveying robot, having a third hand for holding the aforementioned substrate and a fourth hand for holding the aforementioned component carrier, wherein the aforementioned third hand and the aforementioned fourth hand are arranged vertically offset from each other.

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