Light emitting display device

Abstract

This invention relates to a light-emitting display device with a heat dissipation structure. The light-emitting display device includes: a substrate; a display layer located on the substrate; a protective layer located below the substrate; a thermally insulating layer located below the protective layer; a heat dissipation layer located below the thermally insulating layer; and a driving element located below the heat dissipation layer.

Description

Technical Field

[0001] The invention relates to a light-emitting display device with a heat dissipation structure. Prior Art

[0002] In modern society, a wide variety of electronic devices are widely used, including televisions, monitors, laptops, smartphones, tablets, electronic tablets, wearable devices, and navigation devices. These devices are implemented as multimedia devices with complex functions, such as video displays, video capture, music and video file playback, gaming, and broadcasting systems. These electronic devices may include display panels and driver circuit components connected to drive the display panels.

[0003] While these electronic devices can generate heat within the display panel, the driver circuit components present a greater heat generation problem. In particular, for ultra-high-resolution emissive display panels implementing 4K pixels per inch (ppi) or higher, the driver circuit components that supply data to each pixel and the display panel itself that displays the image can generate excessive heat. Furthermore, heat generated by the display panel and the driver circuit components can transfer to each other, potentially adversely affecting the functionality and lifespan of the entire display device.

[0004] Therefore, it is necessary to develop a structure of a light-emitting display device having a heat dissipation structure that quickly discharges heat generated from a display panel and driving circuit elements to the outside and a thermal insulation structure that prevents heat exchange between the display panel and the driving circuit elements. Summary of the Invention

[0005] The object of the present invention is to solve the above-mentioned problem and to provide a heat dissipation structure that can quickly discharge the heat generated by the display panel and driving circuit elements in an ultra-high resolution light-emitting display device to the outside.

[0006] The object of the present invention is to provide an ultra-high-resolution light-emitting display device with a heat-insulating structure, which prevents the heat generated by the display panel and the heat generated by the driving circuit elements from being exchanged and causing problems to the entire light-emitting display device.

[0007] In one embodiment, a light-emitting display device includes: a substrate, a display layer located on the substrate, a protective layer located below the substrate, a thermal insulation layer located below the protective layer, a heat dissipation layer located below the thermal insulation layer, and a driving element located below the heat dissipation layer.

[0008] In one embodiment, the heat insulating layer prevents first heat generated from the display layer from being transferred to the driving element, and prevents second heat generated from the driving element from being transferred to the display layer.

[0009] In one embodiment, the heat dissipation layer discharges the heat generated by the driving element to the outside through the horizontal surface direction of the substrate.

[0010] In one embodiment, the thermal insulation layer includes: a metal layer located below the thermal insulation layer, and a thermally conductive adhesive layer located below the metal layer.

[0011] In one embodiment, the thermally conductive adhesive layer transfers heat generated by the driving element to the metal layer, and the metal layer discharges the heat transferred from the thermally conductive adhesive layer to the outside along the horizontal surface direction of the substrate.

[0012] In one embodiment, the metal layer includes aluminum. The thermally conductive adhesive layer includes a filler and a silicone-based resin having a volume ratio of 8:2 to 9:1. The filler includes aluminum particles and silicon nitride particles having a volume ratio of 8:2.

[0013] In one embodiment, the light-emitting display device further includes a heat-conductive covering layer located on the display layer.

[0014] In one embodiment, the thermally conductive coating layer includes a filler and a silicone resin with a volume ratio of 8:2 to 9:1. The filler includes aluminum particles and silicon nitride particles with a volume ratio of 8:2.

[0015] In one embodiment, the thermal insulation layer includes: a first non-thermal conductive adhesive layer located below the protective layer, a vibration absorbing layer located below the first non-thermal conductive adhesive layer, and a second non-thermal conductive adhesive layer located below the vibration absorbing layer.

[0016] In one embodiment, each of the first and second non-thermally conductive adhesive layers includes a filler and an acrylic resin at a volume ratio of 3:7 to 6:4. The filler includes aluminum particles and silicon nitride particles at a volume ratio of 2:8.

[0017] In one embodiment, the light-emitting display device further includes a thermally conductive cover layer located on the display layer. The heat dissipation layer includes a metal layer located below the thermal insulation layer, and a thermally conductive adhesive layer located below the metal layer. The thermal insulation layer includes a first non-thermally conductive adhesive layer located below the protective layer, a vibration-absorbing layer located below the first non-thermally conductive adhesive layer, and a second non-thermally conductive adhesive layer located below the vibration-absorbing layer.

[0018] In one embodiment, the light-emitting display device further includes a heat dissipation element disposed on the driving element.

[0019] In one embodiment, the heat dissipation element includes a filler and a silicone resin with a volume content ratio of 8:2 to 9:1. The filler includes aluminum particles and silicon nitride particles with a volume content ratio of 8:2.

[0020] In one embodiment, a heat dissipation element includes a base, and a pattern portion including a plurality of patterns arranged at predetermined intervals on the base.

[0021] In one embodiment, the pattern portion has a cross-sectional shape of any one of a triangle, a rectangle, and a semicircle.

[0022] The light-emitting display according to the present invention can quickly dissipate heat generated by the display panel and drive circuit components to the outside. Furthermore, it can prevent the heat generated by the display panel from affecting the drive circuit components. Furthermore, it can prevent the heat generated by the drive circuit components from affecting the display panel.

[0023] Therefore, the light-emitting display device according to the present invention can prevent damage caused by self-heating of the components constituting the device. In addition, the present invention can safely ensure the reliability of the light-emitting display device and provide a light-emitting display device with a long service life.

[0024] In addition to the effects of the present invention described above, other features and advantages of the present invention are also described below. Through these descriptions, a person with ordinary knowledge in the technical field to which the present invention belongs will be able to clearly understand the contents of the present invention. Simple diagram description

[0025] The accompanying drawings are included to provide a further understanding of the present invention and are incorporated in and constitute a part of this invention. The accompanying drawings illustrate embodiments of the present invention and together with the description explain the principles of the present invention. In the drawings:

[0026] FIG. 1 is a plan view showing a schematic structure of a light-emitting display according to an embodiment of the present invention.

[0027] FIG. 2 is an equivalent circuit diagram of a pixel structure included in the light-emitting display of FIG. 1 according to an embodiment of the present invention.

[0028] FIG. 3 is an enlarged plan view illustrating a pixel structure in the light emitting display device of FIG. 1 according to an embodiment of the present invention.

[0029] FIG4 is a cross-sectional view taken along the cutting line II-II′ in FIG3 , illustrating the structure of a light-emitting display device according to an embodiment of the present invention.

[0030] FIG5 is a side view illustrating the structure of the light emitting display device according to an embodiment of the present invention along the cutting line II′ in FIG1 .

[0031] FIG. 6 is a graph illustrating the structures of a non-thermally conductive material and a thermally conductive material, and the thermal conductivity of each of these materials, according to an embodiment of the present invention.

[0032] FIG7 is an enlarged cross-sectional view of the dotted area “X” in FIG5 , illustrating the structure of the light emitting display device according to the first embodiment of the present invention.

[0033] FIG8 is an enlarged cross-sectional view of the dotted area “X” in FIG5 , illustrating the structure of a light-emitting display device according to a second embodiment of the present invention.

[0034] FIG9 is an enlarged cross-sectional view of the dotted area “X” in FIG5 , illustrating the structure of a light-emitting display device according to a third embodiment of the present invention.

[0035] FIG10 is an enlarged cross-sectional view of the dotted area “X” in FIG5 , illustrating the structure of a light-emitting display device according to a fourth embodiment of the present invention.

[0036] FIG11 is an enlarged cross-sectional view of the dotted area “X” in FIG5 , illustrating the structure of a light-emitting display device according to a fifth embodiment of the present invention.

[0037] FIG. 12 is a cross-sectional view of a heat dissipation element in another example of the light-emitting display device shown in FIG. 11 .

[0038] FIG13 is a cross-sectional view of a heat dissipation element in yet another example of the light-emitting display device shown in FIG11 . Implementation Method

[0039] The advantages and features of the present invention, as well as methods for achieving these advantages and features, are illustrated below through the embodiments described with reference to the accompanying drawings. However, the present invention may be embodied in various forms and should not be limited to the embodiments disclosed herein. Rather, these exemplary embodiments are provided so that this disclosure will be thorough and complete, and will help those skilled in the art to fully understand the scope of the present invention. Furthermore, the scope of protection of the present invention is defined by the appended patent claims and their equivalents.

[0040] The shapes, sizes, proportions, angles, and quantities illustrated in the accompanying drawings for purposes of describing various exemplary embodiments of the present invention are provided for illustrative purposes only and are not intended to limit the present invention. Therefore, the present invention is not limited to the details shown. Unless otherwise noted, similar reference numerals generally denote similar elements throughout the specification. In the following description, detailed descriptions of known related functions or configurations may be omitted when such detailed descriptions would unnecessarily obscure the main points of the present invention.

[0041] Reference will now be made in detail to exemplary embodiments of the present invention, which are illustrated in the accompanying drawings. Wherever possible, identical reference numerals will be used throughout the specification to denote identical or similar components. It should be noted that identical reference numerals used to denote similar elements in other figures will also be used for other elements, where possible. In the following description, detailed descriptions of functions and configurations known to those of ordinary skill in the art and not relevant to the main configurations of the present invention will be omitted. The terms used in this specification should be understood as follows.

[0042] In the specification, when the terms "include", "have", "include", etc. are used, one or more other elements may be added unless a term such as "only" is used. Unless otherwise clearly stated throughout, elements described in the singular should be intended to include plural elements, and vice versa.

[0043] When interpreting a component, even if there is no special statement that an error range or tolerance range is included, the component is still interpreted as including the error range or tolerance range.

[0044] In the description of various embodiments of the present invention, when describing positional relationships, for example, when the positional relationship between two components is described as "on," "above," "below," "above," "below," "next to," or "near," one or more other components may be positioned between the two components, unless more restrictive terms such as "immediately," "directly," or "immediately adjacent" are used. For example, when an element or layer is positioned "on" another element or layer, a third layer or element may be interposed therebetween. Furthermore, if a first element is described as being "on" a second element, this does not necessarily mean that the first element is positioned above the second element in the drawings. The upper and lower components of related objects may vary depending on the orientation of the objects. Therefore, when a first element is described as being "on" a second element, the first element may be positioned "below" or "above" the second element in the drawings or in actual configuration, depending on the orientation of the objects.

[0045] When describing a temporal relationship, for example, when describing the time sequence as "after," "subsequently," "next," "before," etc., non-continuous situations may be included unless more restrictive terms such as "only," "immediately," or "directly" are used.

[0046] It should be understood that although terms such as "first" and "second" may be used to describe various elements in the present invention, these elements should not be limited by these terms, as these terms are not intended to define a specific order. These terms are simply used to distinguish one element from another. For example, a first element could be referred to as a second element, and similarly, a second element could be referred to as a first element without departing from the scope of the present invention.

[0047] When describing the elements of the present invention, terms such as first, second, A, B, (a), and (b) may be used. These terms are used solely to distinguish one element from another and are not used to define the specific nature, order, or quantity of the elements. When an element is described as being "engaged," "coupled," or "connected" to another element, unless otherwise specified, the element may be directly or indirectly connected to the other element. It should be understood that other elements may be "interposed" between two elements described as being "engaged," "coupled," or "connected" to each other.

[0048] It should be understood that the term "at least one" is understood to include any and all combinations of one or more of the associated listed items. For example, the phrase "at least one of a first element, a second element, and a third element" includes all combinations of the three listed elements, any combination of any two of the three elements, and each element alone, namely, the first element, the second element, and the third element.

[0049] The features of the various embodiments of the present invention may be coupled or combined, in part or in whole, and may interact with each other in various ways and be technically driven in a manner that is fully understood by those skilled in the art to which the present invention relates. The embodiments of the present invention may be implemented independently of each other or may be implemented together in a mutually dependent relationship.

[0050] An example of a display device according to the present invention will be described in detail below with reference to the accompanying drawings. Wherever possible, the same reference numerals will be used throughout this specification to represent the same or similar components. Because the scale of each of the various elements depicted in the drawings may differ from the actual scale, for ease of description, the present invention is not limited to the scales depicted in the drawings.

[0051] The present invention will be explained below with reference to the accompanying drawings. Since the scale of each of the multiple elements depicted in the drawings may differ from the actual scale, for the convenience of description, the present invention is not limited to the scale depicted in the drawings.

[0052] Below, a light-emitting display device according to an embodiment of the present invention will be explained with reference to FIG1 . FIG1 is a plan view illustrating a schematic structure of a light-emitting display device according to an embodiment of the present invention. In FIG1 , the X-axis represents a direction parallel to the scan lines, the Y-axis represents the direction of the data lines, and the Z-axis represents the height of the display device.

[0053] 1 , the light emitting display includes a substrate 110 , a gate (or scan) driver 200 , a pad 300 , a source driver integrated circuit (IC) 410 , a flexible film 430 , a circuit board 450 , and a timing controller 500 .

[0054] Substrate 110 may comprise an electrically insulating material or a flexible material. Substrate 110 may be made of glass, metal, or plastic, but the present invention is not limited thereto. When the electroluminescent display is a flexible display, substrate 110 may be made of a flexible material such as plastic. For example, substrate 110 may comprise a transparent polyimide material.

[0055] The substrate 110 may include a display area AA and a non-display area NDA. The display area AA, which is used to display video images, can be defined as the majority of the central area of ​​the substrate 110, but the present invention is not limited thereto. The display area AA may include a plurality of pixels P arranged in a matrix. The display area AA further includes scan circuits 50 (or gate circuits) and data circuits 60. A pixel P is positioned at a location where the scan circuits 50 extending along the X-axis and the data circuits 60 extending along the Y-axis intersect.

[0056] Here, the pixel P can present a color selected from red, green, and blue, or a color selected from red, green, blue, and white. A red pixel, a green pixel, and a blue pixel can be combined together, or a red pixel, a green pixel, a blue pixel, and a white pixel can be combined together to form a unit pixel.

[0057] A non-display area NDA, which is an area not displaying video images, can be defined in a peripheral area of ​​the substrate 110 surrounding all or part of the display area AA. A low potential line 80, a gate driver 200, and a data pad 300 can be formed or disposed in the non-display area NDA.

[0058] The gate driver 200 supplies scan (or gate) signals to the scan lines based on gate control signals received from the timing controller 500 via the pad 300. The gate driver 200 can be formed as an on-board gate driver (GIP) in the non-display area NDA on one or both sides of the display area AA on the substrate 110. The on-board gate driver type means the gate driver 200 is formed directly on the substrate 110. For example, the gate driver 200 may include multiple shift registers. The on-board gate driver method refers to a structure in which the transistors in the shift registers of the gate driver 200 are formed directly on the substrate 110.

[0059] The pad portion 300 may be disposed in a non-display area NDA located at an edge of the display area AA of the substrate 110. The pad portion 300 may include a data pad 61 connected to each of the plurality of data lines 60 and a driving current pad 71 connected to each of the plurality of driving current lines 70. Although not shown in the figures, the pad portion 300 may further include a high-potential pad that receives a high-potential voltage and a low-potential pad that receives a low-potential voltage.

[0060] The source driver IC 410 receives digital image data and source control signals from the timing controller 500. Based on the source control signals, the source driver IC 410 converts the digital image data into an analog data voltage, which is then supplied to the data line 60. When the source driver IC 410 is fabricated as a chip, it can be mounted on the flexible circuit film 430 as a chip-on-film (COF) or chip-on-plastic (COP) type.

[0061] The flexible circuit film 430 may include a plurality of first connection lines connecting the pad portion 300 to the source driver integrated circuit 410, and a plurality of second connection lines connecting the pad portion 300 to the circuit board 450. The flexible circuit film 430 may be attached to the pad portion 300 using an anisotropic conductive film, thereby enabling the pad portion 300 to be connected to the first connection lines of the flexible circuit film 430.

[0062] Circuit board 450 can be attached to flexible circuit film 430. For example, an anisotropic conductive film can be used to connect the circuits of flexible circuit film 430 to the circuits of circuit board 450. Circuit board 450 can include multiple circuits implemented as a driver chip. For example, circuit board 450 can be a printed circuit board or a flexible printed circuit board.

[0063] The timing controller 500 receives digital image data and timing signals from an external motherboard via a cable on the circuit board 450. Based on the timing signals, the timing controller 500 generates gate control signals for controlling the operating timing of the gate driver 200 and source control signals for controlling the source driver integrated circuit 410. The timing controller 500 supplies the gate control signals to the gate driver 200 and the source control signals to the source driver integrated circuit 410. Depending on the product type, the timing controller 500 and the source driver integrated circuit 410 may be formed into a single chip and mounted on the substrate 110.

[0064] Television screens, computer screens, notebook screens, or flat panel display devices can be manufactured using the light-emitting display device shown in FIG1 . At this point, the flexible circuit film 430 can be bent to attach the source driver integrated circuit 410 and the circuit board 450 to the back side of the substrate 110 .

[0065] Below, a light-emitting display device according to an embodiment of the present invention will be explained with reference to Figures 2 to 4. First, Figures 2 and 3 show top views of a light-emitting display device according to an embodiment of the present invention. Figure 2 is an equivalent circuit diagram of a pixel structure included in the light-emitting display of Figure 1 according to an embodiment of the present invention. Figure 3 is an enlarged plan view of a pixel structure in the light-emitting display of Figure 1 according to an embodiment of the present invention.

[0066] The light-emitting display device according to an embodiment of the present invention may include a display layer 600 formed on a substrate 110. The light-emitting display device according to an embodiment of the present invention may include a display layer 600 formed on a substrate 110. The display layer 600 may include a display area AA and a non-display area NDA. The display area AA may include a plurality of pixels P arranged in a matrix.

[0067] Each pixel P in a light-emitting display device according to an embodiment of the present invention may be defined by a scan circuit 50, a data circuit 60, and a drive current circuit 70. Within each pixel P, a switching thin-film transistor 10, a drive thin-film transistor 20, a light-emitting diode 90, and a storage capacitor Cst (or capacitor) may be disposed. The drive current circuit 70 may be supplied with a high-voltage voltage for driving the light-emitting diode 90.

[0068] The switching thin-film transistor 10 can be configured to connect to a scan line 50 and a data line 60. The switching thin-film transistor 10 may include a gate electrode 11, a semiconductor layer 13, a source electrode 15, and a drain electrode 17. The gate electrode 11 may be part of the scan line 50. The semiconductor layer 13 may overlap with the gate electrode 11. For example, the semiconductor layer 13 may be arranged to straddle the scan line 50. The portion where the semiconductor layer 13 overlaps with the gate electrode 11 may be defined as a channel region. The source electrode 15 is connected to the data line 60 or branches off from the data line 60, and the drain electrode 17 is connected to the driver thin-film transistor 20. By supplying a data signal to the driver thin-film transistor 20, the switching thin-film transistor 10 can select the pixel P to be operated.

[0069] The driver thin-film transistor 20 drives the light-emitting diode 90 included in the pixel P selected by the switching thin-film transistor 10. The driver thin-film transistor 20 includes a gate electrode 21, a semiconductor layer 23, a source electrode 25, and a drain electrode 27. The gate electrode 21 of the driver thin-film transistor 20 can be connected to or extend from the drain electrode 17 of the switching thin-film transistor 10. The semiconductor layer 23 can be arranged to straddle the gate electrode 21. The portion of the semiconductor layer 23 that overlaps the gate electrode 21 can be defined as a channel region. The drain electrode 27 of the driver thin-film transistor 20 branches off from or is connected to the driving current line 70, and the source electrode 25 is connected to the anode electrode 91 of the light-emitting diode (or light-emitting element) 90. A storage capacitor Cst can be provided between the gate electrode 21 of the driver thin-film transistor 20 and the anode electrode 91 of the light-emitting diode 90.

[0070] The driving thin film transistor 20 is disposed between the driving current line 70 and the light emitting diode 90 . The driving thin film transistor 20 controls the amount of current flowing from the driving current line 70 to the light emitting diode 90 according to the voltage difference between the gate electrode 21 and the source electrode 25 .

[0071] Referring further to FIG. 4 , the cross-sectional structure of a light-emitting display device according to the present invention will be described. FIG. 4 is a cross-sectional view of the structure of a light-emitting display device according to an embodiment of the present invention, taken along the cutting line II-II' in FIG. The display device according to an embodiment of the present invention includes a display layer 600 formed on a substrate 110. The display layer 600 may include a driver layer 220, a light-emitting device layer 330, and an encapsulation layer 440. The driver layer 220 may include multiple thin layers formed on the substrate 110. The driver layer 220 may include a switching thin film transistor 10, a driver thin film transistor 20, and a storage capacitor Cst.

[0072] Specifically, the data line 60, the driving current line 70, the auxiliary line 83, and the light shielding layer 75 are formed on the substrate 110. The light shielding layer 75 may have an island shape that is spaced apart from the data line 60 and the driving current line 70 and overlaps with the semiconductor layers 13 and 23. In some cases, the light shielding layer 75 may be omitted.

[0073] A buffer layer 31 is deposited on substrate 110 to cover the drive current line 70, auxiliary circuit 83, data circuit 60, and light shielding layer 75. The semiconductor layer 13 of the switching thin-film transistor 10 and the semiconductor layer 23 of the driving thin-film transistor 20 are formed on the buffer layer 31. Preferably, at least the channel regions of the semiconductor layers 13 and 23 overlap with the light shielding layer 75.

[0074] A gate insulating layer 33 is deposited on a substrate 110 having semiconductor layers 13 and 23. A gate electrode 11 overlapping the semiconductor layer 13 of the switching thin film transistor 10 and a gate electrode 21 overlapping the semiconductor layer 23 of the driving thin film transistor 20 are formed on the gate insulating layer 33. Furthermore, a source electrode 15 is formed on both sides of the gate electrode 11 of the switching thin film transistor 10, contacting one side of the semiconductor layer 13 and spaced apart from the gate electrode 11, and a drain electrode 17 is formed on the other side of the semiconductor layer 13 and spaced apart from the gate electrode 11. Similarly, a source electrode 25 is formed on both sides of the gate electrode 21 of the driving thin film transistor 20, contacting one side of the semiconductor layer 23 and spaced apart from the gate electrode 21, and a drain electrode 27 is formed on the other side of the semiconductor layer 23 and spaced apart from the gate electrode 21.

[0075] Although the gate electrodes 11, 21 and the source electrodes 15, 25 and drain electrodes 17, 27 are formed on the same layer, they are spatially and electrically separated from each other. Furthermore, the source electrode 15 of the switching thin film transistor 10 is connected to the data line 60 via a contact hole penetrating the gate insulating layer 33 and the buffer layer 31. Although not shown in the figures, the drain electrode 27 of the driving thin film transistor 20 is connected to the driving current line 70 via a contact hole penetrating the gate insulating layer 33.

[0076] A passivation layer 35 is deposited on the substrate 110 having the thin film transistors 10 and 20. The passivation layer 35 is preferably made of an inorganic material such as silicon oxide (SiOx) or silicon nitride (SiNx).

[0077] The light-emitting element layer 330 is formed on the driver element layer 220. The light-emitting element layer 330 includes light-emitting diodes 90. Before forming the light-emitting diodes 90, a planarization layer 37 is deposited on the passivation layer 35. The surface of the substrate 110 on which the thin-film transistors 10 and 20 are formed is not uniform or flat, so the planarization layer 37 is a thin film layer used to flatten the uneven surface. To minimize height differences caused by the uneven surface conditions and ensure a uniform height across the entire surface, the planarization layer 37 can be formed from an organic material. A pixel contact hole 30 is formed in the passivation layer 35 and the planarization layer 37. The pixel contact hole 30 exposes a portion of the source electrode 25 of the driver thin-film transistor 20.

[0078] The light-emitting diode 90 includes an anode electrode 91, a light-emitting layer 93, and a cathode electrode 95. The light-emitting diode 90 generates light in response to a current controlled by the driving thin-film transistor 20. In other words, the light-emitting diode 90 emits light in response to the current controlled by the driving thin-film transistor 20 to display an image. The anode electrode 91 of the light-emitting diode 90 is connected to the source electrode 25 of the driving thin-film transistor 20, and the cathode electrode 95 is connected to the low-potential line 80 supplied with a low-potential voltage. The light-emitting diode 90 is driven by the driving thin-film transistor 20 through the current flowing from the driving current line 70 to the low-potential line 80.

[0079] An anode electrode 91 is formed on the upper surface of the planarization layer 37. The anode electrode 91 is connected to the source electrode 25 of the driver thin-film transistor 20 through the pixel contact hole 30. The anode electrode 91 has different structures depending on the light-emitting type of the light-emitting diode 90. For example, in the case of a bottom-emission display device, where light is provided in the direction of the substrate 110, the anode electrode 91 can be formed of a transparent conductive material. As another example, in the case of a top-emission display device, where light is provided in an upward direction relative to the substrate 110, the anode electrode 91 can be formed of a metal material with excellent light reflection. Because the present invention relates to a top-emission display device, the anode electrode 91 is preferably made of a metal material with a thickness of 1,000 Å or more.

[0080] Bank 97 is formed on substrate 110 having anode electrode 91. In one embodiment, bank 97 is made of an insulating material, such as an inorganic insulating material or an organic insulating material. Here, bank 97 is made of an organic insulating material. Bank 97 covers the area surrounding anode electrode 91 and exposes the middle portion of anode electrode 91. The exposed portion of anode electrode 91 is defined as an emission area EA, while the portion of anode electrode 91 covered by bank 97 is defined as a non-emission area NEA.

[0081] The light-emitting layer 93 is deposited on the pixel electrode 91 and the bank 97. The light-emitting layer 93 may be stacked over the entire display area AA of the substrate 110 to cover the anode electrode 91 and the bank 97. As an example, the light-emitting layer 93 may include at least two light-emitting sections for generating white light. Specifically, the light-emitting layer 93 may include a first light-emitting section and a second light-emitting section stacked vertically to generate white light by mixing first light from the first light-emitting section and second light from the second light-emitting section.

[0082] As another example, the light-emitting layer 93 may include any one of a blue light-emitting portion, a green light-emitting portion, and a red light-emitting portion for generating light corresponding to the color set in each pixel. Furthermore, the light-emitting diode 90 may include a functional layer that improves the light-emitting efficiency and / or life of the light-emitting layer 93.

[0083] Cathode electrode 95 is deposited over the entire surface of substrate 110, where light-emitting layer 93 is formed. Cathode electrode 95 is deposited so as to contact the surface of light-emitting layer 93. Cathode electrode 95 is formed over the entire substrate 110 to be commonly connected to light-emitting layer 93 deposited in all pixels P. In the case of a top-emission type, cathode electrode 95 may include a transparent conductive material. For example, cathode electrode 95 may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0084] The encapsulation layer 440 may be disposed on the light-emitting element layer 330. For example, the encapsulation layer 440 may include a first inorganic layer 441, an organic layer 443, and a second inorganic layer 445 stacked in sequence. As another example, the encapsulation layer 440 may include a single inorganic layer or multiple organic layers.

[0085] Below, with further reference to FIG. 5 , a detailed description will be given of a structure in which a driving element is disposed on the back surface of a substrate 110 in a light-emitting display device according to an embodiment of the present invention. FIG. 5 is a side view of the structure of a light-emitting display device according to an embodiment of the present invention, taken along line II' in FIG. While FIG. 1 depicts a flat planar structure of the flexible circuit film 430 when it is unfolded, FIG. 5 depicts a cross-sectional structure in which the flexible circuit film 430 is curved and the driving element is disposed on the back surface of the substrate 110.

[0086] The display layer 600 may be disposed on the upper surface of the substrate 110 . The display layer 600 may include a display area AA and a non-display area NDA. The display area AA may include a plurality of pixels P. The non-display area NDA may include a gate driver 200 and a pad 300 .

[0087] A thermal insulation layer 700 may be attached to the lower surface (or rear surface or back surface) of the substrate 110 to protect the substrate 110. A heat dissipation layer 800 may be attached to the lower surface of the thermal insulation layer 700. An adhesive layer 306 may be attached and / or applied to the lower surface of the heat dissipation layer 800. The source driver integrated circuit 410 and the circuit board 450 may be attached to the lower surface of the adhesive layer 306. By bending the flexible circuit film 430 on which the source driver integrated circuit 410 is mounted and to which the circuit board 450 is connected, the source driver integrated circuit 410 and the circuit board 450 may be attached to the adhesive layer 306 disposed on the rear surface of the substrate 110.

[0088] As shown in FIG5 , a light-emitting display device according to an embodiment of the present invention may include a display layer 600 in front of a substrate 110 and a driving element including a source driver integrated circuit 410 and a circuit board 450 behind the substrate 110. The display element disposed in the display layer 600 may generate heat, and the driving element disposed below the substrate 110 may also generate heat.

[0089] In this case, if heat generated by the light-emitting elements and the driver elements is concentrated in the display layer 600, the light-emitting diodes 90 (see FIG. 4 ) that constitute the display layer 600 may degrade the display elements, ultimately shortening the life of the display device. To address this issue, a structure is required that can quickly dissipate heat generated by the display device so that it does not affect the display elements. Furthermore, a thermal insulation structure may be required to prevent heat generated from the display layer 600 from affecting the driver elements 410 and 500, and to prevent heat generated from the driver elements 410 and 500 from affecting the display layer 600.

[0090] The light-emitting display device according to the present invention, as shown in FIG5 , may include a thermal insulation layer 700 and a heat dissipation layer 800 disposed between the substrate 110 and the driving elements 410 and 500. The thermal insulation layer 700 may function to block vertical heat transfer to prevent heat generated from the display layer 600 from affecting the driving elements 410 and 500, and to prevent heat generated from the driving elements 410 and 500 from affecting the display layer 600. The heat dissipation layer 800 may be a component horizontally disposed on the substrate 110 that dissipates heat generated from the driving elements 410 and 500 and quickly dissipates the heat to the outside.

[0091] 6 to 13, the structural features for thermal insulation and heat dissipation in the light-emitting display device according to the present invention will be described in detail.

[0092] First, referring to FIG6 , the structures and properties of the non-thermally conductive and thermally conductive materials used in thermal insulation and heat dissipation structures according to the present invention will be described. FIG6 illustrates the structures of the non-thermally conductive and thermally conductive materials according to an embodiment of the present invention, as well as a graph showing the thermal conductivity of each of these materials.

[0093] As shown in Figure 6 , the thermally conductive material (TCM) can be implemented in the form of a film or layer. For example, the thermally conductive material (TCM) can be formed by mixing a filler and a silicone resin material and then curing the mixture into a film. As another example, the thermally conductive material (TCM) can be formed into an adhesive layer by adding an adhesive element to the silicone resin material.

[0094] The thermally conductive material (TCM) preferably has a thermal conductivity of 8 W / m·K to 11 W / m·K. To ensure this thermal conductivity, the TCM can be formed by mixing a filler with high thermal conductivity into a silicone-based resin. For example, the volume ratio (vol%) of the filler to the silicone-based resin can be preferably 8:2 to 9:1. Here, the filler can be a mixture of aluminum oxide (or aluminum oxide) powder and silicon nitride (Si3N4) powder, with the volume ratio preferably being 8:2:aluminum oxide:Si3N4. In other words, the thermally conductive material (TCM) can include a filler and a silicone-based resin in a volume ratio of 8:2 to 9:1. The filler can include aluminum particles and silicon nitride particles in a volume ratio of 8:2. The aluminum particles can include aluminum particles and / or aluminum oxide particles.

[0095] As shown in Figure 6, non-thermally conductive NTCs can also be implemented in the form of films. For example, non-thermally conductive NTCs can be formed by mixing fillers and silicone resin materials and then curing them into a film. As another example, non-thermally conductive NTCs can be formed by adding an adhesive element to an acrylic resin material to form an adhesive layer.

[0096] The non-thermally conductive NTC material preferably has a thermal conductivity of 1 W / m·K to 3 W / m·K. To ensure this thermal conductivity, the non-thermally conductive NTC material can be formed by mixing a filler with low thermal conductivity into an acrylic resin. For example, the volume ratio (vol%) of the filler to the acrylic resin can be preferably 3:7 to 6:4. In this case, the filler can be a mixture of aluminum oxide powder and silicon nitride (Si3N4) powder, with a volume ratio of aluminum oxide to Si3N4 of 2:8. In other words, the non-thermally conductive NTC material can contain filler and acrylic resin in a volume ratio of 3:7 to 6:4. The filler can include aluminum particles and silicon nitride particles in a volume ratio of 2:8.

[0097] Here, the terms "high thermal conductivity" and "low thermal conductivity" are used to describe the configuration of the two materials used in this invention. In other words, one layer has a relatively high thermal conductivity, while the other layer has a relatively low thermal conductivity. The thermal conductivity of the heat transfer material and heat barrier material used in this invention is set based on the heat generated by the light-emitting display device and the allowable heat in the product. Therefore, "high thermal conductivity" refers to a thermal conductivity of 8W / m·K to 11W / m·K, and "low thermal conductivity" refers to a thermal conductivity of 1W / m·K to 3W / m·K.

[0098] Various embodiments of the present invention will be described below, in which the non-thermal conductive material and / or thermal conductive material described in FIG. 6 can be applied to a light-emitting display device in various ways and structures.

[0099] <First embodiment>

[0100] 7, a light emitting display device according to a first embodiment of the present invention will be described. FIG7 is an enlarged cross-sectional view of the dotted area "X" in FIG5, illustrating the structure of the light emitting display device according to the first embodiment of the present invention.

[0101] 7 , the light-emitting display device according to the first embodiment of the present invention may include a substrate 110, a display layer 600, and a lower structure 900. The lower structure 900 may include a protective layer 610, a thermal insulation layer 700, and a heat dissipation layer 800. Furthermore, a driving element may be disposed below the heat dissipation layer 800. The driving element may include a source driver integrated circuit 410, a circuit board 450, and a timing controller 500.

[0102] Specifically, the display layer 600 may be formed on the upper surface of the substrate 110. The display layer 600 may have a cross-sectional structure as shown in FIG5. For example, the display layer 600 may include a driving device layer 220, a light-emitting device layer 330, and an encapsulation layer 440.

[0103] The protective layer 610 may be stacked on the lower surface (or rear surface or bottom surface) of the substrate 110. Since the protective layer 610 serves to protect the substrate 110 from cracking or breaking, it may be made of an organic material. The protective layer 610 may be formed by depositing the organic material on the lower surface of the substrate 110 through a deposition process or by attaching a film made of an organic material to the lower surface of the substrate 110.

[0104] The thermal insulation layer 700 may be attached to the lower surface of the protective layer 610. For example, the thermal insulation layer 700 may have a structure comprising a first adhesive layer 302, a shock-absorbing layer 720, and a second adhesive layer 304 stacked in sequence. The thermal insulation layer 700 may be formed in the form of a film, with the first adhesive layer 302 and the second adhesive layer 304 applied to the top and bottom surfaces of the shock-absorbing layer 720, respectively. The thermal insulation layer 700 may be arranged so that one surface of the first adhesive layer 302 is attached to the bottom surface of the protective layer 610. Furthermore, the thermal insulation layer 700 may have the same dimensions as the protective layer 610. The bottom surface of the first adhesive layer 302 may be attached to the entire top surface of the thermal insulation layer 700. The top surface of the first adhesive layer 302 may be attached to the entire bottom surface of the protective layer 610. The first adhesive layer 302 and the second adhesive layer 304 may comprise a pressure-sensitive adhesive material.

[0105] In one embodiment, the shock absorbing layer 720 can be made of a material that protects the substrate 110 and the display layer 600 by absorbing external physical impact. Furthermore, the shock absorbing layer 720 can have low thermal conductivity to prevent heat generated from outside below the shock absorbing layer 720 from being transferred upward, and can be made of a material that prevents heat generated from outside above the shock absorbing layer 720 from being transferred downward. For example, the shock absorbing layer 720 can be made of polyurethane, which has extremely low thermal conductivity and excellent physical impact absorption properties.

[0106] The heat dissipation layer 800 can be disposed on the bottom surface of the thermal insulation layer 700. The heat dissipation layer 800 can be attached to one surface of the second adhesive layer 304 attached to the bottom surface of the thermal insulation layer 700. The heat dissipation layer 800 can have the same dimensions as the thermal insulation layer 700 and can be attached to the entire surface of the second adhesive layer 304 attached to the entire bottom surface of the thermal insulation layer 700. The heat dissipation layer 800 can have a stacked structure of a metal layer 801 and a thermally conductive adhesive layer 803. As one example, the metal layer 801 can be a plate-shaped metal material having a specific thickness. As another example, the metal layer 801 can be made of a thin-film metal material. In particular, the metal layer 801 can preferably be made of a metal material, such as aluminum, which has excellent thermal conductivity in a horizontal surface direction (or a planar surface direction). The thermally conductive adhesive layer 803 can preferably be made of the thermally conductive material TCM described in FIG. 6 . As an example, the thermally conductive adhesive layer 803 may be made of a material containing a filler and a silicon-based adhesive resin at a volume ratio of 8:2 to 9:1. The filler may be made by mixing aluminum oxide (or aluminum oxide particles) (or powder) and silicon nitride particles (or powder) at a volume ratio of 8:2.

[0107] The driver component can be attached to the bottom surface of the thermally conductive adhesive layer 803. The driver component can be attached to a portion of the bottom surface of the thermally conductive adhesive layer 803. For example, the source driver integrated circuit 410 and the circuit board 450 can be attached to the thermally conductive adhesive layer 803. The timing controller 500 can be mounted on the bottom surface of the circuit board 450.

[0108] In this structure, heat generated by the driver components can be transferred to the metal layer 801 through the thermally conductive adhesive layer 803, diffused horizontally across the metal layer 801, and then discharged to the outside. In particular, because the thermally conductive adhesive layer 803 has a higher thermal conductivity than the first adhesive layer 302 and the second adhesive layer 304, which are made of pressure-sensitive adhesive material, the thermally conductive adhesive layer 803 can quickly transfer heat generated by the driver components to the metal layer 801.

[0109] At the same time, the heat insulating layer 700 prevents the heat generated from the driving element from being transferred to the display layer 600. In addition, the heat insulating layer 700 can also prevent the heat generated from the display layer 600 from being transferred to the driving element.

[0110] According to the first embodiment, the thermally conductive adhesive layer 803 disposed below the metal layer 801 can very quickly transfer the heat generated by the driving element to the metal layer 801. Therefore, the heat generated by the driving element can be quickly discharged to the outside.

[0111] <Second embodiment>

[0112] 8, a light emitting display device according to a second embodiment of the present invention will be described. FIG8 is an enlarged cross-sectional view of the dotted area "X" in FIG5, illustrating the structure of the light emitting display device according to the second embodiment of the present invention.

[0113] 8 , a light-emitting display device according to a second embodiment of the present invention may include a substrate 110, a display layer 600, and a lower structure 900′. The lower structure 900′ may include a protective layer 610, a thermal insulation layer 700, and a heat dissipation layer 800′. A thermally conductive cover layer 703 may be disposed on the display layer 600. Furthermore, a driving component may be disposed below the heat dissipation layer 800′. The driving component may include a source driver integrated circuit 410, a circuit board 450, and a timing controller 500.

[0114] The display layer 600 may be formed on the top surface of the substrate 110. The display layer 600 may have a cross-sectional structure as shown in FIG5. For example, the display layer 600 may include a driving device layer 220, a light-emitting device layer 330, and an encapsulation layer 440.

[0115] The thermally conductive cover layer 703 may be formed on the top surface of the substrate 110. The thermally conductive cover layer 703 may be stacked to have an area equal to or slightly larger than the display area AA to completely cover the display area AA in the display layer 600. For example, although not shown in the figures, the thermally conductive cover layer 703 may not be formed on the pad portion 300 of the display layer 600 to which the flexible circuit film 430 is attached.

[0116] The thermally conductive cover layer 703 is preferably formed by applying an organic material, curing the material, and attaching it to the top surface of the display layer 600 in the form of a film. The thermally conductive cover layer 703 can be a film-type thermal conductive material (TCM) as described in Figure 6. As an example, the thermally conductive adhesive layer 803 can be made of a material containing a filler and a silicone-based resin in a volume ratio of 8:2 to 9:1. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) in a volume ratio of 8:2. After applying this material, it can be cured to form the film-type thermally conductive cover layer 703.

[0117] The protective layer 610 may be stacked on the bottom surface of the substrate 110. The protective layer 610 may be used to protect the substrate 110 from cracking or breaking and may be made of an organic material. The protective layer 610 may be attached to cover the entire bottom surface of the substrate 110.

[0118] The thermal insulation layer 700 may be attached to the bottom surface of the protective layer 610. For example, the thermal insulation layer 700 may have a structure in which the first adhesive layer 302, the shock-absorbing layer 720, and the second adhesive layer 304 are stacked in sequence. The thermal insulation layer 700 may be formed in the form of a film, with the first adhesive layer 302 and the second adhesive layer 304 applied to the top and bottom surfaces of the shock-absorbing layer 720, respectively. The thermal insulation layer 700 may be arranged so that one surface of the first adhesive layer 302 is attached to the bottom surface of the protective layer 610. Furthermore, the thermal insulation layer 700 may have the same dimensions as the protective layer 610. The bottom surface of the first adhesive layer 302 may be attached to the entire top surface of the thermal insulation layer 700. The top surface of the first adhesive layer 302 may be attached to the entire bottom surface of the protective layer 610. The first adhesive layer 302 and the second adhesive layer 304 may comprise a pressure-sensitive adhesive material.

[0119] The shock absorbing layer 720 can be made of a material that protects the substrate 110 and the display layer 600 by absorbing external physical impact. Furthermore, the shock absorbing layer 720 can be made of a material having low thermal conductivity to prevent heat generated from outside below the shock absorbing layer 720 from being transferred upward, and preferably prevent heat generated from outside above the shock absorbing layer 720 from being transferred downward. For example, the shock absorbing layer 720 can be made of polyurethane, which has extremely low thermal conductivity and excellent physical impact absorption properties.

[0120] A heat dissipation layer 800' can be disposed on the bottom surface of the thermal insulation layer 700. The heat dissipation layer 800' can be attached to one surface of the second adhesive layer 304 attached to the bottom surface of the thermal insulation layer 700. The heat dissipation layer 800' can have the same dimensions as the thermal insulation layer 700 and can be attached to the entire surface of the second adhesive layer 304 attached to the entire bottom surface of the thermal insulation layer 700. The heat dissipation layer 800' can have a stacked structure of a metal layer 801 and a thermally conductive adhesive layer 803. As one example, the metal layer 801 can be a plate-shaped metal material having a specific thickness. As another example, the metal layer 801 can be made of a thin-film metal material. In particular, the metal layer 801 can preferably be made of a metal material, such as aluminum, which has excellent thermal conductivity in a horizontal surface direction (or a planar surface direction). The third adhesive layer 306 can be made of the same pressure-sensitive adhesive material as the first adhesive layer 302 and the second adhesive layer 304.

[0121] The driver component may be attached to the bottom surface of the third adhesive layer 306. The driver component may be attached to a portion of the bottom surface of the third adhesive layer 306. For example, the source driver integrated circuit 410 and the circuit board 450 may be attached to the third adhesive layer 306. The timing controller 500 may be mounted on the bottom surface of the circuit board 450.

[0122] With this structure, heat generated by the driver elements can be transferred to the metal layer 801, diffused horizontally across the metal layer 801, and then dissipated to the outside. Simultaneously, the heat generated by the driver elements is prevented from being transferred to the display layer 600 through the thermal insulation layer 700. Furthermore, heat generated by the display layer 600 can be quickly dissipated from the top surface through the thermally conductive cover layer 703 applied to the top surface. While some heat can be transferred to the substrate 110, the thermal insulation layer 700 prevents heat from being transferred to the driver elements.

[0123] According to the second embodiment, the thermally conductive cover layer 703 stacked on the display layer 600 can quickly dissipate heat to the outside. Some heat may be transferred to the substrate 110, but compared to the case without the thermally conductive cover layer 703, the heat transferred to the substrate 110 is minimized or eliminated.

[0124] <Third embodiment>

[0125] A light emitting display device according to a third embodiment of the present invention will be described with reference to Figure 9. Figure 9 is an enlarged cross-sectional view of the dotted area "X" in Figure 5, illustrating the structure of the light emitting display device according to the third embodiment of the present invention.

[0126] 9 , a light-emitting display device according to a third embodiment of the present invention may include a substrate 110, a display layer 600, and a lower structure 900'. The lower structure 900' may include a protective layer 610, a thermal insulation layer 700', and a heat dissipation layer 800'. Furthermore, a driving element may be disposed below the heat dissipation layer 800'. The driving element may include a source driver integrated circuit 410, a circuit board 450, and a timing controller 500.

[0127] The display layer 600 may be formed on the top surface of the substrate 110. The display layer 600 may have the structure shown in FIG5. As an example, the display layer 600 may include a driving element layer 220, a light emitting element layer 330, and an encapsulation layer 440.

[0128] The protective layer 610 may be attached to the bottom surface of the substrate 110. The protective layer 610 may be an element for protecting the substrate 110 from cracking or breaking, and the protective layer 610 may be made of an organic material.

[0129] The thermal insulation layer 700' can be attached to the bottom surface of the protective layer 610. As an example, the thermal insulation layer 700' can have a structure in which a first non-thermally conductive adhesive layer 702, a shock-absorbing layer 720, and a second non-thermally conductive adhesive layer 704 are stacked in sequence. The thermal insulation layer 700' can be formed in the form of a film, with the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 applied to the top and bottom surfaces of the shock-absorbing layer 720, respectively. The thermal insulation layer 700' can be configured so that one surface of the first non-thermally conductive adhesive layer 702 is attached to the bottom surface of the protective layer 610. Furthermore, the thermal insulation layer 700' can have the same dimensions as the protective layer 610. The bottom surface of the first non-thermally conductive adhesive layer 702 can be attached to the entire top surface of the thermal insulation layer 700'. The top surface of the first non-thermally conductive adhesive layer 702 can be attached to the entire bottom surface of the protective layer 610.

[0130] The shock absorbing layer 720 can be made of a material that protects the substrate 110 and the display layer 600 by absorbing external physical impact. Furthermore, the shock absorbing layer 720 can have low thermal conductivity to prevent heat generated from outside below the shock absorbing layer 720 from being transferred upward, and can be made of a material that prevents heat generated from outside above the shock absorbing layer 720 from being transferred downward. For example, the shock absorbing layer 720 can be made of polyurethane, which has extremely low thermal conductivity and excellent physical impact absorption properties.

[0131] The first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 are preferably made of the non-thermally conductive material NTC described in Figure 6. As an example, the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer can be made of a material containing a filler and an acrylic resin in a volume ratio of 8:2 to 9:1. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) in a volume ratio of 2:8. The vibration absorbing layer 720 can also prevent heat transfer in the vertical direction. To effectively prevent the vertical transfer of heat accumulated during long-term use of the light-emitting display device, the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 are preferably further included.

[0132] The heat dissipation layer 800' can be attached to the bottom surface of the thermal insulation layer 700'. The heat dissipation layer 800' can be attached to one surface of the second non-thermally conductive adhesive layer 704 attached to the thermal insulation layer 700'. Furthermore, the heat dissipation layer 800' can have the same dimensions as the thermal insulation layer 700' and can be attached to the entire surface of the second non-thermally conductive adhesive layer 704 attached to the entire bottom surface of the thermal insulation layer 700'. The heat dissipation layer 800' can have a stacked structure of a metal layer 801 and a third adhesive layer 306. As one example, the metal layer 801 can be a plate-shaped metal material having a specific thickness. As another example, the metal layer 801 can be made of a metal material having a thin film shape. In particular, the metal layer 801 can preferably be made of a metal material, such as aluminum, which has excellent thermal conductivity in a horizontal surface direction (or a planar surface direction). The third adhesive layer 306 can be made of a pressure-sensitive adhesive material.

[0133] The driver component may be attached to the bottom surface of the third adhesive layer 306. The driver component may be attached to a portion of the bottom surface of the third adhesive layer 306. For example, the source driver integrated circuit 410 and the circuit board 450 may be attached to the third adhesive layer 306. The timing controller 500 may be mounted on the bottom surface of the circuit board 450.

[0134] With this structure, heat generated from the driving elements can be transferred to the metal layer 801, diffused horizontally across the metal layer 801, and then discharged to the outside. Simultaneously, the heat generated from the driving elements is prevented from being transferred to the display layer 600 through the thermal insulation layer 700. Furthermore, the heat generated from the display layer 600 is prevented from being transferred to the driving elements through the thermal insulation layer 700. According to the third embodiment, thermal insulation performance can be improved, preventing heat generated from the display layer 600 and heat generated from the driving elements from penetrating the substrate 110 and affecting each other.

[0135] <Fourth embodiment>

[0136] A light emitting display device according to a fourth embodiment of the present invention will be described with reference to Figure 10. Figure 10 is an enlarged cross-sectional view of the dotted area "X" in Figure 5, illustrating the structure of the light emitting display device according to the fourth embodiment of the present invention.

[0137] 10 , a light-emitting display device according to a fourth embodiment of the present invention may include a substrate 110, a display layer 600, and a lower structure 900'''. The lower structure 900''' may include a protective layer 610, a thermal insulation layer 700', and a heat dissipation layer 800'. A thermally conductive cover layer 703 may be disposed on the display layer 600. Furthermore, a driving element may be disposed below the heat dissipation layer 800. As an example, the driving element may include a source driver integrated circuit 410, a circuit board 450, and a timing controller 500.

[0138] The display layer 600 may be formed on the top surface of the substrate 110. The display layer 600 may have the cross-sectional structure shown in FIG5. As an example, the display layer 600 may include a driving element layer 220, a light-emitting element layer 330, and an encapsulation layer 440.

[0139] The thermally conductive cover layer 703 may be formed on the top surface of the substrate 110. The thermally conductive cover layer 703 may be stacked to have an area equal to or slightly larger than the display area AA to completely cover the display area AA in the display layer 600. For example, although not shown in the figures, the thermally conductive cover layer 703 may not be formed on the pad portion 300 of the display layer 600 to which the flexible circuit film 430 is attached.

[0140] The thermally conductive cover layer 703 can be formed by applying an organic material, curing the material, and attaching it to the top surface of the display layer 600 in the form of a film. The thermally conductive cover layer 703 can be a film-type thermal conductive material (TCM) as described in Figure 6. As an example, the thermally conductive adhesive layer 803 can be made of a material containing a filler and a silicone-based resin in a volume ratio of 8:2 to 9:1. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) in a volume ratio of 8:2. After applying this material, it can be cured to form the film-type thermally conductive cover layer 703.

[0141] A protective layer 610 may be deposited on the bottom surface of the substrate 110. The protective layer 610 may be used to protect the substrate 110 from cracking or breaking and may be made of an organic material. When the protective layer 610 is deposited on the substrate 110, the thickness of the substrate 110 with the protective layer 610 may be minimized.

[0142] The thermal insulation layer 700' can be attached to the bottom surface of the protective layer 610. As an example, the thermal insulation layer 700' can have a structure in which a first non-thermally conductive adhesive layer 702, a shock-absorbing layer 720, and a second non-thermally conductive adhesive layer 704 are stacked in sequence. The thermal insulation layer 700' can be formed in the form of a film, with the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 applied to the top and bottom surfaces of the shock-absorbing layer 720, respectively. The thermal insulation layer 700' can be configured so that one surface of the first non-thermally conductive adhesive layer 702 is attached to the bottom surface of the protective layer 610. Furthermore, the thermal insulation layer 700' can have the same dimensions as the protective layer 610. The bottom surface of the first non-thermally conductive adhesive layer 702 can be attached to the entire top surface of the thermal insulation layer 700'. The top surface of the first non-thermally conductive adhesive layer 702 can be attached to the entire bottom surface of the protective layer 610.

[0143] The shock absorbing layer 720 can be made of a material that protects the substrate 110 and the display layer 600 by absorbing external physical impact. Furthermore, the shock absorbing layer 720 can be made of a material having low thermal conductivity to prevent heat generated from outside below the shock absorbing layer 720 from being transferred upward, and preferably prevent heat generated from outside above the shock absorbing layer 720 from being transferred downward. For example, the shock absorbing layer 720 can be made of polyurethane, which has extremely low thermal conductivity and excellent physical impact absorption properties.

[0144] The first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 can be made of the non-thermally conductive material NTC described in Figure 6. As an example, the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer can be made of a material containing a filler and an acrylic resin in a volume ratio of 3:7 to 6:4. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) in a volume ratio of 2:8. The vibration absorption layer 720 can also prevent heat transfer in the vertical direction. To effectively prevent the vertical transfer of heat accumulated during long-term use of the light-emitting display device, it is preferred to further include the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704.

[0145] The heat dissipation layer 800 can be attached to the bottom surface of the thermal insulation layer 700'. The heat dissipation layer 800 can be attached to one surface of the second non-thermally conductive adhesive layer 704 attached to the thermal insulation layer 700'. Furthermore, the heat dissipation layer 800 can have the same dimensions as the thermal insulation layer 700' and can be attached to the entire surface of the second non-thermally conductive adhesive layer 704 attached to the entire bottom surface of the thermal insulation layer 700'. The heat dissipation layer 800 can have a stacked structure of a metal layer 801 and a thermally conductive adhesive layer 803. As one example, the metal layer 801 can be a plate-shaped metal material having a specific thickness. As another example, the metal layer 801 can be made of a thin-film metal material. In particular, the metal layer 801 can preferably be made of a metal material, such as aluminum, which has excellent thermal conductivity in a horizontal surface direction (or a planar surface direction).

[0146] Thermally conductive adhesive layer 803 may be made of the thermally conductive material TCM described in FIG6 . As an example, thermally conductive adhesive layer 803 may be made of a material containing a filler and a silicone resin at a volume ratio of 8:2 to 9:1. The filler may be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) at a volume ratio of 8:2.

[0147] The driver component can be attached to the bottom surface of the thermally conductive adhesive layer 803. The driver component can be attached to a portion of the bottom surface of the thermally conductive adhesive layer 803. For example, the source driver integrated circuit 410 and the circuit board 450 can be attached to the thermally conductive adhesive layer 803. The timing controller 500 can be mounted on the bottom surface of the circuit board 450.

[0148] In this structure, heat generated by the driving elements can be transferred to the metal layer 801 through the thermally conductive adhesive layer 803, diffused horizontally along the surface of the metal layer 801, and then discharged to the outside. In particular, because the thermally conductive adhesive layer 803 has a much higher thermal conductivity than the first adhesive layer 302 and the second adhesive layer 304, which are made of pressure-sensitive adhesive material, the thermally conductive adhesive layer 803 can quickly transfer the heat generated by the driving elements to the metal layer 801. Although some heat generated by the driving elements can be transferred to the substrate 110, the thermal insulation layer 700′ prevents this heat from being transferred to the display layer 600.

[0149] Furthermore, heat generated from the display layer 600 can be quickly dissipated from the top surface through the thermally conductive cover layer 703 disposed on the top surface of the display layer 600. Although some heat can be transferred to the substrate 110, the thermal insulation layer 700′ prevents this heat from being transferred to the driving components.

[0150] According to the fourth embodiment, the thermally conductive adhesive layer 803 disposed beneath the metal layer 801 can very quickly transfer heat generated by the driving elements to the metal layer 801 and then dissipate the heat to the outside. Furthermore, the thermally conductive cover layer 703 disposed on the display layer 600 can quickly dissipate heat generated by the display layer 600 to the outside. Simultaneously, the insulation properties are improved by the first and second non-thermally conductive adhesive layers 702 and 704, preventing heat generated from the display layer 600 and the driving elements from penetrating the substrate 110 and affecting each other.

[0151] <Fifth embodiment>

[0152] A light emitting display device according to a fifth embodiment of the present invention will be described with reference to Figure 11. Figure 11 is an enlarged cross-sectional view of the dotted area "X" in Figure 5, illustrating the structure of the light emitting display device according to the fifth embodiment of the present invention.

[0153] The light-emitting display device according to the fifth embodiment can be very similar to the light-emitting display device according to the fourth embodiment. The difference is that the fifth embodiment can further include a heat dissipation element 705 that can be attached to the driving elements 410, 430, and 500. The same description as the fourth embodiment will not be repeated or simply explained.

[0154] 11 , a light-emitting display device according to a fifth embodiment of the present invention may include a substrate 110, a display layer 600, a thermally conductive cover layer 703, a protective layer 610, a thermal insulation layer 700′, and a heat dissipation layer 800. Here, the protective layer 610, the thermal insulation layer 700′, and the heat dissipation layer 800 may be configured as a lower structure 900′″ that supports and protects the substrate 110.

[0155] The display layer 600 may be formed on the top surface of the substrate 110. A thermally conductive cover layer 703 may be disposed on the top surface of the display layer 600. The thermally conductive cover layer 703 may be attached to an area equal to or slightly larger than the display area AA to completely cover the display area AA of the display layer 600. For example, although not shown in the figures, the thermally conductive cover layer 703 may not be disposed on the pad portion 300 of the display layer 600 to which the flexible circuit film 430 is attached.

[0156] The protective layer 610 may be deposited on the bottom surface of the substrate 110. A thermal insulation layer 700' may be attached to the bottom surface of the protective layer 610. The thermal insulation layer 700' may include a first non-thermally conductive adhesive layer 702, a shock-absorbing layer 720, and a second non-thermally conductive adhesive layer 704. The thermal insulation layer 700' may be positioned such that one surface of the first non-thermally conductive adhesive layer 702 is attached to the bottom surface of the protective layer 610. Furthermore, the thermal insulation layer 700' may have the same dimensions as the protective layer 610. The bottom surface of the first non-thermally conductive adhesive layer 702 may be attached to the entire top surface of the thermal insulation layer 700'. The top surface of the first non-thermally conductive adhesive layer 702 may be attached to the entire bottom surface of the protective layer 610.

[0157] The heat dissipation layer 800 can be attached to one surface of the second non-thermally conductive adhesive layer 704, including the thermal insulation layer 700'. Furthermore, the heat dissipation layer 800 can have the same dimensions as the second non-thermally conductive adhesive layer 704, and the bottom surface of the second non-thermally conductive adhesive layer 704 can be attached to the entire top surface of the heat dissipation layer 800. The heat dissipation layer 800 can have a stacked structure of a metal layer 801 and a thermally conductive adhesive layer 803. The driving components 410 and 450 can be attached to the thermally conductive adhesive layer 803.

[0158] The thermally conductive cover layer 703 and the thermally conductive adhesive layer 803 can be film-type layers or film-type adhesive layers comprising the thermally conductive material (TCM) described in Figure 6 . As an example, the thermally conductive cover layer 703 and / or the thermally conductive adhesive layer 803 can be made from a material comprising a filler and a silicone resin at a volume ratio of 8:2 to 9:1. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) at a volume ratio of 8:2. After applying this material, it can be cured to form the film-type thermally conductive cover layer 703 and / or the film-type thermally conductive adhesive layer 803. Alternatively, after forming the adhesive film, it can be applied to a suitable surface.

[0159] The first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 can be made of the non-thermally conductive material NTC described in FIG6 . As an example, the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704 can be made of a material containing a filler and an acrylic resin at a volume ratio of 3:7 to 6:4. The filler can be made by mixing aluminum particles (or powder) and silicon nitride particles (or powder) at a volume ratio of 2:8.

[0160] The heat dissipation element 705 can be attached to the driver components 410 and 450. Specifically, the bottom portion of the source driver integrated circuit 410 can be mounted on the flexible circuit film 430, and the top surface of the source driver integrated circuit 410 can be attached to the thermally conductive adhesive layer 803. Therefore, the heat dissipation element 705 can be disposed on the bottom surface of the flexible circuit film 430. Furthermore, the heat dissipation element 705 can be attached to the top surface of the timing controller 500 mounted on the circuit board 450.

[0161] Heat dissipation element 705 can be made of the thermally conductive material TCM illustrated in FIG. 6 and can be configured to have a specific shape. For example, heat dissipation element 705 can be formed by applying a material comprising a filler and a silicone resin at a volume ratio of 8:2 to 9:1, curing, and / or patterning. The filler can be formed by mixing aluminum particles (or powder) and silicon nitride particles (or powder) at a volume ratio of 8:2.

[0162] The heat dissipation element 705 may include a base portion 1 and a pattern portion 3. The base portion 1 may have a plate-like shape corresponding to the dimensions of the driving elements 410 and 450. The pattern portion 3 may have a concave-convex shape. As an example, the concave-convex shape may have a square sawtooth cross-section. A concave-convex pattern portion 3 has a larger surface area than a flat pattern portion, thereby increasing the area in contact with air. As a result, heat generated by the driving elements 410 and 500 can be quickly dissipated into the air.

[0163] Figures 12 and 13 illustrate other examples of heat dissipation elements 705 having different shapes. Figure 12 is a cross-sectional view of a heat dissipation element according to another example of the light-emitting display device shown in Figure 11. Referring to Figure 12, the pattern portion 3 of the heat dissipation element 705 may have a triangular sawtooth cross-sectional shape.

[0164] Fig. 13 is a cross-sectional view of a heat dissipation element in yet another example of the light-emitting display device shown in Fig. 11. Referring to Fig. 13, the pattern portion 3 of the heat dissipation element 705 may have a semicircular sawtooth cross-sectional shape.

[0165] With this structure, heat generated by the driver elements can be transferred to the metal layer 801 through the thermally conductive adhesive layer 803, diffused horizontally along the surface of the metal layer 801, and then discharged to the outside. In particular, this heat can be directly and quickly discharged to the outside through the heat dissipation element 705 attached to the surface of the driver elements. Simultaneously, the heat generated by the driver elements can be prevented from being transferred to the display layer 600 through the thermal insulation layer 700'. Furthermore, heat generated by the display layer 600 can be discharged from the top surface through the thermally conductive cover layer 703 disposed on the top surface of the display layer 600. Although some heat can be transferred to the substrate 110, this heat is prevented from being transferred to the driver elements through the thermal insulation layer 700'.

[0166] According to the fifth embodiment, the thermally conductive adhesive layer 803 disposed beneath the metal layer 801 can very quickly transfer heat generated by the driver components to the metal layer 801, and then dissipate the heat to the outside. Furthermore, the heat generated by the driver components can be directly and quickly dissipated to the outside through the heat dissipation element 705. Furthermore, the thermally conductive cover layer 703 disposed on the display layer 600 can quickly dissipate heat generated by the display layer 600 to the outside. Simultaneously, the insulation properties are improved by the first non-thermally conductive adhesive layer 702 and the second non-thermally conductive adhesive layer 704, so that heat generated from the display layer 600 and heat generated from the driver components do not pass through the substrate 110 and affect each other.

[0167] The features, structures, functions, etc. described in the above exemplary embodiments of the present invention are included in at least one exemplary embodiment of the present invention and are not necessarily limited to only one exemplary embodiment. In addition, the features, structures, functions, etc. described in at least one exemplary embodiment can be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the technical field to which the present invention belongs. Therefore, these combinations and variations should be understood to be included in the scope of the present invention.

[0168] It will be apparent to those of ordinary skill in the art to which this invention pertains that various substitutions, modifications, and variations of the invention are possible without departing from the spirit and scope of the invention. Therefore, the embodiments of the present invention are intended to encompass various substitutions, modifications, and variations of the invention that fall within the scope of the claims and their equivalents. These and other variations of the embodiments may be made in light of the foregoing detailed description. In general, the terms used in the following claims should not be construed to limit the claims to the specific exemplary embodiments disclosed in the specification and claims, but rather should be construed to encompass all possible embodiments and the full scope of equivalents to which the claims are entitled. Therefore, the claims are not limited by the present invention.

[0169] 1: Base 10: Thin Film Transistor 11: Gate electrode 13: Semiconductor layer 15: Source electrode 17: Drain electrode 110:Substrate 20: Thin Film Transistor 21: Gate electrode 23: Semiconductor layer 25: Source electrode 27: Drain electrode 200: Gate driver 220: driving element layer 3: Pattern 30: Pixel contact hole 31: buffer layer 33: Gate insulation layer 35: passivation layer 37: Planarization layer 300: cushion 302: first adhesive layer 304: Second adhesive layer 306: Adhesive layer 330: Light-emitting element layer 410: driving element, source driver integrated circuit 430: driving element, flexible circuit film 440: Encapsulation layer 441: first inorganic layer 443: organic layer 445: Second inorganic layer 450: Circuit Board 50: Scan line 500: Timing controller, driver components 60: Data line 61: Data pad 600: Display layer 610: Protective layer 70: driving current circuit 71: driving current pad 75:Light-shielding layer 700: Thermal insulation layer 700': Thermal insulation layer 702: first non-thermal conductive adhesive layer 703: Thermal conductive cover 704: second non-thermal conductive adhesive layer 705: Heat dissipation element 720: shock absorbing layer 80: Low potential line 83: Auxiliary line 800: heat dissipation layer 800': heat dissipation layer 801: Metal layer 803: Thermally conductive adhesive layer 90: Light-emitting diode 91: Anode electrode 93: Luminescent layer 95: cathode electrode 97: Embankment 900: Lower structure 900': Lower structure 900'': Lower structure 900''': Lower structure AA: Display Area Cst: Storage capacitor EA:Emitting Area NDA: Non-display area NEA: Non-Emitting Area NTC: Non-thermal conductive material P: Pixel TCM: Thermally Conductive Material

Claims

1. A light-emitting display comprising: a substrate; a display layer on the substrate; a protective layer below the substrate; a thermally insulating layer below the protective layer; a heat-dissipating layer below the thermally insulating layer; a driving element below the heat-dissipating layer; and a thermally conductive covering layer on the display layer, wherein the thermally conductive covering layer comprises a filler having a volume ratio of 8:2 to 9:1 and a silicone resin, the filler comprising aluminum particles and silicon nitride particles having a volume ratio of 8:

2.

2. The light-emitting display as claimed in claim 1, wherein the thermal insulation layer prevents first heat generated from the display layer from being transferred to the driving element and prevents second heat generated from the driving element from being transferred to the display layer.

3. The light-emitting display as claimed in claim 1, wherein the heat dissipation layer dissipates heat generated by the driving element to the outside through a horizontal surface direction of the substrate.

4. The light-emitting display as claimed in claim 3, wherein the heat dissipation layer comprises: a metal layer located below the thermal insulation layer; and a thermally conductive adhesive layer located below the metal layer.

5. The light-emitting display as claimed in claim 4, wherein the thermally conductive adhesive layer transfers heat generated from the driving element to the metal layer, wherein the metal layer dissipates the heat transferred from the thermally conductive adhesive layer to the outside along a horizontal surface direction of the substrate.

6. The light-emitting display as claimed in claim 4, wherein the metal layer comprises aluminum, and wherein the thermally conductive adhesive layer comprises a filler having a volume ratio of 8:2 to 9:1 and a silicone resin, the filler comprising aluminum particles and silicon nitride particles having a volume ratio of 8:

2.

7. A light-emitting display comprising: a substrate; a display layer on the substrate; a protective layer below the substrate; a thermally insulating layer below the protective layer; a heat-dissipating layer below the thermally insulating layer; and a driving element below the heat-dissipating layer, wherein the thermally insulating layer comprises: a first non-thermally conductive adhesive layer below the protective layer; a vibration-absorbing layer below the first non-thermally conductive adhesive layer; and a second non-thermally conductive adhesive layer below the vibration-absorbing layer, wherein each of the first non-thermally conductive adhesive layer and the second non-thermally conductive adhesive layer comprises a filler having a volume ratio of 3:7 to 6:4 and an acrylic resin, the filler comprising aluminum particles and silicon nitride particles having a volume ratio of 2:

8.

8. The light-emitting display as claimed in claim 7 further comprises: a thermally conductive covering layer on the display layer, wherein the heat dissipation layer comprises: a metal layer below the thermally insulating layer; and a thermally conductive adhesive layer below the metal layer.

9. The light-emitting display as claimed in claim 8, wherein each of the thermally conductive cover layer and the thermally conductive adhesive layer comprises a filler having a volume ratio of 8:2 to 9:1 and a silicone resin, the filler comprising aluminum particles and silicon nitride particles having a volume ratio of 8:

2.

10. The light-emitting display as described in claim 1 or 7 further comprises: a heat dissipation element attached to the driving element.

11. The light-emitting display as claimed in claim 10, wherein the heat dissipation element comprises a filler having a volume ratio of 8:2 to 9:1 and a silicone resin, the filler comprising aluminum particles and silicon nitride particles having a volume ratio of 8:

2.

12. The light-emitting display as claimed in claim 10, wherein the heat dissipation element comprises: a base; and a patterned portion located on the base, the patterned portion comprising a plurality of patterns arranged on the base at a predetermined interval.

13. The light-emitting display as claimed in claim 12, wherein the pattern portion comprises a cross-sectional shape of any one of a triangle, a rectangle, and a semicircle.

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