Device and method for detecting an electronic component to be tested

Abstract

An apparatus for testing an electronic component under test includes a heating module and a temperature monitoring module. The heating module heats the electronic component under test. The temperature monitoring module is electrically connected to the heating module and monitors and controls the temperature of the electronic component under test.

Description

Technical Field

[0001] This invention relates to a testing apparatus for electronic components under test, and more particularly to a testing apparatus and a testing method for electronic components under test. Prior Technology

[0002] Electronic components under test, such as printed circuit boards (PCBs), wafers, LCD panels, IC substrates, and other products that require heating for electrical testing, typically have circuits and several circuit nodes set on the circuits. Several electronic components are electrically connected to several circuit nodes, and the electronic components are controlled by the circuit. The above-mentioned electronic components under test are widely used in various electronic products.

[0003] Among them, the circuit nodes of the electronic components under test, such as printed circuit boards, may fail to conduct properly or have poor contact when heated due to insufficient metal layer thickness, metal layer cracking or falling off, or other factors. Therefore, manufacturers will test the circuit nodes of printed circuit boards when shipping.

[0004] However, traditional circuit node testing uses ceramic contact heating of printed circuit boards, which results in only the part of the printed circuit board that is in contact with the ceramic heating structure being heated, while the other part that is not in contact with the ceramic heating structure is not heated. This leads to problems such as uneven heating and inaccurate yield during the testing process.

[0005] In addition, temperature monitoring of electronic components under test (DUTs), such as PCB products, is also important when heated. It is necessary to maintain the DUTs at a required temperature while avoiding high temperatures that could burn them out, in order to improve yield.

[0006] In view of this, the inventor has devoted himself to researching and applying theoretical principles to address the aforementioned problems in the prior art, which is the goal of the inventor's development. Summary of the Invention

[0007] This invention provides a testing device and a testing method for electronic components under test. The testing device uses a heating module to heat the electronic components under test, thereby achieving the effects of uniform heating of the electronic components under test and improving the accuracy and yield of testing.

[0008] This invention also provides a temperature monitoring unit for monitoring the temperature of an electronic component under test (ECU) and providing temperature data, and a processing unit electrically connected to the temperature monitoring unit and a heating module. The processing unit can control the heating state of the heating module and simultaneously acquire the temperature data related to the ECU from the temperature monitoring unit. During heating, the processing unit controls the heating state of the heating module, such as the heating intensity, in real time based on the temperature data to ensure that the temperature of the ECU reaches the required test temperature and remains stable within a preset range. Compared to the traditional method of heating a printed circuit board (PCB) with ceramic contacts for circuit node testing, which involves first contacting the PCB with ceramic contacts before performing electrical tests on the circuit node, this method only allows testing on one side initially, or testing on both sides only after the PCB has been removed from the ceramic contacts. The electronic component testing device of the present invention can carry or clamp a part of the electronic component under test, such as the edge of a PCB, so that most of both sides of the PCB are exposed, and both sides of the PCB can be tested at the same time. The PCB can be heated at the same time and the electrical properties (such as resistivity, capacitance, inductive reactance, withstand voltage, withstand current, etc.) of both sides of the PCB can be tested simultaneously. This not only reduces the testing time, but also improves the yield and reduces the probability of the entire production batch being scrapped.

[0009] In this embodiment of the invention, the present invention provides an apparatus for testing an electronic component under test, comprising a fixture, a heating module, a thermal imager, and a processing unit. The fixture holds the electronic component under test (DUT), which has a first surface and a second surface. A heating module is disposed on one side of the DUT and heats the first surface. A thermal imager is disposed on the other side of the DUT and monitors the second surface to monitor the temperature of the DUT. A processing unit is electrically connected to the heating module and the thermal imager, and adjusts the heating module in response to the temperature to stabilize the temperature within a preset range.

[0010] In an embodiment of the present invention, the present invention provides a method for testing an electronic component under test, comprising the following steps: providing an electronic component under test, a holder for holding the electronic component under test, a heating module disposed on one side of the electronic component under test, a temperature monitoring unit disposed on the other side of the electronic component under test, and a processing unit; holding and moving the electronic component under test to the position of the heating module; heating a first surface of the electronic component under test on one side of the electronic component under test; monitoring a second surface of the electronic component under test on the other side of the electronic component under test to monitor a temperature of the electronic component under test; and adjusting the heating module in response to the temperature to stabilize the temperature within a preset range.

[0011] In this embodiment of the invention, an apparatus for testing an electronic component under test is provided, comprising a heating module, a temperature monitoring unit, and a processing unit. The heating module heats the electronic component under test. The temperature monitoring unit monitors a temperature of the electronic component under test. The processing unit is electrically connected to the heating module and the temperature monitoring unit, and adjusts the heating module in response to the temperature to stabilize the temperature within a preset range.

[0012] In this embodiment of the invention, an apparatus for testing an electronic component under test is provided, comprising a heating module and a temperature monitoring module. The heating module heats the electronic component under test. The temperature monitoring module is electrically connected to the heating module and monitors and controls the temperature of the electronic component under test.

[0013] Based on the above, compared with the conventional method of heating electronic components under test using ceramic contact, the electronic component testing device of the present invention adopts a heating module to irradiate the electronic component under test over a large area. The first heating source is arranged above the support frame and can irradiate the upper surface of the electronic component under test over a large area. The second heating source may not be arranged or may be arranged below the support frame and can irradiate the lower surface of the electronic component under test over a large area. The heating module can make the electronic component under test heat evenly, thereby increasing the testing yield. Thus, the electronic component testing device can achieve the effects of uniformly heating the electronic component under test and improving the testing accuracy and yield.

[0014] The testing device for electronic components under test of the present invention can also monitor the temperature of the electronic components under test so that the temperature of the electronic components under test can reach the required test temperature and stabilize the temperature of the electronic components under test within a preset range. This device and testing method can not only reduce the testing time, but also improve the yield. Unreliable electronic components under test can be eliminated in advance before leaving the factory, and normal electronic components under test can be avoided from being damaged, thereby improving the yield and reducing the cost of scrapping the entire batch. Simple Explanation of the Diagram

[0015] Figure 1 is a flowchart of the steps of the method for testing electronic components of the present invention. Figure 2 is a top view schematic diagram of the electronic component testing device of the present invention. Figure 3 is another top view schematic diagram of the electronic component testing device of the present invention. Figure 4 is a front view schematic diagram of the electronic component testing device of the present invention. Figure 5 is a schematic diagram of the translation of the support frame relative to the heating module of the present invention. Figure 6 is another schematic diagram showing the translation of the support frame relative to the heating module of the present invention. Figure 7 is another schematic diagram of the translation of the support frame relative to the heating module of the present invention. Figure 8 is another schematic diagram showing the translation of the support frame relative to the heating module of the present invention. Figure 9 is a schematic diagram of a preferred embodiment of the present invention for testing an electronic component under test. Figure 10 is a schematic diagram of a device for testing an electronic component under test according to a preferred embodiment of the present invention. Figure 11 is a schematic diagram of a device for detecting an electronic component under test according to another preferred embodiment of the present invention. Implementation

[0016] Please refer to the accompanying drawings for the following detailed description, which illustrate various embodiments of the invention by way of example and to provide an understanding of how to implement the invention. The embodiments of the invention provide sufficient content for those skilled in the art to implement the disclosed embodiments or embodiments derived from the disclosed content. It should be noted that these embodiments are not mutually exclusive, and some embodiments can be appropriately combined with one or more other embodiments to form new embodiments; that is, the implementation of the invention is not limited to the embodiments disclosed below. Furthermore, for the sake of brevity and clarity, excessive details are not disclosed in the embodiments; even when specific details are disclosed, they are only illustrative to make the reader clear, and the relevant specific details in the embodiments are not intended to limit the disclosure of this case.

[0017] Please refer to Figures 1 to 8. The present invention provides a testing device and a testing method for an electronic component under test, which is used for an electronic component under test 100. The testing device 10 mainly includes a support frame 1, a heating module 2 and one or more testing modules 3.

[0018] As shown in Figures 1 to 6, the support frame 1 is used to support the electronic component 100 under test. The support frame 1 has a transparent area inside, through which the two opposite surfaces of the electronic component 100 under test are exposed.

[0019] As shown in Figures 1 to 6, the heating module 2 includes a first heating source 21 and a second heating source 22. The first heating source 21 is disposed on one side of the support frame 1 and irradiates one surface of the electronic component 100 under test. The second heating source 22 is disposed on the other side of the support frame 1 and irradiates the other surface of the electronic component 100 under test. The first heating source 21 and the second heating source 22 are arranged opposite to each other.

[0020] In addition, the first heating source 21 and the second heating source 22 each have a halogen heating lamp tube 23. The halogen heating lamp tube 23 is preferably a gold halogen heating lamp tube. The gold halogen heating lamp tube has the advantages of being able to instantly rise to a high temperature of over 500°C, high infrared radiation efficiency, powerful motor and fast heating speed. Its special gold outer layer covering the lamp tube can be controlled up to 1650 kelvin (a unit of temperature measurement), which makes it more eye-protecting, not dazzling when looking directly at it, with a main emission wavelength between 0.8 and 1.4 microns, output adjustment through a controller, economical price and long service life.

[0021] As shown in Figures 1 to 3, the detection module 3 includes a moving mechanism 31 and a detection probe 32 installed on the moving mechanism 31. The moving mechanism 31 is set to the support frame 1 and drives the detection probe 32 to detect whether the electronic component 100 under test has a normal circuit connection or poor contact.

[0022] The moving mechanism 31 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312. The detection probe 32 is fixed to the fixed base 313. The fixed base 313 moves up and down in relation to the electronic component 100 under test through the lifting drive group 312. The lifting drive group 312 moves left and right in relation to the electronic component 100 under test through the translation drive group 311.

[0023] In this embodiment, the number of detection modules 3 is four, but this is not a limitation. Two detection modules 3 are arranged on the left and right sides of one side of the support frame 1, and the other two detection modules 3 are arranged on the left and right sides of the other side of the support frame 1, so that the four detection probes 32 can detect the left and right sides of the upper surface and the left and right sides of the lower surface of the electronic component 100 under test.

[0024] As shown in Figures 1 to 6, the electronic component testing device 10 of the present invention further includes a translation mechanism 4. The support frame 1 is installed on the translation mechanism 4 and can follow the translation mechanism 4 to translate left and right relative to the first heating source 21 and the second heating source 22.

[0025] Furthermore, the translation drive group 311, the lifting drive group 312, and the translation mechanism 4 can be common linear slide rails or motor-driven push rods, etc., and are not limited to those disclosed in the drawings of this embodiment.

[0026] As shown in Figures 1 to 6, the electronic component testing device 10 of the present invention is used in a manner in which the electronic component testing device 10 heats the electronic component 100 under test using a heating module 2. The first heating source 21 is arranged above the support frame 1 and can irradiate a large area of ​​the upper surface of the electronic component 100 under test, and the second heating source 22 is arranged below the support frame 1 and can irradiate a large area of ​​the lower surface of the electronic component 100 under test.

[0027] Therefore, compared with the conventional method of heating electronic components under test by ceramic contact, the electronic component testing device 10 of the present invention uses a heating module 2 to irradiate the electronic component under test 100 over a large area, which can make the electronic component under test 100 be heated more evenly, thereby increasing the testing yield. Thus, the electronic component testing device 10 has the effect of uniformly heating the electronic component under test 100 and improving the testing accuracy and yield.

[0028] In addition, the first heating source 21 and the second heating source 22 each have a halogen heating lamp tube 23, so that the heating module 2 has the advantages of instantaneous temperature rise, fast heating speed, high infrared radiation efficiency, economical price and long service life.

[0029] The method for inspecting electronic components under test according to the present invention is described below with reference to Figure 1. The steps of the method for inspecting electronic components under test according to the present invention include: As shown in step A of Figure 1 and Figures 4 to 5 and 7, an electronic component 100 to be tested is provided. The electronic component testing device 10 further includes a translation mechanism 4. The support frame 1 is installed on the translation mechanism 4 and moves with the translation mechanism 4. The electronic component 100 to be tested is divided into a first region 101 and a second region 102. As shown in step B of Figure 1 and Figures 4 to 5 and 7, the first region 101 of the electronic component 100 under test is moved to the position corresponding to the heating module 2 through the translation mechanism 4 and the support frame 1. As shown in step C of Figure 1 and Figures 4 to 5 and Figure 7, the first heating source 21 and the second heating source 22 of the heating module 2 heat the first region 101 of the electronic component 100 under test to a preset temperature. As shown in step D of Figure 1 and Figures 4 to 5 and Figure 7, the moving mechanism 31 drives the detection probe 32 to perform electrical detection on the first region 101 of the electronic component under test 100 when it reaches the preset temperature. As shown in step E of Figure 1 and Figures 4, 6 and 8, the first region 101 of the electronic component under test 100, which has completed electrical testing, is moved away from the heating module 2 by the translation mechanism 4 and the carrier frame 1, and then the second region 102 of the electronic component under test 100 is moved to the position corresponding to the heating module 2. As shown in step F of Figure 1 and Figures 4, 6 and 8, the first heating source 21 and the second heating source 22 of the heating module 2 heat the second region 102 of the electronic component 100 under test to a preset temperature. As shown in step G of Figure 1 and Figures 4, 6 and 8, the moving mechanism 31 drives the detection probe 32 to perform electrical detection on the second region 102 of the electronic component under test 100 when it reaches the preset temperature. As shown in Figures 5 and 6, the first region 101 may be located on the left side of the electronic component 100 under test, and the second region 102 may be located in the middle of the electronic component 100 under test; or, as shown in Figures 7 and 8, the first region 101 may be located in the middle of the electronic component 100 under test, and the second region 102 may be located on the right side of the electronic component 100 under test, without being limited to this embodiment.

[0030] Please refer to Figures 2 and 4 together. The first heating source 21 can be replaced by a thermal imager 24. The device 10 for detecting an electronic component under test includes a support frame 1 or clamp 1', a heating module 2, a thermal imager 24, and a processing unit 25. The clamp 1' holds the electronic component under test 100, which has a surface 100S1 and a surface 100S2. The heating module 2 is disposed on one side of the electronic component under test 100 and heats the surface 100S1. The thermal imager 24 is disposed on the other side of the electronic component under test 100 and monitors the surface 100S2 to monitor the temperature of the electronic component under test 100. The processing unit 25 is electrically connected to the heating module 2 and the thermal imager 24, and adjusts the heating module 2 in response to the temperature to stabilize the temperature within a preset range.

[0031] This temperature is a target temperature, which can be based on the manufacturer's requirements, such as approximately 125 degrees Celsius when testing electronic component 100. The temperature control method includes: a heating start-up procedure, where the temperature monitored in real-time by the thermal imager 24 is far below the target temperature, and the heating module 2 begins to continuously increase its power for heating; a near-target temperature procedure, where the temperature monitored in real-time by the thermal imager 24 approaches the target temperature, and the heating module 2 gradually reduces its heating power; and a target temperature maintenance procedure, where the thermal imager 24 monitors temperature fluctuations in real-time, and the heating module 2 continuously and slightly increases or decreases its heating power to achieve a constant temperature effect. For example, the processing unit 25 can control the heating module 2 to reduce its heating intensity before the thermal imager 24 detects that the temperature of the electronic component 100 under test has reached 125 degrees Celsius. Conversely, before the thermal imager 24 detects that the temperature of the electronic component 100 under test is below 100 degrees Celsius, the processing unit 25 controls the heating module 2 to increase its heating intensity. The heating module 2 in Figure 4 may only include the second heating source 22, which heats only the second surface 100S2 of the electronic component 100 under test. The thermal imager 24 can monitor the temperature of the electronic component 100 under test in real time and transmit the relevant temperature data of the electronic component 100 under test to the processing unit 25 in real time. The processing unit 25 can be configured independently, built into the thermal imager 24, or configured in the heating module 2, without limitation.

[0032] Please refer to Figure 9, which illustrates method S10 of a preferred embodiment of the present invention for testing an electronic component under test. Referring also to Figures 2, 4, and 9, method S10 includes the following steps: Step S101: Providing an electronic component under test 100, a holder 1'' for holding the electronic component under test 100, a heating module 2 disposed on one side of the electronic component under test 100, a temperature monitoring unit 26 disposed on the other side of the electronic component under test 100, and a processing unit 25. Step S102: Holding and moving the electronic component under test 100 to the position of the heating module 2. Step S103: Heating a surface 100S2 of the electronic component under test 100 on one side of the electronic component under test 100. Step S104: Monitoring a surface 100S1 of the electronic component under test 100 on the other side of the electronic component under test 100 to monitor the temperature of the electronic component under test 100. Step S105: Adjust the heating module 2 in response to the temperature so that the temperature is stabilized within a preset range.

[0033] In any embodiment of the present invention, method S10 further includes the following steps: enabling the processing unit to acquire temperature data from the thermal imager in real time, and comparing the temperature data with a target temperature and a threshold temperature, to perform: controlling the heating module to reduce a heating intensity before the temperature data is lower than and close to the target temperature; and controlling the heating module to increase the heating intensity before the temperature data is higher than and close to the threshold temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module. Here, the threshold temperature refers to the temperature at which the heating power needs to be increased if the temperature drops too much after approaching the target temperature; it can also be set manually, for example, to reduce temperature fluctuations, the threshold temperature is set closer to the target temperature. Here, the heat source intensity is equivalent to the heating power.

[0034] In any embodiment of the present invention, the electronic component under test 100 is at least one of an IC substrate, a liquid crystal panel, and a circuit board. The heating module 2 includes a halogen lamp. The device 10 further includes a detection module 3, which includes a moving mechanism 31 and a detection probe 32 mounted on the moving mechanism 31. The moving mechanism 31 is disposed opposite to the fixture 1' and drives the detection probe 32 to detect the electronic component under test 100. The moving mechanism 3 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312. The detection probe 32 is fixed to the fixed base 313. The translation drive group 311 and the lifting drive group 312 are respectively a linear slide rail and a motor-driven push rod. The device 10 also includes a moving mechanism 4', in which the fixture is mounted on the moving mechanism and can move relative to the heating module 2 following the moving mechanism 4'.

[0035] In any embodiment of the present invention, the clamp 1' includes two symmetrical clamping elements to clamp the PCB, which can be placed perpendicular to a horizontal plane (e.g., the ground plane). The heating module 2 can be disposed near the surface of the PCB, and the irradiation direction of the heating module 2 is perpendicular to the surface of the PCB, i.e., parallel to the horizontal plane. For example, when heating and testing the PCB, the PCB is fixed vertically by the clamp 1', which reduces the planar space occupied by the entire heating and testing device. The device 10 further includes at least one detection module 3, and the number of detection modules 3 is four, wherein two detection modules 3 are disposed on the left and right sides of one side of the clamp 1', and the other two detection modules 3 are disposed on the left and right sides of the other side of the clamp 1'. The device 10 of the present invention can simultaneously heat and test the electronic component 100 under test. The device 10 also includes a support frame 1, the interior of which has a perforated area, through which the two opposing surfaces of the electronic component 100 under test are exposed.

[0036] Please refer to Figure 10, which shows a preferred embodiment of the apparatus 50 for testing an electronic component 500 under test (DUT), comprising a heating module 52, a temperature monitoring unit 526, and a processing unit 525. The heating module 52 heats the DUT 500. The temperature monitoring unit 526 monitors a temperature of the DUT 500. The processing unit 525 is electrically connected to the heating module 52 and the temperature monitoring unit 526, and adjusts the heating module 526 in response to the temperature to stabilize the temperature within a preset range.

[0037] In any embodiment of the invention, the temperature monitoring unit 26, 526 is a thermal imager 24. The electronic component under test 100, 500 is at least one of an IC substrate, a liquid crystal panel, and a circuit board. The holder 1'' is a clamp 1' used to hold the electronic component under test 100, 500. The electronic component under test 100, 500 has a surface 100S1 and a surface 100S2. The heating module 2, 52 is disposed on one side of the electronic component under test 100, 500 and heats surface 100S2. The temperature monitoring unit 26, 526 is disposed on the other side of the electronic component under test 100, 500 and monitors surface 100S1 to monitor the temperature of the electronic component under test 100, 500. The processing unit 25, 525 acquires temperature data from the temperature monitoring unit 26, 526 in real time to perform the following actions: before the temperature data is lower than and close to a first temperature, control the heating module 2, 52 to reduce the heating intensity; before the temperature data is higher than and close to a second temperature, control the heating module 2, 52 to increase the heating intensity, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module.

[0038] In Figure 10, the heating module 52 and the temperature monitoring unit 526 can be arranged on either side of the electronic component under test 100, or on the same side of the electronic component under test 100. Although the arrangement is more crowded when both are on the same side, as long as the field of vision (FOV) of the temperature monitoring unit 526 can cover the entire area of ​​the electronic component under test 100, or the distance between the temperature monitoring unit 526 and the electronic component under test 100 is adjusted, the heating module 526 will basically be arranged directly above the electronic component under test 100 to better control the temperature regulation of the electronic component under test 100 by the heating module 526. This method includes adjusting the distance between the heating module 526 and the electronic component under test 100, and adjusting the heating intensity between the heating module 526 and the electronic component under test 100, etc. The temperature monitoring unit 526 does not need to be arranged directly above the electronic component under test 100. On the other hand, at least one of the heating module 526 and the temperature monitoring unit 526 may be configured above the electronic component under test 100.

[0039] Please refer to Figure 11, which shows a preferred embodiment of the device 60 for testing an electronic component 500 under test, comprising a heating module 52 and a temperature monitoring module 62. The heating module 52 heats the electronic component 500 under test. The temperature monitoring module 62 is electrically connected to the heating module 52 and monitors and controls the temperature of the electronic component 500 under test.

[0040] The embodiments in Figure 10 or 11 can be combined with the embodiments in Figures 1-9 to form new embodiments. For example, in any embodiment of the present invention, the temperature monitoring module 62 includes a temperature monitoring unit 526 and a processing unit 525. The temperature monitoring unit 526 is a thermal imager 24. The electronic components under test 100, 500 are at least one of an IC substrate, a liquid crystal panel, and a circuit board. The device 10, 50, 60 further includes a holder 1'' for holding the electronic components under test 100, 500. The holder 1'' is a clamp 1' for clamping the electronic components under test 100, 500. The holder 1'' and the heating module 2 are arranged perpendicularly or horizontally to each other. For example, if the heated surface of the PCB or IC substrate can be arranged perpendicularly to the ground plane, then in order to simultaneously heat and monitor its temperature, the holder 1'' and the heating module 2 are arranged horizontally relative to the electronic component under test 100, 500; when the PCB or IC substrate is arranged horizontally relative to the ground plane, the holder 1'' and the heating module 2 are arranged perpendicularly relative to the electronic component under test 100, 500. The electronic component under test 100, 500 has a first surface 100S1 and a second surface 100S2. The heating module 2 includes a halogen lamp, such as a halogen heating lamp tube 23. The heating module 2 is disposed on one side of the electronic component under test 100, 500 and heats the first surface 100S1. The temperature monitoring units 100 and 500 are disposed on the other side of the electronic component under test 100 and 500 and monitor the second surface 100S2 to monitor a temperature of the electronic component under test 100 and 500. The processing units 25 and 525 acquire temperature data from the temperature monitoring units 26 and 526 in real time to perform the following actions: before the temperature data is lower than and close to a first temperature, control the heating module 2 and 52 to reduce a heating intensity; and before the temperature data is higher than and close to a second temperature, control the heating module 2 and 52 to increase the heating intensity, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test 100 and 500 and the heating module 2 and 52. The devices 10, 50, and 60 further include a detection module 3, which includes a moving mechanism 31 and a detection probe 32 mounted on the moving mechanism 31. The moving mechanism 31 is positioned corresponding to the fixture 1' and drives the detection probe 32 to detect the electronic component 100 or 500 under test. The moving mechanism 31 includes a translation drive group 311, a lifting drive group 312 mounted on the translation drive group 311, and a fixed base 313 mounted on the lifting drive group 312. The detection probe 32 is fixed to the fixed base 313, and the translation drive group 311 and the lifting drive group 312 are respectively a linear slide rail and a motor-driven push rod.The testing device 10, 50, 60 further includes a moving mechanism 4, such as a translation mechanism 4, wherein the holder 1'' is mounted on the moving mechanism 4 and can move relative to the heating module 2, 52 following the moving mechanism 4. Heating of the electronic component 100, 500 and testing of the electronic component 100, 500 are performed simultaneously. The device 10, 50, 60 also includes a support frame 1, the interior of which has a perforated area, exposing the two opposing surfaces 100S1, 100S2 of the electronic component 100, 500 through the perforated area.

[0041] In summary, the electronic component testing device and method of the present invention have not been seen in similar products or publicly used, and have industrial applicability, novelty and progress, fully meeting the requirements for patent application. Therefore, this application is filed in accordance with the Patent Law to protect the inventor's rights.

[0042] 100, 500: Electronic components under test 101: Area 1 102: Second Area 10, 50, 60: Testing device for electronic components under test 1: Support frame 1': Fixture 1'':holder 2,52: Heating Module 21: First heating source 22: Second heating source 23: Halogen heating lamp tube 24: Thermal Imager 25,525: Processing Unit 26,526: Temperature monitoring unit 3: Detection Module 31: Mobile mechanism 311: Translation drive group 312: Lifting drive unit 313: Fixed base 32: Detection probe 4: Translation mechanism 6: Temperature monitoring module

Claims

1. An apparatus for testing an electronic component under test, comprising: a clamp for holding the electronic component under test, wherein the electronic component under test has a first surface and a second surface; a heating module disposed on one side of the electronic component under test and heating the first surface; a thermal imager disposed on the other side of the electronic component under test and monitoring the second surface to monitor a temperature of the electronic component under test; a processing unit electrically connected to the heating module and the thermal imager, and adjusting the heating module in response to the temperature to stabilize the temperature within a preset range; a detection module including a first moving mechanism and a detection probe mounted on the first moving mechanism, wherein the first moving mechanism is disposed opposite to the clamp and drives the detection probe to detect the electronic component under test; and a second moving mechanism, wherein the clamp is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism, and a heated surface of the electronic component under test held by the clamp is disposed perpendicular to a horizontal plane.

2. The apparatus as claimed in claim 1, wherein: The electronic component under test is at least one of an IC substrate, a liquid crystal panel, and a circuit board; the heating module includes a halogen lamp; the first moving mechanism includes a translation drive group, a lifting drive group mounted on the translation drive group, and a fixed base mounted on the lifting drive group, wherein the detection probe is fixed to the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod; the device further includes at least one detection module, the number of which is four, wherein two detection modules are arranged on the left and right sides of one side of the fixture, and the other two detection modules are arranged on the left and right sides of the other side of the fixture; the heating of the electronic component under test and the detection of the electronic component under test are performed simultaneously; and the device also includes a support frame, the interior of which has a transparent area, through which the two opposite surfaces of the electronic component under test are exposed.

3. The apparatus as claimed in claim 1, wherein: The processing unit acquires temperature data from the thermal imager in real time and compares the temperature data with a target temperature and a threshold temperature to perform the following actions: before the temperature data is lower than and close to the target temperature, controlling the heating module to reduce the heating intensity; and before the temperature data is higher than and close to the threshold temperature, controlling the heating module to increase the heating intensity, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module.

4. A method for testing an electronic component under test, comprising the following steps: providing an electronic component under test, a holder for holding the electronic component under test, a heating module disposed on one side of the electronic component under test, a temperature monitoring unit disposed on the other side of the electronic component under test, and a processing unit; holding and moving the electronic component under test to the position of the heating module; heating a first surface of the electronic component under test on one side of the electronic component under test; monitoring a second surface of the electronic component under test on the other side of the electronic component under test to monitor a temperature of the electronic component under test; and adjusting the heating module in response to the temperature to stabilize the temperature within a preset range. A detection module is provided, the detection module including a first moving mechanism and a detection probe mounted on the first moving mechanism, wherein the first moving mechanism is disposed opposite to the holder and drives the detection probe to detect the electronic component under test; and a second moving mechanism is provided, wherein the holder is mounted on the second moving mechanism and is capable of moving with the second moving mechanism relative to the heating module, and a heated surface of the electronic component under test held by the holder is disposed perpendicular to a horizontal plane.

5. The method of claim 4 further comprises the following steps: enabling the processing unit to acquire temperature data from the thermal imager in real time, and comparing the temperature data with a target temperature and a threshold temperature, to perform: controlling the heating module to reduce a heating intensity before the temperature data is lower than and close to the target temperature; and controlling the heating module to increase the heating intensity before the temperature data is higher than and close to the threshold temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the electronic component under test and the heating module.

6. The method as described in request item 4, wherein: The temperature monitoring unit is a thermal imager; the electronic component under test is at least one of an IC substrate, an LCD panel, and a circuit board; the method further includes the following steps: heating the electronic component under test and detecting the electronic component under test are performed simultaneously.

7. An apparatus for testing an electronic component under test, comprising: a heating module for heating the electronic component under test; a temperature monitoring unit for monitoring a temperature of the electronic component under test; a processing unit electrically connected to the heating module and the temperature monitoring unit, and adjusting the heating module in response to the temperature to stabilize the temperature within a preset range; a holder for holding the electronic component under test; a detection module including a first moving mechanism and a detection probe mounted on the first moving mechanism, wherein the first moving mechanism is disposed opposite to the fixture and drives the detection probe to detect the electronic component under test; and the electronic component under test testing apparatus further comprising a second moving mechanism, wherein the holder is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism, and a heated surface of the electronic component under test held by the holder is disposed perpendicular to a horizontal plane.

8. The apparatus as claimed in claim 7, wherein: The temperature monitoring unit is a thermal imager; the electronic component under test (DUT) is at least one of an IC substrate, a liquid crystal panel, and a circuit board; the holder is a clamp; the DUT has a first surface and a second surface; the heating module includes a halogen lamp; the heating module is disposed on one side of the DUT and heats the first surface; the temperature monitoring unit is disposed on the other side of the DUT and monitors the second surface to monitor a temperature of the DUT; the processing unit acquires temperature data from the temperature monitoring unit in real time to perform: controlling the heating module to reduce a heating intensity before the temperature data is lower than and close to a first temperature; and controlling the heating module to increase the heating intensity before the temperature data is higher than and close to a second temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the DUT and the heating module; The first moving mechanism includes a translation drive group, a lifting drive group mounted on the translation drive group, and a fixed base mounted on the lifting drive group, wherein the detection probe is fixed to the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod; the heating of the electronic component under test and the detection of the electronic component under test are performed simultaneously; and the device also includes a support frame, the interior of which has a transparent area, through which the two opposing surfaces of the electronic component under test are exposed.

9. An apparatus for testing an electronic component under test, comprising: a heating module for heating the electronic component under test; a temperature monitoring module electrically connected to the heating module for monitoring and controlling a temperature of the electronic component under test; the apparatus further comprising a holder for holding the electronic component under test; a detection module including a first moving mechanism and a detection probe mounted on the first moving mechanism, wherein the first moving mechanism is disposed opposite to the fixture and drives the detection probe to detect the electronic component under test; and a second moving mechanism, wherein the holder is mounted on the second moving mechanism and is capable of moving relative to the heating module following the second moving mechanism, and a heated surface of the electronic component under test held by the holder is disposed perpendicular to a horizontal plane.

10. The apparatus as claimed in claim 9, wherein: The temperature monitoring module includes a temperature monitoring unit and a processing unit; the temperature monitoring unit is a thermal imager; the electronic component under test (DUT) is at least one of an IC substrate, an LCD panel, and a circuit board; the holder is a clamp; the DUT has a first surface and a second surface; the heating module includes a halogen lamp; the heating module is disposed on one side of the DUT and heats the first surface; the temperature monitoring unit is disposed on the other side of the DUT and monitors the second surface to monitor a temperature of the DUT; the processing unit acquires temperature data from the temperature monitoring unit in real time to perform: controlling the heating module to reduce a heating intensity before the temperature data is lower than and close to a first temperature; and controlling the heating module to increase the heating intensity before the temperature data is higher than and close to a second temperature, wherein the heating intensity includes at least one of a heat source intensity, a heating interval time, and a distance between the DUT and the heating module; The first moving mechanism includes a translation drive group, a lifting drive group mounted on the translation drive group, and a fixed base mounted on the lifting drive group, wherein the detection probe is fixed to the fixed base, and the translation drive group and the lifting drive group are respectively a linear slide rail and a motor-driven push rod; the heating of the electronic component under test and the detection of the electronic component under test are performed simultaneously; and the device also includes a support frame, the interior of which has a transparent area, through which the two opposing surfaces of the electronic component under test are exposed.

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