Substrate processing system and conveying method

Abstract

One embodiment of the substrate processing system of the present invention includes a vacuum transfer module, a plasma processing module connected to the vacuum transfer module, and a controller. The vacuum transfer module includes a vacuum transfer chamber and a transfer robot disposed within the vacuum transfer chamber. The plasma processing module includes: a plasma processing chamber; a stage disposed within the plasma processing chamber, having a substrate support surface and a ring support surface; a first ring disposed on the ring support surface of the stage; and a second ring disposed on the first ring to surround a substrate on the substrate support surface of the stage. The inner diameter is smaller than that of the first ring; a plurality of first support pins are disposed below the ring support surface; a plurality of second support pins are disposed below the substrate support surface; a first actuator is configured to move the plurality of first support pins longitudinally relative to the stage; and a second actuator is configured to move the plurality of second support pins longitudinally relative to the stage; the controller is configured to selectively execute the following two modes, namely, a simultaneous transport mode in which the transport robot simultaneously transports the first ring and the second ring, and a mode in which the upper... The single-transfer mode describes the individual transfer mode where the transfer robot individually transfers the second ring; the simultaneous transfer mode includes the following steps: raising the plurality of first support pins by lifting the first ring and the second ring together; and, while the plurality of first support pins are raised, transferring the first ring and the second ring together between the plurality of first support pins and the transfer robot; the single-transfer mode includes the following steps: raising the plurality of first support pins by lifting the first ring and the second ring together by lifting the plurality of first support pins. 1. The support pins rise; the plurality of second support pins are raised such that the transfer fixture is supported by the plurality of second support pins at a height lower than the height of the second ring; while the second ring is supported by the transfer fixture, and the first ring is supported by the plurality of first support pins, the plurality of second support pins are lowered such that they are lowered to a position lower than the height of the transfer fixture; and while the plurality of second support pins are raised, the transfer fixture and the second ring are transferred together between the plurality of second support pins and the transfer robot.

Description

Substrate Processing System and Transfer Method The present invention relates to a substrate processing system and a transfer method. There is a known technique in which an edge ring and a lid ring are respectively lifted and lowered by lift pins of one system, and thus members are transferred one by one. The above-mentioned edge ring and lid ring are arranged around a wafer placed on an electrostatic chuck on a pedestal provided in a processing container for plasma processing (for example, refer to Patent Document 1). Prior Art Document Patent Document Patent Document 1: Japanese Patent Application Laid-Open No. 2020-113603 [Problems to be Solved by the Invention] The present invention provides a technique for selectively replacing consumable members having different replacement times. [Technical Means for Solving the Problems] A substrate processing system according to an aspect of the present invention includes a vacuum transfer module, a plasma processing module connected to the vacuum transfer module, and a controller. The vacuum transfer module includes a vacuum transfer chamber and a transfer robot disposed in the vacuum transfer chamber. The plasma processing module includes: a plasma processing chamber; a stage disposed in the plasma processing chamber, having a substrate support surface and a ring support surface; a first ring disposed on the ring support surface of the stage; a second ring disposed on the first ring so as to surround a substrate on the substrate support surface of the stage, having an inner diameter smaller than the inner diameter of the first ring; a plurality of first support pins disposed below the ring support surface; a plurality of second support pins disposed below the substrate support surface; a first actuator configured to move the plurality of first support pins vertically relative to the stage; and a second actuator configured to move the plurality of second support pins vertically relative to the stage. The controller is configured to selectively execute two modes, namely, a simultaneous transfer mode in which the transfer robot simultaneously transfers the first ring and the second ring, and a separate transfer mode in which the transfer robot separately transfers the second ring. The simultaneous transfer mode includes the steps of: raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins; and, in a state where the plurality of first support pins have been raised,交接 the first ring and the second ring together between the plurality of first support pins and the transfer robot. The separate transfer mode includes the steps of: raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins; raising the plurality of second support pins so that a transfer jig is supported by the plurality of second support pins at a height lower than the height of the second ring; lowering the plurality of second support pins to a position lower than the height of the transfer jig in a state where the second ring is supported by the transfer jig and, on the other hand, the first ring is supported by the plurality of first support pins; and, in a state where the plurality of second support pins have been raised,交接 the transfer jig and the second ring together between the plurality of second support pins and the transfer robot. [Effects of the Invention] According to the present invention, consumable components with different replacement times can be selectively replaced. Hereinafter, a non-limiting exemplary embodiment of the present invention will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding components or parts are labeled with the same or corresponding reference symbols, and repeated descriptions are omitted. 〔Processing System〕 An example of the processing system according to the embodiment will be described with reference to FIG. 1. As shown in FIG. 1, the processing system PS is a system capable of performing various processes such as plasma processing on a substrate. The substrate may be, for example, a semiconductor wafer. The processing system PS includes vacuum transfer modules TM1 and TM2, process modules PM1 to PM12, load lock modules LL1 and LL2, atmospheric transfer module LM, storage module SM, etc. The vacuum transfer modules TM1 and TM2 each have a substantially quadrilateral shape when viewed from above. The vacuum transfer module TM1 is connected to the process modules PM1 to PM6 on two opposite sides. One of the other two opposite sides of the vacuum transfer module TM1 is connected to the load lock modules LL1 and LL2, and the other side is connected to a passage (not shown) for connecting to the vacuum transfer module TM2. The side of the vacuum transfer module TM1 to which the load lock modules LL1 and LL2 are connected has an angle corresponding to the two load lock modules LL1 and LL2. The vacuum transfer module TM2 is connected to the process modules PM7 to PM12 on two opposite sides. One of the other two opposite sides of the vacuum transfer module TM2 is connected to a passage (not shown) for connecting to the vacuum transfer module TM1, and the other side is connected to the storage module SM. The vacuum transfer modules TM1 and TM2 have vacuum chambers (vacuum transfer chambers), and transfer robots TR1 and TR2 are respectively arranged inside. The transfer robots TR1 and TR2 are configured to be rotatable, extendable, and liftable freely. The transfer robot TR1 holds and transfers substrates and consumable components by using the upper fork (first fork) FK11 and the lower fork (second fork) FK12 arranged at the front end. In the example of FIG. 1, the transfer robot TR1 holds the substrate and the consumable components by using the upper fork FK11 and the lower fork FK12, and transfers the substrate and the consumable components between the load lock modules LL1 and LL2, the process modules PM1 to PM6, and the passage (not shown). The transfer robot TR2 holds and transfers substrates and consumable components by using the upper fork FK21 and the lower fork FK22 arranged at the front end. In the example of FIG. 1, the transfer robot TR2 holds the substrate and the consumable components by using the upper fork FK21 and the lower fork FK22, and transfers the substrate and the consumable components between the process modules PM7 to PM12, the storage module SM, and the passage (not shown). The consumable components are components that can be replaceably installed in the process modules PM1 to PM12 and are components that are consumed due to various processes such as plasma processing in the process modules PM1 to PM12. The consumable components include, for example, the following edge ring FR, cover ring CR, and top plate 121 of the upper electrode 12. The process modules PM1 to PM12 have a processing chamber (plasma processing chamber) and a stage (placement stage) disposed inside. After the substrate is placed on the stage, the process modules PM1 to PM12 depressurize the inside and introduce a processing gas, apply RF (Radio Frequency) power to generate plasma, and perform plasma processing on the substrate using the plasma. The vacuum transfer modules TM1 and TM2 and the process modules PM1 to PM12 are separated by a gate valve G1 that can be freely opened and closed. An edge ring FR, a cover ring CR, etc. are disposed on the stage. An upper electrode 12 for applying RF power is disposed above the stage facing the stage. The load interlock modules LL1 and LL2 are disposed between the vacuum transfer module TM1 and the atmospheric transfer module LM. The load interlock modules LL1 and LL2 have an internal pressure variable chamber that can switch the inside to vacuum or atmospheric pressure. The load interlock modules LL1 and LL2 have a stage disposed inside. When the load interlock modules LL1 and LL2 transfer a substrate from the atmospheric transfer module LM to the vacuum transfer module TM1, they maintain the inside at atmospheric pressure, receive the substrate from the atmospheric transfer module LM, depressurize the inside, and then transfer the substrate to the vacuum transfer module TM1. When the load interlock modules LL1 and LL2 transfer a substrate from the vacuum transfer module TM1 to the atmospheric transfer module LM, they maintain the inside at vacuum, receive the substrate from the vacuum transfer module TM1, increase the inside pressure to atmospheric pressure, and then transfer the substrate to the atmospheric transfer module LM. The load interlock modules LL1 and LL2 and the vacuum transfer module TM1 are separated by a gate valve G2 that can be freely opened and closed. The load interlock modules LL1 and LL2 and the atmospheric transfer module LM are separated by a gate valve G3 that can be freely opened and closed. The atmospheric transfer module LM and the vacuum transfer module TM1 are disposed opposite to each other. The atmospheric transfer module LM can be, for example, an EFEM (Equipment Front End Module). The atmospheric transfer module LM is a rectangular parallelepiped-shaped atmospheric transfer chamber equipped with an FFU (Fan Filter Unit) and maintained at an atmospheric pressure atmosphere. Two load interlock modules LL1 and LL2 are connected to one side surface of the atmospheric transfer module LM along the long side direction. Loading ports LP1 to LP5 are connected to the other side surface of the atmospheric transfer module LM along the long side direction. Containers (not shown) are placed on the loading ports LP1 to LP5, and a plurality of (for example, 25) substrates are accommodated in the containers. The containers can be, for example, FOUPs (Front-Opening Unified Pods). A transfer robot (not shown) for transferring substrates is disposed inside the atmospheric transfer module LM. The transfer robot transfers substrates between inside the FOUP and inside the internal pressure variable chamber of the load interlock modules LL1 and LL2. The storage module SM is detachably connected to the vacuum transfer module TM2. The storage module SM has a storage chamber for storing consumable components. The storage module SM is connected to the vacuum transfer module TM2, for example, when replacing the consumable components in the process modules PM1 to PM12, and is removed from the vacuum transfer module TM2 after the replacement of the consumable components is completed. Thereby, the area around the processing system PS can be effectively utilized. However, the storage module SM can also be always connected to the vacuum transfer module TM2. The storage module SM has a position detection sensor for detecting the position of the consumable components stored in the storage chamber. The consumable components are transferred between the process modules PM1 to PM12 and the storage module SM by transfer robots TR1 and TR2. The vacuum transfer module TM2 and the storage module SM are separated by a gate valve G4 that can be freely opened and closed. A control unit CU is provided in the processing system PS. The control unit CU controls each part of the processing system. For example, it controls the transfer robots TR1 and TR2 provided in the vacuum transfer modules TM1 and TM2, the transfer robot provided in the atmospheric transfer module LM, and the gate valves G1 to G4. For example, the control unit CU is configured to select the following two modes: a simultaneous transfer mode in which the transfer robots TR1 and TR2 transfer the edge ring FR and the cover ring CR simultaneously, and a single transfer mode in which the transfer robots TR1 and TR2 transfer only the edge ring FR. The simultaneous transfer mode and the single transfer mode will be described below. In one example, the control unit CU performs the single transfer mode at a higher frequency than the simultaneous transfer mode. The control unit CU can be a computer, for example. The control unit CU includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an auxiliary storage device, etc. The CPU executes operations based on the programs stored in the ROM or the auxiliary storage device to control each part of the processing system PS. 〔Plasma Processing Device〕 Referring to FIGS. 2 and 3, an example of the plasma processing device used as the process modules PM1 to PM12 included in the processing system PS of FIG. 1 will be described. The plasma processing device 1 includes a plasma processing chamber 10, a gas supply unit 20, an RF power supply unit 30, an exhaust system 40, a lifter 50, and a control unit 90. The plasma processing chamber 10 includes a substrate support portion 11 and an upper electrode 12. The substrate support portion 11 is disposed in the lower region of the plasma processing space 10s in the plasma processing chamber 10. The upper electrode 12 is disposed above the substrate support portion 11 and can function as a part of the top plate of the plasma processing chamber 10. The substrate support portion 11 supports the substrate W in the plasma processing space 10s. The substrate support portion 11 includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 has an upper surface including a substrate support surface 112a and a ring support surface 112b. The electrostatic chuck 112 supports the substrate W using the substrate support surface 112a. The electrostatic chuck 112 supports the edge ring FR using the ring support surface 112b. The electrostatic chuck 112 has an insulating material 112c, a first adsorption electrode 112d, and a second adsorption electrode 112e. The first adsorption electrode 112d and the second adsorption electrode 112e are embedded in the insulating material 112c. The first adsorption electrode 112d is located below the substrate support surface 112a. The electrostatic chuck 112 adsorbs and holds the substrate W on the substrate support surface 112a by applying a voltage to the first adsorption electrode 112d. The second adsorption electrode 112e is located below the ring support surface 112b. The electrostatic chuck 112 adsorbs and holds the edge ring FR on the ring support surface 112b by applying a voltage to the second adsorption electrode 112e. In the examples of FIGS. 2 and 3, the electrostatic chuck 112 includes a monopolar electrostatic chuck that adsorbs and holds the substrate W, and a bipolar electrostatic chuck that adsorbs and holds the edge ring FR. However, a bipolar electrostatic chuck can be used instead of the monopolar electrostatic chuck, or a monopolar electrostatic chuck can be used instead of the bipolar electrostatic chuck. The ring assembly 113 includes an edge ring FR and a cover ring CR. The edge ring FR is an example of a second ring. The edge ring FR has an annular shape and is disposed around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The edge ring FR improves the uniformity of the plasma processing performed on the substrate W. The edge ring FR is formed of a conductive material such as silicon (Si) or silicon carbide (SiC), for example. The cover ring CR is an example of a first ring. The cover ring CR has an annular shape and is disposed on the outer peripheral portion of the edge ring FR. The cover ring CR protects the upper surface of the insulator 115 from, for example, plasma effects. The cover ring CR is formed of an insulating material such as quartz, for example. In the example of FIG. 2, the inner peripheral portion of the cover ring CR is located more inward than the outer peripheral portion of the edge ring FR, and the outer peripheral portion of the edge ring FR is located more outward than the inner peripheral portion of the cover ring CR, and a part of the edge ring FR overlaps with the cover ring CR. Moreover, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Thereby, when the plurality of support pins 521 described below are lifted and lowered, the cover ring CR and the edge ring FR are lifted and lowered integrally. The insulator 115 is disposed on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10 and supports the lower electrode 111 and the insulator 115. The upper electrode 12 and the insulating member 13 together constitute the plasma processing chamber 10. The upper electrode 12 supplies one or more process gases from the gas supply unit 20 to the plasma processing space 10s. The upper electrode 12 includes a top plate 121 and a support body 122. The lower surface of the top plate 121 defines the plasma processing space 10s. A plurality of gas inlets 121a are formed in the top plate 121. The plurality of gas inlets 121a penetrate in the plate thickness direction (vertical direction) of the top plate 121 respectively. The support body 122 supports the top plate 121 in a detachable manner. A gas diffusion chamber 122a is provided inside the support body 122. A plurality of gas inlets 122b extend downward from the gas diffusion chamber 122a. The plurality of gas inlets 122b communicate with the plurality of gas inlets 121a respectively. A gas supply port 122c is formed in the support body 122. The upper electrode 12 supplies one or more process gases from the gas supply port 122c to the plasma processing space 10s via the gas diffusion chamber 122a, the plurality of gas inlets 122b, and the plurality of gas inlets 121a. An inlet / outlet port 10p is formed in the side wall of the plasma processing chamber 10. The substrate W is transported between the plasma processing space 10s and the outside of the plasma processing chamber 10 via the inlet / outlet port 10p. The inlet / outlet port 10p is opened or closed by the gate valve G1. The gas supply unit 20 includes one or more gas sources 21 and one or more flow controllers 22. The gas supply unit 20 supplies one or more process gases from each gas source 21 to the gas supply port 122c via each flow controller 22. The flow controller 22 may include, for example, a mass flow controller or a pressure-controlled flow controller. Further, the gas supply unit 20 may also include one or more flow modulation devices for modulating the flow rate or pulsing one or more process gases. The RF power supply unit 30 includes two RF power supplies (the first RF power supply 31a, the second RF power supply 31b) and two matchers (the first matcher 32a, the second matcher 32b). The first RF power supply 31a supplies the first RF power to the lower electrode 111 via the first matcher 32a. The frequency of the first RF power may be, for example, 13 MHz to 150 MHz. The second RF power supply 31b supplies the second RF power to the lower electrode 111 via the second matcher 32b. The frequency of the second RF power may be, for example, 400 kHz to 13.56 MHz. Further, a DC (Direct Current) power supply may be used instead of the second RF power supply 31b. The exhaust system 40 can be connected, for example, to a gas outlet 10e provided at the bottom of the plasma processing chamber 10. The exhaust system 40 can include a pressure regulating valve and a vacuum pump. The pressure in the plasma processing space 10s is adjusted by the pressure regulating valve. The vacuum pump can include a turbo molecular pump, a dry pump, or a combination thereof. The lifter 50 raises and lowers the substrate W, the edge ring FR, and the cover ring CR. The lifter 50 includes a first lifter 51 and a second lifter 52. The first lifter 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted into through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112 so as to be able to protrude and retract relative to the upper surface of the electrostatic chuck 112. The plurality of support pins 511 support the substrate W by protruding relative to the upper surface of the electrostatic chuck 112 and bringing the upper ends into contact with the lower surface of the substrate W. The actuator 512 raises and lowers the plurality of support pins 511. As the actuator 512, for example, a motor such as a DC motor, a stepping motor, or a linear motor, or a piezoelectric actuator such as a pneumatic drive mechanism such as a cylinder can be used. The first lifter 51 described above raises and lowers the plurality of support pins 511, for example, when the substrate W is transferred between the transfer robots TR1, TR2 and the substrate support portion 11. The second lifter 52 includes a plurality of support pins 521 and an actuator 522. The plurality of support pins 521 are inserted into through holes H2 formed in the insulator 115 so as to be able to protrude and retract relative to the upper surface of the insulator 115. The plurality of support pins 521 support the cover ring CR by protruding relative to the upper surface of the insulator 115 and bringing the upper ends into contact with the lower surface of the cover ring CR. The actuator 522 raises and lowers the plurality of support pins 521. As the actuator 522, for example, the same one as the actuator 512 can be used. The second lifter 52 described above raises and lowers the plurality of support pins 521, for example, when the edge ring FR and the cover ring CR are transferred between the transfer robots TR1, TR2 and the substrate support portion 11. In the example of FIG. 2, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Thus, when the actuator 522 raises and lowers the plurality of support pins 521, the cover ring CR and the edge ring FR are raised and lowered integrally. The control unit 90 controls each part of the plasma processing apparatus 1. The control unit 90 includes, for example, a computer 91. The computer 91 includes, for example, a CPU 911, a memory unit 912, a communication interface 913, and the like. The CPU 911 can be configured to perform various control operations based on the programs stored in the memory unit 912. The memory unit 912 includes at least one memory type selected from the group consisting of auxiliary memory devices such as RAM, ROM, HDD (Hard Disk Drive), and SSD (Solid State Drive). The communication interface 913 can communicate with the plasma processing apparatus 1 via a communication line such as a LAN (Local Area Network). The control unit 90 can be provided separately from the control unit CU or can be included in the control unit CU. 〔Storage Module〕 Referring to FIGS. 4 and 5, an example of the storage module SM included in the processing system PS of FIG. 1 will be described. The storage module SM has a chamber 70 provided on the frame 60 and has a mechanical chamber 81 above the chamber 70. The chamber 70 can be depressurized inside by an exhaust unit 72 connected to an exhaust port 71 provided at the bottom. Also, for example, N 2 gas is supplied to the chamber 70 as a purge gas. Thereby, the pressure inside the chamber 70 can be adjusted. The mechanical chamber 81 is, for example, an atmospheric pressure atmosphere. A storage bin 75 is provided inside the chamber 70. The storage bin 75 has a stage 73 and a lifting chamber 74 provided below the stage 73. The storage bin 75 can be lifted and lowered by a ball screw 76. Inside the mechanical chamber 81, a line sensor 82 that detects the position, orientation, etc. of the consumable member and a motor 77 that drives the ball screw 76 are provided. An opening 84 made of quartz or the like is provided between the chamber 70 and the mechanical chamber 81 so that the line sensor 82 can receive the light from the following light emitting unit 83. The stage 73 is for placing the consumable member. The stage 73 has a light emitting unit 83 facing the line sensor 82. The stage 73 can rotate in the θ direction to rotate the placed consumable member, for example, the edge ring FR, in a specified orientation. That is, the stage 73 performs alignment (registration) of the edge ring FR. At the time of alignment, the orientation plane (OF) of the edge ring FR is made to coincide with the specified orientation. Also, at the time of alignment, the center position of the edge ring FR can be made to coincide. The line sensor 82 detects the amount of light irradiated by the self-luminous unit 83 and outputs the detected amount of light to the control unit CU. The control unit CU detects the orientation plane of the edge ring FR by using the fact that the detected amount of light changes according to the presence or absence of the orientation plane of the edge ring FR. The control unit CU detects the orientation of the edge ring FR based on the detected orientation plane. The line sensor 82 is, for example, a line sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The lift chamber 74 is provided in the lower part of the stage 73. A cassette 78 is placed inside the lift chamber 74. The cassette 78 is a storage container that can be taken out from the lift chamber 74. The cassette 78 has intervals in the vertical direction and stores a plurality of consumable members. In the example of FIG. 4, a plurality of edge rings FR are stored in the cassette 78. The front side of the cassette 78 that stores the module SM is open. Further details of the cassette 78 will be described below. In addition to having the stage 73 and the lift chamber 74, the storage bin 75 also has a guide 79 supported by a ball screw 76 on the side. The ball screw 76 connects the upper surface and the lower surface of the chamber 70, passes through the upper surface of the chamber 70, and is connected to a motor 77 in the mechanical chamber 81. The through portion on the upper surface of the chamber 70 is sealed so that the ball screw 76 can rotate. The ball screw 76 rotates by the motor 77, whereby the storage bin 75 can be moved in the vertical direction (Z-axis direction). The storage module SM is detachably connected to the vacuum transfer module TM2 via a gate valve G4. The upper fork FK21 and the lower fork FK22 of the transfer robot TR2 of the vacuum transfer module TM2 can be inserted into the chamber 70 via the gate valve G4. The upper fork FK21 and the lower fork FK22, for example, carry out the loading of the edge ring FR into the cassette 78, the unloading of the edge ring FR placed in the cassette 78, the placement of the edge ring FR on the stage 73, and the acquisition of the edge ring FR placed on the stage 73. The door 80, for example, opens or closes when the cassette 78 is taken out from the chamber 70 or when the cassette 78 is set in the chamber 70. When the light emitting unit 85 and the sheet number detection sensor 86 move from the bottom side of the chamber 70 to the upper part such as the position where the cassette 78 faces the gate valve G4 in the storage chamber 75, the number of sheets placed on the edge ring FR of the cassette 78 is detected. The light emitting unit 85 is, for example, an LED (Light Emitting Diode), a semiconductor laser, or the like. The sheet number detection sensor 86 detects the amount of light irradiated from the light emitting unit 85 and outputs the detected amount of light to the control unit CU. The control unit CU measures the number of times the light irradiated from the light emitting unit 85 is blocked by the edge ring FR based on the detected amount of light, thereby detecting the number of sheets of the edge ring FR. The sheet number detection sensor 86 is, for example, a photodiode, a phototransistor, or the like. Further, the sheet number detection sensor 86 may also be a line sensor such as a CCD or a CMOS. Furthermore, in the above example, the case where the control unit CU calculates the position information of the edge ring FR based on the amount of light detected by the line sensor 82 in the storage module SM has been described, but the present invention is not limited thereto. For example, a position detection sensor including an inner circumference sensor that detects the position of the inner circumference of the edge ring FR and an outer circumference sensor that detects the position of the outer circumference of the edge ring FR may also be used. In this case, the control unit CU calculates the position information of the edge ring FR based on the outer circumference position of the edge ring FR detected by the inner circumference sensor and the outer circumference position of the edge ring FR detected by the outer circumference sensor. Further, for example, other optical sensors or a camera may be used instead of the line sensor 82. In this case, the control unit CU calculates the position information of the edge ring FR based on the image captured by the camera by using, for example, image processing technology. 〔Transfer robot〕 Referring to FIGS. 6 to 9, the upper fork FK21 of the transfer robot TR2 will be described. Furthermore, the lower fork FK22 of the transfer robot TR2 may have the same configuration as the upper fork FK21. Also, the upper fork FK11 and the lower fork FK12 of the transfer robot TR1 may have the same configuration as the upper fork FK21 of the transfer robot TR2. FIG. 6 is a schematic top view showing the upper fork FK21 not holding the transfer object. As shown in FIG. 6, the upper fork FK21 has a substantially U-shaped shape in a top view. The upper fork FK21 is configured to be able to hold, for example, a substrate W, a transfer jig CJ, an edge ring FR, a cover ring CR, a first assembly A1, and a second assembly A2. The transfer jig CJ is a jig that supports the edge ring FR from below and can be used when only the edge ring FR is replaced. The transfer jig CJ is configured to be able to support only the edge ring FR and not the cover ring CR. For example, the transfer jig CJ is a plate-shaped member having a portion that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the cover ring CR. Specifically, the transfer jig CJ is a plate-shaped member having a substantially rectangular shape with a diagonal line that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the cover ring when viewed from above. Also, the transfer jig CJ can be a disk-shaped member having a diameter that is longer than the inner diameter of the edge ring FR and shorter than the inner diameter of the cover ring CR. The first assembly A1 is an assembly formed by placing the edge ring FR on the cover ring CR to integrate the edge ring FR and the cover ring CR. The second assembly A2 is an assembly formed by placing the edge ring FR on the transfer jig CJ to integrate the transfer jig CJ and the edge ring FR. Figure 7 is a schematic top view of the upper fork FK21 holding the first assembly A1 (edge ring FR and cover ring CR). As shown in Figure 7, the upper fork FK21 is configured to be able to hold the first assembly A1. Thereby, the transfer robot TR2 can transfer the edge ring FR and the cover ring CR simultaneously. Figure 8 is a schematic top view of the upper fork FK21 holding the second assembly A2 (transfer jig CJ and edge ring FR). As shown in Figure 8, the upper fork FK21 is configured to be able to hold the second assembly A2. Thereby, the transfer robot TR2 can transfer the transfer jig CJ and the edge ring FR simultaneously. Figure 9 is a schematic top view of the upper fork FK21 holding only the transfer jig CJ. As shown in Figure 9, the upper fork FK21 is configured to be able to hold the transfer jig CJ that does not support the edge ring FR. Thereby, the transfer robot TR2 can transfer the transfer jig CJ alone. 〔Cassette〕 Referring further to Figure 10, the cassette 78 for storing the edge ring FR, which is an example of the cassette 78 included in the storage module SM, will be described. Figure 10 is a schematic perspective view of an example of the cassette 78 inside the storage module SM. Furthermore, the cassette 78 in a state where the edge ring FR is not stored is shown in Figure 10. The cassette 78 stores the edge ring FR. The cassette 78 has a plurality of bottom plates 781 and a plurality of guide pins 782. The plurality of bottom plates 781 are arranged in multiple stages in the vertical direction. The plurality of bottom plates 781 are for placing the edge ring FR. Each bottom plate 781 has a substantially rectangular plate shape. Each bottom plate 781 is formed of, for example, resin or metal. Each bottom plate 781 includes a placement surface 781a, an outer frame portion 781b, and a fork insertion groove 781c. The placement surface 781a is for placing the edge ring FR. The outer frame portion 781b (recessed portion) protrudes upward from the mounting surface 781a at the peripheral portions of three sides out of the four sides of the mounting surface 781a, excluding the front side where the upper fork FK21 and the lower fork FK22 are inserted. Another bottom plate 781 is placed on the outer frame portion 781b. The fork insertion groove 781c is formed in the mounting surface 781a. The fork insertion groove 781c is recessed with respect to the mounting surface 781a and has a substantially U-shaped in plan view. The upper fork FK21 or the lower fork FK22 of the transfer robot TR2 is inserted into the fork insertion groove 781c. In one example, when the edge ring FR positioned on the mounting surface 781a is carried out from the cassette 78, the upper fork FK21 or the lower fork FK22 of the transfer robot TR2 is inserted into the fork insertion groove 781c. A plurality of guide pins 782 are provided on the mounting surface 781a. Each guide pin 782 may have a conical shape with a tapered front end. When the edge ring FR is placed on the mounting surface 781a, the plurality of guide pins 782 come into contact with the peripheral portion of the edge ring FR and guide the edge ring FR to be placed at a specified position on the mounting surface 781a. Each guide pin 782 may be formed of resin, metal, or the like. If it is resin, generation of fine particles due to friction when contacting the peripheral portion of the edge ring FR can be suppressed. Furthermore, although the cassette 78 for storing the edge ring FR is illustrated in FIG. 10, for example, the cassette 78 for storing the transfer jig CJ, the lid ring CR, the first assembly A1, and the second assembly A2 may have the same configuration except for the plurality of guide pins 782. For example, in the cassette 78 for storing the lid ring CR, a plurality of guide pins 782 are provided at positions in contact with the inner peripheral portion of the lid ring CR. Thereby, the lid ring CR is guided and placed at a specified position on the mounting surface 781a. Also, for example, in the cassette 78 for storing the edge ring FR and the lid ring CR, a plurality of guide pins 782 are provided at positions in contact with the peripheral portion of the edge ring FR placed on the mounting surface 781a and the inner peripheral portion of the lid ring CR. Thereby, the edge ring FR and the lid ring CR are guided and placed at a specified position on the mounting surface 781a. With reference to FIGS. 11A to 11C, an example of the positioning mechanism of the edge ring FR will be described. FIGS. 11A to 11C are diagrams showing an example of the positioning mechanism of the edge ring FR. FIG. 11A is a plan view when the upper fork FK21 enters below the edge ring FR placed on the bottom plate 781. FIG. 11B shows a cross section taken along the dash-dotted line B1 - B1 in FIG. 11A. FIG. 11C is a cross-sectional view when the edge ring FR placed on the bottom plate 781 is lifted by the upper fork FK21. As shown in FIGS. 11A and 11B, the edge ring FR has a notch FRa on its outer periphery. The notch FRa has, for example, a V shape in a top view. The opening angle of the V shape can be appropriately set, for example, it can be 90°. Also, the notch FRa can have a curved shape such as a U shape in a top view. First, as shown in FIGS. 11A and 11B, the upper fork FK21 is inserted below the edge ring FR placed on the bottom plate 781. Subsequently, as shown in FIG. 11C, the upper fork FK21 is raised. Thereby, the upper fork FK21 holds the edge ring FR stored in the cassette 78 in a state of being positioned on the bottom plate 781 and transports it to the process modules PM1 to PM12. In this way, the upper fork FK21 holds the edge ring FR stored in the cassette 78 in a state of being positioned on the bottom plate 781 and transports it to the process modules PM1 to PM12. Therefore, the edge ring FR can be transported to the process modules PM1 to PM12 in a precisely positioned state without separately providing an alignment machine for positioning the edge ring FR. As a result, the downtime generated by transporting the edge ring FR to the alignment machine can be reduced. Also, the device introduction cost can be lowered. Also, the space efficiency is improved. However, an alignment machine can also be separately provided to more precisely align and transport the edge ring FR using the alignment machine. Furthermore, in the examples of FIGS. 11A to 11C, the case where the edge ring FR has one notch FRa on its outer periphery is shown, but the number of notches FRa is not limited to this. For example, the edge ring FR can also have a plurality of notches FRa spaced apart from each other in the circumferential direction on its outer periphery. In this case, it is preferable to provide guide pins 782 corresponding to each of the plurality of notches FRa. Thereby, the angular error can be reduced. Also, in the examples of FIGS. 11A to 11C, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 can also be used. With reference to FIGS. 12A to 12C, an example of the positioning mechanism of the cover ring CR will be described. FIGS. 12A to 12C are diagrams showing an example of the positioning mechanism of the cover ring CR. FIG. 12A is a top view when the upper fork FK21 is inserted below the cover ring CR placed on the bottom plate 781. FIG. 12B shows a cross section taken along the single dotted line B2 - B2 in FIG. 12A. FIG. 12C is a cross-sectional view when the cover ring CR placed on the bottom plate 781 is lifted by the upper fork FK21. As shown in FIGS. 12A and 12B, the cover ring CR has a notch CRa on its inner periphery. The notch CRa has, for example, a V shape in a top view. The opening angle of the V shape can be appropriately set, for example, it can be 90°. Also, the notch CRa can have a curved shape such as a U shape in a top view. First, as shown in FIGS. 12A and 12B, the upper fork FK21 is inserted below the cover ring CR placed on the bottom plate 781. Subsequently, as shown in FIG. 12C, the upper fork FK21 is raised. Thereby, the upper fork FK21 holds the lid ring CR stored in the cassette 78 in a state of being positioned on the bottom plate 781, and conveys it to the process modules PM1 to PM12. In this way, the upper fork FK21 holds the lid ring CR stored in the cassette 78 in a state of being positioned on the bottom plate 781, and conveys it to the process modules PM1 to PM12. Therefore, the lid ring CR can be conveyed to the process modules PM1 to PM12 in a state of precise positioning without separately providing an alignment machine for positioning the lid ring CR. As a result, the downtime generated by conveying the lid ring CR to the alignment machine can be reduced. Also, the device introduction cost can be reduced. Also, the space efficiency is improved. However, an alignment machine may be separately provided to more precisely align and convey the lid ring CR using the alignment machine. Furthermore, in the examples of FIGS. 12A to 12C, the case where the lid ring CR has one notch CRa on its inner circumference is shown, but the number of notches CRa is not limited to this. For example, the lid ring CR may also have a plurality of notches CRa spaced apart from each other in the circumferential direction on its inner circumference. In this case, it is preferable to provide guide pins 782 corresponding to each of the plurality of notches CRa. Thereby, the angular error can be reduced. Also, in the examples of FIGS. 12A to 12C, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may also be used. With reference to FIGS. 13A to 13C, the positioning mechanism for the edge ring FR and the lid ring CR will be described. FIGS. 13A to 13C are diagrams showing an example of the positioning mechanism for the edge ring FR and the lid ring CR. FIG. 13A is a plan view when the upper fork FK21 enters below the edge ring FR and the lid ring CR placed on the bottom plate 781. FIG. 13B shows a cross section taken along the single-dot chain line B3 - B3 in FIG. 13A. FIG. 13C is a cross-sectional view when the edge ring FR and the lid ring CR placed on the bottom plate 781 are lifted by the upper fork FK21. The positioning mechanism shown in FIGS. 13A and 13B can be used, for example, when the inner circumference of the lid ring CR is smaller than the outer circumference of the edge ring FR, or when the inner circumference of the lid ring CR is the same as the outer circumference of the edge ring FR and the process modules PM1 to PM12 are plasma processing devices as shown in FIG. 29 below. As shown in FIGS. 13A and 13B, the edge ring FR has a notch FRa on its outer circumference, and the lid ring CR has a notch CRa on its inner circumference. The notches FRa, CRa have, for example, a V-shaped shape in plan view. The opening angle of the V-shaped shape can be, for example, 90°. Also, the notches FRa, CRa may have a curved shape such as a U-shaped shape in plan view. First, as shown in FIGS. 13A and 13B, the upper fork FK21 enters below the edge ring FR and the lid ring CR placed on the bottom plate 781. Subsequently, as shown in FIG. 13C, the upper fork FK21 is raised. Thereby, the upper fork FK21 holds the edge ring FR and the cover ring CR that are stored in the cassette 78 in a state of being positioned on the bottom plate 781, and transports them to the process modules PM1 to PM12. In this way, the upper fork FK21 holds the edge ring FR and the cover ring CR that are stored in the cassette 78 in a state of being positioned on the bottom plate 781, and transports them to the process modules PM1 to PM12. Therefore, the edge ring FR and the cover ring CR can be transported to the process modules PM1 to PM12 in a precisely positioned state without separately providing an alignment machine for positioning the edge ring FR and the cover ring CR. As a result, the downtime caused by transporting the edge ring FR and the cover ring CR to the alignment machine can be reduced. Also, the device introduction cost can be reduced. Also, the space efficiency is improved. However, an alignment machine may be separately provided to more precisely align and transport the edge ring FR and the cover ring CR using the alignment machine. Furthermore, in the examples of FIGS. 13A to 13C, the case where the edge ring FR has one notch FRa on the outer periphery and the cover ring CR has one notch Cra on the inner periphery is shown, but the number of the notches FRa, Cra is not limited thereto. For example, the edge ring FR may have a plurality of notches FRa spaced apart from each other in the circumferential direction on the outer periphery, and the cover ring CR may have a plurality of notches Cra spaced apart from each other in the circumferential direction on the inner periphery. In this case, it is preferable to provide guide pins 782 corresponding to each of the plurality of notches FRa, Cra. Thereby, the angular error can be reduced. Also, in the examples of FIGS. 13A to 13C, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may also be used. Also, in the examples of FIGS. 13A to 13C, the case of positioning the edge ring FR and the cover ring CR on the outer periphery or the inner periphery is described, but it is not limited thereto. For example, recesses (or protrusions) for positioning may be provided on the back surfaces (the surfaces on the side of the mounting surface 781a) of the edge ring FR and the cover ring CR to perform their respective positioning. Also, in the examples of FIGS. 13A to 13C, the case where the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR have a non-overlapping configuration is described, but it is not limited thereto. The outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR may also have an overlapping configuration. In this case, the edge ring FR is held in a state of being positioned relative to the cover ring CR. In one example, a positioning portion may be provided on the outer periphery of the cover ring CR, and the edge ring FR is positioned by positioning the cover ring CR. Also, in another example, when the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR overlap, recesses (or protrusions) for positioning may be provided in the non-overlapping regions of the edge ring FR and the cover ring CR, respectively. In this case, the guide pins 782 may be provided at positions that engage with the recesses. Thereby, the edge ring FR and the cover ring CR can be respectively positioned. The above has described the case where the transfer robot TR2 uses the upper fork FK21 to take out the edge ring FR and / or the cover ring CR from the cassette 78 with reference to FIGS. 11A to 13C. Furthermore, in the case of loading the edge ring FR and / or the cover ring CR into the cassette 78, the edge ring FR and / or the cover ring CR can be placed on the bottom plate 781 of the cassette 78 using the upper fork FK21 of the transfer robot TR2. Also, when the storage module SM is not operating, for example, an operator can also open the door 80 provided on the side of the storage module SM facing the gate valve G4 and place the edge ring FR and / or the cover ring CR on the bottom plate 781 of the cassette 78. Additionally, other robots can also be used for placement. With reference to FIG. 14, the case of taking out the second assembly A2 (transfer jig CJ and edge ring FR) positioned and placed in the storage module SM from the cassette 78 by the upper fork FK21 will be described. The operation shown in FIG. 14 is performed, for example, when the outer peripheral portion of the edge ring FR overlaps with the inner peripheral portion of the cover ring CR when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the following single transfer mode. FIG. 14 is a schematic top view showing an example of the second assembly A2 stored in the cassette 78. First, as shown in FIG. 14, the upper fork FK21 is moved under the second assembly A2 placed on the bottom plate 781. Then, the upper fork FK21 is raised. Thereby, the upper fork FK21 holds the second assembly A2 stored in the cassette 78 and transports it to the process modules PM1 to PM12. In this way, the transfer robot TR2 holds the second assembly A2 (transfer jig CJ and edge ring FR) stored in the cassette 78 by the upper fork FK21 and simultaneously transports the transfer jig CJ and the edge ring FR to the process modules PM1 to PM12. Furthermore, in the example of FIG. 14, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 can also be used. With reference to FIG. 15, the case of taking out the transfer jig CJ positioned and placed in the storage module SM from the cassette 78 by the upper fork FK21 will be described. The operation shown in FIG. 15 is performed, for example, when the outer peripheral portion of the edge ring FR overlaps with the inner peripheral portion of the cover ring CR when placed on the electrostatic chuck 112 of the plasma processing apparatus 1, and when the control unit CU selects and executes the following single transfer mode. FIG. 15 is a schematic top view showing an example of the transfer jig CJ stored in the cassette 78. First, as shown in FIG. 15, the upper fork FK21 is moved under the transfer jig CJ placed on the bottom plate 781. Then, the upper fork FK21 is raised. Thereby, the upper fork FK21 holds the transfer jig CJ stored in the cassette 78 and transports it to the process modules PM1 to PM12. Thus, the transfer robot TR2 holds the transfer jig CJ stored in the cassette 78 by the upper fork FK21, and transfers the transfer jig CJ alone to the process modules PM1 to PM12. Furthermore, in the example of FIG. 15, the case of using the upper fork FK21 is illustrated, but the lower fork FK22 may also be used. Referring to FIG. 16, another example of the cassette 78 included in the storage module SM of FIGS. 4 and 5 will be described. FIG. 16 is a schematic perspective view showing another example of the cassette 78 in the storage module SM, and shows a cassette 78X that stores an edge ring FR as an example of a consumable member. The difference between the cassette 78X shown in FIG. 16 and the cassette 78 shown in FIG. 10 is that it has an inclined block 782b instead of a plurality of guide pins 782, and the inclined block 782b has an inclined surface that abuts against the outer peripheral portion of the edge ring FR to hold the edge ring FR in a specified position. Furthermore, regarding other configurations, they may be the same as those of the cassette 78 shown in FIG. 10. Also, as another example, the cassette 78 may also have the following inclined block (not shown) that has an inclined surface that abuts against the inner peripheral portion of the lid ring CR to hold the lid ring CR in a specified position. Also, as another example, the cassette 78 may also have the following inclined block (not shown) that has an inclined surface that abuts against the outer peripheral portion of the edge ring FR and the inner peripheral portion of the lid ring CR to hold the edge ring FR and the lid ring CR in a specified position. Also, the inclined block may be configured to abut against the inner peripheral portion of the edge ring FR to hold the edge ring FR in a specified position. Also, the inclined block may be configured to abut against the outer peripheral portion of the lid ring CR to hold the lid ring CR. 〔Method for Transferring Consumable Member〕 Referring to FIGS. 17A to 19D, a case where the control unit CU in the processing system PS as an embodiment selects and executes the simultaneous transfer mode, which is a mode in which the transfer robot TR2 simultaneously transfers the edge ring FR and the lid ring CR, will be described. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transfer robot TR2 and the elevator 50 for explanation. However, the control unit 90 may also be provided separately from the control unit CU, the control unit CU controls the transfer robot TR2, and the control unit 90 controls the elevator 50. Furthermore, the outer peripheral portion of the edge ring FR and the inner peripheral portion of the lid ring CR are configured to overlap in a plan view. Also, in the initial state, as shown in FIGS. 17A and 17B, the edge ring FR and the lid ring CR are placed on the electrostatic chuck 112. First, as shown in FIG. 18A, the control unit CU raises a plurality of support pins 521 from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR, and the cover ring CR is lifted by the plurality of support pins 521, so that the cover ring CR separates from the electrostatic chuck 112. At this time, the outer peripheral portion (outer annular portion) of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Therefore, when the cover ring CR is lifted by the plurality of support pins 521, the edge ring FR is also lifted together with the cover ring CR. That is, the edge ring FR and the cover ring CR are integrally separated from the electrostatic chuck 112. Subsequently, as shown in FIG. 18B, the control unit CU causes the lower fork FK22 that does not hold the transfer object to enter between the edge ring FR and the cover ring CR supported by the plurality of support pins 521 and the electrostatic chuck 112. Subsequently, as shown in FIG. 18C, the control unit CU lowers the plurality of support pins 521 from the support position to the standby position. Thereby, the edge ring FR and the cover ring CR supported by the plurality of support pins 521 are placed on the lower fork FK22. Subsequently, as shown in FIG. 18D, the control unit CU causes the lower fork FK22 holding the edge ring FR and the cover ring CR to retract. Subsequently, as shown in FIG. 19A, the control unit CU causes the upper fork FK21 holding the replacement edge ring FR and the replacement cover ring CR to enter above the electrostatic chuck 112. The replacement edge ring FR can be a new product (unused), or it can be one that has been used but not excessively consumed. The replacement cover ring CR can be a new product (unused), or it can be one that has been used but not excessively consumed. Subsequently, as shown in FIG. 19B, the control unit CU raises the plurality of support pins 521 from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR held by the upper fork FK21, and the cover ring CR is lifted by the plurality of support pins 521, so that the cover ring CR separates from the upper fork FK21. At this time, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Therefore, the edge ring FR and the cover ring CR are lifted by the plurality of support pins 521. That is, the edge ring FR and the cover ring CR are integrally separated from the upper fork FK21. Subsequently, as shown in FIG. 19C, the control unit CU causes the upper fork FK21 that does not hold the transfer object to retract. Subsequently, as shown in FIG. 19D, the control unit CU lowers the plurality of support pins 521 from the support position to the standby position. Thereby, the edge ring FR and the cover ring CR supported by the plurality of support pins 521 are placed on the electrostatic chuck 112. By the above, as shown in FIGS. 17A and 17B, the edge ring FR and the cover ring CR are simultaneously carried into the plasma processing chamber 10 and placed on the electrostatic chuck 112. When the edge ring FR and the cover ring CR placed on the electrostatic chuck 112 are removed from the plasma processing chamber 10, the control unit CU performs an operation opposite to the loading of the edge ring FR and the cover ring CR. As described above, according to the processing system PS of the embodiment, the edge ring FR and the cover ring CR can be transported simultaneously. Referring to FIGS. 20A to 23D, a case where the control unit CU, which is another example of the transport method of the consumable member in the processing system PS of the embodiment, selects and executes the single transport mode will be described. In the single transport mode, the transport robot TR2 transports only the edge ring FR. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transport robot TR2 and the lifter 50 for explanation. However, the control unit 90 may be provided separately from the control unit CU, the control unit CU controls the transport robot TR2, and the control unit 90 controls the lifter 50. Further, the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR are configured to overlap in a plan view. Also, in the initial state, as shown in FIGS. 17A and 17B, the edge ring FR and the cover ring CR are placed on the electrostatic chuck 112. First, as shown in FIG. 20A, the control unit CU raises a plurality of support pins 521 from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR, and the cover ring CR is lifted by the plurality of support pins 521, so that the cover ring CR is separated from the electrostatic chuck 112. At this time, the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR. Therefore, when the cover ring CR is lifted by the plurality of support pins 521, the edge ring FR is also lifted together with the cover ring CR. That is, the edge ring FR and the cover ring CR are integrally separated from the electrostatic chuck 112. Subsequently, as shown in FIG. 20B, the control unit CU causes the lower fork FK22 of the transfer jig CJ, which holds the transfer object, to enter between the edge ring FR and the cover ring CR supported by the plurality of support pins 521 and the electrostatic chuck 112. Subsequently, as shown in FIG. 20C, the control unit CU raises a plurality of support pins 511 from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 511 abut against the lower surface of the transfer jig CJ, and the transfer jig CJ is lifted by the plurality of support pins 511, so that the transfer jig CJ is separated from the lower fork FK22. Subsequently, as shown in FIG. 20D, the control unit CU causes the lower fork FK22 that does not hold the transfer object to retract. Subsequently, as shown in FIG. 21A, the control unit CU lowers a plurality of support pins 521 from the support position to the standby position. At this time, since the inner peripheral portion (inner annular portion) of the edge ring FR is supported by the transfer jig CJ, only the cover ring CR supported by the plurality of support pins 521 is placed on the electrostatic chuck 112. Subsequently, as shown in FIG. 21B, the control unit CU causes the lower fork FK22 that does not hold the object to be transported to enter between the transport jig CJ supported by a plurality of support pins 511, the edge ring FR, and the electrostatic chuck 112. Subsequently, as shown in FIG. 21C, the control unit CU causes the plurality of support pins 511 to descend from the support position to the standby position. Thereby, the transport jig CJ and the edge ring FR supported by the plurality of support pins 511 are placed on the lower fork FK22. Subsequently, as shown in FIG. 21D, the control unit CU causes the lower fork FK22 that holds the transport jig CJ and the edge ring FR to withdraw. Subsequently, as shown in FIG. 22A, the control unit CU causes the upper fork FK21 that holds the transport jig CJ to enter above the electrostatic chuck 112, and the transport jig CJ holds the replacement edge ring FR. Subsequently, as shown in FIG. 22B, the control unit CU controls the plurality of support pins 511 to rise from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 511 abut against the lower surface of the transport jig CJ held by the upper fork FK21, and the transport jig CJ is lifted by the plurality of support pins 511, so that the transport jig CJ separates from the upper fork FK21. At this time, the inner peripheral portion of the edge ring FR is placed on the transport jig CJ. Therefore, when the transport jig CJ is lifted by the plurality of support pins 511, the edge ring FR is also lifted together with the transport jig CJ. That is, the transport jig CJ and the edge ring FR are integrally separated from the upper fork FK21. Subsequently, as shown in FIG. 22C, the control unit CU causes the upper fork FK21 that does not hold the object to be transported to withdraw. Subsequently, as shown in FIG. 22D, the control unit CU causes the plurality of support pins 521 to rise from the standby position to the support position. Thereby, the upper ends of the plurality of support pins 521 abut against the lower surface of the cover ring CR placed on the electrostatic chuck 112, and the cover ring CR is lifted by the plurality of support pins 521, so that the cover ring CR separates from the electrostatic chuck 112. Also, the outer peripheral portion of the edge ring FR placed on the transport jig CJ is placed on the inner peripheral portion of the cover ring CR. Subsequently, as shown in FIG. 23A, the control unit CU causes the upper fork FK21 that does not hold the object to be transported to enter between the transport jig CJ, the edge ring FR, the cover ring CR, and the electrostatic chuck 112. Subsequently, as shown in FIG. 23B, the control unit CU causes the plurality of support pins 511 to descend from the support position to the standby position. At this time, since the outer peripheral portion of the edge ring FR is placed on the inner peripheral portion of the cover ring CR, only the transport jig CJ supported by the plurality of support pins 511 is placed on the upper fork FK21. Subsequently, as shown in FIG. 23C, the control unit CU causes the upper fork FK21 that holds the transport jig CJ to withdraw. Subsequently, as shown in FIG. 23D, the control unit CU lowers a plurality of support pins 521 from the support positions to the standby positions. Thereby, the edge ring FR and the cover ring CR supported by the plurality of support pins 521 are placed on the electrostatic chuck 112. As described above, according to the processing system PS of the embodiment, the edge ring FR can be transported alone without replacing the cover ring CR. As described above, only the edge ring FR is carried into the plasma processing chamber 10 and placed on the electrostatic chuck 112 on which the cover ring CR is placed. When only the edge ring FR among the edge ring FR and the cover ring CR placed on the electrostatic chuck 112 is taken out of the plasma processing chamber 10, the control unit CU performs an operation opposite to the above-described loading of the edge ring FR. 〔Method for Replacing Consumable Components〕 Referring to FIG. 24, an example of a method for replacing consumable components of the embodiment will be described. FIG. 24 is a flowchart showing an example of a method for replacing consumable components of the embodiment. Hereinafter, an example in which the consumable components in the above-described process module PM12 are replaced will be described. Further, the method for replacing consumable components of the embodiment shown in FIG. 24 is performed by the control unit CU controlling each part of the processing system PS. In step S10, the control unit CU determines whether the cover ring CR needs to be replaced. In the present embodiment, the control unit CU determines whether the cover ring CR needs to be replaced based on, for example, the RF cumulative time, the RF cumulative power, and the cumulative value of a specific step of the process recipe. The RF cumulative time, the RF cumulative power, and the cumulative value of a specific step of the process recipe will be described below. Also, the control unit CU can also determine whether the cover ring CR needs to be replaced by, for example, using an optical method to detect the height position of the cover ring CR. Also, in another example, the control unit CU can also count the number of replacements of the edge ring FR in advance, and replace the cover ring CR when a specified value is reached. For example, when the edge ring FR has been replaced 3 times, the cover ring CR can be replaced 1 time. At this time, the cover ring CR is also replaced at the time of the third replacement of the edge ring FR. Also, in another example, the control unit CU can also replace the edge ring FR and the cover ring CR at the same time with the replacement cycle of the cover ring CR. The flowchart of FIG. 24 is an example in which the edge ring FR and the cover ring CR are replaced at the same time with the replacement cycle of the cover ring CR. In step S10, when it is determined that the cover ring CR needs to be replaced, the control unit CU advances the process to step S20. On the other hand, in step S10, when it is determined that the cover ring CR does not need to be replaced, the control unit CU advances the process to step S40. In step S20, the control unit CU determines whether the edge ring FR and the cover ring CR can be replaced. The determination of whether the edge ring FR and the cover ring CR can be replaced can use the same determination method as, for example, the determination of whether the edge ring FR can be replaced described below. However, a different determination method can also be used. In the case where it is determined in step S20 that the edge ring FR and the cover ring CR can be replaced, the control unit CU advances the process to step S30. On the other hand, in the case where it is determined in step S20 that the edge ring FR and the cover ring CR cannot be replaced, the control unit CU repeats step S20. In step S30, the control unit CU selects the simultaneous transfer mode and causes the transfer robot TR2 to transfer the edge ring FR and the cover ring CR simultaneously. Details of step S30 will be described below. In step S40, the control unit CU determines whether the edge ring FR needs to be replaced. In the present embodiment, the control unit CU determines whether the edge ring FR needs to be replaced, for example, based on the RF cumulative time, the RF cumulative power, and the cumulative value of a specific step of the process recipe. The RF cumulative time refers to the cumulative value of the time during which high-frequency power is supplied in the process module PM12 during a specified plasma process. The RF cumulative power refers to the cumulative value of the high-frequency power supplied in the process module PM12 during a specified plasma process. The cumulative value of a specific step of the process recipe refers to the cumulative value of the time or the cumulative value of the high-frequency power during which high-frequency power is supplied in the step of reducing the edge ring FR among the steps of the process performed in the process module PM12. Furthermore, the RF cumulative time, the RF cumulative power, and the cumulative value of a specific step of the process recipe are values calculated, for example, starting from the time point when the device is introduced, the time point when maintenance is performed, or the like, which is the time point when the edge ring FR is replaced. When determining whether the edge ring FR needs to be replaced based on the RF cumulative time, the control unit CU determines that the edge ring FR needs to be replaced when the RF cumulative time reaches the threshold value. In contrast, the control unit CU determines that the edge ring FR does not need to be replaced when the RF cumulative time does not reach the threshold value. Furthermore, the threshold value is a value specified according to the type of the material of the edge ring FR or the like through preliminary experiments or the like. When determining whether the edge ring FR needs to be replaced based on the RF cumulative power, the control unit CU determines that the edge ring FR needs to be replaced when the RF cumulative power reaches the threshold value. In contrast, the control unit CU determines that the edge ring FR does not need to be replaced when the RF cumulative power does not reach the threshold value. Furthermore, the threshold value is a value specified according to the type of the material of the edge ring FR or the like through preliminary experiments or the like. When determining whether to replace the edge ring FR based on the cumulative value of a specific step in the process recipe, the control unit CU determines that the edge ring FR needs to be replaced when the RF cumulative time or RF cumulative power in a specific step reaches a threshold value. In contrast, the control unit CU determines that there is no need to replace the edge ring FR when the RF cumulative time or RF cumulative power in a specific step does not reach the threshold value. When determining whether to replace the edge ring FR based on the cumulative value of a specific step in the process recipe, high-frequency power can be applied, and the timing for replacing the edge ring FR can be calculated based on the steps for reducing the edge ring FR. Therefore, the timing for replacing the edge ring FR can be calculated with particularly high accuracy. Furthermore, the threshold value is a value specified according to the type of the material of the edge ring FR and the like through preliminary experiments and the like. Also, the control unit CU can also determine whether to replace the edge ring FR by, for example, using an optical method to detect the height position of the edge ring FR. In step S40, when it is determined that the edge ring FR needs to be replaced, the control unit CU advances the process to step S50. On the other hand, when it is determined that there is no need to replace the edge ring FR, the control unit CU returns the process to step S10. In step S50, the control unit CU determines whether the edge ring FR can be replaced. In the present embodiment, the control unit CU determines that the edge ring FR can be replaced when, for example, the substrate W is not being processed in the process module PM12 for replacing the edge ring FR. In contrast, the control unit CU determines that the edge ring FR cannot be replaced when the substrate W is being processed in the process module PM12. Also, the control unit CU can also determine that the edge ring FR can be replaced when the processing of the substrate W in the same batch as the substrate W being processed in the process module PM12 for replacing the edge ring FR has ended. In this case, the control unit CU determines that the edge ring FR cannot be replaced during the period before the processing of the substrate W in the same batch as the substrate W being processed in the process module PM12 ends. In step S50, when it is determined that the edge ring FR can be replaced, the control unit CU advances the process to step S60. On the other hand, when it is determined that the edge ring FR cannot be replaced, the control unit CU repeats step S50. In step S60, the control unit CU selects the single transfer mode and causes the transfer robot TR2 to transfer only the edge ring FR. Details of step S60 will be described below. Next, the details of step S30 will be described with reference to FIG. 25. Step S30 includes a first cleaning step S31, an unloading step S32, a second cleaning step S33, a loading step S34, and an aging step S35. Hereinafter, each step will be described. The first cleaning step S31 is a step of performing a cleaning process on the process module PM12. In the first cleaning step S31, the control unit CU performs a cleaning process on the process module PM12 by controlling a gas introduction system, an exhaust system, an electric power introduction system, etc. The cleaning process is the following process, that is, deposits in the process module PM12 generated by plasma treatment are removed by plasma of a processing gas or the like, and the inside of the process module PM12 is stably kept clean. By performing the first cleaning step S31, it is possible to suppress the扬起 of deposits in the process module PM12 when the edge ring FR and the cover ring CR are unloaded from the stage in the unloading step S32. As the processing gas, for example, oxygen (O 2 ), a fluorocarbon (CF)-based gas, nitrogen (N 2 ), argon (Ar), helium (He), or a mixed gas of two or more of them can be used. Further, when performing the cleaning process on the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, when there are no deposits in the process module PM12 or when deposits will not be扬起, the first cleaning step S31 may not be performed. Also, when the edge ring FR and the cover ring CR are adsorbed to the stage by the electrostatic chuck 112, an electrostatic discharge process is to be performed before the next unloading step S32. In order to remove deposits on the back surfaces of the edge ring FR and the cover ring CR, the edge ring FR and the cover ring CR may also be lifted during the execution of the first cleaning step S31 so that they are separated from the electrostatic chuck 112 and the insulator 115. Also, during the execution of the first cleaning step S31, the state may be changed between a state where the edge ring FR and the cover ring CR are lifted (pushed up) and a state where they are not lifted (not pushed up). Thus, in the first cleaning step S31, the cleaning process can be performed in a state where the edge ring FR and the cover ring CR are pushed up and / or not pushed up. It should be noted that the Chinese character "扬起" in the original text seems to be an incorrect or incomplete expression. I have translated it as "扬起" as accurately as possible according to the context, but it may need to be further confirmed or corrected in the actual context.The unloading step S32 is a step of unloading the edge ring FR and the cover ring CR from the process module PM12 without opening the process module PM12 to the atmosphere. In the unloading step S32, the control unit CU controls each part of the processing system PS in such a way as to unload the edge ring FR and the cover ring CR from the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the edge ring FR and the cover ring CR placed on the stage inside the process module PM12 are unloaded from the process module PM12 by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR and the cover ring CR placed on the stage inside the process module PM12. Then, the gate valve G4 is opened, and the edge ring FR and the cover ring CR unloaded from the process module PM12 are stored in the storage module SM by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR and the cover ring CR from the process module PM2 and store them in the storage module SM using the transfer method shown in FIGS. 18A to 18D. The second cleaning step S33 is a step of cleaning the surface of the stage of the process module PM12 where the edge ring FR and the cover ring CR are placed. In the second cleaning step S33, the control unit CU performs the cleaning process on the surface of the stage of the process module PM12 where the edge ring FR and the cover ring CR are placed by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The cleaning process in the second cleaning step S33 can be performed, for example, by the same method as the first cleaning step S31. That is, as the processing gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of them. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process can also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, the second cleaning step S33 can also be omitted. The loading step S34 is a step of loading the edge ring FR and the cover ring CR into the process module PM12 and placing them on the stage without opening the process module PM12 to the atmosphere. In the loading step S34, the control unit CU controls each part of the processing system PS in such a way that the edge ring FR and the cover ring CR are loaded into the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the replacement edge ring FR and cover ring CR accommodated in the storage module SM are carried out by the transfer robot TR2. Then, the gate valve G1 is opened, and the replacement edge ring FR and cover ring CR are carried into the process module PM12 by the transfer robot TR2 and placed on the stage. For example, the control unit CU controls each part of the processing system PS so that they place the edge ring FR and the cover ring CR accommodated in the storage module SM on the stage in the process module PM12 using the transfer methods shown in FIGS. 19A to 19D. The aging step S35 is a step of performing the aging process of the process module PM12. In the aging step S35, the control unit CU performs the aging process of the process module PM12 by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The so-called aging process is a process for stabilizing the temperature or the state of the deposits in the process module PM12 by performing a prescribed plasma process. Also, in the aging step S35, after the aging process of the process module PM12, a quality control wafer may be loaded into the process module PM12, and a prescribed process may be performed on the quality control wafer. Thereby, it is possible to confirm whether the state of the process module PM12 is normal. Furthermore, the aging step S35 may be omitted. As described above, according to the processing system PS of the embodiment, the edge ring FR and the cover ring CR are carried out from the inside of the process module PM12 by the transfer robot TR2 without opening the process module PM12 to the atmosphere. Thereafter, the inside of the process module PM12 is cleaned, and then the edge ring FR and the cover ring CR are carried into the process module PM12 by the transfer robot TR2. Thereby, the edge ring FR and the cover ring CR can be replaced simultaneously without the operator manually replacing the edge ring FR and the cover ring CR. Therefore, the time required for replacing the edge ring FR and the cover ring CR can be shortened, and thus the productivity is improved. Also, by cleaning the surface for placing the edge ring FR and the cover ring CR before loading the edge ring FR and the cover ring CR, it is possible to suppress the presence of deposits between the edge ring FR and the cover ring CR and the surface for placing the edge ring FR and the cover ring CR. As a result, the contact between the two becomes good, and thereby the temperature controllability of the edge ring FR and the cover ring CR can be maintained well. Next, the details of step S60 will be described with reference to FIG. 26. Step S60 includes a first cleaning step S61, an unloading step S62, a second cleaning step S63, a loading step S64, and an aging step S65. Hereinafter, each step will be described. The first cleaning step S61 is a step of performing a cleaning process on the process module PM12. In the first cleaning step S61, the control unit CU performs a cleaning process on the process module PM12 by controlling a gas introduction system, an exhaust system, an electric power introduction system, etc. The cleaning process is the following process, that is, deposits in the process module PM12 generated by plasma treatment are removed by plasma of a process gas, etc., to make the inside of the process module PM12 stably clean. By performing the first cleaning step S61, it is possible to suppress the扬起 of deposits in the process module PM12 when the edge ring FR is carried out from the stage in the carrying-out step S62. As the process gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of them. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, when there are no deposits in the process module PM12 or when deposits will not be扬起, the first cleaning step S61 may not be performed. Also, when the edge ring FR is adsorbed to the stage by the electrostatic chuck 112, an electrostatic discharge process is to be performed before the next carrying-out step S62. In order to remove deposits on the back surface of the edge ring FR and / or the cover ring CR, the edge ring FR and the cover ring CR may also be lifted during the execution of the first cleaning step S61 to separate them from the electrostatic chuck 112 and the insulator 115. Also, during the execution of the first cleaning step S61, the state may be changed between a state where the edge ring FR and the cover ring CR are lifted and a state where they are not lifted. Thus, in the first cleaning step S61, the cleaning process can be performed in a state where the edge ring FR and the cover ring CR are lifted and / or a state where they are not lifted. The unloading step S62 is a step of unloading the edge ring FR from the process module PM12 without opening the process module PM12 to the atmosphere. In the unloading step S62, the control unit CU controls each part of the processing system PS in such a way as to unload the edge ring FR from the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the edge ring FR placed on the stage inside the process module PM12 is unloaded from the process module PM12 by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR placed on the stage inside the process module PM12. Then, the gate valve G4 is opened, and the edge ring FR unloaded from the process module PM12 is stored in the storage module SM by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR from the process module PM2 and store it in the storage module SM using the transfer methods shown in FIGS. 20A to 21D. The second cleaning step S63 is a step of cleaning the surface of the stage of the process module PM12 where the edge ring FR is placed. In the second cleaning step S63, the control unit CU performs the cleaning process on the surface of the stage of the process module PM12 where the edge ring FR is placed by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The cleaning process in the second cleaning step S63 can be performed, for example, using the same method as the first cleaning step S61. That is, as the processing gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of them. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process can also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, the second cleaning step S63 can also be omitted. The loading step S64 is a step of loading the edge ring FR into the process module PM12 and placing it on the stage without opening the process module PM12 to the atmosphere. In the loading step S64, the control unit CU controls each part of the processing system PS in such a way that the edge ring FR is loaded into the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the replacement edge ring FR accommodated in the storage module SM is carried out by the transfer robot TR2. Then, the gate valve G1 is opened, and the replacement edge ring FR is carried into the process module PM12 by the transfer robot TR2 and placed on the stage. For example, the control unit CU controls each part of the processing system PS so that they place the edge ring FR accommodated in the storage module SM on the stage in the process module PM12 using the transfer methods shown in FIGS. 22A to 23D. The aging step S65 is a step of performing the aging process of the process module PM12. In the aging step S65, the control unit CU performs the aging process of the process module PM12 by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The so-called aging process is a process for stabilizing the temperature or the state of the deposit in the process module PM12 by performing a specified plasma process. Also, in the aging step S65, after the aging process of the process module PM12, a quality control wafer may be loaded into the process module PM12, and a specified process may be performed on the quality control wafer. Thereby, it is possible to confirm whether the state of the process module PM12 is normal. Furthermore, the aging step S65 may be omitted. As described above, according to the processing system PS of the embodiment, the edge ring FR is carried out from the process module PM12 by the transfer robot TR2 without opening the process module PM12 to the atmosphere. Thereafter, the inside of the process module PM12 is cleaned, and then the edge ring FR is carried into the process module PM12 by the transfer robot TR2. Thereby, it is possible to replace only the edge ring FR alone without manually replacing the edge ring FR by the operator. Therefore, the time required for replacing the edge ring FR can be shortened, and the productivity is improved. Also, by cleaning the surface for placing the edge ring FR before loading the edge ring FR, it is possible to suppress the presence of deposits between the edge ring FR and the surface for placing the edge ring FR. As a result, the contact between the two becomes good, and thereby the temperature controllability of the edge ring FR can be maintained well. Referring to FIG. 27, another example of the replacement method of the consumable member of the embodiment will be described. FIG. 27 is a flowchart showing another example of the replacement method of the consumable member of the embodiment. Hereinafter, the case of replacing the consumable member in the above-described process module PM12 will be described as an example. Furthermore, the replacement method of the consumable member of the embodiment shown in FIG. 27 is performed by the control unit CU controlling each part of the processing system PS. In step S110, the control unit CU determines whether the cover ring CR needs to be replaced. In step S110, for example, the same determination method as in step S10 above can be used. In step S110, when it is determined that the cover ring CR needs to be replaced, the control unit CU advances the process to step S120. On the other hand, in step S110, when it is determined that the cover ring CR does not need to be replaced, the control unit CU advances the process to step S170. In step S120, the control unit CU determines whether the edge ring FR needs to be replaced. In this embodiment, the control unit CU determines whether the edge ring FR needs to be replaced based on, for example, the above RF cumulative time, RF cumulative power, and the cumulative value of a specific step of the process recipe. Also, the control unit CU can also determine whether the edge ring FR needs to be replaced by, for example, using an optical method to detect the height position of the edge ring FR. In step S120, when it is determined that the edge ring FR needs to be replaced, the control unit CU advances the process to step S130. On the other hand, in step S120, when it is determined that the edge ring FR does not need to be replaced, the control unit CU advances the process to step S150. In step S130, the control unit CU determines whether the edge ring FR and the cover ring CR can be replaced. In step S130, for example, the same determination method as in step S20 above can be used. In step S130, when it is determined that the edge ring FR and the cover ring CR can be replaced, the control unit CU advances the process to step S140. On the other hand, in step S130, when it is determined that the edge ring FR and the cover ring CR cannot be replaced, the control unit CU repeats step S130. In step S140, the control unit CU selects the simultaneous transfer mode and causes the transfer robot TR2 to transfer the edge ring FR and the cover ring CR simultaneously. In step S140, for example, the same transfer method as in step S30 above can be used. In step S150, the control unit CU determines whether the cover ring CR can be replaced. In this embodiment, the control unit CU determines that the cover ring CR can be replaced, for example, when the substrate W is not being processed in the process module PM12 for replacing the cover ring CR. In contrast, the control unit CU determines that the cover ring CR cannot be replaced when the substrate W is being processed in the process module PM12. Also, the control unit CU can also determine that the cover ring CR can be replaced when the processing of the substrate W of the same batch as the substrate W being processed in the process module PM12 for replacing the cover ring CR has ended. In this case, the control unit CU determines that the cover ring CR cannot be replaced during the period before the processing of the substrate W of the same batch as the substrate W being processed in the process module PM12 ends. In step S150, when it is determined that the cover ring CR can be replaced, the control unit CU advances the process to step S160. On the other hand, in step S150, when it is determined that the cover ring CR cannot be replaced, the control unit CU repeats step S150. In step S160, the control unit CU causes the transfer robot TR2 to perform an operation of replacing only the cover ring CR. Details of step S160 will be described below. In step S170, the control unit CU determines whether the edge ring FR needs to be replaced. In the present embodiment, the control unit CU determines whether the edge ring FR needs to be replaced based on, for example, the above-mentioned RF cumulative time, RF cumulative power, and cumulative values of specific steps in the process recipe. Further, the control unit CU can also determine whether the edge ring FR needs to be replaced by, for example, using an optical method to detect the height position of the edge ring FR. In step S170, when it is determined that the edge ring FR needs to be replaced, the control unit CU advances the process to step S180. On the other hand, when it is determined that the edge ring FR does not need to be replaced, the control unit CU returns the process to step S110. In step S180, the control unit CU determines whether the edge ring FR can be replaced. In step S180, for example, the same determination method as in step S50 described above can be used. In step S180, when it is determined that the edge ring FR can be replaced, the control unit CU advances the process to step S190. On the other hand, in step S180, when it is determined that the edge ring FR cannot be replaced, the control unit CU repeats step S180. In step S190, the control unit CU selects the single transfer mode and causes the transfer robot TR2 to transfer only the edge ring FR. In step S190, for example, the same transfer method as in step S60 described above can be used. Next, with reference to FIG. 28, details of step S160 will be described. Step S160 includes a first cleaning step S161, an unloading step S162, a second cleaning step S163, a loading step S164, and an aging step S165. Each step will be described below. The first cleaning step S161 is a step of performing a cleaning process on the process module PM12. In the first cleaning step S161, the control unit CU performs a cleaning process on the process module PM12 by controlling a gas introduction system, an exhaust system, an electric power introduction system, etc. The cleaning process is the following process, that is, deposits in the process module PM12 generated by plasma treatment are removed by plasma of a processing gas or the like, and the inside of the process module PM12 is stably maintained in a clean state. By performing the first cleaning step S161, it is possible to suppress the扬起 of deposits in the process module PM12 when the edge ring FR and the cover ring CR are carried out from the stage in the carry-out step S162. As the processing gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of them. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, when there are no deposits in the process module PM12 or when deposits will not be扬起, the first cleaning step S161 may not be performed. Also, when the edge ring FR is adsorbed to the stage by the electrostatic chuck 112, an electrostatic removal process is to be performed before the next carry-out step S162. In order to remove deposits on the back surface of the edge ring FR and / or the cover ring CR, the edge ring FR and the cover ring CR may also be lifted during the execution of the first cleaning step S161 so that they are separated from the electrostatic chuck 112 and the insulator 115. Also, during the execution of the first cleaning step S161, the state may be changed between a state where the edge ring FR and the cover ring CR are lifted and a state where they are not lifted. Thus, in the first cleaning step S161, the cleaning process can be performed in a state where the edge ring FR and the cover ring CR are lifted and / or a state where they are not lifted. The unloading step S162 is a step of unloading the edge ring FR and the cover ring CR from the process module PM12 without opening the process module PM12 to the atmosphere. In the unloading step S162, the control unit CU controls each part of the processing system PS in such a way that the edge ring FR and the cover ring CR are unloaded from the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G1 is opened, and the edge ring FR and the cover ring CR placed on the stage inside the process module PM12 are simultaneously unloaded from the process module PM12 by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to simultaneously unload the edge ring FR and the cover ring CR placed on the stage inside the process module PM12. Then, the gate valve G4 is opened, and the edge ring FR and the cover ring CR unloaded from the process module PM12 are simultaneously stored in the storage module SM by the transfer robot TR2. For example, the control unit CU controls each part of the processing system PS to unload the edge ring FR and the cover ring CR from the process module PM2 and store them in the storage module SM using the transfer methods shown in FIGS. 18A to 18D. Also, in the unloading step S162, the edge ring FR and the cover ring CR may be unloaded separately. For example, the control unit CU may also control each part of the processing system PS to unload the edge ring FR placed on the stage inside the process module PM12 first, and then unload the cover ring CR placed on the stage inside the process module PM12. The second cleaning step S163 is a step of cleaning the surface of the stage of the process module PM12 where the edge ring FR and the cover ring CR are placed. In the second cleaning step S163, the control unit CU performs the cleaning process on the surface of the stage of the process module PM12 where the edge ring FR and the cover ring CR are placed by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The cleaning process in the second cleaning step S163 can be performed, for example, using the same method as the first cleaning step S161. That is, as the processing gas, for example, O 2 gas, CF-based gas, N 2 gas, Ar gas, He gas, or a mixed gas of two or more of them can be used. Also, when performing the cleaning process of the process module PM12, depending on the processing conditions, in order to protect the electrostatic chuck 112 of the stage, the cleaning process may also be performed in a state where a substrate W such as a dummy wafer is placed on the upper surface of the electrostatic chuck 112. Furthermore, the second cleaning step S163 may be omitted. The loading step S164 is a step of loading the edge ring FR and the replacement cover ring CR unloaded in the unloading step S162 into the process module PM12 and placing them on the stage without opening the process module PM12 to the atmosphere. In the loading step S164, the control unit CU controls each part of the processing system PS in such a way that the edge ring FR and the replacement cover ring CR unloaded in the unloading step S162 are loaded into the process module PM12 without opening the process module PM12 to the atmosphere. Specifically, the gate valve G4 is opened, and the used edge ring FR stored in the storage module SM after being unloaded from the process module PM12 in the unloading step S162 and the replacement cover ring CR stored in the storage module SM are unloaded by the transfer robot TR2. Then, the gate valve G1 is opened, and the used edge ring FR and the replacement cover ring CR are loaded into the process module PM12 by the transfer robot TR2 and placed on the stage. For example, the control unit CU controls each part of the processing system PS so that they place the used edge ring FR and the replacement cover ring CR stored in the storage module SM on the stage in the process module PM12 using the transfer methods shown in FIGS. 19A to 19D. Also, in the loading step S164, the edge ring FR and the cover ring CR may be loaded separately. For example, the control unit CU may also control each part of the processing system PS so that after placing the cover ring CR on the stage inside the process module PM12, the edge ring FR is placed on the stage inside the process module PM12. The aging step S165 is a step of performing the aging process of the process module PM12. In the aging step S165, the control unit CU performs the aging process of the process module PM12 by controlling the gas introduction system, the exhaust system, the power introduction system, etc. The so-called aging process is a process for stabilizing the temperature or the state of the deposits in the process module PM12 by performing a specified plasma process. Also, in the aging step S165, a quality control wafer may be loaded into the process module PM12 after the aging process of the process module PM12, and a specified process may be performed on the quality control wafer. Thereby, it is possible to confirm whether the state of the process module PM12 is normal. Furthermore, the aging step S165 may be omitted. 〔First Variation Example〕 Referring to FIGS. 29 to 31, another example of the plasma processing apparatus used as the process modules PM1 to PM12 provided in the processing system PS of FIG. 1 will be described. The plasma processing apparatus 1X includes a plasma processing chamber 10X and a lifter 50X instead of the plasma processing chamber 10 and the lifter 50 in the plasma processing apparatus 1. Furthermore, other configurations may be the same as those of the plasma processing apparatus 1. The plasma processing chamber 10X includes a substrate support portion 11X and an upper electrode 12. The substrate support portion 11X is disposed in the lower region of the plasma processing space 10s within the plasma processing chamber 10X. The upper electrode 12 is disposed above the substrate support portion 11X and functions as a part of the top plate of the plasma processing chamber 10X. The substrate support portion 11X supports the substrate W in the plasma processing space 10s. The substrate support portion 11X includes a lower electrode 111, an electrostatic chuck 112, a ring assembly 113X, an insulator 115, and a base 116. The electrostatic chuck 112 is disposed on the lower electrode 111. The electrostatic chuck 112 supports the substrate W using its upper surface. The ring assembly 113X includes an edge ring FRX and a cover ring CRX. The edge ring FRX has an annular shape and is disposed around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The edge ring FRX improves, for example, the uniformity of plasma processing. The cover ring CRX has an annular shape and is disposed on the outer peripheral portion of the edge ring FRX. The cover ring CRX protects the upper surface of the insulator 115 from, for example, plasma influence. In the example of FIG. 29, the outer diameter of the edge ring FRX is the same as or smaller than the inner diameter of the cover ring CRX. That is, in a plan view, the edge ring FRX and the cover ring CRX do not overlap. Thereby, the edge ring FRX and the cover ring CRX are lifted and lowered independently. The insulator 115 is disposed on the base 116 so as to surround the lower electrode 111. The base 116 is fixed to the bottom of the plasma processing chamber 10X and supports the lower electrode 111 and the insulator 115. The elevator 50X lifts and lowers the substrate W, the edge ring FRX, and the cover ring CRX. The elevator 50X includes a first elevator 51, a third elevator 53, and a fourth elevator 54. The first elevator 51 includes a plurality of support pins 511 and an actuator 512. The plurality of support pins 511 are inserted into through holes H1 formed in the lower electrode 111 and the electrostatic chuck 112 and can project and retract relative to the upper surface of the electrostatic chuck 112. The plurality of support pins 511 support the substrate W by making the upper ends abut against the lower surface of the substrate W by projecting relative to the upper surface of the electrostatic chuck 112. The actuator 512 lifts and lowers the plurality of support pins 511. As the actuator 512, a motor such as a DC motor, a stepping motor, or a linear motor, a pneumatic drive mechanism such as a cylinder, a piezoelectric actuator, or the like can be used. The first elevator 51 described above lifts and lowers the plurality of support pins 511, for example, when transferring the substrate W between the transfer robots TR1 and TR2 and the substrate support portion 11. The third lifter 53 includes a plurality of support pins 531 and an actuator 532. The plurality of support pins 531 are inserted into the through holes H3 formed in the insulator 115 and can protrude and retract relative to the upper surface of the insulator 115. By protruding relative to the upper surface of the insulator 115, the upper ends of the plurality of support pins 531 abut against the lower surface of the edge ring FRX to support the edge ring FRX. The actuator 532 raises and lowers the plurality of support pins 531. As the actuator 532, for example, the same one as the actuator 512 can be used. The fourth lifter 54 includes a plurality of support pins 541 and an actuator 542. The plurality of support pins 541 are inserted into the through holes H4 formed in the insulator 115 and can protrude and retract relative to the upper surface of the insulator 115. By protruding relative to the upper surface of the insulator 115, the upper ends of the plurality of support pins 541 abut against the lower surface of the cover ring CRX to support the cover ring CRX. The actuator 542 raises and lowers the plurality of support pins 541. As the actuator 542, for example, the same one as the actuator 512 can be used. When the above-mentioned lifter 50X transfers the edge ring FRX and the cover ring CRX between the transfer robots TR1 and TR2 and the substrate support portion 11, the plurality of support pins 531 and 541 are raised and lowered. For example, when the edge ring FRX and the cover ring CRX placed on the electrostatic chuck 112 are carried out by the transfer robots TR1 and TR2, as shown in FIG. 30, the plurality of support pins 531 and 541 are raised. Thereby, while the edge ring FRX is lifted by the plurality of support pins 531, the cover ring CRX can be lifted by the plurality of support pins 541, so that the edge ring FRX and the cover ring CRX can be carried out simultaneously by the transfer robots TR1 and TR2. Further, when the above-mentioned lifter 50X transfers only the edge ring FRX between the transfer robots TR1 and TR2 and the substrate support portion 11, the plurality of support pins 531 are raised and lowered. For example, when only the edge ring FRX placed on the electrostatic chuck 112 is carried out by the transfer robots TR1 and TR2, as shown in FIG. 31, the plurality of support pins 531 are raised. Thereby, only the edge ring FRX can be lifted by the plurality of support pins 531, so that the transfer robots TR1 and TR2 can carry out the edge ring FRX alone. 〔Second Variation〕 (Configuration) Referring to FIG. 32, another example of the plasma processing apparatus used as the process modules PM1 to PM12 included in the processing system PS of FIG. 1 will be described. Hereinafter, the description will be centered on the differences from the plasma processing apparatus 1. The plasma processing apparatus includes a lifter 50Y. The lifter 50Y includes a first lifter 51 and a fifth lifter 55. The fifth lifter 55 includes a plurality of support pins 551 and an actuator (not shown). The support pin 551 is a stepped support pin formed of a member having a cylindrical shape (solid rod shape). The support pin 551 sequentially has a lower rod portion 552 and an upper rod portion 553 from the lower side toward the upper side. The outer diameter of the lower rod portion 552 is larger than the outer diameter of the upper rod portion 553. Thereby, a stepped portion is formed by the upper end surface 552a of the lower rod portion 552. The lower rod portion 552 and the upper rod portion 553 are integrally formed. The support pin 551 is inserted through the through hole H11 formed in the lower electrode 111, the through hole H12 formed in the insulator 115, and the through hole H13 formed in the cover ring CR, and can project in and out relative to the upper surfaces of the insulator 115 and the cover ring CR. The inner diameters of the through holes H11 and H12 are slightly larger than the outer diameter of the lower rod portion 552. The inner diameter of the through hole H13 is slightly larger than the outer diameter of the upper rod portion 553 and smaller than the outer diameter of the lower rod portion 552. The support pin 551 can be displaced between a standby position, a first support position, and a second support position. The standby position is a position where the upper end surface 553a of the upper rod portion 553 is located below the lower surface of the edge ring FR. When the support pin 551 is in the standby position, the edge ring FR and the cover ring CR are not lifted by the support pin 551, but are respectively supported on the electrostatic chuck 112 and the insulator 115. The first support position is a position higher than the standby position. The first support position is a position where the upper end surface 553a of the upper rod portion 553 projects above the upper surface of the cover ring CR and the upper end surface 552a of the lower rod portion 552 is located below the lower surface of the cover ring CR. By moving to the first support position, the support pin 551 causes the upper end surface 553a of the upper rod portion 553 to abut against the recess FRr formed on the lower surface of the edge ring FR to support the edge ring FR. The second support position is a position higher than the first support position. The second support position is a position where the upper end surface 552a of the lower rod portion 552 projects above the upper surface of the insulator 115. By moving to the second support position, the support pin 551 causes the upper end surface 553a of the upper rod portion 553 to abut against the recess FRr to support the edge ring FR, and causes the upper end surface 552a of the lower rod portion 552 to abut against the lower surface of the cover ring CR to support the cover ring CR. The actuator raises and lowers a plurality of support pins 551. As the actuator, for example, motors such as a DC motor, a stepping motor, and a linear motor, and piezoelectric actuators such as an air driving mechanism such as a cylinder can be used. When the fifth lifter 55 transfers the edge ring FR between the transfer robots TR1 and TR2 and the substrate support unit 11, the plurality of support pins 551 are moved to the first support position to lift the edge ring FR. Further, when the fifth lifter 55 transfers the edge ring FR and the cover ring CR between the transfer robots TR1 and TR2 and the substrate support unit 11, the plurality of support pins 551 are moved to the second support position to lift the cover ring CR and the edge ring FR. (Transport method of consumable components: Simultaneous transport mode) Referring to FIGS. 33A to 36C, the case where the control unit CU selects and executes the simultaneous transport mode, which is another example of the transport method of consumable components in the processing system PS as an embodiment, and simultaneously transports the edge ring FR and the cover ring CR by the transfer robot TR2 will be described. Specifically, the case where after the edge ring FR and the cover ring CR are simultaneously unloaded from the plasma processing apparatus shown in FIG. 32, the replacement edge ring FR and the cover ring CR are simultaneously loaded into the plasma processing apparatus will be described. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transfer robot TR2 and the lifter 50Y for description. However, the control unit 90 may be provided separately from the control unit CU, and the control unit CU may control the transfer robot TR2, and the control unit 90 may control the lifter 50Y. Further, the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR are configured to overlap in a plan view. First, as shown in FIG. 33A, the control unit CU raises the plurality of support pins 551 from the standby position. Thereby, the upper end surface 553a of the upper rod portion 553 abuts against the lower surface of the edge ring FR, and the edge ring FR is lifted by the plurality of support pins 551, so that the edge ring FR separates from the electrostatic chuck 112. Subsequently, as shown in FIG. 33B, the control unit CU further raises the plurality of support pins 551 to the second support position. Thereby, the upper end surface 552a of the lower rod portion 552 abuts against the lower surface of the cover ring CR, and the cover ring CR is lifted by the plurality of support pins 551, so that the cover ring CR separates from the insulator 115. Thus, when the plurality of support pins 551 are raised from the standby position to the second support position, the edge ring FR and the cover ring CR are lifted by the plurality of support pins 551 and are supported by the plurality of support pins 551 in a separated state from each other. Subsequently, as shown in FIG. 33C, the control unit CU causes the lower fork FK22 that does not hold the object to be transferred to enter between the edge ring FR and the cover ring CR supported by the plurality of support pins 551 and the electrostatic chuck 112. Subsequently, as shown in FIG. 34A, the control unit CU lowers the plurality of support pins 551 from the second support position. Thereby, the cover ring CR supported by the plurality of support pins 551 is placed on the lower fork FK22. Subsequently, as shown in FIG. 34B, the control unit CU further lowers the plurality of support pins 551 to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 551 is placed on the cover ring CR. Thus, when the plurality of support pins 551 descend from the second support position to the standby position, the edge ring FR and the cover ring CR are placed on the lower fork FK22. Subsequently, as shown in FIG. 34C, the control unit CU withdraws the lower fork FK22 holding the edge ring FR and the cover ring CR. Subsequently, as shown in FIG. 35A, the control unit CU moves the upper fork FK21 holding the replacement edge ring FR and the replacement cover ring CR above the electrostatic chuck 112. Subsequently, as shown in FIG. 35B, the control unit CU raises the plurality of support pins 551 from the standby position. Thereby, the upper end surface 553a of the upper bar portion 553 abuts against the lower surface of the edge ring FR held by the upper fork FK21, and the edge ring FR is lifted by the plurality of support pins 551, so that the edge ring FR separates from the upper fork FK21. Subsequently, as shown in FIG. 35C, the control unit CU further raises the plurality of support pins 551 to the second support position. Thereby, the upper end surface 552a of the lower bar portion 552 abuts against the lower surface of the cover ring CR held by the upper fork FK21, and the cover ring CR is lifted by the plurality of support pins 551, so that the cover ring CR separates from the upper fork FK21. Subsequently, as shown in FIG. 36A, the control unit CU withdraws the upper fork FK21 that does not hold the object to be transported. Subsequently, as shown in FIG. 36B, the control unit CU lowers the plurality of support pins 551 from the second support position. Thereby, the cover ring CR supported by the plurality of support pins 551 is placed on the insulator 115. Subsequently, as shown in FIG. 36C, the control unit CU further lowers the plurality of support pins 551 to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 551 is placed on the electrostatic chuck 112. As described above, in the plasma processing apparatus shown in FIG. 32, after the edge ring FR and the cover ring CR are simultaneously unloaded from the plasma processing apparatus, the replacement edge ring FR and the cover ring CR can be simultaneously loaded into the plasma processing apparatus. (Transport method of consumable components: single transport mode) Referring to FIGS. 37A to 38D, a case where the control unit CU in the processing system PS as an embodiment selects and executes the single transport mode, which is a mode in which the transfer robot TR2 transports only the edge ring FR, will be described. Specifically, a case where the edge ring FR is unloaded alone from the plasma processing apparatus shown in FIG. 32 and then the replacement edge ring FR is loaded alone into the plasma processing apparatus will be described. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transfer robot TR2 and the lifter 50Y for explanation. However, the control unit 90 may also be provided separately from the control unit CU, the control unit CU controls the transfer robot TR2, and the control unit 90 controls the lifter 50Y. Furthermore, the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR are configured to overlap in a plan view. First, as shown in FIG. 37A, the control unit CU raises a plurality of support pins 551 from the standby position to the first support position. Thereby, the upper end surface 553a of the upper rod portion 553 abuts against the lower surface of the edge ring FR, and the edge ring FR is lifted by the plurality of support pins 551, so that the edge ring FR is separated from the electrostatic chuck 112. Subsequently, as shown in FIG. 37B, the control unit CU causes the lower fork FK22 that does not hold the transfer object to enter between the edge ring FR supported by the plurality of support pins 551 and the electrostatic chuck 112. Subsequently, as shown in FIG. 37C, the control unit CU lowers a plurality of support pins 511 from the first support position to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 511 is placed on the lower fork FK22. Subsequently, as shown in FIG. 37D, the control unit CU causes the lower fork FK22 holding the edge ring FR to retreat. Subsequently, as shown in FIG. 38A, the control unit CU causes the upper fork FK21 holding the replacement edge ring FR to enter above the electrostatic chuck 112. Subsequently, as shown in FIG. 38B, the control unit CU controls a plurality of support pins 511 to raise them from the standby position to the first support position. Thereby, the upper end surface 553a of the upper rod portion 553 abuts against the lower surface of the edge ring FR held by the upper fork FK21, and the edge ring FR is lifted by the plurality of support pins 511, so that the edge ring FR is separated from the upper fork FK21. Subsequently, as shown in FIG. 38C, the control unit CU causes the upper fork FK21 that does not hold the transfer object to retreat. Subsequently, as shown in FIG. 38D, the control unit CU lowers a plurality of support pins 551 from the first support position to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 551 is placed on the electrostatic chuck 112. As described above, in the plasma processing apparatus shown in FIG. 32, after the edge ring FR is separately removed from the plasma processing apparatus, the replacement edge ring FR can also be separately loaded into the plasma processing apparatus. 〔Third Modification Example〕 (Configuration) Referring to FIG. 39, another example of the plasma processing apparatus used as the process modules PM1 to PM12 included in the processing system PS of FIG. 1 will be described. Hereinafter, the description will be centered on the differences from the plasma processing apparatus 1. The plasma processing apparatus includes a ring assembly 113Z. The ring assembly 113Z includes an edge ring FR, a cover ring CR, and a transfer ring HR. The edge ring FR has an annular shape and is disposed around the substrate W on the upper surface of the peripheral portion of the lower electrode 111. The edge ring FR improves the uniformity of the plasma processing performed on the substrate W. The edge ring FR is formed of a conductive material such as Si or SiC, for example. A refrigerant flow path 117 is formed inside the lower electrode 111. Cooling water, a refrigerant such as Galden, is supplied to the refrigerant flow path 117 from a cooler unit (not shown). The cover ring CR has an annular shape and is disposed on the outer peripheral portion of the edge ring FR. The cover ring CR protects the upper surface of the insulator 115 from, for example, plasma. The cover ring CR is formed of a conductive material such as Si or SiC, for example. The transfer ring HR is placed on the insulator 115. In a plan view, the inner peripheral portion of the transfer ring HR overlaps with the outer peripheral portion of the edge ring FR, and the outer peripheral portion of the transfer ring HR overlaps with the inner peripheral portion of the cover ring CR. The edge ring FR is placed on the upper surface of the inner peripheral portion of the transfer ring HR. The cover ring CR is placed on the outer peripheral portion of the transfer ring HR. A through hole H22 is formed in the transfer ring HR through which the upper rod portion 563 of the following support pin 561 is inserted. The transfer ring HR is formed of, for example, silicon dioxide (SiO 2 )). The transfer ring HR may also be formed of a ceramic material such as aluminum oxide (Al 2 O 3 ). The transfer ring HR may also be formed of a conductive material such as Si or SiC having a higher resistivity than the edge ring FR, that is, formed of a conductive material such as Si or SiC in which the impurity concentration is adjusted to be higher than that of the material constituting the edge ring FR. The plasma processing apparatus includes a lifter 50Z. The lifter 50Z includes a first lifter 51 and a sixth lifter 56. The sixth lifter 56 includes a plurality of support pins 561 and an actuator (not shown). The support pin 561 is a stepped support pin formed of a cylindrical (solid rod-shaped) member. The support pin 561 has a lower rod portion 562 and an upper rod portion 563 in order from the lower side toward the upper side. The outer diameter of the lower rod portion 562 is larger than the outer diameter of the upper rod portion 563. Thereby, a stepped portion is formed on the upper end surface 562a of the lower rod portion 562. The lower rod portion 562 and the upper rod portion 563 are integrally formed. The support pin 561 is inserted into the through holes H21 and H22 and can project and retract relative to the upper surface of the insulator 115 and the upper surface of the transfer ring HR. The inner diameter of the through hole H21 is slightly larger than the outer diameter of the lower rod portion 562. The inner diameter of the through hole H22 is slightly larger than the outer diameter of the upper rod portion 563 and smaller than the outer diameter of the lower rod portion 562. The support pin 561 can be displaced between the standby position, the first support position, and the second support position. The standby position is a position where the upper end surface 563a of the upper bar portion 563 is located below the lower surface of the edge ring FR. When the support pin 561 is in the standby position, the edge ring FR, the cover ring CR, and the transfer ring HR are not lifted by the support pin 561 but are supported on the electrostatic chuck 112 or the insulator 115. The first support position is a position higher than the standby position. The first support position is a position where the upper end surface 563a of the upper bar portion 563 protrudes above the upper surface of the transfer ring HR and the upper end surface 562a of the lower bar portion 562 is located below the lower surface of the transfer ring HR. By moving to the first support position, the support pin 561 causes the upper end surface 563a of the upper bar portion 563 to abut against the lower surface of the edge ring FR to support the edge ring FR. The second support position is a position higher than the first support position. The second support position is a position where the upper end surface 562a of the lower bar portion 562 protrudes above the upper surface of the insulator 115. By moving to the second support position, the support pin 561 causes the upper end surface 563a of the upper bar portion 563 to abut against the lower surface of the edge ring FR to support the edge ring FR, and causes the upper end surface 562a of the lower bar portion 562 to abut against the lower surface of the transfer ring HR to support the transfer ring HR. At this time, the inner peripheral portion of the cover ring CR is placed on the upper surface of the outer peripheral portion of the transfer ring HR. Therefore, when the transfer ring HR is lifted by a plurality of support pins 561, the cover ring CR is also lifted together with the transfer ring HR. That is, the transfer ring HR and the cover ring CR are lifted away from the insulator 115 as a unit. The actuator raises and lowers a plurality of support pins 561. As the actuator, for example, motors such as DC motors, stepper motors, and linear motors, and piezoelectric actuators such as air drive mechanisms such as air cylinders can be used. When the above-described sixth lifter 56 transfers the edge ring FR between the transfer robots TR1, TR2 and the substrate support portion 11, it moves a plurality of support pins 561 to the first support position to lift the edge ring FR. Also, when the sixth lifter 56 transfers the edge ring FR and the cover ring CR between the transfer robots TR1, TR2 and the substrate support portion 11, it moves a plurality of support pins 561 to the second support position to lift the cover ring CR, the edge ring FR, and the transfer ring HR. (Conveying Method of Consumable Component: Simultaneous Conveying Mode) Referring to FIGS. 40A to 45B, a case where the control unit CU selects and executes the simultaneous conveying mode, which is another example of the conveying method of the consumable component in the processing system PS as an embodiment, will be described. In the simultaneous conveying mode, the transfer robot TR2 simultaneously conveys the edge ring FR, the cover ring CR, and the transfer ring HR. Specifically, a case where after simultaneously taking out the edge ring FR, the cover ring CR, and the transfer ring HR from the plasma processing apparatus shown in FIG. 39, the replacement edge ring FR, the cover ring CR, and the transfer ring HR are simultaneously conveyed into the plasma processing apparatus will be described. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transfer robot TR2 and the elevator 50Z for description. However, the control unit 90 may also be provided separately from the control unit CU, the control unit CU controls the transfer robot TR2, and the control unit 90 controls the elevator 50Z. First, as shown in FIG. 40A, the control unit CU raises a plurality of support pins 561 from the standby position. Thereby, the upper end surface 563a of the upper rod portion 563 abuts against the lower surface of the edge ring FR, and the edge ring FR is lifted by the plurality of support pins 561, so that the edge ring FR separates from the electrostatic chuck 112. Subsequently, as shown in FIG. 40B, the control unit CU further raises the plurality of support pins 561 to the second support position. Thereby, the upper end surface 562a of the lower rod portion 562 abuts against the lower surface of the transfer ring HR, and the transfer ring HR is lifted by the plurality of support pins 561, so that the transfer ring HR separates from the insulator 115. At this time, the outer peripheral portion of the cover ring CR is placed on the outer peripheral portion of the transfer ring HR. Therefore, when the transfer ring HR is lifted by the plurality of support pins 561, the cover ring CR is also lifted together with the transfer ring HR. That is, the transfer ring HR and the cover ring CR are integrally separated from the insulator 115. Thus, when the plurality of support pins 561 rise from the standby position to the second support position, the edge ring FR, the transfer ring HR, and the cover ring CR are lifted by the plurality of support pins 561 and then supported by the plurality of support pins 561 in a separated state from each other. Subsequently, as shown in FIG. 41A, the control unit CU causes the lower fork FK22 that does not hold the object to be conveyed to enter between the transfer ring HR supported by the plurality of support pins 561 and the electrostatic chuck 112. Subsequently, as shown in FIG. 41B, the control unit CU lowers the plurality of support pins 561 from the second support position. Thereby, the cover ring CR and the transfer ring HR supported by the plurality of support pins 561 are placed on the lower fork FK22. Next, as shown in FIG. 42A, the control unit CU further lowers the plurality of support pins 561 to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 561 is placed on the transfer ring HR. Thus, when the plurality of support pins 561 descend from the second support position to the standby position, the edge ring FR, the cover ring CR, and the transfer ring HR are placed on the lower fork FK22. Next, as shown in FIG. 42B, the control unit CU causes the lower fork FK22 holding the edge ring FR, the cover ring CR, and the transfer ring HR to retract. Next, as shown in FIG. 43A, the control unit CU causes the upper fork FK21 holding the replacement edge ring FR, the replacement cover ring CR, and the replacement transfer ring HR to enter above the electrostatic chuck 112. Furthermore, the replacement transfer ring HR can be replaced by the transfer ring HR that can be carried out. Next, as shown in FIG. 43B, the control unit CU raises the plurality of support pins 561 from the standby position. Thereby, the upper end surface 563a of the upper bar portion 563 abuts against the lower surface of the edge ring FR held by the upper fork FK21, and the edge ring FR is lifted by the plurality of support pins 561, so that the edge ring FR separates from the upper fork FK21. Next, as shown in FIG. 44A, the control unit CU further raises the plurality of support pins 561 to the second support position. Thereby, the upper end surface 562a of the lower bar portion 562 abuts against the lower surface of the transfer ring HR held by the upper fork FK21, and the transfer ring HR is lifted by the plurality of support pins 561, so that the transfer ring HR separates from the upper fork FK21. At this time, the outer peripheral portion of the cover ring CR is placed on the outer peripheral portion of the transfer ring HR. Therefore, when the transfer ring HR is lifted by the plurality of support pins 561, the cover ring CR is also lifted together with the transfer ring HR. That is, the transfer ring HR and the cover ring CR are integrally lifted by the plurality of support pins 561, so that the transfer ring HR and the cover ring CR separate from the upper fork FK21. Thus, when the plurality of support pins 561 ascend from the standby position to the second support position, the edge ring FR, the transfer ring HR, and the cover ring CR are lifted by the plurality of support pins 561 and then supported by the plurality of support pins 561 in a separated state from each other. Next, as shown in FIG. 44B, the control unit CU causes the upper fork FK21 that does not hold the object to be transferred to retract. Next, as shown in FIG. 45A, the control unit CU lowers the plurality of support pins 561 from the second support position. Thereby, the transfer ring HR and the cover ring CR supported by the plurality of support pins 561 are placed on the insulator 115. Next, as shown in FIG. 45B, the control unit CU further lowers the plurality of support pins 561 to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 561 is placed on the electrostatic chuck 112. As described above, in the plasma processing apparatus shown in FIG. 39, after the edge ring FR and the cover ring CR are simultaneously unloaded from the plasma processing apparatus, the replacement edge ring FR and the cover ring CR can be simultaneously loaded into the plasma processing apparatus. (Transport method of consumable components: single transport mode) Referring to FIGS. 46A to 49B, a case where the control unit CU selects and executes the single transport mode, which is another example of the transport method of consumable components in the processing system PS as an embodiment, will be described. In the single transport mode, the transfer robot TR2 transports only the edge ring FR. Specifically, a case where the edge ring FR is unloaded alone from the plasma processing apparatus shown in FIG. 39 and then the replacement edge ring FR is loaded alone into the plasma processing apparatus will be described. Hereinafter, it is assumed that the control unit 90 is included in the control unit CU, and the control unit CU controls the transfer robot TR2 and the lifter 50Z for explanation. However, the control unit 90 may be provided separately from the control unit CU, the control unit CU controls the transfer robot TR2, and the control unit 90 controls the lifter 50Z. Furthermore, the outer peripheral portion of the edge ring FR and the inner peripheral portion of the cover ring CR are configured to overlap in a plan view. First, as shown in FIG. 46A, the control unit CU raises a plurality of support pins 561 from the standby position to the first support position. Thereby, the upper end surface 563a of the upper rod portion 563 abuts against the lower surface of the edge ring FR, and the edge ring FR is lifted by the plurality of support pins 561, so that the edge ring FR is separated from the electrostatic chuck 112. Subsequently, as shown in FIG. 46B, the control unit CU causes the lower fork FK22 that does not hold the transfer object to enter between the edge ring FR supported by the plurality of support pins 561 and the electrostatic chuck 112. Subsequently, as shown in FIG. 47A, the control unit CU lowers a plurality of support pins 511 from the first support position to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 511 is placed on the lower fork FK22. Subsequently, as shown in FIG. 47B, the control unit CU causes the lower fork FK22 holding the edge ring FR to retract. Subsequently, as shown in FIG. 48A, the control unit CU causes the upper fork FK21 holding the replacement edge ring FR to enter above the electrostatic chuck 112. Subsequently, as shown in FIG. 48B, the control unit CU controls a plurality of support pins 511 to raise them from the standby position to the first support position. Thereby, the upper end surface 563a of the upper rod portion 563 abuts against the lower surface of the edge ring FR held by the upper fork FK21, and the edge ring FR is lifted by the plurality of support pins 511, so that the edge ring FR is separated from the upper fork FK21. Subsequently, as shown in FIG. 49A, the control unit CU causes the upper fork FK21 that does not hold the transfer object to retract. Subsequently, as shown in FIG. 49B, the control unit CU causes a plurality of support pins 561 to descend from the first support position to the standby position. Thereby, the edge ring FR supported by the plurality of support pins 561 is placed on the electrostatic chuck 112. As described above, in the plasma processing apparatus shown in FIG. 39, after the edge ring FR is separately removed from the plasma processing apparatus, the replacement edge ring FR can also be separately introduced into the plasma processing apparatus. Furthermore, in the above-described embodiment, the edge rings FR, FRX and the cover rings CR, CRX are examples of annular members, the edge rings FR, FRX are examples of inner rings, and the cover rings CR, CRX are examples of outer rings. Also, the transfer robots TR1, TR2 are examples of transfer devices. Also, the support pin 521 is an example of a first support pin, the support pin 511 is an example of a second support pin, the support pin 531 is an example of a third support pin, and the support pin 541 is an example of a fourth support pin. It should be considered that the embodiments disclosed this time are illustrative in all aspects and not restrictive. The above-described embodiments can also be omitted, replaced, and changed in various forms without departing from the scope and gist of the accompanying patent application. In the above-described embodiment, as a mechanism for raising and lowering the edge ring FR and / or the cover ring CR, the elevators 50, 50X to 50Z have been described, but it is not limited thereto. For example, when the outer peripheral portion of the edge ring FR overlaps with the inner peripheral portion of the cover ring CR, a through hole can be formed in the cover ring CR, and the edge ring FR and the cover ring CR can be independently raised and lowered by a support pin having: a first holding portion that fits into the through hole; and a second holding portion that is connected in the axial direction of the first holding portion and has a protruding portion protruding from the outer periphery of the first holding portion. For example, by passing the first holding portion through the through hole of the cover ring CR and bringing the front end of the first holding portion into contact with the back surface of the cover ring CR, the edge ring FR can be separately lifted. Also, for example, by passing the first holding portion through the through hole of the cover ring CR and bringing the protruding portion of the second holding portion into contact with the lower surface of the cover ring CR, the cover ring CR can be separately lifted. Furthermore, this configuration is described in detail in the specification of U.S. Patent Application Publication No. 2020 / 0219753. In the above-described embodiment, the case of transferring the edge ring between the storage module and the process module has been described, but the present invention is not limited thereto. For example, the present invention is also applicable when transferring other consumable components installed in the process module, such as a cover ring, a top plate of an upper electrode, etc., instead of the edge ring. Regarding the above embodiments, the following supplementary notes are further disclosed. (Appendix 1) A processing system that performs plasma processing on a substrate, comprising: a chamber; a vacuum transfer module connected to the chamber; a transfer device disposed inside the vacuum transfer module; a stage disposed inside the chamber around the substrate for placing an outer ring and an inner ring having different inner and outer diameters; a lifter for lifting and lowering the outer ring and the inner ring relative to the stage; and a controller; the controller is configured to select two modes, namely, a simultaneous transfer mode in which the transfer device simultaneously transfers the inner ring and the outer ring, and a single transfer mode in which the transfer device transfers only the inner ring. (Appendix 2) The processing system according to Appendix 1, wherein at least a part of the inner ring is placed on the outer ring. (Appendix 3) The processing system according to Appendix 2, wherein the lifter includes: a plurality of first support pins that abut against the lower surface of the outer ring to lift and lower the outer ring and the inner ring integrally; and a second support pin that abuts against the lower surface of a jig that supports the inner ring from below to lift and lower the jig and the inner ring integrally. (Appendix 4) The processing system according to Appendix 3, wherein the second support pin abuts against the lower surface of the substrate to lift and lower the substrate. (Appendix 5) The processing system according to Appendix 3 or 4, wherein the simultaneous transfer mode includes the following steps: in a state where the first support pins have been raised, the outer ring and the inner ring are transferred between the first support pins and the transfer device. (Appendix 6) The processing system according to any one of Appendix 3 to 5, wherein the single transfer mode includes the following steps: in a state where the second support pins have been raised, the jig and the inner ring are transferred between the second support pins and the transfer device. (Appendix 7) The processing system according to any one of Appendix 3 to 6, further comprising a storage module connected to the vacuum transfer module for storing the outer ring and the inner ring. (Appendix 8) The processing system according to Appendix 7, wherein the storage module stores a first assembly formed by placing the inner ring on the outer ring. (Appendix 9) The processing system according to Appendix 7 or 8, wherein the storage module stores a second assembly formed by placing the inner ring on the jig. (Appendix 10) The processing system according to Appendix 1, wherein the outer diameter of the inner ring is the same as or smaller than the inner diameter of the outer ring. (Supplementary Note 11) The processing system as described in Supplementary Note 10, wherein the above-mentioned elevator includes: a third support pin that abuts against the lower surface of the above-mentioned inner ring to lift the inner ring; and a fourth support pin that abuts against the lower surface of the above-mentioned outer ring to lift the outer ring. (Supplementary Note 12) The processing system as described in Supplementary Note 11, wherein the above-mentioned simultaneous transfer mode includes the following steps: in a state where the above-mentioned third support pin and the above-mentioned fourth support pin have been raised,交接 the above-mentioned outer ring and the above-mentioned inner ring between the above-mentioned third support pin, the above-mentioned fourth support pin, and the above-mentioned transfer device. (Supplementary Note 13) The processing system as described in Supplementary Note 11 or 12, wherein the above-mentioned individual transfer mode includes the following steps: in a state where the above-mentioned third support pin has been raised,交接 the above-mentioned inner ring between the above-mentioned third support pin and the above-mentioned transfer device. (Supplementary Note 14) The processing system as described in any one of Supplementary Notes 1 to 13, wherein the above-mentioned inner ring is an edge ring placed on the upper surface of the above-mentioned placement table so as to surround the periphery of the above-mentioned substrate, and the above-mentioned outer ring is a cover ring placed so as to surround the periphery of the above-mentioned edge ring. (Supplementary Note 15) A transfer method for transferring an outer ring and an inner ring in a processing system, the processing system comprising: a chamber; a vacuum transfer module connected to the above-mentioned chamber; a transfer device provided inside the above-mentioned vacuum transfer module; a placement table provided inside the above-mentioned chamber around a substrate for placing the above-mentioned outer ring and the above-mentioned inner ring with different inner and outer diameters; and an elevator for lifting the above-mentioned outer ring and the above-mentioned inner ring relative to the above-mentioned placement table; and the transfer method includes: a simultaneous transfer mode in which the above-mentioned transfer device simultaneously transfers the above-mentioned inner ring and the above-mentioned outer ring; and an individual transfer mode in which the above-mentioned transfer device only transfers the above-mentioned inner ring. It should be noted that the words "交接" in the translation of and are used as placeholders as the specific Chinese word here seems to be a technical term that might not have a direct one-to-one English equivalent without further context clarification. You may need to adjust it according to the actual meaning in the relevant technical field.(Appendix 16) A substrate processing system includes: a vacuum transfer module; a plasma processing module connected to the vacuum transfer module; and a controller. The vacuum transfer module includes: a vacuum transfer chamber; and a transfer robot disposed in the vacuum transfer chamber. The plasma processing module includes: a plasma processing chamber; a stage disposed in the plasma processing chamber, having a substrate support surface and a ring support surface; a first ring disposed on the ring support surface of the stage; a second ring disposed on the first ring so as to surround a substrate on the substrate support surface of the stage and having an inner diameter smaller than that of the first ring; a plurality of first support pins disposed below the ring support surface; a plurality of second support pins disposed below the substrate support surface; a first actuator configured to move the plurality of first support pins vertically relative to the stage; and a second actuator configured to move the plurality of second support pins vertically relative to the stage. The controller is configured to selectively execute two modes, namely, a simultaneous transfer mode in which the transfer robot simultaneously transfers the first ring and the second ring, and a single transfer mode in which the transfer robot individually transfers the second ring. The simultaneous transfer mode includes the steps of: raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins; and in a state where the plurality of first support pins have been raised,交接 the first ring and the second ring together between the plurality of first support pins and the transfer robot. The single transfer mode includes the steps of: raising the plurality of first support pins so that the first ring and the second ring are lifted together by the plurality of first support pins; raising the plurality of second support pins so that a transfer jig is supported by the plurality of second support pins at a height lower than that of the second ring; in a state where the second ring is supported by the transfer jig and the first ring is supported by the plurality of first support pins, lowering the plurality of second support pins to a position lower than the height of the transfer jig; and in a state where the plurality of second support pins have been raised,交接 the transfer jig and the second ring together between the plurality of second support pins and the transfer robot. (Appendix 17) In the substrate processing system according to Appendix 16, the first ring is formed of an insulating material, and the second ring is formed of a conductive material. (Appendix 18) In the substrate processing system according to Appendix 16, the first ring is formed of quartz, and the second ring is formed of Si or SiC. (Supplementary Note 19) A substrate processing system as described in any one of Supplementary Notes 16 to 18, wherein the second ring has an outer annular portion that can be supported by the first ring and an inner annular portion that can be supported by the transfer jig. (Supplementary Note 20) A substrate processing system comprising: a vacuum transfer module; a plasma processing module connected to the vacuum transfer module; and a controller; the vacuum transfer module includes: a vacuum transfer chamber; and a transfer robot disposed in the vacuum transfer chamber; the plasma processing module includes: a plasma processing chamber; a stage disposed in the plasma processing chamber, having a substrate support surface and a ring support surface; a first ring and a second ring disposed on the ring support surface of the stage so as to surround the substrate on the substrate support surface of the stage; and a lifter configured to lift and lower the first ring and the second ring relative to the stage; the controller is configured to selectively execute two modes, namely, a simultaneous transfer mode in which the transfer robot simultaneously transfers the first ring and the second ring, and a separate transfer mode in which the transfer robot separately transfers the second ring. (Supplementary Note 21) A substrate processing system as described in Supplementary Note 20, wherein at least a part of the second ring is placed on the first ring. (Supplementary Note 22) A substrate processing system as described in Supplementary Note 21, wherein the lifter includes: a plurality of first support pins disposed below the ring support surface; and a plurality of second support pins disposed below the substrate support surface. (Supplementary Note 23) A substrate processing system as described in Supplementary Note 22, wherein the plurality of second support pins are configured to lift and lower the substrate on the substrate support surface. (Supplementary Note 24) A substrate processing system as described in Supplementary Note 22 or 23, wherein the simultaneous transfer mode includes the following steps: in a state where the plurality of first support pins have been raised, the first ring and the second ring are jointly transferred between the plurality of first support pins and the transfer robot. (Supplementary Note 25) A substrate processing system as described in any one of Supplementary Notes 22 to 24, wherein the separate transfer mode includes the following steps: in a state where the plurality of second support pins have been raised, the transfer jig and the second ring are jointly transferred between the plurality of second support pins and the transfer robot. (Supplementary Note 26) A substrate processing system as described in any one of Supplementary Notes 21 to 25, further comprising a storage module connected to the vacuum transfer module for storing the first ring and the second ring. (Supplementary Note 27) The substrate processing system as described in Supplementary Note 26, wherein the storage module is configured to store a first assembly, and the first assembly includes the first ring and the second ring placed on the first ring. (Supplementary Note 28) The substrate processing system as described in Supplementary Note 26 or 27, wherein the storage module is configured to store a second assembly, and the second assembly includes a transfer jig and the second ring placed on the transfer jig. (Supplementary Note 29) The substrate processing system as described in Supplementary Note 27, wherein the outer diameter of the second ring is the same as or smaller than the inner diameter of the first ring. (Supplementary Note 30) The substrate processing system as described in Supplementary Note 29, wherein the lifter includes: a plurality of third support pins disposed below the second ring; and a plurality of fourth support pins disposed below the first ring. (Supplementary Note 31) The substrate processing system as described in Supplementary Note 30, wherein the simultaneous transfer mode includes the following steps: in a state where the plurality of third support pins and the plurality of fourth support pins have been raised, transferring the first ring and the second ring between the plurality of third support pins and the plurality of fourth support pins and the transfer robot. (Supplementary Note 32) The substrate processing system as described in Supplementary Note 30 or 31, wherein the single transfer mode includes the following steps: in a state where the plurality of third support pins have been raised, transferring the second ring between the plurality of third support pins and the transfer robot. (Supplementary Note 33) The substrate processing system as described in any one of Supplementary Notes 20 to 32, wherein the second ring is an edge ring formed of a conductive material, and the first ring is a cover ring formed of an insulating material. (Supplementary Note 34) A transfer method for transferring an outer ring and an inner ring in a processing system, the processing system including: a chamber; a vacuum transfer module connected to the chamber; a transfer device disposed inside the vacuum transfer module; a stage disposed inside the chamber around a substrate for placing the outer ring and the inner ring having different inner diameters and outer diameters; and a lifter for raising and lowering the outer ring and the inner ring relative to the stage; and the transfer method includes: a simultaneous transfer mode in which the transfer device simultaneously transfers the inner ring and the outer ring; and a single transfer mode in which the transfer device only transfers the inner ring. This international application claims priority based on Japanese Patent Application No. 2021-018937 filed on February 9, 2021, and incorporates all the contents of this application into this international application. 1: Plasma processing device 1X: Plasma processing device 10: Plasma processing chamber 10e: Gas discharge port 10p: Loading and unloading port 10s: Plasma processing space 10X: Plasma processing chamber 11, 11X: Substrate support part 12: Upper electrode 13: Insulating member 20: Gas supply part 21: Gas source 22: Flow controller 30: RF power supply part 31a: First RF power supply 31b: Second RF power supply 32a: First matcher 32b: Second matcher 40: Exhaust system 50, 50X, 50Y, 50Z: Lifter 51: First lifter 52: Second lifter 53: Third lifter 54: Fourth lifter 55: Fifth lifter 60: Frame 70: Chamber 71: Exhaust port 72: Exhaust part 73: Stage 74: Lifting chamber 75: Storage bin 76: Ball screw 77: Motor 78: Cassette 78X: Cassette 79: Guide 80: Door 81: Machine room 82: Line sensor 83: Light emitting part 84: Opening 85: Light emitting part 86: Sheet number detection sensor 90: Control part 91: Computer 111: Lower electrode 112: Electrostatic chuck 112a: Substrate support surface 112b: Ring support surface 112c: Insulating material 112d: First adsorption electrode 112e: Second adsorption electrode 113, 113X, 113Z: Ring assembly 115: Insulator 116: Base 121: Top plate 121a, 122b: Gas inlet 122: Support body 122a: Gas diffusion chamber 122c: Gas supply port 511, 521, 531, 541, 551, 561: Support pin 512, 522, 532, 542: Actuator 552, 562: Lower rod part 552a: Upper end surface of lower rod part 552 553, 563: Upper rod part 553a: Upper end surface of upper rod part 553 562a: Upper end surface of lower rod part 562 563a: Upper end surface of upper rod part 563 781: Bottom plate 781a: Placement surface 781b: Outer frame part 781c: Fork insertion groove 782: Guide pin 782b: Tilt block 911: CPU 912: Memory part 913: Communication interface A1: First assembly A2: Second assembly CJ: Transfer jig CR, CRX: Cover ring CRa: Notch CU: Control part FK11, FK21: Upper fork FK12, FK22: Lower fork FR, FRX: Edge ring FRa: Notch FRr: Recess G1~G4: Gate valve H1, H2, H3, H4, H11, H12, H13, H21, H22: Through hole HR: Transfer ring LL1,LL2: Loading Interlock Module LM: Atmosphere Transfer Module LP1 - LP5: Loading Ports PM1 - PM12: Process Modules PS: Processing System SM: Storage Module TM1, TM2: Vacuum Transfer Modules TR1, TR2: Transfer Robots W: Substrate FIG. 1 is a diagram showing an example of a processing system according to an embodiment. FIG. 2 is a schematic cross-sectional view showing a process module. FIG. 3 is a diagram showing an enlarged portion of FIG. 2. FIG. 4 is a front cross-sectional view showing an example of a storage module. FIG. 5 is a side cross-sectional view showing an example of a storage module. FIG. 6 is a schematic top view showing an upper fork not holding a transfer object. FIG. 7 is a schematic top view showing an upper fork holding a first assembly. FIG. 8 is a schematic top view showing an upper fork holding a second assembly. FIG. 9 is a schematic top view showing an upper fork holding only a transfer jig. FIG. 10 is a schematic perspective view showing an example of a cassette in a storage module. FIGS. 11A, 11B, and 11C are diagrams showing an example of a positioning mechanism for an edge ring. FIGS. 12A, 12B, and 12C are diagrams showing an example of a positioning mechanism for a cover ring. FIGS. 13A, 13B, and 13C are diagrams showing an example of a positioning mechanism for an edge ring and a cover ring. FIG. 14 is a schematic top view showing an example of a second assembly stored in a cassette. FIG. 15 is a schematic top view showing an example of a transfer jig stored in a cassette. FIG. 16 is a schematic perspective view showing another example of a cassette in a storage module. FIGS. 17A and 17B are schematic views showing an electrostatic chuck on which an edge ring and a cover ring are placed. FIGS. 18A, 18B, 18C, and 18D are diagrams showing an example of a simultaneous transfer mode. FIGS. 19A, 19B, 19C, and 19D are diagrams showing an example of a simultaneous transfer mode. FIGS. 20A, 20B, 20C, and 20D are diagrams showing an example of a single transfer mode. FIGS. 21A, 21B, 21C, and 21D are diagrams showing an example of a single transfer mode. FIGS. 22A, 22B, 22C, and 22D are diagrams showing an example of a single transfer mode. FIGS. 23A and 23B are diagrams showing an example of a single transfer mode.FIG. 23C is a diagram showing an example of the individual conveyance mode. FIG. 23D is a diagram showing an example of the individual conveyance mode. FIG. 24 is a flowchart showing an example of a method for replacing a consumable member in the embodiment. FIG. 25 is a flowchart showing an example of the simultaneous conveyance mode. FIG. 26 is a flowchart showing an example of the individual conveyance mode. FIG. 27 is a flowchart showing another example of the method for replacing a consumable member in the embodiment. FIG. 28 is a flowchart showing another example of the individual conveyance mode. FIG. 29 is a schematic cross-sectional view of a process module according to the first modification example of the embodiment. FIG. 30 is a diagram showing the state of the elevator in the simultaneous conveyance mode of the first modification example. FIG. 31 is a diagram showing the state of the elevator in the individual conveyance mode of the first modification example. FIG. 32 is a schematic cross-sectional view of a process module according to the second modification example of the embodiment. FIG. 33A is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 33B is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 33C is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 34A is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 34B is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 34C is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 35A is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 35B is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 35C is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 36A is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 36B is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 36C is a flowchart showing an example of the simultaneous conveyance mode of the second modification example. FIG. 37A is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 37B is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 37C is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 37D is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 38A is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 38B is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 38C is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 38D is a flowchart showing an example of the individual conveyance mode of the second modification example. FIG. 39 is a schematic cross-sectional view of a process module according to the third modification example of the embodiment. FIG. 40A is a flowchart showing an example of the simultaneous conveyance mode of the third modification example. FIG. 40B is a flowchart showing an example of the simultaneous conveyance mode of the third modification example. FIG. 41A is a flowchart showing an example of the simultaneous conveyance mode of the third modification example. FIG. 41B is a flowchart showing an example of the simultaneous conveyance mode of the third modification example.FIG. 42A is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 42B is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 43A is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 43B is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 44A is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 44B is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 45A is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 45B is a flowchart showing an example of the simultaneous transfer mode of the third modification. FIG. 46A is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 46B is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 47A is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 47B is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 48A is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 48B is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 49A is a flowchart showing an example of the individual transfer mode of the third modification. FIG. 49B is a flowchart showing an example of the individual transfer mode of the third modification. CU: Control Unit FK11, FK21: Upper Fork FK12, FK22: Lower Fork G1~G4: Gate Valve LL1, LL2: Loading Interlock Module LM: Atmosphere Transfer Module LP1~LP5: Loading Port PM1~PM12: Process Module PS: Processing System SM: Storage Module TM1, TM2: Vacuum Transfer Module TR1, TR2: Transfer Robot

Claims

1. A substrate processing system comprising: a vacuum transfer module; a plasma processing module connected to the vacuum transfer module; and a controller; the vacuum transfer module comprising: a vacuum transfer chamber; and a transfer robot disposed within the vacuum transfer chamber; the plasma processing module comprising: a plasma processing chamber; a stage disposed within the plasma processing chamber and having a substrate support surface and a ring support surface; a first ring disposed on the ring support surface of the stage such that it surrounds a substrate on the substrate support surface of the stage; a second ring placed on the first ring; and a lifter configured to lift the first ring and the second ring relative to the stage; the controller configured to control the transfer robot to selectively execute a simultaneous transfer mode in which it simultaneously transfers the first ring and the second ring, and a separate transfer mode in which it separately transfers the second ring. At the point when the second ring is replaced, the above-mentioned separate transport mode is executed to replace the second ring; at the point when the first ring is replaced, the above-mentioned simultaneous transport mode is executed to replace both the first ring and the second ring.

2. The substrate processing system of claim 1, wherein the lifting device comprises: a plurality of first support pins disposed below the ring support surface; and a plurality of second support pins disposed below the substrate support surface.

3. The substrate processing system of claim 2, wherein the aforementioned simultaneous transfer mode includes the following steps: in a state where the plurality of first support pins have been raised, the first ring and the second ring are transferred together between the plurality of first support pins and the transfer robot.

4. The substrate processing system of claim 3, wherein the above-mentioned individual transport mode includes the following steps: in the state where the plurality of second support pins have been raised, the transport fixture and the second ring are transferred together between the plurality of second support pins and the transport robot.

5. The substrate processing system according to any one of claims 1 to 4 further comprises: a receiving module connected to the vacuum conveying module, which receives the first ring and the second ring.

6. The substrate processing system of claim 5, wherein the aforementioned housing module is configured to house a first assembly, the first assembly comprising the aforementioned first ring and the aforementioned second ring disposed on the aforementioned first ring.

7. The substrate processing system of claim 5, wherein the aforementioned housing module is configured to house a second assembly, the second assembly comprising a transfer fixture and the aforementioned second ring placed on the transfer fixture.

8. The substrate processing system of claim 1, wherein the innermost diameter of the second ring is smaller than the innermost diameter of the first ring.

9. The substrate processing system of claim 1, wherein the outermost diameter of the second ring is greater than the innermost diameter of the first ring.

10. The substrate processing system of claim 1, wherein the outermost diameter of the second ring is smaller than the outermost diameter of the first ring.

11. The substrate processing system of any one of claims 1 to 4, wherein the second ring is an edge ring formed of a conductive material and the first ring is a cover ring formed of an insulating material.

12. The substrate processing system of claim 11, wherein the first ring is formed of quartz and the second ring is formed of Si or SiC.

13. A conveying method, which is a conveying method in a substrate processing system, the substrate processing system comprising a vacuum conveying module and a plasma processing module connected to the vacuum conveying module; the vacuum conveying module comprising: a vacuum conveying chamber; and a conveying robot disposed within the vacuum conveying chamber; the plasma processing module comprising: a plasma processing chamber; a stage disposed within the plasma processing chamber, having a substrate support surface and a ring support surface; a first ring disposed on the ring support surface of the stage such that it surrounds a substrate on the substrate support surface of the stage; a second ring placed on the first ring; and a lifter configured to lift the first ring and the second ring relative to the stage; the conveying method comprising: Control the aforementioned conveying robot to selectively execute either a simultaneous conveying mode that simultaneously conveys the first ring and the second ring, or a separate conveying mode that only conveys the second ring; execute the separate conveying mode at the point when the second ring is replaced to replace the second ring; execute the simultaneous conveying mode at the point when the first ring is replaced to replace both the first ring and the second ring.

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